U.S. patent application number 10/946950 was filed with the patent office on 2005-05-19 for heat dissipating assembly with heat pipes.
Invention is credited to Chen, Chun-Chi, Fu, Meng.
Application Number | 20050103476 10/946950 |
Document ID | / |
Family ID | 34347264 |
Filed Date | 2005-05-19 |
United States Patent
Application |
20050103476 |
Kind Code |
A1 |
Chen, Chun-Chi ; et
al. |
May 19, 2005 |
Heat dissipating assembly with heat pipes
Abstract
A heat dissipation assembly includes a base, plural of fins and
two heat pipes. The base includes a body and two heat-conducting
portions extending slantwise from two sides of the body. A void is
defined in the base surrounded by the body and the heat-conducting
portions. Two grooves are defined in an upper surface of the body.
The fins are attached on the heat-conducting portions. A through
hole is defined in each of two sides of each fin. One end of each
heat pipe is securely received in the groove of the body and the
other end of each heat pipe is extended through the holes of the
fins, for transferring heat from the body to the fins
effectively.
Inventors: |
Chen, Chun-Chi; (Tu-chen,
TW) ; Fu, Meng; (Shenzhen, CN) |
Correspondence
Address: |
WEI TE CHUNG
FOXCONN INTERNATIONAL, INC.
1650 MEMOREX DRIVE
SANTA CLARA
CA
95050
US
|
Family ID: |
34347264 |
Appl. No.: |
10/946950 |
Filed: |
September 21, 2004 |
Current U.S.
Class: |
165/104.33 ;
257/E23.088 |
Current CPC
Class: |
F28D 15/0275 20130101;
H01L 2924/0002 20130101; H01L 2924/0002 20130101; H01L 2924/00
20130101; H01L 23/427 20130101 |
Class at
Publication: |
165/104.33 |
International
Class: |
F28D 015/00 |
Foreign Application Data
Date |
Code |
Application Number |
Nov 17, 2003 |
CN |
2003201183609 |
Claims
What is claimed is:
1. A heat dissipating assembly comprising: plural of fins
cooperatively defining a space; a base located in the space, a void
defined in the base; and at least a heat pipe, one end of the at
least a heat pipe received in the base, an opposite end of the at
least a heat pipe extending through the fins.
2. The heat dissipating assembly as described in claim 1, wherein
each fin defines a cutout in a bottom thereof to cooperatively
define the space.
3. The heat dissipating assembly as described in claim 1, wherein
the base defines at least a groove communicating with the void,
said one end of the at least a heat pipe being received in the at
least a groove.
4. The heat dissipating assembly as described in claim 3, wherein
the base comprises a body and two heat-conducting portions
extending from the body, said void being defined between the body
and the heat-conducting portions.
5. The heat dissipating assembly as described in claim 4, wherein
the two heat-conducting portions extend slantwise from two sides of
the body.
6. The heat dissipating assembly as described in claim 5, wherein
the fins comprise a plurality of hems formed on opposite side of
the space and attached on the heat-conducting portions.
7. The heat dissipating assembly as described in claim 4, wherein
an airflow channel is defined between top ends of the two
heat-conducting portions to allow cooling air to enter into the
void.
8. The heat dissipating assembly as described in claim 1, wherein
each fin defines at least a through hole for extension of the at
least a heat pipe.
9. A heat dissipating assembly, comprising: a base defining a void
therein and at least a groove communicating with the void; plural
of fins arranged on the base; and at least a heat pipe, one end of
the at least a heat pipe received in the groove of the base, an
opposite end of the at least a heat pipe extending through the
fins.
10. The heat dissipating assembly as described in claim 9, wherein
the base comprises a body and two heat-conducting portions
extending from the body, said void being defined between the body
and the heat-conducting portions.
11. The heat dissipating assembly as described in claim 10, wherein
the groove is defined in an upper surface of the body.
12. The heat dissipating assembly as described in claim 10, wherein
the fins are attached on the heat-conducting portions.
13. The heat dissipating assembly as described in claim 10, wherein
the two heat-conducting portions extend slantwise from two sides of
the body.
14. The heat dissipating assembly as described in claim 10, wherein
an airflow channel is defined between top ends of the two
heat-conducting portions.
15. The heat dissipating assembly as described in claim 9, wherein
each fin defines at least a through hole for extension of the at
least a heat pipe.
16. A heat dissipation assembly comprising: a fin assembly
including a plurality of spaced parallel fins cooperatively
defining a space in one side face of said fin assembly; a base
configured to be snugly received in the space; a void defined in
said base with an opening for ventilating communication with a fan
which is located on another side face of the fin assembly; and a
heat pipe defining a section which is attached to said base and
exposed to said void.
17. The heat dissipation assembly as described in claim 16, wherein
an opposite section of the heat pipe extends through said fin
assembly in a perpendicular manner.
18. The heat dissipation assembly as described in claim 16, wherein
said base is of a triangular configuration with said opening at the
uppermost apex.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to cooling of electronic
devices, and particularly to heat dissipating assemblies
incorporating heat pipes.
[0003] 2. Prior Art
[0004] Developments in today's highly information-intensive society
have led to remarkable improvements in performances of electronic
devices. During operation of many contemporary electronic devices,
large amounts of heat are produced. A conventional heat sink formed
by extrusion is frequently no longer able to satisfactorily remove
heat from modem high-speed electronic devices.
[0005] As thermal loads of electronic devices continue to increase,
more effective ways to cool such devices have been sought. One
apparatus developed to cool high-speed electronic devices is
illustrated in FIG. 3. A heat dissipating assembly 50 comprises a
base 52 and a plurality of fins 54. The base 52 comprises two
acclivitous surfaces. The fins 54 are fixed on the acclivitous
surfaces of the base 52. The base 52 has a large volume which
results in it can absorb heat from an electronic device speedily. A
contact surface between the fins 54 and the base 52 is slant and
larger than that of a common heat dissipating assembly which has a
flat contact surface between the fins and the base thereof, which
results in the heat can be efficiently transferred to the fins 54
from the base 52. However, the base 52 of the heat dissipating
assembly 50 has a great weight and it is prone to damage the
electronic device.
[0006] Another apparatus developed to cool high-speed electronic
devices is illustrated in FIG. 4. The heat dissipating assembly 60
comprises a base 62, two heat pipes 64 and plural of fins 66. Two
holes are defined in the middle of the base 62, and the heat pipes
64 are soldered in the holes. As the heat dissipating assembly
illustrated in FIG. 3, the base 62 of the heat dissipating assembly
60 still has a great weight. A solder is stacked unevenly in the
holes, which leads the heat pipes 64 not intimately contacting the
base 62. Furthermore, the heat pipes 64 can't transfer heat from
the base 62 to the fins 66 directly.
[0007] Therefore, an improved heat dissipating assembly for an
electronic device which overcomes the above problems is
desired.
BRIEF SUMMARY OF THE INVENTION
[0008] Accordingly, an object of the present invention is to
provide a heat dissipating assembly which has a light base.
[0009] Another object of the present invention is to provide a heat
dissipating assembly which utilizes a plurality of heat pipes to
attain optimal heat transfer efficiency.
[0010] To achieve the above-mentioned objects, a heat dissipation
assembly comprises a base, plural of fins and two heat pipes. The
base comprises a body and two heat-conducting portions extending
slantwise from two sides of the body. A void is defined in the base
surrounded by the body and the heat-conducting portions. Two
grooves are defined in an upper surface of the body. The fins are
attached on the heat-conducting portions. A through hole is defined
in each of two sides of each fin. One end of each heat pipe is
securely received in the groove of the body and the other end of
each heat pipe is extended through the corresponding holes of the
fins, for transferring heat from the body to the fins
effectively.
[0011] Other objects, advantages and novel features of the present
invention will be drawn from the following detailed description of
a preferred embodiment of the present invention together with the
attached drawings, in which:
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] FIG. 1 is an exploded view of a heat dissipating assembly in
accordance with the present invention;
[0013] FIG. 2 is an assembled view of FIG. 1;
[0014] FIG. 3 is an assembled view of a conventional heat
dissipating assembly; and
[0015] FIG. 4 is an assembled view of another conventional heat
dissipating assembly.
DESCRIPTION OF THE INVENTION
[0016] Referring to FIGS. 1 and 2, a heat dissipating assembly in
accordance with the present invention comprises a base 10, plural
of fins 30 and two heat pipes 40.
[0017] The base 10 comprises a body 12 and two heat-conducting
portions 14 extending slantwise from two sides of the body 12. A
void 16 is defined in the base 10 surrounded by the body 12 and the
heat-conducting portions 14. An airflow channel 17 is defined
between top ends of the heat-conducting portions 14 to allow
cooling air to come into the void 16 through the channel 17 to cool
the base 10 directly. A bottom surface of the base 10 is for
contacting a CPU (not shown). An upper surface of the body 12
defines two grooves 18 communicating with the void 16.
[0018] The fins 30 are laminose-shaped. A trapeziform cutout 32 is
defined in a bottom of each fin 30. The cutouts 32 of the fins 30
cooperatively form a space for receiving the base 10 therein. Each
fin 30 has two hems 34 extending therefrom at opposite sides of the
cutout 32 for keeping uniform distance between two adjacent fins
30. The hems 34 are soldered to the heat-conducting portions 14 to
thereby attach the fins 30 to the base 10. A through hole 36 is
defined in each of two sides of each fin 30.
[0019] The heat pipes 40 both are U-shaped. Working fluid is filled
in each heat pipe 40. One end of the heat pipe 40 is securely
received in a corresponding groove 18 of the body 12 by soldering.
The other end of the heat pipe 40 is extended through the
corresponding holes 36 of the fins 30, for transferring the heat
from the body 12 to the fins 30 effectively.
[0020] In use, the working fluid of the heat pipes 40 evaporates
when absorbing heat from the body 12 of the base 10, and then
condenses and releases the heat to the fins 30 effectively.
[0021] The heat dissipating assembly of the present invention
comprises at least the following advantages. Solder is spread on
the one end of the heat pipe 40 or the grooves 18 of the body 12.
The one end of the heat pipe 40 is placed in the groove 18 from top
to down, and then the heat pipe 40 is pressed downwardly and
soldered to the base 10. Thus, the solder is spread between the
heat pipes 40 and the body 12 in the grooves 18 uniformly, which
reduces heat resistance. In addition, the base 10 has the void 16,
which reduces the weight of the base 10.
[0022] It is understood that the invention may be embodied in other
forms without departing from the spirit thereof. Thus, the present
example and embodiment are to be considered in all respects as
illustrative and not restrictive, and the invention is not to be
limited to the details given herein.
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