U.S. patent application number 10/911049 was filed with the patent office on 2005-09-15 for decal transfer microfabrication.
This patent application is currently assigned to The Board of Trustees of the University of Illinois. Invention is credited to Childs, William Robert, Nuzzo, Ralph G..
Application Number | 20050199584 10/911049 |
Document ID | / |
Family ID | 31976614 |
Filed Date | 2005-09-15 |
United States Patent
Application |
20050199584 |
Kind Code |
A1 |
Nuzzo, Ralph G. ; et
al. |
September 15, 2005 |
Decal transfer microfabrication
Abstract
A method of making a microstructure includes forming a pattern
in a surface of a silicon-containing elastomer, oxidizing the
pattern, contacting the pattern with a substrate; and bonding the
oxidized pattern and the substrate such that the pattern and the
substrate are irreversibly attached. The silicon-containing
elastomer may be removably attached to a transfer pad.
Inventors: |
Nuzzo, Ralph G.; (Champaign,
IL) ; Childs, William Robert; (Champaign,
IL) |
Correspondence
Address: |
BRINKS HOFER GILSON & LIONE
P.O. BOX 10395
CHICAGO
IL
60610
US
|
Assignee: |
The Board of Trustees of the
University of Illinois
|
Family ID: |
31976614 |
Appl. No.: |
10/911049 |
Filed: |
August 4, 2004 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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10911049 |
Aug 4, 2004 |
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10230882 |
Aug 28, 2002 |
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6805809 |
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Current U.S.
Class: |
216/54 |
Current CPC
Class: |
Y10T 428/24562 20150115;
Y10T 428/24628 20150115; B81C 1/0046 20130101; B82Y 10/00 20130101;
G03F 7/0002 20130101; B82Y 40/00 20130101; B81C 2201/034
20130101 |
Class at
Publication: |
216/054 |
International
Class: |
C03C 025/68 |
Goverment Interests
[0001] The subject matter of this application was in part funded by
the National Science Foundation (Grant no. CHE 0097096); by the
Defense Advanced Research Projects Agency (DARPA; Grant no. SPAWAR:
N66001-98-1-8915); and by the Department of Energy (DOE Grant no.
DEFG02-91ER45439). The government may have certain rights in this
invention.
Claims
1-48. (canceled)
49. A microstructure, comprising: a substrate; and a patterned
layer comprising a silicon-containing elastomer on the substrate;
wherein the microstructure is formed by oxidizing the
silicon-containing elastomer, contacting the oxidized elastomer
with the substrate, and bonding the oxidized elastomer and the
substrate such that the elastomer and substrate are irreversibly
attached.
50. The microstructure of claim 49, wherein a minimum feature size
of the patterned layer is between 1 nanometer and 500
micrometers.
51. The microstructure of claim 49, wherein a minimum feature size
of the patterned layer is between 10 nm and 100 micrometers.
52. The microstructure of claim 49, wherein the patterned layer
comprises a discontinuous pattern.
53. The microstructure of claim 49, further comprising a top layer
comprising a silicon-containing elastomer, wherein the patterned
layer is positioned between the substrate and the top layer.
54. The microstructure of claim 53, wherein the patterned layer
further defines channels between the substrate and the top
layer.
55. The microstructure of claim 53, wherein the top layer has a
thickness between 100 nanometers and 500 micrometers.
56. The microstructure of claim 53, wherein the top layer has a
thickness between 500 nanometers and 100 micrometers.
57. The microstructure of claim 53, further comprising a second top
layer comprising a silicon-containing elastomer disposed over said
top layer and a second patterned layer comprising a
silicon-containing elastomer positioned between said top layer and
the second top layer.
58. The microstructure of claim 49, wherein the substrate is
non-planar.
59. The microstructure of claim 58, wherein the substrate is
curved.
60-64. (canceled)
65. A microstructure, comprising: a substrate; a patterned layer
comprising a silicon-containing elastomer on the substrate; and a
top layer comprising a silicon-containing elastomer; wherein the
patterned layer is positioned between the substrate and the top
layer and further defines channels between the substrate and the
top layer; and wherein the top layer has a thickness between 100
nanometers and 500 micrometers.
66. The microstructure of claim 65, wherein the top layer has a
thickness between 500 nanometers and 100 micrometers.
67. The microstructure of claim 65, further comprising a second top
layer comprising a silicon-containing elastomer disposed over said
top layer and a second patterned layer comprising a
silicon-containing elastomer positioned between said top layer and
the second top layer.
68. The microstructure of claim 65, wherein the substrate is
non-planar.
69. The microstructure of claim 65, wherein the patterned layer and
the substrate are irreversibly attached.
70. A microstructure, comprising: a substrate; and a patterned
layer comprising a silicon-containing elastomer on the substrate;
wherein the patterned layer comprises a discontinuous pattern
having a minimum feature size less than 1,000 micrometers and
having a thickness between 10 nanometers and 1 micrometer.
71. The microstructure of claim 70, wherein the discontinuous
pattern has a minimum feature size between 1 nanometer and 500
micrometers.
72. The microstructure of claim 70, wherein the discontinuous
pattern has a minimum feature size between 10 nanometers and 100
micrometers.
73. The microstructure of claim 70, wherein the discontinuous
pattern has a minimum feature size between 10 nanometers and 1
micrometer.
74. The microstructure of claim 70, wherein the discontinuous
pattern has a thickness between 10 nanometers and 100
nanometers.
75. The microstructure of claim 70, wherein the patterned layer and
the substrate are irreversibly attached.
76. A microstructure, comprising: a non-planar substrate; and a
patterned layer comprising a silicon-containing elastomer on the
substrate; wherein a minimum feature size of the patterned layer is
less than 1,000 micrometers.
77. The microstructure of claim 76, wherein the minimum feature
size of the patterned layer is between 1 nanometer and 500
micrometers.
78. The microstructure of claim 76, wherein the minimum feature
size of the patterned layer is between 10 nm and 100
micrometers.
79. The microstructure of claim 76, wherein the patterned layer and
the substrate are irreversibly attached.
80. The microstructure of claim 76, wherein the substrate is
curved.
Description
BACKGROUND
[0002] Soft lithography is a versatile patterning technique for use
in microfabrication to produce microstructures. This technique uses
a patterned elastomer to transfer a pattern from a master to a
substrate. The patterned elastomer may be used, for example, as a
stamp to transfer a substance, as a mold to be filled by a
substance, or as a mask to provide for selective deposition onto a
substrate and/or selective removal of material from the substrate.
See, for example, Xia, Y. and Whitesides, G. M. Annu. Rev. Mater.
Sci. (1998) 28:153-184.
[0003] In contrast, conventional photolithography utilizes rigid
photomasks to pattern photoresist layers, and the patterned
photoresist then protects the material beneath the pattern during
subsequent etching and deposition steps. Soft lithography provides
a number of advantages over conventional photolithography. Soft
lithography can yield three-dimensional structures and non-planar
structures in a single deposition step, rather than requiring the
stepwise assembly of individual layers. Due to the mechanical
flexiblility of the elastomer, non-planar substrates can be
patterned. The various soft lithographic techniques can also be
used with a more diverse range of materials than are available with
photolithography, and the materials and techniques used in soft
lithography are typically much lower in cost. Because of these
advantages, soft lithography has proven useful for applications
including integrated optics, microelectromechanical systems (MEMS),
microfluidics, and patterning of biological material such as
proteins, nucleic acids and cells.
[0004] In one example, a patterned elastomeric stamp can be
contacted with a substrate to form channels which can exhibit a
pattern in two or three dimensions. The channels can then be filled
with a liquid precursor for a solid substance, such as a polymer or
a ceramic. The channels can also be used to mix different fluid
substances, thus functioning as a microreactor or a microanalytical
tool. The formation of solid patterned structures with this
technique is referred to as Micromolding In Capillaries, or
"MIMIC." Drawbacks to this technique include the need for the
pattern to be continuous to allow the entire pattern to be filled.
Also, the channels must be large enough to accommodate the
viscosity of the liquid used to fill the pattern, which can limit
the resolution that can be obtained.
[0005] In another example, a patterned elastomeric stamp can be
coated with a substance and then contacted with a substrate.
Removal of the stamp results in a deposition of the substance onto
the substrate in the pattern of the stamp. The substance which is
transferred thus functions as an ink which is printed onto the
substrate. This technique, referred to as microcontact printing or
".mu.CP," can be used to form discontinuous patterns, and can form
patterns with higher resolution than MIMIC. Applications of
microcontact printing typically involve additive lithography, which
is the selective deposition of another substance on either the
patterned ink or on the exposed substrate. Drawbacks to this
technique include the limited range of materials which can be used
as the substrate and as the ink.
[0006] In yet another example, a patterned elastomeric membrane can
be applied to a substrate. This membrane can then function as a
mask for selective removal of the exposed substrate (subtractive
lithography), or for additive lithography. Depending on the
materials used for the membrane and the substrate, reversible
bonding between the two can be used to stabilize the membrane
during the desired microfabrication and to remove the membrane once
it has served its intended purpose. Drawbacks to this technique
include the extreme difficulty in applying, removing, and
manipulating the thin elastomeric membrane. Also, the membrane must
be continuous and cannot be used for imaging discrete forms and
patterns.
[0007] It is thus desirable to provide an improved soft
lithographic technique that can be used to form patterns that are
continuous or discrete, two dimensional or three dimensional, on
planar and non-planar substrates, and that may be in the form of
channels or masks for additive and subtractive lithography. It is
also desirable that these patterns can be formed on and with a wide
range of substances, without the need for delicate handling of the
materials involved.
BRIEF SUMMARY
[0008] In a first embodiment of the invention, there is provided a
method of making a microstructure, the method comprising forming a
pattern in a surface of a silicon-containing elastomer; oxidizing
the pattern; contacting the pattern with a substrate; and bonding
the oxidized pattern and the substrate such that the pattern and
the substrate are irreversibly attached.
[0009] In a second embodiment of the invention, there is provided a
method of making a microstructure, the method comprising oxidizing
a first surface of a film comprising a silicon-containing
elastomer; wherein the first surface comprises a pattern, and the
film is attached to a transfer pad; contacting the pattern with a
substrate; bonding the pattern and the substrate such that the
pattern and the substrate are irreversibly attached; and separating
the transfer pad from the film.
[0010] In a third embodiment of the invention, there is provided a
microstructure, comprising a substrate; and a patterned
silicon-containing elastomer on the substrate. The microstructure
is formed by oxidizing the silicon-containing elastomer, contacting
the oxidized elastomer with the substrate, and bonding the oxidized
elastomer and the substrate such that the elastomer and substrate
are irreversibly attached. There is further provided a method of
making a microstructure, comprising applying an etching agent to
this microstructure to remove a portion of the substrate which is
not covered by the patterned silicon-containing elastomer. There is
further provided a method of making a microstructure, comprising
depositing a material on this microstructure; and removing the
patterned silicon-containing elastomer to provide a pattern of the
deposited material.
[0011] In a fourth embodiment of the invention, there is provided a
microstructure, comprising a substrate; a patterned
silicon-containing elastomer on the substrate; and a top layer
comprising a silicon-containing elastomer. The patterned
silicon-containing elastomer is positioned between the substrate
and the top layer and comprises empty channels between the
substrate and the top layer, and the top layer has a thickness
between 100 nanometers and 500 micrometers.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] FIG. 1 is a diagram of a pattern transfer method using
irreversible attachment.
[0013] FIG. 2 is a diagram of a closed pattern transfer method
using irreversible attachment and removable attachment.
[0014] FIG. 3 is a diagram of an open pattern transfer method using
irreversible attachment and removable attachment.
[0015] FIGS. 4a and 4c are images of elastomer patterns formed
using irreversible attachment.
[0016] FIG. 4b is a graph of profilometry data of the pattern of
FIG. 4a.
[0017] FIGS. 5a-c are images of elastomer patterns formed using
irreversible attachment.
[0018] FIG. 6a-d are images of open patterns formed using
irreversible attachment and removable attachment.
[0019] FIGS. 7a-c are images of non-continuous patterns open
patterns formed using irreversible attachment and removable
attachment.
[0020] FIGS. 8a-c are images of closed patterns formed using
irreversible attachment and removable attachment.
[0021] FIGS. 9a-c are images of microfluidic structures formed
using irreversible attachment and removable attachment.
[0022] FIGS. 10a-d are images of the formation of silicon pixels on
a substrate by subtractive lithography after pattern transfer.
DETAILED DESCRIPTION
[0023] In a first embodiment of the invention, a method of making a
microstructure includes forming a pattern in a surface of a
silicon-containing elastomer, oxidizing this pattern, and
contacting the oxidized pattern with a substrate. The oxidized
pattern and the substrate may be bonded such that the pattern and
substrate are irreversibly attached.
[0024] In an aspect of the invention, a method for irreversibly
attaching a silicon-containing elastomer to a substrate includes
oxidation of an exposed surface of a silicon-containing elastomer,
followed by contacting the oxidized surface with a substrate and
bonding the elastomer to the substrate. The strength of the bond
can be greater than the strength of the bond between a layer of the
elastomer adjacent the surface and the remaining bulk of the
elastomer material.
[0025] In a second embodiment of the invention, a method of a
making a microstructure includes forming a pattern in a surface of
a silicon-containing elastomer, oxidizing the silicon containing
elastomer; applying an adhesion control agent to the oxidized
elastomer; and removably attaching the oxidized elastomer to a
transfer pad material. The method may further include oxidizing the
pattern in the surface of the silicon-containing elastomer,
contacting the oxidized pattern with a substrate, and bonding the
oxidized pattern and the substrate such that the pattern and
substrate are irreversibly attached.
[0026] In an aspect of the invention, a method for removably
attaching a silicon-containing elastomer to a transfer pad material
includes oxidation of an exposed surface of a silicon-containing
elastomer, combined with treatment of the exposed surface with an
adhesion control agent, to provide a surface that will removably
attach to a transfer pad. Thus, the elastomer can be supported and
manipulated until subjected to a force large enough to remove the
elastomer from the transfer pad.
[0027] In another aspect of the invention, a method for
irreversibly attaching a silicon-containing elastomer to a
substrate includes oxidation of an exposed surface of a
silicon-containing elastomer, combined with contacting the oxidized
surface with the substrate and bonding the oxidized surface with
the substrate.
[0028] In a third embodiment of the invention, a method of making a
microstructure includes oxidizing a first surface of a film
comprising a silicon-containing elastomer and contacting the
pattern with a substrate. The first surface contains a pattern, and
the film is attached to a transfer pad. The method further includes
bonding the pattern and the substrate such that the pattern and the
substrate are irreversibly attached, and then separating the
transfer pad from the film.
[0029] In an aspect of the invention, a method of transferring a
silicon-containing elastomer film from a transfer pad to a
substrate includes oxidizing one surface of a silicon-containing
elastomer material, followed by contacting the oxidized surface
with a substrate and forming a bond between the elastomer surface
and the substrate. Separation of the elastomer material from the
substrate results in a partitioning of the elastomer between the
bulk elastomer material and a layer of the elastomer adjacent the
oxidized surface. Thus, a film of the elastomer remains bonded to
the substrate.
[0030] In another aspect of the invention, a method of transferring
a silicon-containing elastomer film from a transfer pad to a
substrate includes removably attaching one surface of a
silicon-containing elastomer film to a transfer pad material,
followed by irreversibly attaching the other surface of the film to
a substrate. Separation of the transfer pad from the substrate
results in a removal of the elastomer film from the transfer pad,
thus transferring the film from the transfer pad to the
substrate.
[0031] In yet another aspect of the invention, a method of
transferring a pattern from a master to a substrate includes
forming a patterned film based on the master, followed by
irreversibly attaching the patterned film to the substrate. The
patterned film may be a film which is removably attached to a
transfer pad, or it may be a layer of a silicon-containing
elastomer which is adjacent to a surface that is irreversibly
attached to the substrate.
[0032] The term "microstructure," as used herein, is defined as a
structure or pattern containing features which are 1,000
micrometers (.mu.m) or smaller. The formation of microstructures is
referred to herein as "microfabrication" and includes, but is not
limited to, techniques such as microlithography, soft lithography,
MIMIC, and self-assembly.
[0033] The term "irreversibly attached," as used herein, means that
the bonding between two substances is sufficiently strong that the
substances cannot be mechanically separated without damaging or
destroying one or both of the substances. Substances which are
irreversibly attached may be separated by exposure to an
appropriate chemical environment, such as chemical reagents or
irradiation.
[0034] The term "removably attached," as used herein, means that
the bonding between two substances is sufficiently weak that the
substances can be separated mechanically without significantly
damaging either substance.
[0035] The term "elastomer," as used herein, is defined as a
polymer which can return to its initial dimensions when deformed by
an external force. A polymer is considered an elastomer when it
meets the following standard. A sample of the polymer in its solid
state and having an initial linear dimension D.sup.o is subjected
to a force such that the dimension is changed by 10%. Once the
force is no longer applied, the dimension assumes a value of
D.sup.e, where D.sup.e=D.sup.o.+-.0.01D.sup.- o.
[0036] The term "silicon-containing elastomer," as used herein, is
an elastomer which contains silicon (Si) atoms. Examples of
silicon-containing elastomers include, but are not limited to,
polysiloxanes, such as poly(dimethyl siloxane), poly(methyl
siloxane), partially alkylated poly(methyl siloxane), poly(alkyl
methyl siloxane) and poly(phenyl methyl siloxane); block copolymers
containing segments of a polysiloxane and another polymer;
silicon-modified elastomers, such as silicon-modified natural
rubber, silicon-modified polyolefins (including silicon-modified
polyisoprene, silicon-modified polybutadiene, and silicon-modified
polyisobutylene), silicon-modified polyimides, silicon-modified
crosslinked phenol-formaldehyde resins (Si-modified NOVOLAC), and
silicon-modified polyurethane elastomers. Silicon modification of
elastomers may be carried out by reactions with silanes and
siloxanes, including hydrosilation and condensation. Preferably the
silicon-containing elastomer is a polysiloxane. More preferably,
the silicon-containing elastomer is poly(dimethyl siloxane),
referred to as "PDMS."
[0037] Further examples of silicon-containing elastomers include
block copolymers of polysiloxanes with other polymers. For example,
block copolymers containing polysiloxanes may be formed with
polyolefins such as polyethylene (U.S. Pat. No. 5,618,903,
incorporated herein by reference), poly(isobutylene) (U.S. Pat. No.
5,741,859, incorporated herein by reference), polypropylene (U.S.
Pat. No. 5,744,541, incorporated herein by reference), polystyrene
and various polydienes (U.S. Pat. No. 5,932,649, incorporated
herein by reference), and polyisoprene and polybutadiene (U.S. Pat.
No. 6,362,288, incorporated herein by reference). In another
example, block copolymers containing polysiloxanes may be formed
with acrylates (U.S. Pat. No. 6,090,902, incorporated herein by
reference), with a wide variety of polymers formed by
polymerization of unsaturated monomers (U.S. Pat. No. 6,124,411,
incorporated herein by reference), and with a variety of types of
siloxanes (U.S. Pat. No. 5,637,668, incorporated herein by
reference). In another example, block copolymers containing
polysiloxanes may be formed with condensation polymers such as
polycarbonates (U.S. Pat. No. 6,072,011, incorporated herein by
reference) and poly(arylene ethers) (U.S. Pat. No. 6,339,131,
incorporated herein by reference) and may also be formed with
polyethers such as polyethylene oxide and polypropylene oxide (U.S.
Pat. No. 6,013,711, incorporated herein by reference). Further
examples of silicon-containing elastomers include copolymers
containing polysiloxane repeat units in combination with polyester
and/or polycarbonate repeat units (U.S. Pat. No. 6,407,193,
incorporated herein by reference), and also include blends of
polysiloxanes with polyamides (U.S. Pat. No. 6,344,521,
incorporated herein by reference) and blends of polysiloxanes with
polyolefins, polyurethanes, or styrenic polymers (U.S. Pat. No.
6,153,691, incorporated herein by reference). Further examples of
silicon-containing elastomers include polymers modified to contain
silicon by treatment with silane compounds (U.S. Pat. No.
6,136,926, incorporated herein by reference).
[0038] Oxidation of silicon-containing elastomers can be performed
by a variety of methods known in the art. In one method, for
example, the elastomer can be exposed to an oxygenated plasma to
oxidize the elastomer surface. This oxidation can be carried out by
converting a stream of oxygen into a plasma at a temperature as low
as 40.degree. C. In another method, which is preferred, oxidation
of a surface of a silicon-containing elastomer is performed by
exposing the surface to ultraviolet radiation which is sufficient
to generate ozone and/or other oxidizing species, such as singlet
oxygen, from an ambient atmosphere. This particular oxidation is
referred to as UV/Ozone treatment, or "UVO." Oxidation by UVO can
also include exposing the surface to an atmosphere enriched in
either molecular oxygen (O.sub.2) or ozone (O.sub.3). One advantage
of the oxidation by UVO is that the silicon-containing elastomer
can become sufficiently oxidized under mild conditions. See for
example Ouyang, M. et al. Chem. Mater. 2000, 12, 1591-1596.
[0039] The oxidized surface of a silicon-containing elastomer can
then be irreversibly attached to the surface of a substrate
material by contacting the oxidized surface and the substrate and
bonding together the surface and the substrate. Suitable substrates
include, but are not limited to, silicon; ceramic materials such as
silicon oxide, quartz and glass; polymers such as polystyrene and
silicon-containing elastomers, including PDMS; and metals such as
titanium, chromium, tungsten, and gold. Preferably, the surface of
the silicon-containing elastomer is treated with UVO at ambient
temperature for an appropriate length of time and is then
immediately contacted with a substrate that has been recently
cleaned. For example, PDMS is preferably exposed to UVO for 14
minutes, more preferably for 2-3 minutes, and even more preferably
for about 2.5 minutes.
[0040] The elastomer and substrate are kept in contact to allow the
formation of an irreversible bond. The contacted elastomer and
substrate may be subjected to heating and/or supplemental
ultraviolet radiation to assist the formation of the bond. For
example, after contacting UVO treated PDMS with a silicon
substrate, the irreversible bond can be obtained by maintaining the
contact for about 16 hours at ambient temperature, by maintaining
the materials at 70.degree. C. for at least 20 minutes, or by
applying UV radiation to the PDMS for at least 30 minutes. Exposure
of unoxidized silicon-containing elastomers to only one of heat,
ozone or UV radiation will not typically provide irreversible
adhesion to substrates.
[0041] The initial contact between the oxidized surface of the
silicon-containing elastomer and the substrate surface typically
will not result in an irreversible bond. This phenomenon allows for
the precise positioning of the elastomer and the substrate. Thus,
any patterns in the elastomer and/or the substrate can be aligned
or registered prior to the formation of an irreversible bond. The
use of an optically transparent silicon-containing elastomer (such
as PDMS) may also be desirable, in that alignment or registration
of films and patterns can be done using optical observation.
[0042] It may be desirable to clean the surface of the substrate
prior to contacting the substrate with the oxidized
silicon-containing elastomer. Substrates may be cleaned by
conventional methods. For example, substrates of silicon or silicon
oxide can be rinsed with solvents such as hexanes and ethanol and
dried under an inert gas such as nitrogen. In another example,
glass and quartz can be rinsed with reagents such as piranha
(sulfuric acid and hydrogen peroxide). The substrate may also be
cleaned and/or oxidatively modified by exposure to UVO, to a plasma
such as an argon plasma or other plasma, or to other chemical
treatments. It may also be desirable to treat the surface of the
substrate with UVO immediately prior to contacting it with the
oxidized elastomer. The treatment of the substrate may conveniently
be carried out by subjecting the elastomer surface and the
substrate surface to the same UVO exposure. For metal substrates
such as gold, it may be useful to apply an adhesion promoter such
as a thiol compound to the metal surface and/or the elastomer
surface. Examples of thiol compounds include thiol-silane compounds
such as (thiolpropyl)-trimethoxysilane.
[0043] Ultraviolet radiation at 185 nm is believed to convert
oxygen into ozone, which is subsequently converted to atomic oxygen
by UV radiation at 254 nm. Without wishing to be bound by any
theory of interpretation, it is believed that oxidation of the
silicon-containing surface of the elastomer serves to form free
silicon-oxide (Si--O--) and/or silicon-hydroxide (Si--OH)
functionalities on the surface due to the removal of organic groups
by cleavage of the initial silicon-oxygen-carbon (Si--O--C--) or
silicon-carbon (Si--C) bonds. Contact between the oxidized
elastomer and the substrate is believed to foster the formation of
silyl ether (Si--O--Si, Si--O--C, or Si--O-metal) bonds between the
two materials.
[0044] The amount of UVO treatment may be varied depending on the
type of silicon-containing elastomer and the type of substrate
material. For example, for polysiloxanes containing alkyl or aryl
organic side groups which are less volatile than the methyl groups
of PDMS, the UVO may need to be applied for more than 5 minutes.
Also, for silicon-modified elastomers and polysiloxane-containing
block copolymers, an increased duration of UVO may be needed, since
the silicon atoms are less concentrated than in PDMS. PDMS
elastomer which has been treated with UVO for 5 minutes or more may
not adhere to a substrate irreversibly, and treatment for 4 minutes
may yield adhesion which is inconsistent from one sample to
another. Other silicon-containing elastomers may also exhibit this
"overoxidation" phenomenon and thus will have a maximum effective
UVO treatment time.
[0045] In addition to being irreversibly attached to a substrate,
the oxidized surface of a silicon-containing elastomer can be
adhered to a transfer pad material such that the attachment is
removable. A silicon-containing elastomer can be adhered to a
transfer pad with a bond which is sufficiently strong to allow for
manipulation of the elastomer, but which is less strong than the
cohesive forces within the elastomer. Thus, the removable
attachment between a silicon-containing elastomer and a transfer
pad can allow the elastomer to retain its desired shape during
storage and/or other processing, but the elastomer can be
completely removed from the transfer pad when they are pulled away
from each other with a sufficient force. Preferably, this removal
is accomplished without tearing the elastomer and/or the transfer
pad (cohesive failure).
[0046] The removable attachment of a silicon-containing elastomer
to a transfer pad may be facilitated by the combination of
oxidation of the surface of the elastomer and deposition of an
adhesion control agent on the oxidized surface. For example, the
surface of a silicon-containing elastomer can be oxidized and then
exposed to an adhesion control agent such that at least some of the
adhesion control agent is present on the surface. Contacting this
modified surface with a transfer pad can then provide the elastomer
and the transfer pad connected by a removable attachment.
[0047] Adhesion control agents can be any substance which, when
present on an oxidized surface of a silicon-containing elastomer,
reduces the strength of the bond between the oxidized surface and
another material. Adhesion control agents may include, but are not
limited to, surface active agents such as ionic and non-ionic
surfactants, silane compounds such as a trichlorosilane containing
an organic substituent, siloxane compounds such as a cyclic
methylsiloxane containing an organic substituent. Preferred
adhesion control agents include trichlorosilanes containing an
organic substituent having from 3 to 20 carbon atoms. More
preferred adhesion control agents include trichlorosilanes
containing a fluorinated organic substituent having from 3 to 20
carbon atoms and from 1 to 41 fluorine atoms. A specific preferred
adhesion control agent is
(tridecafluoro-1,1,2,2-tetrahydrooctyl)trichlorosilane, hereinafter
referred to as TDTS.
[0048] Removable attachment may also be facilitated by a
stimulus-responsive adhesive layer between the elastomer and the
transfer pad. The adhesive layer can provide an irreversible
attachment between the adhesive layer and the silicon-containing
elastomer and between the adhesive layer and the other material,
but can be made to reduce the strength of attachment to the
elastomer and/or the other material. For example, a layer of
adhesive material may be subjected to a change in conditions such
as temperature, irradiation or electric field such that the
adhesive strength is reduced. In one example, a photoresist
material such as poly(methyl methacrylate),
poly(.alpha.-methylstyrene), poly(norbornene-co-maleic anhydride),
or phenol-formaldehyde can initially provide an adhesive bond
between the materials. These materials may then be degraded by
irradiation to sufficiently reduce the strength of adhesion and to
allow the materials to be separated. Such photoresist-based
reversible adhesion may also include the use of a photosensitizer
such as a photoacid generator to improve the response time for the
reduction in adhesive strength.
[0049] Suitable transfer pad materials include, but are not limited
to, silicon, silicon oxide, quartz and glass, as well as
silicon-containing elastomers such as PDMS. Preferably, the
transfer pad is a silicon-containing elastomer. More preferably,
the transfer pad is PDMS.
[0050] The irreversible attachment of a silicon-containing
elastomer to a substrate can be used to transfer a film of the
elastomer onto the substrate. For example, oxidation of a surface
of the silicon-containing elastomer, followed by contacting and
bonding the oxidized surface with a substrate can form an
irreversible attachment between the elastomer and the substrate.
Preferably, the irreversible attachment is stronger than the
cohesive forces within the elastomer. Although the elastomer is a
unified, continuous material, it can be regarded as containing a
bulk portion which is not adjacent the oxidized surface, and a
surface layer portion which is adjacent the oxidized surface. Thus,
if the elastomer is pulled away from the substrate, the elastomer
will undergo cohesive failure, separating the bulk portion from the
surface layer portion. Preferably, the cohesive failure is such
that a film of elastomer material remains bonded to the substrate
only in regions where the elastomer surface has been oxidized and
then placed in contact with the substrate.
[0051] The irreversible attachment of a silicon-containing
elastomer to a substrate can also be used to transfer a pattern
from a master to a substrate. For example referring to FIG. 1, the
silicon-containing elastomer can be patterned based on a master
pattern 20. The master pattern may be present on a surface of a
master material 22. Formation of the final silicon-containing
elastomer 30 on this patterned surface can form a relief of the
pattern in the elastomer. Silicon-containing elastomers can be
formed, for example, by polymerizing monomers and/or prepolymers;
by crosslinking monomers, prepolymers and/or polymers; and by
solidifying the elastomer from a liquid or molten state. Thus
viscous elastomer precursors, such as monomers, prepolymers or
uncrosslinked polymer, can be deposited onto the patterned surface
of a master. Polymerization and/or crosslinking can then provide
the patterned silicon-containing elastomer, which can be removed
from the master. Also, an elastomer that is at a temperature above
its melting temperature (T.sub.m) can be deposited onto the
patterned surface of the master. Once the elastomer has cooled
sufficiently below its T.sub.m, it can be removed from the master
to reveal the patterned elastomer. When transferring a pattern
using irreversible attachment and cohesive failure, it is preferred
that the material used to make the patterned silicon-containing
elastomer is deposited on the master in an amount sufficient to
cover the entire master pattern.
[0052] The master can be patterned by any number of known
microfabrication techniques and can be made of a variety of
materials. Preferably, the master is cleaned before deposition of
material that is used to make the patterned elastomer. It is also
preferred that the master not contain substances which can be
transferred to the surface of the patterned elastomer, such as
contaminants, lubricants, salts, particulates, small molecules, or
oligomers.
[0053] Referring still to FIG. 1, once the patterned
silicon-containing elastomer has been produced, based on the master
pattern, it is removed 40 from the master. The patterned surface 32
of the elastomer can then be oxidized 42 and irreversibly bonded 44
to a substrate 50, as described. The substrate and the
silicon-containing elastomer are thus irreversibly attached along
the pattern as dictated by the master pattern. When the bulk of the
elastomer 34 is pulled away 46 from the substrate, the elastomer
will undergo cohesive failure, leaving a film 36 of elastomer
material bonded to the substrate only in regions where the
elastomer surface has been oxidized and then placed in contact with
the substrate. Since the elastomer and the substrate are
irreversibly attached in the shape of the pattern, the residual
film on the substrate retains this pattern.
[0054] The yield strength of the patterned elastomer as it is
peeled from the substrate can be affected both by the total
elastomer contact area and by the feature sizes. Thus, the
patterning method based on cohesive failure is especially useful
for transferring patterns with small feature sizes (100 .mu.m or
smaller) over relatively large areas. One advantage of this method
is that it can transfer patterns in a manner that allows
registration of multiple patterns and that enables micron scale
patterning over large areas. The locus of the cohesive failure of
the elastomer progressively approaches that of the surface of the
features as their sizes approach the 1 micron level. Pattern
transfers in a thickness range of 10-100 nm can be attained easily
for a 1.0 .mu.m minimum feature size, based on a master with a 1
.mu.m feature height as a specific example. The removal of the bulk
elastomer for these small features sizes also tends to require a
lower amount of force.
[0055] The removable attachment of a silicon-containing elastomer
with a transfer pad can also be used to transfer a film of the
elastomer onto a substrate. In this method, both surfaces of the
silicon-containing elastomer are oxidized, but for different
effects. For example, oxidation of one surface of the
silicon-containing elastomer film, followed by deposition of an
adhesion control agent, can allow that surface to be removably
attached to another material. Contacting this surface with a
transfer pad can form a removable bond between the elastomer film
and the transfer pad. Once this surface is removably attached to
the transfer pad, oxidation of the other surface of the
silicon-containing elastomer film followed by bonding this oxidized
surface with a substrate can form an irreversible attachment
between the elastomer film and the substrate. This results in a
layered structure having the silicon-containing elastomer film
situated between the substrate and the transfer pad. If the
transfer pad is pulled away from the substrate, the removable bond
will be broken, and the irreversible bond will keep the film in
contact with the substrate. Thus, the film is transferred from the
transfer pad to the substrate. For removable attachment achieved
with a stimulus-responsive adhesive, the adhesive is subjected to
appropriate conditions to reduce the adhesion before the transfer
pad is removed. Preferably, the separation of the transfer pad and
the substrate is such that a film of elastomer material remains
bonded to the substrate only in regions where the elastomer surface
has been oxidized and then placed in contact with the
substrate.
[0056] The transfer pad may be a solid material before it is
contacted with the elastomer film, or the transfer pad may be
formed directly on the elastomer film after the surface has been
oxidized and treated with adhesion control agent. The formation of
the transfer pad on the oxidized and treated surface is especially
useful when the transfer pad is a silicon-containing elastomer.
Thus, a viscous elastomer precursor can be deposited on the
oxidized and treated film surface and allowed to solidify into an
elastomeric transfer pad. The elastomeric transfer pad will then be
removably attached to the film upon formation of the transfer
pad.
[0057] In an example of the formation of an elastomeric transfer
pad on an oxidized and treated film, initiated PDMS precursors can
be deposited on a film surface and allowed to polymerize into a
PDMS elastomer. Typically, when initiated PDMS precursors are added
to a portion of PDMS which has already been cured, for example an
elastomer film, the newly formed layer cures without the formation
of a measurable boundary between the layers. Thus, the "adhesion"
between the layers is the bulk, internal adhesion, which is
relatively strong. If the surface of the cured PDMS film has been
treated with an adhesion control agent without oxidation, the
adhesion between the film and the transfer pad layer will be less
than the bulk adhesion, allowing the layer and the film to be
separated without causing damage to either layer. The adhesion can
be reduced further by exposing the cured PDMS film to UVO before
depositing an adhesion control agent.
[0058] For a cured PDMS film that is subjected to UVO, the strength
of adhesion can thus be controlled by adjusting the amount of
adhesion control agent, with increased amounts of adhesion control
agent correlating to decreased adhesion strength. For example, a
cured PDMS film that is subjected to 50 seconds of UVO followed by
20 minutes of exposure to TDTS exhibits minimal adhesion to a PDMS
transfer pad. A reduction in the TDTS exposure provides for
removable attachment to the PDMS transfer pad, and the film is thus
supported across the entire film-transfer pad interface, allowing
the exposed surface of the film to be brought into contact with a
substrate without tearing, sagging, or folding of the film. The
strength of adhesion can also be controlled by changing the level
of exposure to UVO before the addition of an adhesion control
agent. If the type and amount of adhesion control agent is
unchanged, an increase in the UVO treatment time can provide for a
reduction in the adhesion strength.
[0059] When combined with irreversible attachment of a
silicon-containing elastomer to a substrate, the removable
attachment of a silicon-containing elastomer to a transfer pad can
also be used to transfer a pattern from a master to a substrate.
For example, the silicon-containing elastomer can be patterned
based on a master pattern, where the master and the elastomer
precursors are as described above.
[0060] Referring to FIGS. 2 and 3, the material used to make the
patterned silicon-containing elastomer film may be deposited on the
master in an amount sufficient to cover the entire master pattern,
or it may be deposited in an amount that fills the pattern in the
length and width dimensions but not in the height dimension.
Referring to FIG. 2, in the first situation a continuous film of
the elastomer 60 covers the entire master pattern 20. Once the
exposed continuous film surface is oxidized 70 and treated with an
adhesion control agent 72, a transfer pad material 80 may be
applied 74, in the form of a pre-solidified material or as an
elastomer precursor that then solidifies. Referring to FIG. 3, in
the second situation, the top of the master pattern 20 is exposed,
and the elastomer film 90 may be continuous or discontinuous. This
elastomer film and the exposed portions of the master can then be
subjected to oxidation conditions 70, followed by an adhesion
control agent 72. Deposition of an elastomer precursor 76 allows a
solid elastomer 82 to be formed that is removably attached to the
patterned elastomer film 90.
[0061] Referring to both FIGS. 2 and 3, once the film (60 or 90) is
removably attached to the transfer pad (80 or 82), the film and
transfer pad can be separated 40 from the master to expose the
other surface of the film (62 or 92). This exposed surface, which
has been patterned based on the master pattern, can then be
oxidized 42 and bonded 44 to a substrate 50, as described. The
substrate and the silicon-containing elastomer are thus
irreversibly bonded along the pattern as dictated by the master
pattern. When the transfer pad (80 or 82) is pulled away 78 from
the substrate, the removable attachment will be broken, leaving a
film (60 or 90) of elastomer material bonded to the substrate only
in regions where the elastomer surface has been oxidized and then
placed in contact with the substrate. If the removable attachment
is provided by a stimulus-responsive adhesive between the elastomer
and the transfer pad, the oxidation 70 and adhesion control
treatment 72 may be substituted with a deposition of the
stimulus-responsive adhesive. Also, once the pattern has been
oxidized 42 and irreversibly bonded 44, the adhesive is subjected
to appropriate conditions to sufficiently reduce the strength of
attachment between the transfer pad (80 or 82) and the film (60 or
90) before removing 78 the transfer pad from the substrate.
[0062] Since the elastomer and the substrate are irreversibly
bonded in the shape of the pattern, the residual film on the
substrate retains this pattern. For patterned films formed by
covering the master with a continuous film, the pattern will be a
closed pattern, with spaces bounded on all sides by the substrate
and the elastomer film. In one example, these spaces form empty
channels which may be discrete, or which may be interconnected. For
patterned films formed by leaving the top of the master pattern
exposed, the pattern will be an open pattern containing exposed
regions of the substrate.
[0063] The use of a bulk PDMS transfer pad for the elastomer film
during the pattern transfer enables microfabrication of structures
not previously accessible, including discrete open-form patterns.
Furthermore, this method can transfer patterns with excellent
precision and can also allow for registration of elastomer patterns
with other substrate features, since elastomeric films can be
readily manipulated. The film thickness can be controlled over a
very wide range, and is not limited in pattern sizes, array sizes,
or line widths that can be reproduced. The flexibility of the
pattern and the transfer pad also allow for patterning on
non-planar substrates. For example, patterns can be formed on
concave or convex surfaces, such as lenses.
[0064] The pattern transfer methods of the present invention allow
the deposition of precisely designed polymer thin-films with a
remarkable range of feature sizes. Minimum feature sizes in these
patterns may be less than 1,000 micrometers. Preferably, minimum
feature sizes are from 1 nanometer to 500 micrometers, and more
preferably from 10 nanometers to 100 micrometers. For closed form
patterns covered by a silicon-containing elastomeric membrane, the
top membrane layer may have a thickness from multiple millimeters
to the order of nanometers. Preferably, the top layer thickness is
from 500 micrometers to 100 nanometers, and more preferably from
100 micrometers to 500 nanometers.
[0065] Designs can be formed which may be open or closed, three
dimensionally patterned structures, and which may be continuous or
discontinuous. This technique may be used for a variety of soft
lithographic applications, including the formation of microfluidic
membranes and patterned etch resists.
EXAMPLES
[0066] Polydimethylsiloxane (PDMS) precursor was obtained from DOW
CORNING (Midland, Mich.) as SYLGARD 184. Boron doped silicon wafers
(<100>) were obtained from SILICON SENSE, INC. (Nashua,
N.H.). (Tridecafluoro-1,1,2,2-tetrahydrooctyl)trichlorosilane
(TDTS) was obtained from GELEST (Morrisville, Pa.). Fluorescein and
all solvents were obtained from ALDRICH (Milwaukee, Wis.).
Rhodamine B, sulfuric acid, hydrogen peroxide 30% were obtained
from FISHER (Springfield, N.J.). Common solvents were also obtained
from Fisher.
[0067] Silicon oxides were grown on silicon wafers under an ambient
atmosphere by heating them to around 800.degree. C. for several
hours to give a .about.2500 .ANG. thick oxide layer. An apparatus
employing a low-pressure mercury lamp (BHK, Claremont, Calif.) at
173 microwatts per square centimeter (.mu.W/cm.sup.2) was used as a
UV source, and laboratory jacks were used to hold samples within a
few millimeters of the bulb. Masters were produced as described in
Deng et al., Anal. Chem. 73:3176-3180 (2000) and in Deng et al.,
Langmuir 15:6575-6581 (1999). Contact photolithography was used to
make master patterns by patterning either AZ 5214 (CLARIANT,
Sommerville, N.J.) or SU-8 5 (MICROCHEM, Newton, Mass.)
photoresists, using 5080 dpi transparencies as an exposure mask.
Solvents used in processing the samples were of analytical grade or
higher and used without purification.
[0068] Optical micrographs were recorded using an OLYMPUS BH-2
optical microscope (OLYMPUS AMERICA, Melville, N.Y.) with PANASONIC
GP-KR222 digital color camera (PANASONIC USA, Seacaucus, N.J.).
Electron micrographs were recorded using either a ZEISS DSM 960
(CARL ZEISS, INC., Thornwood, N.Y.) or HITACHI S4700 (HITACHI
AMERICA, Tarrytown, N.Y.) scanning electron microscope (SEM). For
the SEM samples, 6 nm of palladium/gold alloy was sputtered on them
prior to examination to facilitate imaging. Fluorescent images were
recorded using an OLYMPUS PROVIS AX70 optical microscope with an
OLYMPUS UMWIB dichroic mirror assembly. This set-up using a 100 W
Hg arc lamp to send excitation through a band-pass filter (470-505
nm) to excite a sample filled with a 0.01 mM fluorescein solution
at pH 12. The emission from the sample then passes though a
high-band pas filter (>515 nm) for capture by an ASAHI PENTAX
K100 35 mm camera (PENTAX, Denver, Colo.) using KODAK COLOR WATCH
film (EASTMAN KODAK, Rochester, N.Y.). All images shown are
unprocessed. Surface feature heights were determined by surface
profilometry using a SLOAN DEKTAK.sup.3 ST (available from VEECO
INSTRUMENTS, Histon, Cambs, United Kingdom).
Example 1
Sample Preparation and Adhesive Treatment
[0069] PDMS molds and stencils were prepared as recommended by DOW
CORNING in the SYLGARD 184 kit by mixing the oligomer and initiator
in a 10:1 ratio. The recommended procedure was modified by reducing
the pressure (50 torr) at room temperature for several minutes with
a vacuum oven to remove entrained gas bubbles. The prepolymer
mixture was cast onto a master, and, after waiting 10 min for the
mixture to level, the mixture was cured at 70.degree. C. for two
hours. The patterned PDMS elastomer was then extracted from the
master, washed with ethanol, and dried under a stream of high
purity nitrogen. Substrates were treated prior to pattern transfer.
Silcon, thermally grown oxides, and quartz substrates were rinsed
with hexanes and ethanol, dried with nitrogen, and exposed to UVO
for 15 min prior to use. Glass slide substrates were cleaned in
piranha (3:1H.sub.2SO.sub.4: hydrogen peroxide 30%) for 5 min,
rinsed thoroughly with deionized water, and dried under a stream of
nitrogen. PDMS substrates were prepared by exposing the surface to
UVO for 20 min and then waiting for 5-10 min before rinsing the
surface with ethanol, and drying with nitrogen.
[0070] To irreversibly bond the silicon-containing elastomer to the
substrate, the patterned surface of the PDMS was modified by
exposing it to the ultraviolet lamp for 150 seconds. The modified
surface was then brought immediately into contact with the cleaned
substrate. While maintaining contact, the sample was heated in an
oven at 70.degree. C. for a minimum of 20 min.
Example 2
Patterning Using Irreversible Attachment
[0071] This patterning procedure follows from the bonding steps
described above. After inducing adhesion between a molded PDMS
elastomer and a silcon substrate, the elastomer pattern was
transferred by using tweezers to grip one of the corners of the
bulk of the elastomer. The bulk of the elastomer was then
physically peeled off the substrate to leave a PDMS film of the
pattern.
[0072] FIGS. 4a-c show two examples of PDMS patterns with very
different sizes and design rules that were created in this way. The
pattern shown in FIG. 4a was made by transferring PDMS lines 400 to
a planar silicon substrate. The origin of this pattern was a master
of coplanar lines that were 15 .mu.m wide, with a depth of 1.5
.mu.m and a line spacing of 20 .mu.m. The image here reveals the
cohesive failure caused by peeling the stamp off in a direction
parallel to the lines, leading to a failure in the stamp near the
regions where the surface features join the bulk of the PDMS. This
catastrophic failure in the polymeric material led to necking of
the elastomer, which distorted the shape of the original
rectilinear contours of the stamp's structures. It is notable that,
in the profilometry data shown in FIG. 4b, the deposited lines
shared a uniformity of feature heights and spacing.
[0073] In FIG. 4c, a pattern having a larger line-width but with
the same amount of PDMS surface coverage as the pattern in FIG. 4a,
required a larger force to peel the elastomer from the substrate.
This pattern was based on contoured 180 .mu.m lines 410 with 180
.mu.m line-widths, a depth of 8.6 .mu.m, and a pitch of one. The
stamp was peeled off in a direction perpendicular to the lines. The
pattern is precisely reproduced at the elastomer-substrate
interface, although overhanging portions were also formed.
[0074] Examples of small feature patterning with PDMS are also
shown in FIGS. 5a-c. FIG. 5a shows a set of lines 500 1 .mu.m thick
with a pitch of one, which was patterned by this method. This
pattern has a well-defined height profile, and the line heights are
well centered on a sub-micron level across the array. FIG. 5b shows
a 2.5.times.2.5 cm pattern derived from a master having of a square
array of holes, providing PDMS circles 510 2 .mu.m in diameter and
1.5 .mu.m deep, with a 2.7 .mu.m center-to-center separation. No
thinning of the PDMS below a 10 nm thickness was observed, and this
thickness permits the pattern to be used as a resist for silicon
processing by both wet etching and reactive ion etching. This same
pattern is shown with a larger field of view in FIG. 5c. It is
remarkable that very few defects are seen in the entire 6.25
cm.sup.2 area of the pattern.
[0075] These results clearly show that this method can produce PDMS
structures with micron scale features sizes over very wide
substrate areas with few gross defects. In fact, sub-micron design
rules should be easily accommodated by this method as well.
Example 3
Patterning by Removable and Irreversible Attachment
[0076] This patterning procedure involves the formation of a
well-defined layer of PDMS that is bound to a transfer pad layer
that has specifically engineered release properties. The procedure
used for either open patterning or closed patterning is identical
except for the limits adopted in the initial spin-casting of the
prepolymer mixture onto the master. The height of the features on
the master is known before the prepolymer is deposited, and the
amount of prepolymer used can be adjusted to provide for open
patterns or closed patterns. For open patterns, the PDMS prepolymer
was deposited in an amount such that the top of the mixture was
below the feature height of the master. For closed patterns, the
prepolymer was deposited in an amount such that the top of the
mixture was above the feature height of the master. After
spin-casting of the PDMS prepolymer, both types of decals were
cured at 70.degree. C. for 30 min.
[0077] The PDMS thin-film was then modified for reversible
attachment by exposing the film, while still on the master, to UVO
for 3 min, holding it only a few millimeters from the UV source.
The film was then placed in a dry atmosphere container with an open
vial of (tridecafluro-1,1,2,2-tet- rahydroctyl) trichlorosilane
(TDTS) at room temperature for 20 min, and was then covered with an
additional, thicker layer of the PDMS prepolymer which was cured in
place at 70.degree. C. for 2 hrs. The composite replica was
extracted from the master using a scalpel to cut around the
pattern's edge. The master was reusable for further patterning.
Using the substrate and stamp preparation described in Example 2,
irreversible adhesion was induced between the two by exposing the
patterned thin-film surface to UVO for 150 s, and placing the stamp
in contact with the substrate during curing at 70.degree. C. for
twenty minutes. In the last step, the transfer pad layer is easily
removed at a remote corner with tweezers to uncover the decal.
[0078] FIGS. 6a-d illustrate a variety of continuous, open form
PDMS patterns. Such designs are obtained by spin casting the first
application of the PDMS prepolymer below the height of the features
on the master (see FIG. 3). The silicon supported structures shown
in FIG. 6a, a continuous open form pattern of lines 600 that were 5
.mu.m in width with a pitch of one, were deposited by diluting PDMS
prepolymer 4:1 with toluene and spin-casting this mixture to a
thickness of 600 nm on a master with 5 .mu.m high features. The
structure shown in FIG. 6b was produced by spin-casting the PDMS
prepolymer to a thickness of 2.8 .mu.m on a master containing
circular posts that were 5 .mu.m tall and 10 .mu.m wide, to form a
pattern having 10 .mu.m wide circular holes 610. The pattern 620 on
a thermal oxide substrate, shown in FIG. 6c, used a prepolymer cast
to a thickness of 8 .mu.m on a master bearing features 13 .mu.m
tall. Finally, the composite set of PDMS lines shown in FIG. 5d
illustrates a set of continuous, open form 70 .mu.m wide lines 630
with 20 .mu.m spacings, which were deposited perpendicularly upon
an identical set of lines 640 previously deposited on silicon. Each
level used PDMS lines that were 8 .mu.m thick.
[0079] Examples of the design flexibility possible with this method
are also shown in FIGS. 7a-c. Each of these non-continuous patterns
was cast to around 8 .mu.m on masters with feature heights
averaging 13 .mu.m. FIG. 7a is an example of symbols 700 and 710
printed at a font size of 8, which makes each thin-film pattern
about 1 mm.sup.2. This example demonstrates that elastomer film
patterns can be released easily even when they incorporate very
large areas of physical contact between the film and the substrate.
The structures 720, 722, 724, and 726 shown in FIG. 7b were
generated from a pattern derived from rectangles 725 that were 210
.mu.m long and 50 .mu.m wide, but with a range of spacings. The
pattern shown in FIG. 7c demonstrates patterning of a range of
features sizes and pitches in a single complex pattern. Square
arrays of four 30 .mu.m.sup.2 squares 730 on 20 .mu.m centers
interpenetrates a larger square array of 120.times.140 .mu.m
rectangles 740 spaced by 420 .mu.m centers.
[0080] FIGS. 8a-c illustrate a variety of continuous, closed form
PDMS patterns, obtained by spin casting the first application of
the PDMS prepolymer above the height of the features on the master
(see FIG. 2). The pattern shown in FIG. 8a was derived from a PDMS
prepolymer deposited onto a master for a film thickness of 37
.mu.m. Since the master's features were only 12 .mu.m tall, the
patterned is an interpenetrating, square array on 400 .mu.m centers
of 75 .mu.m diameter cylindrical 800 and 40.times.10 .mu.m
cross-shaped 810 cavities, all which are sealed under a 25 .mu.m
thick PDMS membrane. The examples shown FIGS. 8b and c were made
from the same masters used to produce the patterns in FIGS. 6a and
b respectively, except that the film was cast to a thickness of 7
.mu.m, covering the 5 .mu.m features of the master. These patterns
have 5 .mu.m empty channels 820 with a pitch of 1 and a rectangular
array of 10 .mu.m holes 830 with centers separated by 20 .mu.m
vertically and 30 .mu.m horizontally, all covered by 2 .mu.m thick
membrane. These examples demonstrate remarkable design tolerances
and capabilities for wide area patterning. The essentially defect
free structures shown in FIGS. 8b and c are particularly promising
for sensor applications based on microfluidic devices.
Example 4
Microfluidic Devices
[0081] Using a master with a continuous pattern of photoresist with
a height of 12 micrometers (.mu.m), freshly initiated PDMS
pre-elastomer was spun-coat onto the master at 3.times.10.sup.3 rpm
for 40 seconds. The film was cured and treated with UVO and TDTS
before being covered with a second layer of PDMS pre-elastomer as
in Example 3. After the second layer had been cured, a metal
leather-punch was used to form a hole in the PDMS structure,
intersecting a single pre-designed capillary removed from the
master. The patterned PDMS surface was irreversibly sealed to
silicon. A 0.01 mM solution of fluorescein was syringed into the
hole to form a reservoir of the dye. Using capillary outgas
technique, the capillaries were filled with the fluorescein by
applying vacuum for 1 min. When the vacuum was released, the
capillaries filled either spontaneously or with mild agitation. A
vertical cut was then made between the reservoir and the pattern,
taking precautions not to cut so deep as to sever the capillary
extending to the filled pattern. The PDMS transfer pad layer was
peeled away, leaving a layer over the section containing the
reservoir to prevent evaporation or reverse capillary action.
[0082] Additional levels were added to the microfluldic system by
replicating these steps and transferring the patterned film to the
top of the previously deposited film. The thicknesses of the
elastomers covering any channel systems created by this method were
found to be easily designed to range from essentially bulk
dimensions (mm) to as little at 1 .mu.m without tearing. The
registration of the layers was followed using an optical
microscope, and errors were corrected prior to the last heat
treatment that provided the final binding.
[0083] The examples presented in FIGS. 9a-c highlight patterns that
allow for fabrication of membrane microreactors. FIG. 9a shows a
portion of a large PDMS channel system with features varying from
20 .mu.m wide empty channels 900 to 600 .mu.m.sup.2 square sections
910. The elastomer pattern used to construct this channel system
had a height of 22 .mu.m. Since the master's features were 12 .mu.m
high, this complex channel system is sealed by a membrane that is
only 10 .mu.m thick. FIG. 9b is an example of two identical
microfluidic systems in a stacked configuration, with the bottom
capillary system 920 filled with fluorescein and the top 930 filled
with rhodamine B. Both systems were cast to a thickness of 23 .mu.m
over a 13 .mu.m height profile master, and accordingly a permeable
membrane with a thickness of only 10 .mu.m separated the fluids in
the two levels. The grid's channels were 75 .mu.m wide with
intersections spaced on 240 .mu.m centers. Because of the device's
large size, FIG. 9b is a composite of several micrographs combined
to image the channels. FIG. 9c is a scanning electron micrograph
(SEM) of a cross-section of a similar stacked channel system having
75 .mu.m wide channels 940 with a height of 12 .mu.m, covered with
a 20 .mu.m thick membrane 950.
Example 5
Silicon Pixel Fabrication
[0084] Low-temperature reactive magnetron sputtering (RMS) was used
to deposit amorphous silicon on glass slides, planar quartz
substrates, and on piano-convex lenses. The film was deposited
under argon at 1.5 mtorr for 20 minutes without heating, and
surface profilometry indicated a film thickness of .about.4000
.ANG.. SYLGARD 184 was allowed to cure on a planar master to form
an elastomeric mold of its master, as in Example 2. The elastomer
was removed, and its patterned surface was modified by exposing it
to UVO for 150 seconds and then placed immediately in contact with
a pre-cleaned silicon-coated substrate. The substrate and the
elastomer were then heated between 60-70.degree. C. for 20 minutes.
The PDMS was peeled off, leaving a patterned thin-film based on the
areas of contact (FIG. 10a).
[0085] The substrate bearing the PDMS pattern was then etched in a
parallel plate plasma chamber at 50 watts under 200 mTorr with 20
sccm of sulfur hexafluoride for 11 minutes to produce silicon
pixels covered with PDMS resist 102 (FIG. 10b). The potential
during etching was approximately 12V. The PDMS film was then
removed by submerging the substrate for 30 s in 1M tetra-butyl
ammonium fluoride (TBAF) in tetrahydrofuran (THF) to yield
amorphous silicon pixels 104. Buffered HF (6:1 ammonium
fluoride:HF) could also be employed, typically for 1 minute
following etching to clean the surface and to differentiate the
silicon and silicon oxide layers for SEM evaluation. The area
patterned was 1 cm.sup.2, but may be larger if desired.
Approximately 5 nm of gold was sputtered onto the substrate to
facilitate SEM imaging.
[0086] As imaged by SEM (FIG. 10), the PDMS film deposited on a
planar quartz substrate had features approximately two micrometers
in diameter and having varying thicknesses and morphologies. In an
effort to obtain anisotropic etching conditions, the chamber
pressure was lowered to 30 mTorr, resulting in pixels with better
side-wall ratios but with a loss in shape control. This decrease in
chemical selectivity was most likely due to increased physical
etching of the resist. In another attempt, 0.5 sccm of oxygen was
added during the etching process in an attempt to passivate the
sidewalls through oxidation. This small amount of oxygen oxidized
the PDMS as expected, but also altered the etch characteristics,
again leading to a loss of shape.
[0087] Referring to FIG. 10, the pattern features began as circular
films 100 of 2 .mu.m in diameter and maintained that diameter at
the base throughout the etching process. The tops of the pixels 104
had an average diameter of 1.6 .mu.m, since the side-wall ratio was
only slightly better than unity. However this still gave an edge
resolution of about 2000 .ANG., together with retention of shape
and preservation of the silicon pixel's level top.
[0088] The removal of the PDMS film subsequent to patterning is
important to most subtractive lithographic schemes. In the case of
patterned PDMS films, 1 M TBAF/THF is capable of dissolving PDMS
without any apparent effects on amorphous silicon or glass. This
protects the integrity of the film and its support. Buffered HF was
only used to illustrate the separation of silicon and glass in SEM
imaging, but the PDMS film has not been able to resist this etchant
for longer than a few minutes.
[0089] Silicon pixel arrays were also formed on non-planar
substrates. A quartz lens was coated with a 4,000 .ANG. thick layer
of amorphous silicon, followed by a PDMS resist pattern on the
amorphous silicon, as described for the planar substrates
illustrated in the examples of FIGS. 10a-d. Amorphous silicon
pixels were formed after etching and after removal of the PDMS
resist.
Example 6
Additive Lithography Of Metals
[0090] The patterns formed by the decal transfer methods, using
irreversible attachment or using irreversible attachment together
with removable attachment, can be used for additive lithography to
deposit patterns of other materials onto a substrate. A PDMS
pattern was irreversibly attached to a silicon substrate. The
pattern was formed using the same master used to form the pattern
shown in FIG. 8a, but depositing PDMS prepolymer such that an
elastomer thickness of 5 .mu.m was obtained. Removable attachment
of this patterned PDMS layer to a transfer pad layer of PDMS,
followed by irreversible attachment of the pattern to a silicon
substrate and subsequent removal of the transfer pad layer (as in
Example 3), provided a pattern containing cylindrical holes 75
.mu.m diameter and arrayed on 400 .mu.m centers; and these
cylindrical holes were interpenetrated with 40.times.10 .mu.m
cross-shaped holes. Deposition of a 40 nm thick layer of a 60%
palladium/40% gold alloy, followed by removal of the PDMS pattern,
provided a metal pattern of circles and crosses on silicon. This
technique was combined with the non-planar substrate patterning
described in Example 5 to produce a metal pattern on a curved
quartz lens. The pattern was formed of 1,000 .ANG. thick gold, with
a titanium adhesion layer between the quartz and the gold.
Example 7
Patterning on Other Substrates
[0091] The patterning techniques and the resultant additive
lithography, subtractive lithography, and microfluidic fabrications
already described and exemplified may also be applied to a variety
of other substrates. A PDMS resist was formed on a 1.4 .mu.m thick
thermal oxide substrate. This resist contained circular holes
having 75 .mu.m diameters, and the thermal oxide was etched with a
carbon tetrafluoride/oxygen plasma, followed by removal of the PDMS
layer by treatment with 1M TBAF/THF. These same techniques were
used with a 0.8 .mu.m thick thermal oxide substrate to produce a
PDMS resist and subsequent patterned oxide.
[0092] A PDMS pattern was also formed on a gold substrate. For this
gold/elastomer bonding, (thiolpropyl)trimethoxysilane was deposited
between the gold and the oxidized elastomer before the gold was
contacted with the oxidized elastomer and irreversibly bonded. The
(thiolpropyl)trimethoxysilane can be applied to the oxidized
elastomer, or it can be applied to the gold surface.
[0093] A PDMS pattern was also applied to a polystyrene substrate.
The polystyrene substrate in this example was treated with an
oxygen plasma before it was contacted with the oxidized elastomer
and irreversibly bonded.
[0094] Although the invention has been described and illustrated
with reference to specific illustrative embodiments thereof, it is
not intended that the invention be limited to those illustrative
embodiments. Those skilled in the art will recognize that
variations and modifications can be made without departing from the
true scope and spirit of the invention as defined by the claims
that follow. It is therefore intended to include within the
invention all such variations and modifications as fall within the
scope of the appended claims and equivalents thereof.
* * * * *