U.S. patent application number 10/798073 was filed with the patent office on 2005-09-15 for laminated fin heat sink for electronic devices.
Invention is credited to Gonzales, Christopher A., Leija, Javier.
Application Number | 20050199368 10/798073 |
Document ID | / |
Family ID | 34920206 |
Filed Date | 2005-09-15 |
United States Patent
Application |
20050199368 |
Kind Code |
A1 |
Gonzales, Christopher A. ;
et al. |
September 15, 2005 |
Laminated fin heat sink for electronic devices
Abstract
A heat sink may transfer heat from electronic devices. A heat
conductive base may have integrally attached thereto a plurality of
parallel fins. The fins may be made up of two sheets of material.
One sheet may be a metal having significant structural integrity
and the other sheet of material may be a pyrolytic graphite
material having excellent heat transfer characteristics. The two
layers may be integrally bonded together.
Inventors: |
Gonzales, Christopher A.;
(Chandler, AZ) ; Leija, Javier; (Chandler,
AZ) |
Correspondence
Address: |
TROP PRUNER & HU, PC
8554 KATY FREEWAY
SUITE 100
HOUSTON
TX
77024
US
|
Family ID: |
34920206 |
Appl. No.: |
10/798073 |
Filed: |
March 11, 2004 |
Current U.S.
Class: |
165/80.3 |
Current CPC
Class: |
H01L 21/4882 20130101;
H01L 2924/0002 20130101; F28F 13/18 20130101; F28F 3/02 20130101;
H01L 23/3672 20130101; H01L 2924/0002 20130101; H01L 2924/00
20130101; F28F 21/02 20130101; F28F 2275/122 20130101 |
Class at
Publication: |
165/080.3 |
International
Class: |
F28F 007/00 |
Claims
What is claimed is:
1. A method comprising: forming a heat transfer fin of a laminate
of a metallic and a non-metallic layer, said metallic layer
providing structural integrity to the laminated fin.
2. (canceled)
3. The method of claim 1 including permanently securing said fin to
a heat conductive base using crimping.
4. The method of claim 1 including adhesively bonding said metallic
and non-metallic layers.
5. The method of claim 1 wherein forming a heat transfer fin
includes forming a fin of a laminate of a metallic and a pyrolytic
graphite material.
6. The method of claim 1 including forming the fin with an aspect
ratio higher than 20:1.
7. The method of claim 5 including forming the fin with an aspect
ratio of 60:1.
8. The method of claim 1 including securing heat transfer fin to an
integrated circuit.
9. The method of claim 8 including securing said heat transfer fin
to a microprocessor.
10. The method of claim 2 including forming the metallic and
non-metallic material of equal thicknesses.
11. A heat sink comprising: a heat sink fin including metallic and
non-metallic materials, said metallic material providing structural
integrity to said fin; and a conductive base, said fin secured to
said base.
12. (canceled)
13. The heat sink of claim 11 wherein said fin is crimped to said
base.
14. The heat sink of claim 11 wherein said metallic and
non-metallic materials are adhesively bonded.
15. The heat sink of claim 11 wherein said non-metallic material is
a pyrolytic graphite material.
16. The heat sink of claim 11 wherein the fin aspect ratio is
higher than 20:1.
17. The heat sink of claim 16 wherein the fin aspect ratio is
60:1.
18. The heat sink of claim 11 wherein said base is secured to an
integrated circuit.
19. The heat sink of claim 18 wherein said integrated circuit is a
microprocessor.
20. The heat sink of claim 11, said fin including a first sheet of
metallic material and a second sheet of non-metallic material, said
sheets being laminated together.
21. The heat sink of claim 20 wherein said first and second sheets
are of equal thicknesses.
22. An integrated circuit comprising: an integrated circuit chip;
and a heat sink secured to said chip, said heat sink including a
heat transfer fin of a laminate of metallic and non-metallic
material, said metallic material providing structural integrity to
said fin.
23. The circuit of claim 22 wherein said heat sink includes a
conductive base, and said fin is crimped to said base.
24. The circuit of claim 22 wherein said metallic and non-metallic
materials are adhesively bonded.
25. The circuit of claim 22 wherein said non-metallic material is a
pyrolytic graphite material.
26. The circuit of claim 22 wherein the fin aspect ratio is higher
than 20:1.
27. The circuit of claim 26 wherein the fin aspect ratio is
60:1.
28. The circuit of claim 22 wherein said heat sink includes a base
secured to said integrated circuit chip.
29. The circuit of claim 28 wherein said integrated circuit chip is
a microprocessor.
30. The circuit of claim 22 wherein said metallic and non-metallic
material are of equal thicknesses.
Description
BACKGROUND
[0001] This invention relates to removing heat from heat producing
electronic devices such as microprocessors.
[0002] In operation, electronic devices, including microprocessors,
tend to generate heat. Their performance may be adversely affected
by their temperature. Thus, it is advantageous to remove heat from
the integrated circuits as effectively as possible.
[0003] To this end, heat sinks are commonly attached to integrated
circuit packaging. These heat sinks may include fins and integrated
heat spreaders which transfer heat from the integrated circuit
packaging to the heat sink.
[0004] Existing heat sinks tend to be heavy, contributing to weight
of the overall electronic device. In some electronic devices,
including mobile devices, overall weight is an important
factor.
[0005] Thus, there is a need for ways to improve the heat transfer
from electronic devices.
BRIEF DESCRIPTION OF THE DRAWINGS
[0006] FIG. 1 is a partial, front elevational view of one
embodiment of the present invention in the course of
manufacture;
[0007] FIG. 2 is a partial, front elevational view of the
embodiment of FIG. 1 after further processing; and
[0008] FIG. 3 is a perspective view of one embodiment of the
present invention.
DETAILED DESCRIPTION
[0009] Referring to FIG. 1, a heat sink base 12 may be formed of
copper or other heat conducting material. The base 12 may have a
number of closely spaced fin receiving apertures 16. In one
embodiment, the fin receiving apertures 16 may have a downwardly
expanding, dovetail shape.
[0010] A heat sink fin 14b may include a metallic layer 18 and a
graphite or non-metallic layer 16. The non-metallic layer 16
provides good heat transfer characteristics at relatively lower
weight compared to metals. In other words, the layer 16 is lighter
than the layer 18 per unit of volume. The layers 16 and 18 may be
bonded together along the line 20.
[0011] In the illustrated embodiment, the layers 16 and 18 are of
equal thickness. One of the layers 16 or 18 may be thicker in some
embodiments.
[0012] In order to join the fin 14b to the base 12, crimping
forces, indicated by the arrows A and B, may be applied in one
embodiment. In other words, the heat sink fin 14b may be inserted
into the slot 16. Thereafter, the two opposed sides of the base 12
are compressed together causing the edges 17 to cut into and engage
the material of the fin 14b. To this end, it may be advantageous,
in some embodiments, that the material of the base 12 is harder
than the material used for the layer 16 or 18.
[0013] Referring to FIG. 2, the completed structure may include a
fin 14a engaged in a dovetail arrangement in the base 12.
Indentations 19 may be formed in the fin 14a caused by the base
material 12 crimping process.
[0014] The fins 14 may be made of a high conductivity metal and a
pyrolytic graphite material in some embodiments. The two material
sheets may be compressed together and held in place with a high
thermal conductivity adhesive along the bond line 20 to form a
laminated fin 14. The laminated fin 14 may then be permanently
attached to the heat sink base 12, for example, using the crimping
process illustrated in FIGS. 1 and 2. The laminated fin 14 is used
in place of the traditional solid metal fin, achieving improved
thermal performance and reduction in weight in some
embodiments.
[0015] The metal layer 18 provides structural integrity to the
laminated fin 14. An isotropic metal layer 18 may also act as a
medium to transfer heat to the surrounding air via forced
convection, as one example. In one embodiment, the layer 18 may be
aluminum.
[0016] The layer 16, which may be graphite, may spread the heat in
a more efficient manner than metal since layer 16 may have a
thermal conductivity value on the order of three times that of
solid metals. Since graphite material is non-isotropic, thermal
conductivity in one direction is significantly lower than in the
other two directions of heat transfer. As a result, heat may be
transferred effectively in the direction of the fin height and
length, but not so in the direction of fin thickness. However, this
is insignificant since the heat can still easily be transferred
through the relatively thin fin thickness.
[0017] The layer 16 may be in intimate contact with the base 12 to
improve the heat transfer through the laminated fin 14. To this
end, the laminate fin 14 may be permanently attached to the base
12.
[0018] In some embodiments of the present invention, graphite
material with advantageous heat transfer properties can be used in
a fin shape having relatively extended aspect ratios. Normally,
graphite material would not be sufficiently tough to be used in
such environments. However, the combination of graphite and metal
has both advantageous heat transfer properties and sufficient
structural integrity.
[0019] Referring to FIG. 3, the heat sink fins 14 may be attached
to a base 12 so that a large number of fins are arranged in close
proximity. The fins 14 may be rectangular in shape, in one
embodiment, with the long axis extending along and into the base
12. An electronic device 20, such as a microprocessor, may be
thermally coupled to the base 12. In some embodiments, thermal
interface materials may be utilized between the device 20 and the
base 12. In addition, an integral heat spreader may be applied
between the electronic device 20 and the base 12. In some
embodiments, the electronic device 20 may consist of an integrated
circuit enclosed within an integrated heat spreader.
[0020] In one embodiment of the present invention, the aspect
(height to thickness) ratio of the fins 14 may be higher than 20:1.
In one particularly advantageous embodiment, the aspect ratio may
be 60:1.
[0021] While the present invention has been described with respect
to a limited number of embodiments, those skilled in the art will
appreciate numerous modifications and variations therefrom. It is
intended that the appended claims cover all such modifications and
variations as fall within the true spirit and scope of this present
invention.
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