U.S. patent application number 10/968010 was filed with the patent office on 2005-04-14 for electronic apparatus.
Invention is credited to Katou, Hajime, Kondo, Yoshihiro, Minamitani, Rintaro, Naganawa, Takashi, Nakagawa, Tsuyoshi, Nakanishi, Masato, Ohashi, Shigeo, Yoshitomi, Yuuji.
Application Number | 20050078450 10/968010 |
Document ID | / |
Family ID | 19096701 |
Filed Date | 2005-04-14 |
United States Patent
Application |
20050078450 |
Kind Code |
A1 |
Ohashi, Shigeo ; et
al. |
April 14, 2005 |
Electronic apparatus
Abstract
A water-cooling device for cooling a heat-generating element
within an electronic apparatus. The water-cooling device includes a
water-cooling jacket which is thermally connectable with the
heat-generating element, a heat-radiation pipe, a tank, and a
liquid driver which forms a circulation flow passage through which
a cooling liquid flows. At least one of the water-cooling jacket,
the heat-radiation pipe, the tank and the liquid driver is attached
on a plate, and the water-cooling device is detachable with respect
to the heat-generating element by the plate.
Inventors: |
Ohashi, Shigeo; (Tsuchiura,
JP) ; Kondo, Yoshihiro; (Tsuchiura, JP) ;
Minamitani, Rintaro; (Tsuchiura, JP) ; Naganawa,
Takashi; (Tsuchiura, JP) ; Yoshitomi, Yuuji;
(Tsuchiura, JP) ; Nakanishi, Masato; (Tsuchiura,
JP) ; Katou, Hajime; (Tsuchiura, JP) ;
Nakagawa, Tsuyoshi; (Tsuchiura, JP) |
Correspondence
Address: |
ANTONELLI, TERRY, STOUT & KRAUS, LLP
1300 NORTH SEVENTEENTH STREET
SUITE 1800
ARLINGTON
VA
22209-9889
US
|
Family ID: |
19096701 |
Appl. No.: |
10/968010 |
Filed: |
October 20, 2004 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
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10968010 |
Oct 20, 2004 |
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10239141 |
May 9, 2003 |
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6809927 |
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10239141 |
May 9, 2003 |
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PCT/JP02/07007 |
Jul 10, 2002 |
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Current U.S.
Class: |
361/699 ;
361/679.53 |
Current CPC
Class: |
G06F 1/203 20130101;
G06F 2200/201 20130101; G06F 2200/203 20130101; F28F 1/22
20130101 |
Class at
Publication: |
361/699 ;
361/687 |
International
Class: |
H05K 007/20 |
Foreign Application Data
Date |
Code |
Application Number |
Sep 7, 2001 |
JP |
2001-271159 |
Claims
1. A water-cooling device for cooling a heat-generating element
within an electronic apparatus, comprising: a water-cooling jacket
which is thermally connectable with the heat-generating element; a
heat-radiation pipe; a tank; and a liquid driver which forms a
circulation flow passage through which a cooling liquid flows;
wherein at least one of the water-cooling jacket, the
heat-radiation pipe, the tank and the liquid driver is attached on
a plate, and the water-cooling device is detachable with respect to
the heat-generating element by the plate.
2. A water-cooling device for cooling a heat-generating element
within an electronic apparatus, comprising: a water-cooling jacket
which is thermally connectable with the heat-generating element; a
heat-radiation pipe; a tank; and a liquid driver which forms a
circulation flow passage through which a cooling liquid flows;
wherein at least one of the water-cooling jacket, the
heat-radiation pipe, the tank and the liquid driver is attached on
a plate, and the water-cooling device includes a piping system for
circulating the cooling liquid which contains an anti-freeze fluid
therein, the piping system of the water-cooling device being
received within a case of the electronic apparatus as a unit so as
to be detachable therefrom, and wherein the cooling liquid which
contains the anti-freeze fluid is collectable at least in the tank.
Description
CROSS REFERENCE TO RELATED APPLICATION
[0001] This is a continuation of U.S. application Ser. No.
10/239,141, filed May 9, 2003, the subject matter of which is
incorporated by reference herein, which is a 371 of PCT/JP02/07007,
filed Jul. 10, 2002.
TECHNICAL FIELD
[0002] The present invention relates to an electronic apparatus, in
which a semiconductor elements generating heat therefrom is cooled
by a liquid circulating therein.
BACKGROUND ART
[0003] As conventional electronic apparatuses, the structure
thereof is already known, for example, in Japanese Patent
Laying-Open No. Hei 6-266474 (1994), and Japanese Patent
Laying-Open No. Hei 7-142886 (1995), etc.
[0004] First of all, in the Japanese Patent Laying-Open No. Hei
6-266474 (1994), for example, is shown the structure of an
electronic apparatus, comprising a main housing or case, within
which is stored a wiring or circuit board mounting a
heat-generating element thereon, and a housing or case of a display
apparatus, which has a display panel and is attached onto the main
housing rotatably, wherein a heat-receiving jacket attached to the
heat-generating element, a heat-radiation pipe, and a liquid
driving mechanism are connected with one another through flexible
tubes.
[0005] Further, in the Japanese Patent Laying-Open No. Hei 7-142886
(1995), there is shown an example, in which the housing is made of
a metal, for example, in the structure shown in the Japanese Patent
Laying-Open No. Hei 6-266474 (1994).
[0006] In those examples, heat generated in the heat-generating
element is transferred to the water-cooling jacket, and then the
heat is transferred from the water-cooling jacket to the
heat-radiation pipe by driving a liquid through a liquid driving
mechanism, thereby being radiated into the air outside.
[0007] With such the electronic apparatuses, as being represented
by a portable personal computer, etc., a tendency of increase in
high heat generation of an element is remarkable accompanying with
an improvement in performances thereof. On the other side,
miniaturization or small-sizing and/or thinning in sizes of the
housing is still desired or demanded, so as to be fit to be carried
with.
[0008] Any one of those conventional arts mentioned above has the
structure, so that the heat generated in the heat-generating
element is transferred to the display side, thereby to be
irradiated thereon, with respect to the high heat generation of the
heat-generating element. The transfer of heat from the
heat-generating element to the display side is carried out through
driving a liquid between both of them. In the structure of those
conventional arts, the liquid passes by in the vicinity of the
electronic circuits, however no consideration is paid upon safety
in the case where the electronic circuits and the liquid co-exist,
or upon assembling property thereof.
DISCLOSURE OF THE INVENTION
[0009] An object is, therefore according to the present invention,
to provide an electronic equipment or apparatus, being improved in
the safety in the case where the electronic circuits and the liquid
co-exist, and the assembling property, etc.
[0010] The object mentioned above, according to the present
invention, can be achieved by an electronic apparatus, receiving a
liquid circulation flow passage within a case, comprising: a
water-cooling jacket being thermally connected with a
heat-generating element; a heat-radiation pipe being connected to
said water-cooling jacket; a tank being connected to said
heat-radiation pipe; and a liquid driving means being connected to
said tank, wherein an anti-freezing fluid is encloses within said
tank, and said anti-freezing fluid is circulated within said liquid
circulation flow passage by means of said liquid driving means.
[0011] Also, the object mentioned above, according to the present
invention, can be achieved by the electronic apparatus, as
described in the above, wherein a collection means for said
anti-freezing fluid is provided in a portion of said liquid
circulation flow passage.
[0012] And also, the object mentioned above, according to the
present invention, can be achieved by an electronic apparatus,
receiving a liquid circulation flow passage within a case,
comprising: a water-cooling jacket being thermally connected with a
heat-generating element; a heat-radiation pipe being connected to
said water-cooling jacket; a tank being connected to said
heat-radiation pipe; and a liquid driving means being connected to
said tank, wherein said water-cooling jacket and said liquid
driving means are attached onto a first heat-radiation plate while
said heat-radiation pipe and said tank onto a second heat-radiation
plate, and said first and said second heat-radiation plates are
made detachable into said case.
[0013] Also, the object mentioned above, according to the present
invention, can be achieved by the electronic apparatus, as
described in the above, wherein said water-cooling jacket is formed
from a winding metal pipe, and said metal pipe is extended, so as
to be connected with a flexible tube connected to said
heat-radiation pipe.
[0014] Also, the object mentioned above, according to the present
invention, can be achieved by the electronic apparatus, as
described in the above, wherein said liquid circulation flow
passage is attached on an interior surface of said case, while said
water-cooling jacket is in contact with a circuit board mounting
said heat-generating element thereon.
[0015] Also, the object mentioned above, according to the present
invention, can be achieved by the electronic apparatus, as
described in the above, wherein a pipe of said water-cooling jacket
at an exit side and a pipe of said liquid driving means at an inlet
side are thermally connected with each other.
[0016] Also, the object mentioned above, according to the present
invention, can be achieved by the electronic apparatus, as
described in the above, wherein thermo-conductive means is
connected to a pipe of said liquid driving means at an inlet side
thereof.
[0017] Also, the object mentioned above, according to the present
invention, can be achieved by the electronic apparatus, as
described in the above, wherein said tank is made detachable with
respect to said heat-radiation pipe, thereby providing collection
means of the anti-freezing fluid within said liquid circulation
flow passage.
[0018] Also, the object mentioned above, according to the present
invention, can be achieved by the electronic apparatus, as
described in the above, further comprising a detection means for
detecting a change amount of the liquid within said liquid
circulation flow passage, and an alarm means inputting an output
from said detection means.
[0019] Also, the object mentioned above, according to the present
invention, can be achieved by the electronic apparatus, as
described in the above, further comprising a detection means for
detecting leakage of the liquid from said liquid circulation flow
passage, and a stoppage means inputting an output from said
detection means and for stopping an electric power of said
electronic apparatus.
[0020] Also, the object mentioned above, according to the present
invention, can be achieved by the electronic apparatus, as
described in the above, wherein within said case is provided an
accumulation portion for specifying a portion of said leakage in
said liquid circulation flow passage and for accumulating the
liquid leaking from said liquid leakage portion.
[0021] And, the object mentioned above, according to the present
invention, can be achieved by an electronic apparatus, receiving a
liquid circulation flow passage within a case, comprising: a
heat-generating element mounted onto an electronic circuit on a
circuit board; a water-cooling jacket being thermally connected
with a heat-generating element; a heat-radiation pipe being
connected to said water-cooling jacket; a tank being connected to
said heat-radiation pipe; and a liquid driving means being
connected to said tank, wherein a partition is provided for
separating said electronic circuit from said liquid circulation
flow passage.
BRIEF DESCRIPTION OF THE DRAWINGS
[0022] FIG. 1 is a perspective view of an electronic apparatus,
according an embodiment of the present invention;
[0023] FIG. 2 is a perspective view of a heat-radiation metal plate
applied in the above-mentioned electronic apparatus, according the
embodiment of the present invention;
[0024] FIGS. 3(a) and 3(b) are a front view and a A-A cross-section
view of a water-cooling jacket, and FIGS. 3(c) and 3(d) are a front
view and a B-B cross-section view of other water-cooling jacket,
which are applied in the above-mentioned electronic apparatus,
according to the embodiment of the invention;
[0025] FIGS. 4(a) and 4(b) are an outlook structure view of a
cooling device and a C-C cross-section view thereof, in the
above-mentioned electronic apparatus, according to the embodiment
of the invention; and
[0026] FIGS. 5(a) and 5(b) are cross-section views of a display
case of the above-mentioned electronic apparatus, according to the
embodiment of the invention.
BEST MODE FOR CARRYING OUT THE INVENTION
[0027] An electronic apparatus, such as a so-called personal
computer, includes a notebook-type personal computer, which is
portable, and a desktop-type personal computer, which is mainly
used on a desk. In each of those personal computers, being demanded
to be higher and larger in processing speed and capacity thereof
every year, temperature of the heat generation of a CPU, i.e., the
semiconductor element, comes up to be higher, as a result of those
requirements. And it is expected that this tendency will continue
further in future.
[0028] On the contrary to this, in general, the personal computers
are of an air-cooling type by means of a fan or the like, at the
present situation. This air-cooling type has a limit in the
capacity of heat-radiation, and there is a possibility that it
cannot follow the heat-radiation of the CPU, which is on the
tendency of high heat-generation as was mentioned in the above.
However, it may be possible to treat with, by making the fan
rotating with higher speed and/or large in the size thereof,
however it brings about an effect against low-noise generation
and/or light-weighting, therefore it is not a realistic
solution.
[0029] On the other hand, as a method for heat-radiation, to be
replaced with heat-radiation of the conventional air-cooling type,
there is a device for cooling the CPU by circulating a cooling
medium or coolant, such as water, etc.
[0030] Such the cooling device is mainly used in cooling system for
a large-scaled computer, being located in a company or bank, etc.,
and wherein cooling water is circulated compulsively by means of a
pump and is cooled down by a refrigerator for exclusive use
thereof, thereby being large in the scale or sizes.
[0031] Accordingly, such the cooling device by means of water as
was mentioned above is unable at all, to be mounted into the
notebook-type personal computer, which is moved or carried with
frequently, and into the desk-top personal computer, which also may
be moved due to re-arrangement in an office, etc., even if this
cooling device can be made small in sizes, for example.
[0032] Then, as in the conventional arts mentioned above, various
devices are studied, for achieving the cooling by means of the
water, which can be mounted on a small-sized personal computer,
however the temperature of heat-generation by the semiconductor
element was not so high as in the recent year, at the time when
such the conventional arts were made and filed as the patent
applications, therefore no personal computer equipped with the
water-cooling device comes out as an actual product available on
markets, until up to now.
[0033] On the contrary to this, according to the present invention,
it is possible to achieve small-sizing of the water-cooling device,
greatly, by building up the housing defining an external form of
the computer main body, made of aluminum alloy or magnesium alloy,
etc., being superior in heat-radiation, thereby enabling to mount
the water-cooling device onto the personal computer.
[0034] By the way, in case of installing the cooling device through
liquid circulation into the electronic apparatus, the most
important factor is safety. If assuming that the circulating water
contacts with the electronic parts due to leakage of the water,
then it brings about short-circuiting therein, therefore it is
needless to say that it gives a big damage upon the electronic
apparatus. Accordingly, the present inventors studied various
actual models of the electronic apparatuses, each being mounted
with a water-cooling device, upon which the safety is considered
with giving the highest priority.
[0035] As a result of this, the mounting structure comes to be
apparent, being the highest in the safety of the water-cooling
device.
[0036] Hereinafter, explanation will be made on an embodiment
according to the present invention, by referring to FIG. 1
attached.
[0037] FIG. 1 shows a perspective view of an electronic apparatus,
according to the embodiment of the present invention.
[0038] In FIG. 1, the electronic apparatus is constructed by a main
case 1 provided with a keyboard 3 therein, and a display case 2
having a display thereon. This display 2 is supported onto the main
case 1 through a hinge portion 15, rotatably. On the main case 1
are provided a wiring or circuit board 4, on which a plural number
of elements are mounted, a hard-disc drive 5, an auxiliary memory
device (for example, a floppy-disc drive, a CD drive, etc.) 6, and
a battery 13, etc., other than the keyboard 3.
[0039] On the wiring or circuit board 4, there is mounted an
element, such as a central processing unit 7 (hereinafter, being
described by "CPU") having a large heat-generation amount, in
particular. Onto the CPU 7 is attached a water-cooling jacket 8, so
as to be contact therewith, thermally. The water-cooling jacket 8
and the CPU 7 are connected with therebetween, through a soft
thermo-conductive material (i.e., a mixture of thermo-conductive
fillers of aluminum oxide within Si rubber, for example).
[0040] On a rear surface (an inner side surface of the case) of the
display case 2 are provided a metal heat-radiator plate 10, on
which a winding heat-radiation pipe 9 (being made of metal, such as
copper, stainless steel, etc.) is connected. In an upper portion of
the rear surface on the display case 2, a tank 14 is connected to
the heat-radiation pipe 9 on the way of flow passage thereof.
[0041] However, by making the display case 2 itself of a metal,
such as aluminum alloy, magnesium alloy, etc., it may be possible
to connect the heat-radiation pipe 9 directly onto the display case
2, without the heat-radiator plate 10.
[0042] Within the main case 1 is provided a pump as a liquid
driving means. The water-cooling jacket 8 and the heat-radiation
pipe 9, including the pump 11 thereto, are connected with one
another through flexible tubes 12, respectively, thereby
circulating a coolant liquid enclosed in an inside thereof, by
means of the pump 11 (hereinafter, the entire of circulating route
of the coolant liquid, which is attached onto the display case and
the main case, is called by a "piping system").
[0043] The tank 14 should be made to have such a capacity, so as to
secure an amount of a liquid therein, being necessary for cooling
within a circulation flow passage, even if it is lessened, due to
penetration or permeation thereof, or the like, from the flexible
tubes 12.
[0044] The flexible tube 12 must be used at least in a hinge
portion 15, since the display case 2 is always opened and closed,
however there is no necessity of connecting with the flexible tubes
in the portions other than that.
[0045] Thus, using metal pipes in piping between the water-cooling
jacket 8 and the hinge portion 15, between the pump 11 and the
hinge portion 15, and between the pump 11 and the water-cooling
jacket 8, while connecting the metal pipe and the heat-radiation
pipe 9 by the flexible tubes 12, at least only in the portion of
the hinge portion 15, thereby making the ratio of the metal piping
portion, occupying in the entire piping, as large as possible,
enables to meet the requirement of open-close of the display
portion around the hinge portion, as well as, to suppress the
penetration or permeation of water from the pipe.
[0046] In this case, the piping system is built up, by connecting
between the metal pipe from the water-cooling jacket, the flexible
tube of the hinge portion, the flexible tube of the heat-radiation
pipe and the hinge portion, the metal pipe to the pump, and the
metal pipe to the water-cooling jacket, in that sequence. In the
connecting portions of this structure, an appropriate joint and/or
a clamping band (in plate-like, or coil spring-like shape) are used
for preventing from slipping off. Further, the connecting portions
may be coated with a resin for the purpose of protection from
leakage of water.
[0047] As a result of various studies made on the flexible tube 12,
being less in the water permeation therethrough, it can be
acknowledged that a butyl rubber is most suitable, which is mainly
used as a connection rubber in a radiator for use in an automobile
or as a tube of a tire, etc.
[0048] Next, explanation will be given in more detail about the
heat-radiation plate, which is attached on the piping system
mentioned above (including the water-cooling jacket 8, the
heat-radiation pipe 9, the pump 11, the flexible tube 12, and the
tank 14), by referring to FIG. 2 attached.
[0049] FIG. 2 is a perspective view of a metal heat-radiation
plate.
[0050] In FIG. 2, on the metal heat-radiation plate 19 on a side of
the main case 1 are attached the water-cooling jacket 8, the pump
11, and the flexible tube 12 among the piping system mentioned
above. Also, this metal heat-radiation plate 19 conducts the
heat-radiation generated from heat-generating parts other than the
CPU 7. Onto the metal heat-radiation plate 10 on a side of the
display case 2 is attached the heat-radiation pipe 9 and the tank
14 among the piping system mentioned above. Those metal
heat-radiation plates 10 and 19 are attached to the hinge 20
therebetween, thereby being assembled in a rotatable manner and
made in form of a unit.
[0051] In this manner, combining the piping system and the metal
heat-radiation plates 10 and 19, in the form of a unit, enables the
metal heat-radiation plates 10 and 19 to be detachable from the
main case 1 and the display case 2, easily.
[0052] On the other hand, it may be also possible to install the
piping system directly on an interior surface of the main case 1 in
advance. In this instance, since the wiring or circuit board 4 is
located in an upper part of the water-cooling jacket 8, the wiring
or circuit board can be attached and/or detached easily.
[0053] According to those embodiments, since the piping system is
fixed onto the heat-radiation plate and the main case, etc., in
advance, in addition to that work of installing and replacing of
the wiring or circuit board 4 becomes easy, it is also possible to
protect the flexible tube 12 from buckling and to prevent the pipe
from slipping off.
[0054] Herein, explanation will be given on the route of
heat-radiation in this cooling device.
[0055] Heat generated from the CPU 7 is transferred to the coolant
liquid communicating within the water-cooling jacket 8, and is
radiated from the metal heat-radiation plate 10 provided on the
rear surface of the display through the surface of the display case
2 into the air outside, during the time when it passes through the
heat-radiation pipe 9. The coolant liquid, being lowered in
temperature with this, is then sent out to the water-cooling jacket
8 through the pump 11, again.
[0056] In the embodiment mentioned above, the heat-generating
element to be cooled down in temperature by means of the
water-cooling jacket 8 is only (1) piece, however in the place
thereof, a plural number of heat-generating elements may be cooled
down by connecting a plural number of the water-cooling jackets
provided in series or in parallel.
[0057] Next, the details of the structure of the water-cooling
jacket will be explained by referring to FIGS. 3(a) to 3(d).
[0058] FIGS. 3(a) and 3(b) are a front view and an A-A
cross-section view thereof, for showing the structure of the base
22 made from an aluminum block, being formed with a flow passage
21a therein and sealed with a cover 24 through an O-ring 23.
[0059] On the other hand, FIGS. 3(c) and 3(d) are a front view and
a B-B cross-section view thereof, for showing the structure,
wherein a flow passage built up by winding a metal groove 21a is
bonded on the base 22 made of a metal (such as, aluminum, copper,
etc.).
[0060] In FIGS. 3(a) and 3(b), on the base 22 is formed a winding
groove 21a in advance. In an outer periphery of this winding groove
21a, there is provided a groove to be inserted with the O-ring
therein. Closing the grooves 21a by means of the cover 24 forms one
(1) piece of the winding groove 21a, into which the coolant liquid
can flows. The O-ring is provided for the purpose of preventing the
coolant liquid leaking from the groove 21a, and the O-ring is
suppressed by the cover 24, thereby the groove 21a being
hermetically sealed.
[0061] In FIGS. 3(c) and 3(d), on the base 22 are formed with a
winding groove in advance, in the similar manner to that shown in
FIGS. 3(a) and 3(b) mentioned above, fitting with the shape of the
metal pipe 21b, thereby enlarging contact area between the base 22
and the metal groove 21a. In the present embodiment, since the
groove does not define the flow passage for the coolant liquid by
itself as in the embodiment shown in FIGS. 3(a) and 3(b) mentioned
above, none of such the cover 24 or O-ring is necessary, therefore
being simple in the structure.
[0062] Although the explanation was given on the piping system
build up by the water-cooling jacket, the flexible tube, the metal
pipe, the flexible tube in the hinge portion, aligned in that
sequence thereof, in the above-mentioned embodiment shown in FIG.
1, however according to the present embodiment, the piping system
can be built up by extending the metal groove 21a up to the
flexible tube 12 used in the hinge portion (see FIG. 1), to be
connected therewith.
[0063] Further, while connecting the base to the extended portion
of the metal groove 21a, it is also possible to build up the
water-cooling jackets in a plural number thereof, by one (1) piece
of the metal pipe, thereby cooling the plural number of the
heat-generating elements.
[0064] By the way, with the electronic apparatus explained in the
present embodiments, in a manufacturing works or factory, the pump
11 and the movable portion, such as, the flexible tube(s) disposed
in the hinge portion 15, etc., are received within the equipment or
apparatus thereof, under the condition of being filled up with the
coolant liquid therein.
[0065] Such the electronic equipments or apparatuses are shipped
from the manufacturing works or factory, and then are distributed
domestically, and are also imported into every countries of the
world. When being transported to each area in this manner, mainly
an airplane is used, and when the plane flies on the upper sky of
20,000 m in height, the temperature within the freight room thereof
comes down to 0.degree. C. or lower than that. Therefore, there is
a probability those parts are deformed and/or destroyed due to the
cubical expansion, which is caused by freezing of the coolant
liquid. Also, when being transported in a cold district, such as
Hokkaido (i.e., a northern area of Japan), and stored and kept in a
warehouse, the temperature comes down to 0.degree. C. or lower than
that, in the circumference where the electronic equipments or
apparatuses are located. In such the case, there is also a
probability that the coolant liquid is frozen.
[0066] In this manner, on the assumption that it is laid in the
circumference being equal to 0.degree. C. or lower than that, it is
preferable that an anti-freezing solution or fluid is applied as
the coolant liquid to be used in such the electronic apparatus.
However, in the case where temperature of the cooling liquid will
not come down to 0.degree. C. or lower than that, or where no
problem occurs if the coolant liquid is frozen (i.e., in case of
the structure being able to absorb the cubical expansion), the
water may be applied as the coolant liquid.
[0067] By the way, in general, the viscosity of the anti-freezing
solution or fluid is higher than that of the water, and also is
larger in temperature dependency thereof. Accordingly, the
viscosity of the anti-freezing solution or fluid comes up to high
when being in a system initiation, in particular, when temperature
of the air outside is low. For this reason, there is a possibility
that a flow amount of circulation cannot be secured sufficiently,
which is necessary for cooling down the heat-generating element,
thereby bringing about an abrupt increase of temperature in the
CPU.
[0068] The present inventors understood that, for dissolving such
the problems mentioned above, it is preferable to connect the pipe
at the outlet of the water-cooling jacket, where the temperature
rises up at the fastest, to the pipe at the inlet of the pump,
thermally, so as to increase the liquid temperature flowing into
the pump as quickly as possible, thereby lowering the viscosity,
for the purpose of advancing recovery the flow amount and securing
the necessary flow amount of circulation.
[0069] Then, explanation will be given on an electronic apparatus,
according to other embodiment of the present invention, by
referring to FIGS. 4(a) and 4(b) attached herewith.
[0070] FIGS. 4(a) and 4(b) are an outlook structure view of the
electronic apparatus and a C-C cross-section view of a part
thereof, according to the other embodiment of the present
invention.
[0071] In FIGS. 4(a) and 4(b), the piping system shown in FIG. 1
mentioned above is built up with a water-cooling jacket 8, a
heat-radiation pipe 9 attached onto the metal heat-radiation plate
10, and a pump, arranged in that sequence thereof. An exit of the
pump 11 and an inlet of the water-cooling jacket 8 are connected by
a metal pipe 28 therebetween, and further, between an inlet of the
pump 11 and a flexible tube 12, and between an exit of the
water-cooling jacket 8 and the flexible tube 12, are connected by
metal pipes 26 and 27, respectively. Those connection portions are
connected by means of joints 29.
[0072] Those metal pipes 26 and 27 are thermally connected, by
means of a thermo-conductive plate 25, being rounded at both ends
of the metal plate, such as, a copper plate, an aluminum plate,
etc., to be coincident with the shape of the metal pipes 26 and 27,
as is in the C-C cross-section shown in FIG. 4(b).
[0073] With this structure, the heat can be transferred from the
metal pipe 26, being connected to the exit side of the
water-cooling jacket 8 where temperature rises up at the fastest,
to the metal pipe 27 connected to the inlet side of the pump 11,
through the thermo-conductive plate 25, thereby increasing
temperature of the liquid flowing into the pump.
[0074] However, the metal pipe 27, which is connected to the inlet
side of the pump 11, may be connected with the heat-generating
parts other than the CPU, thereby increasing temperature of the
liquid flowing into the pump.
[0075] By the way, for the method of injecting or supplying the
anti-freezing solution or fluid into the cooling device within the
electronic apparatus, there can be considered a method of injecting
the liquid from an inlet provided in the tank 14, and/or a method
of attaching a detachable tank 14 enclosing the liquid therein in
advance, etc.
[0076] However, in general, the anti-freezing solution or fluid
contains various kinds of materials, such as corrosion suppress
agents, etc., mixed therein, therefore it brings about a
probability of being a cause of the pollution of the environment,
etc. For this reason, it is preferable that the anti-freezing
solution or fluid is collected when being scrapped. For the purpose
thereof, preferably, the anti-freezing solution or fluid can be
collected from the inlet of the tank 14 after being accumulated
therein in the total amount thereof, or it can be collected
together with the tank 14, if being detachable structure.
[0077] In more details of the collection method, for example, the
pipe connected to the tank 14 is closed or choked at one end
thereof, while driving the pump 11, thereby collecting the
anti-freezing solution or fluid. Further, with supervising the CPU
temperature, operating time, a water amount, etc., by using the CPU
itself, it is also possible to notice the necessity of supplement
of the anti-freezing solution or fluid to an operator (or, an owner
or a manager of the electronic apparatus), and in addition thereto,
noticing this to a person of maintenance service, for example,
through the network, may enable a maintenance service of the
anti-freezing solution or fluid. Also, as one example of the
maintenances mentioned above, it may be possible to provide or
prepare a system for collecting the anti-freezing solution or fluid
before a customer scraps or throws away the electronic
apparatus.
[0078] In this way, with the structure of the electronic apparatus
according to the present invention, the coolant liquid (or the
anti-freezing solution or fluid) exists in the vicinity of the
electronic circuits, therefore there is a necessity of considering
the safety when the liquid comes out from the flow passage at the
highest priority.
[0079] In the electronic apparatus, the portion where the highest
voltage is generated is accommodated or located within the display
case, in general. This is, in a sense of separating a portion of
the highest voltage away from the user, as well as, for the purpose
of preventing a cable connecting the high voltage between the
display from passing by the hinge portion where the cable is easily
fatigued. However, in the embodiment according to the present
invention, since the tank and the heat-radiation pipe are received
within that display case, an afraid of contacting between the
liquid leakage and the high voltage portion can be fully
considered.
[0080] Also, in a portion of a battery 13, having a fear of causing
abrupt chemical reaction with the water, there is also a necessity
of providing the structure for separating from the liquid.
[0081] Then, explanation will be given on an electronic apparatus
equipped with the structure against the water leakage, according to
further other embodiment of the present invention, by referring to
FIGS. 5(a) and 5(b) attached.
[0082] FIG. 5(a) is the cross-section view of the display case of
the electronic apparatus, according to further other embodiment of
the present invention. And, FIG. 5(b) is the cross-section view of
the display case, shown under the condition that the display case
is divided into a display portion and a heat-radiation portion
thereof.
[0083] In FIG. 5(a), a partition or wall 18 is provided for the
purpose of separating a display 16 and a high voltage circuit board
17 for use in display driving away from the piping portion (i.e.,
the metal heat-radiation plate 10 and the heat-radiation pipe 9),
within the display case 2 for receiving the display 16 therein.
[0084] Also, with the structure shown in FIG. 5(b), separating from
the display case 2 accommodating the display 16 therein is provided
a cover 19, within which is disposed the piping portion (i.e., the
metal heat-radiation plate 10 and the heat-radiation pipe 9), and
this cover 19 is plated on the rear surface side of the display
case 2.
[0085] As is shown in those FIGS. 5(a) and 5(b), since the high
voltage circuit board 17 can be separated from the heat-radiation
pipe 9 and the tank, therefore, even if the liquid leaks out from a
portion of the heat-radiation pipe 9, due to the partition 18, for
example, it is possible to prevent the liquid from flowing into a
side of the high voltage circuit board 17.
[0086] On the other hand, in the battery portion, it is preferable
to provide the partition or wall, being like 18 shown in FIG. 5(a),
in a receiving portion of the battery 13 (see FIG. 1), thereby
protecting the battery portion from being invaded by the liquid
leaking out from the pipe.
[0087] Also, in place of the structure mentioned above, a method or
manner may be effective of molding a resin over the electronic
circuit portion on the wiring or circuit board 4, but except for a
connector or a socket portion, or a method of disposing the pipe
under the wiring or circuit board 4, etc.
[0088] However, if the liquid comes out, it is necessary to stop
the system as soon as possible. For that purpose, it is also
possible to provide a sensor 98, as shown in FIGS. 1 and 2, for
detecting the water (or the liquid), i.e., for detection of liquid
leakage, at a specific location within the electronic apparatus,
such as, at the connection portion of the pipe and/or at the
portion of the flexible tube 12, etc., for example, thereby
initiating processing of stoppage of the system and/or alarming
(for example, via a speaker 100 shown in FIG. 1), etc. Also, it may
be possible to construct so that, monitoring is always made on the
liquid amount (for example, detecting a water surface within the
tank 14), so as to catch an abnormal reduce in the liquid amount;
thus, for determining the water leakage, and thereby initiating
processing of stoppage of the system and/or alarming, etc. However,
in this instance, in the location where the sensor is provided, the
pipe may be coved with a sleeve, and the sensor is located at an
end portion of the sleeve.
[0089] With this, the water leakage in the pipe can be sensed at
the end portion of the sleeve. Also, for prohibiting the leakage of
water at that location from coming outside the electronic
apparatus, i.e., for accumulating the liquid within the apparatus,
it may be possible to provide a pan, or a method of applying and
fixing a hydrophilic polymer at that location, and so on.
[0090] Although only the structure is shown in the embodiments
mentioned above, wherein the metal heat-radiation plate connected
with the heat-radiation pipe is received or accommodated within the
display case, however it may possible to construct so that, the
metal heat-radiation plate is provided on an inner surface of the
main case, so as to obtain the heat-radiation from the surface of
the main case.
[0091] Furthermore, it may possible to construct so that, the
heat-radiation from the surface of the display case and the
heat-radiation from the surface of the main case can be obtained in
common. Also, by using a heat-exchanger in place of the metal
heat-radiation plate, it may be possible to perform the
heat-exchange, compulsively, between the air by using a fan or the
like. Furthermore, by adding the heat-exchanger on the way of the
piping system of the embodiment shown in FIG. 1 (for example,
between the water-cooling jacket and the hinge portion), it may be
possible to construct so that, the compulsive heat-exchange can be
obtained between the air by means of the fan and the heat-radiation
from the rear surface of the display in common.
[0092] Though are shown the cases where the main case and the
display case are constructed by separate cases, respectively, in
the embodiments mentioned in the above, however the present
invention should not be restricted only thereto, but it is also
possible to be applied to an electronic apparatus, such as a
so-called desk-top type electronic apparatus, in which the display,
the wiring or circuit board mounting the heat-generating element
thereon, and other parts, as well, are received or accommodated,
for example, or that having no display therewith.
INDUSTRIAL APPLICABILITY
[0093] As was fully mentioned in the above, according to the
present invention, with an electronic apparatus, in which cooling
is achieved by circulating the cooling liquid between the
heat-generating element and the heat-radiation pipe provided on a
wall surface of the case, it is possible to radiate the heat
generated from the heat-generating element from the surface of the
case with high reliability.
* * * * *