U.S. patent application number 10/671038 was filed with the patent office on 2005-03-24 for image sensor module.
Invention is credited to Chang, Jason, Hsieh, Figo, Tu, Hsiu Wen, Wu, Jichen, You, Irving.
Application Number | 20050062083 10/671038 |
Document ID | / |
Family ID | 34274777 |
Filed Date | 2005-03-24 |
United States Patent
Application |
20050062083 |
Kind Code |
A1 |
You, Irving ; et
al. |
March 24, 2005 |
IMAGE SENSOR MODULE
Abstract
An image sensor module includes a substrate, a frame layer, a
photosensitive chip, a transparent layer and a lens barrel. The
substrate has a plurality of lead frame arranged in a matrix to
form an upper surface, which is formed with a opening, and a lower
surface, which is formed with a cavity penetrated from the opening.
The frame layer is integrally formed with the substrate, and
arranged at the periphery of the upper surface of the substrate to
define a chamber together with the substrate, an internal thread
being formed on the inner wall of the chamber. The photosensitive
chip is mounted within the cavity of the substrate, and
electrically coupled each of the lead frames in a flip chip manner.
The transparent layer is covered onto the upper surface of the
substrate to cover the opening. The lens barrel has a top surface,
a bottom surface opposed to the top surface and a transparent
region, a external thread formed between the top surface and the
bottom surface, the lens barrel being arranged within the chamber
of the frame layer, the external thread being screwed on the
internal thread of the chamber.
Inventors: |
You, Irving; (Hsinchu Hsien,
TW) ; Wu, Jichen; (Hsinchu Hsien, TW) ; Tu,
Hsiu Wen; (Hsinchu Hsien, TW) ; Chang, Jason;
(Hsinchu Hsien, TW) ; Hsieh, Figo; (Hsinchu Hsien,
TW) |
Correspondence
Address: |
Keith Kline
PRO-TECHTOR INTERNATIONAL SERVICES
20775 Norada Court
Saratoga
CA
95070-3018
US
|
Family ID: |
34274777 |
Appl. No.: |
10/671038 |
Filed: |
September 24, 2003 |
Current U.S.
Class: |
257/291 ;
257/E31.117 |
Current CPC
Class: |
H01L 27/14625 20130101;
H01L 2924/0002 20130101; H01L 31/0203 20130101; H01L 2924/0002
20130101; H01L 27/14618 20130101; H01L 2924/00 20130101 |
Class at
Publication: |
257/291 |
International
Class: |
H01L 031/062 |
Claims
What is claimed is:
1. An image sensor module comprising: a substrate having plurality
of lead frames arranged in a matrix, each of the lead frames having
a first board and a second board located on a height different from
that of the first board, the substrate forming with an upper
surface, which is formed with a opening, and a lower surface, which
is formed with a cavity penetrated from the opening, each of the
first board of the lead frames exposed from the cavity, and each of
the second board of the lead frames exposed from the lower surface
of the substrate; a frame layer integrally formed with the
substrate, and arranged at the periphery of the upper surface of
the substrate to define a chamber together with the substrate, an
internal thread being formed on the inner wall of the chamber. a
photosensitive chip mounted within the cavity of the substrate, and
electrically coupled each of the first boards of the lead frames in
a flip chip manner; a transparent layer covered onto the upper
surface of the substrate to cover the opening, therefore, the
photosensitive chip may received optical signals passing through
the transparent layer; and a lens barrel having a top surface, a
bottom surface opposed to the top surface and a transparent region,
a external thread formed between the top surface and the bottom
surface, the lens barrel being arranged within the chamber of the
frame layer, the external thread being screwed on the internal
thread of the chamber.
2. The image sensor module according to claim 1, wherein a through
hole communication with the transparent region is formed at the
upper end face of the lens barrel, and an aspheric lens and an
infrared filter under the aspheric lens is arranged within the
transparent region of the lens barrel.
3. The image sensor module according to claim 1, wherein the
transparent layer is a piece of glass.
4. The image sensor module according to claim 1, further comprises
a molded resin, which is filled within the cavity of the substrate
to protect the photosensitive chip.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the invention
[0002] The present invention relates to an image sensor module, and
more particularly to an image sensor module having a reduced
manufacturing cost and package volume.
[0003] 2. Description of the Related Art
[0004] Referring to FIG. 1, a conventional image sensor module
includes a lens holder 10, a lens barrel 20, and an image sensor
30. The lens holder 10 has an upper face 12, a lower face 14 and an
opening 16 penetrating through the lens holder 10 from the upper
end face 12 to the lower end face 14. An internal thread 18 is
formed on an inner wall of the opening 16 of the lens holder
10.
[0005] The lens barrel 20 formed with an external thread 22 is
inserted from the upper end face 12 of the lens holder 10, received
within the opening 16, and screwed to the internal thread 18 of the
lens holder 10. The lens barrel 20 is formed with a transparent
region 24 under which an aspheric lens 26 and an infrared filter 28
are arranged in sequence.
[0006] The image sensor 30 has a substrate 31, which is a printed
circuit board. The substrate 31 has a first surface 32 formed with
first connected points 34 and a second surface 33 opposite to the
first surface 32 formed with second connected points 35.
[0007] The frame layer 36 is arranged at the periphery of the first
surface 32 of the substrates 1.
[0008] The photosensitive chip 37 is mounted on the first surface
32 on which is electrically connected to the first connected points
34 by wires 38.
[0009] The transparent layer 39 is adhered on the frame layer 36
for covering the photosensitive chip 37 and wires 38.
[0010] The above-mentioned image sensor module has the following
drawbacks.
[0011] 1. Because the transparent layer 36 is bonded to the lower
surface 14 of the lens holder 10 by the adhesive, which may
contaminate the surface of the transparent layer 36, poor optical
signals may be obtained.
[0012] 2. When the module is assembled, the transparent layer 36
has to be precisely positioned with the aspheric lens 26 and then
bonded to the lens barrel 20. Once the positional precision
deviates from the standard level, the overall module cannot be
reassembled and has to be treated as waste material
[0013] 3. The lens holder 10 has to be additionally provided to
combine the lens barrel 20 with the image sensor 30.
[0014] 4. The substrate 31 is a printed circuit board, which has a
higher cost.
SUMMARY OF THE INVENTION
[0015] It is an important subject of the present invention to
provide an improved structure for an image sensor module, which is
easy to be assembled/disassembled and has less components.
[0016] It is another object of the present invention is to provide
an image sensor module, which may be advantageously reduced the
volume of the package.
[0017] It is still another object of the present invention is to
provide an image sensor module, which may be omitted the printed
circuit board and has a reduced manufacturing cost.
[0018] To achieve the above-mentioned object, the present invention
of an image sensor module includes a substrate, a frame layer, a
photosensitive chip, a transparent layer and a lens barrel. The
substrate has plurality of lead frames, each of the lead frames has
a first board and a second board located on a height different from
that of the first board, the substrate is formed with an upper
surface, which is formed with a opening, and a lower surface, which
is formed with a cavity penetrated from the opening, each of the
first board of the lead frames are exposed from the cavity, and
each of the second board of the lead frames are exposed from the
lower surface of the substrate. The frame layer is integrally
formed with the substrate, and is arranged at the periphery of the
upper surface of the substrate to define a chamber together with
the substrate, an internal thread is formed on the inner wall of
the chamber. The photosensitive chip is mounted within the cavity
of the substrate, and is electrically coupled each of the first
boards of the lead frames in a flip chip manner. The transparent
layer is covered onto the upper surface of the substrate to cover
the opening, therefore, the photosensitive chip may received
optical signals passing through the transparent layer. The lens
barrel has a top surface, a bottom surface opposed to the top
surface and a transparent region, a external thread is formed
between the top surface and the bottom surface, the lens barrel is
arranged within the chamber of the frame layer, the external thread
being screwed on the internal thread of the chamber.
[0019] Furthermore, the present invention which is easy to be
assembled/disassembled and has less components, then, it may be
advantageously reduced the volume of the package and has less
manufacturing cost
BRIEF DESCRIPTION OF THE DRAWINGS
[0020] FIG. 1 is a schematic illustration showing a conventional
image sensor module.
[0021] FIG. 2 is exploded view showing an image sensor module of
the present invention.
[0022] FIG. 3 is a cross-section showing an image sensor module of
the present invention.
[0023] FIG. 4 is a second schematic illustration showing an image
sensor module of the present invention
DETAILED DESCRIPTION OF THE INVENTION
[0024] Please referring to FIG. 2 and FIG. 3, an image sensor
module of the present invention includes a substrate 42, a
photosensitive 44, a transparent layer 46, a molded resin 47 and a
lens barrel 48.
[0025] The substrate 42 has a plurality of lead frames 50 arranged
in a matrix, each of the lead frames 50 have a first board 60 and a
second board 62 located on a height different from that of the
first board 60, the substrate 42 is forming with an upper surface
52, which is formed with a opening 58, and a lower surface 54,
which is formed with a cavity 56 penetrated from the opening 54,
each of the first board 60 of the lead frames 50 are exposed from
the cavity 56 to define signal input terminals, and each of the
second board 62 of the lead frames 50 are exposed from the lower
surface 54 of the substrate 40 to define signal output terminals,
wherein a third board 64 is coupled the first board 64 to the
second board 62.
[0026] The frame layer 42 is integrally formed with the substrate
40 by way of injecting mold, and is arranged at the periphery of
the upper surface 52 of the substrate 40 to define a chamber 66
together with the substrate 40, an internal thread 68 is formed on
the inner wall of the chamber 66.
[0027] The photosensitive chip 44 is arranged within the cavity 56
and electrically connected to the first board 60 of the lead frame
50 in a flip chip manner.
[0028] The transparent layer 46 is a piece of glass adhered onto
the upper surface 52 of the substrate 40 to cover the opening 58,
therefore, the photosensitive chip 44 may received optical signals
passing through the transparent layer 46.
[0029] The molded resin 47 is filled into the cavity 56 of the
substrate 40 for covering the photosensitive chip 44.
[0030] The lens barrel 48 has an upper end face 70, a bottom end
face 72 opposed to the upper end face 70 and a transparent region
76. A external thread 74 is formed between the upper end face 70
and the bottom end face 72. The lens barrel 48 is arranged within
the chamber 66 of the frame layer 42, the external thread 74 of the
lens barrel 48 is screwed on the internal thread 68 of the chamber
66. A through hole 78 communication with the transparent region 76
is formed at the upper end face 70 of the lens barrel 48, and an
aspheric lens 80 and an infrared filter 82 under the aspheric lens
80 is arranged within the transparent region 76 of the lens barrel
48.
[0031] Please referring to FIG. 4, which is a second schematic
illustration showing an image sensor module of the present
invention, wherein the transparent layer 46 and the infrared filter
82 are combined, therefore, the transparent layer 46 may be
omitted.
[0032] To sum up, the present invent has the following
advantages.
[0033] 1. Since the frame layer 42 and the lens barrel 48 are
screwed together through the external thread 74 and internal thread
68, the module is easy to be assembled/disassembled so as to
facilitate the replacement of the components and the source
recycling.
[0034] 2. Since the conventional lens holder is omitted, the
product size may be reduced.
[0035] 3. Since the substrate 40 and the frame layer 42 are
integrally formed by injecting mold, and an internal thread 68 is
formed on the frame layer 42, therefore, the module may be
omitted.
[0036] 4. Since the substrate 40 is consist of a plurality of lead
frames 30 so as to may reduced the manufacturing cost.
[0037] While present the invention has been described by way of an
example and in terms of a preferred embodiment, it is to be
understood that the invention is not limited to the disclosed
embodiment. To the contrary, it is intended to cover various
modifications. Therefore, the scope of the appended claims should
be accorded the broadest interpretation so as to encompass all such
modifications.
* * * * *