U.S. patent application number 11/087078 was filed with the patent office on 2005-10-06 for lid unit for thin plate supporting container.
Invention is credited to Kawashima, Yoshio.
Application Number | 20050218034 11/087078 |
Document ID | / |
Family ID | 34880054 |
Filed Date | 2005-10-06 |
United States Patent
Application |
20050218034 |
Kind Code |
A1 |
Kawashima, Yoshio |
October 6, 2005 |
Lid unit for thin plate supporting container
Abstract
A lid unit seals a container main body of a thin-plate
supporting container which is conveyed while plural 300 mm-diameter
semiconductor wafers are stored in the container. In a wafer
retainer which supports the wafers stored in the container main
body, the maximum amount of displacement is set in a range of 1.5
to 2.5 mm (ranges from {fraction (1/200)} to {fraction (1/120)} of
the semiconductor wafer diameter), and proportionality is held
between the amount of displacement and external force when the
maximum amount of displacement ranges from 1.5 to 2.5 mm. In the
states in which the wafer retainer is fitted in the container main
body and force is not applied, the wafer retainer is arranged at a
position in which the wafer retainer is not in contact with the
semiconductor wafers stored in the container main body or at a
position in which the wafer retainer is in slight contact with the
semiconductor wafers. Therefore, the lid unit can be attached and
detached without fixing the container main body, so that
vibration-resistant performance and shock-resistant performance are
improved by preventing spring resistance force from rapidly
increasing, and automatization of the attachment and detachment of
the lid unit is easy to realize.
Inventors: |
Kawashima, Yoshio;
(Kumamoto-ken, JP) |
Correspondence
Address: |
LORUSSO, LOUD & KELLY
3137 Mount Vernon Avenue
Alexandria
VA
22305
US
|
Family ID: |
34880054 |
Appl. No.: |
11/087078 |
Filed: |
March 23, 2005 |
Current U.S.
Class: |
206/710 ;
257/E21.001 |
Current CPC
Class: |
H01L 21/67369
20130101 |
Class at
Publication: |
206/710 |
International
Class: |
B65D 085/30 |
Foreign Application Data
Date |
Code |
Application Number |
Mar 31, 2004 |
JP |
104675 |
Claims
1. A lid unit for a thin plate supporting container with which a
container main body of a thin-plate supporting container is
covered, the thin-plate supporting container in which a plurality
of disk-shaped thin plates are stored and conveyed, the lid unit
comprising a thin-plate retainer which supports the disk-shaped
thin plates stored in the container main body, wherein the maximum
amount of displacement of the thin-plate retainer is set in a range
of {fraction (1/200)} to {fraction (1/120)} of a diameter of the
disk-shaped thin plate.
2. A lid unit for a thin plate supporting container with which a
container main body of a thin-plate supporting container is
covered, the thin-plate supporting container in which a plurality
of disk-shaped thin plates having diameter of 300 mm are stored and
conveyed, the lid unit comprising a thin-plate retainer which
supports the disk-shaped thin plates stored in the container main
body, wherein the maximum amount of displacement of the thin-plate
retainer is set in a range of 1.5 mm to 2.5 mm.
3. The lid unit for a thin plate supporting container according to
claim 1, wherein proportionality is held between the amount of
displacement of the thin-plate retainer and external force when the
maximum amount of displacement of the thin-plate retainer ranges
from 1.5 mm to 2.5 mm.
4. The lid unit for a thin plate supporting container according to
claim 1, wherein the thin-plate retainer is arranged at a position
in which the thin-plate retainer is not in contact with the
disk-shaped thin plates stored in the container main body or at a
position in which the thin-plate retainer is in slight contact with
the disk-shaped thin plates in a state that the thin-plate retainer
is fitted in the container main body and any force is not
applied.
5. The lid unit for a thin plate supporting container according to
claim 1, further comprising a support convex strip which is molded
such that both end sides are thinned and a central side is
thickened, the support convex strip absorbing deformation of the
lid unit to support the disk-shaped thin plates with even
force.
6. The lid unit for a thin plate supporting container according to
claim 2, wherein the thin-plate retainer is arranged at a position
in which the thin-plate retainer is not in contact with the
disk-shaped thin plates stored in the container main body or at a
position in which the thin-plate retainer is in slight contact with
the disk-shaped thin plates in a state that the thin-plate retainer
is fitted in the container main body and any force is not
applied.
7. The lid unit for a thin plate supporting container according to
claim 2, further comprising a support convex strip which is molded
such that both end sides are thinned and a central side is
thickened, the support convex strip absorbing deformation of the
lid unit to support the disk-shaped thin plates with even force.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims, under 35 USC 119, priority of
Japanese Application No. 2004-104675 filed Mar. 31, 2004.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to a lid unit for a thin plate
supporting container used for storage, transport, a manufacturing
line, and the like of thin plates such as semiconductor wafers,
storage disks, and liquid crystal glass substrates while the thin
plates are stored therein, particularly to the lid unit for a thin
plate supporting container which is suitable for the storage and
transport of disk-shaped thin plates having diameters of 300
mm.
[0004] 2. Description of the Related Art
[0005] The thin-plate supporting container used for the storage and
transport of the thin plates such as the semiconductor wafers is
well known.
[0006] The thin-plate supporting container mainly includes a
container main body and a lid unit which covers an upper opening of
the container main body. A member which supports the thin plate
such as the semiconductor wafer is provided inside the container
main body. In order to prevent contamination of a surface of the
thin plate such as the semiconductor wafer stored in the thin-plate
supporting container, it is necessary to transport the thin-plate
supporting container while the inside of the thin-plate supporting
container is kept clean, so that the thin-plate supporting
container is sealed. That is, the lid unit is fixed to the
container main body to seal the container main body.
[0007] A thin-plate retainer is provided on the lid unit side. The
thin-plate retainer supports the plural thin plates stored in the
container main body from the upper side. The thin-plate retainer is
attached to the inside surface of the lid unit, and the lid unit is
attached to the container main body, which allows the thin-plate
retainer to be fitted into each of the thin plates stored in the
container main body to support the thin plates. Further, in
consideration of vibration and the like, the thin-plate retainer is
designed to be slightly displaced while fitted into each of the
thin plates. The thin-plate retainer is designed so that usually
the amount of displacement has linearity up to about 0.3 mm. That
is, a range where proportionality is held between the amount of
displacement and external force is set up to about 0.3 mm.
[0008] However, in the thin-plate retainer, since the range where
the linearity is held exists within about 0.3 mm, an existence
position tolerance of the thin plate ranges from about -0.15 mm to
about +0.15 mm. Recently the amount of displacement of the
thin-plate retainer is also increased as the size of the thin plate
such as the semiconductor wafer is enlarged. In the lid unit for a
thin plate supporting container for the 300 mm-diameter thin plate,
conventionally the existence position tolerance of the thin plate
ranges from about -1.0 mm to about +1.0 mm. Further, due to the
recent improvement of molding accuracy, the existence position
tolerance of the thin plate is improved to the range of about -0.5
mm to about +0.5 mm. However, even in this case, sometimes the
thin-plate retainer is displaced beyond the linearity range, when
the range in which the proportionality is held between the amount
of displacement and the external force is set up to about 0.3 mm.
When the thin-plate retainer is displaced beyond the linearity
range, spring resistance force is rapidly increased, which
generates the problem that the lid unit is not closed or the lid
unit is deformed.
[0009] When the lid unit is fixed to the container main body, as
described above, it is necessary that the lid unit is strongly
pressed against the container main body. Therefore, it is necessary
that the container main body is fixed, and automatization of
attachment and detachment of the lid unit is not easy to
realize.
SUMMARY OF THE INVENTION
[0010] An object of the invention is to provide a lid unit for a
thin plate supporting container which solves the problem associated
with the increase in thin-plate size.
[0011] A lid unit for a thin plate supporting container according
to the invention, with which a container main body of a thin-plate
supporting container is covered, the thin-plate supporting
container in which a plurality of disk-shaped thin plates are
stored and conveyed, the lid unit includes a thin-plate retainer
which supports the disk-shaped thin plates stored in the container
main body, where the maximum amount of displacement of the
thin-plate retainer is set in a range of {fraction (1/200)} to
{fraction (1/120)} of a diameter of the disk-shaped thin plate. For
example, for the disk-shaped thin plate having the diameter of 300
mm, the maximum amount of displacement of the thin-plate retainer
which supports the disk-shaped thin plate is set in the range of
1.5 to 2.5 mm.
[0012] According to the above configuration, even if the size of
the thin plate is enlarged to 300 mm to increase the amount of
shift, the amount of shift caused by the enlargement of the size is
absorbed by the amount of displacement of the thin-plate retainer
to support the thin plate.
[0013] The thin-plate retainer is set so that the proportionality
is held between the amount of displacement of the thin-plate
retainer and external force when the maximum amount of displacement
of the thin-plate retainer ranges from 1.5 mm to 2.5 mm. The spring
resistance force of the thin-plate retainer is never rapidly
increased by supporting the thin plate within the range where the
proportionality is held between the amount of displacement of the
thin-plate retainer and external force.
[0014] It is desirable that the thin-plate retainer is arranged at
a position in which the thin-plate retainer is not in contact with
the disk-shaped thin plates stored in the container main body or at
a position in which the thin-plate retainer is in slight contact
with the disk-shaped thin plates in the states in which the lid
unit for the thin-plate retainer is fitted in the container main
body and any force is not applied. Therefore, in the state in which
the lid unit for a thin plate supporting container is fitted in the
container main body, the lid unit for a thin plate supporting
container can be fixed to the container main body without pressing
the lid unit for a thin plate supporting container against the
container main body.
[0015] As described above, according to the lid unit for a thin
plate supporting container of the invention, the following effects
can be obtained.
[0016] (1) The maximum amount of displacement of the wafer retainer
is set in the range of 1.5 to 2.5 mm. Therefore, even in the thin
plate having the diameter of 300 mm, the thin plate is supported by
absorbing the increase in displacement amount associated with the
enlargement of the thin plate size, and the spring resistance force
of the thin-plate retainer can be prevented from rapidly
increasing.
[0017] (2) The proportionality is held between the amount of
displacement and the external force when the maximum amount of
displacement of the wafer retainer is set in the range of 1.5 to
2.5 mm. Therefore, the spring resistance force of the wafer
retainer is not rapidly increased, and the thin-plate supporting
container which is excellent for the vibration-resistant
performance and shock-resistant performance can be provided.
[0018] (3) Even if the lid unit for a thin plate supporting
container is slightly fitted in the container main body, the
thin-plate retainer is not in contact with the disk-shaped thin
plates. Therefore, the disk-shaped thin plates can be fixed without
strongly pressing the lid unit for a thin plate supporting
container, and the automatization of the attachment and detachment
of the lid unit can be easily realized.
BRIEF DESCRIPTION OF THE DRAWINGS
[0019] FIG. 1 is a perspective view showing a wafer retainer
according to a first embodiment of the invention;
[0020] FIG. 2 is a perspective view showing a thin-plate supporting
container according to the first embodiment of the invention;
[0021] FIG. 3 is a perspective view showing the thin-plate
supporting container according to the first embodiment of the
invention while a lid unit is uncovered;
[0022] FIG. 4 is a partially perspective view showing a lid unit
supporting portion of the thin-plate supporting container according
to the first embodiment of the invention;
[0023] FIG. 5 is a partially sectional view showing the lid unit
supporting portion of the thin-plate supporting container according
to the first embodiment of the invention;
[0024] FIG. 6 is a perspective view showing a top surface of a
manufacturing line lid unit according to the first embodiment of
the invention;
[0025] FIG. 7 is a perspective view showing a bottom surface of the
manufacturing line lid unit according to the first embodiment of
the invention;
[0026] FIG. 8 is a partially perspective view showing the
manufacturing line lid unit according to the first embodiment of
the invention;
[0027] FIG. 9 is a perspective view showing the top surface of a
latch member according to the first embodiment of the
invention;
[0028] FIG. 10 is a perspective view showing the bottom surface of
the latch member according to the first embodiment of the
invention;
[0029] FIG. 11 is a sectional side view showing the latch member
according to the first embodiment of the invention;
[0030] FIG. 12 is a perspective view showing the top surface of a
feed member according to the first embodiment of the invention;
[0031] FIG. 13 is a perspective view showing the bottom surface of
the feed member according to the first embodiment of the
invention;
[0032] FIG. 14 is a plan view showing the feed member according to
the first embodiment of the invention;
[0033] FIG. 15 is a bottom view showing the feed member according
to the first embodiment of the invention;
[0034] FIG. 16 is a perspective view showing the top surface of a
hold cover according to the first embodiment of the invention;
[0035] FIG. 17 is a perspective view showing the bottom surface of
the hold cover according to the first embodiment of the
invention;
[0036] FIG. 18 is a perspective view showing the top surface of a
cover clamp according to the first embodiment of the invention;
[0037] FIG. 19 is a perspective view showing the bottom surface of
the cover clamp according to the first embodiment of the
invention;
[0038] FIG. 20 is a side view showing the top surface of a wafer
retainer according to the first embodiment of the invention;
[0039] FIG. 21 is a perspective view showing the wafer retainer
according to the first embodiment of the invention;
[0040] FIG. 22 is a perspective view showing a lid unit holder
according to the first embodiment of the invention;
[0041] FIG. 23 is a graph showing a spring characteristics of an
elastic support plate according to the first embodiment of the
invention;
[0042] FIG. 24 is a graph showing the spring characteristics
comparison between the conventional example and the elastic support
plate according to the first embodiment of the invention;
[0043] FIG. 25 is a schematic view showing an operation of
simplified detaching mechanism according to the first embodiment of
the invention;
[0044] FIG. 26 is a side view showing the wafer retainer according
to a first modification example in the first embodiment of the
invention;
[0045] FIG. 27 is a perspective view showing the wafer retainer
according to the first modification example in the first embodiment
of the invention;
[0046] FIG. 28 is a perspective view showing the wafer retainer
according to the first modification example in the first embodiment
of the invention;
[0047] FIG. 29 is a perspective view showing the wafer retainer
according to a second modification example in the first embodiment
of the invention;
[0048] FIG. 30 is a front elevation showing the wafer retainer
according to the second modification example in the first
embodiment of the invention;
[0049] FIG. 31 is a perspective view showing the wafer retainer
according to a third modification example in the first embodiment
of the invention;
[0050] FIG. 32 is a sectional view showing a main portion of the
wafer retainer according to the third modification example in the
first embodiment of the invention;
[0051] FIG. 33 is a perspective view showing the wafer retainer
according to a fourth modification example in the first embodiment
of the invention;
[0052] FIG. 34 is a front elevation showing the wafer retainer
according to the fourth modification example in the first
embodiment of the invention;
[0053] FIG. 35 is a sectional view showing the main portion of the
wafer retainer according to a second embodiment of the
invention;
[0054] FIG. 36 is a perspective view showing a backside of the lid
unit including the wafer retainer according to the second
embodiment of the invention;
[0055] FIG. 37 is a partially perspective view showing a backside
of the lid unit according to the second embodiment of the invention
while the wafer retainer is included;
[0056] FIG. 38 is a perspective view showing the main portion of a
backside of the lid unit according to the second embodiment of the
invention while the wafer retainer is excluded;
[0057] FIG. 39 is a perspective view showing the main portion of
the backside of the lid unit according to the second embodiment of
the invention while the wafer retainer is excluded;
[0058] FIG. 40 is a sectional perspective view showing a support
rib according to the second embodiment of the invention;
[0059] FIG. 41 is an enlarged view showing the main portion of the
wafer retainer according to the second embodiment of the
invention;
[0060] FIG. 42 is an enlarged view showing the main portion of an
engagement piece of the wafer retainer according to the second
embodiment of the invention;
[0061] FIG. 43 is an enlarged view showing the main portion of the
engagement piece of the wafer retainer according to the second
embodiment of the invention;
[0062] FIG. 44 is an enlarged view showing the main portion of the
engagement piece of the wafer retainer according to the second
embodiment of the invention; and
[0063] FIG. 45 is an enlarged view showing the main portion of a
modification example in the second embodiment of the invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0064] Referring now to the accompanying drawings, preferred
embodiments of the invention will be described below. The
thin-plate supporting container of the invention is a container
which is used for the storage, the transport, the manufacturing
line, and the like while the thin plates such as the semiconductor
wafer, the storage disk, and the liquid crystal glass substrate are
stored in the thin plate support container. The thin-plate
supporting container in which the semiconductor wafers having a
diameter of 300 mm are stored will be described as an example in
the following embodiments. The transport lid unit and the lid unit
used in the manufacturing line are separately used as the lid unit
which closes the thin-plate supporting container.
First Embodiment
[0065] As shown in FIGS. 2 to 7, a thin-plate supporting container
11 according to a first embodiment includes a container main body
12 in which the plural semiconductor wafers (not shown) are stored,
two thin plate supports 13, a transport lid unit 14 and a
manufacturing line lid unit 15 which close the container main body
12, a top flange 16 which is grasped by an arm of a conveying
apparatus (not shown) in a plant, and a carrying handle 17 which an
operator grasps when the operator manually carries the thin-plate
supporting container 11. The two thin plate supports 13 are
respectively provided in sidewalls opposite each other in the
container main body 12, and the two thin plate supports 13 support
the semiconductor wafer stored in the container main body 12 from
both sides.
[0066] As shown in FIGS. 2 and 3, the whole of container main body
12 is formed in a substantial cube. When the container main body 12
is placed in a vertical position (FIGS. 2 and 3), the container
main body 12 includes four sidewalls 12A, 12B, 12C, and 12D which
become a surrounding wall and a bottom 12E, and an opening 12F is
provided on the top portion of the surrounding wall. The container
main body 12 is horizontally placed when installed opposite a wafer
carrying robot (not shown) in the manufacturing line of the
semiconductor wafer and the like. Positioning means (not shown) for
positioning the thin-plate supporting container 11 is provided
outside the sidewall 12B which becomes the bottom when the
container main body 12 is horizontally placed. The top flange 16 is
detachably attached outside the sidewall 12A which becomes a
ceiling when the container main body 12 is horizontally placed. The
carrying handle 17 is detachably attached to the outside of the
sidewalls 12C and 12D which become a side wall when the container
main body 12 is horizontally placed.
[0067] As shown in FIGS. 4 and 5, a lid unit holder 21 into which
the lid unit 4 is fitted is provided in upper end portions of the
sidewalls 12A, 12B, 12C, and 12D of the container main body 12. The
lid unit holder 21 is formed so that the upper end portion of the
container main body 12 is enlarged to dimensions of the lid unit 4.
Therefore, the lid unit 4 is fitted inside the vertical plate 21A
of the lid unit holder 21 to engage a horizontal plate 21B, which
allows the lid unit to be attached to the lid unit holder 21. A
sealing groove 21C is provided in a perimeter of the horizontal
plate 21B, and a gasket 22 attached to a lower surface of the
transport lid unit 14 is fitted in the seal groove 21C to seal the
thin-plate supporting container 11. In each inside surface of the
vertical plates 21A located at four corners of the lid unit holder
21, a first fitted portion 23 is provided so that a lid unit latch
pawl (not shown) of the later-mentioned transport simplified
detaching mechanism 26 is fitted to fix the transport lid unit 14
onto the container main body 12 side. The first fitted portion 23
is formed by recessing the vertical plate 21A in a rectangle shape,
and the lid unit latch pawl is fitted in the rectangle recess.
[0068] A second fitted portion 24 is provided near each first
fitted portion 23. The second fitted portion 24 is used in the
manufacturing line. A latch member 42 of a simplified detaching
mechanism 32 of the manufacturing line lid unit 15 is fitted in the
second fitted portion 24 to fix the manufacturing line lid unit 15
onto the container main body 12 side.
[0069] The transport lid unit 14 is the well-known lid unit. The
transport lid unit 14 is formed in a dish shape, and a central
portion of the transport lid unit 14 is formed in a cylindrical
shape arising from the surface so as not to come into contact with
the upper portion of the stored semiconductor wafer.
[0070] As shown in FIGS. 2 and 3, the transport simplified
detaching mechanism 26 which detachably fixes the transport lid
unit 14 to the container main body 12 is provided at each of the
four corners of the transport lid unit 14. The transport simplified
detaching mechanism 26 includes the lid unit latch pawl (not shown)
which is provided while projected from a peripheral portion of the
transport lid unit 14. The lid unit latch paw is arranged to be
fitted in the first fitted portion 23.
[0071] The manufacturing line lid unit 15 is a lid unit which
causes the container main body 12 of the transported thin-plate
supporting container 11 to be used in the manufacturing line in the
plant. In the semiconductor manufacturing plant and the like, the
manufacturing line lid unit 15 is arranged as a single product
independent of the thin-plate supporting container 11. As shown in
FIGS. 6 and 7, the manufacturing line lid unit 15 includes a main
body 30, a cover plate (not shown), and the simplified detaching
mechanism 32.
[0072] The main body 30 is formed thinly in a substantial square
shape as a whole. The main body 30 is designed not to extend off
when attached to the lid unit holder 21 of the container main body
12. A gasket holder 31 is attached to a periphery of the lower
portion of the main body 30, and a gasket (not shown) is provided
in the gasket holder 31. When the main body 30 is attached to lid
unit holder 21, the gasket holder 31 is fitted in the sealing
groove 21C to seal the container main body 12. As with the gasket
22 of the transport lid unit 14, the gasket is appropriately formed
in accordance with the shape of the sealing groove 21C.
[0073] In the manufacturing line lid unit 15, recesses 33 to which
the simplified detaching mechanisms 32 are attached are provided in
end portions on both sides in a longitudinal direction of the main
body 30 (upper left and lower right in FIG. 6) respectively. The
recess 33 is formed in a substantial rectangle by recessing the end
portion of the main body 30. Openings 34 which a leading-end
fitting portion 56 of the later-mentioned latch member 42 appears
from and disappears in are provided in both ends in the
longitudinal direction of the recess 33 (upper right and lower left
in FIG. 6) respectively. The opening 34 is provided at a position
where the opening 34 matches the second fitted portion 24 of the
lid unit holder 21 when the main body 30 is fitted in the lid unit
holder 21. A rotating support shaft 36, a stopper 37, a latch pawl
38, a base-end lower cam 39, and a leading-end cam 40 are provided
in the bottom portion of the recess 33. A cover plate is detachably
attached to the recess 33. The cover plate is detached when the
simplified detaching mechanism 32 provided in the recess 33 is
cleaned.
[0074] The rotating support shaft 36 is a member which rotatably
supports the later-mentioned feed member 43. The rotating support
shaft 36 is formed in the cylindrical shape projecting from the
bottom portion. The rotating support shaft 36 is fitted in a
rotating cylinder portion 63 of the feed member 43 to rotatably
support the feed member 43. The stopper 37 supports the feed member
43 while rotating the feed member 43 to a predetermined angle. The
stopper 37 includes two plate-shaped members projecting from the
bottom portion around the rotating support shaft 36. A holder 37A
is formed by bending the plate-shaped member. The feed member 43 is
held at the predetermined angle by fitting a projection 65A of a
latch piece 65 of the feed member 43 into the holder 37A.
[0075] The latch pawl 38 is a member which fixes the
later-mentioned cover clamp 46 to the bottom portion of the recess
33. Because the cover clamps 46 are attached to the both sides in
the longitudinal direction of the recess 33, each six latch pawls
38 are also attached to the both side in the longitudinal direction
of the recess 33 respectively. The latch pawl 38 includes an
L-shaped member, and a lower support plate piece 88 of the cover
clamp 46 is fitted in the latch pawl 38.
[0076] The base-end lower cam 39 and the leading-end cam 40
constitute the later-mentioned cam mechanism 44. The base-end lower
cam 39 and the later-mentioned base-end upper cam 53 constitute a
base-end side cam which pushes down a base end side of the latch
member 42 when the latch member 42 is fed.
[0077] As shown in FIGS. 7 and 8, the base-end lower cam 39 pushes
down the base end side of the latch member 42 to the other end
(lower side in FIG. 8) as the latch member 42 is fed. The base-end
lower cams 39 are provided on the both side of the rotating support
shaft 36 respectively. In the sectional side view, the base-end
lower cam 39 is formed in a substantial triangle, and the base-end
lower cam 39 includes a slope 39A which vertically moved the
base-end side of the latch member 42. Mirror polishing is performed
to the slope 39A in order to decrease frictional resistance between
the slope 39A and a base-end slide surface 52 of the latch member
42.
[0078] The leading-end cam 40 pushes (lifts up) the leading-end
fitting portion 56 of the latch member 42 to the other end (upper
side in FIG. 8) as the latch member 42 is fed. The leading-end cams
40 are provided while facing the openings 34 at the both ends in
the longitudinal direction of the recess 33 respectively. In the
sectional side view, the leading-end cams 40 is formed in the
substantial triangle, and the leading-end cams 40 includes a slope
40A which upwardly moved the leading-end side of the latch member
42. The mirror polishing is performed to the slope 40A in order to
decrease the frictional resistance between the slope 40A and a
lead-end slide surface 55A of a fulcrum portion 55 of the latch
member 42. A fitting recess 40B is provided in the upper end
portion of the slope 40A. The fulcrum portion 55 of the latch
member 42 is fitted in the fitting recess 40B.
[0079] The simplified detaching mechanism 32 is provided in the
recess 33. The simplified detaching mechanism 32 causes the
manufacturing line lid unit 15 to be easily attached to and
detached from the container main body 12. As shown in FIG. 8, the
simplified detaching mechanism 32 includes the latch member 42, the
feed member 43, the cam mechanism 44, a hold cover 45, and the
cover clamp 46.
[0080] The latch member 42 is fitted in the second fitted portion
24 of the lid unit holder 21 by extending from the opening 34 of
the main body 30 while the manufacturing line lid unit 15 is
attached to the lid unit holder 21 of the container main body 12.
As shown in FIGS. 8 to 11, the latch member 42 includes a
connecting shaft 51, the base-end slide surface 52, the base-end
upper cam 53, an upper groove 54, the fulcrum portion 55, the
leading-end fitting portion 56, a base-end side-plate 57, and a
leading-end side-plate 58.
[0081] The connecting shaft 51 is fitted in a long hole 64 of the
feed member 43 to connect the feed member 43 and the latch member
42. The connecting shaft 51 is formed in a round bar, and the
connecting shaft 51 is provided in the base end portion of the
latch member 42 while facing upward.
[0082] The base-end slide surface 52 slides to the slope 39A of the
base-end lower cam 39 to vertically move the base end portion of
the latch member 42. The base-end slide surface 52 is formed by
obliquely cutting away the lower side of the base end portion of
the latch member 42. The mirror polishing is performed to the
base-end slide surface 52 in order to decrease the frictional
resistance between the base-end slide surface 52 and a slope 39A of
the base-end lower cam 39. When the base-end slide surface 52
slides to the slope 39A of the base-end lower cam 39, the base end
portion of the latch member 42 is pushed down by feeding the latch
member 42. Therefore, the base-end lower portion of the latch
member 42 is pushed up by pulling in the latch member 42.
[0083] The base-end upper cam 53 vertically moves the base end
portion of the latch member 42 in conjunction with base-end lower
cam 39. The base-end upper cam 53 is a part which acts as a power
point in leverage principle. However, the connecting shaft 51 does
not act as the power point in the leverage principle, and the
connecting shaft 51 is a part which simply receives the force in
the longitudinal direction when the latch member 42 is caused to
appear and disappear.
[0084] The base-end upper cam 53 is provided near the base end
portion of the latch member 42 while facing upward. In the
sectional side view, the base-end upper cam 53 is formed in the
substantial triangle shape, and the base-end upper cam 53 includes
a slope 53A which vertically moved the base-end side of the latch
member 42. As with the slope 39A of the base-end lower cam 39, the
mirror polishing is performed to the slope 53A of the base-end
upper cam 53, and the base-end upper cam 53 is arranged to slide to
a cam holder projection 69 on the holder cover 45 side as mentioned
later. The slope 53A of the base-end upper cam 53 is set so as to
be substantially parallel to the slope 39A of the base-end lower
cam 39. Therefore, when the latch member 42 is fed while the cam
holder projection 69 slides to the slope 53A of the base-end upper
cam 53, the base-end upper cam 53 is pushed by the cam holder
projection 69 to push down the base end portion of the latch member
42. When the latch member 42 is pulled in, the base-end slide
surface 52 is pushed by the slope 39A of the base-end lower cam 39
to push up the base end portion of the latch member 42.
[0085] The fulcrum portion 55 holds the leading end portion of the
latch member 42 to act as a rotating center. The fulcrum portion 55
acts as the fulcrum in the leverage principle. The fulcrum portion
55 is provided on the lower side near the leading end of the latch
member 42 while formed in the substantially square-cornered shape.
The leading-end slide surface 55A is formed in a top portion of the
fulcrum portion 55A. The leading-end slide surface 55A slides to
the slope 40A of the leading-end cam 40 to vertically move the
leading-end fitting portion 56 of the latch member 42. The
leading-end slide surface 55A is formed by obliquely cutting away
the top portion of the fulcrum portion 55. The mirror polishing is
performed to the leading-end slide surface 55A in order to decrease
the frictional resistance between the leading-end slide surface 55A
and the slope 40A of the leading-end cam 40. Therefore, when the
latch member 42 is fed while the leading-end slide surface 55A
slides to the slope 40A of the leading-end cam 40, the leading-end
fitting portion 56 of the latch member 42 is pushed up to pull in
the latch member 42, which allows the leading end portion of the
latch member 42 to be pushed down.
[0086] The fulcrum portion 55 is fitted in the fitting recess 40B
of the leading-end cam 40 to be rotated about the fitting recess
40B.
[0087] The leading-end fitting portion 56 is directly fitted in the
second fitted portion 24 of the lid unit holder 21 by extending
from the opening 34 of the recess 33 to the outside. The
leading-end fitting portion 56 acts as a point of application in
the leverage principle. The leading-end fitting portion 56 is
provided to be slightly separated from the fulcrum portion 55 so
that the leading-end fitting portion 56 can sufficiently exert
force while fitted in the second fitted portion 24 of the lid unit
holder 21.
[0088] The base-end side-plate 57 and the leading-end side-plate 58
are the members which hold the latch member 42 to permit the
reciprocal movement of the latch member 42.
[0089] The feed member 43 is connected to latch member 42 to cause
the latch member 42 to appear and disappear. The feed member 43 is
rotatably attached to the rotating support shaft 36 of the recess
33. As shown in FIGS. 7, 8, and 12 to 15, the feed member 43
includes a top plate 61, a key groove 62, the rotating cylinder
portion 63, the long hole 64, and the latch piece 65.
[0090] The top plate 61 is substantially formed in a disk shape.
Two notches 66 for providing the latch piece 65 are provided at
positions opposite each other in the top plate 61 respectively.
[0091] The key groove 62 is the groove in which a latch key of a
lid unit attaching and detaching device (not shown) is fitted when
the manufacturing line lid unit 15 is automatically attached and
detached by the lid unit attaching and detaching device. The key
groove 62 is provided in the center of the upper surface of the top
plate 61.
[0092] The rotating cylinder portion 63 is used when the feed
member 43 is rotatably attached to the rotating support shaft 36 of
the recess 33. The rotating cylinder portion 63 is provided at the
central portion of the lower surface of the top plate 61. The key
groove 62 is designed to be located in the center of the rotating
cylinder portion 63.
[0093] The long hole 64 converts the rotation of the feed member 43
into the appearance and disappearance actions of the latch member
42. The two long holes 64 are provided at the positions opposite
each other in the top plate 61 respectively. The long hole 64 is
formed by a part of a spiral so that one end portion 64A of the
long hole 64 is located near the center of the top plate 61 and the
other end portion 64B is located far away from the center of the
top plate 61. When the connecting shaft 51 of the latch member 42
is fitted in the end portion 64A of the long hole 64, the latch
member 42 is pulled in. When the connecting shaft 51 of the latch
member 42 is fitted in the end portion 64B of the long hole 64, the
latch member 42 is fed.
[0094] A gentle slope 64C is provided in the lower surface of the
top plate 61 in the long hole 64. The slope 64C is set such that
the slope 64C is the same height as the lower surface of the top
plate 61 at the end portion 64A of the long hole 64 and the height
of the slope 64C is gradually increased toward the end portion 64B.
This is because the latch member 42 and the feed member 43 are
securely connected. That is, when the connecting shaft 51 of the
latch member 42 is fitted in the end portion 64B of the long hole
64 to be fed, the base end portion of the latch member 42 is pushed
down, so that the connecting shaft 51 is securely fitted in the
long hole 64 even if the base end portion is pushed down.
[0095] The latch piece 65 holds the feed member 43 while the feed
member 43 is rotated by the predetermined angle. The two latch
pieces 65 are provided at positions opposite each other in the
circumference of the top plate 61. The latch piece 65 is formed by
the plate-shaped member extending along the circumference from the
top plate 61. The projection 65A which is fitted in the holder 37A
of the stopper 37 is provided in the leading end portion of the
latch piece 65. The latch piece 65 has elasticity, and the latch
piece 65 elastically holds the projection 65A. When the projection
65A is fitted in the holder 37A of the stopper 37, the feed member
43 is held while rotated by the predetermined angle (angle in which
the latch member 42 is caused to extend to fix the manufacturing
line lid unit 15 to the container main body 12).
[0096] The cam mechanism 44 fixes the manufacturing line lid unit
15 by engaging the upper surface of the second fitted portion 24 to
push down the manufacturing line lid unit 15 onto the container
main body 12 side while the leading-end fitting portion 56 of the
latch member 42 fed by the feed member 43 is fitted in the second
fitted portion 24 of the lid unit holder 21. While the cam
mechanism 44 engages the upper surface of the second fitted portion
24 by pushing up the leading-end fitting portion 56 of the latch
member 42 fed by the feed member 43, the cam mechanism 44 fixes the
manufacturing line lid unit 15 by pushing down the base end portion
to push down the manufacturing line lid unit 15 onto the container
main body 12 side by the leverage principle. The cam mechanism 44
includes the base-end lower cam 39, the base-end upper cam 53, the
base-end slide surface 52, the cam holder projection 69, the
leading-end cam 40, and the leading-end slide surface 55A. The
configurations of the base-end lower cam 39, the base-end upper cam
53, the base-end slide surface 52, the leading-end cam 40, and the
leading-end slide surface 55A are already described above
[0097] The cam holder projection 69 engages the slope 53A of the
base-end upper cam 53 to push down the base end portion of the
latch member 42 when the latch member 42 is fed. The cam holder
projection 69 is provided in the lower surface of the hold cover
45. Specifically, the cam holder projection 69 and the slope 53A of
the base-end upper cam 53 are provided while the cam holder
projection 69 slides to the slope 53A with no gap in the state in
which the base-end slide surface 52 of the latch member 42 slides
to the slope 39A of the base-end lower cam 39.
[0098] The hold cover 45 holds the latch member 42 and the feed
member 43. As shown in FIGS. 16 and 17, the hold cover 45 includes
a feed-member holder 71 and a latch-member holder 72.
[0099] The feed-member holder 71 supports the feed member 43 while
permitting the feed member 43 to be rotated. The feed-member holder
71 includes a circumferential plate 74 and a top plate 75. The
circumferential plate 74 is formed while the circumference of the
feed member 43 is covered with the circumferential plate 74. The
top plate 75 is formed while the upper side of the feed member 43
is covered with the top plate 75. A key hole 76 whose size is equal
to the key groove 62 of the feed member 43 is provided in the
central portion of the top plate 75. The key hole 76 matches the
key groove 62 of the feed member 43 while the feed member 43 is
covered with the top plate 75. Therefore, the key groove 62 matches
the key hole 76 while the latch member 42 is pulled in.
[0100] The latch member holder 72 supports the latch member 42
while permitting the latch member 42 to be reciprocally moved. The
latch member holders 72 are provided on the right and left sides of
the feed-member holder 71 respectively. Each latch member holder 72
includes a side plate 78 and a top plate 79.
[0101] The side plate 78 supports the latch member 42 from the
right and left sides in the vicinity of the latch member 42. The
side plate 78 includes a wide portion 78A and a narrow portion 78B.
The base-end side-plate 57 of the latch member 42 is fitted in the
wide portion 78A. The portion located between the base-end
side-plate 57 and the leading-end side-plate 58 in the latch member
42 is fitted in the narrow portion 78B.
[0102] The top plate 79 supports the latch member 42 from the upper
side. The cam holder projection 69 is provided in the base end
portion of the lower surface of the top plate 79. A support
projection 80 which is fitted in the upper groove 54 of the latch
member 42 is provided in the leading end portion of the lower
surface of the top plate 79. A slit 81 is provided on the leading
end side of the top plate 79, and a projection 82 is provided in
the leading end of the slit 81. The projection 82 includes a
central projection piece 82A and latch piece 82B. The projection 82
is elastically supported by the slit 81. The positioning is
performed between the hold cover 45 and the cover clamp 46 by
fitting the central projection piece 82A and latch piece 82B of the
projection 82 in a cross notch 86A of the cover clamp 46.
[0103] As shown in FIGS. 8, 18, and 19, the cover clamp 46 fixes
the hold cover 45 to the recess 33 of the manufacturing line lid
unit 15. Specifically, the two cover clamps 46 support the latch
member holders 72 to fix the hold cover 45 to the recess 33. The
cover clamp 46 includes a side plate 85, a top plate 86, an upper
support plate piece 87, and a lower support plate piece 88.
[0104] The right and left side-faces of the latch member 42 are
covered with the side plates 85 so that the latch member 42 is
permitted to be reciprocally moved. The top plate 86 integrally
supports the side plates 85, and the upper side of the latch member
42 is covered with the top plate 86 to permit the latch member 42
to be reciprocally moved. The upper support plate piece 87 supports
the top plate 79 of the latch member holder 72 of the hold cover 45
from the lower side of the top plate 79. The top plate 79 of the
latch member holder 72 is vertically supported by the top plate 86
of the cover clamp 46 and the upper support plate piece 87. The
lower support plate piece 88 fixes the cover clamp 46 to the recess
33. Each three of the lower support plate pieces 88 are provided in
the lower end portions of the side plates 85. The cover clamp 46 is
fixed to the recess 33 by fitting the lower support plate pieces 88
in the latch pawls 38 provided in the recess 33 respectively. A
taper 88A is provided in each lower support plate piece 88 so as to
be easily fitted in the latch pawl 38.
[0105] In lower surfaces of the transport lid unit 14 and the
manufacturing line lid unit 15, as shown in FIGS. 1, 20, and 21, a
wafer retainer 91 is provided as a thin-plate retainer. The wafer
retainer 91 supports the plural semiconductor wafers stored in the
container main body 12 from the upper side of the semiconductor
wafers. The wafer retainer 91 includes a base-end support portion
92, an elastic support plate 93, and an engaging piece 94.
[0106] The base-end support portion 92 supports the elastic support
plate 93 and the engaging piece 94. The base-end support portion 92
is formed in a square bar across the total length of the wafer
retainer 91, and the base-end support portion 92 is fixed to the
lower surface of the lid unit.
[0107] The elastic support plate 93 elastically supports the
engaging piece 94. The elastic support plates 93 are arranged
according to the number of semiconductor wafers stored in the
container main body 12. The elastic support plates 93 are fixed to
the base-end support portion 92 while horizontally arranged in a
row. The elastic support plate 93 includes a first support plate
piece 93A whose side face is bent in an S-shape and a second
support plate piece 93B whose side face is bent in a U-shape. In
the first support plate piece 93A, the base end portion is fixed to
the base-end support portion 92, and a first engaging piece 94A is
fixed to the leading end portion. In the second support plate piece
93B, the base end portion is integrally connected to the first
support plate piece 93A through the first engaging piece 94A, and a
second engaging piece 94B is fixed to the leading end portion.
[0108] The elastic support plate 93 is set so that the range where
the proportionality is held between the amount of displacement of
the engaging piece 94 and the external force is set up to 1.5 to
2.5 mm. That is, the proportionality is held between the amount of
displacement and the external force when the amount of displacement
does not exceed the range of 1.5 to 2.5 mm. Hereinafter the amount
of displacement in the range where the proportionality is held
between the amount of displacement and the external force is
referred to as an elastic displacement amount. When the engaging
piece 94 is displaced beyond the elastic displacement amount,
spring resistance force is rapidly increased. It is desirable that
the elastic displacement amount is set to 1.5 mm. This is because
the semiconductor wafer is elastically supported within the amount
of the displacement of the semiconductor wafer to rapidly prevent
the spring resistance force, even if the amount of displacement is
increased as the semiconductor wafer is enlarged to 300 mm in the
size. As described above, in the thin-plate supporting container,
recently the molding accuracy is improved so that the existence
position tolerance of the semiconductor wafer ranges from about
-0.5 mm to about +0.5 mm. Therefore, in the amount of displacement
not exceeding the elastic displacement amount ranging from 1.5 to
2.5 mm, the range of 0 to 0.5 mm is used for holding force of the
semiconductor wafer (holding force for securing drop-resistant
performance and vibration-resistant performance), and the range of
0.5 to 1.5 mm (2.5 mm at the maximum according to design) is used
for permitting variations in existence position of the
semiconductor wafer.
[0109] FIGS. 23 and 24 show spring characteristics of the elastic
support plate 93. FIG. 23 shows values per one semiconductor wafer,
and FIG. 24 shows values per two semiconductor wafers. As shown in
FIG. 23, the proportionality is held between the amount of
displacement and pressing force up to the amount of displacement of
2.5 mm. Therefore, the elastic support plate 93 is elastically
deformed in the range of 0 to 2.5 mm. When compared to the
characteristics of the conventional spring, as shown in FIG. 24,
the conventional spring member (lower line in FIG. 24) is hardly
displaced when the pressing force becomes 0.3 mm. On the contrary,
the elastic support plate 93 according to the first embodiment is
deformed while the proportionality is held between the amount of
displacement and the pressing force. As shown in FIG. 23, the
proportionality is held up top the amount of displacement of 2.5
mm. In FIGS. 23 and 24, the proportionality is held when the amount
of displace exceeds 2.5 mm. However, like the conventional spring
member, the elastic support plate 93 is designed so as to be hardly
displaced when the maximum amount of displacement exceeds 2.5 mm.
In the case of the structure in which a part of the elastic support
plate (for example, a horizontal plate 125C in FIG. 35) engages the
backsides of the lid units 14 and 15, it is possible that the size
of the corresponding part is changed and designed so as to be
hardly displaced when the maximum amount of displacement exceeds
2.5 mm.
[0110] FIGS. 23 and 24 show the experimental results when the two
semiconductor wafers are simultaneously pressed. In the elastic
support plate 93 having the characteristics, the spring force
becomes about 1 kg for one semiconductor wafer when the amount of
displacement is 0.5 mm, and the spring force becomes about 3 kg
when the amount of displacement is 1.5 mm. In the case where the 25
semiconductor wafers are stored, clamping force ranges from 25 to
75 kg.
[0111] In the state in which the manufacturing line lid unit 15 is
lightly fitted in the container main body 12 and the force is not
applied, the installation position of the engaging piece 94
supported by the elastic support plate 93 is set to the position
where the engaging piece 94 is not in contact with the
semiconductor wafers stored in the container main body 12 while the
small gap is kept between the engaging piece 94 and the
semiconductor wafers, or the installation position of the engaging
piece 94 is set to the position where the engaging piece 94 is in
slight contact with the semiconductor wafers. Therefore, when the
manufacturing line lid unit 15 is fitted in and fixed to the
container main body 12, even if the container main body 12 is not
fixed to press the manufacturing line lid unit 15, the
manufacturing line lid unit 15 is fitted in the container main body
12 so as to be able to fix the manufacturing line lid unit 15 only
by rotating the latch key, which results in facilitating
automatization of the easy attachment and detachment of the
manufacturing line lid unit 15.
[0112] The engaging piece 94 directly supports each of the
semiconductor wafers. Each engaging piece 94 has the first engaging
piece 94A and the second engaging piece 94B, and the semiconductor
wafer is supported at two points. The engaging piece 94 includes
two blocks 96 and a support pawl 97 alternately arranged.
[0113] The block 96 includes a slope 96A and an engaging surface
96B. In order to easily insert the peripheral portion of the
semiconductor wafer between the two blocks 96, the slope 96A is
formed so as to open outward while the two blocks 96 are formed
opposite each other. The engaging surface 96B is configured so as
to form the groove having a constant width (slightly wider than the
thickness of the semiconductor wafer) when the two blocks 96 are
attached opposite each other.
[0114] The support pawl 97 (the same member as the support pawl 113
in FIG. 27) comes into direct contact with the peripheral portion
of the semiconductor wafer to support the semiconductor wafer. The
support pawl 97 is provided in the engaging surface 96B of each
block 96. The support pawl 97 is formed by a long convex strip. The
support pawls 97 are alternately arranged in the opposite engaging
surface 96B. Specifically, two support pawls 97 are provided at the
both end in one of the engaging surfaces 96B and one support pawl
97 is provided in the center of the other engaging surface 96B,
which allows the support pawls 97 opposite each other to be
alternately arranged. That is, in the block 96 on the upper left
side of the two blocks 96 opposite each other in the engaging piece
94 of FIG. 21, two support pawls 97 are provided at the both end
portions in the upper right and lower left directions of the
engaging surface 96B. Further, one support pawl 97 is provided in
the center of the engaging surface 96B in the block 96 on the lower
right side. Therefore, the support pawls 97 opposite each other are
alternately arranged.
[0115] The support pawl 97 is molded with an elastic material, and
the support pawl 97 elastically supports the peripheral portion of
the semiconductor wafer. The gap between two engaging surfaces 96B
is slightly wider than the thickness of the semiconductor wafer, so
that the gap between two leading ends of the support pawls 97
arranged in the engaging surfaces 96B is narrower than the
thickness of the semiconductor wafer. Therefore, the semiconductor
wafer is inserted between the support pawls 97 while slightly
pushing the support pawls 97 made of the elastic material which are
alternately arranged. Therefore, the peripheral portion of the
semiconductor wafer is securely supported by the alternately
arranged support pawls 97.
[0116] As shown in FIG. 22, a lid unit holder 100 is provided
outside the manufacturing line lid unit 15. The lid unit holder 100
prevents the manufacturing line lid unit 15 from detaching from the
container main body 12. The lid unit holder 100 includes a support
plate 101, a hook 102, and a fitting projection 103.
[0117] The support plate 101 supports the hook 102 and the fitting
projection 103. The hooks 102 are provided at the both end portions
of the support plate 101 respectively. The flange portion of the
container main body 12 (the flange portion and the like outside the
lid unit holder 21 in FIG. 3) is hooked on the hook 102.
[0118] The fitting projection 103 is provided in one side surface
of the support plate 101. The fitting projection 103 is formed in
the same shape as the key groove 62, and the fitting projection 103
is fitted in the key groove 62 through the key hole 76. The two
fitting projections 103 are provided at positions in which the two
fitting projections 103 match the two key grooves 62 respectively.
Therefore, each fitting projection 103 is fitted in each key groove
62 to fix the feed member 43 while the flange of the container main
body 12 is hooked on the hook 102. This is because that the
vibration and the shock rotate the feed member 43 to release the
fixation of the manufacturing line lid unit 15 to the container
main body 12 is prevented during the transport of the thin-plate
supporting container.
[0119] The thin-plate supporting container 11 having the above
configuration is used as described below.
[0120] When the manufacturing line lid unit 15 is detached from the
container main body 12, the latch key is fitted in the key groove
62 and rotated, which allows the feed member 43 to be rotated from
the state shown in FIG. 25A to gradually pull in the latch member
42. Therefore, the leading-end slide surface 55A of the fulcrum
portion 55 in the latch member 42 slides to the slope 40A of the
leading-end cam 40 to push down the leading-end fitting portion 56
as shown in FIGS. 25B, 25C, and 25D. At the same time, the base-end
slide surface 52 of the latch member 42 slides to the slope 39A of
the base-end lower cam 39 to push up the base end portion of the
latch member 42. Therefore, the leading-end fitting portion 56 is
completely stored in the main body 30. Then, the manufacturing line
lid unit 15 is detached from the container main body 12.
[0121] When the manufacturing line lid unit 15 is attached to the
container main body 12, the manufacturing line lid unit 15
supported by the latch key fitted in the key groove 62 is attached
to the lid unit holder 21, which allows the manufacturing line lid
unit 15 to be fitted without applying any particular force until
the gasket 22 of the transport lid unit 14 engages the sealing
groove 21C. In this state, the bottom portion of the engaging piece
94 of the wafer retainer 91 is not in contact with the
semiconductor wafer, or the bottom portion of the engaging piece 94
is in slight contact with the semiconductor-wafer. The leading-end
fitting portion 56 of the latch member 42 in the simplified
detaching mechanism 32 is positioned inside the engaging surface of
the second fitted portion 24 (inside the container main body 12).
In this state, the latch key is rotated. Therefore, contrary to the
case in which the manufacturing line lid unit 15 is detached from
the container main body 12, the latch member 42 is pushed out from
the main body 30, and the leading-end fitting portion 56 is
smoothly fitted in the second fitted portion 24 to engage the
engaging surface of the second fitted portion 24. At this point,
the fulcrum portion 55 of the latch member 42 slides the slope 40A
of the leading-end cam 40 to push up the leading-end fitting
portion 56. Further, the cam holder projection 69 slides the slope
53A of the base-end upper cam 53 to push down the base end portion
of the latch member 42. Therefore, the base-end slide surface 52 of
the latch member 42 is pushed down along the slope 39A of the
base-end lower cam 39.
[0122] In the fulcrum portion 55 of the latch member 42, the
leading-end slide surface 55A is fitted in the fitting recess 40B,
and the latch member 42 is rotated about the fitting recess
40B.
[0123] In the base end portion of the latch member 42, while the
base-end slide surface 52 slides to the slope 39A of the base-end
lower cam 39, the cam holder projection 69 engages the slope 53A of
the base-end upper cam 53 to push down the base end portion of the
latch member 42.
[0124] Therefore, the latch member 42 acts as the lever in which
the fulcrum portion 55 fitted in the fitting recess 40B becomes the
fulcrum, and the manufacturing line lid unit 15 is fixed by
strongly pushing the manufacturing line lid unit 15 down onto the
container main body 12 side while the leading-end fitting portion
56 is fitted in the second fitted portion 24 of the lid unit holder
21. Accordingly, the engaging piece 94 of the wafer retainer 91 is
fitted in the semiconductor wafer to support the semiconductor
wafer. At this point, a rotating torque of the latch key is
transmitted to the latch and converted into push-out force of the
latch member 42. Then, the latch member 42 engages the container
main body 12 to convert the push-out force into the force pressing
the manufacturing line lid unit 15 against the container main body
12 and the force pressing the wafer retainer 91 against the
semiconductor wafers. The force pushed back from the semiconductor
wafers returns to the manufacturing line lid unit 15. Therefore,
even if the container main body 12 is not fixed, the lid unit 15
can be attached and detached without shifting the container main
body 12 by the force generated when the latch key is rotated.
[0125] In the state in which the manufacturing line lid unit 15 is
attached to the container main body 12, the lid unit holder 100 is
attached as necessary. Specifically, the flange portion of the
container main body 12 (the flange portion and the like outside the
lid unit holder 21 in FIG. 3) is hooked on the hook 102. Therefore,
the fitting projection 103 is fitted in the key groove 62 to fix
the feed member 43.
[0126] In the container main body 12, the peripheral portion of the
semiconductor wafer is fitted in the engaging piece 94. In the
engaging piece 94, the peripheral portion of the semiconductor
wafer is inserted between the alternately arranged support pawls
97, and the semiconductor wafer is securely supported by the
support pawls 97.
[0127] When the strong shock is applied from the outside of the
thin-plate supporting container 11, the latch member 42 strongly
presses the manufacturing line lid unit 15 against the container
main body 12 using the leverage principle, so that the
manufacturing line lid unit 15 is never detached from the container
main body 12. Further, since the feed member 43 is fixed by the lid
unit holder 100, there is no possibility that the latch member 42
is detached from the second fitted portion 24 by rotating the feed
member 43.
[0128] On the other hand, since the semiconductor wafer in the
thin-plate supporting container 11 is fitted in the engaging piece
94 of wafer retainer 91 and supported by the alternately arranged
support pawls 97 from the both sides, there is no possibility that
the semiconductor wafer is detached from the engaging piece 94 by
rotating the feed member 43. Further, the engaging piece 94 is
supported by the elastic support plate 93, so that the first
support plate piece 93A and the second support plate piece 93B
engage the lower surface of the manufacturing line lid unit 15 by
their own elastic force to support the semiconductor wafer, which
enables the breakage of the semiconductor wafer to be
prevented.
[0129] At this point, the engaging piece 94 supported by the
elastic support plate 93 supports the semiconductor wafer up to the
amount of displacement of about 0.5 mm. Further, while the engaging
piece 94 securely supports the semiconductor wafer by absorbing the
position shift of the semiconductor wafer up to the amount of
displacement of about 1.5 mm (2.5 mm at the maximum depending on
the design), the engaging piece 94 absorbs the vibration and shock
from the outside by the elastic displacement up to the amount of
displacement of about 1.5 mm (2.5 mm at the maximum depending on
the design). For the large shock and the like, the shock is
absorbed at a first stage in which the engaging piece 94 is
elastically displaced up to the amount of displacement of about 1.5
mm (2.5 mm at the maximum depending on the design). When the
elastic displacement exceeds 2.5 mm, the shock is absorbed at a
second stage in which the spring resistance force is rapidly
increased by the characteristics previously set to the elastic
support plate 93.
[0130] In the case of cleaning, when the cover clamp 46 is shifted
to detach the cover clamp 46 from the latch pawls 38, the
simplified detaching mechanism 32 is disassembled into the latch
member 42, the feed member 43, the cam mechanism 44, the hold cover
45, and the cover clamp 46, and each part can individually be
cleaned and dried.
[0131] As described above, according to the thin-plate supporting
container 11, the following effects can be obtained.
[0132] (1) The maximum amount of displacement of the wafer retainer
91 is set to 1.5 mm (2.5 mm at the maximum depending on the
design). Therefore, even in the semiconductor wafer having the
diameter of 300 mm, the thin-plate supporting container 11 can
support the semiconductor wafers by absorbing the increase in
displacement amount associated with the enlargement of the
semiconductor wafer size, and the spring resistance force can be
prevented from rapidly increasing.
[0133] (2) The proportionality is held between the amount of
displacement and the external force in the range not exceeding the
maximum amount of displacement of the wafer retainer 91 of 1.5 mm
(2.5 mm at the maximum depending on the design). Therefore, the
spring resistance force of the wafer retainer 91 is not rapidly
increased, and the thin-plate supporting container which is
excellent for the vibration-resistant performance and
shock-resistant performance can be provided.
[0134] When the large shock is applied to the thin-plate supporting
container, the shock is absorbed at the first stage in which the
engaging piece is elastically deformed up to the maximum amount of
displacement of about 1.5 mm (2.5 mm at the maximum depending on
the design), and the shock is absorbed at the second stage in which
the spring resistance force is rapidly increased when the elastic
displacement exceeds 2.5 mm. Therefore, the shock from the outside
can be absorbed without applying the large shock to the
semiconductor wafer.
[0135] (3) In the state in which the manufacturing line lid unit 15
is slightly fitted in the container main body 12, the wafer
retainer 91 is not in contact with the semiconductor wafer, or the
wafer retainer 91 is in light contact with the semiconductor wafer.
Therefore, the semiconductor wafer can be fixed to container main
body 12 without strongly pressing the manufacturing line lid unit
15, and the automatization of the attachment and detachment of the
manufacturing line lid unit 15 can be easily realized.
[0136] (4) The latch member 42 is fed using the leverage principle,
so that the manufacturing line lid unit 15 can be firmly fixed to
the container main body 12 with the strong force.
[0137] (5) The simplified detaching mechanism can be taken apart
into component parts. Therefore, in the case of the cleaning, while
the simplified detaching mechanism can be taken apart into
component parts to clean every part, the component parts can be
immediately dried.
[0138] (6) The support pawls 97 are alternately arranged, so that
the semiconductor wafer can securely be supported by alternately
engaging the support pawl 97 to the circumference of the
semiconductor wafer.
Second Embodiment
[0139] Then, a second embodiment of the invention will be
described. In the second embodiment, the wafer retainer is
improved.
[0140] Sometimes the thin-plate supporting container is vibrated by
various factors during transport. When the vibration is transmitted
to the semiconductor wafer, sometimes the undesirable rotation of
the semiconductor wafer is generated by the vibration. Therefore,
when the thin-plate supporting container is used in the mode in
which the thin-plate supporting container is subject to the
vibration, the wafer retainer according to the second embodiment
(thin-plate retainer) is used. Referring to FIGS. 35 to 44, a wafer
retainer 121 of the second embodiment will be described below.
Because the constituents except for the wafer retainer 121 are
similar to those of the thin-plate supporting container 11 of the
first embodiment, the similar constituent is indicated by the same
reference numeral, and the description is neglected.
[0141] As shown in FIG. 41, the wafer retainer 121 includes a
base-end support portion 122, an elastic support plate 123, an
engaging piece 124, a connecting support plate 125, and a support
rib 126.
[0142] The base-end support portions 122 are respectively provided
at the both end of the wafer retainer 121 to directly support the
two elastic support plates 123. The base-end support portion 122 is
formed in the square bar across the total length in the
longitudinal direction of the wafer retainer 121 (vertical
direction in FIG. 36). Two hook-shaped support portions 128 are
provided on the lower side of a lid unit 127 respectively. The
base-end support portions 122 are respectively fitted in the
hook-shaped support portions 128 and fixed to the backside of the
lid unit 127.
[0143] The elastic support plate 123 elastically supports the
outside end of the engaging piece 124. Two sets of elastic support
plates 123 are arranged according to the number of semiconductor
wafers 120 stored in the container main body 12. The elastic
support plates 123 are fixed to the base-end support portion 122
while horizontally arranged in a row. In the elastic support plate
123, the side face is bent in the S-shape. In the two sets of
elastic support plates 123, the base end portions are fixed to the
two base-end support portions 122 respectively, and each engaging
piece 124 is attached to the leading end portion, which elastically
supports the engaging pieces 124.
[0144] The engaging piece 124 directly engages the circumferential
portion of each semiconductor wafer 120 to directly support the
semiconductor wafer 120. As shown in FIGS. 43 and 44, a V-shaped
fitting groove 124A in which the semiconductor wafer 120 is fitted
is provided in one of side faces of each engaging piece 124. The
fitting groove 124A is formed in the V-shape having the two stages.
In the first-stage groove, the gentle slope having an angle of
124.degree. is formed. In the second-stage groove, the slope having
the angle of 44.degree. is formed. Therefore, when the
circumference of the semiconductor wafer 120 comes into contact
with the first-stage groove, the circumference of the semiconductor
wafer 120 is guided by the gentle slope to fall down in the
second-stage groove, and the semiconductor wafer 120 is supported
by the second-stage groove. The bottom portion of the second-stage
groove is formed in a flat whose width is substantially equal to
the thickness of the semiconductor wafer 120. The slope angle and
the bottom width of the second-stage groove are formed according to
the size of the peripheral portion of the semiconductor wafer 120.
Because the peripheral portion of the semiconductor wafer 120 is
cut at an edge angle of 44.degree., the slope angle of the groove
is set to 44.degree.. Further, the bottom width of the groove is
also set according to the width of the peripheral portion of the
semiconductor wafer 120, which allows the second-stage groove to
firmly hold the semiconductor wafer 120. Therefore, the
second-stage groove securely supports the semiconductor wafer 120
while being in contact with the semiconductor wafer 120 in the wide
area, and the semiconductor wafer 120 can be prevented from
rotating against the vibration. Although the second-stage groove is
set to 44.degree. according to the edge angle of the semiconductor
wafer 120, in consideration of the material of the engaging piece
124, it is also possible that the second-stage groove is formed in
the slope angle slightly narrow than 44.degree.. Specifically, the
slope angle is appropriately set in the range of about 40.degree.
to about 44.degree. according to difference in elastic force. When
the slope angle of the second-stage groove is too narrow, the
peripheral portion of the semiconductor wafer 120 is not
sandwiched. Therefore, when the lid unit 127 is lifted up,
sometimes the semiconductor wafer 120 is lifted up in conjunction
with the lid unit 127, so that the slope angle is set to a certain
extent in which the semiconductor wafer 120 is sandwiched. In the
case where the edge angle of the semiconductor wafer 120 is
different from 44.degree., or in the case of other thin plates
except for the semiconductor wafer 120, the slope angle of the
second-stage groove is set in the range of about 20.degree. to
about 60.degree. as appropriate.
[0145] As shown in FIGS. 41 and 42, the bottom portion of the
fitting groove 124A is set to the angle along the peripheral shape
of the semiconductor wafer 120, i.e. such that the angle becomes a
tangential direction of the periphery of the semiconductor wafer
120. As mentioned later, because the elastic force is increased in
proportion to the amount of deformation of the wafer retainer 121,
the force in which each engaging piece 124 presses the
semiconductor wafer 120 is equalized as a whole. That is, when the
amount of change is increased in one of the two engaging pieces
124, the elastic force is increased according to the amount of
change, the semiconductor wafer 120 is slightly pushed onto the
other engaging piece 124 side, and the semiconductor wafer 120 is
settled at a point in which the elastic forces of the two engaging
pieces 124 become equal to each other. As a result, the two
engaging pieces 124 are automatically adjusted so that the elastic
forces of the two engaging pieces 124 become equal to each other.
Further, in the state in which the lid unit 127 is attached to the
container main body 12, the bottom portion of the fitting groove
124A is set so as to come into contact with the semiconductor wafer
120 at the position near the substantial center of the bottom
portion (contact point A in FIG. 42).
[0146] The connecting support plate 125 supports the two engaging
pieces 124 while connecting the two engaging pieces 124. The both
end portions of the connecting support plate 125 are respectively
connected to the engaging pieces 124 to elastically support each
engaging piece 124. The connecting support plate 125 is formed
while the side face is bent in the U-shape. Specifically, the
connecting support plate 125 includes vertical plates 125A and 125B
located on the both sides and the horizontal plate 125C. The
vertical plates 125A and 125B are arranged in the direction
perpendicular to the backside of the lid unit 127, and the vertical
plates 125A and 125B support the engaging pieces 124
respectively.
[0147] The horizontal plate 125C is configured to be elastically
deformed. The horizontal plate 125C mainly assumes the function in
which the connecting support plate 125 elastically supports the
engaging piece 124. The horizontal plate 125C is arranged in the
direction along the backside of the lid unit 127 while the vertical
plates 125A and 125B are connected to the both ends respectively.
The horizontal plate 125C is supported by the later-mentioned
support convex strip 131 at the center, and the both end portions
of the horizontal plate 125C are deformed centering the support
convex strip 131.
[0148] The elastic force which is generated by the deformation of
the horizontal plate 125C (elastic force by which the connecting
support plate 125 supports the engaging piece 124) is set stronger
than the elastic force by which the elastic support plate 123
supports the engaging piece 124. Therefore, in the two engaging
pieces 124, the inside ends of the engaging pieces 124 are
supported by the strong elastic force, and the outside ends of the
engaging pieces 124 are supported by the weak elastic force.
Further, as mentioned above, the bottom portions of the fitting
grooves 12 4A in the two engaging pieces 124 are arranged in the
tangential direction of the periphery of the semiconductor wafer
120. Accordingly, the force by which the wafer retainer 121
supports the semiconductor wafer 120 is set so as to increase in
proportional to the amount of movement (vibration) of the
semiconductor wafer 120. That is, in the normal state, as shown by
solid lines in FIG. 42, the semiconductor wafer 120 is supported
while being in contact with the bottom portion of the fitting
groove 124A at the position near the central portion of the bottom
portion (contact point A in FIG. 42). When the semiconductor wafer
120 is vibrated, the inside end of the engaging piece 124 supported
by the strong elastic force of the connecting support plate 125 is
not changed so much, and the outside end supported by the weak
elastic force of the elastic support plate 123 is largely changed.
Therefore, as shown by chain double-dashed lines in FIG. 42, the
semiconductor wafer 120 is supported while moved onto the inside
end side (contact point B side in FIG. 42) of the bottom portion in
the fitting groove 124A. When the amount of vibration of the
semiconductor wafer 120 is small (the amount of deformation of the
wafer retainer 121 is small), the semiconductor wafer 120 is
supported by the weak elastic force while being in contact with the
bottom portion of the fitting groove 124A on the outside end side
(contact point side A in FIG. 42). When the amount of vibration of
the semiconductor wafer 120 is large (the amount of deformation of
the wafer retainer 121 is large), the semiconductor wafer 120 is
supported by the strong elastic force while the contact point of
the semiconductor wafer 120 is moved onto the inside end side of
the fitting groove 124A (contact point B side in FIG. 42). Further,
as the amount of movement of the contact point of the semiconductor
wafer 120 on to the inside end side is increased, the force applied
to the connecting support plate 125 becomes larger than the force
applied to the elastic support plate 123, and the elastic force is
increased, which allows the vibration of the semiconductor wafer
120 to be efficiently suppressed.
[0149] The support rib 126 supports the connecting support plate
125 to prevent the connecting support plate 125 from shifting
toward the direction along the backside of the lid unit. As shown
in FIGS. 35 to 41, the support rib 126 is provided in the central
portion of the backside of the lid unit 127. The support rib 126 is
provided such that the whole of many connecting support plates 125
of the wafer retainer 121 is covered. Specifically, the support rib
126 is set to the length in which the connecting support plates 125
arranged according to the number of stored semiconductor wafer 120
can be fitted. The support rib 126 includes two support walls 129
and 130.
[0150] The support walls 129 and 130 are provided in parallel while
being opposite each other. Each of the support walls 129 and 130
includes a support plate piece 133 and a partition plate piece
134.
[0151] The support plate piece 133 supports the vertical plates
125A and 125B of the connecting support plate 125 so that the
vertical plates 125A and 125B do not shift in a circumferential
direction (horizontal direction in FIG. 41) of the semiconductor
wafer 120. The support plate piece 133 directly supports the
vertical plates 125A and 125B of the connecting support plate 125.
Therefore, the support plate piece 133 indirectly supports the
engaging pieces 124 so that the engaging pieces 124 do not shift in
the circumferential direction of the semiconductor wafer 120.
[0152] The partition plate piece 134 is a plate piece which
individually partitions the many connecting support plates 125.
Each of the partition plate pieces 134 is provided while positioned
on the outermost sides and between the connecting support plates
125, which allows the connecting support plate 125 to be supported
from the both sides in the width direction by the partition plate
pieces 134. The partition plate pieces 134 directly support the
connecting support plate 125. Therefore, the partition plate pieces
134 indirectly support the engaging pieces 124 so that the engaging
pieces 124 do not shift in the direction orthogonal to the
circumferential direction of the semiconductor wafer 120.
[0153] The connecting support plate 125 is individually supported
while sandwiched from the surrounding (radial direction of the
semiconductor wafer 120 stored in the container main body 12) by
the support plate piece 133 and the partition plate piece 134.
Therefore, the connecting support plate 125 is prevented from
shifting in the direction along the backside of the lid unit, and
the movement in the direction perpendicular to the backside of the
lid unit is permitted.
[0154] A slight gap is formed between the support plate piece 133
and partition plate piece 134 and the connecting support plate 125.
That is, when the semiconductor wafer 120 is slightly vibrated, the
connecting support plate 125 does not come in to contact with the
support plate piece 133 and partition plate piece 134, but the
connecting support plate 125 is deformed to absorb the vibration.
When the vibration violent, since the connecting support plate 125
is also violently vibrated through the engaging pieces 124, the
connecting support plate 125 is supported while being in contact
with the support plate piece 133 and partition plate piece 134.
[0155] As shown in FIGS. 35 and 38 to 40, the support convex strip
131 is provided between the two support walls 129 and 130 of the
support rib 126. The support convex strip 131 directly engages the
connecting support plates 125 to support the connecting support
plates 125. Specifically, the central portions of the horizontal
plates 125C of the connecting support plates 125 engage the support
convex strip 131 to support the connecting support plates 125, and
the both end portions of the horizontal plate 125C can be freely
deformed. The support convex strip 131 is provided at the central
portion between the two support walls 129 and 130 which are
provided in parallel while being opposite each other. The support
convex strip 131 is provided in parallel with the support walls 129
and 130, and the support convex strip 131 has the substantially
same length as the support walls 129 and 130.
[0156] The support convex strip 131 has the configuration shown in
FIGS. 39 and 40. That is, the support convex strip 131 is molded so
that the both-side portions (b in FIG. 39) are thin and the central
portion (a in FIG. 39) is thick. Therefore, the engaging pieces 124
located in the central portion are projected toward the
semiconductor wafer 120 further than the engaging pieces 124
located in the both sides. In the second embodiment, the support
convex strip 131 is formed in a bow shape. In the state in which
the wafer retainer 121 is attached to the lid unit 127, as shown in
FIG. 40, the interval between the support convex strip 131 and the
connecting support plate 125 becomes widened in the both sides, and
the interval becomes narrowed in the central portion. The specific
dimensions of the support convex strip 131 are appropriately set
according to the amount of deformation of the lid unit 127.
[0157] The reason why the support convex strip 131 is formed in the
above-described manner is as follows. When the lid unit 127 is
attached while the plural semiconductor wafers 120 are stored in
the container main body 12, a certain repellent force acts on the
lid unit 127. The wafer retainer 121 attached to the backside of
the lid unit supports each of the semiconductor wafers 120 one by
one with a constant force. Therefore, as the diameter of the
semiconductor wafer 120 is enlarged to increase the force
supporting the semiconductor wafer 120, or as the number of
semiconductor wafers 120 is increased, the repellent force pushing
back the wafer retainer 121 is increased. The lid unit 127 to which
the wafer retainer 121 is attached is slightly deformed toward the
outside by the repellent force. When the lid unit 127 is deformed
toward the outside, the force supporting the semiconductor wafers
120 with the wafer retainer 121 is weakened in the central portion.
Therefore, the support convex strip 131 is provided in order to
eliminate the unevenness of the force supporting the semiconductor
wafers 120. The deformation of the lid unit 127 is absorbed by the
support convex strip 131 in which the central portion is thick, and
the wafer retainer 121 supports the semiconductor wafers 120 with
even forces.
[0158] As with the first embodiment, in the wafer retainer 121, the
range where the proportionality is held between the amount of
displacement of the engaging piece 124 and the external force is
set up to 1.5 to 2.5 mm. It is desirable that the maximum amount of
displacement is set to 1.5 mm. In the amount of displacement not
exceeding the maximum amount of displacement ranging from 1.5 to
2.5 mm, the range of 0 to 0.5 mm is used for the holding force of
the semiconductor wafer (holding force for securing the
drop-resistant performance and the vibration-resistant
performance), and the range of 0.5 to 1.5 mm (2.5 mm at the maximum
according to design) is used for permitting the variations in
existence position of the semiconductor wafer.
[0159] In the state in which the lid unit 127 is lightly fitted in
the container main body 12 and the force is not applied, the
installation position of the engaging piece 124 is set to the
position where the engaging piece 124 is not in contact with the
semiconductor wafers stored in the container main body 12 while the
small gap is kept between the engaging piece 124 and the
semiconductor wafers, or the installation position of the engaging
piece 124 is set to the position where the engaging piece 124 is in
slight contact with the semiconductor wafers.
[0160] The thin-plate supporting container having the above
configuration is used as follows.
[0161] When the lid unit 127 is attached while the plural
semiconductor wafers 120 are stored in the container main body 12,
the wafer retainer 121 is fitted in the semiconductor wafers
120.
[0162] When the lid unit 127 is attached to the container main body
12, as with the first embodiment, the lid unit 127 supported by the
latch key fitted in the key groove 62 is attached to the lid unit
main body 12, which allows the lid unit 127 to be fitted in the
container main body 12 without applying any particular force. In
this state, the wafer retainer 121 is not completely fitted in the
semiconductor wafers 120, and the bottom portion of the wafer
retainer 121 is not in contact with the semiconductor wafers 120 or
the bottom portion of the wafer retainer 121 is in slight contact
with the semiconductor wafers 120. The leading-end fitting portion
56 of the latch member 42 in the simplified detaching mechanism 32
is positioned inside the engaging surface of the second fitted
portion 24 (inside the container main body 12). In this state, as
with the first embodiment, the latch key is rotated, which allows
the lid unit 127 to be pushed in the container main body 12 and
fixed. Therefore, the wafer retainer 121 is completely fitted in
the semiconductor wafers 120.
[0163] Specifically, the peripheries of the semiconductor wafers
120 are individually fitted in the fitting grooves 124A of the
engaging pieces 124 to guide the peripheries of the semiconductor
wafers 120 to the bottom portions of the fitting grooves 124A. At
this point, when a marginal portion of the semiconductor wafer 120
is fitted in the second-stage groove, the second-stage groove
securely supports the semiconductor wafer 120 while grasping the
marginal portion of the semiconductor wafer 120 to come into
contact with the semiconductor wafer 120 in the broad area. The
engaging piece 124 is supported by the elastic support plate 123
and the connecting support plate 125.
[0164] The leading-end portion of the elastic support plate 123
elastically supports the outside end of the engaging piece 124
while the base-end portion of the elastic support plate 123 is
supported by the base-end support portion 122 fixed to the backside
of the lid unit 127. The both-side end portions of the connecting
support plate 125 elastically support the inside end of the
engaging piece 124 while the central portion of the connecting
support plate 125 is supported by the support rib 126.
[0165] The support convex strip 131 bent in the bow shape supports
the engaging piece 124 while absorbing the deformation of the lid
unit 127. Therefore, the engaging pieces 124 support the
semiconductor wafers 120 with the even forces.
[0166] In each of the engaging pieces 124, the inside end is
elastically supported by the relatively strong force, and the
outside end is elastically supported by the relatively weak force.
At this point, the engaging piece 124 is in contact with the
semiconductor wafer 120 while the bottom portion of the fitting
groove 124A is arranged along the tangential direction of the
circumference of the semiconductor wafer 120, and the force
pressing the semiconductor wafer 120 is equalized as a whole by
automatically adjusting the elastic forces of the two engaging
pieces 124 so as to become equal to each other. Therefore, the
semiconductor wafers 120 are stably supported.
[0167] As with the first embodiment, the rotating torque of the
latch key is transmitted to the latch and converted into the
push-out force of the latch member 42. Then, the latch member 42
engages the container main body 12 to convert the push-out force
into the force pressing the lid unit 127 against the container main
body 12 and the force pressing the wafer retainer 121 against the
semiconductor wafers 120. The force pushed back from the
semiconductor wafers 120 returns to the lid unit 127. Therefore,
even if the container main body 12 is not fixed, the lid unit 127
can be attached and detached without shifting the container main
body 12 by the force generated when the latch key is rotated.
[0168] When the vibration is applied to the thin-plate supporting
container in conveying the thin-plate supporting container, the
semiconductor wafers 120 are also vibrated. Further, the engaging
pieces 124 are also vibrated according to the vibration of the
semiconductor wafers 120.
[0169] For the gentle vibration, since amplitude of the engaging
piece 124 is small, the contact point between the semiconductor
wafer 120 and the engaging piece 124 is located outside (for
example, near the contact point A in FIG. 42), and the elastic
support plate 123 is mainly deformed to support the semiconductor
wafer 120 with the weak elastic force.
[0170] For the violent vibration, although the amplitude of the
engaging piece 124 becomes large, the contact point between the
semiconductor wafer 120 and the engaging piece 124 is moved toward
the inside (for example, near the contact point B in FIG. 42) as
the amplitude of the engaging piece 124 is increased. The force
which is applied to the connecting support plate 125 from the
elastic support plate 123 is increased according to the amount of
movement, and the elastic force is increased. When the
semiconductor wafer 120 is largely vibrated, the engaging pieces
124 push back the semiconductor wafer 120 with the strong elastic
force to suppress the vibration of the semiconductor wafer 120.
Therefore, the force supporting the semiconductor wafer 120 is
automatically changed according to a magnitude of the vibration to
securely support the semiconductor wafer 120.
[0171] In the above-described vibration absorbing mode, the
engaging pieces 124 support the semiconductor wafers 120 up to the
amount of displacement of about 0.5 mm. Further, the engaging
pieces 124 absorb the position shifts of the semiconductor wafers
120 to securely support the semiconductor wafers 120 up to the
amount of displacement of 1.5 mm (2.5 mm at the maximum depending
on design), and the engaging pieces 124 absorb the vibration and
shock from the outside by the elastic displacement up to the amount
of displacement of 1.5 mm (2.5 mm at the maximum depending on
design). For the large shock and the like, in addition to the
structural shock absorbing function, the shock is absorbed at the
first stage in which the engaging piece 124 is elastically
displaced up to the amount of displacement of about 1.5 mm (2.5 mm
at the maximum depending on the design). When the elastic
displacement exceeds 1.5 mm (2.5 mm at the maximum depending on the
design), the shock is absorbed at the second stage in which the
spring resistance force is rapidly increased by the characteristics
previously set to the elastic support plate 93 or the contact with
the backside of the lid units 14 and 15.
[0172] As a result, all the semiconductor wafers 120 are supported
by the even forces, the vibrations of the semiconductor wafers 120
can be suppressed to the minimum against the outside vibration, and
the semiconductor wafers 120 can be prevented from rotating.
[0173] Further, as with the first embodiment, the spring resistance
force can be prevented from rapidly increasing to provide the
thin-plate supporting container which is excellent for the
vibration-resistant performance and shock-resistant performance,
and the automatization of the attachment and detachment of the
manufacturing line lid unit 15 can be easily realized.
MODIFICATION EXAMPLES
[0174] (1) In the first and second embodiments, the 300 mm-diameter
semiconductor wafer is described as an example. However, even if
the semiconductor wafer has the different diameter, the invention
can be applied. In this case, the maximum amounts of the wafer
retainer 91 and the like are set in the range of {fraction (1/200)}
to {fraction (1/120)} of the diameter of the semiconductor wafer.
The same operations and effects as in the first and second
embodiments can be obtained even in this case.
[0175] (2) In the first embodiment, the wafer retainer 91 includes
the base-end support portion 92, the elastic support plate 93, and
the engaging piece 94. However, as shown in FIGS. 26 to 28, it is
possible that the wafer retainer includes a base-end support
portion 110, an elastic support plate 111, and an engaging piece
112. The elastic support plate 111 supports one end of the base-end
support portion 110 while the base-end portion of the elastic
support plate 11 is fixed to the base-end support portion 110. The
elastic support plate 111 extends from the other end of the
engaging piece 112 to the lower surface of the manufacturing line
lid unit 15. The engaging piece 112 includes a slope 112A and an
engaging piece 112B, and the slope 112A and the engaging piece 112B
substantially have the same functions as the slope 96A and the
engaging piece 96B. Each three of support pawls 113 are alternately
arranged while being opposite one another. The number of support
pawls 113 is set as necessary.
[0176] In this configuration, the same operations and effects as in
the first and second embodiments can also be obtained.
[0177] (3) In FIGS. 20 and 21, the wafer retainer 91 has the
cantilever structure. However, as shown in FIGS. 29 and 30, it is
possible that the wafer retainer has a structure in which the both
ends of the wafer retainer are supported. In the wafer retainer
shown in FIGS. 29 and 30, the elastic support plate is attached
between and on both side of the engaging pieces, and the elastic
support plate located between the engaging pieces supports the
engaging pieces while floating slightly from the lower surface of
the manufacturing line lid unit 15 by a gap S.
[0178] Since the elastic support plate located between the engaging
pieces supports the engaging pieces while floating slightly from
the setting surface, usually the thin plates are supported with the
relatively weak force. When the large shock is applied from the
outside like the case in which the thin-plate supporting container
falls down by mistake, the gap S is eliminated and the elastic
support plate located between the engaging pieces engages the
support surface to strongly support the engaging pieces. Therefore,
the thin plates are protected from the violent shock.
[0179] (4) In the first embodiment, the semiconductor wafers are
supported by the support pawls 97. However, it is possible that the
semiconductor wafers are supported by blocks. As shown in FIGS. 31
and 32, two blocks 115 are alternately arranged while facing each
other in the same way as for the first embodiment. That is, while
each four sets of two blocks 115 facing each other are arranged at
constant intervals, the blocks 115 are alternately arranged.
Further, in a set of two blocks 115, engaging surfaces 115A are set
to 4.degree. and 20.degree. with respect to the vertical line
respectively, and the engaging surface 115A which the semiconductor
wafer engages is set to 4.degree.. Therefore, the circumference of
the semiconductor wafer is sandwiched and held at the angle of
4.degree. on one side (8.degree. on both sides), so that the
semiconductor wafer can be securely supported with no shift.
[0180] In this case, it is also possible that the blocks are
provided in the manner shown in FIGS. 33 and 34. The blocks shown
in FIGS. 33 and 34 substantially have the same configuration as for
the support pawls shown in FIGS. 29 and 30, and the same operations
and effects can be obtained.
[0181] (5) In the first embodiment, the lid unit for a thin plate
supporting container is used in the manufacturing line. However,
the lid unit for a thin plate supporting container can also be used
in the storage and the transport. In this case, the same operations
and effects as in the first embodiment can also be obtained.
[0182] (6) In the first embodiment, the two simplified detaching
mechanisms 32 are provided in the manufacturing line lid unit 15.
However, according to the specification and standard, it is also
possible that one simplified detaching mechanism 32 or at least
three simplified detaching mechanisms 32 are provided in the
manufacturing line lid unit 15.
[0183] (7) In the first embodiment, the lid unit for a thin plate
supporting container is applied to the storage container of the
semiconductor wafers. However, the invention is not limited to the
storage container of the semiconductor wafers, but the invention
can be applied to the storage container of other thin plates. In
this case, the same operations and effects as in the first
embodiment can also be obtained.
[0184] (8) In the first embodiment and the modification example,
the wafer retainer which is of the thin-plate retainer for
supporting the thin plates stored in the container main body is
applied to the thin-plate supporting container 11 of the first
embodiment. However, the invention is not limited to the thin-plate
supporting container 11 of the first embodiment, but the invention
can be applied to the thin-plate supporting containers having other
structures. In this case, the same operations and effects as in the
first embodiment can also be obtained.
[0185] (9) In the first embodiment, the lid unit holder 100 is
applied to the thin-plate supporting container 11. However, the
invention is not limited to the thin-plate supporting container 11
of the first embodiment, but the invention can be applied to the
thin-plate supporting containers having other structures. In this
case, the same operations and effects as in the first embodiment
can also be obtained.
[0186] (10) In the second embodiment, the two engaging pieces 124
are provided in the wafer retainer 121. However, it is also
possible to provide at least three engaging pieces 124. In the case
where at least three engaging pieces 124 are provided, the
connecting support plate 125 and the support rib 126 are provided
between the engaging pieces 124. In this case, the same operations
and effects as in the second embodiment can also be obtained.
[0187] (11) In the second embodiment, the horizontal plate 125C is
supported by the support convex strip 131. However, it is also
possible that a support projection is provided in the central
portion of the horizontal plate 125C. In the case where the support
projection is provided, it is not necessary to provide the support
convex strip 131. The support projection engages the support convex
strip 131 to support the horizontal plate 125C when the support
convex strip 131 is provided, and the support projection engages
the backside of the lid unit 127 to support the horizontal plate
125C when the support convex strip 131 is not provided.
[0188] When the support convex strip 131 is not provided, the
height of the support projection is set at the central portion of
the horizontal plate 125C so that the central portion is higher
than the both end portions as in the second embodiment. When the
support convex strip 131 is provided, the total heights of the
support projection at the central portion of the horizontal plate
125C and the support convex strip 131 are set so that the central
portion is higher than the both end portions. In this case, the
same operations and effects as in the second embodiment can also be
obtained.
[0189] (12) In the second embodiment, the fitting groove 124A of
the engaging piece 124 is formed in a V-shape. However, like the
engaging piece 94 of the first embodiment, it is also possible to
include the alternately arranged support pieces. That is, like the
engaging piece 94 of the first embodiment, it is possible that the
engaging piece 124 of the second embodiment includes the two blocks
96 and the alternately arranged support pawls 97 (support pieces).
Therefore, the alternately arranged support pieces alternately
engage the circumference of the semiconductor wafer 120 to securely
support the semiconductor wafer 120. As a result, while the
vibration of the semiconductor wafer 120 can be suppressed to the
minimum against the outside vibration, the semiconductor wafer 120
can be securely prevented from rotating.
[0190] (13) The configuration in which the wafer retainer 121
supports the engaging piece 124 is not limited to the second
embodiment, but other configurations can be adopted as long as the
engaging pieces 124 located in the central portion can be arranged
while arising toward the semiconductor wafers 120 further than the
engaging pieces 124 located on the both-side portions.
[0191] For example, it is possible that the elastic support plate
123 is formed such that the engaging pieces 124 located in the
central portion arises toward the semiconductor wafers 120 further
than the engaging pieces 124 located on the both-side portions. It
is also possible that one of or both the elastic support plate 123
and the connecting support plate 125 are formed such that the
engaging pieces 124 located in the central portion arises toward
the semiconductor wafers 120 further than the engaging pieces 124
located on the both-side portions.
[0192] (14) In the second embodiment, the connecting support plate
125 is supported by the support rib 126. However, it is also
possible that the connecting support plate 125 is supported by a
projection. Specifically, as shown in FIG. 45, it is possible that
the connecting support plate 125 is supported by a fitting
projection 142. The fitting projection is fitted in a fitting hole
141 made in the connecting support plate 125, which allows the
fitting projection 142 to prevent the connecting support plate 125
from shifting along the backside of the lid unit to permit the
movement of the connecting support plate 125 in the direction
perpendicular to the backside of the lid unit. In this case, the
same operations and effects as in the second embodiment can also be
obtained.
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