U.S. patent application number 11/068356 was filed with the patent office on 2005-08-11 for method for edge sealing barrier films.
Invention is credited to Burrows, Paul E., Graff, Gordon L., Gross, Mark E., Martin, Peter M., Mast, Eric S., Pagano, J. Chris.
Application Number | 20050176181 11/068356 |
Document ID | / |
Family ID | 25511000 |
Filed Date | 2005-08-11 |
United States Patent
Application |
20050176181 |
Kind Code |
A1 |
Burrows, Paul E. ; et
al. |
August 11, 2005 |
Method for edge sealing barrier films
Abstract
An edge-sealed barrier film composite. The composite includes a
substrate and at least one initial barrier stack adjacent to the
substrate. The at least one initial barrier stack includes at least
one decoupling layer and at least one barrier layer. One of the
barrier layers has an area greater than the area of one of the
decoupling layers. The decoupling layer is sealed by the first
barrier layer within the area of barrier material. An edge-sealed,
encapsulated environmentally sensitive device is provided. A method
of making the edge-sealed barrier film composite is also
provided.
Inventors: |
Burrows, Paul E.;
(Kennewick, WA) ; Pagano, J. Chris; (Santa Clara,
CA) ; Mast, Eric S.; (Richland, WA) ; Martin,
Peter M.; (Kennewick, WA) ; Graff, Gordon L.;
(West Richland, WA) ; Gross, Mark E.; (Pasco,
WA) |
Correspondence
Address: |
DINSMORE & SHOHL LLP
ONE DAYTON CENTRE, ONE SOUTH MAIN STREET
SUITE 1300
DAYTON
OH
45402-2023
US
|
Family ID: |
25511000 |
Appl. No.: |
11/068356 |
Filed: |
February 28, 2005 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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11068356 |
Feb 28, 2005 |
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09966163 |
Sep 28, 2001 |
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6866901 |
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09966163 |
Sep 28, 2001 |
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09427138 |
Oct 25, 1999 |
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6522067 |
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Current U.S.
Class: |
438/127 ;
257/E23.194; 438/758 |
Current CPC
Class: |
C09K 2323/05 20200801;
Y10T 29/49146 20150115; C09K 2323/00 20200801; G02F 1/133337
20210101; H01L 23/562 20130101; H01L 51/5237 20130101; H01L 51/5256
20130101; H01M 50/183 20210101; Y10T 428/239 20150115; H01L 51/003
20130101; Y10T 156/10 20150115; Y02E 60/10 20130101; H01L
2924/12044 20130101; H01L 2924/0002 20130101; H01L 23/564 20130101;
H01L 2924/0002 20130101; H01L 2924/00 20130101 |
Class at
Publication: |
438/127 ;
438/758 |
International
Class: |
H01L 021/44; H01L
021/469; H01L 021/20 |
Claims
What is claimed is:
1. A method of making an edge-sealed barrier film composite
comprising: providing a substrate; and placing at least one initial
barrier stack adjacent to the substrate, the at least one first
initial barrier stack comprising at least one decoupling layer and
at least one barrier layer, wherein a first decoupling layer of a
first initial barrier stack has an area and wherein a first barrier
layer of the first initial barrier stack has an area, the area of
the first barrier layer being greater than the area of the first
decoupling layer, and wherein the first decoupling layer is sealed
by the first barrier layer within the area of the first barrier
layer
2. The method of claim 1 wherein the first initial barrier stack
includes at least two barrier layers, and wherein a second barrier
layer has an area greater than the area of the first decoupling
layer and wherein the first and second barrier layers seal the
first decoupling layer between them.
3. The method of claim 1 wherein there are at least two initial
barrier stacks, wherein a first barrier layer of a second initial
barrier stack has an area greater than the area of the first
decoupling layer of the first initial barrier stack and wherein the
first barrier layer of the first initial barrier stack and the
first barrier layer of the second initial barrier stack seal the
first decoupling layer of the first initial barrier stack between
them.
4. The method of claim 1 wherein placing the at least one initial
barrier stack adjacent to the substrate comprises depositing the at
least one initial barrier stack adjacent to the substrate.
5. The method of claim 4 wherein depositing the at least one
initial barrier stack adjacent to the substrate comprises
depositing at least one decoupling layer before depositing at least
one barrier layer.
6. The method of claim 4 wherein depositing the at least one
initial barrier stack adjacent to the substrate comprises
depositing at least one barrier layer before depositing at least
one decoupling layer.
7. The method of claim 4 wherein depositing the at least one
initial barrier stack adjacent to the substrate comprises:
providing a mask with at least one opening; depositing the first
decoupling layer through the at least one opening in the mask; and
depositing the first barrier layer.
8. The method of claim 4 wherein depositing the at least one
initial barrier stack adjacent to the substrate comprises:
depositing the first decoupling layer having an initial area of
decoupling material which is greater than the area of the first
decoupling layer; etching the first decoupling layer having the
initial area to remove a portion of the decoupling material so that
the first decoupling layer has the area of the first decoupling
layer; and depositing the first barrier layer.
9. The method of claim 8 wherein etching the first decoupling layer
comprises providing a solid mask over the first decoupling layer
having the initial area of decoupling material, and etching the
first decoupling layer having the initial area of decoupling
material to remove the portion of the decoupling material outside
the solid mask so that the first decoupling layer has the area of
the first decoupling layer.
10. The method of claim 8 wherein the first decoupling layer is
etched so that at least one edge of the first decoupling layer has
a gradual slope.
11. The method of claim 8 wherein the first decoupling layer is
etched using a reactive plasma.
12. The method of claim 11 wherein the reactive plasma is selected
from O.sub.2, CF.sub.4, H.sub.2, or combinations thereof.
13. The method of claim 1 wherein at least one initial barrier
stack includes at least two barrier layers.
14. The method of claim 1 wherein at least one initial decoupling
layer includes at least two decoupling layers.
15. The method of claim 1 further comprising placing an
environmentally sensitive device adjacent to the substrate before
the at least one initial barrier stack is placed thereon.
16. The method of claim 1 further comprising placing an
environmentally sensitive device adjacent to the at least one
initial barrier stack after the at least one initial barrier stack
is placed on the substrate.
17. The method of claim 16 further comprising placing at least one
additional barrier stack adjacent to the environmentally sensitive
device on a side opposite the substrate, the at least one
additional barrier stack comprising at least one decoupling layer
and at least one barrier layer, wherein a first decoupling layer of
a first additional barrier stack has an area and wherein a first
barrier layer of the first additional barrier stack has an area,
the area of the first barrier layer of the first additional barrier
stack being greater than the area of the first decoupling layer of
the first additional barrier stack, and wherein the first
decoupling layer of the first additional barrier stack is sealed by
the first barrier layer of the first additional barrier stack
within the area of the first barrier layer.
18. The method of claim 4 further comprising depositing a ridge on
the substrate before depositing the at least one barrier stack
adjacent to the substrate, the ridge interfering with the
deposition of the first decoupling layer so that the area of the
first barrier layer is greater than the area of the first
decoupling layer and the first decoupling layer is sealed by the
first barrier layer within the area of the first barrier layer.
19. The method of claim 1 wherein placing the at least one barrier
stack adjacent to the substrate comprises laminating the at least
one barrier stack adjacent to the substrate.
20. The method of claim 19 wherein the at least one barrier stack
is laminated adjacent to the substrate using a process selected
from heating, soldering, using an adhesive, ultrasonic welding, and
applying pressure.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a division of U.S. patent application
Ser. No. 09/966,163, filed Sep. 28, 2001, and entitled "METHOD FOR
EDGE SEALING BARRIER FILMS" which is a continuation-in-part of U.S.
patent application Ser. No. 09/427,138, filed Oct. 25, 1999,
entitled "ENVIRONMENTAL BARRIER MATERIAL FOR ORGANIC LIGHT EMITTING
DEVICE AND METHOD OF MAKING," now U.S. Pat. No. 6,522,067, issued
Feb. 18, 2003.
BACKGROUND OF THE INVENTION
[0002] The invention relates generally to multilayer, thin film
barrier composites, and more particularly, to multilayer, thin film
barrier composites having the edges sealed against lateral moisture
and gas diffusion.
[0003] Multilayer, thin film barrier composites having alternating
layers of barrier material and polymer material are known. These
composites are typically formed by depositing alternating layers of
barrier material and polymer material, such as by vapor deposition.
If the polymer layers are deposited over the entire surface of the
substrate, then the edges of the polymer layers are exposed to
oxygen, moisture, and other contaminants. This potentially allows
the moisture, oxygen, or other contaminants to diffuse laterally
into an encapsulated environmentally sensitive device from the edge
of the composite, as shown in FIG. 1. The multilayer, thin film
barrier composite 100 includes a substrate 105 and alternating
layers of decoupling material 110 and barrier material 115. The
scale of FIG. 1 is greatly expanded in the vertical direction. The
area of the substrate 105 will typically vary from a few square
centimeters to several square meters. The barrier layers 115 are
typically a few hundred Angstroms thick, while the decoupling
layers 110 are generally less than ten microns thick. The lateral
diffusion rate of moisture and oxygen is finite, and this will
eventually compromise the encapsulation. One way to reduce the
problem of edge diffusion is to provide long edge diffusion paths.
However, this decreases the area of the substrate which is usable
for active environmentally sensitive devices. In addition, it only
lessens the problem, but does not eliminate it.
[0004] A similar edge diffusion problem will arise when a substrate
containing a multilayer, thin film barrier composite is scribed and
separated to create individual components.
[0005] Thus, there is a need for a edge-sealed barrier film
composite, and for a method of making such a composite.
SUMMARY OF THE INVENTION
[0006] The present invention solves this need by providing an
edge-sealed barrier film composite. The composite comprises a
substrate, and at least one initial barrier stack adjacent to the
substrate, the at least one initial barrier stack comprising at
least one decoupling layer and at least one barrier layer, wherein
a first decoupling layer has an area and wherein a first barrier
layer has an area, the area of the first barrier layer being
greater than the area of the first decoupling layer, and wherein
the first decoupling layer is sealed by the first barrier layer
within the area of the first barrier layer. By adjacent, we mean
next to, but not necessarily directly next to. There can be
additional layers intervening between the substrate and the barrier
stacks.
[0007] The first layer can be either a decoupling layer or a
barrier layer, as can the last layer. One or more barrier stacks
can include at least two decoupling layers and/or at least two
barrier layers. When a barrier stack has at least two barrier
layers, a second barrier layer may have an area greater than the
area of the first decoupling layer, and the first and second
barrier layers may seal the first decoupling layer between
them.
[0008] The decoupling layers can be made from materials including,
but not limited to, organic polymers, inorganic polymers,
organometallic polymers, hybrid organic/inorganic polymer systems,
silicates, and combinations thereof. The decoupling layers can be
made of the same decoupling material or different decoupling
materials.
[0009] Suitable barrier materials include, but are not limited to,
metals, metal oxides, metal nitrides, metal carbides, metal
oxynitrides, metal oxyborides, and combinations thereof. Suitable
barrier materials also include, but are not limited to, opaque
metals, opaque ceramics, opaque polymers, and opaque cermets, and
combinations thereof. The barrier layers can be made of the same
barrier material or different barrier material.
[0010] The composite can include an environmentally sensitive
device. Environmentally sensitive devices include, but are not
limited to, organic light emitting devices, liquid crystal
displays, displays using electrophoretic inks, light emitting
diodes, light emitting polymers, electroluminescent devices,
phosphorescent devices, electrophoretic inks, organic solar cells,
inorganic solar cells, thin film batteries, and thin film devices
with vias, and combinations thereof.
[0011] Another aspect of the invention is an edge-sealed,
encapsulated environmentally sensitive device. The edge-sealed,
encapsulated environmentally sensitive device includes: at least
one initial barrier stack comprising at least one decoupling layer
and at least one barrier layer, wherein a first decoupling layer of
a first initial barrier stack has an area and wherein a first
barrier layer of the first initial barrier stack has an area, the
area of the first barrier layer of the first initial barrier stack
being greater than the area of the first decoupling layer of the
first initial barrier stack, and wherein the first decoupling layer
of the first initial barrier stack is sealed by the first barrier
layer of the first initial barrier stack within the area of the
first barrier layer; an environmentally sensitive device adjacent
to the at least one initial barrier stack; and at least one
additional barrier stack adjacent to the environmentally sensitive
device on a side opposite the at least one initial barrier stack,
the at least one additional barrier stack comprising at least one
decoupling layer and at least one barrier layer, wherein a first
decoupling layer of a first additional barrier stack has an area
and wherein a first barrier layer of the first additional barrier
stack has an area, the area of the first barrier layer of the first
additional barrier stack being greater than the area of the first
decoupling layer of the first additional barrier stack, wherein the
first decoupling layer of the first additional barrier stack is
sealed by the first barrier layer of the first additional barrier
stack within the area of the first barrier layer, and wherein the
environmentally sensitive device is sealed between the at least one
initial barrier stack and the at least one additional barrier
stack.
[0012] Another aspect of the invention is a method of making an
edge-sealed barrier film composite. The method includes providing a
substrate, and placing at least one initial barrier stack adjacent
to the substrate, the at least one initial barrier stack comprising
at least one decoupling layer and at least one barrier layer,
wherein a first decoupling layer of a first initial barrier stack
has an area and wherein a first barrier layer of the first initial
barrier stack has an area, the area of the first barrier layer
being greater than the area of the first decoupling layer, and
wherein the first decoupling layer is sealed by the first barrier
layer within the area of the first barrier layer.
[0013] Placing the at least one barrier stack adjacent to the
substrate includes, but is not limited to, depositing the at least
one barrier stack adjacent to the substrate, and laminating the at
least one barrier stack adjacent to the substrate.
[0014] The barrier layers can be deposited before or after the
decoupling layers, depending on the particular application and
structure.
[0015] Depositing the at least one barrier stack may include, but
is not limited to, providing a mask with at least one opening,
depositing the first decoupling layer through the at least one
opening in the mask, and depositing the first barrier layer.
[0016] Alternatively, depositing the at least one barrier stack
adjacent to the substrate may include, but is not limited to,
depositing the first decoupling layer having an initial area of
decoupling material which is greater than the area of the first
decoupling layer, etching the first decoupling layer having the
initial area of decoupling material to remove a portion of the
decoupling material so that the first decoupling layer has the area
of the first decoupling layer, and depositing the first barrier
layer. Etching the first decoupling layer may include, but is not
limited to, providing a solid mask over the first decoupling layer
having the initial area of decoupling material, and etching the
first decoupling layer having the initial area of decoupling
material to remove the portion of the decoupling material outside
the solid mask so that the first decoupling layer has the area of
the first decoupling layer. The first decoupling layer may be
etched so that at least one edge of the first decoupling layer has
a gradual slope. A reactive plasma may be used to etch the
decoupling layers. Reactive plasmas include, but are not limited to
O.sub.2, CF.sub.4, H.sub.2, and combinations thereof.
[0017] The method may include placing an environmentally sensitive
device adjacent to the substrate before the at least one initial
barrier stack is placed thereon. Alternatively, the method may
include placing the environmentally sensitive device adjacent to
the at least one initial barrier stack after the at least one
initial barrier stack is placed on the substrate. The method may
also include placing at least one additional barrier stack adjacent
to the environmentally sensitive device on a side opposite the
substrate, the at least one additional barrier stack comprising at
least one decoupling layer and at least one barrier layer, wherein
a first decoupling layer of a first additional barrier stack has an
area and wherein a first barrier layer of the first additional
barrier stack has an area, the area of the first barrier layer of
the first additional barrier stack being greater than the area of
the first decoupling layer of the first additional barrier stack,
and wherein the first decoupling layer of the first additional
barrier stack is sealed by the first barrier layer of the first
additional barrier stack within the area of the first barrier
layer.
[0018] Laminating the at least one barrier stack adjacent to the
substrate may be performed using a number of processes including,
but not limited to, heat, solder, adhesive, ultrasonic welding, and
pressure.
[0019] The method may include depositing a ridge on the substrate
before depositing the at least one barrier stack adjacent to the
substrate, the ridge interfering with the deposition of the first
decoupling layer so that the area of the first barrier layer is
greater than the area of the first decoupling layer and the first
decoupling layer is sealed by the first barrier layer within the
area of the first barrier layer.
BRIEF DESCRIPTION OF THE DRAWINGS
[0020] FIG. 1 is a cross-section of a barrier composite of the
prior art.
[0021] FIG. 2 is a cross-section of one embodiment of an
edge-sealed, barrier composite of the present invention.
[0022] FIG. 3 is a cross-section of an embodiment of an
edge-sealed, encapsulated environmentally sensitive device of the
present invention.
[0023] FIG. 4 is a cross-section of a second embodiment of an
edge-sealed, encapsulated environmentally sensitive device of the
present invention.
DETAILED DESCRIPTION OF THE INVENTION
[0024] FIG. 2 shows one embodiment of an edge-sealed, barrier
composite 200. The composite 200 includes a substrate 205. The
substrate can be any suitable substrate, and can be either rigid or
flexible. Suitable substrates include, but are not limited to:
polymers, for example, polyethylene terephthalate (PET),
polyethylene naphthalate (PEN), or high temperature polymers, such
as polyether sulfone (PES), polyimides, or Transphan.TM. (a high
glass transition temperature cyclic olefin polymer available from
Lofo High Tech Film, GMBH of Weil am Rhein, Germany); metals and
metal foils; paper; fabric; glass, including thin, flexible, glass
sheet (for example, flexible glass sheet available from Coming Inc.
under the glass code 0211. This particular thin, flexible glass
sheet has a thickness of less than 0.6 mm and will bend at a radium
of about 8 inches.); ceramics; semiconductors; silicon; and
combinations thereof.
[0025] FIG. 2 shows three initial barrier stacks 220 adjacent to
the substrate 205. The initial barrier stacks 220 include a
decoupling layer 210 and a barrier layer 215. The barrier layer 215
has an area greater than the area of the decoupling layer 210. As a
result, the barrier layer 215 extends beyond the edges of the
decoupling layer 210, sealing the decoupling layer 210 within the
area covered by the barrier layer 215. Because the decoupling
layers 210 are sealed within the area covered by the barrier layers
215, ambient moisture, oxygen, and other contaminants cannot
diffuse through the decoupling layers to the environmentally
sensitive device.
[0026] FIG. 2 shows three initial barrier stacks 220. However, the
number of barrier stacks is not limited. The number of barrier
stacks needed depends on the substrate material used and the level
of permeation resistance needed for the particular application. One
or two barrier stacks may provide sufficient barrier properties for
some applications. The most stringent applications may require five
or more barrier stacks.
[0027] Each of the initial barrier stacks 220 shown in FIG. 2 has
one barrier layer 215 and one decoupling layer 210. However, the
barrier stacks can have one or more decoupling layers and one or
more barrier layers. There could be one decoupling layer and one
barrier layer, there could be one or more decoupling layers on one
side of one or more barrier layers, there could be one or more
decoupling layers on both sides of one or more barrier layers, or
there could be one or more barrier layers on both sides of one or
more decoupling layers. The important feature is that the barrier
stack have at least one decoupling layer and at least one barrier
layer. The barrier layers in the barrier stacks can be made of the
same material or of a different material, as can the decoupling
layers. The barrier layers are typically about 100-400 .ANG. thick,
and the decoupling layers are typically about 1000-10,000 .ANG.
thick.
[0028] Although the three initial barrier stacks 220 are shown as
having the same layers in the same order, this is not necessary.
The barrier stacks can have the same or different layers, and the
layers can be in the same or different sequences.
[0029] If there is only one barrier stack and it has only one
decoupling layer and one barrier layer, then the decoupling layer
must be first in order for the barrier layer to seal it, as shown
in FIG. 2. The decoupling layer will be sealed between the
substrate (or the upper layer of the previous barrier stack) and
the barrier layer. Although a composite can be made with a single
barrier stack having one decoupling layer and one barrier layer,
there will typically be at least two barrier stacks, each having
one (or more) decoupling layer and one (or more) barrier layer. In
this case, the first layer can be either a decoupling layer or a
barrier layer, as can the last layer.
[0030] FIG. 3 shows an edge-sealed, encapsulated environmentally
sensitive device 300. There is a substrate 305 with an
environmentally sensitive device 330 adjacent to it. There is a
barrier stack 340 adjacent to the environmentally sensitive device
330. The barrier stack includes one decoupling layer 310 and two
barrier layers 315, 325. The barrier layer 315 has an area greater
than that of the environmentally sensitive device 330. Thus, the
environmentally sensitive device 330 is sealed within the barrier
layer 315. The barrier layers 315, 325 have an area greater than
the area of the decoupling layer 310 so the decoupling layer 310 is
sealed between the barrier layers 315, 325.
[0031] The environmentally sensitive device can be any device
requiring protection from moisture, gas, or other contaminants.
Environmentally sensitive devices include, but are not limited to,
organic light emitting devices, liquid crystal displays, displays
using electrophoretic inks, light emitting diodes, light emitting
polymers, electroluminescent devices, phosphorescent devices,
electrophoretic inks, organic solar cells, inorganic solar cells,
thin film batteries, and thin film devices with vias, and
combinations thereof.
[0032] It is not required that all of the barrier layers have an
area greater than all of the decoupling layers, but at least one of
the barrier layers must have an area greater than at least one of
the decoupling layers. If not all of the barrier layers have an
area greater than of the decoupling layers, the barrier layers
which do have an area greater than the decoupling layers should
form a seal around those which do not so that there are no exposed
decoupling layers within the barrier composite, although, clearly
it is a matter of degree. The fewer the edge areas of decoupling
layers exposed, the less the edge diffusion. If some diffusion is
acceptable, then a complete barrier is not required.
[0033] FIG. 4 shows an edge-sealed, encapsulated environmentally
sensitive device 400. There is a substrate 405 which can be removed
after the device is made, if desired. The environmentally sensitive
device 430 is encapsulated between two initial barrier stacks 420,
422 on one side and one additional barrier stack 440 on the other
side.
[0034] Barrier stack 420 has a barrier layer 415 which has an area
greater than the area of the decoupling layer 410 which seals the
decoupling layer 410 within the area of the barrier layer 415.
Barrier stack 422 has two barrier layers 415, 417 and two
decoupling layers 410, 412. Barrier layer 415 has an area greater
than that of the decoupling layers 410, 412 which seals the
decoupling layers 410, 412 within the area of the barrier layer
415. There is a second barrier layer 417.
[0035] On the other side of the environmentally sensitive device
430, there is an additional barrier stack 440. Barrier stack 440
includes two decoupling layers 410 and two barrier layers 415 which
may be of approximately the same size. Barrier stack 440 also
includes barrier layer 435 which has an area greater than the area
of the decoupling layers 410 which seals the decoupling layers 410
within the area of barrier layer 435.
[0036] The barrier layer which seals the decoupling layer may be
the first barrier layer in the barrier stack, as shown in barrier
stack 420. It may also be a second (or later) barrier layer as
shown in barrier stack 440. Barrier layer 435 which seals the
barrier stack 440 is the third barrier layer in the barrier stack
following two barrier layers 415 which do not seal the barrier
stack. Thus, the use of the terms first decoupling layer and first
barrier layer in the claims does not refer to the actual sequence
of layers, but to layers which meet the limitations. Similarly, the
terms first initial barrier stack and first additional barrier
stack do not refer to the actual sequence of the initial and
additional barrier stacks.
[0037] The barrier stack may include one or more decoupling layers.
The decoupling layers may be made from the same decoupling material
or different decoupling material. The decoupling layer can be made
of any suitable decoupling material, including, but not limited to,
organic polymers, inorganic polymers, organometallic polymers,
hybrid organic/inorganic polymer systems, silicates, and
combinations thereof. Organic polymers include, but are not limited
to, urethanes, polyamides, polyimides, polybutylenes, isobutylene
isoprene, polyolefins, epoxies, parylenes, benzocyclobutadiene,
polynorbornenes, polyarylethers, polycarbonates, alkyds,
polyaniline, ethylene vinyl acetate, ethylene acrylic acid, and
combinations thereof. Inorganic polymers include, but are not
limited to, silicones, polyphosphazenes, polysilazanes,
polycarbosilanes, polycarboranes, carborane siloxanes, polysilanes,
phosphonitriles, sulfur nitride polymers, siloxanes, and
combinations thereof. Organometallic polymers include, but are not
limited to, organometallic polymers of main group metals,
transition metals, and lanthanide/actinide metals, or combinations
thereof. Hybrid organic/inorganic polymer systems include, but are
not limited to, organically modified silicates, preceramic
polymers, polyimide-silica hybrids, (meth)acrylate-silica hybrids,
polydimethylsiloxane-silica hybrids, ceramers, and combinations
thereof.
[0038] The barrier stack may include one or more barrier layers.
The barrier layers may be made from the same barrier material or
different barrier material. The barrier layer can be made from any
suitable barrier material. The barrier material can be transparent
or opaque depending on what the composite is to be used for.
Suitable barrier materials include, but are not limited to, metals,
metal oxides, metal nitrides, metal carbides, metal oxynitrides,
metal oxyborides, and combinations thereof. Metals include, but are
not limited to, aluminum, titanium, indium, tin, tantalum,
zirconium, niobium, hafnium, yttrium, nickel, tungsten, chromium,
zinc, alloys thereof, and combinations thereof. Metal oxides
include, but are not limited to, silicon oxide, aluminum oxide,
titanium oxide, indium oxide, tin oxide, indium tin oxide, tantalum
oxide, zirconium oxide, niobium oxide, hafnium oxide, yttrium
oxide, nickel oxide, tungsten oxide, chromium oxide, zinc oxide,
and combinations thereof. Metal nitrides include, but are not
limited to, aluminum nitride, silicon nitride, boron nitride,
germanium nitride, chromium nitride, nickel nitride, and
combinations thereof. Metal carbides include, but are not limited
to, boron carbide, tungsten carbide, silicon carbide, and
combinations thereof. Metal oxynitrides include, but are not
limited to, aluminum oxynitride, silicon oxynitride, boron
oxynitride, and combinations thereof. Metal oxyborides include, but
are limited to, zirconium oxyboride, titanium oxyboride, and
combinations thereof. Suitable barrier materials also include, but
are not limited to, opaque metals, opaque ceramics, opaque
polymers, and opaque cermets, and combinations thereof. Opaque
cermets include, but are not limited to, zirconium nitride,
titanium nitride, hafnium nitride, tantalum nitride, niobium
nitride, tungsten disilicide, titanium diboride, and zirconium
diboride, and combinations thereof.
[0039] The barrier layers may be deposited by any suitable process
including, but not limited to, conventional vacuum processes such
as sputtering, evaporation, sublimation, chemical vapor deposition
(CVD), plasma enhanced chemical vapor deposition (PECVD), electron
cyclotron resonance-plasma enhanced vapor deposition (ECR-PECVD),
and combinations thereof.
[0040] The decoupling layer can be produced by a number of known
processes which provide improved surface planarity, including both
atmospheric processes and vacuum processes. The decoupling layer
may be formed by depositing a layer of liquid and subsequently
processing the layer of liquid into a solid film. Depositing the
decoupling layer as a liquid allows the liquid to flow over the
defects in the substrate or previous layer, filling in low areas,
and covering up high points, providing a surface with significantly
improved planarity. When the decoupling layer is processed into a
solid film, the improved surface planarity is retained. Suitable
processes for depositing a layer of liquid material and processing
it into a solid film include, but are not limited to, vacuum
processes such as those described in U.S. Pat. Nos. 5,260,095,
5,395,644, 5,547,508, 5,691,615, 5,902,641, 5,440,446, and
5,725,909, which are incorporated herein by reference, and
atmospheric processes such as spin coating and/or spraying.
[0041] One way to make a decoupling layer involves depositing a
polymer precursor, such as a (meth)acrylate containing polymer
precursor, and then polymerizing it in situ to form the decoupling
layer. As used herein, the term polymer precursor means a material
which can be polymerized to form a polymer, including, but not
limited to, monomers, oligomers, and resins. As another example of
a method of making a decoupling layer, a preceramic precursor could
be deposited as a liquid by spin coating and then converted to a
solid layer. Full thermal conversion is possible for a film of this
type directly on a glass or oxide coated substrate. Although it
cannot be fully converted to a ceramic at temperatures compatible
with some flexible substrates, partial conversion to a cross-lined
network structure would be satisfactory. Electron beam techniques
could be used to crosslink and/or densify some of these types of
polymers and can be combined with thermal techniques to overcome
some of the substrate thermal limitations, provided the substrate
can handle the electron beam exposure. Another example of making a
decoupling layer involves depositing a material, such as a polymer
precursor, as a liquid at a temperature above its melting point and
subsequently freezing it in place.
[0042] One method of making the composite of the present invention
includes providing a substrate, and depositing a barrier layer
adjacent to the substrate at a barrier deposition station. The
substrate with the barrier layer is moved to a decoupling material
deposition station. A mask is provided with an opening which limits
the deposition of the decoupling layer to an area which is smaller
than, and contained within, the area covered by the barrier layer.
The first layer deposited could be either the barrier layer or the
decoupling layer, depending on the design of the composite.
[0043] In order to encapsulate multiple small environmentally
sensitive devices contained on a single large motherglass, the
decoupling material may be deposited through multiple openings in a
single shadow mask, or through multiple shadow masks. This allows
the motherglass to be subsequently diced into individual
environmentally sensitive devices, each of which is edge
sealed.
[0044] For example, the mask may be in the form of a rectangle with
the center removed (like a picture frame). The decoupling material
is then deposited through the opening in the mask. The layer of
decoupling material formed in this way will cover an area less than
the area covered by the layer of barrier material. This type of
mask can be used in either a batch process or a roll coating
process operated in a step and repeat mode. With these processes,
all four edges of the decoupling layer will be sealed by the
barrier material when a second barrier layer which has an area
greater than the area of the decoupling layer is deposited over the
decoupling layer.
[0045] The method can also be used in a continuous roll to roll
process using a mask having two sides which extend inward over the
substrate. The opening is formed between the two sides of the mask
which allows continuous deposition of decoupling material. The mask
may have transverse connections between the two sides so long as
they are not in the deposition area for the decoupling layer. The
mask is positioned laterally and at a distance from the substrate
so as to cause the decoupling material to be deposited over an area
less than that of the barrier layer. In this arrangement, the
lateral edges of the decoupling layer are sealed by the barrier
layer.
[0046] The substrate can then be moved to a barrier deposition
station (either the original barrier deposition station or a second
one), and a second layer of barrier material deposited on the
decoupling layer. Since the area covered by the first barrier layer
is greater than the area of the decoupling layer, the decoupling
layer is sealed between the two barrier layers. These deposition
steps can be repeated if necessary until sufficient barrier
material is deposited for the particular application.
[0047] When one of the barrier stacks includes two or more
decoupling layers, the substrate can be passed by one or more
decoupling material deposition stations one or more times before
being moved to the barrier deposition station. The decoupling
layers can be made from the same decoupling material or different
decoupling material. The decoupling layers can be deposited using
the same process or using different processes.
[0048] Similarly, one or more barrier stacks can include two or
more barrier layers. The barrier layers can be formed by passing
the substrate (either before or after the decoupling layers have
been deposited) past one or more barrier deposition stations one or
more times, building up the number of layers desired. The layers
can be made of the same or different barrier material, and they can
be deposited using the same or different processes.
[0049] In another embodiment, the method involves providing a
substrate and depositing a layer of barrier material on the surface
of the substrate at a barrier deposition station. The substrate
with the barrier layer is moved to a decoupling material deposition
station where a layer of decoupling material is deposited over
substantially the whole surface of the barrier layer. A solid mask
is then placed over the substrate with the barrier layer and the
decoupling layer. The mask protects the central area of the
surface, which would include the areas covered by the active
environmentally sensitive devices. A reactive plasma can be used to
etch away the edges of the layer of decoupling material outside the
mask, which results in the layer of etched decoupling material
covering an area less than the area covered by the layer of barrier
material. Suitable reactive plasmas include, but are not limited
to, O.sub.2, CF.sub.4, and H.sub.2, and combinations thereof. A
layer of barrier material covering an area greater than that
covered by the etched decoupling layer can then be deposited,
sealing the etched decoupling layer between the layers of barrier
material.
[0050] To ensure good coverage of the edge of the decoupling layer
by the barrier layer, techniques for masking and etching the
decoupling layer to produce a feathered edge, i.e., a gradual slope
instead of a sharp step, may be employed. Several such techniques
are known to those in the art, including, but not limited to,
standing off the mask a short distance above a polymer surface to
be etched.
[0051] The deposition and etching steps can be repeated until
sufficient barrier material is deposited. This method can be used
in a batch process or in a roll coating process operated in a step
and repeat mode. In these processes, all four edges of the
decoupling layer may be etched. This method can also be used in
continuous roll to roll processes. In this case, only the edges of
the decoupling material in the direction of the process are
etched.
[0052] If a composite is made using a continuous process and the
edged sealed composite is cut in the transverse direction, the cut
edges will expose the edges of the decoupling layers. These cut
edges may require additional sealing if the exposure compromises
barrier performance.
[0053] One method for sealing edges which are to be cut involves
depositing a ridge on the substrate before depositing the barrier
stack. The ridge interferes with the deposition of the decoupling
layer so that the area of barrier-material is greater than the area
of decoupling material and the decoupling layer is sealed by the
barrier layer within the area of barrier material. The ridge should
be fairly pointed, for example, triangular shaped, in order to
interrupt the deposition and allow the layers of barrier material
to extend beyond the layers of decoupling material. The ridge can
be deposited anywhere that a cut will need to be made, such as
around individual environmentally sensitive devices. The ridge can
be made of any suitable material, including, but not limited to,
photoresist and barrier materials, such as described
previously.
[0054] While certain representative embodiments and details have
been shown for purposes of illustrating the invention, it will be
apparent to those skilled in the art that various changes in the
compositions and methods disclosed herein may be made without
departing from the scope of the invention, which is defined in the
appended claims.
* * * * *