U.S. patent application number 10/851060 was filed with the patent office on 2005-08-18 for fluid passage arrangement of a heat absorber for use in a liquid-cooling type cooling apparatus.
This patent application is currently assigned to Forward Electronics Co., Ltd.. Invention is credited to Huang, Chih Chien, Huang, Jung Fong.
Application Number | 20050178531 10/851060 |
Document ID | / |
Family ID | 34571583 |
Filed Date | 2005-08-18 |
United States Patent
Application |
20050178531 |
Kind Code |
A1 |
Huang, Jung Fong ; et
al. |
August 18, 2005 |
Fluid passage arrangement of a heat absorber for use in a
liquid-cooling type cooling apparatus
Abstract
A fluid passage arrangement of a heat absorber for use in a
liquid-cooling type cooling apparatus is disclosed to have a
heat-absorber plate, and a cover plate covering the heat-absorber
plate and defining with the heat-absorber plate a hermetically
sealed chamber, the heat-absorber plate having upright partition
strips that divide the sealed chamber into multiple partition zones
that form a maze passage and are respectively divided into parallel
passages by parallel fins. The partition strips and parallel fins
lower the flowing speed of the heat-transfer fluid passing through
the heat absorber and increase the contact area between the
heat-transfer fluid and the heat absorber, increasing the heat
energy absorbing effect of the heat absorber and the utilization of
the cooling apparatus.
Inventors: |
Huang, Jung Fong; (Sanchong
City, TW) ; Huang, Chih Chien; (Sansia Township,
TW) |
Correspondence
Address: |
BACON & THOMAS, PLLC
625 SLATERS LANE
FOURTH FLOOR
ALEXANDRIA
VA
22314
|
Assignee: |
Forward Electronics Co.,
Ltd.
Taipei City
TW
|
Family ID: |
34571583 |
Appl. No.: |
10/851060 |
Filed: |
May 24, 2004 |
Current U.S.
Class: |
165/104.31 ;
165/168; 257/E23.098 |
Current CPC
Class: |
H01L 2924/0002 20130101;
H01L 23/473 20130101; H01L 2924/0002 20130101; F28F 3/12 20130101;
H01L 2924/00 20130101 |
Class at
Publication: |
165/104.31 ;
165/168 |
International
Class: |
F28D 015/00; F28F
003/12; F25B 015/00 |
Foreign Application Data
Date |
Code |
Application Number |
Feb 16, 2004 |
TW |
093202181 |
Claims
What is claimed is:
1. A fluid passage arrangement of a heat absorber for use in a
liquid-cooling type cooling apparatus, comprising a heat-absorber
plate, and a cover plate covering said heat-absorber plate and
defining with said heat-absorber plate a hermetically sealed
chamber, said cover plate having two through holes in communication
between said sealed chamber and the outside space, wherein: said
sealed chamber comprises at least one partition strip, said at
least one partition strip dividing said sealed chamber into at
least two partition zones, and a plurality of parallel fins
arranged in parallel in each of said at least two partition zones
and defining in each of said at least two partition zones a
plurality of parallel passages, each of two adjacent ones of said
at least two partition zones having one same side connected to each
other to form a maze passage, said maze passage having a front and
a rear end respectively connected to the through holes of said
cover plate.
2. The fluid passage arrangement as claimed in claim 1, wherein
said heat-absorber plate has a top face; said at least one
partition strip is upwardly protruded from said top face of said
heat-absorber plate.
3. The fluid passage arrangement as claimed in claim 2, wherein
said parallel fins are upwardly protruded from the top face of said
heat-absorber plate.
4. The fluid passage arrangement as claimed in claim 1, therein
said heat-absorber plate further comprises a bottom flange
downwardly protruded from a bottom face thereof, forming a heat
absorbing zone attachable to a heat generating electronic device
for absorbing heat energy.
5. The fluid passage arrangement as claimed in claim 1, wherein
said heat-absorber plate is a copper plate member.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a heat absorber for use in
a liquid-cooling type cooling apparatus for computer and more
particularly, to the fluid passage arrangement of a heat absorber
for liquid-cooling type cooling apparatus.
[0003] 2. Description of Related Art
[0004] In a computer, the main heat-generating electronic device is
the CPU. In order to effectively dissipate heat from the CPU of a
computer, a cooling apparatus shall be used.
[0005] FIG. 1 illustrates a conventional liquid-cooling type
cooling apparatus for this purpose. This structure of
liquid-cooling type cooling apparatus comprises a heat absorber 91,
a liquid tank 92, and a heat sink 93. The heat absorber 91 is
adapted to absorb heat from the CPU, for enabling absorbed heat
energy to be transferred through a heat-transfer tube 94 to the
heat sink 93. The liquid tank 92 is adapted to store a
heat-transfer fluid.
[0006] The aforesaid heat absorber 91, as shown in FIG. 2, is
comprised of a heat-absorber plate 911, a gasket 912, and a top
cover plate 913. The heat-absorber plate 911 has a detoured fluid
passage 910 formed in the top wall. The gasket 912 seals the
detoured fluid passage 910, preventing leakage. The fluid passage
910 is a one-way fluid channel for forward flowing of the
heat-transfer fluid. During flowing of the heat-transfer fluid, the
contact area between the heat-transfer fluid and the fluid passage
910 is limited to the two opposite sidewalls of the fluid passage
910, therefore the heat-transfer fluid 910 can only absorb heat
energy from the limited area of the two opposite sidewalls of the
fluid passage 910. Further, because the heat-transfer fluid 910
keeps flowing in the fluid passage 910. When observing a particular
location in the fluid passage 910, the fluid in such a particular
location does not stay for long to effectively absorb heat energy
from the heat-absorber plate 911. Therefore, the aforesaid heat
absorber 91 is still not satisfactory in function.
SUMMARY OF THE INVENTION
[0007] The present invention has been accomplished under the
circumstances in view. It is therefore the main object of the
present invention to provide a fluid passage arrangement of a heat
absorber for use in a liquid-cooling type cooling apparatus, which
greatly improves the heat absorbing effect of the heat absorber,
increasing the utilization of the whole cooling apparatus.
[0008] To achieve this and other objects of the present invention,
the fluid passage arrangement of a heat absorber for use in a
liquid-cooling type cooling apparatus is comprised of a
heat-absorber plate, and a cover plate. The cover plate covers the
heat-absorber plate, defining with the heat-absorber plate a
hermetically sealed chamber. The cover plate has two through holes
in communication between the sealed chamber and the outside
space.
[0009] The sealed chamber comprises at least one partition strip,
which divides the sealed chamber into at least two partition zones,
and a plurality of parallel fins arranged in parallel in each of
the at least two partition zones and defining in each of the at
least two partition zones a plurality of parallel passages. Each of
two adjacent ones of the at least two partition zones have one same
side connected to each other to form a maze passage, which has a
front and a rear end respectively connected to the through holes of
the cover plate.
[0010] By means of the parallel fins and the parallel passages in
each of the at least two partition zones, the contact area between
the heat-transfer fluid and the heat absorber is greatly increased.
Further, the design of the maze passage and the parallel passages
in each of the at least two partition zones lowers the flowing
speed of the heat-transfer fluid. When observing one particular
location in the passages, it will be seen that the heat-transfer
fluid has more time to absorb heat energy from the heat-absorber
plate at such a particular location. Therefore, the invention
greatly improves the heat energy connecting effect of the heat
absorber, increasing the utilization of the cooling apparatus.
[0011] The at least one partition strip and the parallel fins can
be made directly upwardly protruded from the top face of the
heat-absorber plate. This design makes the fabrication of the heat
absorber easy.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] FIG. 1 is an elevational view of a conventional
liquid-cooling type cooling apparatus.
[0013] FIG. 2 is an exploded view of a heat absorber according to
the prior art.
[0014] FIG. 3 is an exploded view of a heat absorber made according
to the first embodiment of the present invention.
[0015] FIG. 4 is a sectional view of the heat absorber shown in
FIG. 3.
[0016] FIG. 5 is an exploded view of a heat absorber made according
to the second embodiment of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0017] Referring to FIGS. 3 and 4, a heat absorber made according
to the aforesaid manufacturing process comprises a heat-absorber
plate 1, and a top cover 2. The top cover 2 covers the
heat-absorber plate 1, defining with the, heat-absorber plate 1 a
hermetically sealed chamber 10. The top cover 2 has two through
holes 21, 22 in communication between the sealed chamber 10 and the
atmosphere.
[0018] The heat-absorber plate 1 is made of a copper plate,
comprising a top face 11, three partition strips 3 upwardly
protruded from the top face 11 and suspended in the sealed chamber
10. The three partition strips 3 divide the sealed chamber 10 into
four partition zones 41.about.44. Each of two adjacent ones of the
four partition zones 41.about.44 have one same side connected to
each other, thereby forming a maze passage 4. Further, parallel
fins 31 are arranged in each of the four partition zones
41.about.44, defining a plurality of parallel passages
411.about.441. The parallel fins 31 are upwardly protruded from the
top face 11 of the heat-absorber plate 1. The maze passage 4 has a
front end 401 and a rear end 402 respectively connected to the two
through holes 21, 22 of the top cover 2.
[0019] The heat-transfer fluid used in the liquid-cooling type
cooling apparatus using the aforesaid heat absorber passes in or
out of the sealed chamber 10 through the through hole 21 or 22.
When entered the sealed chamber 10, the heat-transfer fluid flows
in the parallel passages 411.about.441 to contact and absorb heat
from the parallel fins 31. Because the heat-transfer fluid touches
the surface of the parallel fins 31 when passing through the heat
absorber, the contact area between the heat-transfer fluid and the
heat absorber is greatly increased. Therefore, the heat-transfer
fluid effectively absorbs heat energy from the heat absorber.
[0020] Further, when passing through the parallel passages
411.about.441, the flowing speed of the heat-transfer fluid is
reduced due to the effect of the parallel fins 31 and the three
partition strips 3. When observing one particular location in the
passages 411.about.441, it will be seen that the heat-transfer
fluid has more time to absorb heat energy from the heat-absorber
plate 1 at such a particular location. Therefore, the invention
greatly improves the heat energy connecting effect of the heat
absorber, increasing the utilization of the cooling apparatus.
[0021] Further, the three partition strips 3 and the parallel fins
31 are directly protruded from the top face 11 of the heat-absorber
plate 1. This design facilitates the fabrication of the
heat-absorber plate by way of conventional processing
techniques.
[0022] FIG. 5 shows a heat absorber made according to the second
embodiment of the present invention. According to this embodiment,
the heat-absorber plate 5 has a bottom flange downwardly protruded
from the bottom face 50 thereof, forming a heat absorbing zone 51
adapted to absorb heat energy from a heat generating electronic
device (not shown). This design enables the heat absorber to be
accurately secured to the heat generating electronic device without
interfering with other electronic component parts around the heat
generating electronic device that are relatively taller than the
heat generating electronic device.
[0023] Although the present invention has been explained in
relation to its preferred embodiment, it is to be understood that
many other possible modifications and variations can be made
without departing from the spirit and scope of the invention as
hereinafter claimed.
* * * * *