U.S. patent application number 10/838175 was filed with the patent office on 2005-06-09 for method and apparatus for substrate temperature control.
Invention is credited to Lane, John, Melcer, Chris, Straube, Ralph H.M..
Application Number | 20050120805 10/838175 |
Document ID | / |
Family ID | 34636626 |
Filed Date | 2005-06-09 |
United States Patent
Application |
20050120805 |
Kind Code |
A1 |
Lane, John ; et al. |
June 9, 2005 |
Method and apparatus for substrate temperature control
Abstract
A method and apparatus for gas control is provided. The
apparatus may be used for controlling gases delivered to a chamber,
controlling the chamber pressure, controlling the delivery of
backside gas between a substrate and substrate support and the
like. In one embodiment, an apparatus for controlling gas control
includes at least a first flow sensor having a control valve, a
first pressure sensor and at least a second pressure sensor. An
inlet of the first flow sensor is adapted for coupling to a gas
supply. A control valve is coupled to an outlet of the flow sensor.
The first pressure sensor is adapted to sense a metric indicative
of the pressure upstream of the first flow sensor. The second
pressure sensor is adapted to sense a metric indicative of the
pressure downstream of the control valve.
Inventors: |
Lane, John; (San Jose,
CA) ; Straube, Ralph H.M.; (Mountain View, CA)
; Melcer, Chris; (Sunnyvale, CA) |
Correspondence
Address: |
MOSER, PATTERSON & SHERIDAN, LLP/
APPLIED MATERIALS, INC.
3040 POST OAK BOULEVARD, SUTIE 1500
HOUSTON
TX
77056
US
|
Family ID: |
34636626 |
Appl. No.: |
10/838175 |
Filed: |
May 3, 2004 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
60527428 |
Dec 4, 2003 |
|
|
|
Current U.S.
Class: |
73/861 |
Current CPC
Class: |
H01J 37/32449 20130101;
C23C 16/466 20130101; H01J 37/3244 20130101; C23C 16/45557
20130101 |
Class at
Publication: |
073/861 |
International
Class: |
G01M 009/00 |
Claims
What is claimed is:
1. Apparatus for gas control, comprising: at least a first flow
sensor having an inlet adapted for coupling to a gas supply by a
first gas line; a control valve; a second gas line coupled to an
outlet of the flow sensor and an inlet of the control valve; a
third gas line coupled to an outlet of the control valve; a
upstream pressure sensor coupled to the first gas line and adapted
to sense a metric indicative of pressure within the first gas line;
and a downstream pressure sensor coupled to the third gas line and
adapted to sense a metric indicative of pressure within the third
gas line.
2. The apparatus of claim 1 further comprising: a bypass line
coupled to the third gas line.
3. The apparatus of claim 2, wherein the bypass line further
comprises: a restrictor sized such that flow is choked and
proportional to the downstream pressure sensor; and a bypass valve
coupled in parallel.
4. The apparatus of claim 3 further comprising: a vacuum source
coupled in parallel to outlets of the restrictor and bypass
valve.
5. The apparatus of claim 4, wherein the vacuum source provides a
pressure at least 2 times less than a pressure in the third gas
line.
6. The apparatus of claim 1 further comprising: an intermediate
pressure sensor adapted to provide a metric of pressure in the
second gas line, wherein a flow of gas passing through the second
gas line may be expressed as: 2 F A = F S + F P S ( P S t , V s ) -
F P ( P t ) where: F.sub.S is the flow sensed by the flow sensor; P
is the pressure sensed in the first gas line; P.sub.S is the
pressure sensed in the second gas line; and V.sub.S is the volume
between flow sensor and the control valve in the second gas
line.
7. The apparatus of claim 6 further comprising: a bypass control
branch teed to the third gas line and having a bypass restrictor; a
bypass valve coupled in parallel to the bypass restrictor; and a
vacuum source coupled in parallel to outlets of the bypass
restrictor and the bypass valve.
8. The apparatus of claim 1 further comprising: an intermediate
pressure sensor coupled to the second gas line and adapted to sense
a metric indicative of pressure within the second gas line and;
9. The apparatus of claim 8, wherein a flow of gas passing through
an outlet of the apparatus downstream of the downstream pressure
sensor may be expressed as: F.sub.W=F.sub.A-F.sub.BLEED(P.sub.W)
where: F.sub.A is the flow measured by the flow sensor; F.sub.BLEED
is the flow to the vacuum source; and P.sub.W is the pressure
sensed in the third gas line
10. The apparatus of claim 9, wherein the flow of gas to the vacuum
source is at least one of measured or factory calibrated.
11. The apparatus of claim 2, wherein the bypass line is disposed
downstream of the downstream pressure sensor.
12. The apparatus of claim 2 further comprising: a bypass pressure
sensor coupled to the bypass control branch and adapted to sense a
metric indicative of pressure within the bypass control branch.
13. The apparatus of claim 1, wherein the third gas line is coupled
to a processing chamber.
14. The apparatus of claim 16, wherein the third gas line is routed
through a substrate support disposed in the processing chamber.
15. The apparatus of claim 1, wherein the control valve, the flow
sensor, and up to three pressure sensors define a first sub-circuit
having a first gas outlet; and a second sub-circuit configured
substantially identical to the first sub-circuit and having a
second gas outlet.
16. The apparatus of claim 15, wherein the outlet of the first
sub-circuit is coupled to a first substrate support and the outlet
of the second sub-circuit is coupled to a second substrate
support.
17. The apparatus of claim 16, wherein the first substrate support
is disposed in a different processing chamber than the second
substrate support.
18. The apparatus of claim 16, wherein the outlet of the first
sub-circuit is coupled to a first backside gas control zone of the
first and second substrate supports; and the outlet of the second
sub-circuit is coupled to a second backside gas control zone of the
first and second substrate supports.
19. Apparatus for gas control, comprising: at least a first control
valve having an inlet adapted for coupling to a gas supply; a flow
sensor coupled to an outlet of the control valve; a first gas line
coupled to an outlet of the control valve and the inlet of the flow
sensor; a upstream pressure sensor couple to the first gas line and
adapted to sense a metric indicative of pressure within the first
gas line. a second gas line coupled to an outlet of the flow
sensor; and a downstream pressure sensor coupled to the second gas
line and adapted to sense a metric indicative of pressure within
the second gas line.
20. The apparatus of claim 19 further comprising; a restrictor
disposed in the second gas line; an intermediate pressure sensor
coupled to the second gas line and adapted to sense a metric
indicative of pressure within the second gas line upstream of the
restrictor;
21. The apparatus of claim 19 further comprising: a bypass line
coupled to the second gas line down stream of the restrictor.
22. The apparatus of claim 21, wherein the bypass line further
comprises: a bypass restrictor; and a bypass valve coupled in
parallel.
23. The apparatus of claim 22 further comprising: a vacuum source
coupled in parallel to outlets of the restrictor and bypass
valve.
24. The apparatus of claim 23, wherein the vacuum source provides a
pressure at least 2 times less than a pressure in the second gas
line.
25. The apparatus of claim 24 further comprising: an intermediate
pressure sensor adapted to provide a metric of pressure in the
second gas line, wherein a flow of gas passing through the first
gas line may be expressed as: 3 F A = F S + F P S ( P S t , V s ) -
Fpu ( Pu t , Vu ) where: F.sub.S is the flow sensed by the flow
sensor; Pu is the pressure sensed in the first gas line; Vu is the
volume between the between the flow sensor and the control valve in
the first gas line; P.sub.S is the pressure sensed in the second
gas line; and V.sub.S is the volume between flow in the second gas
line.
26. The apparatus of claim 25 further comprising: a bypass control
branch teed to the second gas line; a bypass restrictor; a bypass
valve coupled in parallel to the bypass restrictor; and a vacuum
source coupled in parallel to outlets of the bypass restrictor and
bypass valve.
27. The apparatus of claim 26, wherein a flow of gas passing
through an outlet of the apparatus teed to the second gas line and
bypass line may be expressed as:
F.sub.W=F.sub.A-F.sub.BLEED(P.sub.W) where: F.sub.A is the flow
measured by the flow sensor; and F.sub.BLEED is the flow to the
vacuum source.
28. The apparatus of claim 27, wherein the flow of gas to the
vacuum source is at least one of measured or factory
calibrated.
29. The apparatus of claim 27 further comprising: a restrictor
disposed in the second gas line; and an intermediate pressure
sensor coupled to the second gas line and adapted to sense a metric
indicative of pressure within the second gas line upstream of the
restrictor.
30. The apparatus of claim 22 further comprising an outlet gas
line.
31. The apparatus of claim 30, wherein the outlet gas line is
coupled to a processing chamber.
32. The apparatus of claim 19, wherein the control valve, the flow
sensor, the upstream pressure sensor and the downstream pressure
sensor define a first sub-circuit having a first gas outlet; and a
second sub-circuit configured substantially identical to the first
sub-circuit and having a second gas outlet.
33. The apparatus of claim 32, wherein the outlet of the first
sub-circuit is coupled to a first substrate support and the outlet
of the second sub-circuit is coupled to a second substrate
support.
34. The apparatus of claim 32, wherein the first substrate support
is disposed in a different processing chamber than the second
substrate support.
35. The apparatus of claim 33, wherein the outlet of the first
sub-circuit is coupled to a first backside gas control zone of the
first and second substrate supports; and the outlet of the second
sub-circuit is coupled to a second backside gas control zone of the
first and second substrate supports.
36. The apparatus of claim 19 further comprising: a restrictor
disposed between the second and downstream pressure sensor.
37. The apparatus of claim 19 further comprising: a bypass control
branch teed between the control valve and the flow sensor; a bypass
restrictor; a bypass valve coupled in parallel to the bypass
restrictor; and a vacuum source coupled in parallel to outlets of
the bypass restrictor and bypass valve.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims benefit of U.S. provisional patent
application Ser. No. 60/527,428, filed Dec. 4, 2003, which is
herein incorporated by reference in its entirety.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] Embodiments of the present invention generally relate to a
method and apparatus for controlling pressure and measuring flow.
More specifically, embodiments of the invention generally relate to
a method and apparatus for controlling gas provided between a
substrate and a substrate support in a semiconductor processing
chamber or to a semiconductor processing chamber.
[0004] 2. Description of the Related Art
[0005] Substrate temperature is an important process control
attribute critical to many microelectronic device fabrication
processes. Providing gas between the substrate and a substrate
support in a semiconductor processing chamber is a well-known
method for improving heat transfer between the substrate and the
substrate support, thereby enhancing the precision and uniformity
of substrate temperatures.
[0006] FIG. 1 depicts a simplified schematic of a conventional
semiconductor processing chamber 150 having a gas delivery system
100 shown providing backside gas between a substrate 154 and a
substrate support 152 disposed in the processing chamber 150. The
processing chamber 150 may be configured to perform chemical vapor
deposition (CVD), physical vapor deposition (PVD), etch chamber or
other vacuum processing technique. Process gas delivery systems,
pumping systems and the like for controlling processes performed
within the processing chamber are well-known and have been omitted
for the sake of brevity.
[0007] The substrate support 152 generally includes a passage 156
formed therethrough for delivering a heat transfer gas (hereinafter
referred to as backside gas) to an area 158 defined between the
substrate 154 and substrate support 152. The size of the area 158
has been exaggerated for clarity. The backside gas, such as helium
or another gas is generally provided by the gas delivery system
100.
[0008] The gas delivery system 100 located outside the processing
chamber 150 and includes a gas supply 104 and control circuit 102.
The delivery of backside gas from the supply 104 to the area 158 is
regulated by a control circuit 102. A shut-off valve 106 is
generally provided between the supply 104 and control circuit
102.
[0009] The control circuit 102 generally includes a thermal flow
sensor 110, control valve 112, a pressure sensor 114 and a
restrictor 118. An inlet line 120 is coupled to an inlet of the
flow sensor 110 and facilitates coupling the control circuit to the
shut-off valve 106. A first intermediate line 122 couples an outlet
of the flow sensor 110 to the control valve 112. A second
intermediate line 124 couples an outlet of the control valve 112 to
an outlet line 126. The outlet line 126 facilitates coupling the
control circuit 102 to the passage 156 to that gas provided by the
supply 104 may be delivered in a regulated manner to the area 158
between substrate 154 and substrate support 152. A pressure sensor
114 is coupled to the second intermediate line 124 and is adapted
to provide a metric of pressure of the gas within the second
intermediate line 124.
[0010] A bypass line 128 is teed into the outlet line 126 and is
coupled to a vacuum source 116. A restrictor 118, such as a needle
valve, is provided in series with the bypass line 128 to regulate
the flow therethrough.
[0011] In operation, the control circuit 102 is set to a predefined
pressure measured by the pressure sensor 114. The flow sensor 110
measures the flow of gas to the control valve 112. The control
valve 112 is modulated in response to pressure variations as
detected by the pressure sensor 114, such that the pressure of gas
delivered to the area 158 between the substrate 154 and the
substrate support 152 is provided at a predefined pressure.
[0012] Although this design has proven to control pressure in this
application, field experience with the existing technology has
increased the demand for more accurate measurement of flow. In
addition accelerated response to change in pressure set points is
needed to reduce process cycle times. For example, gas temperature
and/or pressure fluctuations upstream of the gas delivery system
may make the flow through the flow sensor unstable, thereby
reducing the accuracy of the correlation between the flow indicated
and the actual flow to both the area between the substrate and
substrate support and the restrictor. Additionally, variation in
the vacuum provided by the vacuum source may impact the flow
through the restrictor, which may falsely indicate or contribute to
erroneous interpretation of the amount of gas disposed between
substrate and substrate support. In critical applications, the gas
available as a heat transfer medium between the substrate and
substrate support may vary, leading to deviation in substrate to
substrate process performance.
[0013] In addition, the system as described in FIG. 1 is unable to
determine the rate of gas flowing into the area between the
substrate support and substrate or to determine small variations in
the rate of gas leakage between the substrate support and substrate
that may cause the heat transfer characteristics and uniformity to
vary, thereby resulting in unwanted variation in processing
performance. Thus, it would be desirable to know in addition to
pressure the rate of gas flow to the substrate support.
[0014] Therefore, there is a need for an improved method and
apparatus for controlling the delivery of backside gas in a
semiconductor processing system.
[0015] Chamber pressure control is an equally important process
control attribute. Throttle valves are typically placed between the
chamber and a vacuum pump to control chamber pressure. In these
applications a chamber pressure gage provides feedback to the
throttle valve controller. However in an application where the
conductance between the throttle valve and the chamber is much
smaller then the controllable conductance of the throttle valve, it
is not possible to control chamber pressure with a throttle valve
between the chamber and a vacuum pump. Therefore, there is a need
for a method and apparatus for controlling the delivery of gas into
a chamber such that the delivery rate results in the desired
chamber pressure.
SUMMARY OF THE INVENTION
[0016] A method and apparatus for gas control is provided. The
method and apparatus may be used for controlling gases delivered to
a chamber, controlling the chamber pressure, controlling the
delivery of backside gas between a substrate and substrate support
and the like. In one embodiment, an apparatus for controlling gas
control includes at least a first flow sensor having a control
valve, a first pressure sensor and a second pressure sensor. An
inlet of the first pressure sensor is adapted for coupling to a gas
supply. A control valve is coupled to an outlet of the flow sensor.
The first pressure sensor is adapted to sense a metric indicative
of the pressure upstream of the first flow sensor. A second
pressure sensor is adapted to sense a metric indicative of the
pressure downstream of the control valve.
BRIEF DESCRIPTION OF THE DRAWINGS
[0017] So that the manner in which the above recited features of
the present invention can be understood in detail, a more
particular description of the invention, briefly summarized above,
may be had by reference to embodiments, some of which are
illustrated in the appended drawings. It is to be noted, however,
that the appended drawings illustrate only typical embodiments of
this invention and are therefore not to be considered limiting of
its scope, for the invention may admit to other equally effective
embodiments.
[0018] FIG. 1 is a simplified schematic of a conventional
semiconductor processing chamber and gas delivery system;
[0019] FIG. 2 is a simplified schematic of one embodiment of a gas
delivery system of the invention coupled to an exemplary a
semiconductor processing chamber;
[0020] FIG. 3 is a simplified schematic of another embodiment of a
control circuit of a gas delivery system coupled to a processing
chamber;
[0021] FIGS. 4-6 are simplified schematics of alternative
embodiments of a gas delivery system; and
[0022] FIGS. 7-8 are simplified schematics of alternative
embodiments of a control circuit.
[0023] To facilitate understanding, identical reference numerals
have been used, wherever possible, to designate identical elements
that are common to the figures.
DETAILED DESCRIPTION
[0024] FIG. 2 depicts a simplified schematic of one embodiment of a
gas delivery system 200 of the invention coupled to an exemplary a
semiconductor processing chamber 150. As described above, the
processing chamber 150 includes a substrate support 152 disposed
therein which supports a substrate 154 during processing. The
processing chamber 150 may be configured to perform chemical vapor
deposition (CVD), physical vapor deposition (PVD), etch chamber or
other vacuum processing technique. Process gas delivery systems,
pumping systems and the like for controlling processes performed
within the processing chamber are well-known and have been omitted
for the sake of brevity.
[0025] The substrate support 152 generally includes a passage 156
formed therethrough for delivering a heat transfer gas (hereinafter
referred to as backside gas) to an area 158 defined between the
substrate 154 and substrate support 152. The size of the area 158
has been exaggerated in FIG. 2 for clarity. The backside gas, such
as helium, nitrogen, argon or another gas is generally provided by
the gas delivery system 200.
[0026] The gas delivery system 200 is located outside the
processing chamber 150 and includes a gas supply 104 and a control
circuit 202. The delivery of backside gas from the supply 104 to
the area 158 is regulated by the control circuit 202. At least one
shut-off valve 106 is provided between the supply 104 and the
control circuit 202. It is contemplated that the shut-off valve 106
may be an integral part of the control circuit 202.
[0027] The control circuit 202 generally includes a first pressure
sensor 290, a second pressure sensor 214 (optional), a flow sensor
210, control valve 212, a third pressure sensor 216, and a bypass
control branch 218. It is contemplated that the control circuits
described herein may be readily adapted for use in other
applications, such as chamber pressure control, process gas
delivery and the like.
[0028] An inlet line 220 is coupled to an inlet of the flow sensor
210 and facilitates coupling the control circuit 202 to the
shut-off valve 106. The flow sensor 210 provides a metric
indicative of flow F.sub.S passing into the control circuit 202.
The flow sensor 210 may be a thermal based technology (most
common), a delta pressure based technology, a correolis technology,
or any other technology capable of providing mass flow rate. The
first pressure sensor 290 is coupled to the inlet line 220 and is
adapted to provide a metric indicative of the pressure P.sub.U
upstream of the flow sensor 210. The first pressure sensor 290 can
be used to ensure that the output of the flow sensor 210 during
upstream pressure perturbations accurately reports the flow through
the flow sensor 210.
[0029] A first intermediate line 222 couples an outlet of the flow
sensor 210 to the control valve 212. The first intermediate line
222 has a predetermined volume V.sub.S. The predetermined volume
V.sub.S may be calculated or measured. The optional second pressure
sensor 214 is coupled to the first intermediate line 222 and is
adapted to provide a metric indicative of the pressure P.sub.S
within the volume V.sub.S.
[0030] A second intermediate line 224 couples an outlet of the
control valve 212 to an outlet line 226 of the control circuit 202.
A supply line 228 couples the outlet line 226 to the passage 156
and allows gas, regulated by the control circuit 202, to be
delivered to the area 158 between substrate 154 and substrate
support 152.
[0031] The bypass control branch 218 includes a restrictor 230 and
a bypass valve 232 coupled in parallel. A bypass inlet line 234 is
teed to junction of the second intermediate line 224 and outlet
line 226, and is coupled to the inlets of the restrictor 230 and
the bypass valve 232. A bypass outlet line 236 couples the outlets
of the restrictor 230 and the bypass valve 232 to a vacuum source
116. The restrictor 230 is set or selected to have a predefined
orifice such that a chocked condition is achieved where P.sub.W
(described below) is greater than 2 times the vacuum provided by
the vacuum source 116. The restrictor 230 may be factory set to
this condition, or set on site by a technician or tool operator.
With the restrictor 230 set to this condition, P.sub.W sensed by
the pressure sensor 216 is also indicative of the pressure in the
area 158 below the substrate 152.
[0032] The bypass valve 232 may be opened to allow quick evacuation
and pressure drop within the control circuit 202. This allows for
quick reductions in pressure Pw to be realized in a short amount of
time and as a result significantly reduce process times associated
with long delays that are required with the existing
technology.
[0033] A predetermined control volume V.sub.W, defined by the gas
conduits with a dashed line 240, includes the volumes of the second
intermediate line 224, the bypass inlet line 234, the outlet line
226, the supply line 228, the passage 156 and the area 158. The
control volume V.sub.W may be calculated or measured. The third
pressure sensor 214 is coupled to at least one of the gas conduits
comprising the control volume V.sub.W and is adapted to provide a
metric of pressure P.sub.W of the gas within the control volume
V.sub.W. In the embodiment depicted in FIG. 2, the third pressure
sensor 214 is coupled to the second intermediate line 224.
[0034] To facilitate control of the control circuit 202 as
described above, a controller 260 comprising a central processing
unit (CPU) 262, support circuits 266 and memory 264, is coupled to
the control circuit 202. The controller 260 may additionally
control processes performed in the processing chamber 150. The CPU
262 may be one of any form of computer processor that can be used
in an industrial setting for controlling various chambers and
subprocessors. The memory 264 is coupled to the CPU 262. The memory
264, or computer-readable medium, may be one or more of readily
available memory such as random access memory (RAM), read only
memory (ROM), floppy disk, hard disk, or any other form of digital
storage, local or remote. The support circuits 266 are coupled to
the CPU 262 for supporting the processor in a conventional manner.
These circuits include cache, power supplies, clock circuits,
input/output circuitry, subsystems, and the like.
[0035] In operation, a desired pressure set point P.sub.W is
selected. The flow sensor 210, and pressure sensors 290, 214, and
216 respectively provide a metric of flow and pressure to the
controller 260.
[0036] As the volumes V.sub.S and V.sub.W are known for the volumes
corresponding to the pressure sensed by the pressure sensors 214,
216, a flow F.sub.A of gas the flow to area 158 between the
substrate 154 and substrate support 152 and through the bleed
restrictor 230 may be expressed as: 1 F A = F S + F P S ( P S t , V
s ) - F P W ( P W t , V W ) - F deltaP ( P U t ) ( 1 )
[0037] and
F.sub.W=F.sub.AF.sub.BLEED(P.sub.W) (2)
[0038] where:
[0039] F.sub.BLEED is the flow through the bypass outlet line 236
(typically factory calibrated as a function of Pw),
[0040] F.sub.W is the flow measured to the area 158 between the
substrate 154 and substrate support 152 through the outlet line 226
of the control circuit 202, and
[0041] F.sub.A is the flow measured by the flow sensor 210; and
[0042] in embodiments where a second pressure sensor is not
utilized, F.sub..DELTA.Pw(dP.sub.w/dt, V.sub.W is zero.
[0043] Knowing F.sub.W and P.sub.W provides more accurate
characterization of the heat transfer conditions between the
substrate 154 and substrate support 152. The leak rate of backside
gas from under the substrate 154 can now be quantified and
associated with process conditions such as heat transfer
uniformity, substrate chucking characteristics and wear of the
substrate support.
[0044] FIG. 3 is a simplified schematic of another embodiment of a
control circuit 302 of a gas delivery system 300 coupled to a
processing chamber 350. The control circuit 302 has a plurality of
outlet lines 312.sub.i thereby enabling control of multiple gas
flows from a single control circuit 302. The subscript "i" used
herein is a positive integer. The gas delivery system 300 is
similar to the system 100 described above, having a gas supply 104,
a shut-off valve 106 and a vacuum source 116.
[0045] The processing chamber 350 is similar to the processing
chamber 150 described above, except wherein a substrate support 352
disposed in the processing chamber 350 includes multiple zones
360.sub.i of backside gas pressure control. Each zone 360.sub.i
defined in an area 358 between the substrate 154 and the substrate
support 352 has gas supplied thereto by at least one of the outlet
lines 312.sub.i. In the embodiment depicted in FIG. 3, the
substrate support 352 has two zones 360.sub.0 and 360.sub.i
supplied by output lines 312.sub.0, 312.sub.i.
[0046] The control circuit 302 includes a plurality of sub-circuits
310.sub.i. The sub-circuits 310.sub.i are configured similar to the
circuits 102 described above and share the gas supply 104 and
vacuum source 116. It is contemplated that one or more of the
sub-circuits 310.sub.i may a dedicated gas supply and vacuum
source. Each of the sub-circuits 310.sub.i controls the flow
through a respective outlet line 312.sub.i. In each of the circuits
310.sub.i, the conductance downstream of the bypass control branch
218 (referring additionally to FIG. 2) must ensure P.sub.W is 2
times greater than vacuum provided by the vacuum source 116 when
all the outlets lines 312.sub.i are at maximum flow or when all of
the lines 312.sub.i are flowing to the vacuum source 116 through
the bypass valve 232.
[0047] The control circuit 202 may be coupled to multiple
substrates supports in other configurations. For examples, FIG. 4
depicts the control circuit 302 coupled to two processing chambers.
Although one output line 312.sub.i is shown coupled to each
processing chamber 150, it is contemplated that the processing
chamber may include substrates supports having multi-zone backside
gas delivery, as discussed with reference to FIG. 3. In such a
configuration, the circuit 302 may be configured to provide gas
through multiple output lines 312.sub.i to each chamber.
[0048] In another example depicted in FIG. 5, the control circuit
302 may be coupled to a single processing chamber 550 having
multiple processing regions 502. An example of a processing chamber
available in this configuration is a PRODUCER.RTM. processing
chamber, available from Applied Materials, Inc., located in Santa
Clara, Calif. In the embodiment depicted in FIG. 5, one output line
312.sub.i is shown coupled to each substrate support 554 disposed
in each processing region 502. It is contemplated that the
substrates supports 554 may include multizone backside gas
delivery, as discussed with reference to FIG. 3. In such a
configuration, the circuit 302 may be configured to provide gas
through multiple output lines 312.sub.i to each substrate support.
It is contemplated that a first output line 312.sub.i may be teed
to supply a first zone in a predefined number of substrate
supports, while a second output 312.sub.i may be teed to supply a
second zone in each of the substrate supports, wherein the
substrate supports are disposed in the same or different processing
chambers.
[0049] FIGS. 6-8 depict alternative embodiments of control
circuits. It is contemplated that any of the control circuits
described in FIGS. 6-8 may include multiple sub-circuits as
described with reference to FIG. 3, or be coupled one or more
substrate supports having one or more backside gas zones as
described with reference to FIGS. 4-5.
[0050] FIG. 6 is a simplified schematic of another embodiment of a
gas delivery system 600 of the invention coupled to a processing
chamber 150. The processing chamber 150 has been described
above.
[0051] The gas delivery system 600 includes a gas supply 104 and a
control circuit 602. The delivery of backside gas from the supply
104 to the area 158 between the substrate 154 and substrate support
152 is regulated by the control circuit 602. The control circuit
602 generally includes a flow sensor 610, control valve 612, a
first pressure sensor 690, a second pressure sensor 614, a third
pressure sensor 616 and a bypass control branch 218.
[0052] An inlet line 620 couples the inlet of the control valve 612
to the shut-off valve 106. A first intermediate line 622 couples an
outlet of the control valve 612 to the flow sensor 610. The control
valve 612 and flow sensor 610 may be similar to the control valve
216 and flow sensor 210 described above.
[0053] The first pressure sensor 690 is coupled to the first
intermediate line 622 and is adapted to provide a metric indicative
of the pressure P.sub.U upstream of the flow sensor 610. The first
pressure sensor 690 can be used to ensure that the output of the
flow sensor 610 during upstream pressure perturbations accurately
reports the flow through the flow sensor 610.
[0054] A second intermediate line (shown as portions 624a, 624b)
couples an outlet of the flow sensor 610 to an outlet line 626 of
the control circuit 602. A supply line 228 couples the outlet line
626 to the passage 156 and allows gas, regulated by the circuit
602, to be delivered to the area 158 between substrate 154 and
substrate support 152.
[0055] A restrictor 642 separates the portions 624a, 624b of the
second intermediate line. The restrictor 642 may have a fixed or
variable orifice, and generally provides sufficient back pressure
to accommodate the operational parameters of the flow sensor 610.
As such, with some flow meters, use of the restrictor 642 may not
be required.
[0056] The first portion 624a couples the flow sensor 610 to the
restrictor 642. The first portion 624a has a predetermined volume
V.sub.S. The predetermined volume V.sub.S may be calculated or
measured. The second pressure sensor 614 is coupled to the first
portion 624a of the second intermediate line and is adapted to
provide a metric indicative of the pressure P.sub.S within the
volume V.sub.S.
[0057] The second portion 624b runs from the restrictor 642 to at
tee joining the outlet line 626 and bypass control branch 218. The
bypass control branch 218 includes a bypass inlet line 234 that
couples the outlet line 226 and second portion 624b of the second
intermediate line to the inlets of a restrictor 630 and a bypass
valve 232. The bypass control branch 218 is configured and
generally functions as described above.
[0058] A predetermined control volume V.sub.W, defined by the gas
conduits with a dashed line 240, includes the volumes of the second
portion 624b of the second intermediate line, the bypass inlet line
234, the outlet line 626, the supply line 228, the passage 156 and
the area 158. The control volume V.sub.W may be calculated or
measured. The second pressure sensor 614 is coupled to the at least
one of the gas conduits comprising the control volume V.sub.W and
is adapted to provide a metric of pressure P.sub.W of the gas
within the control volume V.sub.W. In the embodiment depicted in
FIG. 6, the second pressure sensor 614 is coupled to the second
portion 624b of the second intermediate line.
[0059] In operation, a desired pressure set point P.sub.W is
selected and the valve 106 is opened to provide a flow of gas from
the supply 104 to the control circuit 602. The flow sensor 610, and
pressure sensors 690, 614, 616 respectively provide a metric of
flow and pressure to the controller 260. The pressure sensors 690,
614, 616 upstream and downstream of the control valve 612 prevent
transient pressure changes upstream and downstream of the flow
sensor 610 or in V.sub.w of the control valve 612 from effecting
the flow measurements provided by the flow sensor 610.
[0060] As the volumes V.sub.S and V.sub.W are known for the volumes
corresponding to the pressure sensed by the pressure sensors 614,
616, a flow F.sub.A of gas through the second portion 624b of the
second intermediate line and a flow F.sub.W of gas to the area 258
between the substrate support 252 and the substrate 254 the may be
determined using equations (1) and (2) as discussed above.
[0061] FIG. 7 is a simplified schematic of another embodiment of a
gas delivery system 700 of the invention coupled to a processing
chamber 150. The processing chamber 150 has been described above
and may be configured to include a chamber pressure sensor 704 that
is adapted to provide a metric indicative of the actual pressure
P.sub.C within the chamber 150. The gas delivery system 700 shown
in FIG. 7 for regulating chamber pressure, or the flow of gas into
a process volume within the chamber, may also be configured to
provide backside gas to the substrate support within the processing
chamber. The chamber pressure sensor 704 is not needed at this
location for back side cooling applications where the effective
restriction R.sub.W between control circuit 702 and substrate 254
or processing chamber 150 is relatively large and the actual flow
F.sub.W/C through the effective restriction R.sub.W to the chamber
150 is relatively small. In chamber pressure control P.sub.C is
needed when R.sub.W is relatively small and F.sub.W/C is relatively
large and feedback to the control valve 706 is provided from the
chamber pressure sensor 704.
[0062] The gas delivery system 700 includes a gas supply 104 and a
control circuit 702. The delivery of gas from the supply 104 to the
chamber 150 is regulated by the control circuit 702 based on
feedback from the chamber pressure sensor 704. The. control circuit
702 generally includes a control valve 706, a flow sensor 710, an
upstream pressure sensor 718, and may also require a downstream
pressure sensor 720 and a primary pressure sensor 714.
[0063] An input line 716 couples the gas delivery system 702 to the
shut-off valve 106. The input line 716 is connected to the flow
sensor 710 that is adapted to provide a metric indicative of flow
F.sub.W/CB' through the flow sensor 710 placed upstream of the
control valve 706. In the chamber pressure control application this
may be the sum of two or more sensors and control valves and may
require control of the ratio of these sensors. In the embodiment
depicted in FIG. 7, only one flow sensor 710 and control valve 706
are shown.
[0064] A first pressure sensor 718 is provided upstream of the flow
sensor 710 and adapted to provide a metric indicative of a pressure
P.sub.US. The first pressure sensor 718 can be used to ensure the
flow sensor output during upstream pressure perturbations so that
accurate determination of the flow through the flow sensor 710 can
be made.
[0065] A second pressure sensor 720 is provided downstream of and
adjacent to the flow sensor 710 and adapted to provide a metric
indicative of a pressure P.sub.DS. The second pressure sensor 720
may be necessary for measuring the pressure if transient pressure
changes in the volume V.sub.DS defined in a first intermediate line
740 connecting the flow sensor 710 and the control valve 706 (i.e.
dP.sub.DS/dt). In such a condition, the flow sensor output may not
be equal to the actual flow through the restriction downstream of
the flow sensor (i.e. the control valve 706).
[0066] The second intermediate line 742 couples an outlet of
control valve 706 to a tee between an outlet line 744 and the
bypass control branch 218. The outlet line 744 is coupled through a
passage to the chamber 150.
[0067] The primary pressure sensor 714 may be necessary to provide
a metric indicative of a pressure P.sub.WB of the flow within the
outlet line 744. The output from the primary pressure sensor 714
may be necessary to augment the flow sensor output, as transient
changes in pressure within Vw will result in differences between
Fw/cb' and Fw/c.
[0068] The bypass control branch 218 includes a pressure sensor 708
is adapted to provide a metric indicative of a pressure P.sub.B
downstream of the bleed restrictor R.sub.B and the bypass valve
232. To reduce cost, the pressure sensor 708 may be optionally
omitted and the pressure P.sub.B is assumed to be <{fraction
(1/2)}P.sub.WB.
[0069] The restrictor 230 provides the effective restriction
R.sub.B of bleed flow. The restrictor 230 is sized such that flow
through the restrictor 230 is chocked. The restrictor 230 may not
be needed for the chamber control application where F.sub.W/C is
relatively large. F.sub.B is the flow through the bypass control
branch 218 to the vacuum source 116.
[0070] The control circuit 702 can be used to calculate a volume
V.sub.W defined as that volume between the chamber restriction Rw,
the bypass control branch 218, and the control valve 706. If
shut-off valves are added at all ports of the control circuit to
isolate its internal volume and the total internal volume of the
control circuit V.sub.1 (as isolated by these shut-off valves) is
known. In this configuration the controller 260 must run through
the following steps to determine V.sub.W:
[0071] Step 1: Pressurize the control circuit;
[0072] Step 2: Isolate the control circuit volume from the inlet
pressure source;
[0073] Step 3: Open the shut-off valve on the w/c port. Note: A
valve at the chamber must be added and closed during this
operation; and
[0074] Step 4: After pressure in the control circuit volume has
stabilized, V.sub.W may be expressed as
V.sub.W=(V.sub.1(P.sub.1/P.sub.2-- 1))-sum of: volume between the
bleed restriction/dump valve and bleed port shut off valve; volume
between the first restrictor upstream of P.sub.WB, and the supply
port shut off valve.
[0075] The control valve must be open during this routine.
Alternatively, V.sub.W can be determined empirically or via
computer modeling for each application and input as a constant into
the control circuit 702.
[0076] The flow output from this device must be resolved to provide
F.sub.W/CB and F.sub.W/C and F.sub.B. In chamber pressure control
applications it may also be necessary to provide and control a
ratio of gases as the flow from F.sub.W/CB' may be the sum of two
or more flow controllers. The following are examples of
considerations that must be made when resolving these flows:
[0077] F.sub.W/CB=F.sub.W/CB'-TFDS; where TFDS is the transient
flow into V.sub.DS associated with changes in pressure in V.sub.DS
and is a function of V.sub.DS and dP.sub.DS/dt and governed by
PV=nRT. F.sub.W/CB' must not be impacted by changes in pressure
upstream of the flow sensor and is a function of dP.sub.US/dt.
[0078] F.sub.W/C=F.sub.W/CB-F.sub.B-TFW; where F.sub.B is the bleed
flow through the restrictor R.sub.B and TFW is the transient flow
in V.sub.W associated with changes in pressure in V.sub.W and is a
function of V.sub.W and dP.sub.WB/dt. TFW may be ignored and the
need for Pwb may be eliminated if Vw can be made small enough such
that these values are negligible when compared to Fw/c.
[0079] F.sub.B is only a function of P.sub.WB when
P.sub.WB>2P.sub.D (i.e. chocked flow) because R.sub.B is
designed such that during these conditions (P.sub.WB>2P.sub.D),
the flow F.sub.B is chocked. F.sub.B is characterized as a function
of P.sub.WB in production to account for any variation in
manufacturer of R.sub.B. F.sub.B may be zero in chamber pressure
control application where F.sub.W/C is relatively large.
[0080] where:
[0081] V.sub.W is a volume between the R.sub.W, the bleed
restrictor (R.sub.B), and the control valve 706;
[0082] R.sub.F is the effective restriction of flow sensing
technology; and
[0083] F.sub.W/CB is the sum of the flow R.sub.B through the bleed
restrictor; the flow Fw/c through the total effective restriction
to the chamber, and the transient flow into V.sub.W associated with
changes in pressure (dP.sub.WB/dt).
[0084] FIG. 8 is a simplified schematic of another embodiment of a
gas delivery system 800 of the invention coupled to a processing
chamber 150. The gas delivery system 800 is essentially identical
to the system 600 described above, except wherein a flow sensor 812
is positioned downstream of the bypass control branch 218 with
pressure sensors 822, 824 positioned to detect the pressure on the
immediate upstream and downstream sides of the flow sensor 812.
Although the bypass control branch 218 is shown teed between the
pressure sensor 822 and the control valve 212, the bypass control
branch 218 may be positioned in other positions downstream of the
control valve 212.
[0085] In this embodiment, the first pressure sensor 822 is
necessary for measuring the pressure P.sub.US upstream of the flow
sensor 822 to ensure the flow sensor 812 output is accurate during
upstream pressure perturbations, including flow changes through the
bypass control branch 218, are accurately reported by the flow
sensor 812. The first pressure sensor 822 is utilized to resolve
the flow through the bypass restrictor 230. Bleed flow through the
restrictor 230 is chocked as described above. The F.sub.W/C may be
resolved as described with reference to the embodiment of FIG.
7.
[0086] The following are examples of considerations that must be
made when resolving these flows in a device which has the flow
sensor downstream of the control valve and downstream of the branch
to the bleed restrictor:
[0087] F.sub.W/CB=F.sub.W/C'+F.sub.B-TFUS where F.sub.B is the
bleed flow through the restrictor R.sub.B. TFUS is the transient
flow into V.sub.US associated with changes in pressure in V.sub.US
and is a function of V.sub.US and dP.sub.US/dt and governed by
PV=nRT. F.sub.W/C' must not be impacted by changes in pressure
upstream of the flow sensor and is a function of dP.sub.US/dt.
[0088] F.sub.W/C=F.sub.W/C'-TFDS; where TFDS is the transient flow
in V.sub.DS associated with changes in pressure in V.sub.DS and is
a function of V.sub.DS and dP.sub.DS/dt.
[0089] F.sub.B is only a function of P.sub.US when
P.sub.US>2P.sub.B (i.e. chocked flow) because R.sub.B is
designed such that during these conditions (Pus>2PB) flow
F.sub.B is chocked. F.sub.B is characterized as a function of
P.sub.US in production to account for any variation in manufacturer
of R.sub.B.
[0090] Thus, gas delivery systems having control circuit that
advantageously enable characterization of the heat transfer
conditions between the substrate and substrate support have been
provided. The innovative control circuits enable the determination
of the pressure and flow rates of gas flowing to the backside of
the substrate. Accuracy of backside gas flow control has been
improved over the state of the art. Moreover, quick and efficient
purging of the control circuit and passages leading to the
substrate support is enabled. It is also contemplated that the gas
delivery system may be configured to supply gas to other aspects of
the processing system. For example, the gas delivery system may be
utilized to at least partially regulate or control chamber
pressures, or to deliver at least one of process gases, purge
gases, cleaning agents, or carrier gases among others.
[0091] While the foregoing is directed to embodiments of the
present invention, other and further embodiments of the invention
may be devised without departing from the basic scope thereof, and
the scope thereof is determined by the claims that follow.
* * * * *