U.S. patent application number 10/748771 was filed with the patent office on 2005-06-30 for backside cooling apparatus for modular platforms.
Invention is credited to Campini, Edoardo, Handley, William F., Summers, Mark D..
Application Number | 20050141200 10/748771 |
Document ID | / |
Family ID | 34700950 |
Filed Date | 2005-06-30 |
United States Patent
Application |
20050141200 |
Kind Code |
A1 |
Campini, Edoardo ; et
al. |
June 30, 2005 |
Backside cooling apparatus for modular platforms
Abstract
A thermal management apparatus is provided, wherein heat
generated by an electronic component coupled to a backside of a
carrier substrate may be transferred to an opposite front side of
the carrier substrate through a thermal conductor sized to pass
through an opening in the carrier substrate.
Inventors: |
Campini, Edoardo; (Mesa,
AZ) ; Handley, William F.; (Chandler, AZ) ;
Summers, Mark D.; (Phoenix, AZ) |
Correspondence
Address: |
SCHWABE, WILLIAMSON & WYATT, P.C.
PACWEST CENTER, SUITES 1600-1900
1211 SW FIFTH AVENUE
PORTLAND
OR
97204
US
|
Family ID: |
34700950 |
Appl. No.: |
10/748771 |
Filed: |
December 29, 2003 |
Current U.S.
Class: |
361/704 ;
257/E23.084; 257/E23.105 |
Current CPC
Class: |
H01L 23/4006 20130101;
H01L 2924/0002 20130101; H05K 1/0204 20130101; H01L 23/3677
20130101; H01L 2924/0002 20130101; H01L 2924/00 20130101; H05K
2201/1056 20130101 |
Class at
Publication: |
361/704 |
International
Class: |
H05K 007/20 |
Claims
What is claimed is:
1. A thermal management apparatus, comprising: a carrier substrate
having a first side and an opposite second side and an opening
extending from the first side to the second side; and a thermal
conductor dimensioned to fit in the opening to facilitate transfer
of heat generated by an electronic component attached to the first
side for dissipation at the second side.
2. The thermal management apparatus of claim 1, further comprising
a first heat dissipation device couple to the electronic component
and the thermal conductor, and configured to transfer heat
generated by the electronic component to the thermal conductor.
3. The thermal management apparatus of claim 2, wherein the first
heat dissipation device is one of a low profile heat sink and heat
spreader.
4. The thermal management apparatus of claim 2, wherein the carrier
substrate is at least part compliant with a standard and the
aggregate thickness of the component and the first heat dissipation
device is within a dimension requirement of the standard.
5. The thermal management apparatus of claim 4, wherein the
standard is PICMG 3.0 ATCA, and the dimension requirement is 4.66
mm.
6. The thermal management apparatus of claim 5, wherein first side
is covered with a nonconductive material and the aggregate
thickness of the nonconductive material, the component, and the
first heat dissipation device is less than or equal to 4.66 mm.
7. The thermal management apparatus of claim 1, wherein the one or
more thermal conductors are a selected one of a solid core
conductor, a liquid filled conductor and a heat pipe.
8. The thermal management apparatus of claim 1, wherein the device
further comprises a second heat dissipation device disposed on the
second side and thermally coupled to the one or more thermal
conductors to dissipate said heat transferred away from the
component disposed on the first side.
9. The thermal management apparatus of claim 8 wherein the second
heat dissipation device is configured to transfer heat to a
surrounding environment.
10. The thermal management apparatus of claim 9, wherein the second
heat dissipation device is one of an air cooled, liquid cooled,
thermoelectric, and phase change device.
11. The thermal management apparatus of claim 8, wherein the second
heat dissipation device is removably coupled to the thermal
conductors by fasteners and retains the first heat dissipation
device against the first side component.
12. The thermal management apparatus of claim 8 wherein the second
heat dissipation device is configured to thermally couple to a
component disposed on the second side.
13. A modular platform, comprising: a shelf; a plurality of modular
platform boards, at least one of the boards including a thermal
management apparatus, the thermal management apparatus comprising a
carrier substrate having a first side and an opposite second side
and an opening extending from the first side to the second side;
and a thermal conductor dimensioned to fit in the opening to
facilitate transfer of heat generated by an electronic component
attached to the first side for dissipation at the second side.
14. The modular platform of claim 13, further comprising a first
heat dissipation device couple to the electronic component and the
thermal conductor, and configured to transfer heat generated by the
electronic component to the thermal conductor.
15. The modular platform of claim 14, wherein the first heat
dissipation device is one of a low profile heat sink and heat
spreader.
16. The modular platform of claim 14, wherein the carrier substrate
is at least part compliant with a standard and the aggregate
thickness of the component and the first heat dissipation device is
within a dimension requirement of the standard.
17. The modular platform of claim 16, wherein the standard is PICMG
3.0 ATCA, and the dimension requirement is 4.66 mm.
18. The modular platform of claim 17, wherein first side is covered
with a nonconductive material and the aggregate thickness of the
nonconductive material, the component, and the first heat
dissipation device is less than or equal to 4.66 mm.
19. The modular platform of claim 13, wherein the one or more
thermal conductors are a selected one of a solid core conductor, a
liquid filled conductor and a heat pipe.
20. The modular platform of claim 13 wherein the device further
comprises a second heat dissipation device disposed on the second
side and thermally coupled to the one or more thermal conductors to
dissipate said heat transferred away from the component disposed on
the first side.
21. The modular platform of claim 20 wherein the second heat
dissipation device is configured to transfer heat to a surrounding
environment.
22. The modular platform of claim 21, wherein the second heat
dissipation device is one of an air cooled, liquid cooled,
thermoelectric, and phase change devices.
23. The modular platform of claim 20, wherein the second heat
dissipation device is removably coupled to the thermal
conductors.
24. The modular platform of claim 20 wherein the second heat
dissipation device is configured to thermally couple to a component
disposed on the second side.
25. A thermal management method, comprising: providing a carrier
substrate having a first side and an opposite second side and an
opening extending from the first side to the second side, and an
electronic component coupled to the first side; providing a thermal
conductor dimensioned to fit in the opening to facilitate transfer
of heat generated by an electronic component attached to the first
side for dissipation at the second side; and transferring heat from
the electronic component to the second side via the thermal
conductor.
26. The method of claim 25, further comprising: providing a first
heat dissipation device coupled to the electronic component; and
coupling the first heat dissipation device to the thermal
conductor.
27. The method of claim 25, further comprising: providing a second
heat dissipation device; coupling the second heat dissipation
device to the thermal conductor on the second side; transferring
heat from the thermal conductor to the second heat dissipation
device; and transferring heat from the second heat dissipation
device to a surrounding environment.
Description
FIELD OF THE INVENTION
[0001] Embodiments of the invention generally relate to modular
computing systems, such as, systems in accordance or in compliance
with the specification of the Advanced Telecom Computing
Architecture (ATCA). More specifically, disclosed embodiments of
the invention relate to an apparatus and method for cooling
backside components on modular platform boards.
BRIEF DESCRIPTION OF THE DRAWINGS
[0002] The invention is illustrated by way of example and not by
way of limitation in the figures of the accompanying drawings, in
which the like references indicate similar elements and in
which:
[0003] FIG. 1 Illustrates a perspective view of a modular platform
in accordance with an embodiment of the present invention;
[0004] FIG. 2 illustrates a cross sectional view of a thermal
cooling apparatus in accordance with an embodiment of the present
invention; and
[0005] FIG. 3 illustrates an exploded view of a modular platform
board in accordance with an embodiment of the present
invention.
DETAILED DESCRIPTION OF EMBODIMENTS OF THE INVENTION
[0006] In the following detailed description, reference is made to
the accompanying drawings which form a part hereof wherein like
numerals designate like parts throughout, and in which is shown by
way of illustration specific embodiments in which the invention may
be practiced. It is to be understood that other embodiments may be
utilized and structural or logical changes may be made without
departing from the scope of the present invention. Therefore, the
following detailed description is not to be taken in a limiting
sense, and the scope of the present invention is defined by the
appended claims and their equivalents.
[0007] Embodiments of the present invention may provide a thermal
management solution for heat generating electronic components
mounted on the back side of a modular platform board (back side
components), where cooling such electronic components may be
hampered or restricted. Back side electronic components may
include, but are not limited to, semiconductor devices, such as a
microprocessor, that tend to generate significant amounts of
heat.
[0008] Modular platform boards may be used in a variety of modular
platform applications, including, but not limited to enterprise
servers, telecommunications servers, flexi-servers and the like.
One particular example where modular platform boards are being used
is for Advance Telecommunications Computing Architecture (ATCA)
solutions. ATCA requirements are set forth in the PCI Industrial
Computer Manufacturers Group (PICMG) 3.0 ATCA Specification (ATCA
Specification), which is targeted to the next generation of carrier
grade communication equipment.
[0009] FIG. 1 illustrates a perspective view of a modular platform
48 where several high density modular platform boards 52, may be
vertically positioned in a horizontal array within a shelf 50. Due
in part to the vast number of electronic components, modular
platform boards 52 can generate a substantial amount of heat that
must be disposed of to maintain an operable environment. A cooling
medium, such as air, may be pulled in through an intake 58,
circulated past modular platform boards 52 and vented out a shelf
exhaust (not shown) to facilitate cooling of the electronic
components.
[0010] The spacing between adjacent modular platform boards 52 may
often times be minimal, thus leaving little room for components on
the front side 54 of the modular platform board 52, and even less
on the back side 56. As a result, many specifications and design
requirements restrict the overall modular platform profile height
to control the aggregate thickness of electronic components mounted
on the modular platform board.
[0011] For example, the ATCA specification sets forth strict stand
off requirements to control the aggregate thickness on both sides
of the modular platform board. For front side 54, the maximum
component rise from the board, or profile is 21.33 mm. This is
typically enough room for a component, such as a microprocessor,
and an attached heat dissipation device, such as a heat sink. The
backside 56 aggregate thickness limit, however, is 4.66
millimeters, and in some cases may be limited to 2.86 mm. Such a
backside limitation is barely enough to accommodate an electronic
component, much less an effective heat dissipation device.
[0012] The ATCA Specification also requires that the backside 56 of
the modular platform boards 52 be covered with a non-conducting
material to prevent potential shorts with the front side components
of an adjacent modular platform board. This requirement is a result
of the fact that the modular platform boards 52 in an ATCA shelf
are hot swappable, in that the modular platform boards adjacent to
the modular platform board being swapped in or out are energized.
Such a covering, however, effectively eliminates any transfer of
heat from a back side electronic component to the circulating
cooling medium.
[0013] Due at least in part to these limitations (i.e.
inter-modular platform board spacing, aggregate thickness
requirements, and backside coverings) backside electronic
components may not be adequately cooled by the circulating cooling
medium. Accordingly, heat generating back side electronic
components are typically avoided. Embodiments in accordance with
the present invention provide a thermal management system for
thermally transferring the heat generated by a backside component
to the front side of the modular platform where the heat can be
transferred to a circulating cooling medium.
[0014] FIG. 2 illustrates a cross-sectional view of a thermal
management apparatus in accordance with an embodiment of the
present invention. An electronic component 12 is coupled to a back
side 11 of a modular platform board 10. Modular platform board 10
may include, but is not limited to, any carrier substrate, such as
a printed circuit board (PCB) or other substrate form factor that
may allow components to electrically interconnect and accommodate
signal and power routing. Covering 36 may be positioned over
backside 11. Heat generated by electronic component 12 is
affirmatively managed, to avoid over heat and malfunction, which
may ultimately cause the modular platform board to fail.
[0015] A first thermal management apparatus 8 may transfer heat
generated from the electronic component 12 to the front side 13 of
board 10, where the heat can be transferred to the circulating
cooling medium as shown by 42. A low profile heat dissipation
device 14 may be coupled to the backside component 12. Heat
dissipation device 14 may include, but is not limited to a heat
sink, heat spreader, or other such devices. Though not required,
thermal interface material (TIM) 16 may also be disposed between
heat dissipation device 14 and backside component 12 to help ensure
effective heat transfer.
[0016] To accommodate aggregate thickness limitation 38, the heat
dissipation device should have a low profile such that the overall
thickness of the backside component 12, TIM 16 (if used), heat
dissipation device 14 and protective cover 36 is less than or equal
to aggregate thickness limitation 38. For example, as set forth in
the ATCA specification, the overall thickness 38 may be less than
or equal to 4.66 mm.
[0017] Thermal conductors 18 may be thermally and mechanically
coupled to heat dissipation device 14. Thermal conductors 18 may
act to transfer heat away from the heat dissipation device 14 and
electronic component 12. Thermal conductors 18 may be configured to
pass through openings in modular platform board 10, so that they
may transfer heat from the back side 11 to the front side 13. Once
on the front side 13, the heat may be transferred to the
circulating cooling medium.
[0018] Thermal conductors 18 may be constructed of a conductive
material, including, but not limited to, cooper, aluminum, or
various alloys. For higher capacity and transfer rates, more
sophisticated heat transfer devices may be used for thermal
conductors 18, including, but not limited to heat pipes and other
multi phase configurations, liquid transfer mechanisms and
thermoelectric devices.
[0019] Thermal conductors 18 may be independently coupled to heat
dissipation device 14, or may be integrally formed as part of heat
dissipation device 14. Where a liquid cooling loop is used to
transfer heat from the backside 11 to the front side 13, the loop
may be integrated with and circulate through the heat dissipation
device 14 and thermal conductors 18.
[0020] With the heat generated from backside electronic component
12 transferred to the front side 13 of modular platform board 10,
thermal conductors 18 may be thermally coupled to a front side or
second heat dissipation device 20. Front side heat dissipation
device 20 may be configured to efficiently transfer heat 42 from
thermal conductors 18 to the cooling medium being circulated
through the shelf in which the modular platform board 10 is
inserted. Front side heat dissipation device 20 may have a
plurality of projections 28 that create a large surface area that
may enable a greater rate of heat transfer from front side heat
dissipation device 20 to the cooling medium. A variety of heat
dissipation devices can be used for front side heat dissipation
device 20, including, but not limited to, air cooled, liquid
cooled, conduction cooled, thermoelectric, and phase change type
devices.
[0021] Where a plurality of thermal conductors are used, front side
heat dissipation device 20 may have a corresponding number of
apertures 24 positioned and dimensioned to receive corresponding
thermal conductors 18. The front side heat dissipation device may
be removably secured to the thermal conductors 18 using fasteners
22.
[0022] Front side heat dissipation device 20 may be coupled to the
front side 13 of modular platform board 10 and in thermal
communication with thermal conductors 18. Front side heat
dissipation device 20 may also be configured to overlay a front
side electronic component (not shown) that is opposably positioned
on the front side 13 in relation to a back side electronic
component 12. In such a configuration, front side heat dissipation
device may transfer heat from both the front side component, and
the back side component (via the thermal conductors) to the cooling
medium circulating through the shelf.
[0023] Configuring components on opposite sides of modular platform
board may increase the density of the modular platform boards and
take better advantage of the aggregate thickness allowed on both
sides of the modular platform board. Opposibly positioning
components also may shorten the routing and transmission distances
between the back side and front side component, which may improve
component response and performance.
[0024] By positioning electronic components on the backside of a
modular platform board and thermally managing the generated heat,
the logistics of routing between various components, both front and
backside, and routing to various input output devices and back
plain connectors may be simplified and further help maximize board
space.
[0025] FIG. 3 illustrates an exploded view of a thermal management
system in accordance with an embodiment of the present invention. A
modular platform board 105 may have a front panel 130, a back plane
interface 134 a front side 113 and a back side 111. An electronic
component 112 may be coupled to back side 111. One or more openings
124 may extend through modular platform board 105 and be positioned
about the periphery of electronic component 112. Corresponding one
or more thermal conductors 119 may be disposed through openings
124. A low profile backside heat dissipation device 114 may be
coupled to backside electronic component 112 and thermal conductors
119 to transfer heat from electronic component 112 to the front
side 113.
[0026] Front side heat dissipation device 120 may be provided, and
may be configured to transfer heat to the environment. Front side
heat dissipation device may have a plurality of openings 122
configured to receive a corresponding thermal conductor 119. Heat
may then be transferred from back side component 112 through
backside heat dissipation device 114 and thermal conductors 119 to
front side heat dissipation device 120, which in turn may transfer
the heat to the environment.
[0027] Although specific embodiments have been illustrated and
described herein for purposes of description of the preferred
embodiment, it will be appreciated by those of ordinary skill in
the art that a wide variety of alternate and/or equivalent
implementations calculated to achieve the same purposes may be
substituted for the specific embodiment shown and described without
departing from the scope of the present invention. Those with skill
in the art will readily appreciate that the present invention may
be implemented in a very wide variety of embodiments. This
application is intended to cover any adaptations or variations of
the embodiments discussed herein. Therefore, it is manifestly
intended that this invention be limited only by the claims and the
equivalents thereof.
* * * * *