U.S. patent application number 10/792721 was filed with the patent office on 2005-08-18 for cooling system or electronic apparatus, and electronic apparatus using the same.
Invention is credited to Suzuki, Osamu.
Application Number | 20050178529 10/792721 |
Document ID | / |
Family ID | 34836311 |
Filed Date | 2005-08-18 |
United States Patent
Application |
20050178529 |
Kind Code |
A1 |
Suzuki, Osamu |
August 18, 2005 |
Cooling system or electronic apparatus, and electronic apparatus
using the same
Abstract
An electronic apparatus, such as, personal computers of
so-called a desktop type and a notebook type, as well as, a server,
etc., having a cooling system being high in cooling efficiency,
wherein a CPU 200 in need of cooling is installed within a hosing
100, and the liquid cooling system for cooling the CPU, comprises:
a heat-receiving (cooling) jacket 50; a radiator 60; and a
circulation pump 70, wherein the heat-receiving (cooling) jacket
50, for transmitting heat generated from a heat-generation element,
i.e., the CPU, into a liquid coolant flowing with in an inside
thereof, has a heat diffusion plate 90 attached on the lower
surface thereof. This heat diffusion plate encloses an operating
fluid 94, such as water, within a space, which is hermetically
sealed and formed within an inside thereof, and also has heater
elements 95, being provided in contact with a portion the operating
fluid. To those heater elements 95 are supplied a pulse-like
electric power. With this, a portion of the operating fluid repeats
forming/extinguishing, to give vibration to the operating fluid,
thereby diffusing the heat over the entire of the diffusion plate,
as a whole, thereafter the heat is transmitted to the
heat-receiving (cooling) jacket. Or, alternatively, it may be
connected with a heat radiation fin 300.
Inventors: |
Suzuki, Osamu; (Chiyoda,
JP) |
Correspondence
Address: |
ANTONELLI, TERRY, STOUT & KRAUS, LLP
1300 NORTH SEVENTEENTH STREET
SUITE 1800
ARLINGTON
VA
22209-3873
US
|
Family ID: |
34836311 |
Appl. No.: |
10/792721 |
Filed: |
March 5, 2004 |
Current U.S.
Class: |
165/80.4 ;
257/E23.081; 257/E23.098 |
Current CPC
Class: |
H01L 23/473 20130101;
G06F 2200/201 20130101; F28D 15/0233 20130101; F28D 15/06 20130101;
H01L 2924/00 20130101; G06F 1/20 20130101; H01L 2924/0002 20130101;
H05K 7/20809 20130101; F28F 13/10 20130101; H01L 2924/0002
20130101; H01L 23/345 20130101 |
Class at
Publication: |
165/080.4 |
International
Class: |
F28F 007/00 |
Foreign Application Data
Date |
Code |
Application Number |
Feb 16, 2004 |
JP |
2004-038378 |
Claims
What is claimed is:
1. A cooling system for an electronic apparatus, installing a
semiconductor element within a housing, which necessitates cooling
for maintaining normal operation thereof, in a part of the housing,
having: a heat diffusion element being connected with the
semiconductor element, thermally, wherein said heat diffusion
element comprises: a plate-like member of heat conductive material,
enclosing therein an operating liquid having large latent heat; and
an actuator being provided in a part of the plate-like member, for
vibrating said operating liquid having large latent heat, wherein:
said heat diffusion element mounts said heat-generating
semiconductor element on one side surface, while transporting heat
generated from said heat-generation semiconductor element to other
side surface of said heat diffusion element, thereby conducting
heat transmission from said other side surface.
2. The cooling system for an electronic apparatus, as described in
the claim 1, wherein a heat radiation plate is attached on the
other side surface of said heat diffusion element.
3. The cooling system for an electronic apparatus, as described in
the claim 1, wherein a cooling jacket is attached on the other side
surface of said heat diffusion element, being thermally connected
with said semiconductor element, thereby transmitting the heat
generated therein to a liquid coolant vibrating within an inside of
said cooling jacket, so as to conduct the cooling upon said
semiconductor.
4. The cooling system for an electronic apparatus, as described in
the claim 1, wherein the actuator for vibrating the operating
liquid filled within said heat diffusion element is made up with a
heater wire wound around periphery of two (2) pieces of supporting
bodies.
5. The cooling system for an electronic apparatus, as described in
the claim 4, wherein said heater wire is made from a nichrome
wire.
6. The cooling system for an electronic apparatus, as described in
the claim 4, wherein said actuator made up with the heater wire
wound around the periphery of said two (2) pieces supporting bodies
is disposed within an inside of said plate-like member, so that it
dips in said operating fluid filled therein, near to said other
surface thereof.
7. The cooling system for an electronic apparatus, as described in
the claim 4, wherein hydrophilic treatment is conducted on a
portion, on a surface of interior wall of said one side surface in
said plate-like member, in vicinity of said actuator.
8. An electronic apparatus, installing a heat-generating
semiconductor element within a housing thereof, which requires
cooling for maintaining normal operation there, and having a
cooling system, within said housing or in a part thereof,
comprising: a cooling jacket, being thermally connected with the
semiconductor element, for transmitting heat generated from to a
liquid coolant flowing within an inside thereof; a radiator ford is
charging the heat transmitted to the liquid coolant in said cooling
jacket into an outside; and a circulation pump for circulating said
liquid coolant in a loop, including said cooling jacket and said
radiator therein, wherein: said cooling jacket is in contact with a
surface of said heat-generating semiconductor element through a
heat diffusion means for diffusing the heat generated from said
heat-generating semiconductor element.
9. The electronic apparatus descried in the claim 8, wherein said
heat diffusion means for diffusing the heat generated from said
heat-generating semiconductor element into said cooling jacket
comprises a hermetically sealed space for enclosing an operating
fluid having large latent heat to be vibrated within an inside
thereof, and is made up with a plate-like member having a surface
shape being almost similar to that of said cooling jacket and being
superior in heat conductivity, wherein an actuator is provided in a
portion thereof, for vibrating said operating fluid, while dipping
in said operating fluid.
10. The electronic apparatus descried in the claim 9, wherein in a
part of said hermetically sealed space of said heat diffusion
means, into an inside of which is enclosed the operating fluid
having the large latent heat to be vibrated, is provided a buffer
portion for enclosing a gas therein.
11. The electronic apparatus descried in the claim 10, wherein said
hermetically sealed space of said heat diffusion means, into an
inside of which is enclosed the operating fluid having the large
latent heat to be vibrated, are formed in a plural number thereof
and in parallel with each other, and also each of those is
connected through said buffer portion, thereby forming a comb-like
shape.
12. The electronic apparatus descried in the claim 9, wherein said
heat diffusion means comprises a heating means provided in contact
with a part of the operating fluid enclosed within said
hermetically sealed space, and said heating means is supplied with
pulse-like electric power, thereby providing vibration to said
operating fluid.
13. An electronic apparatus, installing a heat-generating
semiconductor element within a housing thereof, which requires
cooling for maintaining normal operation there, and having a
cooling system, within said housing or in a part thereof,
comprising: a heat diffusion element, being connected with said
semiconductor element, thermally; and a heat radiator, wherein said
heat diffusion element comprises: a plate-like member of heat
conductive material, enclosing therein an operating liquid having
large latent heat; and an actuator being provided in a part of the
plate-like member, for vibrating said operating liquid having large
latent heat, whereby said heat diffusion element mounts said
heat-generating semiconductor element on one side surface, while
diffusing heat generated from said heat-generating semiconductor
element, thereby transmitting the heat to the other side surface of
said heat diffusion element; and said heat radiation plate is
attached on the other side surface of said heat diffusion element,
and transmitting the heat generated from said heat-generating
semiconductor element, which is transported through said heat
diffusion element, from a surface thereof into an outside.
Description
BACKGROUND OF THE INVENTION
[0001] The present invention relates to an electronic apparatus,
such as, a personal computer, being so-called a desktop-type or a
notebook-type, or a server, etc., and in particular, it relates to
an electronic apparatus having a liquid cooling system therein,
being able to cool down a heat-generation element mounted within an
inside thereof, such as, a semiconductor integrated circuit (IC),
effectively with an aid of a liquid refrigerant or coolant, as well
as, the cooling system thereof.
[0002] In order to maintain a normal operation thereof, cooling is
necessary for the heat-generation element, such as, the
semiconductor IC element, being mounted within an electronic
apparatus, including a personal computer, of so-called the
desktop-type or the notebook-type, as well as, a server, etc., and
in particular, the heat-generation element, such as, a CPU (Central
Processing Unit), as a representative one thereof, for example. For
this reason, conventionally, such the cooling is achieved generally
by using, a heat transfer element, being so-called a heat sink that
is formed with fins thereon, as well as a fan, being provided for
sending a cooling air thereto. However, small-sizing and high
integration of such the semiconductor IC element in recent years,
such as the heat-generation element, brings about localization of
the heat generating at the portion thereof within the
heat-generation element, and also for this reason, attention comes
to be paid onto a cooling system of a liquid type of using the
liquid coolant therein, such as a water, for example, being high in
the cooling efficiency thereof, in the place of the conventional
cooling system of an air-cooling type.
[0003] Namely, with the liquid cooling system of being high in the
cooling efficiency thereof, which is used in the personal computer,
of s-called the desktop-type or the notebook-type, and also the
server, etc., as is known from the following patent documents 1-5,
for example, in general, an element being so-called by a
heat-receiving (or cooler) jacket is mounted on the surface of the
heat-generating element, i.e., the CPU, directly, while conducting
the liquid coolant within a flow passage formed within the
heat-receiving jacket, so as to transmit or convey the heat
generated from the CPU to the coolant flowing within the jacket
mentioned above, thereby cooling down the heat-generating element
with high efficiency. Further, in such the cooling system of the
liquid-cooling type, normally, a heat cycle is made up with the
cooler jacket, as the heat-receiving portion thereof, and in more
details thereof, it comprises a circulation pump for circulating
the liquid coolant mentioned above within the cycle, so-called a
radiator, being a heat-radiation portion for irradiating heat of
the liquid coolant mentioned above into an outside, and further a
coolant tank provided in a part of the cycle depending on the
necessity thereof. And, those are connected through a tube made of
a metal and/or an elastic material, such as rubber or the like.
[0004] On the other hand, conventionally, as an apparatus for
diffusing (or conducting) heat generated from the heat-generation
body, such as, the semiconductor element, etc., which is installed
within the electronic apparatus, there is already known a heat
diffusion plate, for example, in the following patent document 6;
wherein, for example, a groove or gutter is formed in a loop-like
manner upon each of connection surfaces between an upper plate and
a lower plate, which are made of material having high thermal
conductivity, and both of those plated are piled and bonded with
each other, opposing those grooves to each other, thereby forming a
heat pipe in an inside thereof.
[0005] In addition thereto, in general, it is already known, with a
heat transmission element for transmitting heat from the
heat-generation body, that driving of fluid enclosed within an
inside thereof transmits the heat. For example, in the apparatus
disclosed in the following patent document 7, for the purpose of
transmitting the heat from a print circuit board, on which a plural
number of semiconductor elements (i.e., the heat-generation
bodies), a part of the formed liquid passage comprises a means,
being made up with a capillary and having a heating means in a part
thereof, and the heater means heats the liquid within the capillary
in the pulse-like manner, to cause bumping, thereby driving the
liquid mentioned above due to a sudden or abrupt increase of
pressure accompanying the vaporization when the bumping occurs.
Further, regarding the principle of conducting the heat with using
the vibration of liquid is described, in the details thereof, in
the following non-patent document 1, for example. Also, the
following non-patent document 2 discloses the structure, in
particular in FIG. 10 thereof, for dispersing heat-generation of a
semiconductor chip having large electric power consumption, with
applying a container, which builds up the device therein for
conducting the heat, with utilization of the heat pipe and/or the
vibration of liquid.
[0006] Patent Document 1: Japanese Patent Laying-Open No.
2003-304086 (2003);
[0007] Patent Document 2: Japanese Patent Laying-Open No.
2003-22148 (2003);
[0008] Patent Document 3: Japanese Patent Laying-Open No.
2002-182797 (2002);
[0009] Patent Document 4: Japanese Patent Laying-Open No.
2002-189536 (2002);
[0010] Patent Document 5: Japanese Patent Laying-Open No.
2002-188876 (2002);
[0011] Patent Document 6: Japanese Patent Laying-Open No.
2002-130964 (2002);
[0012] Patent Document 7: Japanese Patent Laying-Open No. Hei
7-286788 (1995);
[0013] Non-Patent Document 1: Mamoru Ozawa, et al., "Promotion of
Heat Conduction through Vibration of Liquid" pp228-235, Vo. 50
No.530 (1990-10), Articles of Japan Machinery Academic Association
(B edition); and
[0014] Non-Patent Document 2: Z. J. Zuo, L. R. Hoover and A. L.
Phillips, "An integrated thermal architecture for thermal
management of high power electronics", pp317-336, Thermal
Challenges in Next Generation Electronic System (PROCESSINGS OF
INTERNATIONAL CONFERENCE THERMES 2002), SANTA FE, N.M., USA, 13-16
Jan. 2002.
[0015] However, with such the cooling system of liquid cooling
type, according to the conventional art, which was applied in the
personal computers, of so-called the desktop type and the notebook
type, and the server, etc., cooling of the heat-generation body,
such as, the CPU, for example, is achieved by mounting it directly
on the above-mentioned heat-receiving (or cooling) jacket having
high cooling effect, however in general, the heat-generation body,
i.e., the CPU comes to be small, in particular, on the surface area
thereof, accompanying high integration of the semiconductor
elements in recent years. On the contrary to this, the
heat-receiving (or cooling) jacket has a large surface area due to
the structure thereof; e.g., the liquid coolant flows within the
flow passage formed with in the inside thereof, therefore, the area
is very small, upon which the heat-generation element, i.e., the
CPU is in contact with, comparing to the surface area of the
heat-receiving (or cooling) jacket.
[0016] In this manner, in a case where the area is small, upon
which the heat-generation body, or the CPU is in contact with,
comparing to that of the heat-receiving (or cooling) jacket, the
heat generated within the CPU diffused into the contact surface
between the heat-receiving (or cooling jacket) and also the
peripheral portion thereof, and thereafter it is conducted to the
liquid coolant flowing within the jacket, thereby being discharged
into an outside. However, in the case where that contact surface is
small in the area thereof, even though the heat diffuses also to
the peripheral portion thereof, more or less, but it cannot diffuse
to the entire of the jacket, therefore the cooling efficiency of
the heat-generation element is lowered by means of the
heat-receiving (or cooling) jacket. Thus, at a position relatively
far from the contact position with the CPU, the conduction of the
heat generation cannot be obtained sufficiently, to the liquid
coolant flowing within the jacket, and therefore, only a part of
cooling capacity is utilized, but without using the, cooling
capacity, fully, by means of the heat-receiving (or cooling)
jacket.
SUMMARY OF THE INVENTION
[0017] Therefore, an object, according to the present invention, by
taking the problems in such the conventional arts into the
consideration, in more details, is provide a cooling system, being
suitable for use in the personal computers, such as, called by the
desktop type and/or the notebook type, and also the server, etc.,
and enhancing or increasing the cooling efficiency thereof with
using a heat transmission/diffusion element, in which heat
transmission/diffusion is promoted or facilitated through vibration
of the heat-conductive liquid filled within an inside of a
heat-conductive member, as well as, an electronic apparatus having
such the cooling system therein.
[0018] Thus, according to the present invention, for accomplishing
such the object mentioned above, firstly, there is provided a
cooling system for an electronic apparatus, installing a
semiconductor element within a housing, which necessitates cooling
for maintaining normal operation thereof, in a part of the housing,
having: a heat diffusion element being connected with the
semiconductor element, thermally, wherein said heat diffusion
element comprises: a plate-like member of heat conductive material,
enclosing therein an operating liquid having large latent heat; and
an actuator being provided in a part of the plate-like member, for
vibrating said operating liquid having large latent heat, wherein:
said heat diffusion element mounts said heat-generating
semiconductor element on one side surface, while transporting heat
generated from said heat-generation semiconductor element to other
side surface of said heat diffusion element, thereby conducting
heat transmission from said other side surface.
[0019] Also, according to the present invention, in the cooling
system for an electronic apparatus as described in the above, it is
preferable that a heat radiation plate is attached on the other
side surface of said heat diffusion element, or that a cooling
jacket is attached on the other side surface of said heat diffusion
element, being thermally connected with said semiconductor element,
thereby transmitting the heat generated therein to a liquid coolant
vibrating within an inside of said cooling jacket, so as to conduct
the cooling upon said semiconductor. Also, according to the present
invention, in the cooling system for an electronic apparatus as
described in the above, it is preferable that the actuator for
vibrating the operating liquid filled within said heat diffusion
element is made up with a heater wire wound around periphery of two
(2) pieces of supporting bodies, and in particular, it is
preferable that said heater wire is made from a nichrome wire.
Further, according to the present invention, in the cooling system
for an electronic apparatus as described in the above, it is also
preferable that said actuator made up with the heater wire wound
around the periphery of said two (2) pieces supporting bodies is
disposed within an inside of said plate-like member, so that it
dips in said operating fluid filled therein, near to said other
surface thereof, or that hydrophilic treatment is conducted on a
portion, on a surface of interior wall of said one side surface in
said plate-like member, in vicinity of said actuator.
[0020] Next, according to the present invention, for accomplishing
such the object mentioned above, there is provided an electronic
apparatus, installing a heat-generating semiconductor element
within a housing thereof, which requires cooling for maintaining
normal operation there, and having a cooling system, within said
housing or in a part thereof, comprising: a cooling jacket, being
thermally connected with the semiconductor element, for
transmitting heat generated from to a liquid coolant flowing within
an inside thereof; a radiator for discharging the heat transmitted
to the liquid coolant in said cooling jacket into an outside; and a
circulation pump for circulating said liquid coolant in a loop,
including said cooling jacket and said radiator therein, wherein:
said cooling jacket is in contact with a surface of said
heat-generating semiconductor element through a heat diffusion
means for diffusing the heat generated from said heat-generating
semiconductor element.
[0021] And, according to the present invention, in the electronic
apparatus descried in the above, it is preferable that said heat
diffusion means for diffusing the heat generated from said
heat-generating semiconductor element into said cooling jacket
comprises a hermetically sealed space for enclosing an operating
fluid having large latent heat to be vibrated within an inside
thereof, and is made up with a plate-like member having a surface
shape being almost similar to that of said cooling jacket and being
superior in heat conductivity, wherein an actuator is provided in a
portion thereof, for vibrating said operating fluid, while dipping
in said operating fluid. Also, according to the present invention,
in the electronic apparatus descried in the above, it is preferable
that in a part of said hermetically sealed space of said heat
diffusion means, into an inside of which is enclosed the operating
fluid having the large latent heat to be vibrated, is provided a
buffer portion for enclosing a gas therein. Further, according to
the present invention, in the electronic apparatus descried in the
above, it is preferable that said hermetically sealed space of said
heat diffusion means, into an inside of which is enclosed the
operating fluid having the large latent heat to be vibrated, are
formed in a plural number thereof and in parallel with each other,
and also each of those is connected through said buffer portion,
thereby forming a comb-like shape. And, also according to the
present invention, in the electronic apparatus descried in the
above, it is preferable that said heat diffusion means comprises a
heating means provided in contact with a part of the operating
fluid enclosed within said hermetically sealed space, and said
heating means is supplied with pulse-like electric power, thereby
providing vibration to said operating fluid.
[0022] Further, according to the present invention, for
accomplishing such the object mentioned above, there is also
provided an electronic apparatus, installing a heat-generating
semiconductor element within a housing thereof, which requires
cooling for maintaining normal operation there, and having a
cooling system, within said housing or in a part thereof,
comprising: a heat diffusion element, being connected with said
semiconductor element, thermally; and a heat radiator, wherein said
heat diffusion element comprises: a plate-like member of heat
conductive material, enclosing therein an operating liquid having
large latent heat; and an actuator being provided in a part of the
plate-like member, for vibrating said operating liquid having large
latent heat, whereby said heat diffusion element mounts said
heat-generating semiconductor element on one side surface, while
diffusing heat generated from said heat-generating semiconductor
element, thereby transmitting the heat to the other side surface of
said heat diffusion element; and said heat radiation plate is
attached on the other side surface of said heat diffusion element,
and transmitting the heat generated from said heat-generating
semiconductor element, which is transported through said heat
diffusion element, from a surface thereof into an outside.
BRIEF DESCRIPTION OF THE VARIOUS VIEWS OF THE DRAWING
[0023] Those and other features, objects and advantages of the
present invention will become more apparent from the following
description when taken in conjunction with the accompanying
drawings wherein:
[0024] FIG. 1 is a partially exploded perspective view, for showing
an example, in particular, the detailed structures of a heat
receiving jacket and a heat diffusion plate, in a cooling system of
an electronic apparatus, according to the present invention;
[0025] FIG. 2 is a perspective view for showing the cooling system,
in particular, of an electronic circuit portion, in the electronic
apparatus, according to the present invention;
[0026] FIG. 3 is a partially exploded perspective view, for showing
an example of disposition of each part, within an inside of a
desktop-type personal computer, for example, in which the cooling
system motioned above is installed therein;
[0027] FIG. 4 is a partially enlarged perspective view for showing
an example of a heater element, which is provided within an inside
of each of a plural number of grooves, which are formed within the
heat diffusion plate mentioned above;
[0028] FIG. 5 is a partially enlarged perspective view for showing
the above-mentioned groove and the heater element provided within
the inside thereof, for explaining the principle of heat diffusion
by means of the heat diffusion plate mentioned above;
[0029] FIG. 6 is across-section view for showing the heat diffusion
plate, the heat-receiving jacket and a CPU, for explaining the
principle of heat diffusion by means of the heat diffusion plate
mentioned above;
[0030] FIG. 7 is a perspective view for showing the structure, in
particular, of the heat diffusion plate mentioned above, but
according to other embodiment, in the cooling system of the
electronic apparatus according to the present invention;
[0031] FIGS. 8(a) and 8(b) are a cross-section view and an upper
view, for showing the structure of the heat diffusion plate
mentioned above, according to further other embodiment, in the
cooling system of the electronic apparatus according to the present
invention;
[0032] FIG. 9 is an upper view for showing the structure of the
heat diffusion plate mentioned above, according to further other
embodiment, in the cooling system of the electronic apparatus
according to the present invention;
[0033] FIG. 10 is also an upper view for showing the structure of
the heat diffusion plate mentioned above, according to further
other embodiment, in the cooling system of the electronic apparatus
according to the present invention;
[0034] FIG. 11 is an enlarged cross-section view of a portion,
wherein the heater element is disposed within the heat diffusion
plate (or a heat spreader), according to other embodiment of the
present invention;
[0035] FIGS. 12(a) and 12(b) are an upper view and a side view for
showing the detailed structure of the heater element mentioned
above;
[0036] FIG. 13 is a partially enlarged cross-section view, for
explaining the operation of the heat diffusion plate (i.e., the
heat spreader), according to the other embodiment mentioned
above;
[0037] FIGS. 14(a) and 14(b) are a side view and a perspective view
for showing a variation of the heater element mentioned above;
[0038] FIG. 15 is a partially enlarged cross-section view for
showing further variation of the heater element mentioned
above;
[0039] FIG. 16 is also a partially enlarged cross-section view for
showing further other variation of the heater element mentioned
above;
[0040] FIG. 17 is a side surface cross-section view for showing the
cooling system of the electronic apparatus, using the heat
diffusion plate therein, according to other embodiment of the
present invention;
[0041] FIG. 18 is also a side surface cross-section view for
showing the cooling system of the electronic apparatus, using the
heat diffusion plate therein, according to other embodiment of the
present invention; and
[0042] FIG. 19 is an upper view of the cooling system of the
electronic apparatus, using the heat diffusion plate therein, i.e.,
seen from a direction "c" shown in FIG. 18 mentioned above.
DETAILED DESCRIPTION OF THE INVENTION
[0043] Hereinafter, explanation will be given on the embodiments
according to the present invention, in details thereof, by
referring to the drawings attached herewith.
[0044] First of all, FIG. 2 attached herewith shows an example of
the entire structure of an electronic apparatus having a liquid
cooling system therein, according to one embodiment of the present
invention. However, in this embodiment is shown a case, where the
present invention is applied into a main portion of a personal
computer, such as, of so-called the desktop type, for example.
[0045] As shown in the figure, the main portion of the desktop type
personal computer comprises a housing 100, which is formed from a
metal plate into a cubic shape thereof, for example, and on a front
panel portion 101 thereof are provided various kinds of switches;
including an electric power switch and so on, and also indicator
lamps, etc. Also, within an inside thereof is disposed a driver
device 102, for driving various kinds of external information
recording medium, such as, a floppy disk, a CD, and a DVD, etc., so
that it positions an opening thereof on the front panel portion
101. Also, a reference numeral 103 in the figure depicts a memory
portion provided within the housing 100 mentioned above, comprising
a hard disk device, for example. And also, a reference numeral 104
in the figure depicts a cover to be put on the housing 100
mentioned above.
[0046] While on a rear side of the housing 100 is disposed an
electronic circuit portion 105, having a liquid cooling system
according to the present invention, and a reference numeral 106 in
the figure depicts an electric power source portion for supplying
from a commercial electric power source, a desired electric power
to each of the portions, including, the driver device 102, the
memory portion 103, and the electronic circuit portion 105
mentioned above.
[0047] Next, in FIG. 3 attached herewith is shown the electronic
circuit portion 105 of the electronic apparatus, the brief
structure of which was explained in the above; i.e., within the
desktop type personal computer, in particular, mainly around a heat
receiving jacket 50 for mounting thereon a heat-generation element,
such as, a CPU, as a main or principle structure thereof. However,
in this embodiment, a chip 200 of the CPU, being such the
heat-generation element as was mentioned, is mounted on the lower
side surface of the heat-receiving jacket 50 mentioned above, being
in directly contact with, therefore it is not illustrated on the
figure, herein.
[0048] And, as is apparent from the figure, this electronic circuit
portion 105 comprises the above-mentioned heat-receiving (or
cooling) jacket 50 for mounting the CPU thereon, a radiator portion
60 for radiating heat generated from the CPU into an outside of the
apparatus, a pump 70 for building up a cooling system, and further
flow passages are formed by connecting tubes (conduits) 81, 82 . .
. , being made of a metal, or an elastic material, such as a rubber
or the like, being covered with a metal film, etc. on the outer
surface thereof, so as to prevent the liquid coolant inside from
leaking outside, for conducting a liquid coolant (for example, a
water, or a water mixed with a so-called anti-freezing solution,
such as, propylene glycol, at a predetermined ratio) to each of
those portions building up the heat cycle. Also, in a part of the
radiator portion 60 mentioned above, there are attached with
plate-like shaped fans 62, 62 . . . (in a plural number, such as,
three (3) pieces, in the present example), directing into an
outside of the apparatus, for blowing wind onto a large number of
fins 61, as the constituent element of the radiator portion,
thereby radiating the heat transmitted from the heat receiving
jacket 50 mentioned above, compulsively.
[0049] Namely, as apparent from the figure, the radiator portion 60
mentioned above is connected to the circulation pump 70 by means of
the tube (conduit) 81, and is further connected to the
heat-receiving jacket 50 through the tube (conduit) 82, thereafter
is connected to the radiator portion 60 mentioned above, thereby
forming a loop turning back thereto. Namely, with an aid of
operation of the circulation pump 70, within the liquid circuit
mentioned above circulates the above-mentioned water, or the
mixture thereof with the anti-freezing solution, as the liquid
coolant.
[0050] And, in FIG. 1 attached herewith, there is shown the
detailed structure of the heat-receiving jacket 50 mentioned above,
together with a heat diffusion plate (the heat spreader) 90
attached on the lower surface thereof. As is apparent from this
figure, the heat-receiving jacket 50 is made of a plate-like member
of material, having high heat conductivity, such as a metal, etc.,
including, copper or aluminum therein, for example, and in an
inside thereof is formed a flow passage 51, winding around, for
example, in the present embodiment, so that the liquid coolant can
flow covering over the entire thereof. Also, reference numerals 52
and 53 in the figure depict an inlet and an outlet for guiding and
discharging the liquid coolant into/from the heat-receiving jacket
50, respectively.
[0051] On the other hand, the heat diffusion plate (the heat
spreader) 90 is also made of a plate-like member, being made of a
metal, etc., having high heat conductivity, and as is apparent from
the figure, so as to be in contact with the lower surface of the
heat-receiving jacket 50 mentioned above, it has a surface being
same to that of the jacket 50 in the form/sizes thereof. And, on
this heat diffusion plate 90, for example, on a surface thereof in
contact with the heat-receiving jacket 50, in the example shown in
the figure, are formed a plural number of grooves (or gutters) 91,
91 . . . , having a circular or rectangular shape in the
cross-section thereof and being minute in the cross-section area
(for example, around several mm.sup.2) thereof, in parallel with
one side thereof, and further each of the plural number of those
grooves 91 is connected to a common groove or gutter 92, which is
formed at one end portion thereof (i.e., the left-lower side in the
figure), to be so-called a buffer portion, respectively. Namely,
attachment and fixation of this heat diffusion plate 90 onto the
lower surface of the heat-receiving jacket 50 defines a comb-like
hermetically sealed space within an inside thereof, with the plural
number of the passages 91, 91 . . . and the buffer portion 92.
Further, in that instance, grooves or gutters 91, 92 may also
formed on the lower surface side of the heat-receiving jacket 50,
being similar to those mentioned above, to be located opposing to
each other when they are bonded together. Also, among of those
closed spaces, in particular, within an inside of each of those
passages 91, 91 . . . is enclosed a fluid (i.e., an operation fluid
94), having a large latent heat, such as, a water (i.e., pure
water) or the like, representatively, for example, though will be
explained in more details thereof, hereinafter.
[0052] Also, at the other end portion thereof (i.e., the
right-upper portion in the figure), so-called heater elements 95,
95 . . . are disposed, respectively, to build up heating members,
the details of which will be explained hereinafter. In the figure,
there is also shown conductor lines 96, for supplying the
pulse-like heating electric power to those heater elements 95, 95 .
. . , and also a pulse electric power generating circuit 97. And,
as was mentioned in the above, the heat-receiving jacket 50, being
assembled together with the heat diffusion plate 90 in one body is
attached, for example, on the CPU 200; i.e., the heat-generation
element mounted on the printed circuit board 210, as shown in this
figure, so as to be in contact with the surface of the CPU.
[0053] FIG. 4 attached herewith shows an enlarged view about the
heater element 95, which is attached at the other end portion of
each of the plural number of the passages 91, 91 . . . , which are
formed within an inside of the heat diffusion plate 90 mentioned
above. Thus, this heater element 95 is built up with a cylindrical
member (i.e., a bobbin) 951 made of an inorganic material, such as
ceramic, for example, while being wound thereroung helically with a
fine wire 952 (for example, about 0.1 mm in diameter), such as, a
nichrome wire or a stainless wire, etc., for example, and
thereafter being fixed through treatment of a coating or the like,
on the surface thereof. Or, in case of forming the cylindrical
member (bobbin) 951, to be the supporting body of the fine wire,
from the material having electric conductivity, such as a metal or
the others, for example, it is preferable to cover the surface
thereof with an inorganic material of electric insulator at first.
This is because of preventing it from change thereof, due to
contacting with the water and other organic materials (for example,
propylene glycol, etc., as the anti-freezing solution), filled
within the passage formed within an inside thereof as the operating
fluid 94.
[0054] Also, charging of the operating liquid 94 mentioned above is
conducted, by injecting the liquid coolant, such as the water,
etc., as the operating fluid 94, into an inside of the plural
number of passages 91 mentioned above, for example, when bonding
the heat diffusion plate 90 mentioned above with the heat-receiving
jacket 50 in one body. Alternatively, though not shown in the
figure herein, however with provision of a communicating port
between the passages 91 and the surface of the heat-receiving
jacket 50, it is possible to charge the operation fluid 94
therefrom. However, upon charging of the operating fluid 94
therein, charging pressure is altered depending upon the
characteristics of the operating fluid, or a gaseous phase portion
of non-condensation gas (for example, an air) is mixed therein when
charging it.
[0055] Next, FIG. 5 attached herewith shows the cross-section view,
for showing the other end portion thereof, i.e., a portion of the
heat diffusion plate 90 mentioned above, where the heater element
95 building up the driving means of the operating fluid 94 is
attached, within the passage 91 formed within the inside thereof.
Further, as was shown in the above, on the heater element 95, made
up with the fine wire 952 of the nichrome wire, etc., is formed
wirings for supplying the heat-generation electric power thereto,
and through those wirings, the electric power from the pulse-like
electric power generating circuit 97 is supplied to the heater
element 95 mentioned above, intermittently, and in a pulse-like
manner. In this instance, the pulse frequency is, for example, in
about from several tens to several hundreds Hz, but depending upon
the sort of the operating fluid 94 and the sizes of the passages
91. Also, with such a pulse-like electric power supplying means, it
may be formed, for example, in a part of the heat diffusion plate
90 in a form of an electronic circuit, or on the printed circuit
board 210 mentioned above, and further, it may be built up, with
using a portion of the CPU 200 mounted on the printed circuit board
210. Though not shown in the figure herein, however it is also
possible to use a portion thereof, from an electric power source
supplying driving electric power to the CPU 200, and such the
structure may be advantageous from a viewpoint of simplification of
the circuit.
[0056] Following to the above, explanation will be made about the
conducting (or diffusing) function of heat in the heat diffusion
plate (i.e., the heat spreader) 90, the structure of which was
explained in the above, by referring to FIG. 5 mentioned above.
[0057] First, when the electric power is supplied in pulse-like
manner from the pulse-like electric power generating circuit 97
mentioned above, it is converted into heat on the nichrome fine
wire 952 of the heater element 95 shown in FIG. 5 mentioned above.
Due to this pulse-like heat, the operating fluid 94 within the
passages 91 (for example, the water in the present example) is
headed suddenly or abruptly (i.e., in the pulse-like manner), and
with this, it evaporates or vaporizes (causing the pumping),
thereby generating a bubble S due to the vapor thereof, within an
inside of the heater element 95 and the vicinity thereof, i.e., in
a portion in an inside of the operating fluid 94. Thereafter, when
the pulse-like electric power stops to be supplies thereto, the
heating by means of the nichrome fine wire 952 also stops, thereby
extinguishing the vapor 4a of the operating fluid generated in the
above.
[0058] In this manner, with supplying of the pulse-like electric
power mentioned above, continuously, to the nichrome fine wire 952
building up the heater element 95, the operating fluid 94 enclosed
in the inside at the end portion of the passage 91 (i.e., at the
position where the heater element 95 is provided) repeats the
generation and extinction of the bubble 94a due to the generation
and extinction of the vapor thereof. And, at the time when this
bumping occurs due to the abrupt increase of pressure accompanying
the vaporization thereof, and also expansion of the bubble
accompanying therewith, the operating fluid 94 is vibrated with the
vibration generated. Namely, accompanying the vibration of the
operating fluid 94 within the passage 91, the heat from the CPU 200
mentioned above is transmitted/diffused on a plane thereof, first
with the function of this heat diffusion plate (i.e., the heat
spreader) 90.
[0059] Namely, as is shown in FIG. 6 attached herewith, the heat
generated in the CPU 200, i.e., the heat-generation element, is
transmitted/diffused on the plane, with an aid of the heat
diffusion plate (i.e., the heat spreader) 90, at least covering
over the sufficient area comparing to the surface of the CPU 200
mentioned above, and thereafter, it is transmitted into the
heat-receiving jacket 50 and also into the liquid coolant flowing
in the flow passage 51 within an inside thereof, thereby being
discharged into an outside. In this instance, as was mentioned in
the above, due to the function of the heat diffusion plate 90, the
area of transmitting the heat generated from the CPU 200 to the
heat-receiving jacket 50 is increased, remarkably, in other words,
the heat can be widely diffused over the entire of the
heat-receiving jacket 50, and for this reason, the cooling
efficiency of the heat-generation element is improved up by means
of the heat-receiving (or cooling) jacket. Namely, even at the
position relatively far from the contacting position with the CPU,
the heat-generation can be transmitted to the liquid coolant
flowing within the heat-receiving jacket, therefore enabling to
fully utilize the cooling capacity by means of the heat-receiving
(or cooling) jacket. And, such the cooling system is suitable to be
used in the personal computers, such as being called by the desktop
type and the notebook type, and also the server, etc., and for this
reason, by attaching the heat diffusion plate (i.e., the heat
spreader) thereto, it is possible to provide an electronic
apparatus having a cooling system therein, increasing the cooling
efficiency, further, with utilizing the heat-receiving (or cooling)
jacket, fully.
[0060] However, with the embodiment mentioned above, in particular,
the heat diffusion plate (i.e., the heat spreader) 90, it was
explained that the fine wire 952 building up the heater element 95
thereof is made from the nichrome wire, in particular, because of
the excellent characteristics thereon, when generating the bubble
within the operating fluid 94 through heating due to the pulse-like
electric power thereto, however in the place of the structure
thereof, for example, the heater element 95 may be made, by
laminating a film of, such as, polysilicon or tantalum compound
(TaN), etc., for example, through an insulation film (such as,
SiO.sub.2 layer), i.e., in the form of a resistor film.
[0061] Following to the above, FIG. 7 attached herewith shows the
structure, in particular, of the heat diffusion plate (i.e., the
heat spreader) according to other embodiment, in the electronic
apparatus having the cooling system according to the present
invention. Namely, as is apparent from this figure, according to
the other embodiment, an upper layer having the passages 91, the
buffer potions 92 and the heater elements 95, which build up the
heat diffusion plate 90 mentioned above, is piled up on a lower
layer (having the passages 91', the buffer potions 92' and the
heater elements 95') into two(2)-layer structure, and also the
passages 91, 91' are formed in the directions being orthogonal to
each other. With such the structure, as indicated by arrows in the
figure, the heats generated in the CPU 200, i.e., the
heat-generation element, diffuse covering the entire directions on
the plane, with crossing each other at the right angle, thereby
being transmitted to the entire of the heat-receiving jacket 50
mentioned above. Namely, also with more fully utilizing the
heat-receiving (i.e., cooling) jacket, which is applied into the
personal computers, such as being called by the desktop type and
the notebook type, and also the server, etc., it is possible to
achieve more effective cooling, as the cooling system further
increasing the cooling efficiency thereof.
[0062] Next, FIGS. 8(a) and 8(b) attached herewith shows the
structure of the heat diffusion plate (i.e., the heat spreader) 90,
according to further other embodiment of the present invention.
Thus, in the further other embodiment, in the vicinity of a lower
surface of the heat diffusion plate (i.e., the heat spreader) 90
are provided a plural number of temperature sensors 98, 98 . . . ,
and also the operating fluid 94 within each of the passages 91,
which build up the heat diffusion plate 90, is driven/operated
individually, in the structure thereof.
[0063] Namely, in the heat diffusion plate (i.e., the heat
spreader) 90, according to this further other embodiment, the
pulse-like electric power supplying circuit 97 detects a location
of an increase of temperature upon the lower surface 99 of the heat
diffusion plate 90, with using temperature detection signals from
those temperature sensors 98, which are disposed within the
substrate of the heat diffusion plate 90 mentioned above, and
controls the driving electric power to be supplied to the heater
element 95 provided in each of the passages 91, selectively. Thus,
in the heat diffusion plate 90, the pulse-like electric power is
supplied to (or drive) only the heat element 95 of the passage 91
corresponding to the portion where the temperature rises up
locally. With this, it is possible to promote or enhance the heat
transmission (or diffusion), not upon the entire of the heat
diffusion plate, but only at the necessary portion thereof, thereby
achieving the heat diffusion plate (i.e., the heat spreader) having
an efficiency being much higher.
[0064] Next, FIGS. 9 and 10 attached herewith show further other
structure of the heat diffusion plate (i.e., the heat spreader) 90,
according to the embodiment of the present invention. Thus, in an
example shown in FIG. 9, it is the heat diffusion plate 90, wherein
the passage 91 mentioned above is formed, not in the plural number
thereof, but only one (1) piece of the groove or gutter, and
further the groove is wound around in the zigzag manner over the
entire surface of the heat diffusion plate. However, as shown in
the figure, the heater element, being the means 95 for driving the
operating fluid 94 within the passage 91 (i.e., the actuator), it
is provide at the upper left-hand side in the figure, and on the
contrary to this, the buffer portion 92, in which the
non-condensation gas, such as, the air is enclosed therein, is
formed on the opposite side (i.e., a lower side in the figure) to
the position where this heater element 95 is formed.
[0065] Also, in an example shown in FIG. 10, also the passage 91
formed is made up with one (1) piece of the groove, and is wound
around in the zigzag manner over the entire surface of the heat
diffusion plate, however both ends thereof are connected with each
other, therefore coring a ring-like shape as a whole. However, in
the example of this figure, the heater element 95 building up the
driving means is provided at a central portion on the right-hand
side in the figure, and the buffer portion 92 at the opposite
position to that where this heater element 95 is formed (i.e., the
left-hand side in the figure).
[0066] Namely, in the other example about the passage 91 formed
within the heat diffusion plate (i.e., the heat spreader) 90, the
groove making up the passage 91 is one (1) piece, and the heater
element 95 for building up the driving means is also only one (1)
piece, therefore it can be manufactured easily, and is suitable, in
particular, for the heat diffusion plate (i.e., the heat spreader)
being relatively small in sizes and cheap.
[0067] Next, FIGS. 11 and 12 attached herewith shows, in
particular, an enlarged cross-section view of a portion where the
heater element is disposed, in the heat diffusion plate (i.e., the
heat spreader) according to other embodiment of the present
invention. Namely, with the heat diffusion plate (i.e., the heat
spreader) 90 according to this other embodiment, for example, the
heater element 991 is formed, by winding the fine wire 991 of
nichrome or stainless of diameter about 0.1 mm, around the
periphery of a pair supporting bodies 992 and 992 made of an
inorganic material, such as a ceramic, aligning in parallel with,
as is apparent from FIGS. 12(a) and 12(b), thereby forming it to be
plate-like in an outlook thereof. Thus, for the heater element 990,
it is preferable to be formed, so that it has a large heat
transmission area (i.e., the surface area) but small in the heat
capacity thereof in the structure. Also, a reference numeral 993
depicts supporting bodies for supporting the pair of supporting
bodies 992 and 992 mentioned above at both ends thereof, and also
for attaching the heater element 95 at a predetermined position,
within an inside of the groove 91 formed in the heat diffusion
plate 90, and a reference numeral 994 electrodes. Further, for the
purpose of lessening the heat leakage from the heater element 990
mentioned above, it is preferable to build up the supporting bodies
993, being as small as possible in the cross-section area thereof,
and also with a member having a small heat conductivity.
[0068] Also, as is apparent from FIG. 11 mentioned above, the
heater element 990 formed to be about a plate-like form is disposed
at a position within an inside of the groove 91, so that the
distance from the lower surface on the figure (i.e., the surface on
the side where the heat is transported/discharged into an outside)
is greater than that from the upper side on the figure (i.e., the
side surface upon which the heat-generation element is in contact
with), and also in parallel with those surfaces. Further, so-called
the hydrophilic treatment is conducted on a portion of wall surface
of the groove 91, in particular, the portion opposing to the heater
element 990, for example, through roughing, etc. Further, a
reference numeral 94 also indicates the operating fluid 94 filled
within the inside of the groove 91 mentioned above, and as is clear
from this figure, this heater element 990 is also disposed in an
inside of the groove 91 dipping within the operating fluid 94
filled therein.
[0069] Next, FIGS. 13(a) and 13(b) attached herewith show the
condition where the heater element 990 mentioned above is supplied
with the pulse-like electric power, to be driven therewith.
[0070] First, FIG. 13(a) shows the condition where the heater
element 990 conducts the electricity through it, and because of the
heat-generation of the heater element due to this electric
conduction, a portion of the water, i.e., the operating fluid 94
contacting with this is boiled, abruptly, and due to the pressure
by the gas (i.e., the vapor) S generated, the operating fluid 94
filled within the inside of the groove 91 moves (or be pushed out)
in the direction indicated by an arrow in the figure.
[0071] On the other hand, FIG. 13(b) shows the condition when the
heater element 990 is in non-conductive of electricity, and
accompanying this electric non-conduction, temperature of the
heater element 990 comes down abruptly. At this instance, the vapor
S generated in the above condensed, thereby turning back to the
liquid (W), in a cooling porting at least of a temperature level
lower than that of the heater element 990, thereby steadily taking
the heat therefrom; i.e., on an interior wall surface on the lower
surface shown in the figure (i.e., the side surface for
transporting/discharging the heat into an outside). In this
instance, because of extinction of the vapor S, the operating fluid
94 filled within the inside of the groove 91 is moved (or turned
back) in the direction indicated by an arrow in the figure. Namely,
repetition of the operations mentioned above give the vibration
onto the operating fluid 94.
[0072] However, in this instance, it can be considered that the
operating fluid, i.e., the water will not turn back to the liquid
(W), completely, after turning to the vapor S once, therefore this
remains in the vicinity of the heater element in the form of the
bubble. For this reason, it is desirable that the position of the
heater element 990 be set at the position, appropriately,
confirming through an experiment or the like, so that the heating
surface thereof comes to be in contact with the condensed liquid
(W) with certainty. Also, as mentioned above, if the hydrophilic
treatment is conducted, through such as, the roughing, etc., on a
portion of the wall surface of the groove 91, the liquid (W) can be
condensed on that portion, easily. For this reason, it is
preferable to conduct such the hydrophilic treatment on the surface
of the heater element 990 (in particular, the heater wire),
too.
[0073] Next, FIG. 14 attached herewith shows a variation (i.e.,
other structure of the heater element mentioned above. Namely, as
is apparent from the figure, this example is formed, with useing
three (3) pieces of supporting bodies 992 therein, wherein the
heater wire 991 is wound around between the pair of supporting
bodies 992 located on both sides, in a plural number of times, and
thereafter, by means of the remaining supporting body 992, the
heater wire 991 in the central portion is pushed downward in the
figure. With such the structure, it is possible to locate a large
portion of the heating surface of the heater element 990 as near as
possible to the cooling portion (i.e., the interior wall surface in
the lower side in the figure, in an inside of the groove 91),
thereby increasing the contact area between the heater element 990
and the condensed liquid (W). In other words, it is possible to
accomplish the drive (i.e., vibration) of the operating liquid 94
through the heater element 990, with certainty much more.
[0074] Also, FIG. 15 attached herewith shows the structure, wherein
the heater element is received within the inside of a member made
of a material, being small in the heat capacity and having high
heat conductivity capacity thereof, and further FIG. 16 attached
herewith the structure, wherein the heater element 990" is formed
by winding the heater wire 991, being made from the fine wire of
nichrome or stainless, too, around the periphery of a rod-like
supporting body 992. However, the heater element 990" having the
structure shown in FIG. 16 is inserted from an opening portion
formed on a sidewall of the heat diffusion plate 90 mentioned
above.
[0075] Following to the above, FIG. 17 attached herewith shows the
cooling system for the electronic apparatus, according other
embedment of the present invention, and in this embodiment, without
using the liquid cooling system mentioned above, but upon a surface
on one side of the heat diffusion plate 90, the detailed structure
of which was explained in the above is attached the CPU, i.e., the
heat-generation element, while on a surface of other side is
attached a heat radiation plate (i.e., a heat radiation fin) 300.
Also with such the structure, the heat generated in the CPU 200 is
transported to the heat radiation fin 300 with an aid of the
function of the heat diffusion plate 90, and thereafter, it is
radiated into an outside of the apparatus through the heat
radiation fin 300. However, such the structure is advantageous, for
example, in a case when the distance is far from the position where
the CPU 200 as the heat-generation element is attached up to the
position where the heat radiation fin can be attached.
[0076] Further, FIG. 18 attached herewith shows an example, wherein
the heat radiation fin 300 is attached upon the entire other side
surface of the heat diffusion plate 90. With such the structure, it
is possible to utilize the entire of the heat radiation fin 300,
effectively, in spite of the fact that the area of the CPU 200 as
the heat-generation element is small. Further, FIG. 19 shows a
whole view seeing the heat diffusion plate 90 shown in FIG. 18
mentioned above, from an upper portion (the direction c indicted by
an arrow in FIG. 10).
[0077] Although the explanation was made, mainly, only about the
actuator, as a means for vibrating the operating liquid therewith,
which is enclosed within the plural number of passages (i.e., the
grooves) 91 formed within an inside thereof, for the purpose of
transmitting (diffusing) the heat in the heat diffusion plate
(i.e., the heat spreader) 90, it is a type of heating the operating
liquid 94 by means of the heater element mentioned above, thereby
generating bubbles, however, the present invention should not be
restricted only to such the embodiments as were mentioned in the
above. Thus, for example, as one of those applying such the heat
driving method therein, in the place of the embodiment mentioned
above, further it is also possible of (1) applying a gas to be the
operating liquid, in the place of the liquid mentioned above, and
thereby generate vibration through repetitive
expansion/condensation of the gas due to heating/cooling thereof.
Further, in such a case, a fluid having large latent heat is
applied as the gas to be enclosed within the heat diffusion plate,
in the similar manner to that mentioned above. Alternatively, it is
also possible (2) to use a bimetal in combination with the heating
means, thereby giving vibration to the operating fluid mentioned
above. Further, in the similar manner, it is also possible (3) to
use a shape memory alloy in a part thereof, thereby giving
vibration to the operating fluid mentioned above. Also, differing
from such the heat driving method mentioned above, however it is
also possible to utilize a piezoelectric element, such as so-called
a piezo-element, etc., for example, thereby giving vibration to the
operating fluid mentioned above.
[0078] As was fully explained in the above, according to the
present invention mentioned above, since it is possible to transmit
the heat to the heat radiation plate or the cooling jacket, which
is generated in the heat-generation element having a small surface
area thereof due to small-sizing and high integration of an
element, such as the CPU, etc., for example, with high efficiency,
with using the heat diffusion element/means mentioned above,
thereby improving the cooling efficiency of the heat-generation
element.
[0079] Also, in particular, with attaching the heat diffusion
element/means onto the heat radiation plate or the cooling jacket,
so as to the heat generated from the heat-generation element
through the heat diffusion element/means to the heat radiation
plate or the cooling jacket, the heat is transmitted to the coolant
of a gas or a liquid in contact therewith, to be discharged into an
outside, after being transported/diffused widely over an sufficient
region of the cooling jacket. In this manner, due to the function
of the heat diffusion element/means mentioned above, the area can
be increased remarkably, for the heat generated in the
heat-generation element to be transmitted to the heat radiation
plate or the cooling jacket, thereby improving the cooling
efficiency of the heat-generation element.
[0080] In particular, in a case where the heat diffusion element is
attached on the cooling jacket, within an inside of which the
liquid coolant flows, the heat can be transmitted into the liquid
coolant flowing within the cooling jacket, with certainty, even at
the position relatively far from the position contacting with the
CPU, therefore, it is possible to fully use the cooling capacity by
means of the cooling jacket. And, such the cooling system is
suitable to be used, in particular, in the electronic apparatus,
such as, the personal computers of so-called the desktop type and
the notebook type, as well as, the server, etc.
[0081] The present invention may be embodied in other specific
forms without departing from the spirit or essential feature or
characteristics thereof. The present embodiment(s) is/are therefore
to be considered in all respects as illustrative and not
restrictive, the scope of the invention being indicated by the
appended claims rather than by the forgoing description and range
of equivalency of the claims are therefore to be embraces
therein.
* * * * *