U.S. patent application number 10/787986 was filed with the patent office on 2005-09-01 for compact radiator for an electronic device.
Invention is credited to Wattelet, Jonathan P., Wilson, Michael J..
Application Number | 20050189096 10/787986 |
Document ID | / |
Family ID | 34886895 |
Filed Date | 2005-09-01 |
United States Patent
Application |
20050189096 |
Kind Code |
A1 |
Wilson, Michael J. ; et
al. |
September 1, 2005 |
Compact radiator for an electronic device
Abstract
A compact radiator for a coolant used in cooling an electronic
device, including inlet and outlet headers, a plurality of parallel
flat tubes defining coolant flow paths between the inlet and outlet
headers, and serpentine fins between adjacent tubes. The tubes have
a minor dimension in the range of 0.75 mm to 1.2 mm, and the fins
have a height in the range of 3 mm to 7 mm. Particularly
advantageously, extruded aluminum tubes have a minor dimension of
0.75 mm to 0.85 mm, the fin height of 3.0 mm to 3.25 mm, a tube
major dimension on the order of 28 to 32 times the tube minor
dimension, and a wall thickness of 0.15 mm to 0.25 mm.
Inventors: |
Wilson, Michael J.; (Racine,
WI) ; Wattelet, Jonathan P.; (Gurnee, IL) |
Correspondence
Address: |
WOOD, PHILLIPS, KATZ, CLARK & MORTIMER
500 W. MADISON STREET
SUITE 3800
CHICAGO
IL
60661
US
|
Family ID: |
34886895 |
Appl. No.: |
10/787986 |
Filed: |
February 26, 2004 |
Current U.S.
Class: |
165/152 ;
165/104.33; 257/E23.098 |
Current CPC
Class: |
H01L 2924/0002 20130101;
F28D 2021/0031 20130101; F28D 1/05375 20130101; F28D 1/05366
20130101; H01L 2924/0002 20130101; G06F 1/20 20130101; F28F 1/126
20130101; H01L 23/473 20130101; H01L 2924/00 20130101; G06F
2200/201 20130101 |
Class at
Publication: |
165/152 ;
165/104.33 |
International
Class: |
F28D 001/02 |
Claims
1. A compact radiator for a coolant used in cooling an electronic
device, comprising: first and second headers; an inlet for
receiving the coolant into said first header; an outlet for
discharging the coolant from one of said first and second headers;
a plurality of parallel flat tubes defining coolant flow paths
between said headers, said tubes having a minor dimension in the
range of 0.75 mm to 1.2 mm; and serpentine fins between adjacent
tubes, said fins having a height in the range of 3 mm to 7 mm.
2. The compact radiator of claim 1, wherein at least said first
header includes a baffle, whereby said flat tubes define multiple
passes for said coolant.
3. The compact radiator of claim 2, wherein said one of said first
and second headers is said first header, and said baffle is in said
first header.
4. The compact radiator of claim 1, wherein said flat tubes are
extruded aluminum.
5. The compact radiator of claim 1, wherein said minor dimension of
said tubes is in the range of 0.75 mm to 0.85 mm.
6. The compact radiator of claim 1, wherein said fin height is in
the range of 3.0 mm to 3.25 mm.
7. The compact radiator of claim 1, wherein the tube major
dimension is on the order of 10 to 40 times the tube minor
dimension.
8. The compact radiator of claim 7, wherein said tube major
dimension is on the order of 22 to 32 times the tube minor
dimension.
9. The compact radiator of claim 8, wherein: said minor dimension
of said tubes is in the range of 0.75 mm to 0.85 mm; and said fin
height is in the range of 3.0 mm to 3.25 mm.
10. The compact radiator of claim 8, wherein said tube major
dimension is on the order of 28 to 32 times the tube minor
dimension.
11. The compact radiator of claim 1, wherein said tubes have a wall
thickness in the range of 0.15 mm to 0.25 mm.
12. A compact radiator for a coolant used in cooling an electronic
device, comprising: first and second headers; an inlet for
receiving the coolant into said first header; an outlet for
discharging the coolant from one of said first and second headers;
a plurality of parallel flat tubes defining coolant flow paths
between said headers, said tubes having a minor dimension in the
range of 0.75 mm to 0.85 mm; and serpentine fins between adjacent
tubes, said fins having a height in the range of 3.0 mm to 3.25
mm.
13. The compact radiator of claim 12, wherein at least said first
header includes a baffle, whereby said flat tubes define multiple
passes for said coolant.
14. The compact radiator of claim 13, wherein said one of said
first and second headers is said first header, and said baffle is
in said first header.
15. The compact radiator of claim 12, wherein said flat tubes are
extruded aluminum.
16. The compact radiator of claim 12, wherein the tube major
dimension is on the order of 10 to 40 times the tube minor
dimension.
17. The compact radiator of claim 16, wherein said tube major
dimension is on the order of 22 to 32 times the tube minor
dimension.
18. The compact radiator of claim 17, wherein said tube major
dimension is on the order of 28 to 32 times the tube minor
dimension.
19. The compact radiator of claim 12, wherein said tubes have a
wall thickness in the range of 0.15 mm to 0.25 mm.
20. A compact radiator for an electronic device that rejects heat
to a coolant, comprising: first and second headers; an inlet for
receiving the coolant into said first header; an outlet for
discharging the coolant from one of said first and second headers;
a plurality of extruded aluminum parallel flat tubes each defining
a plurality of coolant flow paths between said headers, said tubes
having a minor dimension in the range of 0.75 mm to 0.85 mm and a
tube major dimension on the order of 22 to 32 times the tube minor
dimension; and serpentine fins between adjacent tubes, said fins
having a height in the range of 3.0 mm 3.25 mm.
21. The compact radiator of claim 20, wherein said tube wall
thickness is in the range of 0.15 mm to 0.25 mm.
22. An electronic device, comprising: at least one heat generating
processor chip; a compact radiator including first and second
headers; an inlet for receiving the coolant into said first header;
an outlet for discharging the coolant from one of said first and
second headers; a plurality of parallel flat tubes defining flow
paths between said headers, said tubes having a minor dimension in
the range of 0.75 mm to 1.2 mm; and serpentine fins between
adjacent tubes, said fins having a height in the range of 3 mm to 7
mm; a liquid coolant path defined from said radiator outlet to said
at least one processor chip and then to said radiator inlet; and a
pump adapted to circulate liquid coolant through said radiator and
liquid coolant path.
23. The electronic device of claim 22, wherein at least said first
header includes a baffle, whereby said flat tubes define multiple
passes for said coolant.
24. The electronic device of claim 23, wherein said one of said
first and second headers is said first header, and said baffle is
in said first header.
25. The electronic device of claim 22, wherein said flat tubes are
extruded aluminum
26. The electronic device of claim 22, wherein said minor dimension
of said tubes is in the range of 0.75 mm to 0.85 mm.
27. The electronic device of claim 22, wherein said fin height is
in the range of 3.0 mm to 3.25 mm.
28. The electronic device of claim 22, wherein the tube major
dimension is on the order of 10 to 40 times the tube minor
dimension.
29. The electronic device of claim 28, wherein said tube major
dimension is on the order of 22 to 32 times the tube minor
dimension.
30. The electronic device of claim 29, wherein: said minor
dimension of said tubes is in the range of 0.75 mm to 0.85 mm; and
said fin height is in the range of 3.0 mm to 3.25 mm.
31. The electronic device of claim 29, wherein said tube major
dimension is on the order of 28 to 32 times the tube minor
dimension.
32. The electronic device of claim 22, wherein said tubes have a
wall thickness in the range of 0.15 mm to 0.25 mm.
Description
CROSS REFERENCE TO RELATED APPLICATION(S)
[0001] Not applicable.
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT
[0002] Not applicable.
REFERENCE TO A MICROFICHE APPENDIX
[0003] Not applicable.
TECHNICAL FIELD
[0004] The present invention is directed toward heat exchangers,
and particularly toward compact radiators for use in cooling
electronic devices.
BACKGROUND OF THE INVENTION AND TECHNICAL PROBLEMS POSED BY THE
PRIOR ART
[0005] Electronic devices such as computer systems are known to
generate large amounts of heat, particularly in their processor
chips. Excessive heat can degrade the operation of the devices and,
moreover, can significantly impact the useful life of the device,
including destroying the electronic components if not properly
cooled.
[0006] As a result, such electronic devices typically include some
form of cooling system. For example, personal computers will
typically include a fan to circulate air through the computer case,
and the processing chips are often mounted in a manner so that its
heat may be transferred to an element which provides increased
surface area and therefore increased heat dissipation as a result
of fan blown air passing over that surface area.
[0007] Liquid cooling systems have also been suggested to provide
such cooling for electronic devices, where heat from the processing
chips is dissipated into the liquid coolant with the coolant being
circulated in a manner so as to reject the heat to air. For
example, systems using bar-plate style heat exchangers have been
suggested. However, due to sagging of the cover plate of such heat
exchangers, such heat exchangers have required tube minor
dimensions of at least about 1.2 mm in order to prevent sagging of
the cover plate and/or channel blockage due to brazing during
manufacture.
[0008] It is imperative that an adequate amount of cooling be
provided with whatever cooling system is used in order to ensure
proper operation and useful life of the device. Moreover, such
requirements must be met within the strictly confined space of a
device in which compactness has long been an important commercial
feature.
[0009] The present invention is addresses the above needs.
SUMMARY OF THE INVENTION
[0010] In one aspect of the present invention, a compact radiator
for a coolant used in cooling an electronic device is provided,
including first and second headers, an inlet for receiving the
coolant into the first header, an outlet for discharging the
coolant from one of the first and second headers, a plurality of
parallel flat tubes defining coolant flow paths between the
headers, and serpentine fins between adjacent tubes. The tubes have
a minor dimension in the range of 0.75 mm to 1.2 mm, and the fins
have a height in the range of 3 mm to 7 mm.
[0011] In one form of this aspect of the invention, the flat tubes
are extruded aluminum.
[0012] In another form of this aspect of the invention, at least
the first header includes a baffle, whereby the flat tubes define
multiple passes for the coolant. In a further form, the inlet, the
outlet, and the baffle are in the first header.
[0013] In still another form of this aspect of the invention, the
minor dimension of the tubes is in the range of 0.75 mm to 0.85
mm.
[0014] In a further form of this aspect of the invention, the fin
height is in the range of 3.0 mm to 3.25 mm.
[0015] In a further form of this aspect of the invention, the tube
major dimension is on the order of 10 to 40 times the tube minor
dimension. In further forms, the tube major dimension is on the
order of 22 to 32 times the tube minor dimension, or 28 to 32
times, and in a still further form, the minor dimension of the
tubes is in the range of 0.75 mm to 0.85 mm and the fin height is
in the range of 3.0 mm to 3.25 mm.
[0016] In yet another form, the tubes have a wall thickness in the
range of 0.15 mm to 0.25 mm.
[0017] In another aspect of the present invention, a compact
radiator for a coolant used in cooling an electronic device is
provided, including first and second headers, an inlet for
receiving the coolant into the first header, an outlet for
discharging the coolant from one of the first and second headers, a
plurality of parallel flat tubes defining coolant flow paths
between the headers, and serpentine fins between adjacent tubes.
The tubes have a minor dimension in the range of 0.75 mm to 0.85
mm, and the fins having a height in the range of 3.0 mm to 3.25
mm.
[0018] In one form of this aspect of the present invention, the
flat tubes are extruded aluminum.
[0019] In another form of this aspect of the invention, at least
the first header includes a baffle, whereby the flat tubes define
multiple passes for the coolant. In a further form, the inlet, the
outlet, and the baffle are in the first header.
[0020] In a further form of this aspect of the present invention,
the tube major dimension is on the order of 10 to 40 times the tube
minor dimension and, in still further forms, the tube major
dimension is on the order of 22 to 32 times the tube minor
dimension, or 28 to 32 times.
[0021] In yet another form of this aspect of the present invention,
the tubes have a wall thickness in the range of 0.15 mm to 0.25
mm.
[0022] In a further aspect of the present invention, a compact
radiator for an electronic device that rejects heat to a coolant is
provided, including first and second headers, an inlet for
receiving the coolant into the first header, an outlet for
discharging the coolant from one of the first and second headers, a
plurality of extruded aluminum parallel flat tubes each defining a
plurality of coolant flow paths between the headers, and serpentine
fins between adjacent tubes. The tubes have a minor dimension in
the range of 0.75 mm to 0.85 mm and a tube major dimension on the
order of 22 to 32 times the tube minor dimension, and the fins have
a height in the range of 3.0 mm 3.25 mm.
[0023] In one form of this aspect of the present invention, the
tube wall thickness is in the range of 0.15 mm to 0.25 mm.
[0024] In yet another aspect of the present invention, an
electronic device is provided, including at least one heat
generating processor chip, a compact radiator, a liquid coolant
path, and a pump adapted to circulate liquid coolant through the
radiator and liquid coolant path. The radiator includes first and
second headers, an inlet for receiving the coolant into the first
header, an outlet for discharging the coolant from one of the first
and second headers, a plurality of parallel flat tubes defining
flow paths between the headers, the tubes having a minor dimension
in the range of 0.75 mm to 1.2 mm, and serpentine fins between
adjacent tubes, the fins having a height in the range of 3 mm to 7
mm. The liquid coolant path is defined from the radiator outlet to
the at least one processor chip and then to the radiator inlet.
[0025] In one form of this aspect of the invention, the flat tubes
are extruded aluminum.
[0026] In another form of this aspect of the invention, at least
the first header includes a baffle, whereby the flat tubes define
multiple passes for the coolant. In a further form, the inlet, the
outlet, and the baffle are in the first header.
[0027] In another form of this aspect of the invention, the minor
dimension of the tubes is in the range of 0.75 mm to 0.85 mm.
[0028] In still another form of this aspect of the invention, the
fin height is in the range of 3.0 mm to 3.25 mm.
[0029] In a further form of this aspect of the invention, the tube
major dimension is on the order of 10 to 40 times the tube minor
dimension. In further forms, the tube major dimension is on the
order of 22 to 32 times, or 28 to 32 times, the tube minor
dimension, and in a still further form, the minor dimension of the
tubes is in the range of 0.75 mm to 0.85 mm and the fin height is
in the range of 3.0 mm to 3.25 mm.
[0030] In yet another form, the tubes have a wall thickness in the
range of 0.15 mm to 0.25 mm.
BRIEF DESCRIPTION OF THE DRAWINGS
[0031] FIG. 1 is a perspective view of a radiator incorporating the
present invention;
[0032] FIG. 2 is a front face view of the radiator of FIG. 1;
[0033] FIG. 3 is a top view of the radiator of FIG. 1;
[0034] FIG. 4 is a cross-sectional view taken along line 4-4 of
FIG. 2;
[0035] FIG. 5 is a cross-sectional view taken along line 5-5 of
FIG. 2;
[0036] FIG. 6 is a diagram of an electronic device incorporating a
radiator embodying the present invention; and
[0037] FIG. 7 is a partially broken away, front face view of a
multi-pass radiator incorporating the present invention.
DETAILED DESCRIPTION OF THE INVENTION
[0038] A compact radiator 10 according to the present invention is
illustrated in FIGS. 1-5.
[0039] The radiator 10 includes a pair of headers 14, 16, each
having inlet/outlet connectors 20, 22 for liquid coolant. Extending
between the headers 14, 16 is the radiator core 26 including a
plurality of spaced parallel flat tubes 30 with serpentine fins 40
therebetween. End plates 44 may be provided for strength on the top
and bottom of the core 26, or additional tubes may alternately be
positioned above and below the last rows of fins 40.
[0040] The radiator core 26 may be made of aluminum, copper, or
brass components. Further, the tubes 30 may be extruded, welded or
folded/brazed. Extruded aluminum tubes 30 have been found to be
particularly suitable. Moreover, though the present invention is
not limited to the following dimensions, the following radiator
dimensions may be advantageously used in accordance with the
present invention:
1 RADIATOR DIMENSION DIMENSION RANGE Minor tube dimension 0.75 mm
to 1.2 mm Major tube dimension 12 to 30 mm Fin height 3 to 7 mm
Tube wall thickness 0.15 mm to 0.25 mm Tube aspect ratio (major
tube 10:1 to 40:1 dimension to minor tube dimension) Tube pitch to
tube minor dimension 3:1 to 10:1
[0041] A particularly advantageous configuration tube 30 is formed
by extruding aluminum into a size having a major dimension of about
24 mm and a minor dimension of 0.75 to 0.85 mm, and tube wall
thicknesses of about 0.20 mm. Upwards of ten separate flow paths or
channels 50 (see FIG. 4) are defined from front to back of each
tube 30, having an opening height (minor dimension) of around 0.40
mm and a depth (major dimension) of around 2.0 mm. Serpentine fins
40 having a height in the range of 3.0 mm to 3.25 mm may be used
with these tubes 30 to particular advantage.
[0042] Radiator cores 26 according to the above provide
advantageous heat exchange by minimizing the air flow blockage
resulting from the front face of the tubes and may be manufactured
cost-effectively, especially for low volume applications.
[0043] FIG. 6 illustrates an electronic device 60 with in which a
radiator 10 in accordance with the present invention may be
advantageously incorporated.
[0044] As illustrated diagrammatically, the electronic device 60
includes a housing including at least one heat generating
component, such as a processor chip 64, and a path or circuit 66
for coolant (e.g. liquid coolant) which passes near the chip 64 so
that the coolant absorbs heat rejected by the chip 64. The radiator
10 is a part of the path 66. A suitable pump 70 circulates the
coolant in the path 66 so that the coolant absorbs heat as it
passes by the processor chip 64, then passes to an inlet connector
22 of one header 14, then is cooled by passing through the tubes 30
to the other header 16, and then passes out the outlet connector 24
back to the processor chip 64. A suitable fan 74 may also be
provided to circulate air through the radiator core 26 to
facilitate cooling of the coolant in the tubes 30.
[0045] FIG. 7 illustrates another embodiment of a radiator 80
incorporating the present invention, wherein the radiator 80 is a
multi-pass heat exchanger. Specifically, a two-pass radiator 80 is
illustrated in FIG. 7, wherein both the inlet connector 22' and
outlet connector 24' are in the same header 82, separated by a
baffle 84. As will be appreciated by those skilled in the art, the
core 26' of the radiator 80 may be substantially the same as the
previously described core 26, though in this embodiment the coolant
will flow from the inlet connector 22' to the top four (of eight as
illustrated) tubes 30', then through the second header 86 to the
bottom four tubes 30". Coolant exiting the bottom four tubes 30"
then is discharged through the outlet connector 24'.
[0046] It should be recognized, moreover, that still further
multi-pass configurations could be used within the scope of the
present invention, including more than two passes (with baffles in
both headers), and different numbers of tubes (including different
numbers of tubes in different passes).
[0047] It should also be recognized that different flow directions
(e.g., with vertical tubes) within the scope of the present
invention.
[0048] It should be appreciated that advantageous cooling for an
electronic device may be provided through the use of the present
invention, with such cooling provided in a very compact space as is
particularly desired for such devices.
[0049] Still other aspects, objects, and advantages of the present
invention can be obtained from a study of the specification, the
drawings, and the appended claims. It should be understood,
however, that the present invention could be used in alternate
forms where less than all of the objects and advantages of the
present invention and preferred embodiment as described above would
be obtained.
* * * * *