U.S. patent application number 10/766832 was filed with the patent office on 2005-08-04 for heat sink-type cooling device for an integrated circuit.
This patent application is currently assigned to DATECH TECHNOLOGY CO., LTD.. Invention is credited to Chu, Chin-Yueh, Li, Nien-Lun.
Application Number | 20050167082 10/766832 |
Document ID | / |
Family ID | 34921231 |
Filed Date | 2005-08-04 |
United States Patent
Application |
20050167082 |
Kind Code |
A1 |
Li, Nien-Lun ; et
al. |
August 4, 2005 |
Heat sink-type cooling device for an integrated circuit
Abstract
A heat sink-type cooling device for an integrated circuit having
a base and plurality of fin extended upward. The plurality of fins
are divided into more than one heat zones and said plurality of
heat zones have a height drop between each two zones wherein a
rectangular hole can also be punched on the plate end of said
plurality of fin which is not connected with said base. By these
heat zones with height drop between each two zones, the heat
sink-type cooling device is able to match up the inner space
allocation of the computer mainframe and be assembled even more
easily into the computer mainframe so that heat is dispersed
efficiently.
Inventors: |
Li, Nien-Lun; (Hsin-Chuang
City, TW) ; Chu, Chin-Yueh; (Hsin-Chuang City,
TW) |
Correspondence
Address: |
TROXELL LAW OFFICE PLLC
SUITE 1404
5205 LEESBURG PIKE
FALLS CHURCH
VA
22041
US
|
Assignee: |
DATECH TECHNOLOGY CO., LTD.
|
Family ID: |
34921231 |
Appl. No.: |
10/766832 |
Filed: |
January 30, 2004 |
Current U.S.
Class: |
165/80.3 ;
257/E23.103 |
Current CPC
Class: |
F28F 3/02 20130101; H01L
23/3672 20130101; H01L 2924/00 20130101; H01L 2924/0002 20130101;
H01L 2924/0002 20130101 |
Class at
Publication: |
165/080.3 |
International
Class: |
F28F 007/00 |
Claims
1-7. (canceled)
8. A heat sink cooling device for an integrated circuit comprising:
a) a base; and b) a plurality of heat zones having: i) at least one
first heat zone having a plurality of first heat zone fins, the
plurality of first heat zone fins having a plurality of first heat
zone vertical plates and a plurality of first heat zone horizontal
plates, each first heat zone vertical plate is located between two
first heat zone horizontal plates of the plurality of first heat
zone horizontal plates, each two first heat zone horizontal plates
including a first top horizontal plate and a first bottom
horizontal plate, each first bottom horizontal plate is connected
to the base and each first top horizontal plate is spaced apart
from the base; and ii) at least one second heat zone having a
plurality of second heat zone fins, the plurality of second heat
zone fins having a plurality of second heat zone vertical plates
and a plurality of second heat zone horizontal plates, each second
heat zone vertical plate is located between two second heat zone
horizontal plates of the plurality of second heat zone horizontal
plates, each two second heat zone horizontal plates including a
second top horizontal plate and a second bottom horizontal plate,
each second bottom horizontal plate is connected to the base and
each second top horizontal plate is spaced apart from the base,
wherein each of the plurality of first heat zone vertical plates
have a height that is higher than a height of each of the plurality
of second heat zone vertical plates and each of the plurality of
first heat zone vertical plates have a bottom in a same plane as a
bottom of each of the plurality of second heat zone vertical
plates.
9. The heat sink cooling device according to claim 8, wherein the
plurality of heat zones includes one first heat zone and one second
heat zone.
10. The heat sink cooling device according to claim 8, wherein the
plurality of heat zones includes one first heat zone and two second
heat zones.
11. The heat sink cooling device according to claim 8, wherein the
plurality of heat zones includes two first heat zones and one
second heat zone.
12. The heat sink cooling device according to claim 8, wherein each
first top horizontal plate and each second top horizontal plate
includes a rectangular hole.
13. The heat sink cooling device according to claim 8, wherein the
plurality of heat zones are formed by bending a metal plate.
Description
FIELD OF THE INVENTION
[0001] The invention relates to a cooling device for an integrated
circuit. More particularly, the invention relates to a heat
sink-type cooling device for an integrated circuit, especially one
which, by more than one heat zones that has height drop between
each two zones, is able to match up the inner space allocation of
the computer mainframe and be assembled more easily into the
computer mainframe so that heat is dispersed efficiently.
DESCRIPTION OF THE RELATED ART
[0002] Accordingly, a heat sink of the prior art (as FIG. 8)
comprises a base 3 and plurality of fin 31 extended upward. Said
plurality of fin 31 is framed by solid mental plate and is set on
said base 3 having the same height. Its usage is to stick said base
3 on the heat source in the computer mainframe (such as CPU) to
make said base 3 absorb the heat of the heat source and conduct it
to plurality of fin to disperse heat. Besides, a fan (as
alternative) can be set upon said plurality of fin of the same
height to inhale the air and direct it to said plurality of fin to
disperse heat.
[0003] The above heat sink has the ability to disperse the heat of
the heat source in the computer mainframe. But, because said
plurality of fin of the same height 31 is set upon said base 3,
when the equipment in the computer mainframe is expanded, the
height of said plurality of fin 31 affect the inner space
allocation of the mainframe and the inner space allocation of the
mainframe is limited by the heat sink. Therefore, usual heat sink
of the prior art does not meet the need of the user.
BRIEF SUMMARY OF THE INVENTION
[0004] Therefore, the purpose of the present invention is to make a
heat sink having more than one heat zone with height drop between
each two zones. The purpose is to make said heat sink be able to
match up the inner space allocation of the computer mainframe and
be installed into the computer mainframe more easily so as to
efficiently disperse heat.
[0005] To achieve the above goals, present invention is a heat
sink-type cooling device for an integrated circuit comprising a
base and plurality of fin extended upward from one end surface of
said base. Said plurality of fin is divided into more than one heat
zones and said plurality of heat zone has height drop between each
two zones. By these heat zones with height drop between each two
zones, said heat sink-type cooling device for an integrated circuit
is able to match up the inner space allocation of the computer
mainframe. Rectangular hole can also be punched on the plate of
said plurality of fin which is not connected with said base so as
to improve the efficiency of heat dispersing of said heat sink-type
cooling device for an integrated circuit.
BRIEF DESCRIPTION OF THE DRAWINGS
[0006] The present invention will be better understood from the
following detailed description of preferred embodiments of the
invention, taken in conjunction with the accompanying drawings, in
which
[0007] FIG. 1 is a perspective view of the first preferred
embodiment according to the present invention;
[0008] FIG. 2 is an exploded view of the structure of the first
preferred embodiment according to the present invention;
[0009] FIG. 3 is a perspective view of the second preferred
embodiment according to the present invention;
[0010] FIG. 4 is a perspective view of the third preferred
embodiment according to the present invention;
[0011] FIG. 5 is a perspective view of the fourth preferred
embodiment according to the present invention;
[0012] FIG. 6 is a perspective view of the fifth preferred
embodiment according to the present invention;
[0013] FIG. 7 is a perspective view of the sixth preferred
embodiment according to the present invention; and
[0014] FIG. 8 is a perspective view of the prior art.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0015] The following descriptions of the preferred embodiments are
provided to understand the features and the structures of the
present invention.
[0016] Please refer to FIG. 1 till FIG. 5, which are a perspective
view of the first preferred embodiment, an exploded view of the
structure of the first preferred embodiment, a perspective view of
the second preferred embodiment, a perspective view of the third
preferred embodiment, and a perspective view of the fourth
preferred embodiment, according to the present invention. As shown
in the above figures, present invention is a heat sink-type cooling
device for an integrated circuit 1 comprising a base 11 and
plurality of fin 12. An end of said plurality of fin 12 is
connected with an end surface of said base and is extended upward.
Said plurality of fin 12 is framed by bending a mental plate into
more than one vertical plate 121 and plurality of horizontal plate
122 which is connected to the said vertical plate by turns. And
said plurality of horizontal plate 122 is divided into more than
one heat zone 13,14 wherein there is drop height between each two
zones. Different type of said heat sink-type cooling device for an
integrated circuit 1a,1b and 1c (as FIG. 3, FIG. 4 and FIG. 5) can
be made according to actual requirements which has different height
drop of said heat zones 13 14. When assembling, said heat sink-type
cooling device for an integrated circuit 1 with said heat zones
having drop height between each two zones 13 and 14 is to fit in
the space allocation of the computer mainframe in effect, which is
to keep away from and be harmony with the electronic components and
connectors on the main board, and is not limited by the original
space allocation of the computer mainframe so that said heat
sink-type cooling device is assembled more easily into the computer
mainframe to efficiently disperse heat. Thereby, a brand new heat
sink-type cooling device for an integrated circuit is constructed
according to the structure mentioned above.
[0017] Please refer to FIG. 6, which is the perspective view of the
fifth embodiment according to present invention. As shown in the
above figure, said heat sink-type cooling device for an integrated
circuit 2 comprises a base 21 and plurality of fin 22 wherein an
end of said plurality of fin 22 is connected with an end surface of
said base 21 and is extended upward. Said plurality of fin is
divided into more than one heat zone 23,24 and said heat zones
23,24 have height drop between each two zones. Said plurality of
fin 22 is framed by bending a mental plate into more than one
vertical plate 221 and plurality of horizontal plate 222 which is
connected with said vertical plates 221 by turns. Each of those
horizontal plates 222 which is not connected with said base is
punched with a rectangular hole 223 and on punching said
rectangular holes 223 on the fins 22, required rectangular holes
223 on the horizontal plates 222 can be punched first, and then
bend said mental plate to form heat zones 23,24 with height drop
between each two zones; or, on punching rectangular holes 223 on
the horizontal plates 222, required rectangle holes 223 on the
horizontal plates 222 can be punched, and simultaneously bend said
mental plate to form heat zones 23,24 with drop height between each
two zones. Said heat zones 23,24 which have drop height between
each two zones are to keep away from and be harmony with the
electronic components and connectors on the main board. As a
result, said heat sink-type cooling device for an integrated
circuit 2 is to fit in the space allocation of the computer
mainframe in effect and is not limited by the original space
allocation of the computer mainframe and said heat sink-type
cooling device 2 can be assembled even more easily into the
computer mainframe. And by the help of the rectangular holes 223 on
the horizontal plates for better ventilation, the efficiency of the
heat dispersing of said heat sink-type cooling device for an
integrated circuit 2 is improved and heat is dispersed
efficiently.
[0018] Please refer to FIG. 7, which is the perspective view of the
sixth embodiment according to present invention. As shown in the
above figure, said heat sink-type cooling device for an integrated
circuit 3 comprises a base 41 and plurality of fin 42 extended from
an end surface of said base 41. Said plurality of fin 42 is divided
into more than one heat zone 43,44 and said heat zones 43,44 have
height drop between each two zones. Each of said plurality of heat
zone 43,44 is framed by bending a mental plate. After said
plurality of heat zone 43,44 is framed by bending said mental
plate, a heat sink-type cooling device for an integrated circuit is
made by putting it on said base 41.
[0019] The preferred embodiments herein disclosed are not intended
to unnecessarily limit the scope of the invention. Therefore,
simple modifications or variations belonging to the equivalent of
the scope of the claims and the instructions disclosed herein for a
patent are all within the scope of the present invention.
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