U.S. patent application number 10/803805 was filed with the patent office on 2005-09-22 for replacing chamber components in a vacuum environment.
Invention is credited to Mosden, Aelan.
Application Number | 20050205209 10/803805 |
Document ID | / |
Family ID | 34984939 |
Filed Date | 2005-09-22 |
United States Patent
Application |
20050205209 |
Kind Code |
A1 |
Mosden, Aelan |
September 22, 2005 |
Replacing chamber components in a vacuum environment
Abstract
An apparatus and method are provided for replacing parts in a
vacuum chamber without venting the vacuum. A transfer system is
used to transfer a removably mounted component from a processing
module that is attached to a transfer system and replacing the
component with another component from a maintenance system that is
connected through an isolation assembly to a transfer module. The
maintenance system may include a supply of replacement parts and
receive expended or otherwise serviceable items that are to be
replaced. These serviceable items may include chamber component
that has a tendency to degrade during processes being performed in
the processing module. Typically, such items are etched or eroded
away or accumulate coatings, requiring occasional removal and
replacement. Focus rings, chamber shields, dark space shields,
insulators, deposition baffles and adaptors are some of the items
requiring periodic replacement. Such items are installed in the
process module in a way that permits their removal and replacement
by a transfer arm or other transfer mechanism of the transfer
system or otherwise by robotic mechanisms. The processing module
may be an etching, deposition, ALD, patterning, developing,
metrology, thermal processing, cleaning or other module used in a
vacuum process, particularly for processing of semiconductor
wafers.
Inventors: |
Mosden, Aelan;
(Poughkeepsie, NY) |
Correspondence
Address: |
WOOD, HERRON & EVANS, LLP (TOKYO ELECTRON)
2700 CAREW TOWER
441 VINE STREET
CINCINNATI
OH
45202
US
|
Family ID: |
34984939 |
Appl. No.: |
10/803805 |
Filed: |
March 18, 2004 |
Current U.S.
Class: |
156/345.31 ;
118/719; 156/915 |
Current CPC
Class: |
H01L 21/67069 20130101;
H01L 21/67748 20130101 |
Class at
Publication: |
156/345.31 ;
118/719; 156/915 |
International
Class: |
C23F 001/00 |
Claims
What is claimed is:
1. A processing system having a vacuum environment therein and
comprising: a processing module having mounting structure therein
configured to removably mount a maintenance item in the vacuum
environment in the processing module and to present the maintenance
item for pick up by a wafer transfer mechanism; the processing
module having a maintenance item removably mounted on the mounting
structure; a transfer system having a transfer mechanism therein
configured to transfer a maintenance item within the vacuum
environment between the mounting structure in the processing module
and the transfer system without exposing the processing module to
an outside environment.
2. The processing system as claimed in claim 1, further comprising:
an isolation assembly coupled between the processing module and the
transfer system, the isolation assembly comprising a gate valve
assembly.
3. The processing system as claimed in claim 1, further comprising:
a maintenance system comprising a storage assembly storing at least
one maintenance item and an exchange system for transferring a
maintenance item between the transfer system and the maintenance
system without exposing the vacuum environment to an outside
environment.
4. The processing system as claimed in claim 3, further comprising:
an isolation assembly coupled between the maintenance system and
the transfer system, the isolation assembly comprising a gate valve
assembly.
5. The processing system as claimed in claim 3, wherein the
exchange system comprises a drive system, a transfer arm coupled to
the drive system, and an end effector coupled to the transfer arm,
the drive system being used to move the transfer arm and the end
effector in at least one direction in order to transfer the
removably mounted maintenance item between the maintenance system
and the processing module.
6. The processing system as claimed in claim 3, wherein the
exchange system comprises a drive system, a transfer arm coupled to
the drive system, and an end effector coupled to the transfer arm,
the drive system being used to move the transfer arm and the end
effector to transfer the substrate between a transfer plate in the
transfer system and a substrate holder in the processing
module.
7. The processing system as claimed in claim 3, wherein the
exchange system comprises a drive system, a transfer arm coupled to
the drive system, and an end effector coupled to the transfer arm,
the drive system being used to move the transfer arm and the end
effector to transfer the removably mounted maintenance item between
the transfer system and a storage assembly in the maintenance
system.
8. The processing system as claimed in claim 1, wherein the
transfer system comprises a transfer plate and a transfer assembly
for moving the transfer plate from the one position to another
position.
9. The processing system as claimed in claim 1, wherein the
maintenance item comprises at least one of a ring, a shield, an
insulator, an adapter, a baffle, and a plate.
10. The processing system as claimed in claim 1, further
comprising: a controller coupled to the processing module and the
transfer system, the controller being programmed to control the
processing module and the transfer system to replace the
maintenance item on the mounting structure without exposing the
processing module to an outside environment.
11. The processing system of claim 1 wherein: the processing module
is an etching module having an upwardly facing wafer support in a
vacuum environment therein; the maintenance item is an annular
member in a mounting position in the etching module surrounding a
wafer support area of the wafer support where the maintenance item
is prone to being etched by an etching process being performed on a
wafer in the etching module; and the maintenance item is mounted in
its mounting position in the etching module so as to be removable
from the processing module in part by a lifting of the maintenance
item from the mounting position.
12. The processing system of claim 1 wherein: the processing module
includes a deposition module having an upwardly facing wafer
support in a vacuum environment therein; the maintenance item is an
annular member in a mounting position in the deposition module
surrounding a wafer support area of the wafer support where the
maintenance item is prone to collecting deposits of material
thereon when a deposition process is performed on a wafer on the
support in the deposition module; and the maintenance item is
mounted in its mounting position in the deposition module so as to
be removable from the processing module in part by a lifting of the
maintenance item from the mounting position.
13. The processing system of claim 1 wherein: the mounting
structure is configured to move the maintenance item into position
for pick up by the transfer mechanism.
14. The processing system of claim 13 wherein: the maintenance item
is an annular ring configured to surround a wafer on a wafer
support; the mounting structure includes a set of lift pins
operable to lift the ring into position for pick up by a wafer
transfer arm.
15. The processing system of claim 13 wherein: the maintenance item
is supported within the processing module from the top of the
processing module; the mounting structure includes a set of
elements for releaseably holding the maintenance item and operable
to lower the maintenance item into position for pick up by a wafer
transfer arm.
16. The processing system of claim 13 wherein: the transfer
mechanism includes a wafer transfer arm and a separate transfer arm
configured to pick up a maintenance item.
17. The processing system as claimed in claim 1, wherein the
processing module comprises at least one of an ALD module, a
deposition module, a coating module, a patterning module, a
developing module, a metrology module, a thermal processing module,
and a cleaning module.
18. A method of operating a processing system, the method
comprising: coupling a processing module to a transfer system
having a wafer transfer arm therein, the processing module having a
first maintenance item removably mounted therein; presenting the
first maintenance item within the processing module for pick up by
a transfer arm of the transfer system; and picking up the
maintenance item with the wafer transfer arm and transferring the
first maintenance item from the processing module to the transfer
system without exposing the processing module to an outside
environment.
19. The method of claim 18 wherein: the maintenance item is an
annular member in a mounting position in the processing module that
surrounds a wafer support area on an upwardly facing wafer support
where the maintenance item is prone to being etched or coated by a
process performed on the wafer in the processing module; and the
maintenance item is removable from the processing module in part by
lifting the maintenance item from the mounting position.
20. The method of operating a processing system as claimed in claim
18, the method further comprising: coupling a maintenance system to
the transfer system, the maintenance system having a second
maintenance item therein; transferring the second maintenance item
from the maintenance system to the transfer system; transferring
the second maintenance item from the transfer system to the
processing module without exposing the processing module to an
outside environment; and removably mounting the second maintenance
to the module.
21. The method of operating a processing system as claimed in claim
18, the method further comprising: transferring the first
maintenance item to a transfer plate; and moving the transfer plate
from a first position to a second position.
22. The method of operating a processing system as claimed in claim
18, the method further comprising: transferring the second
maintenance item to a transfer plate; and moving the transfer plate
from a second position to a first position.
23. The method of operating a processing system as claimed in claim
18, the method further comprising: transferring the first
maintenance item to a storage assembly in a maintenance system
without exposing the processing module to an outside
environment.
24. The method of operating a processing system as claimed in claim
20, the method further comprising: transferring a substrate from
the transfer system to the processing module without exposing the
processing module to an outside environment; processing the
substrate in the processing module; and transferring the processed
substrate from the processing module to the transfer system.
25. The method of operating a processing system as claimed in claim
18, the method further comprising: monitoring the first maintenance
item without exposing the processing module to an outside
environment; determining when to replace the first etching
maintenance item; and performing the detaching and the transferring
in response to the determination.
26. The method of operating a processing system as claimed in claim
18, the method further comprising: monitoring a processing recipe
for the processing module; and determining when to exchange the
first maintenance item with a second maintenance item, wherein the
process recipe specifies a different maintenance item.
27. The method of claim 18 further comprising: coupling a
processing module having a first maintenance item removably mounted
therein to a first exchange system; coupling the first exchange
system to a transfer system; detaching the first maintenance item
from the processing module; and transferring the first maintenance
item from the processing module to the transfer system without
exposing the processing module to an outside environment.
28. The method of operating a processing system as claimed in claim
27, the method further comprising: coupling a maintenance system to
a second exchange system, the maintenance system comprising a
second etching maintenance item, wherein the second etching
maintenance item can be removably mounted in the etching module;
coupling the second exchange system to a second position in the
transfer system; transferring the second etching maintenance item
from the maintenance system to the transfer system, wherein the
second exchange system comprises means for transferring the
maintenance item between the maintenance system and the transfer
system without exposing the etching module to an outside
environment; transferring the second etching maintenance item from
the transfer system to the processing module, wherein the first
exchange system comprises means for transferring the second etching
maintenance item between the transfer system and the processing
module without exposing the etching module to an outside
environment; and removably coupling the second etching maintenance
item to the etching module.
29. A method of operating a processing system comprising: coupling
a processing module having a first maintenance item removably
mounted therein to an exchange system using a first isolation
assembly; coupling the exchange system to a maintenance system
using a second isolation assembly; vertically moving the
maintenance item into position within the processing module for
pick up of the first maintenance item from the processing module by
the wafer transfer arm; transferring the first maintenance item
from the processing module to the maintenance system through the
first and second isolation assemblies without exposing the
processing module and the first maintenance item to an outside
environment; transferring a second maintenance item from the
maintenance system to the processing module through the first and
second isolation assemblies without exposing the processing module
and the second maintenance item to an outside environment; and
removably mounting the second maintenance item to the processing
module.
Description
FIELD OF THE INVENTION
[0001] The invention relates to a system and method for replacing
chamber components, and more particularly to a system and method
for replacing chamber components in a vacuum environment.
BACKGROUND OF THE INVENTION
[0002] It is common in the routine maintenance of a vacuum chamber
to require venting of a vacuum chamber in order to replace parts,
which have been consumed or damaged in the normal operation of the
chamber. Venting of these chambers typically has a negative effect
on the operation of the vacuum chamber and causes the owners time
and money to return the system to a normal state. If other methods
could be used to perform these activities it would be advantageous
to system owners.
[0003] One solution to this problem was addressed to a degree by
Hurwitt in U.S. Pat. No. 5,620,578, owned by applicant's assignee.
Hurwitt proposes replacing a fixture or such other device that
accumulates an undesired coating in a deposition module of a
cluster tool by providing a service module having replacement
devices therein and using a transfer arm in the transfer module of
the tool to exchange the coated device in the deposition module
with one of the replacement devices within the vacuum environment
of the cluster tool. The example shown by Hurwitt envisions some
releaseable mounting mechanism, such as a pin and slot structure,
which requires some manipulation with actions by the transfer arm
to remove the part being replaced and to install the
replacement.
[0004] With the trend toward submicron features on semiconductor
wafers being processed, emphasis is placed on avoiding particle
generation. Manipulating parts with a transfer arm to lock and
unlock them can produce unacceptable contamination. Further,
modification of the wafer handling components of a processing tool,
such as a transfer arm mechanism or wafer handler, cannot as a
practical matter be required of the owner of the tool to
accommodate the service of a module that is but one of many of
which the tool owner may purchase. This limits the actions that a
transfer arm can execute when removing and reattaching a part.
[0005] Accordingly, there remains a need to make the replacement of
parts in the vacuum environment of a processing system more
practical.
SUMMARY OF THE INVENTION
[0006] The invention provides an apparatus and method for replacing
parts in a vacuum chamber of a substrate processing system without
venting the vacuum. Such processing systems are those of the types
used for processing substrates such as semiconductor wafers. These
processing systems typically include one or more processing
modules, for example, deposition, etch, cleaning, heat treating or
other processing modules, and a transfer system having transfer
ports at a number of locations that communicate with the processing
modules, with loadlocks and other loading devices, and to other
systems. The transfer system transfers substrates among and through
the ports and the modules and systems connected to them.
[0007] In accordance with the invention, the transfer system of the
processing system is used to transfer parts or components of the
processing system to and from the processing module for service or
replacement. The parts are moved without excessive motions or
special actions being performed by the transfer arm and without the
kind of manipulation of mounting structure and fastening elements
that can cause particle generation that can contaminate the
chamber. Rather, the parts to be replaced are configured to be
picked up by the normal motions of a transfer arm that are used in
the handling of wafers to be processed, and actuators necessary to
release and present the parts in a condition to be picked up by the
transfer arm are provided in the process module. In many
embodiments, a generic transfer module and transfer mechanism, such
as a standard fork type end effector, can be used. In other
embodiments, a modified end effector can be used, or a transfer arm
or transfer module with minimal modification. In alternative
embodiments, a separate transfer arm may be used for maintenance
items that require a different end effector than is on the wafer
transfer arm or the transfer arm that is configured to transfer
wafers and other maintenance items. In addition, more than one
transfer arm can be used to increase throughput.
[0008] In one described embodiment of the invention, a lift pin
system is provided to raise an upwardly facing focus ring or
peripheral deposition shield from around the perimeter of a wafer
on a wafer support in an etching module or a deposition module. In
another embodiment, actuators lower and release a deposition shield
in a deposition module from the sputtering cathode assembly. In
both cases, the part is moved into a position where it can be
engaged at a peripheral edge configured for pick up by a wafer
transfer arm. The part release features are provided without
requiring mechanical or structural modification of the tool beyond
the modules that are being provided.
[0009] The parts being replaced are typically those that are
consumed or coated during the operation of the processing module
such that they may need service or replacement. Those parts that
routinely must be replaced particularly benefit from the invention.
A maintenance system or maintenance module may be connected to the
processing system to supply replacement parts or receive parts that
are to be replaced, with the transfer system being used to move the
parts between the maintenance system and the processing module.
[0010] The component parts and other items that are replaced
according to the invention are referred to herein as maintenance
items. These items may include chamber components that have a
tendency to degrade as processes are performed in the processing
module. Typically, such items are etched or eroded away or
accumulate coatings, requiring their occasional removal and
replacement. Focus rings, chamber shields, dark space shields,
insulators, deposition baffles and adaptors are some of the items
requiring periodic replacement.
[0011] The items that are to be replaced by the invention are
mounted in the process module on structure that permits their
removal and replacement by a transfer arm or other transfer
mechanism of the transfer system. Port sizes on the processing
module and maintenance module are large enough to allow the
maintenance items to be passed through them.
[0012] The invention is particularly advantageous for use in
replacing annular focus rings and perimeter shields that surround
upwardly facing wafer supports in etching systems, where these
annular members tend to be eroded by the etching process, requiring
periodic replacement. In such systems, these annular maintenance
items can be removably mounted on or around a wafer holder, being
held in position only by gravity, where they can be picked up by a
wafer transfer arm adapted for that purpose. Lift pins or other
delivery or release mechanisms may be provided to facilitate the
removable mounting of the maintenance items by a transfer arm.
Shields in deposition chambers, where they tend to accumulate
deposits of coating material, can also be easily replaced in this
manner.
[0013] In accordance with embodiments of the invention, a
processing system is provided with a transfer system capable of
transferring a maintenance item to and from a processing module
without exposing the processing module to an outside environment.
The transfer system may also be capable of transferring a substrate
to and from the processing module, or may be separate from a
transfer module of the processing system provided for transferring
substrates. An isolation assembly can be coupled between the
processing module and the transfer system that is configured for
the maintenance item to pass through. A maintenance system may be
coupled to the transfer system structure to store maintenance items
to be transferred to, or after being transferred from, the
processing module.
[0014] The transfer system may have a transfer arm, and an end
effector, and a drive system to move the transfer arm and the end
effector so as to pick up a removably mounted maintenance item and
transfer it to and from a transfer plate or other support in the
transfer system, a substrate holder or item mounting structure in
the processing module, or a storage assembly in the maintenance
system.
[0015] A processing system controller that controls the processing
module and transfer system may be configured to control the
maintenance system and transfer system related thereto.
[0016] The processing modules that have maintenance items that can
be replaced using the invention include etching and deposition
modules, ALD modules, patterning and developing modules, metrology
and thermal processing modules, cleaning and other modules used in
vacuum processing systems, particularly for processing of
semiconductor wafers.
[0017] The replacement process according to certain embodiments of
the invention includes removing the maintenance item that is to be
replaced from its mounting structure in the processing module with
the transfer arm or with other mechanisms provided for that
purpose. Then the removed item is transferred from the processing
module to the transfer system.
BRIEF DESCRIPTION OF THE DRAWINGS
[0018] FIG. 1 illustrates an exemplary block diagram of a
processing system according to an embodiment of the invention.
[0019] FIG. 1A illustrates one embodiment of a processing system of
FIG. 1 in the form of an etch module showing the positioning of a
focus ring for replacement by a transfer arm.
[0020] FIG. 1B illustrates another embodiment of a processing
system of FIG. 1 in the form of a sputter deposition module showing
the positioning of a deposition shield for replacement by the
transfer arm.
[0021] FIG. 2 illustrates an exemplary block diagram of a transfer
system and a processing module according to an embodiment of the
invention.
[0022] FIG. 3 illustrates an exemplary block diagram of a transfer
system and a maintenance system according to an embodiment of the
invention.
[0023] FIG. 4A illustrates an exemplary block diagram of a
processing system according to an embodiment of the invention.
[0024] FIG. 4B illustrates an exemplary block diagram of a transfer
system, an exchange system, and a processing system according to an
embodiment of the invention.
[0025] FIG. 5A illustrates an exemplary block diagram of a
processing system according to an embodiment of the invention.
[0026] FIG. 5B illustrates an exemplary block diagram of a transfer
system, an exchange system, and a maintenance system according to
an embodiment of the invention.
[0027] FIG. 6A illustrates an exemplary block diagram of a
processing system according to an embodiment of the invention.
[0028] FIG. 6B illustrates an exemplary block diagram of a transfer
system, a processing module, an exchange system, and a maintenance
system according to an embodiment of the invention.
[0029] FIG. 7A illustrates an exemplary block diagram of a
processing system according to an embodiment of the invention.
[0030] FIG. 7B illustrates an exemplary block diagram of a
processing module and a maintenance system according to an
embodiment of the invention.
[0031] FIG. 8 illustrates a flow diagram of a method of operating a
processing system in accordance with an embodiment of the
invention.
[0032] FIG. 9 illustrates a flow diagram for another method of
operating a processing system in accordance with an embodiment of
the invention.
DETAILED DESCRIPTION OF SEVERAL EMBODIMENTS
[0033] In semiconductor processing systems, a number of processes
are executed at reduced pressures. In order to reduce the
maintenance time for processing modules, a maintenance system has
been developed to replace consumable parts and other maintenance
items without venting the process chamber/module to the atmosphere.
Such maintenance items include consumable chamber components such
as sputtering targets and other electrodes as well as members
within a processing chamber such as clips, latches, shields, focus
rings and structures having surfaces that can be eroded by etching
or damaged by plasmas, heat, chemical reactions or other causes.
Such maintenance items can also include chamber components that are
susceptible to accumulations of deposits, such as shields,
structural clamps and structural members, sensors, electrodes,
clamps and latches, columnators, and other components exposed to
deposition material, reactive gases, plasmas or other processing
elements.
[0034] FIG. 1 illustrates an exemplary block diagram of a
processing system according to an embodiment of the invention. In
the illustrated embodiment, a processing system 100 for processing
a substrate is shown. The processing system 100 includes a transfer
system 140, a processing module 130 coupled to the transfer system
140, and a maintenance system 110 coupled to the transfer system
140. The transfer system 140 is coupled to the maintenance system
110 in order to transfer maintenance items into and out of the
maintenance system 110. The transfer system 140 is coupled to the
processing module 130 in order to transfer maintenance items into
and out of the processing module 130. In addition, the processing
module 130 can exchange substrates with the transfer system 140.
For example, the transfer system 140 permits the transfer of
substrates and/or maintenance items to and from processing module
130. The processing module 130 can be the processing module of an
etch system, an ALD system, a deposition system, a coating system,
a patterning system, a developing system, a metrology system, a
thermal processing system, a cleaning system, and combinations
thereof.
[0035] Processing system 100 also comprises an isolation assembly
10 that can be utilized to couple the transfer system 140 to the
processing module 130 and to isolate the transfer system 140 from
the processing module 130. For instance, the isolation assembly 10
can comprise at least one of a thermal insulation assembly to
provide thermal isolation, and a gate valve assembly to provide
vacuum isolation. The isolation assembly has an opening between the
processing module 130 and the transfer system 140 that is large
enough to allow maintenance items to pass through. The isolation
assembly 10 can be used to transfer maintenance items into and out
of the processing module 130 either when the processing module 130
is coupled to the transfer system 140 or when the processing module
130 is not coupled to the transfer system 140.
[0036] In addition, the isolation assembly 10 can be used to
transfer substrates into and out of the processing module 130 both
when the processing module 130 is coupled to the transfer system
140 and when the processing module 130 is not coupled to the
transfer system 140. For example, in one embodiment, gate valve
assembly 10 can comprise two gate valves 10A and 10B, one attached
to the processing module 130, and one attached to the transfer
system 140, respectively. Alternately, a different number of gate
valves can be used. The isolation assembly 10 can be the same gate
or other port assembly that is used to transfer substrates to and
from the processing module 110 for processing, or it may be a
separate isolation assembly dedicated to the transfer of
maintenance items.
[0037] Processing system 100 also comprises an isolation assembly
11 that can be utilized to couple the transfer system 140 to the
maintenance system 110 and to isolate the transfer system 140 from
the maintenance system 110. For instance, the isolation assembly 11
can comprise at least one of a thermal insulation assembly to
provide thermal isolation, and a gate valve assembly to provide
vacuum isolation. The isolation assembly opening is large enough to
allow maintenance items to pass through.
[0038] The isolation assembly 11 can be used to transfer
maintenance items into and out of the maintenance system 110 both
when the maintenance system 110 is coupled to the transfer system
140 and when the maintenance system 110 is not coupled to the
transfer system 140. In one embodiment, gate valve assembly 11 can
comprise two gate valves 11A and 11B, one gate valve 11B is
attached to the maintenance system 110, and one gate valve 11A is
attached to the transfer system 140. Alternately, a different
number of gate valves can be used. The gate valve openings can be
large enough to allow substrates and/or maintenance items to pass
through.
[0039] In one embodiment, the maintenance system 110 can comprise a
storage subsystem (not shown) that can be used to store maintenance
items such as consumable parts or chamber components that might
need to be replaced, serviced or reconditioned. Maintenance system
110 can be removably coupled to transfer system 140. Alternately,
the maintenance system 110 can be fixedly coupled to the transfer
system 140. For example, the gate valve(s) between the transfer
system 140 and the maintenance system 110 can be opened; a
maintenance item can be transferred between the transfer system and
the maintenance system; the gate valve(s) between the transfer
system 140 and the maintenance system 110 can be closed; and since
the maintenance system and transfer system remain in a vacuum
(evacuated) state, an isolated state can be preserved in the
processing system. In addition, the gate valve(s) between the
transfer system 140 and the processing module 130 can be opened; a
maintenance item and/or substrate can be transferred between the
transfer system and the processing module; the gate valve(s)
between the transfer system 140 and the processing module 130 can
be closed; and since the maintenance system and transfer system
remain in a vacuum (evacuated) state an isolated state can be
preserved in the processing system.
[0040] In one embodiment, the gate valve 11B can be coupled to the
maintenance system 110 and can be used to load maintenance items
such as consumable parts. During processing, for example, the gate
valve(s) between the transfer system 140 and the maintenance system
110 can be closed; the maintenance system can be decoupled from the
transfer system; the gate valve 11B can be opened; a maintenance
item can be transferred into or out of the maintenance system; the
gate valve 11B can be can be closed; the maintenance system can be
evacuated; the maintenance item can be stored in the maintenance
system, and an isolated state can be preserved in the processing
system.
[0041] In an alternate embodiment, the maintenance system 110 can
comprise an additional opening (not shown) that can be used to load
maintenance items such as consumable parts, either through a
loadlock or otherwise from outside the vacuum environment or by
docking with a cassette or transfer module. For example, the
maintenance system 110 can merely be vented and opened into a
controlled atmospheric pressure environment to exchange used parts
with fresh ones. The maintenance system 110 can be removably
coupled to transfer system 140. Alternately, maintenance system 110
can be fixedly coupled to the transfer system 140. During
processing, for example, the gate valve(s) between the transfer
system 140 and the maintenance system 110 can be closed; the
additional opening (not shown) can be opened; a maintenance item
can be positioned in the maintenance system; the additional opening
(not shown) can be closed; the maintenance system can be evacuated;
the gate valve(s) between the transfer system 140 and the
maintenance system 110 can be opened; the maintenance item can be
stored in the maintenance system and/or moved from the maintenance
system to the transfer system, and an isolated state can be
preserved in the processing system. In one embodiment, one
maintenance system can be used for both new parts and used parts.
Alternately, one maintenance system can be used for new parts and
another maintenance system can be used for used parts.
[0042] In an alternate embodiment, maintenance system 110 can
comprise a cleaning sub-system (not shown) that can clean a
maintenance item and/or measuring subsystem for measuring a
maintenance item.
[0043] In addition, a controller 160 can be coupled to the
processing module 130, the maintenance system 110, and the transfer
system 140. For example, controller 160 can be used to control the
processing module 130, the maintenance system 110, the transfer
system 140, and gate valve assemblies (10 and 11). Alternately, the
controller 160 can be coupled to a controller (not shown) in the
processing module 130, a controller (not shown) in the maintenance
system 110, and a controller (not shown) in the transfer system
140. Also, the controller 160 can be coupled to a control element
(not shown) in a multi-element manufacturing system (not
shown).
[0044] FIG. 1A illustrates an embodiment of the system 100 of FIG.
1 wherein the processing module 130 is an etch module 130A having a
vacuum processing chamber 131 with a plasma source 133 in the upper
section 132 thereof with an upwardly facing wafer support 134 at
the bottom. The plasma source energizes a plasma in the chamber 131
for etching a wafer 135 on the wafer support 134. A focus ring 136
is provided on the wafer support 134 to shape the electric fields
so as to prevent an edge effect around the edge of the wafer 135
that undermines the etch uniformity. In the etching process, the
focus ring 136 undergoes some etching, which necessitates its
occasional replacement, making it a maintenance item in the context
of the present invention. The focus ring 136 has a wafer shaped
edge 137 that allows it to be easily handled by the wafer transfer
arm 194 of a transfer mechanism 198 within a transfer module or
transfer system 130. A set of lift pins 138 is provided in the
wafer support 134 to lift the focus ring 136, on command from the
controller 160, to present the focus ring 136 in position to be
easily picked up and replaced by motion of the transfer arm
194.
[0045] Similarly, as illustrated in FIG. 1B, an embodiment of the
system 100 of FIG. 1 is provided wherein the processing module 130
is a physical vapor deposition module 130B having a vacuum
processing chamber 141 with a sputtering target 142 and a plasma
source 143 in the upper section 132 thereof with an upwardly facing
wafer support 134 at the bottom. The plasma source 142 energizes a
high density plasma in the chamber 141 while a DC power source (not
shown) energizes the sputtering target 142 for producing coating
material for coating wafer 135 on the wafer support 134. A
deposition shield 146 is provided at the plasma source 143 to
protect a dielectric window 145 from deposition. In the deposition
process, the deposition shield 146 accumulates deposition material,
which necessitates its occasional replacement, making it a
maintenance item in the context of the present invention. The
deposition shield 146 has a wafer shaped edge 147 that allows it to
be easily handled by the transfer arm 194 of a transfer mechanism
198 within a transfer module or transfer system 130. A set of
lowering rods 148 is provided in the wafer support 134 to lower the
deposition shield 146, on command from the controller 160, to
present the deposition shield 146 in position to be easily picked
up and replaced by motion of the transfer arm 194. The lowering
rods are configured to release the shield 146 by making a partial
rotation.
[0046] FIG. 2 illustrates an exemplary block diagram of a transfer
system and a processing module according to an embodiment of the
invention. In the illustrated embodiment shown in FIG. 2, a
processing module 130 is shown coupled to a transfer system 140.
Alternately, a number of processing modules 130 can be coupled to a
transfer system 140. In addition, a number of transfer systems 140
can be coupled to a processing module 130.
[0047] The transfer system 140 includes a transfer assembly 180,
and transfer plate 184. The transfer assembly 180 can be used to
move the transfer plate 184 in at least one direction in the
transfer system 140. For example, the transfer plate 184 can be
moved from one chamber to another, from one system to another, or
from one position to another.
[0048] The transfer system 140 can also comprise an exchange system
190 for transferring substrates and/or maintenance items. Exchange
system 190 can comprise a drive system 192, a transfer arm 194, and
an end effector 196. The drive system 192 is used to move the
transfer arm 194 and end effector horizontally, vertically, and
rotationally in order to transfer substrates and/or maintenance
items between the transfer system 140 and the processing module
130. Several transfer arms 194 and end effectors 196 are shown in
FIG. 2 to illustrate some of the various positions for the transfer
arm 194 and end effector 196. In one embodiment, one transfer arm
194 and one end effector 196 are used. Alternately, two transfer
arms 194 and two end effectors 196 can be used to increase
throughput. For example, one end effector can be used to transfer
maintenance items and one end effector can be used to transfer
substrates.
[0049] The exchange system 190 can be used to transfer a
maintenance item 170A between the transfer plate 184 in the
transfer system and the substrate holder 134 in the processing
module. For example, the maintenance item 170A can be a ring, a
shield, an insulator, an adapter, a plate or some other component
that is removably mounted on or near the substrate holder. The
exchange system 190 can also be used to transfer a substrate 170B
between the transfer plate 184 in the transfer system and the
substrate holder 134 in the processing module. For example,
substrate 170B can be at least one of a production substrate, a
dummy substrate, a test substrate, and a test device.
[0050] The exchange system 190 can be used to transfer a
maintenance item 170C between the transfer plate 184 in the
transfer system and the upper assembly 132 in the processing
module. For example, maintenance item 170C can be a shield, an
insulator, an adapter, an electrode, an antenna, or some other
component of the processing chamber remote from the substrate
holder.
[0051] Maintenance items that can be most easily replaced without
breaking the vacuum of the system are those that are secured in
place in simple ways, particularly those that are merely set in
place and do not require complex fasteners or complicated securing
structure. Such simply secured items can thus be removed and
replaced with a transfer arm or otherwise robotically through the
isolation assemblies. Other items can be redesigned to facilitate
their easy removal and replacement with transfer arms.
[0052] FIG. 3 illustrates an exemplary block diagram of a transfer
system and a maintenance system according to an embodiment of the
invention. In the illustrated embodiment shown in FIG. 3, a
maintenance system 110 is shown coupled to a transfer system 140.
Alternately, a number of maintenance systems 110 can be coupled to
a transfer system 140. In addition, a number of transfer systems
140 can be coupled to a maintenance system 110.
[0053] Transfer system 140 can comprise a transfer assembly 180 and
transfer plate 184. The transfer assembly 180 can be used to move
the transfer plate in at least one direction in the transfer
system. For example, the transfer plate can be moved from one
chamber to another, from one system to another, or from one
position to another.
[0054] The transfer system 140 can also comprise an exchange system
190 for transferring substrates and/or maintenance items. The
exchange system 190 can comprise a drive system 192, a transfer arm
194, and an end effector 196. The drive system 192 is used to move
the transfer arm 194 and end effector horizontally, vertically, and
rotationally in order to transfer substrates and/or maintenance
items between the transfer system 140 and the maintenance system
110. Two transfer arms 194 and end effectors 196 are shown in FIG.
3 to illustrate some of the various positions for the transfer arm
194 and end effector 196. In one embodiment, one transfer arm 194
and one end effector 196 are used. Alternately, two transfer arms
194 and two end effectors 196 can be used to increase throughput.
For example, one end effector can be used to transfer a new
maintenance item and one end effector can be used to transfer a
used maintenance item.
[0055] The exchange system 190 can be used to transfer a
maintenance item 170A between the transfer plate 184 in the
transfer system and the storage assembly 112 in the maintenance
system. For example, maintenance item 170A can be at least one of a
ring, a shield, an insulator, an adapter, and a plate. Exchange
system 190 can also be used to transfer a substrate 170B between
the transfer plate 184 in the transfer system and the storage
assembly 112 in the maintenance system. For example, substrate 170B
can be at least one of a production substrate, a dummy substrate, a
test substrate, and a test device.
[0056] FIG. 4A illustrates an exemplary block diagram of a
processing system according to an embodiment of the invention. In
the illustrated embodiment shown in FIG. 4A, a processing system
400 for processing a substrate is shown. Processing system 400 can
comprise a transfer system 440, an exchange system 490 coupled to
the transfer system 440, and a processing module 430 coupled to the
exchange system 490. An exchange system 490 can be coupled to the
processing module 430 in order to transfer maintenance items into
and out of the processing module 430. In addition, an exchange
system 490 can be coupled to the processing module 430 in order to
transfer substrates into and out of the processing module 430. For
example, the exchange system 490 can permit the transfer of
substrates and/or maintenance items between the transfer system 440
and the processing module 430, and the processing module 430 can be
associated with an etch system, ALD system, deposition system,
coating system, patterning system, developing system, metrology
system, thermal processing system, cleaning system, and
combinations thereof.
[0057] The processing system 400 also comprises an isolation
assembly 413 that can be utilized to couple the transfer system 440
to the exchange system 490 and to isolate the transfer system 440
from the exchange system 490. For instance, the isolation assembly
413 can comprise at least one of a thermal insulation assembly to
provide thermal isolation, and a gate valve assembly to provide
vacuum isolation. The isolation assembly opening is large enough to
allow maintenance items to pass through. Isolation assembly 413 can
be used to transfer maintenance items into and out of the exchange
system 490 when the exchange system 490 is coupled to the transfer
system 440 and when the exchange system 490 is not coupled to the
transfer system 440. In addition, the isolation assembly 413 can be
used to transfer substrates into and out of the exchange system 490
when the exchange system 490 is coupled to the transfer system
440.
[0058] In one embodiment, the gate valve assembly 413 can comprise
two gate valves (413A and 413B), one (413B) attached to the
exchange system 490, and one (413A) attached to the transfer system
440. Alternately, a different number of gate valves can be
used.
[0059] The processing system 400 also comprises an isolation
assembly 414 that can be utilized to couple the processing module
430 to the exchange system 490 and to isolate the processing module
430 from the exchange system 490. For instance, the isolation
assembly 414 can comprise at least one of a thermal insulation
assembly to provide thermal isolation, and a gate valve assembly to
provide vacuum isolation. The isolation assembly opening is large
enough to allow maintenance items to pass through. The isolation
assembly 414 can be used to transfer maintenance items and/or
substrates between the processing module 430 and the exchange
system 490 when the exchange system 490 is coupled to the
processing module 430. In addition, the exchange system 490 can be
used to transfer maintenance items and/or substrates between the
transfer system 440 and the processing system 430 when the exchange
system 490 is coupled to the transfer system 440 and the processing
system 430.
[0060] In one embodiment, the gate valve assembly 414 can comprise
two gate valves (414A and 414B), one (414A) attached to the
exchange system 490, and one (414B) attached to the processing
system 430. Alternately, a different number of gate valves can be
used.
[0061] In one embodiment, the exchange system 490 is used to
transfer maintenance items such as consumable parts. Alternately,
the exchange system 490 can comprise a storage means (not shown)
that can be used to store maintenance items such as consumable
parts. The exchange system 490 can be removably coupled to the
transfer system 440. In an alternate embodiment, the exchange
system 490 can be fixedly coupled to the transfer system 440.
[0062] During processing, for example, the gate valve(s) between
the transfer system 440 and the exchange system 490 can be opened;
a maintenance item can be transferred between the transfer system
and the exchange system; the gate valve(s) between the transfer
system 440 and the exchange system 490 can be closed; and since the
exchange system and transfer system remain in a vacuum (evacuated)
state, an isolated state can be preserved in the processing system.
In addition, the gate valve(s) between the exchange system 490 and
the processing module 430 can be opened; a maintenance item and/or
substrate can be transferred between the transfer system and the
processing module; the gate valve(s) between the exchange system
490 and the processing module 430 can be closed; and since the
exchange system and transfer system remain in a vacuum (evacuated)
state, an isolated state can be preserved in the processing
system.
[0063] In an alternate embodiment, the exchange system 490 can
comprise means for cleaning a maintenance item and/or measuring a
maintenance item.
[0064] In addition, a controller 460 can be coupled to the
processing module 430, the exchange system 490, and the transfer
system 440. For example, the controller 460 can be used to control
the processing module 430, the exchange system 490, and the
transfer system 440. Alternately, the controller 460 can be coupled
to a controller (not shown) in the processing module 430, a
controller (not shown) in the exchange system 490, and a controller
(not shown) in the transfer system 440. Also, the controller 460
can be coupled to a control element (not shown) in a multi-element
manufacturing system (not shown).
[0065] FIG. 4B illustrates an exemplary block diagram of a transfer
system, an exchange system, and a processing system according to an
embodiment of the invention. In the illustrated embodiment shown in
FIG. 4B, an exchange system 490 is shown coupled to a processing
module 430 and to a transfer system 440. Alternately, a number of
processing modules 430 can be coupled to an exchange system 490. In
addition, a number of transfer systems 440 can be coupled to an
exchange system 490.
[0066] The transfer system 440 can comprise a transfer assembly 480
and transfer plate 484. The transfer assembly 480 can be used to
move transfer plate in at least one direction in the transfer
system. For example, the transfer plate can be moved from one
chamber to another, from one system to another, or from one
position to another. The transfer plate 484 can be used to hold a
substrate and/or maintenance item.
[0067] Transfer system 440 can be coupled to an exchange system 490
for transferring substrates and/or maintenance items. The exchange
system 490 can comprise a drive system 492, a transfer arm 494, and
an end effector 496. The drive system 492 is used to move the
transfer arm 494 and end effector horizontally, vertically, and
rotationally in order to transfer substrates and/or maintenance
items between the transfer system 440 and the processing module
430. Several transfer arms 494 and end effectors 496 are shown in
FIG. 4B to illustrate some of the various positions for the
transfer arm 494 and end effector 496. In one embodiment, one
transfer arm 494 and one end effector 496 are used. Alternately,
two transfer arms 494 and two end effectors 496 can be used to
increase throughput.
[0068] The exchange system 490 can be used to transfer a
maintenance item 470A between the transfer plate 484 in the
transfer system and the substrate holder 434 in the processing
module. For example, maintenance item 470A can be at least one of a
ring, a shield, an insulator, an adapter, and a plate. The exchange
system 490 can also be used to transfer a substrate 470B between
the transfer plate 484 in the transfer system and the substrate
holder 434 in the processing module. For example, substrate 470B
can be at least one of a production substrate, a dummy substrate, a
test substrate, and a test device.
[0069] The exchange system 490 can be used to transfer a
maintenance item 470C between the transfer plate 484 in the
transfer system and the upper assembly 432 in the processing
module. For example, maintenance item 470C can be at least one of a
ring, a shield, an insulator, an adapter, and a plate.
[0070] FIG. 5A illustrates an exemplary block diagram of a
processing system according to an embodiment of the invention. In
the illustrated embodiment shown in FIG. 5A, a processing system
500 for processing a substrate is shown. The processing system 500
can comprise a transfer system 540, an exchange system 590 coupled
to the transfer system 540, and a maintenance system 510 coupled to
the exchange system 590. The maintenance system 510 can be used for
storing and/or transporting substrates and/or maintenance items. In
an alternate embodiment, the maintenance system 510 can comprise
means for cleaning and/or measuring a maintenance item. An exchange
system 590 can be coupled to the maintenance system 510 in order to
transfer substrates and/or maintenance items into and out of the
maintenance system 510.
[0071] The processing system 500 also comprises an isolation
assembly 515 that can be utilized to couple the transfer system 540
to the exchange system 590 and to isolate the transfer system 540
from the exchange system 590. For instance, the isolation assembly
515 can comprise at least one of a thermal insulation assembly to
provide thermal isolation, and a gate valve assembly to provide
vacuum isolation. The isolation assembly opening is large enough to
allow maintenance items to pass through. Isolation assembly 515 can
be used to transfer maintenance items into and out of the exchange
system 590 when the exchange system 590 is coupled to the transfer
system 540 and when the exchange system 590 is not coupled to the
transfer system 540. In addition, the isolation assembly 515 can be
used to transfer substrates into and out of the exchange system 590
when the exchange system 590 is coupled to the transfer system
540.
[0072] In one embodiment, gate valve assembly 515 can comprise two
gate valves (515A and 515B), one (515B) attached to the exchange
system 590, and one (515A) attached to the transfer system 540.
Alternately, a different number of gate valves can be used.
[0073] The processing system 500 also comprises an isolation
assembly 516 that can be utilized to couple the maintenance system
510 to the exchange system 590 and to isolate the maintenance
system 510 from the exchange system 590. For instance, the
isolation assembly 516 can comprise at least one of a thermal
insulation assembly to provide thermal isolation, and a gate valve
assembly to provide vacuum isolation. The isolation assembly
opening is large enough to allow maintenance items to pass through.
Isolation assembly 516 can be used to transfer maintenance items
and/or substrates between the maintenance system 510 and the
exchange system 590 when the exchange system 590 is coupled to the
maintenance system 510. In addition, the exchange system 590 can be
used to transfer maintenance items and/or substrates between the
transfer system 540 and the maintenance system 510 when the
exchange system 590 is coupled to the transfer system 540 and the
maintenance system 510.
[0074] In one embodiment, gate valve assembly 516 can comprise two
gate valves (516A and 516B), one (516A) attached to the exchange
system 590, and one (516B) attached to the maintenance system 510.
Alternately, a different number of gate valves can be used.
[0075] In one embodiment, the exchange system 590 is used to
transfer maintenance items such as consumable parts. Alternately,
the exchange system 590 can comprise a storage means (not shown)
that can be used to store maintenance items such as consumable
parts. The exchange system 590 can be removably coupled to the
transfer system 540. In an alternate embodiment, the exchange
system 590 can be fixedly coupled to the transfer system 540.
[0076] During processing, for example, the gate valve(s) between
the transfer system 540 and the exchange system 590 can be opened;
a maintenance item can be transferred between the transfer system
and the exchange system; the gate valve(s) between the transfer
system 540 and the exchange system 590 can be closed; and since the
exchange system and transfer system remain in a vacuum (evacuated)
state, an isolated state can be preserved in the processing system.
In addition, the gate valve(s) between the exchange system 590 and
the maintenance system 510 can be opened; a maintenance item and/or
substrate can be transferred between the exchange system and the
maintenance system; the gate valve(s) between the exchange system
590 and the maintenance system 510 can be closed; and since the
exchange system and maintenance system remain in a vacuum
(evacuated) state, an isolated state can be preserved in the
processing system.
[0077] In addition, a controller 560 can be coupled to the
maintenance system 510, the exchange system 590, and the transfer
system 540. For example, the controller 560 can be used to control
the maintenance system 510, the exchange system 590, and the
transfer system 540. Alternately, the controller 560 can be coupled
to a controller (not shown) in the maintenance system 510, a
controller (not shown) in the exchange system 590, and a controller
(not shown) in the transfer system 540. Also, the controller 560
can be coupled to a control element (not shown) in a multi-element
manufacturing system (not shown).
[0078] FIG. 5B illustrates an exemplary block diagram of a transfer
system, an exchange system, and a maintenance system according to
an embodiment of the invention. In the illustrated embodiment shown
in FIG. 5B, an exchange system 590 is shown coupled to a
maintenance system 510 and to a transfer system 540. Alternately, a
number of exchange systems 590 can be coupled to a transfer system
540. In addition, a number of exchange systems 590 can be coupled
to a maintenance system 510. In addition, a number of maintenance
systems 510 can be coupled to an exchange system 590.
[0079] The transfer system 540 can comprise a transfer assembly 580
and transfer plate 584. The transfer assembly 580 can be used to
move the transfer plate in at least one direction in the transfer
system. For example, the transfer plate can be moved from one
chamber to another, from one system to another, or from one
position to another. The transfer plate 584 can be used to hold a
substrate and/or maintenance item.
[0080] The transfer system 540 can be coupled to an exchange system
590 for transferring substrates and/or maintenance items. The
exchange system 590 can comprise a drive system 592, a transfer arm
594, and an end effector 596. The drive system 592 is used to move
the transfer arm 594 and end effector horizontally, vertically, and
rotationally in order to transfer substrates and/or maintenance
items between the transfer system 540 and the maintenance system
510. Two transfer arms 594 and end effectors 596 are shown in FIG.
5B to illustrate some of the various positions for the transfer arm
594 and end effector 596. In one embodiment, one transfer arm 594
and one end effector 596 are used. Alternately, two transfer arms
594 and two end effectors 596 can be used to increase
throughput.
[0081] The exchange system 590 can be used to transfer a
maintenance item 570A between the transfer plate 584 in the
transfer system and the storage assembly 512 in the maintenance
system. For example, maintenance item 570A can be at least one of a
ring, a shield, an insulator, an adapter, and a plate. The exchange
system 590 can also be used to transfer a substrate 570B between
the transfer plate 584 in the transfer system and the storage
assembly 512 in the maintenance system. For example, substrate 570B
can be at least one of a production substrate, a dummy substrate, a
test substrate, and a test device.
[0082] FIG. 6A illustrates an exemplary block diagram of a
processing system according to an embodiment of the invention. In
the illustrated embodiment shown in FIG. 6A, a processing system
600 for processing a substrate is shown. The processing system 600
can comprise a transfer system 640, a processing module 630 coupled
to the transfer system 640, an exchange system 690 coupled to the
processing module 630, and a maintenance system 610 coupled to the
exchange system 690.
[0083] A maintenance system 610 can be used for storing and/or
transporting substrates and/or maintenance items. The maintenance
system 610 can be coupled to additional systems that can include
processing modules, transfer systems, and exchange systems. In an
alternate embodiment, the maintenance system 610 can comprise means
for measuring and/or cleaning a maintenance item.
[0084] The exchange system 690 can be coupled to the processing
module 630 and the maintenance system 610 in order to transfer
substrates and/or maintenance items between the maintenance system
610 and the processing module 630. The exchange system 690 can be
coupled to additional systems that can include processing modules,
transfer systems, and maintenance systems.
[0085] In addition, the transfer system 640 can permit the transfer
of substrates between the transfer system 640 and the processing
module 630. Alternately, the transfer system 640 can permit the
transfer of maintenance items between the transfer system 640 and
the processing module 630. The transfer system 640 can be coupled
to additional systems that can include processing modules, exchange
systems, and maintenance systems.
[0086] The processing system 600 can comprise at least one of an
etch system, a deposition system, coating system, patterning
system, developing system, metrology system, thermal processing
system, and lithography system. The processing system 600 can be
coupled to additional systems that can include transfer systems,
exchange systems, and maintenance systems.
[0087] Processing system 600 also comprises an isolation assembly
617 that can be utilized to couple the transfer system 640 to the
processing module 630 and to isolate the transfer system 640 from
the processing module 630. For instance, the isolation assembly 617
can comprise at least one of a thermal insulation assembly to
provide thermal isolation, and a gate valve assembly to provide
vacuum isolation. The isolation assembly opening is large enough to
allow maintenance items and/or substrates to pass through.
Isolation assembly 617 can be used to transfer substrates into and
out of processing module 630 when processing module 630 is coupled
to transfer system 640. In an alternate embodiment, isolation
assembly 617 can be used to transfer maintenance items into and out
of the processing module 630 when the processing module 630 is
coupled to the transfer system 640 and when the processing module
630 is not coupled to the transfer system 640.
[0088] In one embodiment, gate valve assembly 617 can comprise two
gate valves (617A and 617B), one (617B) attached to the processing
module 630, and one (617A) attached to the transfer system 640.
Alternately, a different number of gate valves can be used.
[0089] Processing system 600 also comprises an isolation assembly
618 that can be utilized to couple the processing module 630 to the
exchange system 690 and to isolate the processing module 630 from
the exchange system 690. For instance, the isolation assembly 618
can comprise at least one of a thermal insulation assembly to
provide thermal isolation, and a gate valve assembly to provide
vacuum isolation. The isolation assembly opening is large enough to
allow maintenance items to pass through. The isolation assembly 618
can be used to transfer maintenance items between the processing
module 630 and the exchange system 690 when the exchange system 690
is coupled to the processing module 630.
[0090] In one embodiment, the gate valve assembly 618 can comprise
two gate valves (618A and 618B), one (618A) attached to the
exchange system 690, and one (618B) attached to the maintenance
system 610. Alternately, a different number of gate valves can be
used.
[0091] The processing system 600 also comprises an isolation
assembly 619 that can be utilized to couple the maintenance system
610 to the exchange system 690 and to isolate the maintenance
system 610 from the exchange system 690. For instance, the
isolation assembly 619 can comprise at least one of a thermal
insulation assembly to provide thermal isolation, and a gate valve
assembly to provide vacuum isolation. The isolation assembly
opening is large enough to allow maintenance items to pass through.
The isolation assembly 619 can be used to transfer maintenance
items between the maintenance system 610 and the exchange system
690 when the exchange system 690 is coupled to the maintenance
system 610.
[0092] In addition, the exchange system 690 can be used to transfer
maintenance items between the processing module 630 and the
maintenance system 610 when the exchange system 690 is coupled to
the processing module 630 and the maintenance system 610.
[0093] In one embodiment, gate valve assembly 619 can comprise two
gate valves (619A and 619B), one (619A) attached to the exchange
system 690, and one (619B) attached to the maintenance system 610.
Alternately, a different number of gate valves can be used.
[0094] In one embodiment, the exchange system 690 is used to
transfer maintenance items such as consumable parts. Alternately,
the exchange system 690 can comprise a storage means (not shown)
that can be used to store maintenance items such as consumable
parts. The exchange system 690 can be removably coupled to the
processing module 630. In an alternate embodiment, the exchange
system 690 can be fixedly coupled to the processing module 630. The
exchange system 690 can be removably coupled to the maintenance
system 610. In an alternate embodiment, the exchange system 690 can
be fixedly coupled to the maintenance system 610.
[0095] During processing, for example, the gate valve(s) between
the processing module 630 and the exchange system 690 can be
opened; a maintenance item can be transferred between the
processing module and the exchange system; the gate valve(s)
between the processing module 630 and the exchange system 690 can
be closed; and since the exchange system and processing module
remain in a vacuum (evacuated) state, an isolated state can be
preserved in the processing system. In addition, the gate valve(s)
between the exchange system 690 and the maintenance system 610 can
be opened; a maintenance item and/or substrate can be transferred
between the exchange system and the maintenance system; the gate
valve(s) between the exchange system 690 and the maintenance system
610 can be closed; and since the exchange system and maintenance
system remain in a vacuum (evacuated) state, an isolated state can
be preserved in the processing system.
[0096] In addition, a controller 660 can be coupled to the
maintenance system 610, the processing module 630, the exchange
system 690, and the transfer system 640. For example, the
controller 660 can be used to control the maintenance system 610,
the processing module 630, the exchange system 690, and the
transfer system 640. Alternately, the controller 660 can be coupled
to a controller (not shown) in the processing module 630, a
controller (not shown) in the exchange system 690, and a controller
(not shown) in the transfer system 640. In addition, the controller
660 can be coupled to a control element (not shown) in a
multi-element manufacturing system (not shown).
[0097] FIG. 6B illustrates an exemplary block diagram of a transfer
system, a processing module, an exchange system, and a maintenance
system according to an embodiment of the invention. In the
illustrated embodiment shown in FIG. 6B, a processing module 630 is
shown coupled to an exchange system 690 and to a transfer system
640. In addition, a maintenance system 610 is coupled to the
exchange system 690.
[0098] The exchange system 690 is coupled between the maintenance
system 610 and the processing module 630, and can be used for
transferring substrates and/or maintenance items between the
maintenance system 610 and the processing module 630. The exchange
system 690 can comprise a drive system 692, a transfer arm 694, and
an end effector 696. The drive system 692 is used to move the
transfer arm 694 and end effector horizontally, vertically, and
rotationally in order to transfer substrates and/or maintenance
items between the transfer system 640 and the maintenance system
610. Several transfer arms 694 and end effectors 696 are shown in
FIG. 6B to illustrate some of the various positions for the
transfer arm 694 and end effector 696. In one embodiment, one
transfer arm 694 and one end effector 696 are used. Alternately,
two transfer arms 694 and two end effectors 696 can be used to
increase throughput.
[0099] The exchange system 690 can be used to transfer a
maintenance item 670A between the storage assembly 612 in the
maintenance system and the substrate holder 634 in the processing
module. For example, maintenance item 670A can be at least one of a
ring, a shield, an insulator, an adapter, and a plate. The exchange
system 690 can also be used to transfer a substrate 670B between
the storage assembly 612 in the maintenance system and the
substrate holder 634 in the processing module. For example,
substrate 670B can be at least one of a production substrate, a
dummy substrate, a test substrate, and a test device.
[0100] The exchange system 690 can be used to transfer a
maintenance item 670C between the storage assembly 612 in the
maintenance system and the upper assembly 632 in the processing
module 630. For example, maintenance item 670C can be at least one
of a ring, a shield, an insulator, an adapter, and a plate.
[0101] FIG. 7A illustrates an exemplary block diagram of a
processing system according to an embodiment of the invention. In
the illustrated embodiment shown in FIG. 7A, a processing system
700 for processing a substrate is shown. The processing system 700
can comprise a transfer system 740, a processing module 730 coupled
to the transfer system 740, and a maintenance system 795 coupled to
the processing module 730.
[0102] A maintenance system 795 can be used for storing and/or
transporting substrates and/or maintenance items. The maintenance
system 795 can be coupled to additional systems that can include
processing modules, transfer systems, and exchange systems. In an
alternate embodiment, the maintenance system 795 can comprise means
for measuring and/or cleaning a maintenance item.
[0103] In addition, the transfer system 740 can permit the transfer
of substrates between the transfer system 740 and the processing
module 730. Alternately, the transfer system 740 can permit the
transfer of maintenance items between the transfer system 740 and
the processing module 730. The transfer system 740 can be coupled
to additional systems that can include processing modules, exchange
systems, and maintenance systems.
[0104] The processing system 700 can comprise at least one of an
etch system, a deposition system, coating system, patterning
system, developing system, metrology system, thermal processing
system, and lithography system. The processing system 700 can be
coupled to additional systems that can include transfer systems,
exchange systems, and maintenance systems.
[0105] Processing system 700 also comprises an isolation assembly
721 that can be utilized to couple the transfer system 740 to the
processing module 730 and to isolate the transfer system 740 from
the processing module 730. For instance, the isolation assembly 721
can comprise at least one of a thermal insulation assembly to
provide thermal isolation, and a gate valve assembly to provide
vacuum isolation. The isolation assembly opening is large enough to
allow substrates to pass through. The isolation assembly 721 can be
used to transfer substrates into and out of processing module 730
when the processing module 630 is coupled to the transfer system
640. In an alternate embodiment, the isolation assembly 721 can be
used to transfer maintenance items into and out of the processing
module 730 when the processing module 730 is coupled to the
transfer system 740 and when the processing module 730 is not
coupled to the transfer system 740.
[0106] In one embodiment, gate valve assembly 617 can comprise two
gate valves (721A and 721B), one (721B) attached to the processing
module 730, and one (721A) attached to the transfer system 740.
Alternately, a different number of gate valves can be used.
[0107] Processing system 700 also comprises an isolation assembly
722 that can be utilized to couple the maintenance system 795 to
the processing module 730 and to isolate the maintenance system 795
from the processing module 730. For instance, the isolation
assembly 722 can comprise at least one of a thermal insulation
assembly to provide thermal isolation, and a gate valve assembly to
provide vacuum isolation. The isolation assembly opening is large
enough to allow maintenance items to pass through. The isolation
assembly 722 can be used to transfer maintenance items between the
maintenance system 795 and the processing module 730 when the
processing module 730 is coupled to the maintenance system 795.
[0108] In one embodiment, gate valve assembly 722 can comprise two
gate valves (722A and 722B), one (722A) attached to the processing
module 730, and one (722B) attached to the maintenance system 795.
Alternately, a different number of gate valves can be used.
[0109] In one embodiment, maintenance system 795 is used to
transfer maintenance items such as consumable parts. In addition,
maintenance system 795 can comprise a storage means (not shown)
that can be used to store maintenance items such as consumable
parts. The maintenance system 795 can be removably coupled to the
processing module 730. In an alternate embodiment, the maintenance
system 795 can be fixedly coupled to the processing module 730.
[0110] During processing, for example, the gate valve(s) between
the processing module 730 and the maintenance system 795 can be
opened; a maintenance item can be transferred between the
processing module and the maintenance system; the gate valve(s)
between the processing module 630 and the maintenance system 795
can be closed; and since the maintenance system and processing
module remain in a vacuum (evacuated) state, an isolated state can
be preserved in the processing system.
[0111] In one embodiment, gate valve 722B can be coupled to the
maintenance system 795 and can be used to load maintenance items
such as consumable parts. After processing, for example, the gate
valve(s) between the processing module 730 and the maintenance
system 795 can be closed; the maintenance system can be decoupled
from the processing module; gate valve 722B can be opened; a
maintenance item can be transferred into or out of the maintenance
system; gate valve 722B can be can be closed; the maintenance
system can be evacuated; the maintenance item can be stored in the
maintenance system, and an isolated state can be preserved in the
processing system. Subsequently, the maintenance system can be
coupled to the processing module and a maintenance item can be
transferred between the processing module and the maintenance
system.
[0112] In an alternate embodiment, maintenance system 795 can
comprise an additional opening (not shown) that can be used to load
maintenance items such as consumable parts. The maintenance system
795 can be removably coupled to the processing module 730.
Alternately, the maintenance system 110 can be fixedly coupled to
the processing module 730. After processing, for example, the gate
valve(s) between the processing module 730 and the maintenance
system 795 can be closed; the additional opening (not shown) can be
opened; a maintenance item can be positioned in the maintenance
system; the additional opening (not shown) can be closed; the
maintenance system can be evacuated; the gate valve(s) between the
processing module 730 and the maintenance system 795 can be opened;
the maintenance item can be stored in the maintenance system and/or
moved from the maintenance system to the processing module, and an
isolated state can be preserved in the processing system. In one
embodiment, one maintenance system can be used for new and used
parts. Alternately, one maintenance system can be used for new
parts and another maintenance system can be used for used
parts.
[0113] In addition, a controller 760 can be coupled to the
maintenance system 795, the processing module 730, and the transfer
system 740. For example, controller 760 can be used to control the
maintenance system 795, the processing module 730, and the transfer
system 740. Alternately, controller 760 can be coupled to a
controller in the processing module 730, a controller in the
maintenance system 795, and a controller in the transfer system
740. In addition, controller 760 can be coupled to a control
element (not shown) in a multi-element manufacturing system (not
shown).
[0114] FIG. 7B illustrates an exemplary block diagram of a
processing module and a maintenance system according to an
embodiment of the invention. In the illustrated embodiment shown in
FIG. 7B, a processing module 730 is shown coupled to a maintenance
system 795.
[0115] The maintenance system 795 comprises an exchange system 790
that can be used for transferring substrates and/or maintenance
items between the maintenance system 795 and the processing module
730. The exchange system 790 can comprise a drive system 792, a
transfer arm 794, and an end effector 796. The drive system 792 is
used to move the transfer arm 794 and end effector horizontally,
vertically, and rotationally in order to transfer substrates and/or
maintenance items between the transfer system 740 and the
maintenance system 710. Several transfer arms 794 and end effectors
796 are shown in FIG. 7B to illustrate some of the various
positions for the transfer arm 794 and end effector 796. In one
embodiment, one transfer arm 794 and one end effector 796 are used.
Alternately, two transfer arms 794 and two end effectors 796 can be
used to increase throughput.
[0116] The exchange system 790 can be used to transfer a
maintenance item 770A between the storage assembly 712 in the
maintenance system and the substrate holder 734 in the maintenance
system. For example, maintenance item 770A can be at least one of a
ring, a shield, an insulator, an adapter, and a plate. The exchange
system 790 can also be used to transfer a substrate 770B between
the storage assembly 712 in the maintenance system and the
substrate holder 734 in the maintenance system. For example,
substrate 770B can be at least one of a production substrate, a
dummy substrate, a test substrate, and a test device.
[0117] The exchange system 790 can be used to transfer a
maintenance item 770C between the storage assembly 712 in the
maintenance system and the upper assembly 732 in the processing
module 730. For example, maintenance item 770C can be at least one
of a ring, a shield, an insulator, an adapter, and a plate.
[0118] FIG. 8 illustrates a flow diagram of a method of operating a
processing system in accordance with an embodiment of the
invention. Procedure 800 starts in 810.
[0119] In 820, an exchange system removes a first removably mounted
maintenance item or a substrate out of a processing module in a
processing system.
[0120] In one case, the exchange system can be a part of a transfer
system and can transfer the first removably mounted maintenance
item or a substrate to a transfer plate in the transfer system. For
example, a transfer system can comprise a first transfer plate for
transferring maintenance items and a second transfer plate for
transferring substrates. In addition, the transfer system can
comprise a transfer plate configured for transferring maintenance
items and/or substrates.
[0121] In another case, the exchange system can be a part of a
transfer system and can transfer the first removably mounted
maintenance item or a substrate to a holding plate in the transfer
system. For example, a transfer system can comprise a first holding
plate for holding maintenance items and a second holding plate for
holding substrates. Also, the transfer system can comprise a
holding plate configured for holding maintenance items and/or
substrates.
[0122] In another case, the exchange system can be coupled to a
transfer system and a processing system and can transfer the first
removably mounted maintenance item or a substrate to a transfer
plate in the transfer system. For example, a transfer system can
comprise a first transfer plate for transferring maintenance items
and a second transfer plate for transferring substrates. In
addition, the transfer system can comprise a transfer plate
configured for transferring maintenance items and/or
substrates.
[0123] In another case, the exchange system can be coupled to a
transfer system and a processing system and can transfer the first
removably mounted maintenance item or a substrate to a holding
plate in the exchange system. For example, an exchange system can
comprise a first holding plate for holding maintenance items and a
second transfer plate for holding substrates. In addition, the
exchange system can comprise a holding plate configured for holding
maintenance items and/or substrates.
[0124] In another case, the exchange system can be coupled to a
maintenance system and a processing system and can transfer the
first removably mounted maintenance item or a substrate to a
storage assembly in the transfer system. For example, a maintenance
system can comprise a first storage assembly for holding
maintenance items and a second storage assembly for holding
substrates. In addition, the maintenance system can comprise a
storage assembly configured for holding maintenance items and/or
substrates.
[0125] In another case, the exchange system can be coupled to a
maintenance system and a processing system and can transfer the
first removably mounted maintenance item or a substrate to a
holding plate in the exchange system. For example, an exchange
system can comprise a first holding plate for holding maintenance
items and a second transfer plate for holding substrates. In
addition, the exchange system can comprise a holding plate
configured for holding maintenance items and/or substrates.
[0126] In another case, the exchange system can be part of a
maintenance system that is coupled to a processing system and can
transfer the first removably mounted maintenance item or a
substrate to a storage assembly in the maintenance system. For
example, a maintenance system can comprise a first storage assembly
for holding maintenance items and a second storage assembly for
holding substrates. In addition, the maintenance system can
comprise a storage assembly configured for holding maintenance
items and/or substrates.
[0127] In another case, the exchange system can be part of a
maintenance system that is coupled to a processing system and can
transfer the first removably mounted maintenance item or a
substrate to a holding plate in the maintenance system. For
example, a maintenance system can comprise a first holding plate
for holding maintenance items and a second transfer plate for
holding substrates. In addition, the maintenance system can
comprise a holding plate configured for holding maintenance items
and/or substrates.
[0128] In 830, the exchange system can transfer a second removably
mounted maintenance item or a wafer into the processing module.
[0129] In one case, the exchange system can be a part of a transfer
system and can transfer the second removably mounted maintenance
item or a substrate from a transfer plate in the transfer system.
For example, a transfer system can comprise a first transfer plate
for transferring maintenance items and a second transfer plate for
transferring substrates. In addition, the transfer system can
comprise a transfer plate configured for transferring maintenance
items and/or substrates.
[0130] In another case, the exchange system can be a part of a
transfer system and can transfer the second removably mounted
maintenance item or a substrate from a holding plate in the
transfer system. For example, a transfer system can comprise a
first holding plate for holding maintenance items and a second
holding plate for holding substrates. Also, the transfer system can
comprise a holding plate configured for holding maintenance items
and/or substrates.
[0131] In another case, the exchange system can be coupled to a
transfer system and a processing system and can transfer the second
removably mounted maintenance item or a substrate from a transfer
plate in the transfer system. For example, a transfer system can
comprise a first transfer plate for transferring maintenance items
and a second transfer plate for transferring substrates. In
addition, the transfer system can comprise a transfer plate
configured for transferring maintenance items and/or
substrates.
[0132] In another case, the exchange system can be coupled to a
transfer system and a processing system and can transfer the second
removably mounted maintenance item or a substrate from a holding
plate in the exchange system. For example, an exchange system can
comprise a first holding plate for holding maintenance items and a
second transfer plate for holding substrates. In addition, the
exchange system can comprise a holding plate configured for holding
maintenance items and/or substrates.
[0133] In another case, the exchange system can be coupled to a
maintenance system and a processing system and can transfer the
second removably mounted maintenance item or a substrate from a
storage assembly in the transfer system. For example, a maintenance
system can comprise a first storage assembly for holding
maintenance items and a second storage assembly for holding
substrates. In addition, the maintenance system can comprise a
storage assembly configured for holding maintenance items and/or
substrates.
[0134] In another case, the exchange system can be coupled to a
maintenance system and a processing system and can transfer the
second removably mounted maintenance item or a substrate from a
holding plate in the exchange system. For example, an exchange
system can comprise a first holding plate for holding maintenance
items and a second transfer plate for holding substrates. In
addition, the exchange system can comprise a holding plate
configured for holding maintenance items and/or substrates.
[0135] In another case, the exchange system can be part of a
maintenance system that is coupled to a processing system and can
transfer the second removably mounted maintenance item or a
substrate from a storage assembly in the maintenance system. For
example, a maintenance system can comprise a first storage assembly
for holding maintenance items and a second storage assembly for
holding substrates. In addition, the maintenance system can
comprise a storage assembly configured for holding maintenance
items and/or substrates.
[0136] In another case, the exchange system can be part of a
maintenance system that is coupled to a processing system and can
transfer the second removably mounted maintenance item or a
substrate from a holding plate in the maintenance system. For
example, a maintenance system can comprise a first holding plate
for holding maintenance items and a second transfer plate for
holding substrates. In addition, the maintenance system can
comprise a holding plate configured for holding maintenance items
and/or substrates.
[0137] Procedure 800 ends in 840.
[0138] In an alternate embodiment, the exchange system can comprise
two transfer means; the first transfer means can be used to
transfer the first removably mounted maintenance item or substrate;
and the second transfer means can be used to transfer the second
removably mounted maintenance item or substrate.
[0139] FIG. 9 illustrates a flow diagram for another method of
operating a processing system in accordance with an embodiment of
the invention. Procedure 900 starts in 910.
[0140] In 915, a processing module is coupled to a first position
in a transfer system using a first isolation assembly. The
processing module can comprise a first maintenance item, and the
first maintenance item can be removably mounted in the process
module. For example, the processing module can be an etching module
and can comprise a maintenance item for an etching module, and the
maintenance item can be removably mounted in the etching
module.
[0141] In 920, the first maintenance item can be detached from the
processing module. For example, a maintenance item can be lifted
off a substrate holder or can be decoupled from an upper
assembly.
[0142] In 925, the first maintenance item can be transferred from
the processing module to the transfer system. The transfer system
can comprise a first exchange system for transferring the first
maintenance item between the transfer system and the processing
module through the first isolation assembly without exposing the
processing module to an outside environment.
[0143] In 930, a maintenance system can be coupled to a second
position in the transfer system using a second isolation assembly.
The maintenance system can comprise a second maintenance item, and
the second maintenance item can be removably mounted in the process
module.
[0144] In 935, the second maintenance item can be transferred from
the maintenance system to the transfer system. The transfer system
can comprise a second exchange system for transferring the
maintenance item between the maintenance system and the transfer
system through the second isolation assembly without exposing the
system to an outside environment.
[0145] In 940, the second maintenance item can be transferred from
the transfer system to the processing module. The first exchange
system can comprise means for transferring the second maintenance
item between the transfer system and the processing module through
the first isolation assembly without exposing the system to an
outside environment.
[0146] In 945, the second maintenance item can be removably coupled
to the processing module. Procedure 900 ends in 950.
[0147] After replacing one or more maintenance items in one or more
processing modules, additional substrates can be processed.
[0148] In one embodiment, a transfer plate and a transfer assembly
in a transfer system can be used to move a maintenance item and/or
a substrate from one position to another position in the transfer
system.
[0149] Alternately, the processing system components can be
configured differently. For example, a stacked arrangement or a
side-by-side arrangement can be used.
[0150] A maintenance system, an exchange system, and/or a transfer
system can comprise at least one of a thermal control system, a
pressure control system, a gas supply system, an end effector
exchange system, a clamping system, a lifting system, an aligning
system, a monitoring system.
[0151] Although only certain embodiments of this invention have
been described in detail above, those skilled in the art will
readily appreciate that many modifications are possible in the
embodiments without materially departing from the novel teachings
and advantages of this invention. Accordingly, all such
modifications are intended to be included within the scope of this
invention.
* * * * *