U.S. patent application number 10/701727 was filed with the patent office on 2005-05-05 for cooling system for an electronic component.
Invention is credited to Leija, Javier M., Lucero, Christopher D..
Application Number | 20050091989 10/701727 |
Document ID | / |
Family ID | 34435538 |
Filed Date | 2005-05-05 |
United States Patent
Application |
20050091989 |
Kind Code |
A1 |
Leija, Javier M. ; et
al. |
May 5, 2005 |
COOLING SYSTEM FOR AN ELECTRONIC COMPONENT
Abstract
A cooling system for an electronic component is provided. The
cooling system includes a plurality of thermoelectric elements for
placement above a plurality of different areas of the electronic
component. The cooling system has a plurality of conductors
connected to the thermoelectric elements for providing current to
the thermoelectric elements, such that the thermoelectric elements
pump heat away from the respective areas. The cooling system has a
control apparatus connected to the conductors for controlling
current provided to the thermoelectric elements relative to one
another based on heat generated at the different areas.
Inventors: |
Leija, Javier M.; (Chandler,
AZ) ; Lucero, Christopher D.; (Phoenix, AZ) |
Correspondence
Address: |
BLAKELY SOKOLOFF TAYLOR & ZAFMAN
12400 WILSHIRE BOULEVARD
SEVENTH FLOOR
LOS ANGELES
CA
90025-1030
US
|
Family ID: |
34435538 |
Appl. No.: |
10/701727 |
Filed: |
November 4, 2003 |
Current U.S.
Class: |
62/3.2 ;
257/E23.08; 257/E23.082; 62/259.2 |
Current CPC
Class: |
H01L 23/34 20130101;
H01L 2924/0002 20130101; H01L 2924/00 20130101; H01L 23/38
20130101; H01L 2924/0002 20130101 |
Class at
Publication: |
062/003.2 ;
062/259.2 |
International
Class: |
F25B 021/02; F25D
023/12 |
Claims
1. A cooling system for an electronic component, comprising: a
plurality of thermoelectric elements to place above a plurality of
different areas of the electronic component; a plurality of
conductors connected to the thermoelectric elements to provide
current to the thermoelectric elements such that the thermoelectric
elements pump heat away from the respective areas; and a control
apparatus connected to the conductors, including a plurality of
thermostats that switch current to the respective thermoelectric
elements off or on depending on whether the temperatures of the
respective areas are above or below a predetermined set point,
respectively, to control current provided to the thermoelectric
elements relative to one another based on heat generated at the
different areas.
2. The cooling system of claim 1, further comprising: a plurality
of sensors, the control apparatus receiving variables from the
sensors indicative of the heat generated at the different
areas.
3. The cooling apparatus of claim 2, wherein the sensors are
temperature sensors.
4. The cooling apparatus of claim 2, wherein the sensors are power
sensors measuring power to the electronic elements.
5-8. (canceled)
9. The cooling system of claim 1, wherein the areas have center
points that are spaced from one another in x- and y-directions.
10. The cooling system of claim 9, wherein the center points form
an array.
11. The cooling system of claim 10, wherein there is a respective
one of the sensors for a respective one of the areas and a
respective one of the thermoelectric elements, wherein currents to
the respective thermoelectric elements at the respective areas are
individually controlled.
12. The cooling system of claim 11, wherein each sensor is
surrounded by thermoelectric elements of a respective array.
13. A computer subassembly, comprising: an electronic component
that generates heat when being operated; a plurality of
thermoelectric elements placed above a plurality of different areas
of the electronic component; a plurality of conductors connected to
the thermoelectric elements for providing current to the
thermoelectric elements such that the thermoelectric elements drive
heat away from the respective areas; and a control apparatus
connected to the conductors, including a plurality of thermostats
that switch current to the respective thermoelectric elements off
or on depending on whether the temperatures of the respective areas
are above or below a predetermined set point, respectively, for
controlling current provided to the thermoelectric elements
relative to one another based on heat generated at the different
areas.
14. The computer subassembly of claim 13, wherein the electronic
component is a processor, further comprising a memory and an
input/output device connected to the processor.
15. The computer subassembly of claim 13, further comprising: a
plurality of sensors, the control apparatus receiving variables
from the sensors indicative of the heat generated at the different
areas.
16. A method of cooling an electronic component, comprising:
providing current to a plurality of thermoelectric elements placed
above a plurality of different areas of an electronic component so
that the thermoelectric elements pump heat away from the respective
areas; and using a plurality of thermostats that switch current to
the respective thermoelectric elements off or on depending on
whether the temperatures of the respective areas are above or below
a predetermined set point, respectively, to control current
provided to the thermoelectric elements relative to one another
based on heat generated at the different areas.
17. The method of claim 16, further comprising: sensing a plurality
of variables indicative of heat generated at the different areas,
the current being controlled based on the variables.
18. The method of claim 17, wherein the variables are temperature
measurements.
19. The method of claim 17, wherein the variables are power
measured to the electric components.
20. The method of claim 16, wherein the thermoelectric elements
over each area include alternating p- and n-type thermoelectric
elements connected in series.
21. A cooling system for an electronic component, comprising: a
plurality of thermoelectric elements to place above a plurality of
different areas of the electronic component; a plurality of
conductors connected to the thermoelectric elements to provide
current to the thermoelectric elements such that the thermoelectric
elements pump heat away from the respective areas; and a control
apparatus connected to the conductors, including a central power
control module and a plurality of zone-power control modules that
are under the control of the power control module to provide
individual currents to the thermoelectric elements to control
current provided to the thermoelectric elements relative to one
another based on heat generated at the different areas.
22. The system of claim 21, wherein the control apparatus includes
a central power control module and a plurality of zone-power
control modules that are under the control of the power control
module to provide individual currents to the thermoelectric
elements.
23. The system of claim 22, wherein there is a respected one of the
sensors for a respective one of the areas and a respective one of a
thermoelectric element, wherein currents to the respective
thermoelectric elements at the respective areas are individually
controlled.
24. The system of claim 23, wherein the thermoelectric elements
over each area include alternating p- and n-type thermoelectric
elements connected in series.
25. A cooling system for an electronic component, comprising: a
plurality of thermoelectric elements to place above a plurality of
different areas of the electronic component, the areas having
center points that are spaced from one another in x- and
y-directions; a plurality of conductors connected to the
thermoelectric elements to provide current to the thermoelectric
elements such that the thermoelectric elements pump heat away from
the respective areas; and a control apparatus connected to the
conductors to control current provided to the thermoelectric
elements relative to one another based on heat generated at the
different areas.
26. A computer subassembly, comprising: an electronic component
that generates heat when being operated; a plurality of
thermoelectric elements to place above a plurality of different
areas of the electronic component; a plurality of conductors
connected to the thermoelectric elements to provide current to the
thermoelectric elements such that the thermoelectric elements pump
heat away from the respective areas; and a control apparatus
connected to the conductors, including a central power control
module and a plurality of zone-power control modules that are under
the control of the power control module to provide individual
currents to the thermoelectric elements to control current provided
to the thermoelectric elements relative to one another based on
heat generated at the different areas.
27. The computer subassembly of claim 26, wherein the control
apparatus includes a central power control module and a plurality
of zone-power control modules that are under the control of the
power control module to provide individual currents to the
thermoelectric elements.
28. The computer subassembly of claim 27, wherein there is a
respected one of the sensors for a respective one of the areas and
a respective one of a thermoelectric element, wherein currents to
the respective thermoelectric elements at the respective areas are
individually controlled.
29. The computer subassembly of claim 28, wherein the
thermoelectric elements over each area include alternating p- and
n-type thermoelectric elements connected in series.
30. A computer subassembly, comprising: an electronic component
that generates heat when being operated; a plurality of
thermoelectric elements to place above a plurality of different
areas of the electronic component, the areas having center points
that are spaced from one another in x- and y-directions; a
plurality of conductors connected to the thermoelectric elements to
provide current to the thermoelectric elements such that the
thermoelectric elements pump heat away from the respective areas;
and a control apparatus connected to the conductors to control
current provided to the thermoelectric elements relative to one
another based on heat generated at the different areas.
31. A method of cooling an electronic component, comprising:
providing current to a plurality of thermoelectric elements placed
above a plurality of different areas of an electronic component so
that the thermoelectric elements pump heat away from the respective
areas; and using a central power control module and a plurality of
zone-power control modules that are under the control of the power
control module to provide individual currents to the thermoelectric
elements, to control current provided to the thermoelectric
elements relative to one another based on heat generated at the
different areas.
32. A method of cooling an electronic component, comprising:
providing current to a plurality of thermoelectric elements placed
above a plurality of different areas that are spaced from one
another in x- and y-directions of an electronic component so that
the thermoelectric elements pump heat away from the respective
areas; and controlling current provided to the thermoelectric
elements relative to one another based on heat generated at the
different areas.
Description
BACKGROUND OF THE INVENTION
[0001] 1). Field of the Invention
[0002] This invention relates generally to a computer subassembly
and more specifically to a cooling system for an electronic
component of a computer subassembly.
[0003] 2). Discussion of Related Art
[0004] As semiconductor devices, such as processors, operate at
continually higher data rates and higher frequencies, they
generally consume greater current and produce more heat.
[0005] Heat spreaders, heat sinks, and fans have traditionally been
provided to processors of computers. These devices cool a processor
over its entire area. A semiconductor device such as a processor
does not generate heat uniformly so that hot spots are created in
certain areas. Power provided to the processor has to be limited so
that there are no hot spots with temperatures above a predetermined
temperature. More power can be provided to the entire processor if
the temperatures of the hot spots can be reduced.
BRIEF DESCRIPTION OF THE DRAWINGS
[0006] The invention is described by way of examples with reference
to the accompanying drawings, wherein:
[0007] FIG. 1 is a plan view of a computer subassembly, according
to an embodiment of the invention, having a cooling system that
allows for cooling of individual areas of a processor of the
subassembly;
[0008] FIG. 2 is a side view of components of the computer
subassembly;
[0009] FIG. 3 is a plan view of a computer subassembly, according
to another embodiment of the invention, having a cooling system
with a monitor and feedback circuit that detects temperatures at
individual areas on the central power control module that controls
zone-power control modules;
[0010] FIG. 4 is a side view of components of a computer
subassembly according to a further embodiment of the invention,
wherein a monitor and feedback circuit detect data relating to
power provided to a processor and the processor power data is used
to control of cooling of the processor; and
[0011] FIG. 5 is a block diagram illustrating further components of
the computer subassembly.
DETAILED DESCRIPTION OF THE INVENTION
[0012] FIG. 1 of the accompanying drawings illustrates a computer
subassembly 10, according to an embodiment of the invention, which
includes an electronic component in the form of a processor 12 and
a cooling system 14. The cooling system 14 includes a system power
supply 16, a plurality of n-type thermoelectric elements 18, a
plurality of p-type thermoelectric elements 20, a plurality of
conductors 22, a plurality of temperature sensors 24, and a control
apparatus 26.
[0013] The processor 12 can be divided into rows and columns with
an array of areas 28 being defined where respective rows and
columns intersect. The processor 12 has an integrated circuit
formed which, when operated, generates heat. The heat generated by
the processor 12 may be more in some of the areas 28 than in others
and may vary over time. A hot spot 30 may be created where the
temperature of the processor 12 is warmer in one of the areas 28
than in other ones of the areas 28.
[0014] A plurality of the thermoelectric elements 18 and 20 are
located on each respective area 28. The thermoelectric elements 18
and 20 on a particular area 28 are connected to one another in
series. When current conducts through a respective series
connection of the thermoelectric elements 18 and 20, the current
conducts in a direction out of the paper through each one of the
n-type thermoelectric elements 18 and in a direction into the paper
through each one of the p-type thermoelectric elements 20. Both the
n-type and p-type thermoelectric elements 18 and 20 then pump heat
in a direction out of the paper, as will be commonly understood by
those skilled in the art.
[0015] The set of thermoelectric elements 18 and 20 over a
particular area 28 is connected to the system power supply 16 with
two of the conductors 22. One of the conductors 22 provides power
to a first of the thermoelectric elements 18 and 20 of a particular
area 28. The other conductor 22 connects a final one of the
thermoelectric elements 18 and 20 of the particular area 28 to
ground or a reference voltage provided by the system power supply
16.
[0016] The temperature sensors 24 are located between the
thermoelectric elements 18 and 20. Each temperature sensor 24 is
located approximately in a center of a respective one of the areas
28 and is surrounded by the thermoelectric elements 18 and 20 that
are located over the respective area 28. There is an equal number
of areas 28 and temperature sensors 24 so that each temperature
sensor 24 is located in a center of a respective one of the areas
28.
[0017] The control apparatus 26 includes a plurality of thermostats
32. Each thermostat 32 is located in a respective one of the
conductors 22 providing power to the thermoelectric elements 18 and
20 over a respective area 28. There is thus an equal number of
areas 28 and thermostats 32. Each one of the temperature sensors 24
is connected to a respective one of the thermostats 32. The
respective thermostat 32 is closed when the temperature sensed by
the temperature sensor 24 is above a predetermined temperature, and
is switched to open when the temperature is below the predetermined
temperature.
[0018] In use, the processor 12 is operated and may create a hot
spot 30 at an area 28 where the temperature of the processor 12 is
above the predetermined temperature, whereas the temperatures of
other ones of the areas 28 are below the predetermined temperature.
The temperature sensor 24 located on the area 28 having the hot
spot 30 will detect that the temperature is above the predetermined
temperature and switch the thermostat 32 to which it is connected
so that current conducts through one of the conductors 22 to the
series-connection of thermoelectric elements 18 and 20 located on
the area 28 having the hot spot 30. Because current flows through
the thermoelectric elements 18 and 20 located on the hot spot 30,
the thermoelectric elements 18 and 20 will drive heat away from the
hot spot 30. No current will flow through the thermoelectric
elements 18 and 20 on areas 28 that are below the predetermined
temperature. Only the area 28 having the hot spot 30 is thus cooled
by the cooling assembly 14. An advantage is that power is conserved
and that the temperature of the processor 12 can be maintained more
evenly from one of the areas 28 to the next.
[0019] As illustrated in FIG. 2, the cooling system 14 may include
insulated ceramic plates 36 and 38. The thermoelectric elements 18
and 20 are mounted between the ceramic plates 36 and 38. As such,
the thermoelectric elements 18 and 20 that are eventually located
on all the areas 28 are located within one package. The package,
including all of the thermoelectric elements 18 and 20, can be
handled and transported before being mounted as a unit on top of
the processor 12. The temperature sensors 24 are all attached to
the ceramic plate 36, transported therewith, and the ceramic plate
36 is eventually located against the processor 12. The method still
allows for heat to be removed from the processor through conduction
to the thermoelectric elements 18 and 20 and out of an upper
surface of the ceramic plate 38.
[0020] FIG. 3 illustrates a computer subassembly 110 according to
another embodiment of the invention having a monitor and a feedback
circuit 112, and control apparatus 114 that includes a central
power control module 116 and separate zone-power control modules
118. The computer subassembly 110 of FIG. 3 is similar to the
computer subassembly 10 of FIG. 1, and like reference numerals
indicate like components.
[0021] The monitor and feedback circuit 112 is connected to all the
temperature sensors 24 and can monitor the temperatures sensed by
the temperature sensors 24. The central power control module 116 is
connected to the monitor and feedback circuit 112. The central
power control module 116 is connected to the zone-power control
modules 118, and can control current provided by the zone current
control modules 118 individually. The central power control module
116 may have intelligence in the form of software stored thereon
that can provide additional sophistication when controlling power
provided by the zone-power control modules 118. For example, power
provided by the zone-power control modules 118 may be gradually
increased or decreased, as opposed to the on/off functioning of the
thermostats 32 in FIG. 1.
[0022] FIG. 4 illustrates a further embodiment wherein a power
monitor circuit 120 is provided to detect the power provided to the
processor 12. The monitor and feedback circuit 112 is connected to
the power monitor circuit 120. Data detected by the monitor and
feedback circuit 112 is provided to the central power control
module 116. The central power control module 116 can use the data
of power provided to the processor 12. The data can then be used to
control power provided to the individual sets of thermoelectric
elements, thus increasing or decreasing the cooling capacity of the
cooling assembly 14.
[0023] FIG. 5 of the accompanying drawings illustrates further
components of the computer subassembly 10. The computer subassembly
10 further includes a bus 1112 having connected thereto the
processor 12, cache memory 1116, main memory 1118, a floppy drive
1120, a compact disk read-only-memory (CD-ROM) drive 1122, a hard
disk drive 1123, a monitor 1124 having a screen with a display
area, a keyboard 1126, and a mouse 1128. A list of instructions in
the form of a program can be stored on, for example, a compact disk
and be loaded in the CD-ROM drive 1122. The instructions of the
program can be loaded into the cache memory 1116 and the main
memory 1118, while more of the instructions may reside on the
compact disk and on the hard disk of the hard drive. The floppy
drive 1120 or the hard disk drive 1123 may be used instead of the
CD-ROM drive 1122 to load instructions into the computer system
subassembly 10. The instructions can be read by the processor 12 in
a logical manner, which ensures proper execution of the program. A
user may interact, utilizing the mouse 1128 or the keyboard 1126. A
respective signal can be generated by the mouse 1128 or the
keyboard 1126. The signal is sent through the bus 1112 and
ultimately to the processor 12, which responds to the signal to
modify an execution of the program. Execution of the program by the
processor 12 results in control of how information stored in the
main memory 1118, the cache memory 1116, the hard disk drive 1123,
or the CD-ROM drive 1122 is displayed on the display area of the
monitor 1124.
[0024] While certain exemplary embodiments have been described and
shown in the accompanying drawings, it is to be understood that
such embodiments are merely illustrative and not restrictive of the
current invention, and that this invention is not restricted to the
specific constructions and arrangements shown and described since
modifications may occur to those ordinarily skilled in the art.
* * * * *