U.S. patent application number 10/818025 was filed with the patent office on 2005-06-30 for solid electrolytic capacitor, fabrication method thereof, and coupling agent utilized in the same.
Invention is credited to Tsai, Li Duan, Tseng, Wen Nan, Wu, Chun-Guey.
Application Number | 20050141173 10/818025 |
Document ID | / |
Family ID | 34699339 |
Filed Date | 2005-06-30 |
United States Patent
Application |
20050141173 |
Kind Code |
A1 |
Tseng, Wen Nan ; et
al. |
June 30, 2005 |
SOLID ELECTROLYTIC CAPACITOR, FABRICATION METHOD THEREOF, AND
COUPLING AGENT UTILIZED IN THE SAME
Abstract
A solid electrolytic capacitor, fabrication method, and coupling
agent utilized in the same. The capacitor includes a valve metal
layer, an oxide dielectric layer on at least a part of the surface
of the valve metal layer, a coupling layer having a molecular chain
with a first end bonding to the oxide dielectric layer by covalent
bonding and second end with a functional group of a monomer of a
conducting polymer, and a conducting polymer layer bonding to the
monomer by covalent bonding.
Inventors: |
Tseng, Wen Nan; (Nantou
City, TW) ; Tsai, Li Duan; (Hsinchu City, TW)
; Wu, Chun-Guey; (Hualien City, TW) |
Correspondence
Address: |
THOMAS, KAYDEN, HORSTEMEYER & RISLEY, LLP
100 GALLERIA PARKWAY, NW
STE 1750
ATLANTA
GA
30339-5948
US
|
Family ID: |
34699339 |
Appl. No.: |
10/818025 |
Filed: |
April 5, 2004 |
Current U.S.
Class: |
361/525 |
Current CPC
Class: |
H01G 9/025 20130101;
Y02E 60/13 20130101; H01G 11/56 20130101 |
Class at
Publication: |
361/525 |
International
Class: |
H01G 009/02 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 26, 2003 |
TW |
92137052 |
Claims
1. A solid electrolytic capacitor, comprising: a valve metal layer;
an oxide dielectric layer overlying at least parts of the surface
of the valve metal layer; a coupling layer having a molecular chain
with a first end bonding to the oxide dielectric layer with
covalent bonding and second end with a functional group of a
monomer of a conducting polymer; and a conducting polymer layer
bonding to the monomer with covalent bonding.
2. The capacitor as claimed in claim 1, wherein the valve metal
layer is aluminum, tantalum, titanium, niobium, niobium oxide, or
combinations thereof.
3. The capacitor as claimed in claim 1, wherein the oxide
dielectric layer is an oxide of the vale metal layer.
4. The capacitor as claimed in claim 1, wherein the bonding between
the coupling layer and oxide dielectric layer is silicon-oxygen
bonding, phosphorous-oxygen bonding, carbon-oxygen bonding,
sulfur-oxygen boding, or boron-oxygen bonding.
5. The capacitor as claimed in claim 1, wherein the functional
group of the monomer is aniline, thiophene, pyrrole, or derivatives
thereof.
6. The capacitor as claimed in claim 1, wherein the functional
group of monomer is aniline.
7. The capacitor as claimed in claim 1, wherein the molecular chain
of the coupling layer further comprises an alkyl group of C1 to C12
between the first end and second end.
8. The capacitor as claimed in claim 1, wherein the conducting
polymer is polyaniline, polythiphere, polypyrrole, or derivatives
thereof.
9. The capacitor as claimed in claim 1, wherein the conducting
polymer layer is polyaniline.
10-24. (canceled)
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a passive device and
fabrication method thereof, and in particularly to a fabrication
method for a solid electrolytic capacitor and coupling agent
utilized in the same.
[0003] 2. Description of the Related Art
[0004] A major object of electrolytic capacitors' development is to
improve the conductivity of an electrolyte in order to reduce the
equivalent series resistance (ESR) thereof, thereby achieving the
properties of low resistance at high frequency and superior
reliability. Conducting polymers have higher conductivity than
liquid electrolyte, solid organic semiconductor complex salts such
as TCNQ, or manganese oxide used in conventional electrolytic
capacitors, and can further serve as insulators at high
temperature. Therefore, conducting polymers are currently the most
popular materials used for solid electrolytes in electrolytic
capacitors.
[0005] FIG. 1 is a zoom-in cross-section of a portion of the micro
structure of a solid electrolytic capacitor. A valve metal 100 is a
meso-porous material acting as a positive electrode. A dielectric
layer 110 is disposed on the valve metal 100. A conducting polymer
layer 120, acting as a negative electrode, is disposed on the
dielectric layer 110. The conducting polymer layer 120 bonds to the
dielectric layer 110 with only van der Waal's force, which is too
weak to prevent the formation of a void 121 between the dielectric
layer 110 and conducting polymer layer 120, thus the electrical
performance of the capacitor suffers, resulting in loss of
capacitance, increases in ESR and dissipation factor (DF), and
further negatively affecting the reliability of the capacitor.
[0006] Sato et al., in JP9246106, disclose a before-treatment
procedure using a silane coupling agent, such as
gamma-glycidoxypropyltrimethoxysil- ane or
octadecyl-triethoxysilane, on a forming aluminum foil, followed by
forming a conducting polymer layer thereon. The coupling agent used
therein, however, comprises functional groups which negatively
affect the conductivity of the conducting polymer, resulting in the
increase of ESR and DF.
[0007] Sakata et al., in U.S. Pat. No. 5,729,428, disclose a
before-treatment procedure using an organic compound, such as
organic acid, phenol, silane coupling agent, aluminum coupling
agent, and titanium coupling agent, followed by forming a
conducting polymer layer thereon, in order to improve leakage at
high temperature. Hahn et al., in U.S. Pat. No. 6,072,694, disclose
an electrolytic capacitor whose adhesion of a conducting polymer
film to an oxidized porous pellet anode is improved by the
incorporation of a silane coupling agent in the polymer
impregnating solution, in order to improve leakage and dissipation
factor thereof. The coupling agents used by these two arts,
however, cannot bond to both conducting polymers and dielectric
materials, thus limiting the effect of assisting the connection of
conducting polymers and dielectric materials.
SUMMARY OF THE INVENTION
[0008] Thus, objects of the present invention are to provide a
solid electrolytic capacitor, and fabrication method thereof, and
coupling agent utilized in the same, in order to provide a coupling
layer between a conducting polymer layer and dielectric layer,
capable of bonding to both the conducting polymer layer and
dielectric layer by covalent bonding, improving the adhesion and
preventing voids from forming therebetween, thereby improving the
electrical performance and reliability of the solid electrolytic
capacitor.
[0009] In order to achieve the described objects, the present
invention provides a solid electrolytic capacitor having a valve
metal layer, an oxide dielectric layer overlying at least parts of
the surface of the valve metal layer, a coupling layer having a
molecular chain with a first end bonding to the oxide dielectric
layer with covalent bonding and second end with a functional group
of a monomer of a conducting polymer, and a conducting polymer
layer bonding to the monomer with covalent bonding.
[0010] The present invention further provides a fabrication method
for a solid electrolytic capacitor. First, a valve metal layer is
provided. Then, an oxide dielectric layer is formed overlying at
least parts of the surface of the valve metal layer. Further, a
coupling layer is formed on the oxide dielectric layer by
self-assembly process. The coupling layer has a molecular chain
with a first end bonding to the oxide dielectric layer with
covalent bonding and second end with a functional group of a
monomer of a conducting polymer. Finally, a conducting polymer
layer is formed bonding to the monomer with covalent bonding.
[0011] The present invention further provides a coupling agent for
forming covalent bonds with an oxide layer and a conducting polymer
layer by self-assembly process, comprising a formula (1) of:
R.sub.1--R.sub.3 (1)
[0012] wherein R.sub.1 is silyl, phosphono, carboxy, sulfo, boric
acid group, or derivatives thereof, and R3 is one of the polymer
monomers.
[0013] The present invention further provides a coupling agent for
forming covalent bonds with an oxide layer and a conducting polymer
layer by self-assembly process, comprising a formula (2) of:
R.sub.1--R.sub.2--R.sub.3 (2)
[0014] wherein R.sub.1 is silyl, phosphono, carboxy, sulfo, boric
acid group, or derivatives thereof, R.sub.2 is an alkyl group of C1
to C12, and R.sub.3 is one of the polymer monomers.
BRIEF DESCRIPTION OF THE DRAWINGS
[0015] The present invention can be more fully understood by
reading the subsequent detailed description in conjunction with the
examples and references made to the accompanying drawings,
wherein:
[0016] FIG. 1 is a zoom-in cross-section of a structure of a
conventional solid electrolytic capacitor.
[0017] FIGS. 2A through 2D are cross-sections of the fabrication
method for a solid electrolytic capacitor of the present
invention.
[0018] FIGS. 3A through 3C are schematic drawings of a reaction
mechanism of a coupling agent of the present invention forming a
covalent bond to both oxide dielectric layer 210 and conducting
polymer 230 in the solid electrolytic capacitor of the present
invention.
DETAILED DESCRIPTION OF THE INVENTION
[0019] The following embodiments are intended to illustrate the
invention more fully without limiting the scope of the claims,
since numerous modifications and variations will be apparent to
those skilled in this art.
[0020] FIGS. 2A through 2D are cross-sections of the fabrication
method of a solid electrolytic capacitor of the present
invention.
[0021] In FIG. 2A, first, a valve metal layer 200, typically a
meso-porous material such as aluminum, tantalum, titanium, niobium,
niobium oxide, or combinations thereof, is provided. Then, an oxide
dielectric layer 210 is formed overlying at least parts of the
surface of the valve metal layer 200. Thus, the exposed valve metal
layer 200 can electrically connect to other electrical devices to
act as a positive electrode for a solid electrolytic capacitor of
the present invention. The oxide dielectric layer 210 is preferably
an oxide of the valve metal layer 200.
[0022] Next, a solution comprising a coupling agent of the present
invention is provided. The coupling agent enables formation of a
covalent bond with an oxide such as the oxide dielectric layer 210
and polymer by self-assembly process, comprising a formula (3)
of:
R.sub.1--R.sub.2--R.sub.3 (3)
[0023] wherein R.sub.1 is preferably silyl, phosphono, carboxy,
sulfo, boric acid group, or derivatives thereof, R.sub.2 is
preferably an alkyl group of C0 to C12, and R.sub.3 is preferably
one of the monomers of the polymer. "C0", indicates "R.sub.2" is
empty and "R.sub.1" directly bonds to "R.sub.3". For example, the
polymer acting as the conducting polymer layer of the present
invention can be polyaniline, polythiophene, polypyrrole, or
derivatives thereof, so "R.sub.3" is preferably aniline, thiophene,
pyrrole, or derivatives thereof.
[0024] In FIG. 2B, a coupling agent 220 is formed overlying the
oxide dielectric layer 210 by self-assembly process resulting from
the R.sub.1 end of the molecular chains of the coupling agent of
the present invention bonding to the oxide dielectric layer 210 by
covalent bonding. The reaction mechanism is shown in FIGS. 3A and
3B. The formula of the coupling agent shown in FIGS. 3A through 3C
matches the formula (3), wherein "R.sub.1" is trimethoxysilyl group
(--Si(MeO).sub.3), a derivative of silyl, "R.sub.2" is propyl
group, and "R.sub.3" is aniline, naming
3-(phenylamino)propyltrimethoxysilane. Note that the coupling agent
shown in FIGS. 3A through 3C is an example, and is not intended to
limit the scope of the present invention. Those skilled in the art
will recognize the possibility of using various coupling agents
with formulas matching the formula (3) to achieve the reaction
mechanism shown in FIGS. 3A through 3C.
[0025] In FIG. 3A, the oxide dielectric layer 210, having hydroxyl
groups on its surface, is immersed in a solution of
3-(phenylamino)propyltrimeth- oxysilane comprising methyl alcohol
acting as a solvent, starting self-assembly reaction between the
hydroxyl groups and trimethoxysilyl.
[0026] In FIG. 3B, during the self-assembly reaction between the
hydroxyl groups of the oxide dielectric layer 210 and
trimethoxysilyl of 3-(phenylamino)propyltrimethoxysilane,
silicon-oxygen bonding is formed between the oxygen atoms of the
oxide dielectric layer 210 and silicon atoms of
3-(phenylamino)propyltrimethoxysilane. The trimethoxy group of
trimethoxysilyl group (R.sub.1) is removed by forming methyl
alcohol with the hydrogen atoms of the hydroxyl groups on the
surface of the oxide dielectric layer 210. Thus, the silicon atoms
of the coupling agent of the present invention bonds to the oxygen
atoms on the surface of the oxide dielectric layer 210 with
covalent bonding, thereby forming the coupling layer 220 shown in
FIG. 2B.
[0027] Next, in FIG. 2C, a conducting polymer layer 230 is formed
bonding to the "R.sub.3" end of the molecular chains of the
coupling layer 220 with covalent bonding. The conducting polymer
layer 230 preferably comprises the same monomers as "R.sub.3", such
as polyaniline, polythiophene, polypyrrole, or derivatives
thereof.
[0028] FIG. 3C, continuing from FIG. 3B, is an example of a
polymerization reaction mechanism during formation of the
conducting polymer layer 230 shown in FIG. 2C. Because the coupling
agent used in FIGS. 3A and 3B is
3-(phenylamino)propyltrimethoxysilane, the coupling layer 220 is
immersed in a polymerization solution comprising aniline monomers,
resulting in forming polyaniline bonding to the aniline ("R.sub.3"
end) of the coupling agent 220 by covalent bonding, thereby forming
the conducting polymer layer 230. Thus, the solid electrolytic
capacitor of the present invention is achieved.
[0029] Finally, in FIG. 2D, conductive pastes, such as a carbon
paste layer 240 and silver paste layer 250 are sequentially formed
overlying the conducting polymer layer 230, acting as a leading
electrode of the negative electrode of the solid electrolytic
capacitor of the present invention and protecting conducting
polymer layer 230.
[0030] The subsequent four examples and one comparative example are
performed to further describe the results of the present
invention.
EXAMPLE 1
[0031] First, an etched aluminum foil (forming voltage thereof was
approximately 36V and area thereof was 0.6 cm times 2.0 cm) having
an alumina dielectric layer thereon was immersed in a solution of
3-(phenylamino)propyltrimethoxysilane comprising methyl alcohol
acting as solvent with concentration of about 0.1 to 50 wt %,
followed by drying at approximately 105.degree. C. Then, the dried
specimen was immersed in a polymerization solution comprising
respectively 0.5M of aniline, methanesulfonic acid, and ammonium
persulfate for approximately 30 minutes, followed by cleaning with
D. I. water and drying at approximately 105.degree. C. for 10
minutes. Next, the described immersion, cleaning, and drying step
series were repeated 10 times. Further, a carbon paste layer was
coated on the polyaniline layer, followed by drying at
approximately 100.degree. C. for 1 hour. Finally, a silver paste
layer was coated overlying the carbon paste layer, followed by
drying at approximately 100.degree. C. for 1 hour, thereby
completing the fabrication of the solid electrolytic capacitor
shown in FIG. 2D. The measurement results of the electrical
performance thereof are listed in Table 1.
EXAMPLE 2
[0032] First, an etched aluminum foil (forming voltage thereof was
approximately 36V and area thereof was 0.6 cm times 2.0 cm) having
an alumina dielectric layer thereon was immersed in a solution of
4-(4-aminophneyl)butyric acid comprising methyl alcohol acting as
solvent with concentration of about 0.1 to 50 wt %, followed by
drying at approximately 105.degree. C. Then, the dried specimen was
immersed in a polymerization solution comprising respectively 0.5M
of aniline, methanesulfonic acid, and ammonium persulfate for
approximately 30 minutes, followed by cleaning with D. I. water and
drying at approximately 105.degree. C. for 10 minutes. Next, the
described immersion, cleaning, and drying step series were repeated
10 times. Further, a carbon paste layer was coated on the
polyaniline layer, followed by drying at approximately 100.degree.
C. for 1 hour. Finally, a silver paste layer was coated overlying
the carbon paste layer, followed by drying at approximately
100.degree. C. for 1 hour, thereby completing the fabrication of
the solid electrolytic capacitor shown in FIG. 2D. The measurement
results of the electrical performance thereof are listed in Table
1.
EXAMPLE 3
[0033] First, an etched aluminum foil (forming voltage thereof was
approximately 36V and area thereof was 0.6 cm times 2.0 cm) having
an alumina dielectric layer thereon was immersed in a solution of
aniline-2-sulfonic acid comprising methyl alcohol acting as solvent
with concentration of about 0.1 to 50 wt %, followed by drying at
approximately 105.degree. C. Then, the dried specimen was immersed
in a polymerization solution comprising respectively 0.5M of
aniline, methanesulfonic acid, and ammonium persulfate for
approximately 30 minutes, followed by cleaning with D. I. water and
drying at approximately 105.degree. C. for 10 minutes. Next, the
described immersion, cleaning, and drying step series were repeated
10 times. Further, a carbon paste layer was coated on the
polyaniline layer, followed by drying at approximately 100.degree.
C. for 1 hour. Finally, a silver paste layer was coated overlying
the carbon paste layer, followed by drying at approximately
100.degree. C. for 1 hour, thereby completing the fabrication of
the solid electrolytic capacitor shown in FIG. 2D. The measurement
results of the electrical performance thereof are listed in Table
1.
EXAMPLE 4
[0034] First, an etched aluminum foil (forming voltage thereof was
approximately 36V and area thereof was 0.6 cm times 2.0 cm) having
an alumina dielectric layer thereon was immersed in a solution of
3-aminophenylboronic acid comprising methyl alcohol acting as
solvent with concentration of about 0.1 to 50 wt %, followed by
drying at approximately 105.degree. C. Then, the dried specimen was
immersed in a polymerization solution comprising respectively 0.5M
of aniline, methanesulfonic acid, and ammonium persulfate for
approximately 30 minutes, followed by cleaning with D. I. water and
drying at approximately 105.degree. C. for 10 minutes. Next, the
described immersion, cleaning, and drying step series were repeated
10 times. Further, a carbon paste layer was coated on the
polyaniline layer, followed by drying at approximately 100.degree.
C. for 1 hour. Finally, a silver paste layer was coated overlying
the carbon paste layer, followed by drying at approximately
100.degree. C. for 1 hour, thereby completing the fabrication of
the solid electrolytic capacitor shown in FIG. 2D. The measurement
results of the electrical performance thereof are listed in Table
1.
COMPARATIVE EXAMPLE
[0035] First, an etched aluminum foil (forming voltage thereof was
approximately 36V and area thereof was 0.6 cm times 2.0 cm) having
an alumina dielectric layer thereon was immersed in a
polymerization solution comprising respectively 0.5M of aniline,
methanesulfonic acid, and ammonium persulfate for approximately 30
minutes, followed by cleaning with D. I. water and drying at
approximately 105.degree. C. for 10 minutes. Then, the described
immersion, cleaning, and drying step series were repeated 10 times.
Further, a carbon paste layer was coated on the polyaniline layer,
followed by drying at approximately 100.degree. C. for 1 hour.
Finally, a silver paste layer was coated overlying the carbon paste
layer, followed by drying at approximately 100.degree. C. for 1
hour, thereby completing the fabrication of the solid electrolytic
capacitor shown in FIG. 2D. The measurement results of the
electrical performance thereof listed in Table 1.
1 TABLE 1 Capacitance (.mu.F) ESR (m.OMEGA.) DF (%) 120 Hz 100 kHz
120 Hz Example 1 44.06 31.65 1.34 Example 2 42.05 35.70 1.43
Example 3 40.88 36.68 1.48 Example 4 41.56 35.48 1.43 Comparative
36.39 49.23 1.54 Example
[0036] Results
[0037] As shown in Table 1, capacitance of all the solid
electrolytic capacitors of the present invention (examples 1
through 4) is greater than that of the conventional solid
electrolytic capacitor (comparative example) whose conducting
polymer layer bonds to the alumina dielectric layer with only van
der Waal's force. The ESR and DF of all the solid electrolytic
capacitors of the present invention are less than that of the
conventional solid electrolytic capacitor.
[0038] Thus, the results show the efficacy of the inventive solid
electrolytic capacitor fabrication method and coupling agent
utilized therein in improving the adhesion and preventing voids
from forming in the conducting polymer layer and dielectric layer
interface thereof resulting from providing a coupling layer
therebetween, bonding to both the conducting polymer layer and
dielectric layer with covalent bonding, improving the electrical
performance and reliability of the solid electrolytic capacitor of
the present invention.
[0039] Although the present invention has been particularly shown
and described with reference to the preferred specific embodiments
and examples, it is anticipated that alterations and modifications
thereof will no doubt become apparent to those skilled in the art.
It is therefore intended that the following claims be interpreted
as covering all such alteration and modifications as fall within
the true spirit and scope of the present invention.
* * * * *