U.S. patent application number 11/014790 was filed with the patent office on 2005-05-26 for noncontact id card and method of manufacturing the same.
This patent application is currently assigned to Toray Engineering Company, LTD. Invention is credited to Akita, Masanori, Sawaki, Yoshiki.
Application Number | 20050110129 11/014790 |
Document ID | / |
Family ID | 28793492 |
Filed Date | 2005-05-26 |
United States Patent
Application |
20050110129 |
Kind Code |
A1 |
Akita, Masanori ; et
al. |
May 26, 2005 |
Noncontact ID card and method of manufacturing the same
Abstract
A noncontact ID card composed by laminating an antenna circuit
board where an antenna is formed and an interposer board formed by
connecting an enlarged electrode to an electrode of a mounted IC
chip and bonding between an antenna electrode of the antenna
circuit board and the enlarged electrode of the interposer board
with electroconductive adhesive material, wherein a substrate of
the antenna circuit board and a substrate of the interposer board
are bonded. In addition, in another composition, at least one local
deformation is applied to a boding face of the electrodes each
other in a direction crossing the bonding face.
Inventors: |
Akita, Masanori; (Otsu-shi,
JP) ; Sawaki, Yoshiki; (Otsu-shi, JP) |
Correspondence
Address: |
RADER FISHMAN & GRAUER PLLC
LION BUILDING
1233 20TH STREET N.W., SUITE 501
WASHINGTON
DC
20036
US
|
Assignee: |
Toray Engineering Company,
LTD
|
Family ID: |
28793492 |
Appl. No.: |
11/014790 |
Filed: |
December 20, 2004 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
11014790 |
Dec 20, 2004 |
|
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|
10386616 |
Mar 13, 2003 |
|
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Current U.S.
Class: |
257/696 |
Current CPC
Class: |
G06K 19/07752 20130101;
G06K 19/07749 20130101 |
Class at
Publication: |
257/696 |
International
Class: |
H01L 023/48 |
Foreign Application Data
Date |
Code |
Application Number |
Mar 18, 2002 |
JP |
JP2002-075112 |
Jun 26, 2002 |
JP |
JP2002-186514 |
Claims
1-9. (canceled)
10. A method of manufacturing a noncontact ID card, comprising
steps of, laminating an antenna circuit board where an antenna is
formed and an interposer board formed by connecting an enlarged
electrode to an electrode of a mounted IC chip, bonding an antenna
electrode of the antenna circuit board and the enlarged electrode
of the interposer board with electroconductive adhesive material,
and bonding a substrate of said antenna circuit board and a
substrate of said interposer board.
11. The method of manufacturing the noncontact ID card of claim 10,
wherein said substrates bonding step is executed before said
electrodes bonding step.
12. A noncontact ID card composed by laminating an antenna circuit
board where an antenna is formed and an interposer board formed by
connecting an enlarged electrode to an electrode of a mounted IC
chip, bonding between an antenna electrode of said antenna circuit
board and the enlarged electrode of said interposer board with
electroconductive adhesive material, and applying at least one
local deformation to a boding face of the electrodes each other in
a direction crossing the bonding face.
13. A method of manufacturing of the noncontact ID card comprising
steps of, laminating an antenna circuit board where an antenna is
formed and an interposer board formed by connecting an enlarged
electrode to an electrode of a mounted IC chip, bonding an antenna
electrode of the antenna circuit board and the enlarged electrode
of the interposer board with electroconductive adhesive material,
and applying at least one local deformation to said antenna
electrode and said enlarged electrode in a direction crossing
opposite faces of both electrodes.
14. The method of manufacturing of the noncontact ID card of claim
13, wherein said electrodes deformation step is executed before
said electrodes bonding step.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention concerns a noncontact ID
(identification information) card and a method of manufacturing of
the same and, more particularly, a noncontact ID card in which the
conduction state between both electrodes can be kept satisfactory
for a prolonged period of time, even in case of bonding between an
antenna electrode of an antenna circuit board and an enlarged
electrode of an interposer board with electroconductive adhesive
material, and a method of manufacturing of the same.
[0003] 2. Detailed Description of the Prior Art
[0004] Conventionally, those on various forms are well known, as a
noncontact ID card, a noncontact ID tag and so on mounting an IC
chip on an antenna circuit board. As a representative example
thereof, the International Publication (WO01/62517) can be cited,
and the noncontact ID card disclosed in this document is a
noncontact ID card in which an antenna circuit board where an
antenna is formed and an interposer board formed by connecting an
enlarged electrode to an electrode of an IC chip mounted thereof
are laminated and, at the same time, an antenna electrode of the
antenna circuit board and the enlarged electrode of the interposer
board are bonded with electroconductive adhesive material.
[0005] However, the portion where both electrodes are bonded with
the electroconductive adhesive material might come off under the
effect of temperature, moisture and so on and it is extremely
difficult to hold the bonding state in a conduction state of a
constant electric resistance for a prolonged period of time.
Especially, as the bonding part of both electrodes is minute in
area, it has been difficult to resolve it so long as general
commercialized electroconductive adhesive material is used.
[0006] Moreover, as for electroconductive adhesive material, those
of paste form or film form containing a number of electroconductive
particles in resin are used. When this electroconductive adhesive
material is used for bonding between both electrodes, it is painted
and dried on the electrode of the interposer board in case of paste
form before bonding them, and sticked in case of film form. Next,
this interposer board is laminated on the antenna circuit board,
points where both electrodes are opposed are heated under the
pressure by a heat tool, and both electrodes are bonded in a
conduction state through heat sealing.
[0007] However, in the initial phase immediately after the start of
heat sealing, as both electrodes are in an unstable temporary
bonding state one to the other, a miss-alignment may occur between
the bonding positions of both electrodes due to fluidity,
elasticity and so on of the resin component of the
electroconductive adhesive material. Then, if the flatness between
both electrodes can be no more kept precise due to the dislocation
of this bonding part, there is a problem that the electric
resistance value of the bonding part. changes, and thereby
resulting in the production of defectives.
SUMMARY OF THE INVENTION
[0008] A main object of the present invention is to provide a
noncontact ID card wherein the conduction state between both
electrodes can be kept satisfactory for a prolonged period of time,
even in case of bonding between an antenna electrode of an antenna
circuit board and an enlarged electrode of an interposer board with
electroconductive adhesive material, and a method of manufacturing
of the same.
[0009] Another object of the present invention is to provide a
noncontact ID card wherein the conduction state between both
electrodes can be kept satisfactory for a prolonged period of time
by making the bonding part hard to detach, even in case of bonding
between an antenna electrode of an antenna circuit board and an
enlarged electrode of an interposer board with electroconductive
adhesive material, and a method of manufacturing of the same.
[0010] Still another object of the present invention is to provide
a noncontact ID card wherein the conduction state between both
electrodes can be kept satisfactory for a prolonged period of time
by preventing a dislocation of their bonding part from occurring,
even in case of bonding between an antenna electrode of an antenna
circuit board and an enlarged electrode of an interposer board with
electroconductive adhesive material, and a method of manufacturing
of the same.
[0011] A noncontact ID card of the present invention for attaining
the main object and the second object, among the aforementioned
objects, is composed by laminating an antenna circuit board where
an antenna is formed and an interposer board formed by connecting
an enlarged electrode to an electrode of a mounted IC chip, bonding
between an antenna electrode of the antenna circuit board and the
enlarged electrode of the interposer board with electroconductive
adhesive material and bonding between a substrate of the antenna
circuit board and a substrate of the interposer board.
[0012] Moreover, a method of manufacturing of the aforementioned
noncontact ID card comprises steps of laminating an antenna circuit
board where an antenna is formed and an interposer board formed by
connecting an enlarged electrode to an electrode of a mounted IC
chip, bonding an antenna electrode of the antenna circuit board and
the enlarged electrode of the interposer board with
electroconductive adhesive material and bonding a substrate of the
antenna circuit board and a substrate of the interposer board.
[0013] A stable electric resistance value can be kept for a
prolonged period of time, without being influenced by the
environmental change such as temperature, moisture, even in case of
bonding between the antenna electrode of the antenna circuit board
and the enlarged board of the interposer board with
electroconductive adhesive material, because the antenna electrode
of the antenna circuit board and the enlarged electrode of the
interposer board are bonded with electroconductive adhesive
material as mentioned above and, moreover, the substrate of the
antenna circuit board and the substrate of the interposer board are
bonded.
[0014] Moreover, a noncontact ID card of the present invention for
attaining the aforementioned main object, second object and third
object is composed by laminating an antenna circuit board where an
antenna is formed and an interposer board formed by connecting an
enlarged electrode to an electrode of a mounted IC chip, bonding
between an antenna electrode of the antenna circuit board and the
enlarged electrode of the interposer board with electroconductive
adhesive material and applying at least one local deformation to a
boding face of the electrodes each other in a direction crossing
the bonding face.
[0015] Moreover, a method of manufacturing of the aforementioned
noncontact ID card comprises steps of laminating an antenna circuit
board where an antenna is formed and an interposer board formed by
connecting an enlarged electrode to an electrode of a mounted IC
chip, bonding an antenna electrode of the antenna circuit board and
the enlarged electrode of the interposer board with
electroconductive adhesive material and applying at least one local
deformation to the antenna electrode and the enlarged electrode in
a direction crossing opposite faces of both electrodes.
[0016] Thus, the application of local deformation to at least one
place of the bonding face of both electrodes in a direction
crossing the bonding face permits to prevent the bonding part from
detaching and, at the same time, prevent a relative dislocation
between both electrodes, and maintain satisfactory the conduction
state between both electrodes for a prolonged period of time.
BRIEF DESCRIPTION OF DRAWINGS
[0017] FIG. 1 is a plan view illustrating a noncontact ID card of
the present invention;
[0018] FIG. 2 is a II-II cross section of FIG. 1;
[0019] FIG. 3 is a longitudinal section showing a heat-welding mode
of an interposer board in the noncontact ID card of FIG. 1;
[0020] FIG. 4 is a side view of essential parts of the interposer
board by a partial section;
[0021] FIG. 5 is a plan view showing essential parts of the
interposer board of FIG. 4;
[0022] FIG. 6 is a plan view showing an antenna circuit board where
a comb antenna is formed;
[0023] FIG. 7 is a plan view showing a noncontact ID card of
another embodiment of the present invention;
[0024] FIG. 8 is a VII-VII section of FIG. 7;
[0025] FIG. 9 is a plan view showing a deformation point of an
electrode bonding part in FIG. 7 by a partial section;
[0026] FIG. 10 is a vertical section showing another mode of the
deformation point of an electrode bonding part;
[0027] FIG. 11 is a vertical section showing still another mode of
the deformation point of an electrode bonding part;
[0028] FIG. 12 is a vertical section showing still another mode of
the deformation point of an electrode bonding part; and
[0029] FIG. 13 is a vertical section showing still another mode of
the deformation point of an electrode bonding part.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0030] A noncontact ID card of the present invention is composed by
laminating an antenna circuit board where an antenna is formed and
an interposer board mounted with an IC chip and, at the same time,
formed by connecting an enlarged electrode to an electrode of the
IC chip, and bonding between an antenna electrode of the antenna
circuit board and the enlarged electrode of the interposer board
with electroconductive adhesive material. Now, the present
invention shall be described referring to illustrated
embodiments.
[0031] It should be appreciated that, in the present invention,
"noncontact ID card" is used in a meaning including not only simply
cards but also those used as card analogue such as tag. In
addition, "electroconductive adhesive material" shall be used as
generic of media boding two members and, except otherwise
specified, used in a meaning including electroconductive sticky
material.
[0032] In the noncontact ID card of the present invention shown in
FIG. 1 and FIG. 2, 2 is an antenna circuit board disposed downside,
and 7 is an interposer board laminated upside. The antenna circuit
board 2 has a substrate 9 composed of a thermoplastic resin film,
an antenna 6 is formed on the surface of the substrate 9, and a
pair of antenna electrodes 3a, 3b are connected on it. The antenna
6 in the antenna circuit board 2 is not particularly limited in the
form, provided that it has the antenna function. For example, in
addition to the linear form shown in FIG. 1, it may be a comb teeth
form shown in FIG. 6, or a spiral type.
[0033] The interposer board 7 is composed so that a substrate 10 is
also composed of a thermoplastic resin film, an IC chip 4 is
embedded in the substrate 10, and enlarged electrodes 11a, 11b are
connected to a pair of electrodes 12a, 12b of the IC chip 4. The
pair of electrodes 12a, 12b of the IC chip 4 embedded in the
interposer board 7 are connected to the enlarged electrodes 11a,
11b through fine lead parts 11a.sub..vertline., 11b.sub..vertline.,
as shown in the enlarged view of FIG. 4 and FIG. 5.
[0034] For the antenna circuit board 2 and the interposer board 7
composed as mentioned above, the antenna electrodes 3a, 3b and the
enlarged electrodes 11a, 11b are opposed one to the other and, at
the same time, made electrically conductive by bonding them with
electroconductive adhesive material 8. A gap 13 is formed between
the mutually bonded antenna electrodes 3a, 3b and between the
enlarged electrodes 11a, 11b, and this gap 13 is filled with
insulating resin 14. Such filling with the insulation resin 14
allows to enhance the insulation of the electrode bonding part.
[0035] For the aforementioned noncontact ID card, furthermore, the
substrate 9 of the antenna circuit board 2 and the substrate 10 of
the interposer board 7 are bonded by a bonding part 15a to 15d. The
bonding of the substrate 10 of the interposer board 7 and the
substrate 9 of the antenna circuit board 2 allows to reinforce the
bonding between the antenna electrodes 3a, 3b and enlarged
electrodes 11a, 11b with the electroconductive adhesive material 8,
enabling to maintain the conduction state between electrodes at a
constant low electric resistance value for a prolonged period of
time without being influenced by the temperature, moisture and so
on.
[0036] The boding between the aforementioned substrates 9 and 10
may be spot form as bonding parts 15a to 15d, or linear. Besides,
the bonding part between the substrates 9 and 10 is preferably
positioned in the vicinity of the electrode bonding part of the
antenna electrodes 3a, 3b and enlarged electrodes 11a, 11b. Such
positioning in the periphery of the electrode bonding part allows
to make the protection of the electrode bonding part satisfactory
all the way improving the productivity.
[0037] Moreover, the bonding between the substrates 9 and 10 may be
performed by either heat-welding or adhesive material. However, as
the application operation is troublesome and inefficient in case of
adhesive material, it is preferable to perform by heat-welding. In
case of heat-welding, at least one of substrates 9 or 10 is
composed of a thermoplastic resin film, but it is not limited to a
case of composing only with a thermoplastic resin film, and may be
laminated material using the thermoplastic film as base material
and combining with paper, non-woven fabric and so on. These both
substrates 9, 10 are pinched by a heat tool, and bonded by pressing
and heating. Although, the heat tool to be used is not particularly
limited, preferably, ultrasonic type heat tool, ceramic type heat
tool and so on can be used.
[0038] As for thermoplastic resin to be used for the substrate 9,
10, in addition to copolymerization polyethylene terephthalate
(PET-G), for example, polyethylene terephthalate (PET), polysulfone
(PSF), polyethersulfone (PES), liquid crystal polymer (LCP),
polyetherethylketone (PEEK) and so on can be cited.
[0039] The substrate 9, 10 may be composed of a non thermoplastic
resin film, paper, non-woven fabric and so on that are hard to be
welded by heat. In case where both of substrates 9, 10 are composed
of a non thermoplastic resin film, paper, non-woven fabric and so
on that are hard to be welded by heat, the substrates 9, 10 are
bonded with adhesive material. In case of boding substrates 9, 10
with adhesive material also, the bonding part thereof may be spot
form or linear similarly to the case of heat-welding. The adhesive
material to be used may be either adhesion or stick, and may also
be any of thermosetting type, non-thermosefting type, room
temperature-setting type and so on.
[0040] Bonding faces for bonding between the antenna electrodes 3a,
3b and the enlarged electrodes 11a, 11b with electroconductive
adhesive material 8 are preferably roughened respectively into a
minute irregular surface. This is to allow the electroconductive
adhesive material to adhere to it easily. The electroconductive
adhesive material used for bonding may be any of paste form or film
form. However, those of film form are preferably convenient, and
particularly those of paste form are preferable in case of mass
production. In case of using electroconductive adhesive material,
in a paste form, it is applied on the electrode surface with
printing or dripping and then dried into a film form. In case of
using electroconductive adhesive material in a film form, it is
pasted on the electrode surface as it is.
[0041] Many of film form electroconductive adhesive material are
thermosetting adhesive material or PSA (pressure sensitive
adhesive) sticky material, but some of them are thermoplastic. For
example, there are those containing electroconductive particulates
such as Ni, Ag or other metal particulates or metallic coating
particulates in hot-melt type acrylic sticky resin and so on. In
any case, the electrode bonding part is pressed and heated by a
heat tool to bring electroconductive particulates into contact
among them and with both electrodes and electrically into a
conduction state. The heating temperature and the heating time for
the electrode bonding are controlled to predetermined temperature
and time responding to the characteristics of the electroconductive
adhesive material. For example, in case of using a thermoplastic
type electroconductive sticky film, the heating temperature and
time are about 100.degree. C. and several seconds.
[0042] As for the mounting of the IC chip 4 on the substrate 10 of
the interposer board 7, in addition to the embedding as the
illustrated example, for instance, it may be mounted in a way to
laminate on the surface of the substrate. However, it is preferable
to embed in view of thinning of the card.
[0043] The antenna electrode 3a, 3b and enlarged electrode 11a, 11b
are composed of silver paste printing, or the one may be composed
of a silver paste printed electrode, while the other of aluminum.
Moreover, the material of the enlarged electrode 11a, 11b and
antenna electrode 3a, 3b may be electroconductive resin and,
furthermore, formed by printing methods such as screen printing or
offset printing. Or, aluminum or the like may be deposited by
spattering method and so on. For the electrode 12a, 12b of the IC
chip 4, it is preferable to form an under barrier metal layer (UBM
layer) in order to ensure the connection with the enlarged
electrode 11a, 11b.
[0044] The method of manufacturing of the aforementioned noncontact
ID card of the present invention comprises steps of laminating an
antenna circuit board 2 where an antenna 6 is formed and an
interposer board 7 formed by connecting enlarged electrodes 11a,
11b to electrodes 12a, 12b of a mounted IC chip 4, bonding an
antenna electrode 3a, 3b of the antenna circuit board 2 and the
enlarged electrode 11a, 11b of the interposer board 7 with
electroconductive adhesive material 8 and bonding a substrate 9 of
the antenna circuit board 2 and a substrate 10 of the interposer
board 7. To be more specific, it is manufactured as follows.
[0045] First of all, an antenna circuit board 2 and an interposer
board 7 made beforehand in the previous step are prepared. Here,
the substrate 9 of the antenna circuit board 2 and the substrate 10
of the interposer board 7 shall be composed for instance of a
thermoplastic resin film. Next, a paste like electroconductive
adhesive material 8 is applied to or a film like electroconductive
adhesive material 8 is stuck on the enlarged electrode 11a, 11b of
the interposer board 7. It goes without saying that the
electroconductive adhesive material 8 may be applied or stuck on
the electrode 3a, 3b side of the antenna circuit board 2. Then, the
interposer board 7 and the antenna circuit board 2 are laminated so
that enlarged electrode 11a, 11b and the antenna electrode 3a, 3b
are opposed up and down.
[0046] For the aforementioned laminating operation, the antenna
circuit board 2 is sucked and held to a not shown lower stage, the
interposer board 7 sucked and held above is moved to this antenna
circuit board 2, the electrode 3a, 3b of the antenna circuit board
2 and the enlarged electrode 11a, 11b of the interposer board 7 are
aligned in position in two axial directions (X, Y axial directions)
orthogonal one to the other on the horizontal plane, before moving
the heat tool for applying the electroconductive adhesive material
8 to the electrode 3a, 3b of the antenna circuit board 2 to
heat-seal.
[0047] In addition, the substrate 10 of the interposer board 7 is
heat-welded to the substrate 9 of the antenna circuit board 2, and
this bonding operation may be performed at the same time as the
mutual boding of the aforementioned electrodes, after the mutual
bonding of the aforementioned electrodes, or before the mutual
bonding of the aforementioned electrodes. However, from the
viewpoint of preventing the dislocation of the electrode bonding
part or improving the productivity, it is preferable to bond
substrates each other before bonding between the electrodes. It is
similar to the case where the bonding between substrates is
executed by adhesive material instead of the heat-welding.
[0048] Besides, the bonding operation of substrates one to the
other may use simultaneously the heat tool used for the mutual
bonding of the electrodes or a heat tool set separately may also be
used. In addition, the point to bond substrates is not particularly
limited, but preferably it is preferable to bond in the vicinity of
a portion where electrodes are bonded as bonding parts 15a to 15d
illustrated in FIG. 1 for the protection of the electrode bonding
part and the productivity.
[0049] Temperature and time in case of thermo-welding substrates
each other may be decided according to the characteristics of the
thermoplastic resin film used for the substrate. For example, in
case where the material of the substrate is a film of copolymer
polyethyleneterephthalate (PET-G), the temperature and time are
about 120.degree. C. and 0.5 to 2 seconds.
[0050] As substrates of the substrate 9 of the antenna circuit
board 2 and the substrates 10 of the interposer board 7 are bonded
each other as mentioned above, the method of manufacturing of the
noncontact ID card of the present invention, a constant electric
conduction state can be maintained for a prolonged period of time,
even when electrodes 3a, 3b; 11a, 11b are bonded with the
electroconductive adhesive material.
[0051] FIG. 7 to FIG. 9 show other embodiments of the noncontact ID
card of the present invention.
[0052] This noncontact ID card is same as the aforementioned
embodiment of FIG. 1 and FIG. 2 in that the antenna circuit board 2
and the interposer board 7 are laminated, and the antenna electrode
3a, 3b of the antenna circuit board 2 and the enlarged electrode
11a, 11b of the interposer board 7 are bonded through the
electroconductive adhesive material 8. The antenna circuit board 2
is formed by forming an antenna 6 in the substrate 9 composed of a
resin film and connecting a pair of electrodes 3a, 3b to this
antenna 6. Moreover, the interposer board 7 is formed by embedding
an IC chip 4 in a substrate 10 composed of a thermoplastic film,
and connecting an enlarged electrode 11a, 11b to a pair of
electrode 12a, 12b of this IC chip. The substrate 9 of the antenna
circuit board 2 and the substrate 10 of the interposer board 7 may
be same as the case of the aforementioned FIG. 1 and FIG. 2. In
short, the substrate 9, 10 may be a simple resin film or laminated
material with the other materials such as paper, non-woven fabric,
using the resin film as main material. The thermoplastic resin film
is preferable as resin film. Furthermore, it may be a
non-thermoplastic resin film, paper, non-woven fabric or the like
hard to be heat-welded.
[0053] The electrodes 11a and 3a and the electrodes 3b and 11b
bonded each other with the electroconductive adhesive material 8 as
mentioned above have respectively a local portion 20 of one part is
bent and deformed in the arrow direction orthogonal to the bonding
face. A bending deformation being applied between both electrodes
in such a way, the electrode bonding part is prevented from peeling
off, both electrodes are prevented from dislocating, and the
conduction state between both electrodes can be maintained
satisfactory for a prolonged period of time.
[0054] Furthermore, it is not illustrated, but, in the noncontact
ID card shown in FIG. 7 to FIG. 9, the substrate 10 of the
interposer board 7 and the substrate 9 of the antenna circuit board
2 may be bonded by heat-welding or the like, as in the embodiment
of FIG. 1 and FIG. 2. Thus, a satisfactory conduction state between
electrodes can further be improved by adding a bonding composition
between substrates.
[0055] The manufacturing of the noncontact ID card comprising the
aforementioned composition can be executed by steps of laminating
an antenna circuit board 2 where an antenna 6 is formed and an
interposer board 7 formed by connecting an enlarged electrode 11a,
11b to an electrode 12a, 12b of a mounted IC chip 4, bonding an
antenna electrode 3a, 3b of the antenna circuit board 2 and the
enlarged electrode 11a, 11b of the interposer board 7 with
electroconductive adhesive material 8 and applying a local
deformation of at least one point to the antenna electrode 3a, 3b
and the enlarged electrode 11a, 11b in a direction crossing the
opposite faces of both electrodes.
[0056] As for the electrodes bonding step, similarly to the case of
the embodiment(s) of FIG. 1 and FIG. 2 mentioned above, the
electroconductive adhesive material may be interposed between the
antenna electrode 3a, 3b and the enlarged electrode 11a, 11b,
pressed and heated by a heat tool. This pressing and heating can
bring electroconductive particulates in the electroconductive
adhesive material 8 into contact and electrically conduction state.
Concerning also the electroconductive adhesive material, those
similar to the one used for the aforementioned embodiment can be
used.
[0057] The electrodes deformation step can be executed, for
instance, by forcing a molding tool such as punch into a
predetermined depth in the arrow direction from above the substrate
10 of the interposer board 7. As for the electrodes deformation
step, it is preferable to execute previously before the electrodes
bonding step for heat sealing between both electrodes 3a, 3b; 11a,
11b with the electroconductive adhesive material 8. Thus, the
execution of the electrodes deformation step before the electrodes
bonding step allows to obtain a satisfactory bonding state without
occurrence of dislocation in bonding position of both electrodes,
even if the electrode bonding part is pressure heated in the
following electrodes bonding step.
[0058] In general, when the aforementioned heat seal is performed,
the dislocation in the bonding position of both electrodes tends to
occur easily due to the effect of the resin component of the
electroconductive adhesive material 8. Especially, it is remarkable
in case of using electroconductive adhesive material. However, as
the electrodes deformation step is performed before the electrodes
bonding step, a local point 20 of a portion is bent and deformed
between the enlarged electrode 11a, 11b and the antenna electrode
3a, 3b each other, and forced in the other one together with the
electroconductive adhesive material 8 between both electrodes, it
becomes possible not to produce the aforementioned bonding
dislocation, in order to prevent a relative dislocation between
both electrodes.
[0059] The electroconductive adhesive material used for the present
invention may be paste form or film form, but those of film form
are preferable for performing the aforementioned electrodes
deformation step advantageously. However, even that
electroconductive adhesive material of paste form can follow the
forcing of the molding tool in the electrodes deformation step, as
they are applied on the electrode surface, then dried and changed
into the film form.
[0060] Though the molding tool press fitting to be performed in the
electrodes deformation step is executed, in the aforementioned
embodiment, by forcing the local point 20 of the enlarged electrode
11a, 11b of the interposer board 7 side into the antenna electrode
3a, 3b of the antenna circuit board 2 side, contrary to this, as
shown in FIG. 10, the antenna electrode 3a, 3b of the antenna
circuit board 2 side may also be forced in the enlarged electrode
11a, 11b of the interposer board 7 side. Moreover, it is sufficient
that the press fitting deformation to be applied to the electrode
per point, be at least one point, and may also be a plurality of
positions as shown in FIG. 11. And, the place of press fitting is
not limited to the central portion of the electrode, but it may be
the peripheral portion. Besides, the shape of bend deformation is
not limited to a V shape shown in FIGS. 8, 10, 11, but it may be,
for instance, a curved shape as shown in FIG. 12. Moreover, the
bend deformation may be a press fitting into a penetrated state as
shown in FIG. 13.
[0061] As mentioned hereinabove, in the noncontact ID card of the
first invention of the present invention, as the antenna electrode
of the antenna circuit board and the enlarged electrode of the
interposer board are bonded with the electroconductive adhesive
material and, further, the substrate of the antenna circuit board
and the substrate of the interposer board are bonded, a stable
electric resistance value can be kept satisfactory for a prolonged
period of time, without being influenced by the environmental
changes such as temperature and moisture even in case of using the
electroconductive adhesive material for bonding between the antenna
electrode of the antenna circuit board and the enlarged board of
the interposer board.
[0062] Besides, in the noncontact ID card of the second invention,
the applyment of local deformation in at least one place of more of
the bonding face of the antenna electrode of the antenna circuit
board and the enlarged electrode of the interposer board in a
direction crossing the bonding face permits to prevent the bonding
part from detaching and, at the same time, prevent a relative
dislocation between both electrodes, and maintain satisfactory the
electric conduction state between both electrodes for a prolonged
period of time even if the electroconductive adhesive material is
used for bonding between the antenna electrode of the antenna
circuit board and the enlarged board of the interposer board.
* * * * *