U.S. patent application number 10/944808 was filed with the patent office on 2005-05-19 for substrate for electrical device and methods of manufacturing the same.
Invention is credited to Wang, Chung-Cheng.
Application Number | 20050104205 10/944808 |
Document ID | / |
Family ID | 34568546 |
Filed Date | 2005-05-19 |
United States Patent
Application |
20050104205 |
Kind Code |
A1 |
Wang, Chung-Cheng |
May 19, 2005 |
Substrate for electrical device and methods of manufacturing the
same
Abstract
Substrate for electrical devices and methods of manufacturing
such substrate are disclosed. An embodiment for the substrate
comprised of an insulator and a plurality of conductive elements,
wherein the insulator having a recess. The conductive elements
embedded in the insulator. The conductive elements extend from the
insulator surface to the recess. There are two portions of the
conductive elements for electrical connection respectively, wherein
a portion of conductive element may protrude the insulator surface
for electrical connection. In this manner, solder balls are not
needed. Moreover, the substrate of the present invention may also
comprise an adhesive mean, which is between the conductive elements
and the insulator. In addition, the substrate may further comprise
a submember such as a chip, heat spreader etc., and the present
invention may be capable of affording a thinner electrical device
thickness, enhanced reliability, and a decreased cost in
production.
Inventors: |
Wang, Chung-Cheng; (Taichung
County, TW) |
Correspondence
Address: |
BACON & THOMAS, PLLC
625 SLATERS LANE
FOURTH FLOOR
ALEXANDRIA
VA
22314
|
Family ID: |
34568546 |
Appl. No.: |
10/944808 |
Filed: |
September 21, 2004 |
Current U.S.
Class: |
257/730 ;
257/690; 257/786; 257/E23.039; 257/E23.066; 257/E23.092;
257/E23.14; 257/E25.023 |
Current CPC
Class: |
H01L 2224/49171
20130101; H01L 2924/01078 20130101; H01L 2924/12041 20130101; H01L
24/48 20130101; H01L 2924/00014 20130101; H01L 23/3114 20130101;
H05K 2201/09845 20130101; H01L 2224/4826 20130101; H05K 1/183
20130101; H01L 2924/18165 20130101; H01L 2224/4826 20130101; H01L
2924/01029 20130101; H01L 2225/1058 20130101; H05K 3/403 20130101;
H01L 2924/15311 20130101; H01L 2224/48091 20130101; H01L 24/94
20130101; H01L 2225/06568 20130101; H01L 2924/00014 20130101; H01L
2224/73215 20130101; H01L 2225/1041 20130101; H01L 2224/48465
20130101; H01L 2924/19105 20130101; H01L 23/4334 20130101; H01L
23/4951 20130101; H01L 2224/48253 20130101; H01L 2224/48465
20130101; H01L 2224/48465 20130101; H01L 25/03 20130101; H01L
2224/49109 20130101; H01L 2224/49171 20130101; H01L 2225/1035
20130101; H01L 2924/181 20130101; H05K 2203/1476 20130101; H01L
2924/3511 20130101; H01L 2224/4826 20130101; H01L 2924/00 20130101;
H01L 2924/00 20130101; H01L 2924/00 20130101; H01L 2224/48465
20130101; H01L 2924/00 20130101; H01L 2924/00 20130101; H01L
2924/00014 20130101; H01L 2924/00012 20130101; H01L 2224/48247
20130101; H01L 2924/00 20130101; H01L 2224/48247 20130101; H01L
2224/49109 20130101; H01L 2924/00 20130101; H01L 2924/00 20130101;
H01L 2224/45015 20130101; H01L 2924/207 20130101; H01L 2224/48465
20130101; H01L 2224/49171 20130101; H01L 2224/48091 20130101; H01L
2224/48247 20130101; H01L 21/6835 20130101; H01L 23/49861 20130101;
H01L 2924/00014 20130101; H01L 2224/48247 20130101; H01L 24/49
20130101; H05K 2203/0369 20130101; H01L 2924/00 20130101; H01L
2224/45099 20130101; H01L 2224/49109 20130101; H01L 2924/01046
20130101; H01L 2224/48091 20130101; H01L 2224/49171 20130101; H01L
2924/01079 20130101; H05K 3/064 20130101; H01L 23/24 20130101; H05K
2201/09645 20130101; H01L 2224/4826 20130101; H01L 2224/4826
20130101; H01L 2924/01019 20130101; H01L 2924/1532 20130101; H05K
2201/09036 20130101; H01L 25/105 20130101; H01L 2224/48465
20130101; H01L 2924/181 20130101 |
Class at
Publication: |
257/730 ;
257/690; 257/786 |
International
Class: |
H01L 023/04 |
Foreign Application Data
Date |
Code |
Application Number |
Oct 8, 2003 |
TW |
92128017 |
Claims
What is claimed is:
1. A substrate for electrical device comprising: an insulator
having at least a recess; and at least a conductive element having
a first portion, a second portion and a third portion, the
conductive element is staircase-shaped, the conductive element
further having an electrical surface which consists of the
electrical surface of first portion, the electrical surface of
second portion and the electrical surface of third portion, the
electrical surface of conductive element is for electrical
connection; the conductive element embedded in the insulator, and
the conductive element extending from the insulator surface to the
recess, wherein the first portion of conductive element exposed to
the insulator surface, and at least a portion of the first portion
protruding the insulator surface for electrical connection; the
electrical surface of third portion is within the recess and
exposed to the insulator for electrical connection; the second
portion is between the first portion and the third portion.
2. The substrate of claim 1, wherein the recess of substrate having
at least an opening.
3. The substrate of claim 1, further comprising a submember which
is below the recess of substrate and at least a portion of the
submember encapsulated by the insulator, wherein the submember
selectively serving as a heat spreader, a chip or a transparent
plate.
4. The substrate of claim 1, further comprising a chip which is
coupled with the substrate, wherein, the chip electrically
connected to the substrate through at least a conductive mean.
5. A substrate for electrical device comprising: an insulator
having at least a recess; and at least a conductive element having
a first portion, a second portion and a third portion, the
conductive element is staircase-shaped, the conductive element
further having an electrical surface which consists of the
electrical surface of first portion, the electrical surface of
second portion and the electrical surface of third portion, the
electrical surface of conductive element is for electrical
connection, the conductive element embedded in the insulator, and
the conductive element extending from the insulator surface to the
recess, wherein at least a portion of the electrical surface of
first portion exposed to the insulator surface for electrical
connection; the electrical surface of third portion is within the
recess and exposed to the insulator for electrical connection; the
second portion is between the first portion and the third portion,
wherein a portion of electrical surface of conductive element
encapsulated by the insulator, in this manner, the shape of
conductive element is discontinuous in accordance with the
insulator surface.
6. The substrate of claim 5, wherein the recess of substrate having
at least an opening.
7. The substrate of claim 5, wherein the electrical surface of
conductive element having at least a recessed portion which
encapsulated by the insulator.
8. The substrate of claim 5, further comprising an another
insulator and the electrical surface of conductive element having
at least a recessed portion which encapsulated by the another
insulator.
9. The substrate of claim 5, wherein the first portion of
conductive element having a protruding portion for electrical
connection.
10. The substrate of claim 5, further comprising a submember which
is below the recess of substrate and at least a portion of the
submember encapsulated by the insulator, wherein the submember
selectively serving as a heat spreader, a chip or a transparent
plate.
11. The substrate of claim 5, wherein the first portion of
conductive element having a side edge which exposed to the side
wall of insulator.
12. The substrate of claim 5, further comprising a chip which is
coupled with the substrate, wherein the chip electrically connected
to the substrate through at least a conductive mean.
13. A substrate for electrical device comprising: an insulator
having at least a recess; at least a conductive element having a
first portion, a second portion, a third portion, the conductive
element is staircase-shaped, the conductive element further having
an electrical surface which consists of the electrical surface of
first portion, the electrical surface of second portion and the
electrical surface of third portion, the electrical surface of
conductive element is for electrical connection, wherein the
insulator encapsulates the first portion and the second portion
which are imbedded in the insulator, the conductive element
extending from the insulator surface to the recess, wherein at
least a portion of the electrical surface of first portion exposed
to the insulator surface for electrical connection; and at least an
adhesive mean which encapsulates the third portion of conductive
element, then at least a portion of the third portion embedded in
the adhesive mean, wherein the electrical surface of third portion
is within the recess, and the electrical surface of third portion
exposed to the adhesive mean for electrical connection; a portion
of the adhesive mean encapsulated by the insulator; the second
portion is between the first portion and the third portion.
14. The substrate of claim 13, wherein the recess of substrate
having at least an opening.
15. The substrate of claim 13, wherein at least a portion of the
second surface of third portion exposed to the insulator.
16. The substrate of claim 13, further comprising a submember which
is below the recess of substrate and at least a portion of the
submember encapsulated by the insulator, wherein the submember
selectively serving as a heat spreader, a chip or a transparent
plate.
17. The substrate of claim 13, wherein the first portion of
conductive element having a side edge which exposed to the side
wall of insulator.
18. The substrate of claim 13, further comprising a chip which is
coupled with the substrate, wherein, the chip electrically
connected to the substrate through at least a conductive mean.
19. A substrate for electrical device comprising: at least a
conductive element having a first portion, a second portion, a
third portion, the conductive element is staircase-shaped, the
conductive element further having an electrical surface which
consists of the electrical surface of first portion, the electrical
surface of second portion and the electrical surface of third
portion, the electrical surface of conductive element is for
electrical connection; at least an adhesive mean coupled with the
conductive element, then the conductive element mounted on the
upper surface of adhesive mean; an insulator having at least a
recess, the insulator encapsulates the lower surface of adhesive
mean, in this manner, the adhesive mean is between the conductive
element and the insulator, wherein the conductive element extending
from the upper surface of adhesive mean to the recess of substrate,
wherein the first portion is upon the upper surface of adhesive
mean for electrical connection; the third portion is upon the upper
surface of adhesive mean for electrical connection, and the third
portion is within the recess of substrate, the second portion is
between the first portion and the third portion; and a submember is
below the recess, wherein at least a portion of submember
encapsulated by the insulator, in this manner, both the submember
and the adhesive mean are encapsulated by the insulator
respectively.
20. The substrate of claim 19, wherein the submember selectively
serving as a heat spreader, a chip or a transparent plate.
21. The substrate of claim 19, wherein a portion of submember is
exposed to the adhesive mean, and the portion of submember which
exposed to the adhesive mean is served as a portion of the bottom
of recess.
22. The substrate of claim 19, wherein the submember is not exposed
to the adhesive mean, then the submember is not exposed to the
bottom of recess.
23. The substrate of claim 19, wherein at least a portion of
submember embedded in the insulator.
24. The substrate of claim 19, wherein the first portion of
conductive element having an extending portion for electrically
connecting to outside.
25. The substrate of claim 19, further comprising a chip which is
coupled with the substrate, wherein, the chip electrically
connected to the substrate through at least a conductive mean.
26. A substrate for electrical device comprising: an insulator
having at least a recess; at least a conductive element having a
first portion, a second portion and a third portion, the conductive
element is staircase-shaped, the conductive element further having
an electrical surface which consists of the electrical surface of
first portion, the electrical surface of second portion and the
electrical surface of third portion the electrical surface of
conductive element is for electrical connection; the conductive
element embedded in the insulator, and the conductive element
extending from the insulator surface to the recess, wherein at
least a portion of the electrical surface of first portion exposed
to the insulator surface for electrical connection; the electrical
surface of third portion is within the recess and exposed to the
insulator for electrical connection; the second portion is between
the first portion and the third portion; and a submember is below
the recess, the submember encapsulated by the insulator, wherein,
the submember embedded in the insulator.
27. The substrate of claim 26, wherein a portion of submember is
exposed to the insulator, and the portion which exposed to the
insulator is served as a portion of the bottom of recess.
28. The substrate of claim 26, wherein the submember is not exposed
to the insulator, then the submember is not exposed to the bottom
of recess.
29. The substrate of claim 26, wherein the submember selectively
serving as a heat spreader, a chip or a transparent plate.
30. The substrate of claim 26, wherein the first portion of
conductive element having a side edge which exposed to the side
wall of insulator.
31. The substrate of claim 26, further comprising a chip which is
coupled with the substrate, wherein, the chip electrically
connected to the substrate through at least a conductive mean.
32. A substrate for electrical device comprising: an insulator
having at least a recess; and at least a conductive element having
a first portion, a second portion and a third portion, wherein the
first portion, the second portion and the third portion do not have
a co-planar surface, and the first portion, the second portion and
the third portion having a second surface respectively, the
conductive element is staircase-shaped, the conductive element
further having an electrical surface which consists of the
electrical surface of first portion, the electrical surface of
second portion and the electrical surface of third portion, the
electrical surface of conductive element is for electrical
connection; wherein the conductive element embedded in the
insulator, and the conductive element extending from the insulator
surface to the recess, wherein at least a portion of the electrical
surface of first portion exposed to the insulator surface for
electrical connection; the electrical surface of third portion is
within the recess and exposed to the insulator for electrical
connection, wherein the second surface of third portion exposed to
the insulator surface, both the second surface of first portion and
the second surface of second portion encapsulated by the insulator;
the second portion is between the first portion and the third
portion.
33. The substrate of claim 32, wherein the recess of substrate
having at least an opening.
34. The substrate of claim 32, wherein the first portion of
conductive element having a side edge which exposed to the side
wall of insulator.
35. The substrate of claim 26, further comprising a chip, which is
coupled with the substrate, wherein, the chip electrically
connected to the substrate through at least a conductive mean.
36. A substrate for electrical device comprising: an insulator
having at least a recess; at least a conductive element having a
first portion, a second portion and a third portion, the conductive
element is staircase-shaped, the conductive element further having
an electrical surface which consists of the electrical surface of
first portion, the electrical surface of second portion and the
electrical surface of third portion, the electrical surface of
conductive element is for electrical connection; the conductive
element embedded in the insulator, and the conductive element
extending from the insulator surface to the recess, wherein at
least a portion of the electrical surface of first portion exposed
to the insulator surface for electrical connection; the electrical
surface of third portion is within the recess and exposed to the
insulator for electrical connection; the second portion is between
the first portion and the third portion; and a submember having at
least a recess, the submember encapsulated by the insulator, in
this manner, at least a portion of third portion of conductive
element and at least a portion of insulator are within the recess
of submember, wherein the insulator is between the conductive
element and the submember, and at least a portion of the recess of
submember serving as a portion of the recess of insulator.
37. The substrate of claim 36, wherein a portion of electrical
surface of conductive element encapsulated by the insulator, in
this manner, according to the insulator surface, the shape of
conductive element is discontinuous.
38. The substrate of claim 36, wherein the first portion of
conductive element having a protruding portion for electrical
connection.
39. The substrate of claim 36, wherein the first portion of
conductive element having a side edge which exposed to the side
wall of insulator.
40. The substrate of claim 36, further comprising a chip which is
coupled with the substrate, wherein the chip electrically connected
to the substrate through at least a conductive mean.
41. A substrate for electrical device comprising: an insulator
having at least a recess; and at least a conductive element having
a first portion, a second portion and a third portion, the
conductive element is staircase-shaped, the conductive element
further having an electrical surface which consists of the
electrical surface of first portion, the electrical surface of
second portion and the electrical surface of third portion, the
electrical surface of conductive element is for electrical
connection; the conductive element embedded in the insulator, and
the conductive element extending from the insulator surface to the
recess, wherein at least a portion of the electrical surface of
first portion exposed to the insulator surface for electrical
connection; the electrical surface of third portion is within the
recess and exposed to the insulator for electrical connection; the
second portion is between the first portion and the third portion,
wherein the first portion of conductive element having a side edge
which exposed to the side wall of insulator.
42. The substrate of claim 41, wherein the recess of substrate
having at least an opening.
43. The substrate of claim 41, wherein a portion of electrical
surface of conductive element encapsulated by the insulator, in
this manner, the shape of conductive element is discontinuous in
accordance with the insulator surface.
44. The substrate of claim 41, further comprising a submember which
is below the recess of substrate and at least a portion of the
submember encapsulated by the insulator, wherein the submember
selectively serving as a heat spreader, a chip or a transparent
plate.
45. The substrate of claim 41, further comprising a chip which is
coupled with the substrate, wherein the chip electrically connected
to the substrate through at least a conductive mean.
46. An electrical device comprising: a chip having an active
surface; a substrate including at least an insulator and at least a
conductive element, the insulator having at least a recess, the
conductive element having a first portion, a second portion and a
third portion, the conductive element is staircase-shaped, the
conductive element further having an electrical surface which
consists of the electrical surface of first portion, the electrical
surface of second portion and the electrical surface of third
portion, the electrical surface of conductive element is for
electrical connection; the conductive element embedded in the
insulator, and the conductive element extending from the insulator
surface to the recess, wherein at least a portion of the electrical
surface of first portion exposed to the insulator surface for
electrical connection; the electrical surface of third portion is
within the recess and exposed to the insulator for electrical
connection; the second portion is between the first portion and the
third portion; wherein the active surface of chip encapsulated by
the insulator, then the insulator is upon the active surface of
chip, in this manner, both the conductive element and the chip are
encapsulated by the insulator respectively, wherein a portion of
the active surface exposed to the insulator for electrically
connecting to the conductive element; and at least a conductive
mean electrically connected the chip to the substrate.
47. The electrical device of claim 46, wherein the first portion of
conductive element having a protruding portion for electrical
connection.
48. The electrical device of claim 46, further comprising an
adhesive mean which coupled with the active surface of chip,
wherein a portion of the adhesive mean encapsulated by the
insulator, wherein the adhesive mean does not touch the third
portion of conductive element.
49. The electrical device of claim 46, wherein the first portion of
conductive element having a side edge which exposed to the side
wall of insulator.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a substrate for electrical
device and methods of manufacturing the same, more particularly, it
relates to a substrate for electrical device, which enhancing
reliability of electrical devices and downsizing electrical
devices.
[0003] 2. Description of the Related Art
[0004] Users of electrical devices are continually demanding better
quality of electrical devices, smaller(thinner) electrical devices
and inexpensive electrical devices, wherein the better quality of
electrical devices includes higher reliability and enhanced heat
dissipation of electrical devices. So manufacturers of electrical
device research and develop electrical devices for achieving the
demands mentioned-above.
[0005] At first, referring to FIG. 51 shows a conventional
electrical device 100 comprising: a substrate 2 having a through
hole 6, a plurality of conductive fingers 3 and a plurality of
solder balls 4 thereon, wherein the solder balls 4 electrically
connected the substrate 2 to the printed circuit board 7; a chip 5
placed in the through hole 6 of substrate 2; a plurality of
conductive wires 8 electrically connected the chip 5 to the
conductive fingers 3 respectively; an encapsulant 9 encapsulates
the chip 5, substrate 2 and the conductive wires 8, wherein the
height "H" of the solder ball 4 is higher than the height "n" of
the encapsulant 9 (i. e. the higher the encapsulant 9 is, the
bigger the solder ball 4 is needed.). In this manner, more material
for manufacturing solder ball 4 is needed, then the cost increased,
and the thickness of electrical device is thicker. Moreover, due to
the solder ball 4 attaching to the conductive finger 3 by the
surface 23 of the solder ball 4 exclusively. It is easy to cause
peeling-off problems of solder balls 4 by means of contamination
which is happened while operating the attaching (solder balls)
process, thermal effects and/or other reasons such as collision.
When the peeling-off problem happened, the solder ball 4 separated
from the conductive finger 3 easily. It may cause the electrical
device 100 to be not functional well.
SUMMARY OF THE INVENTION
[0006] It is therefore an object of the invention to solve the
mentioned-above problems. In accordance with the invention, the
substrate includes an insulator and a plurality of conductive
elements, wherein the insulator having a recess. The conductive
elements having a first portion, a second portion and a third
portion respectively, the conductive elements are staircase-shaped,
and embedded into the insulator. The conductive elements extend
from the insulator surface to the recess of insulator. There are
two portions of the conductive elements for electrical connection
respectively, wherein
[0007] a portion of the conductive element may protrude the
insulator surface for external connection. In this manner, the
solder balls are not needed. Moreover, the substrate of the present
invention may further comprise an adhesive mean which is between
the conductive elements and the insulator, In addition, the
substrate may also comprise a submember which is encapsulated by
the insulator. The submember is selectively serving as a heat
spreader, chip or transparent plate etc.
[0008] The mentioned-above and further objects of the present
invention will be more adequately appeared from the detailed
description, accompanying drawings and appended claims as
follow.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] FIGS. 1A-1F show cross-sectional views of a step of first
method for manufacturing a first preferred embodiment of substrate
of the present invention.
[0010] FIGS. 2-3 are cross-sectional views show embodiments of
electrical device according to the present invention, the substrate
is manufactured by the first method of first preferred embodiment
of substrate.
[0011] FIGS. 4A-4H show cross-sectional views of a step of second
method for manufacturing a first preferred embodiment of substrate
of the present invention.
[0012] FIGS. 5-7 are cross-sectional views show embodiments of
electrical device according to the present invention, the substrate
is manufactured by the second method of first preferred embodiment
of substrate.
[0013] FIGS. 8A-8E show cross-sectional views of a step of third
method for manufacturing a first preferred embodiment of substrate
of the present invention.
[0014] FIGS. 9-14 are cross-sectional views show embodiments of
electrical device according to the present invention, the substrate
is manufactured by the third method of first preferred embodiment
of substrate.
[0015] FIGS. 15A-15H show cross-sectional views of a step of first
method for manufacturing a second preferred embodiment of substrate
of the present invention.
[0016] FIGS. 16-17 are cross-sectional views show embodiments of
electrical device according to the present invention, the substrate
is manufactured by the first method of second preferred embodiment
of substrate.
[0017] FIGS. 18A-18D show cross-sectional views of a step of second
method for manufacturing a second preferred embodiment of substrate
of the present invention.
[0018] FIGS. 19-21 are cross-sectional views show embodiments of
electrical device according to the present invention, the substrate
is manufactured by the second method of second preferred embodiment
of substrate.
[0019] FIGS. 22A-22D show cross-sectional views of a step of third
method for manufacturing a second preferred embodiment of substrate
of the present invention.
[0020] FIGS. 23-26 are cross-sectional views show embodiments of
electrical device according to the present invention, the substrate
is manufactured by the third method of second preferred embodiment
of substrate.
[0021] FIG. 27A is a top view of the electrical device of the
present invention, the substrate is manufactured by the third
method of second preferred embodiment of substrate.
[0022] FIG. 27B is a cross-sectional view of the electrical device
of FIG. 27A.
[0023] FIG. 28A is a partially enlarged perspective view of FIG.
28B.
[0024] FIG. 28B is a cross-sectional view of electrical device of
the present invention, the substrate is manufactured by the third
method of second preferred embodiment of substrate.
[0025] FIGS. 29-35 are cross-sectional views show embodiments of
electrical device according to the present invention, the substrate
is manufactured by the third method of second preferred embodiment
of substrate.
[0026] FIGS. 36A-36E show cross-sectional views of a step for
manufacturing an electrical device, the substrate is manufactured
by the third method of second preferred embodiment of
substrate.
[0027] FIG. 37 shows a cross-sectional view of a final step for
manufacturing an electrical device according to the present
invention, the substrate is manufactured by the third method of
second preferred embodiment of substrate.
[0028] FIGS. 38A-38D show cross-sectional views of a step of fourth
method for manufacturing a second preferred embodiment of substrate
of the present invention.
[0029] FIGS. 39-42 are cross-sectional views show embodiments of
electrical device according to the present invention, the substrate
is manufactured by the fourth method of second preferred embodiment
of substrate.
[0030] FIGS. 43A-43E show cross-sectional views of a step for
manufacturing an electrical device according to the present
invention, the substrate is manufactured by the fifth method of
second preferred embodiment of substrate.
[0031] FIGS. 44-49 are cross-sectional views show embodiments of
electrical device according to the present invention, the substrate
is manufactured by the fifth method of second preferred embodiment
of substrate.
[0032] FIG. 50 is a cross-sectional view shows an embodiment of
electrical device according to the present invention, the substrate
is manufactured by the third and fourth methods of second preferred
embodiment of substrate.
[0033] FIG. 51 shows a cross-sectional view of electrical device
according to a prior art.
DETAILED DESCRIPTION OF THE INVENTION
[0034] Embodiments of the present invention will be explained with
reference to the drawings as follow.
First Embodiment
[0035] A first embodiment of the present invention will be
explained with reference to FIGS. 1A-1F, which is a first method
for manufacturing the first embodiment of substrate of the present
invention.
[0036] FIG. 1A shows providing a conductive plate 65 such as copper
foil.
[0037] FIGS. 1B, 1Ba (FIG. 1Ba is a side view of FIG. 1B.) show by
means of etching process, a plurality of protruding portions 66,
upper portions 67 and recessed portions 69 formed by the conductive
plate 65, each protruding portion 66 has a lower surface 62, and
each upper portion 67 connects to each protruding portion 66, then
the protruding portion 66 is adjacent to each other. In this
manner, a plurality of gaps 661 formed, the gaps 661 are between
the protruding potions 66 and another protruding potions 66.
[0038] FIG. 1C shows providing a soluble insulating material 53
which placed into the recessed portion 69;
[0039] FIG. 1D, 1Da (FIG. 1Da is a side view of FIG. 1D) show
providing a filling process of insulator for filling the insulator
70 into the gaps 661, then the insulator 70 encapsulates the
protruding portions 66, upper portions 67 and the soluble
insulating material 53, wherein the lower surface 62 of protruding
portion 66 and the lower surface 532 of soluble insulating material
53 exposed to the lower surface 72 of insulator 70. The insulator
70 may be formed by insulative resin, ceramics, powder-shaped
insulative materials or the like; By means of a solidifying
process, the insulator 70 becomes a solid state, then providing a
plurality of dry films 54 which attached to the upper portion 67
and both the lower surface 62 of protruding portion 66 and the
lower surface 72 of insulator 70 for etching the upper portion 67
and the protruding portions 66;
[0040] FIG. 1E, 1Ea (FIG. 1Ea is a partially enlarged perspective
view of FIG. 1E) show after etching process, a plurality of
conductive elements 60 formed, both the soluble insulating material
53 and the dry films 54 removed, then the substrate 80 is formed,
wherein the substrate 80 comprising an insulator 70 having a recess
74; and a plurality of conductive elements 60, wherein each
conductive element 60 is staircase-shaped, and each conductive
element 60 having a first portion 60A, a second portion 60B and a
third portion 60C; the conductive element 60 encapsulated by the
insulator 70 and embedded in the insulator 70, wherein the second
surface 60A2 of first portion 60A and the second surface 60B2 of
second portion 60B are also encapsulated by the insulator 70. The
conductive element 60 extending from the insulator 70 surface 71 to
the recess 74. The first portion 60A exposed to the insulator 70
surface 71, wherein the first portion 60A protrudes and exposes the
insulator 70 surface 71. In this manner, it is easy for the
conductive element 60 to electrically connect to outside, then the
solder ball is not needed. Moreover, the substrate 80 thickness is
thinner, the cost for manufacturing the substrate 80 decreased.
Furthermore, due to the conductive elements 60 embedded in the
insulator 70. Each conductive element 60 surface contacted with the
insulator 70 increased, then the conductive element 60 encapsulated
by the insulator 70 more securely, and the reliability of substrate
80 enhanced; In addition, the electrical surface 60C1 of third
portion 60C exposed to the insulator 70 for electrically connecting
to either a chip or an electrical device, wherein the electrical
surface 60C1 of third portion 60C is within the recess 74 of
insulator 70 of substrate 80. The second portion 60B connects both
first portion 60A and third portion 60C, then the second portion
60B is between first portion 60A and third portion 60C. Wherein a
co-planar surface "M" formed by the first portion 60A and the
second portion 60B. A co-planar surface "Q" formed by the second
portion 60B and the third portion 60C, These co-planar surfaces "M
and Q" exposed to the insulator 70 for electrical connection (refer
to FIG. 3),In addition, by means of plating process, the conductive
element 60 may be plated by a conductive material such as nickel,
gold, palladium or the like, then the conductive element 60 may be
more convenient to electrically connect to outside; The recess 74
is used for placing chip, conductive wires, encapsulant,
transparent plate, electrical device and so on; Furthermore, (refer
to FIG. 1Ea, the FIG. 1Ea is a partially enlarged perspective view
of FIG. 1E) a wall-shaped insulator 70w which is between the third
portion 60C and another third portion 60C is formed by the
insulator 70, due to the wall-shaped insulator 70w, the insulator
70 surface contacted with an encapsulant (not shown) increased,
then the substrate 80 encapsulated by the encapsulant (not shown)
more securely, and the reliability of substrate 80 enhanced;
wherein the wall-shaped insulator 70w may be removed (refer to FIG.
1F) as required. In addition, the recess 74 has an opening 74a.
Then conductive wires (see "40" in FIG. 2) may go through said
opening 74a; Wherein if the soluble insulating material 53 is
omitted, the insulator 70 will be filled into the recessed portion
69, and the recess 74 may be formed by a cutting tool;
[0041] FIG. 1F shows the wall-shaped insulator 70w between the
third portion 60C and another third portion 60C been removed.
[0042] FIGS. 2-3 show embodiments of electrical device in
accordance with the present invention, the substrate of electrical
device is manufactured by the first method of first preferred
embodiment of substrate related to this invention.
[0043] FIG. 2 shows an electrical device 270 comprising a substrate
80; a chip 30 having an active surface 31 which is coupled with the
substrate 80; A plurality of conductive wires 40 electrically
connect the chip 30 to the third portions 60C of conductive
elements 60 respectively, wherein the conductive wires 40 go
through the opening 74a; An encapsulant 50 encapsulates the
substrate 80, conductive wires 40 and the chip 30, wherein the
encapsulant 50 is placed in the recess 74 of the substrate 80.
Wherein the substrate 80 may be coupled with the active surface 31
of chip 30 by an adhesive mean (not shown) such as adhesive tape,
glue or the like. In this manner, the adhesive mean (not shown) is
between the substrate 80 and the active surface 31 of chip 30.
[0044] FIG. 3 shows an electrical device 270 stacked on another
electrical device 270k, wherein the co-planar surface "Q" of
electrical device 270 electrically connecting to the co-planar
surface "Mk" of electrical device 270k.
[0045] Another embodiment of the present invention will be
explained with reference to FIGS. 4A-4D which is the second method
for manufacturing the first embodiment of substrate of the present
invention, wherein a portion of the conductive element protrudes
and exposes the insulator. Then it is not necessary for the
conductive element to electrically connect to outside by means of
solder ball, moreover the conductive elements embedded in the
insulator. In this manner, the reliability of substrate enhanced.
In addition, the substrate of the present invention may further
comprise a submember (refer to FIG. 7) for enhancing heat
dissipation. Detailed descriptions as follow:
[0046] FIGS. 4A, 4Aa (FIG. 4Aa is a side view of FIG. 4A) shows
providing a conductive plate 65 such as copper foil, the conductive
plate 65 having a recessed portion 65a which is for forming upper
portion 67.
[0047] FIGS. 4B, 4Ba (FIG. 4Ba is a side view of FIG. 4B) show By
means of etching process, a recessed portion 69 formed by the
conductive plate 65.
[0048] FIG. 4C shows providing a soluble insulating material 53
which is placed into the recessed portion 69;
[0049] FIG. 4D shows providing a plurality of dry films 54 which
attached to the conductive plate 65 for etching.
[0050] FIGS. 4E, 4Ea (FIG. 4Ea is a side view of FIG. 4E) show
After etching process, a plurality of protruding portions 66 and
upper portion 67 formed by the conductive plate 65, wherein the
upper portion 67 connects to each protruding portion 66, then the
protruding portions 66 are adjacent to each other. In this manner,
a plurality of gaps 661 formed which are between the protruding
potions 66 and the others.
[0051] FIGS. 4F, 4Fa (FIG. 4Fa is a side view of FIG. 4F) show
providing a filling process of insulator for filling the insulator
70 into the gaps 661, then the insulator 70 encapsulates the
protruding portions 66, upper portion 67 and the soluble insulating
material 53, then by means of a solidifying process, the insulator
70 becomes a solid state;
[0052] FIGS. 4G, 4Ga (FIG. 4Ga is a side view of FIG. 4G) show
providing a plurality of dry films 54 which are onto the upper
portion 67 for etching;
[0053] FIGS. 4H, 4Ha (FIG. 4Ha is a side view of FIG. 4H) show
after etching process, a plurality of conductive elements 60
formed, both the soluble insulating material 53 and the dry films
54 removed, then the substrate 80 is formed, wherein the substrate
80 comprising an insulator 70 having a recess 74; and a plurality
of conductive elements 60, wherein each conductive element 60 is
staircase-shaped, and each conductive element 60 having a first
portion 60A, a second portion 60B and a third portion 60C; the
conductive element 60 encapsulated by the insulator 70 and embedded
in the insulator 70, wherein a portion 60A3 of first portion 60A
encapsulated by the insulator 70. The conductive element 60
extending from the insulator 70 surface 71 to the recess 74,
wherein a portion of first portion 60A protrudes and exposes the
insulator 70 surface 71. In this manner, it is easy for the
conductive element 60 to electrically connect to outside, then the
solder ball is not needed. Moreover, the substrate 80 thickness is
thinner, the cost for manufacturing the substrate 80 decreased.
Furthermore, due to the conductive elements 60 embedded in the
insulator 70. Each conductive element 60 surface contacted with the
insulator 70 increased, then the conductive element 60 encapsulated
by the insulator 70 more securely, and the reliability of substrate
80 enhanced; In addition, the third portion 60C is within the
recess 74 of insulator 70 of substrate 80, and the third portion
60C exposed to the insulator 70 for electrically connecting to
either a chip or an electrical device. The second portion 60B is
between first portion 60A and third portion 60C. Furthermore, the
first portion 60A may be co-planar with the insulator 70 surface 71
(refer to FIG. 6) as required.
[0054] FIGS. 5-7 show embodiments of electrical device in
accordance with the present invention, the substrate of electrical
device is manufactured by the second method of first preferred
embodiment of substrate related to this invention.
[0055] FIG. 5 shows the insulator 70 having a recessed portion 73
which is used for preventing the substrate 80 from peeling off the
chip 30 while operating a sawing process (refer to FIG. 36D). In
addition, The material of insulator 70 will be saved because of the
recessed portion 73.
[0056] FIG. 6 shows an insulator 70 having a portion 70m, a chip 30
coupled with the portion 70m, meanwhile, the surface of the first
portion 60A of conductive element 60 is co-planar with the
insulator 70 surface.
[0057] FIG. 7 shows a submember 85 having a plurality of protruding
portions 85a, 85m and a recess 86, said submember 85 serving as a
heat spreader, said recess 86 of submember 85 having a first
portion 86a, a second portion 86b, said submember 85 encapsulated
by the insulator 70. In this manner, a portion of insulator 70 and
the third portion 60C of conductive element 60 are within the first
portion 86a of recess 86 (both the insulator 70 and the third
portion 60C of conductive element 60 may be within the first
portion 86a of recess 86; refer to FIG. 31), wherein the insulator
70 is between the conductive element 60 and the submember 85. A
chip 30 placed in the second portion 86b of recess 86 and mounted
thereon. Due to the protruding portion 85m gets closer to the first
portion 60A of conductive element 60, then the heat dissipation of
chip 30 enhanced. (Because the chip 30 generated heat during
operation, wherein one of the path of heat dissipation is from chip
30 passing through conductive wires 40, conductive elements 60,
insulator 70 then to the submember 85, According to the
mentioned-above path of heat dissipation, The closer both the
conductive element 60 and the submember 85 are, the cooler the chip
30 is). In this manner, the reliability of electrical device 270
enhanced; Moreover, the protruding portion 85a of submember 85 is
used for preventing the insulator 70 from overflowing into the
recess 74 of insulator 70 while operating the filling process of
insulator, wherein the recess 86 of submember 85 serving as a
portion of the recess 74 of insulator 70.
[0058] Further another embodiment of the present invention will be
explained with reference to FIGS. 8A-8E, which is the third method
for manufacturing the first embodiment of substrate of the present
invention, wherein a portion of the conductive element protrudes
and exposes the insulator. Then it is not necessary for the
conductive element to electrically connect to outside by means of
solder ball, moreover the conductive element embedded in the
insulator. In this manner, the reliability of substrate enhanced.
The detailed descriptions as follow:
[0059] FIG. 8A shows providing a conductive plate 65 such as copper
foil.
[0060] FIGS. 8B, 8Ba (FIG. 8Ba is a side view of FIG. 8B) show by
means of etching process, a plurality of protruding portions 66,
upper portion 67 and recessed portion 69 formed by the conductive
plate 65, wherein each protruding portion 66 has a lower surface
62, and the upper portion 67 connects to each protruding portion 66
then the protruding portions 66 are adjacent to each other. In this
manner, a plurality of gaps 661 formed, the gaps 661 are between
the protruding potions 66 and the others.
[0061] FIG. 8C shows providing a soluble insulating material 53
which is placed into the recessed portion 69;
[0062] FIGS. 8D, 8Da (FIG. 8Da is a side view of FIG. 8D) show
providing a filling process of insulator for filling the insulator
70 into the gaps 661, then the insulator 70 encapsulates the
protruding portions 66, upper portion 67 and the soluble insulating
material 53, wherein the lower surface 62 of protruding portion 66
and the lower surface 532 of soluble insulating material 53 also
encapsulated by the insulator 70. By means of a solidifying
process, the insulator 70 becomes a solid state, then providing a
plurality of dry films 54 which attached to the upper portion 67
for etching the upper portion 67; Furthermore, a submember (not
shown) such as heat spreader may attach to the lower surface 532 of
soluble insulating material 53 and be encapsulated by the insulator
70 as required, then the heat dissipation of substrate 80 enhanced
(i.e. the reliability of substrate 80 enhanced.)
[0063] FIGS. 8E, 8Ea (FIG. 8Ea is a partially enlarged perspective
view of FIG. 8E) show after etching process, a plurality of
conductive elements 60 formed, both the soluble insulating material
53 and the dry films 54 removed, then the substrate 80 is formed,
wherein the substrate 80 comprising an insulator 70 having a recess
74, a plurality of conductive elements 60, wherein each conductive
element 60 is staircase-shaped, and each conductive element 60
having a first portion 60A, a second portion 60B and a third
portion 60C; the conductive elements 60 encapsulated by the
insulator 70 and embedded in the insulator 70, wherein the
conductive element 60 extending from the insulator 70 surface 71 to
the recess 74. Both the first portion 60A and the second portion
60B protrude and expose the insulator 70 surface 71. In this
manner, it is easy for the conductive element 60 to electrically
connect to outside, then the solder ball is not needed. Moreover,
the substrate 80 thickness is thinner, the cost for manufacturing
the substrate 80 decreased. Furthermore, due to the conductive
elements 60 embedded in the insulator 70. Each conductive element
60 surface contacted with the insulator 70 increased, then the
conductive element 60 encapsulated by the insulator 70 more
securely, and the reliability of substrate 80 enhanced; wherein the
electrical surface 60C1 of third portion 60C is within the recess
74 of insulator 70 of substrate 80 and exposed to the insulator 70
for electrically connecting to either a chip or an electrical
device, The second portion 60B is between first portion 60A and
third portion 60C, wherein a height "F" which is between the
co-planar surface "M" and the insulator 70 surface 71, If the
height "F" is .gtoreq.0.01 m.m., then the co-planar surface "M" may
be more convenient for electrical connection. Furthermore, (refer
to FIG. 8Ea, the FIG. 8Ea is a partially enlarged perspective view
of FIG. 8E) a wall-shaped insulator 70w which is between the third
portion 60C and another third portion 60C is formed by the
insulator 70, due to the wall-shaped insulator 70w, the insulator
70 surface contacted with an encapsulant (not shown) increased,
then the substrate 80 encapsulated by the encapsulant (not shown)
more securely, and the reliability of substrate 80 enhanced wherein
the wall-shaped insulator 70w may be removed as required.
[0064] FIGS. 9-14 show embodiments of electrical device according
to the present invention, the substrate of electrical device is
manufactured by the third method of first preferred embodiment of
substrate related to this invention.
[0065] FIG. 9 shows a portion 60C3 of conductive element 60 exposed
to the insulator 70, then the electrical device 270 enables to be
stacked on another electrical device 270k.
[0066] FIG. 10 shows the substrate 80 coupled with the central area
31a of active surface 31 of chip 30; a plurality of conductive
wires 40 electrically connected the conductive elements 60 to a
plurality of bond pads (not shown) disposed on the periphery of
chip 30 respectively, wherein the encapsulant 50 encapsulates the
side edge 33 of chip 30 too.
[0067] FIG. 11 shows each conductive element 60 is
multi-staircase-shaped, in this manner, the chip 30 enables to be
stacked on the chip 35, then the electrical device 270 is more
powerful.
[0068] FIGS. 12A, B (FIG. 12B is a cross sectional view of FIG.
12A) show a conductive element 60a having a through hole 64a which
serving as a portion of the recesses 74, wherein the conductive
element 60a is for power supply, signal transfers, and
electromagnetic interference prevention.
[0069] FIG. 13 shows a submember 85 serving as heat spreader
mounted on the active surface 31 of chip 30, and the inactive
surface 32 of chip 30 exposed to the encapsulant 50, In this
manner, the heat dissipation of chip 30 enhanced.
[0070] FIG. 14 shows the insulator 70 of substrate 80 of electrical
device 400 not having recess 74, wherein the first portion 60A,
second portion 60B and third portion 60C of conductive element 60
having a co-planar surface "S".
[ Second Embodiment]
[0071] An embodiment of the present invention will be explained
with reference to FIGS. 15A-15H, which is the first method for
manufacturing the second embodiment of substrate of the present
invention, wherein the conductive element having a recessed portion
which is encapsulated by an insulator and not exposed to the
insulator, in this manner, the shape of conductive element becomes
discontinuous according to the insulator surface. Moreover the
conductive elements embedded in the insulator. In this manner, the
reliability of substrate enhanced, and the substrate of the present
invention may further comprise a submember such as chip, heat
spreader etc.. Detailed descriptions as follow:
[0072] FIG. 15A shows providing two conductive plates 65, 65k,
wherein the conductive plates 65, 65k having a plurality of
recessed portions 68, 68k respectively;
[0073] FIG. 15B shows filling an insulator 70k such as glue,
adhesive tape or the like into the recessed portion 68k of
conductive plate 65k;
[0074] FIG. 15C shows attaching the adhesive means 55, 55k to the
conductive plates 65, 65k respectively, and attaching the dry films
54 to the conductive plates 65, 65k for etching.
[0075] FIG. 15D shows after etching, the dry films 54 removed, a
plurality of conductive elements 60, 60k are formed by the
conductive plates 65, 65k which are coupled with the adhesive means
55, 55k respectively; wherein due to the insulator 70k coupled with
both the recessed portions 68k of conductive element 60k and the
adhesive mean 55k simultaneously, in this manner, the conductive
elements 60k coupled with the adhesive mean 55k more securely, and
the insulator 70k prevents the conductive elements 60k from peeling
off the adhesive mean 55k; Moreover, after the filling process of
insulator 70 (refer to FIG. 15H) accomplished, wherein the
insulator 70 encapsulates the conductive elements 60k and insulator
70k, then the conductive elements 60k and the insulator 70k
embedded in the insulator 70, in this manner, the conductive
elements 60k are held by the insulator 70k and the insulator 70
more securely;
[0076] FIG. 15E shows providing an attaching process of submember
for attaching the active face 31 of chip 30 to the adhesive mean
55, then the chip 30 is surrounded by the conductive elements 60,
wherein the chip 30 may be coupled with the conductive elements 60
by an adhesive mean (refer to the "55" in FIG. 43E), wherein a heat
spreader or a transparent plate may be instead of the chip 30 as
required; The attaching process of submember is optional;
[0077] FIG. 15F shows the adhesive mean 55 with conductive elements
60 and the chip 30, and the adhesive mean 55k with conductive
elements 60k placed in the dies 25A, 25Ad which having a projected
portions 25f, 25fd respectively, wherein the adhesive means 55, 55k
coupled with the projected portions 25f, 25fd respectively;
[0078] FIG. 15G shows filling the pressurized-liquid insulator 70
into the space between the adhesive mean 55 and adhesive mean 55k,
then the pressurized-liquid insulator 70 encapsulates and squeezes
the adhesive means 55/55k, conductive elements 60/60k, the recessed
portions 68 and the insulator 70k, so that each conductive element
60/60k formed a predetermined shape along the projected portions
25f/25fd respectively; then each conductive element 60/60k having a
first portion 60A/60kA, a second portion 60B/60kB and a third
portion 60C/60kC respectively;
[0079] FIG. 15H shows After a solidifying process, the insulator 70
becomes a solid state, and the adhesive means 55/55k and the dies
25A/25Ad removed, then the substrate 80 formed, the substrate 80
having an insulator 70 which having a recess 74; a plurality of
conductive elements 60/60k which are corresponding to each other,
wherein each conductive element 60 is staircase-shaped, each
conductive element 60 having a first portion 60A, a second portion
60B and a third portion 60C, and the conductive element 60 further
having an electrical surface 601 which consists of the electrical
surface 60A1 of first portion 60A, the electrical surface 60B1 of
second portion 60B and the electrical surface 60C1 of third portion
60C; the conductive element 60 encapsulated by the insulator 70 and
embedded therein, the conductive element 60 extending from the
insulator 70 surface 71 to the recess 74; the first portion 60A
exposed to the insulator 70 surface 71 for electrical connection,
the third portion 60C is within the recess 74 of insulator 70 of
substrate 80 and the electrical surface 60C1 exposed to the
insulator 70 for electrical connection, wherein due to the
electrical surface 60B1 of second portion 60B encapsulated by the
insulator 70 and not exposed to the insulator 70, in this manner,
the shape of conductive element 60 becomes discontinuous according
to the insulator 70 surface. Moreover, due to the conductive
element 60 embedded in the insulator 70, and the electrical surface
60B1 of second portion 60B encapsulated by the insulator 70, then
the conductive element 60 surface contacted with the insulator 70
increased, the conductive element 60 is rigidly held by the
insulator 70, and the conductive element 60 encapsulated by the
insulator 70 more securely. In this manner, the reliability of
substrate 80 enhanced; In addition, when the insulator 70 became a
solid liquid state, the chip 30 has already been positioned too,
the advantages are: (a.) it is not necessary for the chip 30 to
attach to the substrate 80 through an adhesive mean which is
between the insulator 70 and the chip 30, then material saved, cost
saved too, and (b.) the substrate 80 thickness is thinner; wherein
the active surface 31 of chip 30 exposed to the insulator 70 for
electrical connection, the chip 30 is below the recess 74 and
embedded in the insulator 70, wherein the recess 74 having a bottom
74b which consists of the electrical surface 60C1 of third portion
60C, the insulator 70, surface 76 and the active surface 31 of chip
30.
[0080] FIGS. 16-17 show embodiments of electrical device according
to the present invention, the substrate of electrical device is
manufactured by the first method of second preferred embodiment of
substrate related to this invention.
[0081] FIG. 16 shows a submember 85 such as heat spreader coupled
with the substrate 80 for enhancing the heat dissipation of chip
30.
[0082] FIG. 17 shows both the electrical device 290 and the
component 110 placed in the recess 74 of substrate 80 of electrical
device 400 and electrically connected to the conductive elements 60
of substrate 80, wherein the chip 30 placed in the electrical
device 290, and the lid 56 hermetically sealed the recess 74.
[0083] Another embodiment of the present invention will be
explained with reference to FIGS. 18A-18D, which is the second
method for manufacturing the second embodiment of substrate of the
present invention, wherein a portion of the electrical surface of
the conductive element encapsulated by an insulator and not exposed
to the insulator, in this manner, the shape of conductive element
becomes discontinuous according to the insulator surface. Moreover
the conductive elements embedded in the insulator. In this manner,
the reliability of substrate enhanced. In addition, the substrate
of the present invention may further comprise a submember (refer to
FIG. 21) for enhancing heat dissipation. Detailed descriptions as
follow:
[0084] FIG. 18A shows providing a plurality of conductive elements
60 which serving as a plurality of leads of leadframe;
[0085] FIG. 18B shows By means of the pressing dies 25A, 25C, the
first portion 60A, the second portion 60B and the third portion 60C
of conductive element 60 formed;
[0086] FIG. 18C shows the dies 25B, 25D which having a plurality of
vacuum hole 27, a vacuum supply "K" sucking the adhesive mean 55,
the insulative film 57 onto the dies 25B, 25D through the vacuum
holes 27, wherein the conductive elements 60 coupled with the
adhesive mean 55; then filling the insulator 70 into the space
between the adhesive mean 55 and the insulative film 57 for
encapsulating the conductive elements 60, adhesive mean 55 and
insulative film 57; after the insulator 70 became a solid state,
both the conductive elements 60 and the insulator 70 separated from
the adhesive mean 55, insulative film 57, then rotating the rollers
58, 58a for collecting the adhesive mean 55, insulative film 57
which have been used, at the same time, pulling the adhesive mean
55, insulative film 57 which have not been used for renew use from
the rollers 59, 59a;
[0087] FIG.18D shows the substrate 80 is formed, wherein a portion
60Bl of electrical surface 601 of conductive element 60
encapsulated by the insulator 70, in this manner, the shape of
conductive element 60 becomes discontinuous according to the
insulator 70 surface, wherein the conductive element 60 surface
contacted with the insulator 70 increased, the conductive element
60 is rigidly held by the insulator 70, and the conductive element
60 encapsulated by the insulator 70 more securely, then the
reliability of substrate 80 enhanced;
[0088] FIGS. 19-21 show embodiments of electrical device according
to the present invention, the substrate of electrical device is
manufactured by the second method of second preferred embodiment of
substrate related to this invention.
[0089] FIG. 19 shows an adhesive mean 55 attached to the conductive
elements 60, the adhesive mean 55 is used for preventing the
conductive elements 60 from being warped by the insulator 70 while
operating the filling process of insulator 70, wherein the chip 30
having a plurality of conductive bumps 45 which electrically
connected the chip 30 to the conductive elements 60.
[0090] FIG. 20 shows the encapsulant 50 is formed by transparent
material, the chip 30 serving as an optical chip/sensor.
[0091] FIG. 21 shows a submember 85 having a side edge 85e and a
recessed portion 87, the submember 85 encapsulated by the insulator
70, wherein the submember 85 with the side edge 85e and the
recessed portion 87 embedded in the insulator 70. Due to the side
edge 87 and the recessed portion 87 embedded in the insulator 70,
In this manner, the submember 85 held by the insulator 70 more
securely, then the submember 85 prevented from peeling off the
insulator 70. In addition, the recessed portions 68 of conductive
element 60 formed after the conductive element 60 pressed by a
molding die as required.
[0092] Further another embodiment of the present invention will be
explained with reference to FIGS. 22A-22D, which is the third
method for manufacturing the second embodiment of substrate of the
present invention, wherein the conductive elements encapsulated by
an insulator, in this manner, the conductive elements embedded in
the insulator. then, the reliability of substrate enhanced. In
addition, the substrate of the present invention may further
comprise a submember (refer to FIG. 29) for enhancing heat
dissipation. Detailed descriptions as follow:
[0093] FIG. 22A-1 shows providing a plurality of conductive
elements 60 which attached to the adhesive mean 55; Wherein the
adhesive mean 55 may have a plurality of openings 55c (shown in
FIG. 22A-2 and FIG. 22A-2a; FIG. 22A-2a is a top view of FIG.
22A-2) as required, wherein each opening 55c is corresponding to
the conductive element 60, in this manner, a portion of the
conductive element 60 enables to expose the adhesive mean 55 for
electrical connection, then the adhesive mean 55 has been not
removed (see FIG. 22D-2);
[0094] FIG. 22B shows By means of the pressing dies 25B, 25C, the
first portion 60A, second portion 60B and the third portion 60C of
conductive element 60 formed; each conductive element 60 becomes
staircase-shaped, wherein the process (FIG. 22B) is optional;
[0095] FIGS. 22C, 22Ca (FIG. 22Ca is a side view of FIG. 22C) shows
filling the insulator 70 into the space between adhesive mean 55
and die 25E, then the conductive element 60, adhesive mean 55
encapsulated by the insulator 70, wherein the die 25B having a
plurality of projected portions 25j, then the substrate 80 surface
81 becomes wave-shaped, and each conductive element 60 positioned
at each top of the wave-shaped substrate 80 surface 81, In this
manner, the conductive element 60 is more convenient to
electrically connect to outside; Nevertheless, the projected
portions 25j may be optional as required, Once the projected
portions 25j omitted, then the conductive element 60 surface which
exposed to the insulator 70 may be co-planar with the insulator 70
surface; Moreover, the die 25E may attach to the second surface
60C2 of third portion 60C through an insulative film (not shown) as
required, then the second surface 60C2 of third portion 60C may be
exposed to the insulator 70, after the insulative film (not shown)
removed;
[0096] FIG. 22D-1 and FIG. 22D-2 show the substrate 80 formed,
wherein FIG. 22D-1 shows the substrate 80 comprising an insulator
70 having a recess 74; a plurality of conductive elements 60 which
are staircase-shaped and embedded in the insulator 70, the
conductive elements 60 extending from the insulator 70 surface 71
to the recess 74, wherein the electrical surface 601 of conductive
element 60 exposed to the insulator 70; FIG. 22D-2 shows the first
portion 60A of conductive element 60 having a side edge 60A5 which
exposed to the side wall 705 of insulator 70, in this manner, the
side edge 60A5 enables to electrically connect to outside.
Furthermore, by means of the side edge 60A5, a tester which
equipped with a plurality of testing probes enables to test a chip
for checking if the chip is good or not (refer to the "P" in FIG.
36C), and the first portion 60A of conductive element 60 may
further have an extending portion (refer to the "603" in FIG. 29)
as required; and the adhesive mean 55 has been not removed from the
substrate 80.
[0097] FIGS. 23-35 show embodiments of electrical device according
to the present invention, the substrate of electrical device is
manufactured by the third method of second preferred embodiment of
substrate related to this invention.
[0098] FIG. 23 shows an insulative layer 75 attached to the
substrate 80 and the encapsulant 50 thereon, the insulative layer
75 having a plurality of openings 75a, then a portion of conductive
element 60 can be exposed to the insulative layer 75 for electrical
connection, wherein the insulative layer 75 is also used for
preventing moisture from getting into the electrical device
270.
[0099] FIG. 24 shows an electrical device 270 having two substrates
80, 80k, wherein the conductive element 60 encapsulated by the
insulator 70 of substrate 80. The first portion 60A, second portion
60B and third portion 60C do not have a co-planar surface (refer to
the "S" in FIG. 14), and both the second surface 60A2 of first
portion 60A and the second surface 60B2 of second portion 60B
encapsulated by the insulator 70. Nevertheless, the second surface
60C2 of third portion 60C does not be encapsulated by the insulator
70 (i.e. the second surface 60C2 of third portion 60C exposed to
the insulator 70) for electrical connection. Meanwhile, the second
surface 60kC2 of second portion 60kC of substrate 80k exposed to
the insulator 70k too, and then the second surface 60C2 of third
portion 60C enables to electrically connect to the second surface
60kC2 of third portion 60kC. In this manner, the substrate 80
stacked on another substrate 80k; the electrical device 270 stacked
on another electrical device 270d through the first portion 60kA
and the first portion 60dA.
[0100] FIG. 25 shows both the chip 30 and the component 110 placed
in the recess 74 of substrate 80 and electrically connected to the
conductive elements 60 of substrate 80, wherein the recess 74 of
insulator 70 of substrate 80 is not hermetically-sealed, the second
surface 60C2 of third portion 60C may be for electrical
connection.
[0101] FIG. 26 shows a submember 95 serving as a transparent plate
which placed in the recess 74 and encapsulated by the encapsulant
50, then a hermetically-sealed space 74c between the submember 95
and the chip 30 is formed, wherein the chip 30 serving as optical
chip, MEMS chip or LED chip.
[0102] FIGS. 27A, 27B (FIG. 27B is a cross-sectional view of FIG.
27A) show the substrate 80 of electrical device 400 having a
plurality of terminals 48 and predetermined-shaped conductive
elements 60, 60j, 60m, wherein the conductive elements 60, 60j, 60m
electrically connected to the terminals 48 respectively, the
terminals 48 are for external connection, and the conductive
elements 60m may be electrically connected to each other through a
conductive material such as solder paste; and two electrical
devices 270, 280 electrically connect to the substrate 80
respectively.
[0103] FIG. 28A, 28B (FIG. 28A is a partial perspective view of
FIG. 28B) show two stackable chips 30 placed in the multi-stepped
recess 74 of substrate 80; the third portion 60C of conductive
element 60 and the third portion 60kC of conductive element 60k are
positioned in different horizontal levels (see FIG. 28A), a
plurality of conductive wires 40, 41 electrically connected the
chips 30 to the third portion 60C, 60kC respectively. In this
manner, the conductive wires 40, 41 are at different horizontal
levels, the distance between conductive wire 40 and conductive wire
41 increased, then each conductive wire 40 and each conductive wire
41 can not touch each other. So that it prevents the electrical
device 270 from causing short circuit problem.
[0104] FIG. 29 shows the first portion 60A of conductive element 60
having an extending portion 603 which protrudes the side wall 705
of insulator 70. In this manner, the electrical device 270 enables
to electrically connect to another electrical device 270k through
the extending portion 603, and the electrical device 270 stacked on
the electrical device 270k, and the submember 85 with the side edge
85e and the recessed portion 87 embedded in the insulator 70.
[0105] FIG. 30 shows the submember 85 having a portion 85a which is
for preventing the insulator 70 from overflowing into the recess 74
while operating the filling process of insulator 70.
[0106] FIG. 31 shows the insulator 70 and the conductive element 60
placed in the first portion 86a of recess 86 of submember 85,
wherein the recess 86 of submember 85 serving as a portion of the
recess 74 of insulator 70 of substrate 80.
[0107] FIG. 32 shows the substrate 80 having a plurality of via 77
which are between the upper surface of insulator 70 and the lower
surface of insulator 70, wherein the via 77 electrically connected
the conductive elements 60 on the upper surface of insulator 70 to
the conductive elements 60 on the lower surface of insulator 70,
and a plurality of solder balls 42 attached to the conductive
elements 60 for electrical connection.
[0108] FIG. 33-34 show the conductive elements 60 which embedded in
the upper surface and the lower surface of insulator 70 are exposed
to the insulator 70 for electrical connection; wherein FIG. 33
shows the conductive element 60 having an electrical ring 60h which
is next to the chip 30, the electrical ring 60h is for power
supply, signal transfers, and/or electromagnetic interference
prevention.
[0109] FIG. 35 shows the insulator 70 having a first portion 70a, a
second portion 70b and a third portion 70c, wherein after the
second portion 70b formed, and both the conductive wires 40 and the
component 110 been positioned too, then the first portion 70a and
the third portion 70c coupled with the second portion 70b
respectively, wherein when the second portion 70b formed, the chip
30 been positioned too; and the first, second, third portions 70a,
70b, 70c having conductive elements 60 respectively; an electrical
device 280 mounted on the substrate 80.
[0110] FIGS. 36A-36D shows a step for manufacturing an electrical
device, the substrate is manufactured by the third method of second
preferred embodiment, wherein when the substrate accomplished, the
electrical device also form; At first, a wafer which having a
plurality of chips coupled with the adhesive mean, secondly, the
wafer encapsulated by the insulator. In this manner, it is not
necessary for the substrates to be coupled with the wafer through
an adhesive mean which is between the substrate and the wafer, then
material saved, cost saved, and the electrical device thickness is
thinner. Moreover, before the electrical device formed completely,
the chip in electrical device can be tested/checked by the testing
probes of tester for identifying a good chip or a bad chip which is
in the electrical device. In this manner, the time for testing chip
shortened, and the efficiency of tester increased. Detailed
descriptions as follow:
[0111] FIG. 36A shows a plurality of conductive elements 60
attached to the adhesive mean 55 which sucked onto the die 25B
through the vacuum holes 27 by the vacuum supply "K", wherein the
adhesive mean 55 having a plurality of protruding portions 55j and
openings 55c, the die 25B still having a plurality of through holes
29 which are corresponding to the openings 55c respectively;
Providing a wafer 350 which having a plurality of chips 30, the
wafer 350 (the active surfaces 31 of chips 30) coupled with the
protruding portions 55j of adhesive mean 55; wherein the wafer 350
may be coupled with the third portions 60C of conductive element 60
by an adhesive mean (refer to the detailed descriptions of FIG.
43A-FIG. 43E) as required; a dam 355 between the wafer 350 and the
adhesive mean 55 is for preventing the insulator 70 from
overflowing to outside of wafer 350, wherein the dam 355 is
optional;
[0112] FIG. 36B-1 shows By means of the through holes 29 and the
openings 55c, filling the insulator 70 into the space between the
adhesive mean 55 and the wafer 350, then the insulator 70
encapsulates the adhesive mean 55, conductive elements 60 and the
wafer 350, in this manner, the substrate 80 formed, and the
insulator 70 has already been coupled with the wafer 350; wherein
the process of filling the insulator 70 into the space between the
adhesive mean 55 and the wafer 350 may be operating as shown in
FIG. 36B-2 which shows After the wafer 350 coupled with the
protruding portions 55j of adhesive mean 55, then removed the die
25B, after that, filling the insulator 70 into the space between
the adhesive mean 55 and the wafer 350 through the openings 55c of
adhesive mean 55, in this manner, the substrate 80 formed, and the
insulator 70 has already been coupled with the wafer 350 (due to
the insulator 70 encapsulates the conductive elements 60 and the
wafer 350 simultaneously);
[0113] FIG. 36C shows the encapsulation process of encapsulant 50
accomplished, then providing the testing probes "P" for testing
each chip 30 and checking if the chip 30 is good or not;
[0114] FIG. 36D shows providing a blade "B" for sawing the
substrate 80 and the wafer 350, then the electrical device 270
formed, wherein the insulator 70 of substrate 80 encapsulates the
conductive elements 60 and the chip 30 respectively (i.e. it is not
necessary for the insulator 70 of substrate 80 to be coupled with
the chip 30 through an adhesive mean which is between the insulator
70 of substrate 80 and the chip 30); In this manner, not only
materials saved, but the electrical device 270 thickness is
thinner. It is good for the industry of electronics. Wherein the
wafer 350 may be divided into a plurality of chips 30 firstly, then
each individual chip 30 enables to be coupled with each
corresponding protruding portions 55j as required, in this manner,
the plural chips 30 may be instead of the wafer 350.
[0115] FIG. 37 shows a final process of manufacturing an electrical
device, the substrate is manufactured by the third method of second
preferred embodiment, wherein the substrate 80 is upon the central
area 31a of active surface 31 of chip 30. In this manner, the blade
"B" sawing the wafer 350 exclusively, then the electrical device
270 formed.
[0116] Further another embodiment of the present invention will be
explained with reference to FIGS. 38A-38D, which is the fourth
method for manufacturing the second embodiment of substrate of the
present invention, wherein the substrate having an adhesive mean
which serving as an insulative layer, the adhesive mean is between
the conductive elements and the insulator. In this manner, the
solder balls are not needed. Moreover, the substrate of the present
invention may further comprise a submember (refer to FIG. 39) for
enhancing heat dissipation. Detailed descriptions as follow:
[0117] FIG. 38A shows providing a conductive plate 65 which is
attached to the upper surface 55a of adhesive mean 55, wherein
another conductive plate 65 (the dotted one) may be attached to the
lower surface 55b of adhesive mean 55 as required,
[0118] FIG. 38B shows After etching process, a plurality of
conductive elements 60 formed by the conductive plate 65;
[0119] FIGS. 38C, 38Ca (FIG. 38Ca is a side view of FIG. 38C) show
the pressurized-liquid insulator 70 squeezes the adhesive mean 55
and the conductive elements 60, so that the conductive elements 60
become staircase-shaped according to the die 25B surface,
meanwhile, due to the adhesive mean 55 squeezed by the insulator
70, a plurality of protruding portions 55e of adhesive mean 55
formed, wherein the protruding portions 55e of adhesive mean 55 are
between the conductive elements 60 and the other conductive
elements 60 respectively, in this manner, the insulator 70 surface
contacted with the adhesive mean 55 increased, then the insulator
70 encapsulates the adhesive mean 55 more securely; In addition,
the process of filling insulator 70 may be accomplished by a screen
printing process as required;
[0120] FIG. 38D shows the substrate 80 formed after the insulator
70 becomes a solid state, the substrate 80 comprising: an insulator
70 having a recess 74; an adhesive mean 55 having a plurality of
protruding portions 55e which are between the conductive elements
60 and the others respectively, wherein the lower surface 55b
encapsulated by the insulator 70; and a plurality of conductive
elements 60 which are staircase-shaped and mounted on the upper
surface 55a of adhesive mean 55, in this manner, the adhesive mean
55 is between the conductive elements 60 and the insulator 70,
wherein the conductive elements 60 extending from the upper surface
55a of adhesive mean 55 to the recess 74 of substrate 80, wherein
the first portion 60A is upon the upper surface 55a of adhesive
mean 55 for electrical connection; the third portion 60C is upon
the upper surface 55a of adhesive mean 55 for electrical
connection; the third portion 60C is within the recess 74 of
substrate 80, the second portion 60B is between the first portion
60A and the third portion 60C; Due to the conductive elements 60
mounted on the adhesive mean 55, it is not necessary for the
conductive elements 60 to electrically connect to outside through
solder balls, then material and cost saved, and the substrate 80
thickness is thinner.
[0121] FIGS. 39-42 show embodiments of electrical device according
to the present invention, the substrate of electrical device is
manufactured by the fourth method of second preferred embodiment of
substrate related to this invention.
[0122] FIG. 39 shows a submember 85 such as a heat spreader
embedded in the insulator 70 and coupled with the adhesive mean 55.
In this manner, the submember 85 is below the recess 74, wherein
the adhesive mean 55 do not have the protruding portions 55e (see
FIG. 38Ca); Moreover, the first portion 60A of conductive element
60 may have an extending portion (refer to "603" in FIG. 29) for
electrically connecting to outside as required; In addition, the
submember 85 may not touch the adhesive mean 55 but may be still
below the recess 74 as required.
[0123] FIG. 40 shows the adhesive mean 55 having a first portion
55h and a second portion 55m, the first portion 55h serving as
adhesive tape, and the second portion 55m serving as glue; The
submember 85 coupled with the second portion 55m of adhesive mean
55 and been below the recess 74, wherein a portion 85j of submember
85 exposed to the adhesive mean 55; The submember 85 and the
adhesive mean 55 are encapsulated by the insulator 70 respectively,
however, both the side edge 85e and the recessed portion 87 are not
encapsulated by the insulator 70 but exposed to the insulator
70.
[0124] FIG. 41 shows the central area 31a of chip 30 exposed to the
adhesive mean 55, a plurality of conductive wires 40 passing
through the opening 55c of adhesive mean 55, and electrically
connected the chip 30 to the conductive elements 60 wherein the
opening 55c serving as a portion of the recess 74.
[0125] FIG. 42 shows the submember 85 is below the recess 74,
meanwhile, the submember 85 does not touch the adhesive mean
55.
[0126] Further another embodiment of the present invention will be
explained with reference to FIGS. 43A-43E, which is the fifth
method for manufacturing the second embodiment of substrate of the
present invention, wherein when the substrate accomplished, the
electrical device also formed, wherein the substrate further
comprising an adhesive mean such as adhesive tape, glue or the
like. At first, a wafer which having a plurality of chips coupled
with the third portions of conductive element by means of adhesive
means respectively. Secondly, the chips of wafer encapsulated by
the insulator. In this manner, the chips of wafer have already been
coupled with the substrates respectively, while the filling
insulator process accomplished, then it is not necessary for the
substrates to be coupled with the chips of wafer through an
adhesive mean which is between the insulator of substrate and the
chip, then material saved, cost saved, and the electrical device
thickness is thinner. Moreover, before the electrical device formed
completely, the chip in electrical device can be tested by the
testing probes of tester for identifying a good chip or a bad chip.
In this manner, the time for testing the chip in the electrical
device shortened, and the efficiency of tester increased. Detailed
descriptions as follow:
[0127] FIG. 43A shows the conductive elements 60 attached to the
adhesive mean 55 which is sucked onto the die 25B through the
vacuum holes 27 by means of vacuum supply "K", wherein the adhesive
mean 55 is optional, when the adhesive mean 55 is omitted, the
conductive elements 60 may be directly sucked onto the die 25B
through the vacuum holes 27 by means of vacuum supply "K" as
required;
[0128] FIG. 43B shows the active surface 31 of chip 30 having a
central area 31a, and the active surface 31 of chip 30 coupled with
the third portion 60C of conductive element 60 by an adhesive mean
55N which also coupled with the adhesive mean 55, then the third
portion 60C embedded in the adhesive mean 55N (the advantages of
adhesive mean 55N, refer to the detailed descriptions for the
adhesive mean 55N in FIG. 43E) moreover, the active surface 31 of
chip 30 may be coupled with the adhesive mean 55 by adhesive mean
55N exclusively (refer to "55N" in FIG. 48, wherein the adhesive
mean 55 has been removed already.)
[0129] FIG. 43C shows providing the filling process of insulator 70
for encapsulating the adhesive mean 55, protruding portions 66,
adhesive mean 55N and wafer 350;
[0130] FIG. 43D shows the encapsulation process of encapsulant 50
accomplished, then providing the testing probes "P" for testing
each chip 30 and checking if the chip 30 is good or not;
[0131] FIG. 43E shows the electrical device 270 formed, wherein the
adhesive mean 55N encapsulates the third portions 60C which
embedded therein, and the adhesive mean 55N surface contacted with
the third portion 60C increased, then the adhesive mean 55N coupled
with the third portion 60C more securely, and the reliability of
electrical device 270 enhanced; Meanwhile, the gaps 60C5 between
the third portions 60C and the others are filled by the adhesive
mean 55N, In this manner, the third portions 60C combined with the
adhesive mean 55N are serving as a dam for preventing the insulator
70 from touching the central area 31a (refer to FIG. 43C) by means
of the gaps 60C5 while operating the filling process of insulator
70, in order to avoid a poor electrical connection which the
conductive wires 40 electrically connect to the chip 30. Because
the reliability of electrical device 270 may become poor when the
poor electrical connection happens; Furthermore, due to the chip 30
coupled with the third portion 60C of conductive element 60 by the
adhesive mean 55N (refer to FIG. 43B), the electrical device 270
thickness becomes thinner. It is good for the industry of
electronics, wherein the substrate 80 formed and the chip 30
coupled with the substrate 80 simultaneously after the insulator 70
solidified; the substrate 80 comprising an insulator 70 having a
recess 74, an adhesive mean 55N, and a plurality of conductive
elements 60, each conductive element 60 having a first portion 60A,
a second portion 60B, a third portion 60C,and each conductive
element 60 is staircase-shaped, the conductive element 60 extending
from the insulator 70 surface to the recess 74, wherein the
insulator 70 encapsulates the first portion 60A, the second portion
60B which are imbedded therein, the first portion 60A exposed to
the insulator 70 for electrical connection; the adhesive mean 55N
encapsulates the third portion 60C which embedded therein, the
third portion 60C is within the recess 74 and is for electrical
connection, wherein the adhesive mean 55N encapsulated by the
insulator 70; the second portion 60B is between the first portion
60A and the third portion 60C; Moreover, a molding die may be
instead of the wafer 350 for manufacturing the substrate 80
exclusively.
[0132] FIGS. 44-49 show embodiments of electrical device according
to the present invention, the substrate of electrical device is
manufactured by the fifth method of second preferred embodiment of
substrate related to this invention.
[0133] FIG. 44 shows the conductive element 60 having a protruding
portion 60f, and then the conductive element 60 is more convenient
for electrical connection.
[0134] FIG. 45 shows the adhesive mean 55N having a first portion
55Na and a second portion 55Nb, the first portion 55Na serving as
adhesive tape, and the second portion 55Nb serving as glue
[0135] FIG. 46 shows the bottom 74b of recess 74 of substrate 80
consists of the electrical surface 60C1 of third portion 60C, the
adhesive mean 55N surface 55N1 and the submember 85 surface 85c,
wherein the submember 85 surface 85c exposed to the adhesive mean
55N, and the submember 85 is below the recess 74.
[0136] FIG.47 shows the bottom 74b of recess 74 of substrate 80
consists of the electrical surface 60C1 of third portion 60C, the
adhesive mean 55N surface 55N1 and the submember 85 surface 85b,
wherein the submember 85 surface 85b exposed to the adhesive mean
55N, and the submember 85 is below the recess 74.
[0137] FIG. 48 shows the central area 31a of chip 30 coupled with
the adhesive mean 55N which encapsulated by the insulator 70,
however, the adhesive mean 55N does not touch the third portion 60C
of conductive element 60 of substrate 80. Moreover, the substrate
80 may be formed firstly, then the active surface 31 of chip 30 may
be coupled with the substrate 80 through an adhesive mean (not
shown) later.
[0138] FIG. 49 shows a submember 85 coupled with the adhesive mean
55N and the insulator 70 (i.e. the submember 85 encapsulated by the
adhesive mean 55N and the insulator 70). In this manner, it is not
necessary for the submember 85 to be coupled with the substrate 80
through an adhesive mean which is between the submember 85 and the
substrate 80.
[0139] In accordance with the mentioned-above descriptions
accompanying drawings, this invention has been described in terms
of several preferred embodiments, various alterations and
modifications can be made to become apparent to those skilled in
the art. For example, FIG. 50 shows the substrate 80 manufactured
by both the third method and the fourth method of second preferred
embodiments, wherein the second portion 70b manufactured by the
fourth method of second preferred embodiment firstly, the first,
third portions 70a, 70c manufactured by the third method of second
preferred embodiment later. After the chip 30 covered with the lid
56, then the second portion 70b coupled with the first, third
portions 70a, 70c respectively; In addition, the conductive element
(see "60" in FIG. 44) may have an extending portion (see "603" in
FIG. 29) as required, Furthermore, the submember (see "85" in FIG.
46) may not touch the adhesive mean 55N as required.
[0140] Accordingly, since many such various alterations can be made
to the foregoing descriptions, it is to be understood that the
scope of the invention is not limited to the disclosed embodiments
but is defined by the appended claims.
* * * * *