U.S. patent application number 10/724512 was filed with the patent office on 2005-06-02 for double-faced detecting devices for an electronic substrate.
Invention is credited to Hsu, Ming-Huey.
Application Number | 20050116730 10/724512 |
Document ID | / |
Family ID | 34592483 |
Filed Date | 2005-06-02 |
United States Patent
Application |
20050116730 |
Kind Code |
A1 |
Hsu, Ming-Huey |
June 2, 2005 |
DOUBLE-FACED DETECTING DEVICES FOR AN ELECTRONIC SUBSTRATE
Abstract
Double-faced detecting devices for an electronic substrate, the
detecting device have a base and two probe-detecting machines
oppositely located beside the base. The base has a guiding groove
and a substrate platform with a through hole rotatably and movably
mounted on the base via the guiding groove. Therefore, when the
electronic substrate mounts on the substrate platform, the
substrate platform enables to rotate from a horizontal position to
a vertical position to expose two faces of the electronic substrate
to face the two probe-detecting machines for a double-faced
detection of the electronic substrate in high-frequency properties.
Additionally, each probe-detecting machine is mounted on a pivot
base and pivoted by the pivot base to adjust the height of probe to
touch the electronic substrate at the vertical position.
Inventors: |
Hsu, Ming-Huey; (Hsinchu
City, TW) |
Correspondence
Address: |
NIKOLAI & MERSEREAU, P.A.
900 SECOND AVENUE SOUTH
SUITE 820
MINNEAPOLIS
MN
55402
US
|
Family ID: |
34592483 |
Appl. No.: |
10/724512 |
Filed: |
November 28, 2003 |
Current U.S.
Class: |
324/763.02 |
Current CPC
Class: |
G01R 31/2893 20130101;
G01R 31/2808 20130101; G01R 1/06772 20130101 |
Class at
Publication: |
324/754 |
International
Class: |
G01R 031/02 |
Claims
What is claimed is:
1. Double-faced detecting devices for an electronic substrate with
two faces, the detecting devices comprising: a base having an
erecting post with a front face, an guiding groove longitudinally
defined in the front face of the erecting post, a substrate
platform movably and rotatably attached to the erecting post via
the guiding groove, and a through hole defined in the substrate
platform, wherein the substrate platform is adapted to settle the
electronic substrate on the substrate platform and is controlled by
a controlling device to locate at a horizontal position or a
vertical position; two pivot bases oppositely placed beside the
substrate platform, wherein each pivot base has a levering plate;
and two probe-detecting machines respectively and pivotally mounted
on the levering plates of the two pivot bases, wherein each
probe-detecting machine has a probe extending toward to the
substrate platform and adapted to touch the electronic
substrate.
2. The double-faced detecting devices as claimed in claim 1,
wherein the substrate platform rotates within 0 to 90 degrees.
3. The double-faced detecting devices as claimed in claim 1,
wherein the electronic substrate is a flip chip.
4. The double-faced detecting devices as claimed in claim 1,
wherein the electronic substrate is a printed circuit board.
Description
FIELD OF THE INVENTION
[0001] In general, the present invention relates to double-faced
detecting devices for an electronic substrate, and more
particularly to detecting devices that enables to alternatively
place the electronic substrate in a horizontal position or a
vertical position to detect high-frequency properties of the
electronic substrate.
BACKGROUND OF THE INVENTION
[0002] With reference to FIG. 5, conventional detecting devices for
an electronic substrate, such as a flip chip, a wafer or a printed
circuit board (PCB), in high-frequency properties comprises two
opposite probe-detecting machines 50 and a substrate platform 70.
Each probe-detecting machine 50 has a probe 51 secured on an inward
face of the probe-detecting machine 50 and connects to a detecting
system (example: networking analysis instrument) via a
high-frequency isolation wire (not shown). The two probe-detecting
machines 50 are respectively mounted on two bases 60. The substrate
platform 70 is located between the two probe-detecting machines 50.
The substrate platform 70 has a top face for securing the flip
chip, the wafer or the printed circuit board (not shown).
[0003] When the detecting devices operate, a calibration substrate
90 with multiple detecting points 91 (or so-called "pads") is
placed on the top face of the substrate platform 70 for adjustment
by the two probes 51 on the two probe-detecting devices 50. After
adjustment, the calibration substrate 90 is removed from the
substrate platform 70. Then, the flip chip, the wafer or the
printed circuit board (not shown) with multiple detecting points is
settled on the top face of the substrate platform 70. The probes 51
on the probe-detecting machines 50 extend to touch multiple
detecting points 91 to detect high-frequency properties of the
electronic substrate.
[0004] However, the flip chip, the wafer or the printed circuit
board usually has the multiple detecting points formed on a top
face and a bottom face in an ideal configuration. For convenience
in detection, most of the flip chips, the wafers or the printed
circuit boards are designed to arrange the multiple detecting
points of circuit on the same face. Unfortunately, data of
high-frequency properties obtained from the designed wafers or the
printed circuit boards are only simulating data that is not
precise. Additionally, only 80% of the electronic substrates can be
modified and be detected by the conventional detecting devices.
Rest of the electronic substrate still can not be modified in
circuit to arrange the multiple detecting points on the same face
and thus can not be detected.
SUMMARY OF THE INVENTION
[0005] The present invention provides double-faced detecting
devices for an electronic substrate in high-frequency properties,
which conveniently contact multiple detecting points on two faces
of the electronic substrate to detect the high-frequency
properties.
[0006] To achieve the foregoing purpose, the double-faced detecting
devices for an electronic substrate comprise:
[0007] a base with a substrate platform movably and rotatably
attached to the base, and through hole defined in the substrate
platform, wherein the substrate platform is adapted to settle the
electronic substrate on the substrate platform and is controlled by
a controlling device to locate at a horizontal position or a
vertical position;
[0008] two pivot bases oppositely placed beside the substrate
platform and each pivot base has a levering plate; and
[0009] two probe-detecting machines respectively and pivotally
mounted on the levering plates of the two pivot bases, wherein each
probe-detecting machine has a probe extending toward to the
substrate platform to touch the electronic substrate.
[0010] Whereby, the electronic substrate is rotated and erected to
the vertical position to expose two faces to respectively face the
two probe-detecting machines to allow multiple detecting points on
the two faces to be touched in a convenient way.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] FIG. 1 is a schematically side plane view of double-faced
detecting devices for an electronic substrate in accordance with
the present invention;
[0012] FIG. 2 is a schematically operational side plane view of the
detecting devices for an electronic substrate in FIG. 1, wherein a
substrate platform is located at a vertical position;
[0013] FIG. 3 is a schematically operational side plane view of the
detecting devices in FIG. 2, wherein two probes of two opposite
probe-detecting machines extend to touch multiple detecting points
on two sides of the electronic substrate;
[0014] FIG. 4 is a partially enlarged side plane view of the
detecting devices in FIG. 3 to clearly show conjunctions of the
probes and the detecting points of the electronic substrate;
and
[0015] FIG. 5 is a schematically operational side plane view of
conventional detecting devices for an electronic substrate in
accordance with prior art.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0016] With reference to FIGS. 1 and 2, double-faced detecting
devices for an electronic substrate 40 in accordance with the
present invention comprises a base 10 with a substrate platform 11,
two pivot bases 33, two probe-detecting machines 30 respectively
mounted on the two pivot bases 33. Particularly, the electronic
substrate 40 has a top face and a bottom face and multiple contacts
41 respectively arranged on the top and bottom faces.
[0017] The base 10 has an erecting post (not numbered) with a front
face, an guiding groove 101 longitudinally defined in the front
face of the erecting post, and the substrate platform 11 with a
connecting rod 112 movably and rotatably attached to the erecting
post via the guiding groove 101. The substrate platform 11 has a
top face. A through hole 114 is defined in the substrate platform
11 and has a diameter smaller than that of the electronic substrate
40. Therefore, the electronic substrate 40 enables to be mounted on
the top face of the substrate platform 11 and exposes the bottom
face of the electronic substrate 40 via the through hole 114. The
substrate platform 11 is controlled by a controlling device (not
shown) to move vertically to change the height of electronic
substrate 40. Additionally, the substrate platform 11 also enables
to be rotated to hold the electronic substrate 40 at a horizontal
position or a vertical position. Preferably, the substrate platform
11 rotates from 0 to 90 degrees.
[0018] The two pivot bases 33 are oppositely located beside the
substrate platform 11. Each pivot base 33 has a levering plate 32.
Each probe-detecting machine 30 is mounted on the levering plate 32
and has a probe 31 retractably extending toward to the electronic
substrate 40. Whereby, the probe-detecting machine 30 can be
pivoted to allow the probe 31 being inclined to extend upward to
reach the contacts 41 at high locations when the electronic
substrate 40 is in the vertical position.
[0019] With further reference to FIGS. 3 and 4, when the detecting
devices operate to probe the electronic substrate 40, the substrate
platform 11 horizontally arises and then rotates to the vertical
position to expose the two faces of the electronic substrate 40 to
respectively face the two probe-detecting machines 30. Because the
contacts 41 on the electronic substrate 40 are at high positions
when the substrate platform 11 is arisen to the vertical position,
the pivot bases 33 rotate the levering plates 32 to adjust
inclinations of the two probes 31 on the two probe-detecting
machines 30. Thereby, the probes 31 enable to probe the contacts 41
to detect the high-frequency properties of the electronic substrate
40.
[0020] For an actually complete operation, a calibration substrate
is applied on the detecting devices initially for adjustment as
described in the conventional ones. Then, a flip chip, a wafer or a
printed circuit board is mounted on the top face of the substrate
platform 11 to detect high-frequency properties. Operational
procedures of the detecting devices for each detection of any
electronic substrate, whether the calibration substrate or the flip
chip, the wafer or the printed circuit board, are the same as
described as in the conventional detecting devices.
[0021] Although particular and specific embodiments of the
invention have been disclosed in some detail, numerous
modifications will occur to those having skill in the art, which
modifications hold true to the spirit of this invention. Such
modifications are deemed to be within the scope of the following
claims.
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