U.S. patent application number 11/053616 was filed with the patent office on 2005-09-15 for heat dissipation module with heat pipes.
This patent application is currently assigned to Quanta Computer Inc.. Invention is credited to Chan, Hung-Chou, Chen, Chao-Jung, Chuang, Chi-Hung, Hwang, Wen-Liang.
Application Number | 20050199377 11/053616 |
Document ID | / |
Family ID | 34919175 |
Filed Date | 2005-09-15 |
United States Patent
Application |
20050199377 |
Kind Code |
A1 |
Chuang, Chi-Hung ; et
al. |
September 15, 2005 |
Heat dissipation module with heat pipes
Abstract
A heat dissipation module including heat pipes. The heat
dissipation module includes a seat with grooves, heat pipes and two
fin assemblies. The heat pipes are secured in the grooves at a
first end and extend at the second end thereof. A first fin
assembly with parallel first fins is soldered to the seat, covering
the grooves and heat pipes. A second fin assembly with parallel
second fins is secured to the cantilevered end of the heat
pipes.
Inventors: |
Chuang, Chi-Hung; (Hsin
Chuang City, TW) ; Hwang, Wen-Liang; (Hsin Chuang
City, TW) ; Chen, Chao-Jung; (Taipei, TW) ;
Chan, Hung-Chou; (Chang Hwa, TW) |
Correspondence
Address: |
THOMAS, KAYDEN, HORSTEMEYER & RISLEY, LLP
100 GALLERIA PARKWAY, NW
STE 1750
ATLANTA
GA
30339-5948
US
|
Assignee: |
Quanta Computer Inc.
|
Family ID: |
34919175 |
Appl. No.: |
11/053616 |
Filed: |
February 8, 2005 |
Current U.S.
Class: |
165/104.33 |
Current CPC
Class: |
G06F 1/20 20130101; H01L
23/427 20130101; F28F 2275/04 20130101; H01L 2924/0002 20130101;
H01L 2924/0002 20130101; H01L 2924/00 20130101; F28F 1/32 20130101;
F28D 15/02 20130101 |
Class at
Publication: |
165/104.33 |
International
Class: |
F28F 007/00 |
Foreign Application Data
Date |
Code |
Application Number |
Mar 11, 2004 |
TW |
93106452 |
Claims
What is claimed is:
1. A heat dissipation module comprising: a seat with a plurality of
grooves, contacting a heat source; a first fin assembly with a
plurality of first fins disposed on the seat, covering the grooves;
a second fin assembly with a plurality of second fins disposed on a
side of the first fin assembly; and a plurality of heat pipes, each
heat pipe comprising a first end disposed in the grooves, covered
by the first fin assembly, and a second end extending from the
grooves and passing through the second fin assembly.
2. The heat dissipation module as claimed in claim 1, wherein the
first fins are parallel.
3. The heat dissipation module as claimed in claim 1, wherein the
second first fins are parallel.
4. The heat dissipation module as claimed in claim 1, wherein the
first fins are perpendicular to the heat pipes.
5. The heat dissipation module as claimed in claim 1, wherein the
second fins are perpendicular to the heat pipes.
6. The heat dissipation module as claimed in claim 1, wherein the
heat pipes are soldered in the grooves.
7. The heat dissipation module 10 as claimed in claim 1, wherein
the first fin assembly is soldered on the seat.
8. The heat dissipation module as claimed in claim 1, wherein the
second fin assembly is soldered to the second ends of the heat
pipes.
9. The heat dissipation module as claimed in claim 1, wherein the
seat, the heat pipes, the first fin assembly and the second fin
assembly comprise copper or aluminum.
10. A heat dissipation module comprising: a seat; a plurality of
heat pipes disposed on the seat and extending from the seat,
forming a plurality of cantilevered ends; a first fin assembly with
a plurality of first fins, disposed on the seat and covering the
heat pipes; and a second fin assembly with a plurality of second
fins, secured at the cantilevered ends of the heat pipes.
11. The heat dissipation module as claimed in claim 10, wherein the
first fins are parallel.
12. The heat dissipation module as claimed in claim 10, wherein the
second first fins are parallel.
13. The heat dissipation module as claimed in claim 10, wherein the
first fins are perpendicular to the heat pipes.
14. The heat dissipation module as claimed in claim 10, wherein the
second fins are perpendicular to the heat pipes.
15. The heat dissipation module as claimed in claim 10, wherein the
heat pipes are soldered on the seat.
16. The heat dissipation module as claimed in claim 10, wherein the
first fin assembly is soldered on the seat.
17. The heat dissipation module as claimed in claim 10, wherein the
second fin assembly is soldered to the cantilevered ends of the
heat pipes.
18. The heat dissipation module as claimed in claim 10, wherein the
seat, the heat pipes, the first fin assembly and the second fin
assembly comprise copper or aluminum.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a heat dissipation module,
and in particular to a heat dissipation module using heat pipes to
increase heat transfer efficiency thereof.
[0003] 2. Description of the Related Art
[0004] Presently, CPUs for conventional barebone servers consume
excessive power and generate considerable heat. Space reserved
inside the server for a heat dissipation module, however, is
limited.
[0005] Heat sinks are a common component in conventional heat
dissipation modules. Conventional heat sinks comprise aluminum
extrusion type or copper adhering type, mounted directly on a chip
or CPU and utilize the flow provided by preset passages or fans
mounted thereon to dissipate heat. In order to increase stability
of conventional severs, heat sinks must continue to dissipate heat
even when some of system fans malfunction. Hence, there is a need
for a better heat sink with higher heat dissipation efficiency for
conventional barebone servers.
SUMMARY OF THE INVENTION
[0006] Accordingly, an object of the invention is to provide a heat
sink with higher heat dissipation efficiency for conventional
barebone servers.
[0007] Accordingly, the present invention provides a heat
dissipation module with heat pipes. The heat dissipation module
comprises a seat with grooves, heat pipes and two fin assemblies.
The seat is disposed directly on a heat source. The first fin
assembly with parallel first fins is disposed on the seat, covering
the grooves. The second fin assembly with parallel second fins is
disposed on a side of the first fin assembly. Each heat pipe
comprises a first end disposed in the grooves, covered by the first
fin assembly, and a second end extending from the grooves and
passing through the second fin assembly.
[0008] In a preferred embodiment, the heat pipes are soldered in
the grooves, perpendicular to the first and second fins. The first
fin assembly is soldered on the seat. The second fin assembly is
soldered on the cantilevered ends of the heat pipes. The seat, heat
pipes, first fin assembly and second fin assembly comprise copper
or aluminum.
[0009] The heat dissipation module of the present invention
utilizes heat pipes to transfer heat from a first fin assembly to
an additional second fin assembly, increasing the effective area of
the heat dissipation module.
[0010] Furthermore, the additional second fin assembly can be
arranged in a residual area of a system or a position with better
dissipation efficiency. The first and second fin assemblies are
connected by heat pipes, thus improving heat dissipation efficiency
of the heat dissipation module and effectively utilizing the
limited space provided in a conventional sever.
[0011] A detailed description is given in the following embodiments
with reference to the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] The present invention can be more fully understood by
reading the subsequent detailed description and examples with
references made to the accompanying drawings, wherein:
[0013] FIG. 1 is an exploded view of a heat dissipation module of
present invention; and
[0014] FIG. 2 is a schematic view of the heat dissipation
module.
DETAILED DESCRIPTION OF THE INVENTION
[0015] FIG. 1 is an exploded view of a heat dissipation module of
the present invention. In FIG. 1, the heat dissipation module 10
comprises a seat 20, heat pipes 24 and two fin assemblies 30, 40.
The seat 20 is a metal plate directly disposed on a heat source 2,
such as a CPU, graphic chip or other chips. The seat 20 comprises a
plurality of parallel grooves 22 with width and depth similar to
the bore diameter of the heat pipes 24. The heat pipes 24 are
hollow elliptic pipes with low-pressure heat conductive liquid
therein, transferring heat by convection. The heat pipes 24 are
secured in the grooves 22 at one end and protrudes from the grooves
22.
[0016] The first fin assembly 30 is disposed on the seat 20,
covering the grooves 22 and heat pipes 24, and comprises a plate
32, a plurality of parallel first fins 34 and two fixing protectors
36. The first fins 34 are adhered or soldered on the plate 32. The
fixing protectors 36 prevent damage to the edges of the first fins
34.
[0017] The second fin assembly 40 comprises a plate 42, a plurality
of parallel second fins 44 and two fixing protectors 46. The second
fins 44 are adhered or soldered on the plate 42. The fixing
protectors 46 prevent damage to the edges of the second fins 44.
Each second fin 44 has through holes 48 for access to the
cantilevered ends of the heat pipes 24, such that the second fin
assembly 40 can be soldered thereon.
[0018] FIG. 2 shows the heat dissipation module of the invention.
In FIGS. 1 and 2, when fabricating the heat dissipation module 10,
the heat pipes 24 are first soldered in the grooves 22, and solder
is applied on the surface of the seat 20 and the cantilevered ends
of the heat pipes 24. The first and second fin assemblies 30, 40
are disposed on the seat 20 and the cantilevered ends of the heat
pipes 24. The entire module 10 is place in an oven, securing the
first and second fin assemblies 30, 40 thereon by baking. After
fabrication, the heat dissipation module 10 is fixed on a printed
circuit board 1, the bottom surface of the seat 20 contacting the
chip 2, by the screws 28 passing through the openings 26 thereof.
Thus, the heat dissipation module 10 can dissipate heat generated
by the chip 2.
[0019] In order to increase the heat dissipation efficiency, the
seat 20, heat pipes 24, first and second fin assemblies 30 and 40
comprise copper or aluminum. Conventional heat dissipation paste
can be applied between the chip 2 and the seat 20 and in the
grooves 22 to facilitate heat conduction. The heat pipes 24 are
perpendicular to the first fins 34 and second fins 44, preventing
obstruction of provided flow.
[0020] Furthermore, the heat pipes 24 can be directly soldered on
the top surface of the seat 20. The plate 20 and the first fins 34
comprise notches, such that the first fin assembly 30 can be
secured on the seat 20 without forming grooves 22.
[0021] The additional second fin assembly 40 can be arranged in a
residual area of a system or a position with better dissipation
efficiency. The first and second fin assemblies 30 and 40 are
connected by heat pipes 24, transferring heat, such that heat
dissipation efficiency of the heat dissipation module 10 can be
improved, and space inside a conventional severs can be utilized
effectively.
[0022] The heat dissipation module 10 of present invention utilizes
heat pipes 24 to transfer heat from the first to the second fin
assembly, thus increasing heat dissipation efficiency and stability
of conventional barebone servers.
[0023] While the invention has been described by way of example and
in terms of the preferred embodiments, it is to be understood that
the invention is not limited to the disclosed embodiments. To the
contrary, it is intended to cover various modifications and similar
arrangements (as would be apparent to those skilled in the art).
Therefore, the scope of the appended claims should be accorded the
broadest interpretation so as to encompass all such modifications
and similar arrangements.
* * * * *