U.S. patent application number 10/656052 was filed with the patent office on 2005-03-10 for method and system for efficiently coordinating orders with product materials progressing through a manufacturing flow.
Invention is credited to Chen, Cheng-Che, Chen, Chiu-Ju, Hsu, Yi-Chin, Yen, Wei-Kuo.
Application Number | 20050055119 10/656052 |
Document ID | / |
Family ID | 34226271 |
Filed Date | 2005-03-10 |
United States Patent
Application |
20050055119 |
Kind Code |
A1 |
Yen, Wei-Kuo ; et
al. |
March 10, 2005 |
METHOD AND SYSTEM FOR EFFICIENTLY COORDINATING ORDERS WITH PRODUCT
MATERIALS PROGRESSING THROUGH A MANUFACTURING FLOW
Abstract
A method and system is provided for dynamically coordinating one
or more product orders with product parts progressing through a
manufacturing process flow. After identifying a first order for
generating one or more lots of parts for manufacturing a first
product, wherein the first order identifies a predetermined base
feature, one or more customer specific features, one or more order
specific features, and the quantity of the first product, A smart
code is assigned to the first order and the lots of parts, wherein
the smart code identifies an association between the first order
and the lots of parts. An analysis is then performed, based on the
smart codes assigned thereto, to see whether one or more available
lots of parts of a second order in production are ready to be
converted to produce the first product. The smart code of the
available lots is changed to the smart code of the first order if
the available lots of the second order are chosen to be further
processed for fulfilling the first order.
Inventors: |
Yen, Wei-Kuo; (Hsin-Tsu,
TW) ; Hsu, Yi-Chin; (Hsin-Tsu, TW) ; Chen,
Cheng-Che; (Hsin-Chu, TW) ; Chen, Chiu-Ju;
(Ping Tung City, TW) |
Correspondence
Address: |
DUANE MORRIS, LLP
IP DEPARTMENT
ONE LIBERTY PLACE
PHILADELPHIA
PA
19103-7396
US
|
Family ID: |
34226271 |
Appl. No.: |
10/656052 |
Filed: |
September 5, 2003 |
Current U.S.
Class: |
700/100 ;
700/106; 705/28 |
Current CPC
Class: |
G06Q 10/087 20130101;
G06Q 10/06 20130101 |
Class at
Publication: |
700/100 ;
700/106; 705/028 |
International
Class: |
G06F 019/00 |
Claims
What is claimed is:
1. A method for dynamically coordinating one or more product orders
with product parts progressing through a manufacturing process
flow, comprising: identifying a first order for generating one or
more lots of parts for manufacturing a first product, the first
order identifying a predetermined base feature, one or more
customer specific features, one or more order specific features,
and the quantity of the first product; assigning a smart code to
the first order and the lots of parts, the smart code identifying
an association between the first order and the lots of parts;
analyzing, based on the smart codes assigned thereto, whether one
or more available lots of parts of a second order in production are
ready to be converted to produce the first product; and dynamically
changing the smart code of the available lots to the smart code of
the first order if the available lots of the second order are
chosen to be further processed for fulfilling the first order.
2. The method of claim 1 wherein the analyzing further includes
determining that the one or more available lots of parts and the
first product are of the same base feature.
3. The method of claim 1 wherein the analyzing further includes
determining that the one or more available lots of parts have not
been processed to a point that they are prohibited from being
converted into the first product.
4. The method of claim 1 wherein the analyzing further includes
determining that the one or more available lots of parts either
have the customer specific features or can incorporate the customer
specific features.
5. The method of claim 1 further comprising when the first order is
modified, analyzing whether one or more available lots of parts in
production that can be converted to fulfill the need of the
modification of the first order.
6. The method of claim 5 further comprising initiating new lots of
the parts if needed based on the analyzing result.
7. A method for dynamically re-arranging one or more orders with
one or more wafer lots progressing through a manufacturing process
flow, comprising: identifying a modification of a first order, the
first order being for generating one or more wafer lots for
manufacturing a first product, the first order identifying a
predetermined base feature, one or more customer specific features,
one or more order specific features, and the quantity of the first
product, and the first order and the wafer lots being associated by
a smart code; analyzing, based on the smart codes assigned thereto,
whether one or more available wafer lots of a second order in
production are ready to be converted to satisfy the modified first
order; and dynamically changing the smart code of the available
wafer lots to the smart code of the first order if the available
wafer lots of the second order are chosen to be further processed
for satisfying the modified first order.
8. The method of claim 7 wherein the analyzing further includes
determining that the one or more available wafer lots and the first
product have the same base feature.
9. The method of claim 7 wherein the analyzing further includes
determining that the one or more available wafer lots have not been
processed to a point that they are prohibited from being converted
into the first product.
10. The method of claim 7 wherein the analyzing further includes
determining that the one or more available wafer lots either have
the customer specific features or can incorporate the customer
specific features.
11. The method of claim 7 further comprising initiating new wafer
lots if needed based on the analyzing result.
12. A semiconductor manufacturing management system for dynamically
coordinating one or more product orders with wafer lots progressing
through a manufacturing process flow, the system comprising: an
order entry module for identifying a modification of a first order,
the first order being for generating one or more wafer lots for
manufacturing a first product and identifying a predetermined base
feature, one or more customer specific features, one or more order
specific features, and the quantity of the first product, the order
entry module assigning a smart code to the first order and the
wafer lots for identifying an association therebetween; a planning
module for analyzing, based on the smart codes assigned thereto,
whether one or more available wafer lots of a second order in
production are ready to be converted to produce the first product;
and a smart code processing module for dynamically changing the
smart code of the available lots to the smart code of the first
order if the available lots of the second order are chosen to be
further processed for fulfilling the changed first order.
13. The system of claim 12 wherein the planning module further
includes an output planning system and a wafer picking system.
14. The system of claim 12 wherein the order entry module further
includes a wafer start system for initiating wafer lots.
15. The system of claim 12 wherein the planning module further
includes means for providing information about excessive wafer
lots.
16. The system of claim 12 wherein the smart code processing module
further includes means for determining that the one or more
available wafer lots and the first product have the same base
feature.
17. The system of claim 12 wherein the smart code processing module
further includes means for determining that the one or more
available wafer lots have not been processed to a point that they
are prohibited from being converted into the first product.
18. The system of claim 12 wherein the smart code processing module
further includes means for reconfiguring the smart code for the
available wafer lots of the second order when they are used to
fulfill the first order.
19. The system of claim 12 wherein the smart code processing module
further includes means for detecting the modification of the first
order.
20. The system of claim 12 wherein the smart code processing module
further includes means for confirming the modified first order.
Description
BACKGROUND OF THE DISCLOSURE
[0001] The present disclosure relates generally to product
manufacturing management, and more particularly, to an efficient
management of production of high volume and highly customized
semiconductor products.
[0002] A standard production management process might be to order
large quantities of raw materials and reorder when stocks look low.
This method is simple and does not require any sophisticated
analysis. It is effective for small lot production in a low volume
environment. It can also be made effective in a mass-production
environment of a single product. This process provides poor
response to demand changes. It is ineffective in high-volume,
multi-product environments. It often requires carrying large
inventories with the related inventory expenses.
[0003] A more advanced standard process has been developed that
plans inventory purchasing based on orders and forecast. This
system is referred to by several names, more commonly as MRP
(Material Requirements Planning. These systems calculate the
quantity of materials and resources required to fill existing
orders and forecast. Based on estimated delivery lead-times and the
order of assembly, the system generates estimates for a
time-sequenced purchasing plan.
[0004] MRP works well in large-volume, multi-product environments.
It is capable of responding to rapidly changing order environments.
However, MRP is not particularly effective in managing production
that includes customized orders or frequent change-orders.
[0005] What is needed is an efficient method for managing material
and resources in support of frequent order changes in a
high-volume, continuous-flow, highly-customized manufacturing
environment.
SUMMARY OF THE DISCLOSURE
[0006] A method and system is provided for dynamically coordinating
one or more product orders with product parts progressing through a
manufacturing process flow. After identifying a first order for
generating one or more lots of parts for manufacturing a first
product, wherein the first order identifies a predetermined base
feature, one or more customer specific features, one or more order
specific features, and the quantity of the first product, A smart
code is assigned to the first order and the lots of parts, wherein
the smart code identifies an association between the first order
and the lots of parts. An analysis is then performed, based on the
smart codes assigned thereto, to see whether one or more available
lots of parts of a second order in production are ready to be
converted to produce the first product. The smart code of the
available lots is changed to the smart code of the first order if
the available lots of the second order are chosen to be further
processed for fulfilling the first order.
[0007] Various benefits are achieved over conventional approaches.
For instance, opportunities for rerouting or rework of parts are
identified, thus reducing costly scrap and resource consuming
restarts. Therefore, it could significantly reduce scrap and
rework, cost to the customer, lead time for delivery, and plant and
material capacity planning.
BRIEF DESCRIPTION OF THE DRAWINGS
[0008] FIG. 1 illustrates an order-flow timing diagram.
[0009] FIG. 2 illustrates the association between product part lots
and orders through a smart code.
[0010] FIG. 3 illustrates a process for re-arranging orders based
on an order modification according to one example of the present
disclosure.
[0011] FIG. 4 illustrates a manufacturing process flow for
processing orders according to one example of the present
disclosure.
DETAILED DESCRIPTION
[0012] High-volume, continuous-flow, highly-customized
manufacturing environments present unique challenges to standard
production management. MRP works well in large-volume, standard
product environments, it is not effective in managing production
that includes highly customized orders or frequent modifications of
existing orders (referred to as "change-orders"). Multi-product
mass production is exemplified by capacity limits and changing
customer demands. This often generates delays and material
shortages. Customer orders often must be prioritized to establish
up-to-date completion schedules.
[0013] Conventionally, each order is given a part number to
identify product materials needed and the features of the expected
product when the order is entered into a computerized manufacturing
management system. Due to the customer's specific customization
requirements, most part numbers will be unique to the requested
order. For illustration purposes, product materials progressing
through the manufacturing flow are referred to as "parts," and they
become "products" when all processes are finished thereon. Once the
parts have begun processing, change-orders can be submitted to
change the quantity requirements for one or more parts. A
change-order may request quantity changes to multiple parts, each
part must be addressed separately, potentially generating scrap and
restarts.
[0014] The following examples will use custom semiconductor device
fabrication as a typical high-volume, highly customized product
manufacturing environment. FIG. 1 illustrates a general order-flow
timing diagram (100). The orders and lots of parts are shown on
various points on a production time-line (102) so as to illustrate
their progress through the production flow. Milestones in the
process flow are marked as WF, CP, AS, and FT which represent
wafer-start, current-probe, assembly, and final-test,
respectively.
[0015] As illustrated in FIG. 1, a customer places an order with
the customer's usual special features for 50 wafers of internal
part-number 005. This request is entered on December 01 as O1L1
PN#005, which indicates that it is Line #1 on Purchase Order #1. A
new batch of wafers is started and is designated O1L1 PN#005 (104),
and is assigned to Lot A (106).
[0016] The same customer places another order for 25 wafers of
internal part-number 007, with the customer's usual special
features. The order is added to the original Purchase Order and is
entered on December 15 as O1L2 PN#007 (Line#2 on Purchase Order
#1). A new batch of wafers is started and is designated O1L2 PN#007
(108), and is assigned to Lot B (110). It is assumed that finished
products of part number 007 are different from those of part number
005, but they all start from the same initial parts.
[0017] The same customer submits a change-order on December 21. In
this request, the quantity of PN#005 is reduced to 25 wafers (112).
As 50 wafers have been started in Lot A to satisfy the original
order, there are now 25 extra wafers in Lot A. However, according
to the conventional practice, since the 25 wafers in excess are
part-numbered as O1L1 PN#005, they cannot be reassigned to another
order. As such, the 25 extra wafers become scrap (112), an
undesired waste is then unnecessarily introduced in production.
Either the manufacturer or the customer will have to pay for the
waste.
[0018] In the example shown in FIG. 1, the same customer has
another change-order (114) on December 21 to increase the quantity
of PN#007 to 50 wafers. Normally, this would trigger another
request to generate 25 additional wafers. Following Lot B (110),
which has already progressed partially through the fabrication
flow, a new batch of wafers is started and is designated O1L2
PN#007 (114), and is associated with Lot C (116). The delivery of
these new wafers will be later than those in Lot B.
[0019] It should be noted that the wafers in Lot A (106) have not
yet progressed to a fabrication point that would preclude them from
being reassigned to and completed as a portion of O1L2 PN#007. If
it is determined that Lot A can be changed as such, this
reassignment action taken in the production flow would both
eliminate the need of scrapping 25 wafers and starting 25
additional wafers. Material cost, resource usage, and time would
all be saved. In addition, the customer's two orders would be
filled sooner. Even though many orders may process through quite a
few common process steps, and sometimes, even through identical
steps when completed, therefore, they can be reassigned if needed
during the process flow. Unfortunately, the conventional part
numbering system cannot identify these opportunities.
[0020] An improved method according to this disclosure allows
identifying and possibly automating opportunities for rerouting
uncompleted wafers that have not yet reached the differentiating
process step, or returning a wafer lot back to the process line for
rework, or both. Since many customer-specific parts have custom
features that are identical until a specific state in the
manufacturing process, it should be possible to take advantage of
parts that are already in the process that might readily be
converted to a new request. For example, when a customer places a
change-order, a request to increase the quantity of one part could
be offset by a request to decrease the quantity of another.
[0021] When an order is entered into a manufacturing management
system, each order might be given a part number that reflects the
base feature, the customer specific features, and the order
specific features. Additionally, both the part number and the order
number are associated with a "smart code". This code associates
orders known to the sales department with product parts known to
manufacturing operations personnel.
[0022] FIG. 2 is a schematic (200) illustrating the use of smart
codes to link lots of wafers with orders. When orders are received
and wafer lots are ready to be initiated, smart codes (202) are
assigned to each production lot (204) and each purchase order
(206). This smart code provides a link that couples a production
lot with a particular purchase order as the lot travels through the
fabrication process. When needed, the manufacturing management
system can automatically search and locate lots that were generated
by a particular purchase order using the smart code. For example,
when a change-order is requested by a customer to modify a purchase
order, it is possible to use the smart code to locate all lots that
were originally generated by the purchase order, regardless of
their part numbers. Therefore, the smart code has the feature to
allow the manufacturing management system to identify parts with
different part numbers, which might be available for rearrangement
in the change-order situation. Thus, a request to increase the
quantity of one part could be offset by a request to decrease the
quantity of another. This could significantly reduce scrap and
rework.
[0023] FIG. 3 illustrates a flow diagram 300 illustrating the use
of the smart code to identify and reroute wafers, in order to
satisfy a change-order request according to one example of the
present disclosure. This wafer lot identification and re-arranging
process might be referred to as a Synchronize Order Change (SOC).
In the example illustrated, a customer initially places a two-line
purchase order. Purchase order one, line-one (302), is a request
for 50 wafers PN#005 with their usual special requirements.
Purchase order one, line-two (304), is a request for 25 wafers
PN#007 with their usual special requirements. Purchase order one,
line-one (ON1LN1) is associated with two 25-wafer lots (306), Lot A
and Lot B. Purchase order one line-two (ON1LN2) is associated with
a single 25-wafer lot (308), Lot C. The orders and the lots are
each assigned with a smart code respectively (310 and 312). The
sample smart code for ON1LN1 is sc20010701005 and the one for
ON1LN2 is sc20010701007. They are only different in the last digit
showing that they have different part numbers, and it also shows
that they belong to the same customer and are similar in features
before being fully completed.
[0024] It is assumed that a change-order request is submitted at an
arbitrary point in the fabrication process. The change-order
modifies ON1LN1 from 50 wafers to 25 wafers (314). The change-order
also modifies ON1LN2 from 25 wafers to 50 wafers of PN #007 (316).
When this change happens, the SOC process (318) is initiated and
examines whether re-arrangement opportunities exist before
initiating fresh wafer lots or scrapping any lots. The SOC detects
the smart codes (320 and 322) for the orders being changed, i.e.,
ON1LN1 (302) and ON1LN2 (304). As shown, the smart codes (310 and
312) are used as indices to identify the wafer lots A, B, (306) and
C (308) that were initiated for the original order. Order related
process progress information is provided that indicates where these
wafer lots stand in the fabrication process flow. The key
information needed for SOC is whether these lots have progressed to
a point that they have had different features incorporated thereon.
Based on such information, it is assumed that the SOC determines
that wafers can be rerouted (324) to satisfy both changes (314 and
316). As a result, Lot B is rerouted as PN#007, and the smart code
sc20010701007 replaces the old smart code sc20010701005 for this
lot. The final result is that the change-request is satisfied
without scrapping or restarting any wafer lots.
[0025] FIG. 4 illustrates a relevant portion of a manufacturing
process flow (400) according to one example of the present
disclosure. A manufacturing management system powered by modern
computer systems is used by multiple operators throughout the
process flow. It is assumed that the system is networked together
so that the information is all in a real time fashion. The
manufacturing management system includes both the SOC feature. In
this example, the process flow has been divided into three
functional stages: Sales Administration, Production Control, Output
Planning, and Manufacture Line Control although many other
alternatives for dividing the flow are also possible. The following
subsystems or modules are included, and will be described in
greater detail: Auto Wafer Start System (402), Output Planning
System (404), Wafer Picking system (406), Smart Code Processing
System (408).
[0026] The early part of the manufacturing management system may be
referred to as an Order Entry Module (410). An order (412) is
entered into the system by the sales administration personnel and
might include the base feature number, customer-specific features,
order-specific features, and other required data. The order-entry
data is provided to the Auto Wafer Start System (402). Normally,
the Auto Wafer Start System initiates the production process for
fabricating the requested order so that wafer lots are started in
the manufacturing process flow. Assuming no SOC is available, smart
codes are assigned to the lots and the orders by a smart code
assignment module (414). The smart code data is saved in a storage
module (416) and made available to the rest of the manufacturing
management system. The order data, smart code data, lot data, and
any other appropriate data, is particularly important for the
Output Planning System (404) as they control the output flow of the
wafer lots.
[0027] Functions centered around the Output Planning System may be
referred to as a Planning Module (418). It is assumed that data has
been provided to the Output Planning System (404) from the
Order-Entry Module (410). If it is a new order and it is determined
that there are no available wafer lots that can be used for this
new order, the Output Planning System (404) submits requests for
starting orders to the Wafer Picking System (406), which will start
appropriate numbers of wafers to satisfy the new order. The Output
Planning System may also provide information about excessive wafer
lots currently in the manufacturing process based on current
inventories and work-in-process (WIP). As such, it has an order
review module (420) that reviews the incoming order based upon the
excess available to determine if opportunities exist to reroute or
rework WIP for the newly input order to avoid starting new lots by
the Wafer Picking System. Based on the planning result, the new
order will be confirmed by a wafer initiation request confirmation
module (422) so that the Wafer Picking System can start processing
new wafer lots after adjustments made based on the analysis from
the Output Planning System (404). This adjustment helps to reduce
the waste in the production.
[0028] Functional modules labeled as (424) may be collectively
referred to as a Smart Code Processing Module. Smart code
processing applies to both new orders or change-orders. In the
situation where a modification of an order or change-order (426) is
made by a customer and conveyed to the operators in the
Manufacturing Line Control, the Smart Code Processing Module is
triggered to find the best solution for making the changes. The
Smart Code Processing Module (424) works with the Planning Module
(418) to analyze the orders and outstanding wafer lots, and orders
that are determined to have opportunities for rerouting or rework
of WIP will be identified. It has to be determined that one or more
available wafer lots are of the same base feature and they have not
been processed so far in the manufacturing process flow that it
would prohibit them from being converted to another product with
additional processing. In addition, it is also determined whether
the wafers have the customer specific features processed or can
have the customer specific features incorporated in future
processes. When available wafer lots are found that are readily
convertable to be further processed to make the desired products
according to the change-order, the Smart Code Processing Module
(408) reconfigures the lot identifiers, order numbers, and smart
codes to take advantage of identified opportunities. The wafer lots
that have been re-arranged to fulfill the need of the change-order
will be confirmed by an order change confirmation module (428), and
their new smart codes are assigned and saved and made available to
various operators of the manufacturing management system.
Furthermore, the reconfigured data with regard to the orders, smart
codes, lots, and any other related data is submitted to the Output
Planning System (404) to allow the updating of production planning.
The Output Planning System then arranges for the final overall
planning. In the case that after the available wafer lots are
converted, and there is still a shortage of desired products, the
Output Planning System (404) will inform the Auto Wafer Start
System (402) to initiate new wafer lots.
[0029] As an alternative, instead of immediately assigning smart
codes and initiating wafer lots for every new order, the Wafer Auto
Start System (402) can optionally contact the Output Planning
System (404) to check whether there are available wafer lots that
can be converted to fulfill the need of the new order. The
communication between these two systems is represented by the
dashed line 428. If so, no wafer will be initiated and the existing
wafer lots will be rearranged to be associated with the new
order.
[0030] The present disclosure as described above thus provides an
improved method for production management of change-orders. Various
benefits are achieved over conventional approaches. For instance,
opportunities for rerouting or rework of WIP are identified, thus
reducing costly scrap and resource consuming restarts. In short,
the improved method and system disclosed could significantly reduce
scrap and rework, cost to the customer, lead time for delivery, and
plant and material capacity planning.
[0031] It will also be understood by those skilled in the art that
one or more of the elements/steps of the present disclosure may be
implemented using software executed on a general purpose computer
system or networked computer systems, using special purpose
hardware-based computer systems, or using combinations of special
purpose hardware and software.
[0032] The above disclosure provides many different embodiments, or
examples, for implementing different features of the invention.
Specific examples of components, and processes are described to
help clarify the invention. These are, of course, merely examples
and are not intended to limit the invention from that described in
the claims.
[0033] While the invention has been particularly shown and
described with reference to the preferred embodiment thereof, it
will be understood by those skilled in the art that various changes
in form and detail may be made therein without departing from the
spirit and scope of the invention, as set forth in the following
claims.
* * * * *