U.S. patent application number 10/683861 was filed with the patent office on 2005-04-14 for interlaced compositions and methods of production.
This patent application is currently assigned to ClozeX Medical, LLC. Invention is credited to Barbuto, Raymond, Lebner, Michael.
Application Number | 20050080453 10/683861 |
Document ID | / |
Family ID | 34422851 |
Filed Date | 2005-04-14 |
United States Patent
Application |
20050080453 |
Kind Code |
A1 |
Lebner, Michael ; et
al. |
April 14, 2005 |
Interlaced compositions and methods of production
Abstract
Disclosed are methods for producing an interlaced device or
composition which includes at least a first and a second interlaced
element. Each interlaced element includes a mated first and second
part, the first part having two termini and the second part having
two termini, and a defined central void through which the other
interlaced element passes. The method includes the processing and
mating of a first and a second substrate layer, each including a
top surface, a bottom surface and a mating zone. The first
substrate layer includes a portion corresponding to a first part of
a first interlaced element and a first part of a second interlaced
element. The second substrate layer includes a portion
corresponding to a second part of a first interlaced element and a
second part of a second interlaced element. Also disclosed are
interlaced devices or compositions.
Inventors: |
Lebner, Michael; (Wellesley
Hills, MA) ; Barbuto, Raymond; (Dagsboro,
DE) |
Correspondence
Address: |
Kevin M. Farrell
Pierce Atwood
Suite 350
One New Hampshire Avenue
Portsmouth
NH
03801
US
|
Assignee: |
ClozeX Medical, LLC
Wellesley
MA
|
Family ID: |
34422851 |
Appl. No.: |
10/683861 |
Filed: |
October 10, 2003 |
Current U.S.
Class: |
606/216 |
Current CPC
Class: |
A61B 17/085 20130101;
A61B 2017/086 20130101; B21L 3/00 20130101; F21V 21/104 20130101;
A61B 17/0466 20130101 |
Class at
Publication: |
606/216 |
International
Class: |
A61B 017/08 |
Claims
1. A method for producing an interlaced device, the device
comprising a first and a second interlaced element, each interlaced
element comprising a mated first and second part, the first part
having two termini and the second part having two termini, and a
defined central void through which the other interlaced element
passes, the method comprising: a) providing a first and a second
substrate layer, the first and second substrate layers each
comprising a top surface, a bottom surface and a mating zone, the
first substrate layer to having a portion corresponding to a first
part of a first interlaced element and a first part of a second
interlaced element and the second substrate layer having a portion
corresponding to a second part of a first interlaced element and a
second part of a second interlaced element; b) introducing terminal
end cuts in the first substrate layer for the first part of the
first interlaced element and the first part of the second
interlaced element; c) introducing cross-over point cuts in the
first substrate layer for the first part of the first interlaced
element first part of the second interlaced element; d) introducing
terminal end cuts in the second substrate layer for the second part
of the first interlaced element and the second part of the second
interlaced element; e) introducing cross-over point cuts in the
second substrate layer to define a cross-over point of the second
part of the first interlaced element and a cross-over point of the
second part of the second interlaced element; f) mating the top
surface of the first substrate layer to the bottom surface of the
second substrate layers by aligning the mating zones and interlaced
element parts; g) bonding the top and bottom substrate layers along
the mating zones; and h) completing, any cuts necessary to fully
define the first and second interlaced elements.
2. The method of claim 1 wherein the first and second substrate
layers are produced from a material selected from the group
consisting of polymer, sheet metal, foil, textile and hide.
3. The method of claim 1 wherein the substrate layers are cut by a
die cut process.
4. The method of claim 1 wherein the substrate layers are cut by a
laser cutting device.
5. The method of claim 1 wherein the bonding of step g) is carried
out using an adhesive.
6. The method of claim 1 wherein the bonding of step g) is carried
out using an ultrasonic welding technique.
7. The method of claim 1 wherein step h) includes cutting away
portions of the bonded mating zone which, in a preferred
embodiment, do not directly link the first portion of a first
interlaced element to the second portion of an interlaced
element.
8. A method for producing an interlaced device, the device
comprising at least two interlaced elements, each of the interlaced
element comprising at least two parts with each part having at
least two termini that are mated during production, and a defined
central void through which at least one other interlaced element
passes, the method comprising: a) providing at least a first and a
second substrate layer, each substrate layer comprising a top
surface, a bottom surface and a mating zone, the substrate layers
to be processed to form at least four interlacing parts, each of
the interlacing parts processed from a single substrate layer being
mated with one part from another substrate layer to create an
interlaced element; b) introducing terminal end cuts in each
substrate layers for each interlacing part; c) introducing
cross-over point cuts in each substrate layers to define cross-over
points, with at least one cross-over point on each interlacing
part; d) mating the substrate layers by aligning mating zones; e)
bonding the substrate layers along the mating zones; and f)
completing any cuts necessary to fully define the interlaced
elements.
9. The method of claim 8 wherein the first and second substrate
layers are produced from a material selected from the group
consisting of polymer, sheet metal, foil, textile and hide.
10. The method of claim 8 wherein the substrate layers are cut by a
die cut process.
11. The method of claim 8 wherein the substrate layers are cut by a
laser cutting device.
12. The method of claim 8 wherein the bonding of step e) is carried
out using an adhesive.
13. The method of claim 8 wherein the bonding of step e) is carried
out using an ultrasonic welding technique.
14. The method of claim 8 wherein step f) includes cutting away
portions of the bonded mating zone which do not directly link the
first portion of a first interlaced element to the second portion
of an interlaced element.
15. A method for manufacturing an interlaced two-component device
useful for altering the spatial relationship between two surfaces,
or two portions of a single surface, the two-component closure
device comprising: a) a first component, the first component
comprising: i) a first anchoring element for attachment to the
surface of an article, the first anchoring element having an inner
edge and an outer edge; ii) a plurality of first connecting
elements extending from the inner edge of the first anchoring
element, at least a portion of the plurality of first connecting
elements having a two layer thickness; iii) a first pulling element
having an outer edge, and an inner edge, the inner edge being
joined to the plurality of first connecting elements; b) a second
component, the second component comprising: i) a second anchoring
element for attachment to the surface of an article, the second
anchoring element having an inner edge and an outer edge; ii) a
plurality of second connecting elements extending from the inner
edge of the second anchoring element, at least a portion of the
plurality of second connecting elements having a two layer
thickness; iii) a second pulling element having an outer edge, and
an inner edge, the inner edge being joined to the plurality of
second connecting elements; c) means for attaching the first
connecting elements to the second anchoring element and means for
attaching the second connecting elements to the first anchoring
element, the method for manufacturing comprising: i) providing a
bottom substrate layer having a top surface, a bottom surface, a
left edge, a right edge, and a mating zone and processing the
bottom substrate layer according to the following steps: (1)
cutting two parallel series of cut-outs, the first parallel cut-out
series extending from the left edge of the mating zone toward the
left edge of the bottom substrate layer, the second parallel
cut-out series extending from the right edge of the mating zone
toward the right edge of the bottom substrate layer, the portion of
the bottom substrate layer remaining left of the mating zone
between individual cut-outs in the first series of parallel
cut-outs defining the connecting elements of a series of first
components, the inner edge of the series of first pulling elements,
and an edge to be further processed to define the inner edge of the
first anchoring element, the portion of the bottom substrate layer
remaining right of the mating zone between individual cot-outs in
the second series of parallel cut-outs defining the connecting
elements of a series of second components, the inner edge of the
series of second pulling elements, and an edge to be further
processed to define the inner edge of the second anchoring element;
ii) providing a top substrate layer having a top surface, a bottom
surface and a mating zone and processing the top substrate layer
according to the following steps; (1) cutting a first and second
series of slits at the two boundaries of the mating zone, the first
and second series of slits forming the inner edges of the
to-be-formed first and second anchoring elements; (2) cutting a
third series of slits through the top substrate layer, the third
series of slits defining the outer edge of the first anchoring
element opposite its associated inner edge in the to-be-completed
first anchoring element; (3) cutting a fourth series of slits
through the top substrate layer, the fourth series of slits
defining the outer edge of the second anchoring element opposite
its associated inner edge in the to-be-completed second anchoring
element; iii) aligning the bottom substrate layer and the top
substrate layer in two dimensions and mating the top surface of the
bottom substrate layer with the bottom surface of the top substrate
layer; iv) bonding the mated top surface and bottom surface along
the length of the mating zone; v) introducing a series of
cross-mating zone cuts through both layers of the mated substrates
thereby extending connecting elements from one side of the mating
zone to the opposite side of the mating zone, each of the
cross-mating zone cuts intersecting with a pre-existing cut on both
sides of the mating zone; vi) completing the formation of the first
and second pulling tabs; and vii) introducing a series of cuts
through the first and second substrate layers, the series of cuts
intersecting with the second, third and fourth series of slits
formed in step c)1), c)2) and c)3), thereby releasing individual,
interlaced two-component closure devices.
16. The method of claim 15 wherein the first and second substrate
layers are produced from a material selected from the group
consisting of polymer, sheet metal, foil, textile and hide.
17. The method of claim 15 wherein the substrate layers are cut by
a die cut process.
18. The method of claim 15 wherein the substrate layers are cut by
a laser cutting device.
19. The method of claim 15 wherein the bonding of step c)iv) is
carried out using an adhesive.
20. The method of claim 15 wherein the bonding of step c)iv) is
carried out using an ultrasonic welding technique.
21. A method for manufacturing an interlaced wound closure device
comprising two interlaced elements, each interlaced element being
produced from two or more substrate layers, each interlaced element
having a plurality of overlapping and bonded portions at which at
least two substrate layers are joined to form an interlaced
element, each interlaced element further comprising: a) an
adhesive-backed anchoring element having a substantially linear
wound edge; b) a plurality of connecting elements having removable
and non-removable portions, the plurality of connecting elements
extending from the wound edge in a first direction, at least a
portion of the lower surface of the connecting elements being
adhesive-backed; and c) a pulling element attached to the
connecting members, the method of manufacturing comprising: i)
providing a bottom substrate layer having a top surface, a bottom
surface, a left edge, a right edge and a center line bisecting a
mating zone and processing the bottom substrate layer according to
the following steps: (1) applying to the top surface of the bottom
substrate layer, a first adhesive layer suitable for securing a
connecting element to an anchoring element when the device is in
use; (2) applying an adhesive-kill layer to the portions of the
first, adhesive layer which will comprise the to-be-formed pulling
elements, and removable portions of connecting elements; (3)
applying a first release liner along the left edges of the bottom
substrate layer, the first release liner extending from the left
edge of the bottom substrate layer toward the center line of the
bottom substrate layer and terminating at the left edge of the
mating zone; (4) applying a second release liner along the right
edge of the bottom substrate layer, the second release liner
extending from the right edge of the bottom substrate layer toward
the center line of the bottom substrate layer and terminating at a
point near the center line which defines the right edge of the
mating zone; (5) applying a third release liner covering adhesive
previously applied over the mating zone; (6) cutting two parallel
series of cut-outs through the bottom substrate layer and
associated release liners, the first parallel cut-out series
extending from the left edge of the mating zone toward the left
edge of the bottom substrate layer, the second parallel cut-out
series extending from the right edge of the mating zone toward the
right edge of the bottom substrate layer, the portion of the bottom
substrate layer remaining left of the mating zone between
individual cut-outs in the first series of parallel cut-outs
defining the connecting elements of a series of first interlaced
elements, the portion of the bottom substrate layer remaining right
of the mating zone between individual cut-outs in the second series
of parallel cut-outs defining connecting elements of a series of
second interlaced elements; ii) providing a top substrate layer
having a top surface, a bottom surface and a center line bisecting
a mating zone and processing the top substrate layer according to
the following steps; (1) applying a second adhesive layer to the
top surface of the top substrate layer, the second adhesive layer
comprising an adhesive suitable for securing an anchoring element
to the skin of an individual when the device is in use; (2)
applying an adhesive-kill layer to a portion of the second adhesive
layer comprising the mating zone; (3) applying a fourth release
liner to the portion of the second adhesive layer exposed to the
left side of the mating zone following the adhesive-kill step; (4)
optionally applying a first longitudinal crease in the fourth
release liner, the first longitudinal crease being substantially
parallel to the margin of the mating zone, the position of the
first longitudinal crease in the X-dimension of the fourth release
liner falling within the boundary of the to-be-formed second
adhesive-backed anchoring element; (5) applying a fifth release
liner to the portion of the second adhesive layer exposed to the
right side of the mating zone following the adhesive-kill step, (6)
optionally applying a second longitudinal crease, the second
longitudinal crease being applied to the fifth release liner, the
second longitudinal crease being substantially parallel to the
margin of the mating zone, the position of the second longitudinal
crease in the X-dimension of the fifth release liner falling within
the boundary of the to-be-formed first adhesive-backed anchoring
element; (7) applying a third adhesive layer and a protective
release liner to the portion of the fourth release liner bounded in
the X-dimension by the adhesive-killed portion, and the first
longitudinal crease, if present, or by an imaginary line drawn to
meet the positioning requirements of the first longitudinal crease;
(8) applying a fourth adhesive layer and a protective release liner
to the portion of the fifth release liner bounded in the
X-dimension by the adhesive-killed portion, and the second
longitudinal crease, if present, or by an imaginary line drawn to
meet the positioning requirements of the second longitudinal
crease; (9) cutting a first and second series of slits at the two
boundaries of the mating zone, the first and second series of slits
forming the wound edges of the to-be-formed first and second
adhesive-backed anchoring elements; (10) cutting a third series of
slits through the fourth release liner and the attached top
substrate layer, the third series of slits defining an edge of the
first adhesive-backed anchoring element opposite its associated
wound edge in the to-be-completed first adhesive-backed anchoring
element; (11) cutting a fourth series of slits through the fifth
release liner and the attached top substrate layer, the fourth
series of slits defining an edge of the second adhesive-backed
anchoring element opposite its associated wound edge in the
to-be-completed second adhesive-backed anchoring element; iii)
removing the third release liner from the top surface of the bottom
substrate layer; iv) aligning the top and bottom substrate layers
in two dimensions and mating the top surface of the bottom
substrate layer with the bottom surface of the top substrate layer
using the adhesive layer exposed by the removal of the third
release liner; v) introducing cross-mating zone cuts to extend
connecting elements, portions of which are pre-existing in the
bottom substrate layer, across the mating zone, each cross-mating
zone cut intersecting with a pre-existing cut in both the top and
bottom substrate layers on both sides of the mating zone; vi)
removing the release liner from the third and fourth adhesive
layers; vii) applying to the adhesive layers exposed in the
preceding step, a strip of semi-rigid material to be further
processed to form a series of first and second members of a series
of flip tab pairs, the left edge of the strip being aligned with
the outer edge of the third adhesive layer, the right edge of the
strip being aligned with the outer edge of the fourth adhesive, the
strip being incompletely cut to form a frangible line in the area
applied over the mating zone of the mated top and bottom substrate
layers; viii) completing the formation of the first and second
pulling tabs by introducing any necessary cuts; and ix) introducing
a series of cuts through all layers of the mated assembly, the
series of cuts intersecting with the second, third and fourth
series of slits, thereby releasing individual, interlaced
two-component wound closure devices.
22. An interlaced wound closure device comprising two interlaced
elements, each interlaced element being produced from two or more
substrate layers, each interlaced element having a plurality of
overlapping and bonded portions at which the at least two substrate
layers are joined to form an interlaced element, each interlaced
element further comprising: i) an adhesive-backed anchoring element
having a substantially linear wound edge; ii) a plurality of
connecting elements extending from the wound edge in a first
direction, at least a portion of the lower surface of the
connecting elements being adhesive-backed; and iii) a pulling
element attached to the connecting elements.
23. The device of claim 22 wherein the connecting elements comprise
removable and non-removable portions and the pulling element is
attached to the removable portion.
24. The device of claim 23 wherein the removable and non-removable
portions of the connecting elements are separated by a perforation
in the connecting elements.
25. The device of claim 22 wherein the adhesive-backed portions of
the device are protected by release liners.
26. The device of claim 22 wherein the overlapping and bonded
portions of each interlaced element comprise portions of connecting
elements.
27. The device of claim 26 wherein the portions of connecting
elements comprise those portions which span the area over a
laceration or incision, between two attached anchoring elements, in
an applied device.
28. The device of claim 27 further comprising an applied strip
preserving an as manufactured relationship of the two interlaced
elements.
29. The device of claim 28 wherein the applied strip is produced
from a semi-rigid polymer.
30. The device of claim 28 wherein the as-manufactured relationship
of the two interlaced elements comprises parallel, spaced-apart
relation between wound edges of the two interlaced elements.
31. The device of claim 30 wherein the applied strip produced from
a semi-rigid polymer spans the spaced-apart portion between
parallel wound edges and is adhered to portions of release liners
protecting adhesive-backed surfaces of anchoring elements.
32. The device of claim 31 wherein the applied strip produced from
a semi-rigid polymer is incompletely cut to form a frangible
line.
33. A method for producing an interlaced device, the device
comprising at least two interlaced elements, at least one of every
two of the interlaced elements comprising at least two parts with
each part having at least two termini ends that are mated during
production, and a defined central void through which at least one
other interlaced element passes, the method comprising: a)
providing at least a first and a second substrate layer, each
substrate layer comprising a top surface, a bottom surface and a
mating zone, the substrate layers to be processed to form at least
two interlacing parts, each of the interlacing parts processed from
a single substrate layer being mated with one part from another
substrate layer to create an interlaced element; b) introducing
terminal end cuts in each substrate layers for each of its
interlacing parts; c) introducing cross-over point cuts in each
substrate layer to define cross-over points for each interlacing
parts; d) mating the substrate layers by aligning mating zones; e)
bonding the substrate layers along the mating zones; and f)
completing any cuts necessary to fully define the interlaced
elements.
34. The method of claim 33 wherein the first and second substrate
layers are produced from a material selected from the group
consisting of polymer, sheet metal, foil, textile and hide.
35. The method of claim 33 wherein the substrate layers are cut by
a die cut process.
36. The method of claim 33 wherein the substrate layers are cut by
a laser cutting device.
37. The method of claim 33 wherein the bonding of step g) is
carried out using an adhesive.
38. The method of claim 33 wherein the bonding of step g) is
carried out using an ultrasonic welding technique.
39. The method of claim 33 wherein step h) includes cutting away
portions of the bonded mating zone which, in a preferred
embodiment, do not directly link the first portion of a first
interlaced element to the second portion of an interlaced element.
Description
BACKGROUND OF THE INVENTION
[0001] U.S. Pat. No. 6,329,564, the disclosure of which is
incorporated herein by reference, discloses an interlaced,
two-component wound closure device. Disclosed methods for
interlacing the two components of the prior art device were: 1)
producing at least one component as an incomplete component,
interlacing the two components, then completing the incomplete
component; and 2) producing two individual components, cutting one
to enable interlacing, then repairing the cut (e.g., using adhesive
tape). Neither of these alternative methods for producing an
interlaced two-component wound closure device is entirely
satisfactory. The primary deficiency associated with prior art
methods for producing an interlaced device of this type is the
requirement for manual assembly as described above. Thus, while
individual elements can be die cut, for example, in a
cost-effective manner, manual assembly of the individual elements
is an expensive and time-consuming activity. A method for producing
an interlaced device which does riot suffer from this deficiency
would represent a significant advance in the manufacturing
process.
SUMMARY OF THE INVENTION
[0002] The present invention relates to a method for producing an
interlaced device which includes a first and a second interlaced
element. Each interlaced element includes a mated first and second
part, the first part having two termini and the second part having
two termini, and a defined central void through which the other
interlaced element passes. The method includes the processing and
mating of a first and a second substrate layer, each including a
top surface, a bottom surface and a mating zone. The first
substrate layer includes a portion corresponding to a first part of
a first interlaced element and a first part of a second interlaced
element. The second substrate layer includes a portion
corresponding to a second part of a first interlaced element and a
second part of a second interlaced element.
[0003] A series of terminal end cuts are introduced in the first
substrate layer for the first part of the first interlaced element
and the first part of the second interlaced element. Cross-over
point cuts are introduced in the first substrate layer for the
first part of the first interlaced element and the first part of
the second interlaced element. Similarly, terminal end cuts are
made in the second substrate layer for the second part of the first
interlaced element and the second-part of the second interlaced
element. Additionally, cross-over point cuts are made in the second
substrate layer to define a cross-over point of the second part of
the first interlaced element and a cross-over point of the second
part of the second interlaced element.
[0004] Following the introduction of these essential cuts, the top
surface of the first substrate layer is mated to the bottom surface
of the second substrate layers by aligning the mating zones and
interlaced element parts. The mated substrate layers are bonded
along the mating zones. Any necessary cuts are completed to fully
define the first and second interlaced elements.
[0005] Embodiments of the present invention also include
modifications of the previously described method which relate to
the production of an interlaced device having at least two
interlaced elements.
[0006] The present invention also relates, in one aspect, to an
interlaced wound closure device comprising two interlaced elements.
Each interlaced element of the wound closure device is produced
from two or more substrate layers and includes a plurality of
overlapping and bonded portions at which the two or more substrate
layers are joined to form an interlaced element. Each interlaced
element further includes an adhesive-backed anchoring element
having a substantially linear wound edge, a plurality of connecting
elements extending from the wound edge in a first direction and a
pulling element attached to the connecting elements. In preferred
embodiments, at least a portion of the lower surface of the
connecting elements are adhesive-backed. Specific methods for
producing an interlaced wound closure device of this type are also
disclosed.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] FIG. 1 is a top view representing two interlaced rings.
[0008] FIG. 2 is a top view representing one interlacing ring
showing two constituent portions.
[0009] FIG. 3 is a top view representing one interlacing ring
showing a mating zone, or area of overlap, between two constituent
portions of the ring.
[0010] FIG. 4 is a top view representing minimum essential cuts
(solid lines) to be made in a top substrate layer prior to mating
with a bottom substrate layer followed by additional
processing.
[0011] FIG. 5 is a top view representing minimum essential cuts
(solid lines) to be made in a bottom substrate layer prior to
mating with a top substrate layer followed by additional
processing.
[0012] FIG. 6 is a top view of an interlaced wound closure device
of the present invention which includes removable portions of
connecting elements and pulling elements.
[0013] FIG. 7 is a top view of an interlaced wound closure device
of the present invention in an applied state in which removable
portions of connecting elements and pulling elements have been
separated from the device.
[0014] FIG. 8 is a top view of a bottom substrate layer showing a
first and second series of parallel cut-outs representing an
intermediate stage in a disclosed method of producing an interlaced
device.
[0015] FIG. 9 is a top view of a top substrate layer showing four
series of parallel slits representing an intermediate stage in a
disclosed method of producing an interlaced device.
[0016] FIG. 10 is a top view of a bottom substrate layer showing
detail relating to two cross-mating zone cuts.
[0017] FIG. 11 is a top view of a top substrate layer showing
detail relating to two cross-mating zone cuts.
[0018] FIG. 12 is a bottom view of a wound closure device of the
present invention including a strip of semi-rigid material applied
across the mating zone and adhered to release liners protecting the
adhesive-backed surfaces of a pair of anchoring elements.
[0019] FIG. 13 is an exploded cross-sectional diagram taken along
line 1-1 of FIG. 12.
DETAILED DESCRIPTION OF THE INVENTION
[0020] The present invention relates, in one aspect, to a method
for producing an interlaced device. The term "interlaced device",
as used herein, refers to a device or object which includes two or
more interlaced elements. FIG. 1 represents a simple interlaced
device which includes two rings or interlacing elements (2 and 4).
The terms "interlacing elements" and "interlaced elements" may be
used interchangeably herein. In the interlaced device, each
interlaced element includes a continuous outer perimeter (6) and a
continuous inner perimeter (8). The continuous inner perimeter (8)
defines a central void (10) in an interlaced element through which
another interlaced element passes. Thus, the interlaced elements
are connected in a manner similar to links in a chain. There is no
requirement of uniformity of shape for the interlaced elements.
[0021] Conventionally, interlaced devices of the type to which the
present manufacturing method applies, are produced by linking
individual interlacing elements (i.e., elements to be interlaced)
by: 1) forming a closed interlacing element (e.g., a chain link);
2) passing through the closed interlacing element a second
interlacing element; and 3) closing the second interlacing element.
For example, continuing with the chain manufacturing example, a
first link is produced by bending a heated, precisely cut portion
of meal rod to the shape of the first link. The adjacent ends are
butt welded to complete the first link. The second link is produced
by passing a second, substantially identical cut and heated portion
of metal rod through the first link, followed by bending and butt
welding. This is a time consuming process, but there is no
alternative process available for chain manufacturing.
[0022] The present invention relates to the production of
interlaced devices from sheet, roll or other layer stock. The term
"substrate layer" is used herein to describe any suitable material
for use in connection with the disclosed methods. Examples of sheet
or layer stock include polymer (plastic), sheet metal, foils,
textile and hide materials. The essential feature of the sheet or
layer stock for use in connection with the present invention is
that the material must be amenable to cutting (e.g., using knives,
punches, or laser trimming devices). Additionally, for use in
connection with the present invention, cut portions in at least two
sheets or layers must be brought into proximity and joined or
mated. It is not essential that the substrate layers be of
identical stock.
[0023] Considering the method in greater detail, FIG. 2 represents
an interlacing element (2) drawn to show constituent halves. The
interlacing element (2) includes a first part (12) having two
termini (14) and a second part (16) having two termini (18). The
first part (12) and the second part (16) of interlacing element (2)
are cut from separate substrate layers. As shown in FIG. 3, the two
parts of interlacing element (2) are mated along a mating zone (20)
to define a central void (10) through which another interlaced
element passes. The method of the present invention enables the
automated production of an interlaced device from two or more
substrate layers using manufacturing techniques such as die cut
manufacturing. The substrate layers may also be provided in roll
form enabling even more efficient automated manufacturing of the
interlaced devices and theoretically the ability to manufacture
interlaced devices of unlimited length.
[0024] For the production of an interlaced device of the type shown
in FIG. 1 which includes only a first (2) and a second (4)
interlaced element, two substrate layers are used. First and second
substrate layers, satisfying the criteria discussed above, are
initially provided. Referring to FIGS. 4 and 5, the substrate
layers are drawn as sheets, for simplicity of illustration. The top
substrate layer (22) and the bottom substrate layer (24) each
include a top surface (26), a bottom surface (not shown), and a
mating zone (20). The first substrate layer includes portions to be
cut to form the first part of the first interlaced device and the
first part of the second interlaced device (shown in phantom in
FIG. 4). The second substrate layer includes portions to be cut to
form the second part of the first interlaced element and the second
part of the second interlaced element (shown in phantom in FIG. 5).
It will be recognized that a plurality of interlaced devices, each
having a first and a second interlaced element, can be produced
using two substrate layers by repeating the steps described below
in series along the substrate layers.
[0025] The preceding paragraph refers to portions of the first and
second substrate layers "to be cut" to produce specific device
parts. An important feature of the invention, however, lies in the
extent and timing of the cuts required to produce the device. A
subset of the cuts required to produce the interlaced element
include two species of cuts that must be made in each substrate
layer before they are mated and the post-mating cuts are
introduced. These cuts are referred to herein as "essential cuts".
For the simple interlaced ring example, essential cuts made in the
top (22) and bottom (24) substrate layers individually are
represented in FIGS. 4 and 5, respectively.
[0026] Essential cuts in each'substrate layer include the terminal
end cuts (30) of the first and second parts of each interlaced
element (i.e., 8 individual cuts). As discussed above,
each-interlaced element includes a continuous outer perimeter (6)
and a continuous inner perimeter (8) (shown in phantom in FIGS. 4
and 5). The continuous inner perimeter (6) defines a central void
in an interlaced element through which another interlaced element
passes. The term "terminal end cut" (30), as used above, refers to
cuts in those end portions of the four parts (in the embodiment
described) of an interlaced device that bridge or connect the cuts
which form the continuous outer perimeter (6) and the
continuous-inner perimeter (8) of the completed interlaced element.
Although the terminal end cuts (30) in the example provided are
straight cuts along the boundary of the mating zone (20), this is
not a requirement.
[0027] Essential cuts in the first and second substrate layers also
include "cross-over point cuts" (32) in the four parts of each
interlaced device. In FIGS. 4 and 5, the circle over cross-over
point cuts (32) is intended to represent a zone of magnification.
The term "cross-over point" refers to those portions of the four
parts of the interlaced device which define the outer and inner
perimeters of a part at the point of non-bonded overlap with
another part following the mating of the two substrate layers.
[0028] Another way of specifying the essential cuts (i.e., cuts
made prior to mating the two substrate layers) is to define these
functionally. The essential cuts which must be made prior to mating
the two substrate layers are those which can not be made through
both substrate layers following mating Without adversely affecting
the integrity of the interlaced device. The "terminal ends cuts"
(30) can not be made following mating because such cuts, if made
through both layers, would create a gap or break in each interlaced
element thereby rendering the elements non-interlaced. The
"cross-over point" cuts (32) can not be made following mating
because such cuts (if made through both substrate layers following
mating) would also create a gap or break in each interlaced
element.
[0029] In the embodiment represented in FIGS. 4 and 5, after
introducing the terminal end cuts (30) and cross-over point cuts
(32) for all four parts of the interlaced device, the first and
second substrate layers are aligned in two dimensions and joined
along a mating zone (20). The alignment in two dimensions includes:
1) a Y-dimension alignment in which the mating zone of the top
substrate layer is placed directly over the mating zone of the
bottom substrate layer; and 2) an X-dimension alignment to place
portions of the top substrate layer (22) to be cut to form a first
part of a first interlaced element in overlapping relation with
portions of the bottom substrate layer (24) to be cut to form a
second part of a first interlaced element. Following the alignment
of the substrate layers in two dimensions, the two substrate layers
are bonded along the mating zone. The bonding of the two substrate
layers along the mating zone can be accomplished in a number of
ways including, for example, through the use of adhesive,
ultrasonic welding, or fastening or bonding means (e.g., hook and
loop fastening or riveting).
[0030] In the mated assembly, terminal end cuts (30) at the
boundary of the mating zones (20) outline the two areas of overlap
between the first part of the first interlacing element and the
second part of the first interlacing element. Taking FIGS. 4 and 5,
for example, terminal end cuts (30) in mated top substrate layer
(22) and bottom substrate layer (24) define the areas of overlap,
in the Y-dimension, between the first part of the first interlacing
element and the second part of the first interlacing element.
Similarly, terminal end cuts (30) at the boundary of the mating
zone (20) outline (in the Y-dimension) the two areas of overlap
between the first part of the second interlacing element and the
second part of the second interlacing element. The word "outlines"
is intentionally used in the preceding sentences because outer and
inner perimeter cuts are required to fully define the areas of
overlap mentioned (in the X-dimension in the example provided).
[0031] As discussed above, terminal end cuts (30) and cross-over
point cuts (32) are the essential cuts which are required to be
made prior to mating of the two substrate layers (22 and 24 in
FIGS. 4 and 5). To fully form the simple interlaced element
represented in FIG. 1, the complete outer perimeter (6) and
complete inner perimeter (8) as shown in phantom in FIGS. 4 and 5
must be cut. While the essential cuts must be made prior to mating,
other portions of the outer and inner perimeters may be cut either
before, or after mating. It is desirable that cuts made across the
mating zone which fully define the portion of bonded overlap
between the interlaced elements be made after mating of the two
substrate layers. The reason for this preference is that a single
cut passing through both substrate layers will define the outer
perimeter of the bonded portion and a single cut through both
substrate layers will define the inner perimeter of the bonded
portion. Another essential consideration in determining the timing
of the various cuts is stability of the web (i.e., the sheet or
roll stock containing a series of interlacing element parts or
portions to be cut to form parts). The introduction of excessive
non-essential cuts prior to mating can interfere with stability of
the substrates and their proper alignment. A significant benefit of
the present method is that it enables automated production from
rolls of stock. As the rolls are feeding through a die cut press
machine, for example, it is important that the parts being cut from
the roll are stable (i.e., they do not fold over, tear, or in any
other way impact the production rate, generate non-usable devices
or excessive scrap). Thus, it is preferable that substantial
non-essential cuts in both the top and bottom layers be reserved
for final stage (i.e., post mating) processing.
[0032] It will be recognized by one of skill in the art that the
principles discussed above in connection with an interlaced device
comprising two interlaced elements can be extended to complex
interlaced assemblies comprising more than two interlaced elements.
More complex embodiments may be produced from more than two
substrate layers and may involve the use of more than one mating
zone.
[0033] Interlaced devices produced according to the methods
disclosed herein are useful in a variety of contexts. For example,
linear constructions comprising a long series of interlaced
elements may be used for decorative purposes, or structurally as an
alternative to light chain (e.g., for hanging lighting fixtures).
Simpler devices, such as a two-component device having a first and
second interlaced element can be used as a closure device useful
for easily and precisely altering the spatial relationship between
two surfaces, or two portions of a single surface.
[0034] Use of an interlaced device produced by the disclosed
methods for purposes of altering the spatial relationship between
two surfaces (or portions of a single surface) can be accomplished
by attaching a portion of one interlaced element to one surface,
and a portion of the second interlaced element to a second surface.
This can be exemplified by considering the use of the disclosed
method for the purposes of producing a wound closure device of the
type shown in FIG. 6. The preferred embodiment of the wound closure
device includes two interlaced elements (34 and 36). Each of the
interlaced elements includes an anchoring element (37, 38) for
attachment to the skin of an individual. Preferably the anchoring
element (37, 38) is adhesive backed for convenient and secure
attachment to the skin. The anchoring elements include a
substantially linear wound edge (40 and 41).
[0035] Each interlaced element includes a plurality of connecting
elements (42 and 43) extending from the wound edges (40 and 41) of
each of the anchoring elements (37 and 38) in a direction which is
substantially perpendicular to the associated wound edge. In
preferred embodiments, connecting elements (42 and 43) include
removable portions (44 and 45). A perforation (47 and 49) is
optionally provided to facilitate removal of the removable portions
(44 and 45) of connecting elements (42 and 43) after the desired
positioning is achieved. Pulling elements (50 and 51) are provided,
each pulling element (50 and 51) having an outer edge (52 and 53)
and an inner edge (54 and 55). The inner edges (54 and 55 ) of the
pulling elements (50 and 51) are attached to the connecting
elements (42 and 43), or removable portions thereof (44 and 45).
The pulling elements (50 and 51) are used to pull the wound edges
(40 and 41) toward each other, thereby closing the wound or
incision.
[0036] In use, one anchoring element (e.g., 37) is positioned on
one side of a laceration or incision. The second anchoring element
(e.g., 38) is then positioned on the other side of the laceration
or incision. Pulling elements (50 and 51) are then pulled in
opposing direction to close the laceration or incision. Following
closure, the position of the first and second interlaced elements
(34 and 36) are fixed relative to one another. This is accomplished
by attaching the connecting members (e.g., 42) of one interlaced
element (34) to the anchoring member (37) of the other interlaced
element (36). Adhesive is preferably provided for attaching the
connecting elements of one interlaced element to the anchoring
element of the other interlaced element. Preferably, this adhesive
is applied to the lower surfaces of connecting members (42 and 43).
It is preferred that the lower surfaces of connecting members (42
and 43) which are directly over a laceration or incision following
application of a device be adhesive-free. The term "adhesive-free"
is intended to include areas in which an adhesive layer is
provided, and subsequently blocked by the application of an
adhesive-kill layer (e.g., polyester).
[0037] FIG. 7 represents the device following wound closure and
attachment of connecting members (43) to anchoring element (38) and
connecting members (42) to anchoring element (37). Following
attachment of the device, as shown in FIG. 7, pulling elements (50
and 51) and removable portions of connecting elements (44 and 45)
are removed to minimize the space occupied by the applied device
for increased comfort and security, As has been indicated above in
connection with the simple, two ring interlaced device, each
interlaced element will have two points of overlap between the
first and second part which make up the interlaced element. In the
wound closure device of the present invention, these points of
overlap are preferably located on the over-wound bridging portion
of the connecting members (42 and 43) (i.e. the portion of the
connecting members bridging the two anchoring elements as shown in
FIG. 7). Although not shown in FIG. 7, the over-wound bridging
portion is preferably more narrow than the portion of the
connecting elements (42 and 43) which are actually attached to an
anchoring element (37 or 38). This narrowing is intended to
maximize wound exposure thereby promoting exudate drainage and
facilitating the application of medications. The narrowing also
enables greater lateral adjustment of the device because narrowing
the connecting elements in the over-wound area effectively
increases the spacing between adjacent connecting elements.
Narrowing of the over-wound bridging portion of connecting members
(42 and 43) could possibly create a weak point in the interlaced
elements, and providing for the bonded overlap of the constituent
parts in this area increases the holding power of the device.
[0038] Having described the device to be produced by the present
manufacturing method, the method itself will now be described.
Application of the presently disclosed manufacturing methods to the
production of the wound closure device described above enables mass
production at substantially reduced cost relative to earlier
production runs which required manual assembly. Referring to FIGS.
8 and 9, a preferred production method for manufacture of the
interlaced wound closure components (with no associated release
liners or adhesive on anchoring elements and connecting elements)
includes the following steps. A first (56) and second (58) (bottom
and top, respectively) substrate layer is provided. Each layer has
a top surface (60 and 61), a bottom surface (not shown), a left
edge (62 and 63), a right edge (64 and 65) and a center line (66
and 67) shown bisecting mating zones (68 and 69). These substrate
layers are preferably flexible polymeric materials, scrims or
fabric reinforced substrates or films. One skilled in the art will
be familiar with a variety of such materials suitable for a given
application. The selection of a particular material from among the
options available would be a matter of design choice. For use in
wound closure devices, it is preferable that these polymeric
materials are substantially inelastic, or are reinforced in
critical areas for which the inelastic property is particularly
important (i.e., the connecting elements).
[0039] Referring to FIG. 8, two parallel series of cut-outs are
made in the bottom substrate layer. The first parallel cut-out
series extends (70) from the left edge of the mating zone (68)
toward the left edge (62) of the bottom substrate layer (56). The
second parallel cut-out series (72) extends from the right edge of
the mating zone (68) toward the right edge (64) of the bottom
substrate layer (56). The portion of the bottom substrate layer
(56) remaining left of the mating zone (68) between cut-outs in the
first series of parallel cut-outs (70) defines the connecting
members (74) of a series of first components. The portion of the
bottom substrate layer (56) remaining right of the mating zone (68)
between individual cut-outs (72) in the second series of parallel
cut-outs defines the connecting members (76) of a series of second
components.
[0040] Additional cuts in the bottom substrate layer (56) between
cut-outs 70 and left edge (62) are made to form pulling elements.
For example, arcuate cuts 96 and 98 are examples of such cuts which
will produce pulling elements in the completed wound closure
device. It will be recognized by one skilled in the art that
although arcuate cuts 96 and 98 may be made either before or after
mating of the top and bottom substrate layer, it is highly
desirable that these cuts be made in the final stages of processing
following mating of the top and bottom substrate layers (56 and
58). The reason for this preference is because the introduction of
arcuate cuts (96 and 98) (if made following the introduction of the
first and second parallel cut-out series (70 and 72) complete the
entire inner and outer perimeter of the device portions to be cut
from the bottom substrate layer (56). This is undesirable in early
stages of processing, especially pre-mating, in light of the fact
that substantially complete portions of pulling elements and
connecting elements would be free to separate from the processing
web resulting in a high failure rate.
[0041] Referring to FIG. 9, the top substrate layer (58) is
processed by cutting a first and second series of slits (78 and 80,
respectively) along the left and right edge of the mating zone
(69). The first and second series of slits (78 and 80) define the
wound edges (40 and 41 as best seen in FIG. 6) of the to-be-formed
first and second anchoring elements. Discontinuities in the first
and second series of cuts (78 and 80) correspond to to-be-formed
connecting members or spacing between individual devices in the
processing web. A third series of slits (82) is cut through the top
substrate layer (58) to define an outer edge of a series of
anchoring elements, the third series of cuts being generally
parallel the associated wound edge series formed by the first
series of slits (78). A fourth series of slits (83) is cut through
the top substrate layer to define an outer edge of a second series
anchoring elements, the fourth series of slits being (83) generally
parallel to the second series of slits (80) defining the wound edge
of the second series of anchoring elements.
[0042] The top and bottom substrate layers (56 and 58) are then
aligned in two dimensions, as was described for the simpler, two
ring example discussed above. The mating zones (68 and 69) of the
bottom substrate layer (56) and the top substrate layer (58) are
aligned in an X-dimension. In a Y-dimension, discontinuities in the
first series of slits (78) are aligned in register with connecting
elements (74) formed by cutting the first series of parallel
cut-outs (70) in bottom substrate layer (56). The alignment in two
dimensions brings the to-be-formed devices into registration, and
the top surface of the bottom substrate layer (56) is mated with
the bottom surface of the top substrate layer (58). The top and
bottom substrate layers are bonded along the aligned mating zones
(68 and 69). Bonding can be accomplished through the use of a
pre-applied adhesive, ultrasonic welding or other fastening or
bonding means.
[0043] Following bonding along the aligned mating zones (68 and
69), cuts are introduced through the layers of the bonded mating
zone which will serve to fully define the connecting members at the
point at which they meet their associated anchoring element. Two
cuts across the mating zone (68 and 69), and through both substrate
layers (56 and 58), are required for each connecting member. Each
of these cuts must intersect with a pre-existing cut in each
substrate layer (56 and 58) on each side of the mating zone (68 and
69). Referring specifically to bottom substrate layer (56) (see
FIG. 8), two cuts must be made across mating zone (68) to extend
each connecting member (74 and 76) across the mating zone (68).
[0044] The detail of this cut is illustrated in FIG. 10. FIG. 10 is
a top view of mated bottom substrate layer (56), with its mate, top
substrate layer (58) not shown. FIG. 10 represents a portion of a
connecting element (74) at the point where it meets mating zone
(68). Also shown, on the opposing side of mating zone (68) is one
cut-out from the second parallel cut-out series (72). The two cuts
required to fully define the connecting member are shown as a first
and second cross-mating zone cut (86 and 87). On the left side of
the mating zone (68) cut (86) intersects with the cut made to form
connecting member (74). Preferably, as shown, cut (86) intersects
with the cut made to form connecting member (74) at a first corner
(84). If cut (86) were made inboard of the first corner (84), a
weak point in the connecting member would result. On the right side
of the mating zone (68), cut (86) intersects with the cut made to
form the second parallel cut-out series (72). Similarly, the second
cross-mating zone cut (87) preferably intersects with the line cut
to form connecting member (74) at a second corner (88) and extends
across mating zone (68) and intersects with the cut made to form
the second parallel cut-out series (72). Thus, cuts (86 and 87)
terminate at the right side of the mating zone within a previously
cut-out portion (72). The net effect of the two cuts (86 and 87) in
the bottom substrate layer (56) is to extend the connecting member
74 across the mating zone (68), at which point it is terminated. A
similar series of two cuts are made across the mating zone (68) to
similarly extend each connecting member (74 and 76) across the
mating zone (68).
[0045] FIG. 11 shows the same two cuts (86 and 87) in top substrate
layer (58). Cuts 82 and 83 were previously shown in FIG. 9 and
refer to individual slits in a third and fourth series of slits
previously described. Slits 82 and 83 define the outer edges of two
anchoring elements to be assembled in a single interlaced wound
closure device. The first and second slit series (78 and 80) were
previously shown and described in connection with FIG. 9. A subset
of the discontinuities in first slit series 78, as shown in FIG.
11, correspond to the area at which connecting member (43) meets
anchoring element (37) as best seen in FIG. 6. Similarly, a subset
of the discontinuities in second slit series (80) correspond to the
area at which connecting members 42 meet anchoring element (38) as
best seen in FIG. 6. Cuts (86 and 87), shown in FIG. 11, intersect
two previously made cuts in top substrate layer (58). Specifically,
on the left side of mating zone (69), cut (86) intersects with a
non-terminal portion of a slit in the first series of slits (78).
On the right side of mating zone (69), cut (86) intersects with a
terminal portion of slit series (80) which defines the beginning of
the area at which connecting member (42) meets anchoring element
(38) (as best seen in FIG. 6). Cut (87) intersects the same slit in
the first series of slits as cut (86). On the right side of the
mating zone (69), cut (87) intersects with a terminal portion of a
slit from slit series (80) which defines a second side of
connecting member (42) at the point where it meets anchoring
element (38) as best seen in FIG. 6.
[0046] Following the completion of mating zone cuts which fully
define the connecting members (42 and 43) at the point of
attachment to the anchoring elements (37 and 38), the remaining
cuts required are those to complete the formation of the anchoring
elements (37 and 38). FIG. 11 shows anchoring element end cuts (90
and 92) which complete the formation of the anchoring elements.
While these cuts are made through both layers (56 and 58), only the
cuts in the top substrate layer (58) are involved in shaping the
device. The cuts through the bottom substrate layer (56) are
incidental only. Following the completion of the cuts described
above, the interlaced device is complete.
[0047] In a completed wound closure device, preferred embodiments
include adhesive on the lower surfaces of anchoring elements and
portions of connecting elements of an interlaced element which
contact the anchoring element of another interlaced device
following closure of the incision or laceration.
[0048] An example of a method for producing the device with
adhesive in appropriate locations is included for guidance.
Initially, the top surface of the bottom substrate layer (e.g., 60
in FIG. 8) is coated with a first adhesive layer suitable for
attaching a connecting element to an anchoring element when the
device is in use. Many such adhesive are known in the art and
selection from among those available is merely a matter of design
choice. In preferred embodiments, an adhesive-kill layer is applied
to the portions of the first adhesive layer which will comprise the
to-be-formed first and second pulling elements, and removable
portions of connecting elements. It will be recognized that an
alternative to whole-sheet adhesive application, followed by
zone-coating with an adhesive-kill layer, is the zone-coating with
an adhesive layer. Technical consideration, however, favor the
two-step approach. It will also be recognized by one skilled in the
art that removal of pulling elements and portions of connecting
elements is not a requirement. To the extent that additional
closure security is desirable, the adhesive-kill layer can be
omitted and adhesive surfaces would extend to portions which are
removed in preferred embodiments.
[0049] Referring again to FIG. 8, a first release liner (not shown)
is applied along the left edge (62) of the bottom substrate layer
(56), the first release liner extending from the left edge (62) of
the bottom substrate layer (56) toward the center line (66) of the
bottom substrate layer (56) and terminating at a point near the
center line which defines the left edge of the mating zone (68). A
second release liner (not shown) is applied along the right edge
(64) of the bottom substrate layer (56). The second release liner
extends from the right edge (64) of the bottom substrate layer (56)
toward the center line (66) of the bottom substrate layer (56) and
terminates at a point near the center line (66) which defines the
right edge of the mating zone (68). A third release liner (not
shown) is applied along the mating zone of the bottom substrate
layer (56). As described in detail above, two parallel series of
cut-outs are made in the bottom substrate layer and the attached
release liners to the left and right side of the mating zone
(68).
[0050] Referring again to FIG. 9, the top substrate layer (58) is
processed by applying an adhesive layer (also referred to as the
"second adhesive layer") to the top surface of the top substrate
layer (61). An adhesive-kill layer (e.g., polyester, polycarbonate
or release coating) is applied to a portion of the second adhesive
layer comprising the mating zone (69). A release liner (also
referred to as the "fourth release liner") (not shown) is applied
to the portion of the second adhesive layer exposed to the left
side of the mating zone. A release liner (also referred to as the
"fifth release liner") (not shown) is applied to the portion of the
second adhesive layer exposed to the right side of the mating zone
(69). Mating the top and bottom substrate layers, and processing
the layers as previously described, produces a series of wound
closure devices having appropriately located adhesive with
protective release liners.
[0051] A further improvement of the present invention relates to
the application of a strip of semi-rigid material (preferably a
polymeric material) to the top substrate layer which covers the
mating zone, and extends partially over the portion of the top
substrate layer which is cut to form the anchoring elements. In
preferred embodiments, the strip of semi-rigid material fully
covers the mating zone of the top substrate layer and extends over
approximately half of the area to be processed to form the
anchoring elements. Preferably this strip of semi-rigid material is
applied to the top substrate layer after the mating of the top and
bottom substrate layers and the introduction of cross-mating zone
cuts (see 86 and 87 in FIGS. 10 and 11). It is further preferred
that the strip of semi-rigid material be applied to the top
substrate layer before the completion of the cuts which fully
define the interlaced device. The reason for this preference is
that the strip of semi-rigid material will serve to maintain the
"as manufactured" relationship of the interlaced elements of an
interlaced device until just prior to application of the
device.
[0052] The application of a strip of adhesive on each side of the
mating zone, and extending partially over the area of both sides of
the mating zone which is to be cut to form the anchoring elements,
provides a suitable means for attaching the strip of semi-rigid
material. Release liners are optionally used to protect these
strips of adhesive prior to the application of the strip of
semi-rigid material. When applied, the two long edges of the strip
of semi-rigid material are parallel with the edges of the mating
zone of the top substrate layer. Prior to application, the strip of
semi-rigid material is incompletely cut in the area to be applied
over the mating zone, the incomplete cut being manually severable
following completion of the manufacturing process. This incomplete
cut forms a frangible line extending along the length of the strip
of semi-rigid material. Preferably, the cut forming the frangible
line is serpentine in shape to increase the length of the gripping
edge during application.
[0053] Following the application of the strip of semi-rigid
material, the final device cuts are, made to separate the devices
from the selvage or, if only partially die cut, the web can be
rolled for subsequent die cutting in conjunction with the final
packaging equipment. FIG. 12 shows a completed device comprising a
first interlaced element (94) and a second interlaced element (96).
The completed device includes anchoring elements protected by
release liners (98 and 99) and connecting elements and pulling
elements protected by release liners (110 and 111) (partially in
phantom). Portions of connecting members (42 and 43) generated
through cross-mating zone cuts are not protected by a release liner
and are shown in phantom beneath semi-rigid strip (90) with
frangible line (92). Portions of release liners (98 and 99) which
protect adhesive-backed surfaces of anchoring elements are also
shown partially in phantom for this reason.
[0054] A cross-section of the first interlaced element (94) of the
device shown in FIG. 12, taken along line 1-1, is represented in
FIG. 13. For purposes of this drawing, frangible line 92 has been
broken and only one half of the portion remaining following
processing of the strip of semi-rigid material is shown.
Considering FIG. 13 in greater detail, one half of the strip of
semi-rigid material (90) broken along frangible line (92) is
connected by adhesive layer (96) to release liner (98). A second
adhesive layer (100) joins release liner (98) to anchoring element
(38). An adhesive-kill layer (101) is applied to the portion of
adhesive layer (100) extending across the mating zone (112) on the
lower surface of connecting element (42). Extending from the wound
edge (41) of anchoring element (38) is a portion cut from bottom
substrate layer (58 in FIG. 11) with cross-mating zone cuts (86 and
87 in FIG. 11). This portion represents one layer of connecting
element (42) (connecting element 42 is comprised of an overlapping
portion of the top and bottom substrate layer in the mating
zone).
[0055] Referring now to the top portion of FIG. 13, pull tab (50),
removable portion of connecting element (102) and connecting
element (42) are portions of the first interlaced element (94)
which are cut from bottom substrate layer (56 in FIG. 8).
Perforation (104) defines the transition between the removable
portion of connecting element (102) and the connecting element
(42). Adhesive layer (106) was applied as a coating to the entire
top surface of bottom substrate layer (56 in FIG. 8) at an early
stage in processing. An adhesive kill layer (108) was applied as a
coating to adhesive layer (106) in areas of the bottom substrate
layer (56 in FIG. 8) to be cut to form pulling elements (50) and
removable portions of connecting members (102). The purpose of the
adhesive kill layer was to prevent the subsequently applied release
liner (110) from adhering to pulling elements (50) and removable
portions of connecting elements (44). Release liner (110) was
applied to the portions of the top surface (60 in FIG. 8) of the
bottom substrate layer (56 in FIG. 8) to the left and to the right
of the mating zone. The only adhesive exposed to the release liner
at these points of application are the single layer portions of
connecting elements (42 in FIG. 13). Adhesive layer (106) is shown
in FIG. 13 joining the overlapping portions of connecting member 42
contributed by the top substrate layer and bottom substrate layer.
The bonded mating zone is shown as 112 in FIG. 13.
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