U.S. patent application number 10/969380 was filed with the patent office on 2005-03-10 for barrier layers for microelectromechanical systems.
Invention is credited to Doan, Jonathan, Huibers, Andrew, Patel, Satyadev.
Application Number | 20050054135 10/969380 |
Document ID | / |
Family ID | 32989809 |
Filed Date | 2005-03-10 |
United States Patent
Application |
20050054135 |
Kind Code |
A1 |
Patel, Satyadev ; et
al. |
March 10, 2005 |
Barrier layers for microelectromechanical systems
Abstract
A method for processing microelectromechanical devices is
disclosed herein. The method prevents the diffusion and interaction
between sacrificial layers and structure layers of the
microelectromechanical devices by providing selected barrier layers
between consecutive sacrificial and structure layers.
Inventors: |
Patel, Satyadev; (Sunnyvale,
CA) ; Doan, Jonathan; (Mountain View, CA) ;
Huibers, Andrew; (Palo Alto, CA) |
Correspondence
Address: |
REFLECTIVITY, INC.
350 POTRERO AVENUE
SUNNYVALE
CA
94085
US
|
Family ID: |
32989809 |
Appl. No.: |
10/969380 |
Filed: |
October 19, 2004 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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10969380 |
Oct 19, 2004 |
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10402789 |
Mar 28, 2003 |
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10969380 |
Oct 19, 2004 |
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10948871 |
Sep 24, 2004 |
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10948871 |
Sep 24, 2004 |
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10748899 |
Dec 29, 2003 |
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6798561 |
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10748899 |
Dec 29, 2003 |
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10153138 |
May 20, 2002 |
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6690502 |
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10153138 |
May 20, 2002 |
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10043703 |
Jan 9, 2002 |
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6538800 |
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10043703 |
Jan 9, 2002 |
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09624591 |
Jul 24, 2000 |
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6356378 |
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09624591 |
Jul 24, 2000 |
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09437586 |
Nov 9, 1999 |
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6172797 |
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09437586 |
Nov 9, 1999 |
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09160361 |
Sep 24, 1998 |
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6046840 |
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09160361 |
Sep 24, 1998 |
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08665380 |
Jun 18, 1996 |
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5835256 |
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60000322 |
Jun 19, 1995 |
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Current U.S.
Class: |
438/52 ;
438/53 |
Current CPC
Class: |
B81C 2201/053 20130101;
B81B 2201/042 20130101; B81C 1/00793 20130101 |
Class at
Publication: |
438/052 ;
438/053 |
International
Class: |
H01L 021/00 |
Claims
We claim:
1. A method comprising: depositing a first sacrificial layer;
depositing a first barrier layer after the first sacrificial layer;
forming a structural layer of a microelectromechanical device after
the first barrier layer; releasing the microelectromechanical
device by removing the first sacrificial layer; and wherein the
first barrier layer prevents diffusion and reaction between the
first sacrificial layer and the structural layer, and the first
barrier layer is not removed after releasing the
microelectromechanical device.
2. The method of claim 1, further comprises: patterning the
deposited first barrier layer; and wherein the step of forming the
structure layer of a microelectromechanical device after the first
barrier layer further comprises: depositing the structure layer;
and patterning the deposited structure layer.
3. The method of claim 2, wherein the first barrier layer and the
first structure layer are patterned simultaneously.
4. The method of claim 1, further comprising: before releasing the
microelectromechanical device by removing the first sacrificial
layer, depositing a second barrier layer after the structural layer
formed on the first barrier layer; depositing a second sacrificial
layer after the second barrier layer; forming one or more structure
layers of the microelectromechanical device after the second
sacrificial layer; and wherein the second barrier layer prevents
diffusion and interaction between the second sacrificial layer and
the structural layer formed underneath the second barrier layer;
and wherein the step of releasing the microelectromechanical device
by removing the first sacrificial layer further comprises: removing
the second sacrificial layer and the second barrier layer.
5. The method of claim 1, further comprising: before releasing the
microelectromechanical device by removing the first sacrificial
layer, depositing a second barrier layer after the structural layer
formed on the first barrier layer; depositing a second sacrificial
layer after the second barrier layer; forming one or more
structural layers of the microelectromechanical device after the
second sacrificial layer; and wherein the second barrier layer
prevents diffusion and interaction between the second sacrificial
layer and the structure layer formed underneath the second barrier
layer; and wherein the step of releasing the microelectromechanical
device by removing the first sacrificial layer further comprises:
removing the second sacrificial layer; and wherein the second
barrier layer is not removed after releasing the
microelectromechanical device.
6. The method of claim 1, wherein the first sacrificial material is
amorphous silicon; and wherein the structural layer formed on the
first sacrificial layer is a metal element or a metal compound.
7. The method of claim 1, wherein the first barrier layer comprises
one or more inter-metallic metal compounds.
8. The method of claim 1, wherein the first barrier layer comprises
one or more early transition metal nitrides.
9. The method of claim 1, wherein the first barrier layer comprises
one or more early transition metal oxynitrides.
10. The method of claim 1, wherein the first barrier layer
comprises one or more early transition metal silicon nitrides.
11. The method of claim 1, wherein the first barrier layer
comprises one or more early transition metal silicon nitrides.
12. The method of claim 11, wherein the early transition metal
silicon nitride is TiSi.sub.xN.sub.y.
13. The method of claim 6, wherein the early transition metal
silicon nitride is TaSi.sub.xN.sub.y.
14. The method of claim 6, wherein the early transition metal
nitride is tungsten nitride.
15. The method of claim 6, wherein the early transition metal
nitride is titanium nitride.
16. The method of claim 69, wherein the early transition metal
nitride is tantalum nitride.
17. The method of claim 1, wherein the step of releasing the
microelectromechanical device by removing the first sacrificial
layer further comprises: etching the first sacrificial layer using
isotropic gas-phase etching technique with non-plasma spontaneous
chemical vapor-phase etchant.
18. The method of claim 9, wherein the chemical vapor-phase etchant
is vapor-phase interhalogen.
19. The method of claim 9, wherein the chemical vapor-phase etchant
is vapor-phase noble gas halide.
20. The method of claim 11, wherein the noble gas halide is xenon
difluoride.
21. The method of claim 9, wherein the chemical vapor-phase etchant
is a mixture of noble gas halide and one or more non-etchant
gaseous additives.
22. The method of claim 13, wherein the non-etchant gaseous
addictive is inert gas.
23. The method of claim 2, wherein the second sacrificial material
is amorphous silicon; and wherein the structural layer formed on
the first sacrificial layer is a metal element or a metal
compound.
24. The method of claim 2, wherein the second barrier layer
comprises one or more early transition metal elements.
25. The method of claim 2, wherein the second barrier layer
comprises one or more early transition metal alloys.
26. The method of claim 2, wherein the second barrier layer
comprises one or more early transition metal compounds.
27. The method of claim 18, wherein the early transition metal
compound is early transition metal silicide.
28. The method of claim 2, wherein the removal of the second
sacrificial layer and the second barrier layer is achieved by
etching the second sacrificial layer and the second barrier layer
using isotropic gas-phase etching technique with non-plasma
spontaneous chemical vapor-phase etchant.
29. The method of claim 20, wherein the chemical vapor-phase
etchant is vapor-phase interhalogen.
30. The method of claim 20, wherein the chemical vapor-phase
etchant is vapor-phase noble gas halide.
31. The method of claim 22, wherein the noble gas halide is xenon
difluoride.
32. The method of claim 20, wherein the chemical vapor-phase
etchant is a mixture of noble gas halide and one or more
non-etchant gaseous additives.
33. The method of claim 24, wherein the non-etchant gaseous
addictive is inert gas.
34. The method of claim 5, wherein the second sacrificial material
is amorphous silicon; and wherein the structure layer formed on the
first sacrificial layer is a metal element or a metal compound.
35. The method of claim 5, wherein the second barrier layer
comprises one or more early transition metal silicon nitrides.
36. The method of claim 35, wherein the early transition metal
silicon nitride is TiSi.sub.xN.sub.y.
37. The method of claim 35, wherein the early transition metal
silicon nitride is TaSi.sub.xN.sub.y.
38. The method of claim 3, wherein the second barrier layer
comprises one or more inter-metallic metal compounds.
39. The method of claim 3, wherein the second barrier layer
comprises one or more early transition metal nitrides.
40. The method of claim 3, wherein the second barrier layer
comprise one or more early transition metal oxides.
41. The method of claim 3, wherein the second barrier layer
comprise one or more early transition metal oxynitrides.
42. The method of claim 3, wherein the second barrier layer
comprise one or more early transition metal silicon nitrides.
43. The method of claim 3, wherein the removal of the second
sacrificial layer is achieved by using isotropic gas-phase etching
technique with non-plasma spontaneous chemical vapor-phase
etchant.
44. The method of claim 32, wherein the chemical vapor-phase
etchant is vapor-phase interhalogen.
45. The method of claim 32, wherein the chemical vapor-phase
etchant is vapor-phase noble gas halide.
46. The method of claim 34, wherein the noble gas halide is xenon
difluoride.
47. The method of claim 32, wherein the chemical vapor-phase
etchant is a mixture of noble gas halide and one or more
non-etchant gaseous additives.
48. The method of claim 36, wherein the non-etchant gaseous
addictive is inert gas.
49. The method of claim 3, further comprises: after depositing the
second barrier layer, patterning the deposited second barrier layer
according to the structural layer.
50. The method of claim 2, wherein the microelectromechanical
device is a micromirror device; and the method further comprising:
before depositing the first sacrificial layer, providing a
substrate, on which the first sacrificial layer is deposited;
wherein the step of forming the structure layer of the
microelectromechanical device on the first sacrificial layer
further comprises: depositing the structure layer, wherein the
structure layer has a reflectivity to visible light higher than
ninety percent (90%); and patterning the deposited structural layer
into a micromirror plate of the micromirror device for reflecting
incident visible light; and wherein the one or more structural
layers on the second sacrificial layer are formed into a hinge, to
which the micromirror plate of the micromirror device is attached
such that the micromirror plate can rotate relative to the
substrate after releasing the micromirror device.
51. The method of claim 39, wherein the micromirror device is part
of a micromirror array of a spatial light modulator.
52. The method of claim 40, wherein the spatial light modulator is
part of a display system that further comprises: a light source for
providing visible light; and one or more optical elements for
directing the visible light onto the spatial light modulator.
53. The method of claim 41, wherein the display system further
comprises: one or more optical elements for directing reflected
light from the spatial light modulator onto a display target.
54. The method of claim 3, wherein the microelectromechanical
device is a micromirror device; and the method further comprising:
before depositing the first sacrificial layer, providing a
substrate, on which the first sacrificial layer is deposited;
wherein the step of forming the structure layer of the
microelectromechanical device on the first sacrificial layer
further comprises: depositing the structure layer, wherein the
structure layer has a reflectivity to visible light higher than
ninety percent (90%); and patterning the deposited structural layer
into a micromirror plate of the micromirror device for reflecting
incident visible light; and wherein the one or more structural
layers on the second sacrificial layer are formed into a hinge, to
which the micromirror plate of the micromirror device is attached
such that the micromirror plate can rotate relative to the
substrate after releasing the micromirror device.
55. The method of claim 43, wherein the micromirror device is part
of a micromirror array of a spatial light modulator.
56. The method of claim 43, wherein the spatial light modulator is
part of a display system that further comprises: a light source for
providing visible light; and one or more optical elements for
directing the visible light onto the spatial light modulator.
57. The method of claim 43, wherein the display system further
comprises: one or more optical elements for directing reflected
light from the spatial light modulator onto a display target.
58. The method of claim 43, wherein the substrate is transparent to
visible light.
59. The method of claim 43, wherein the substrate is a silicon
wafer.
60. The method of claim 1, wherein the first barrier layer neither
diffuses into nor interacts with the first structural layer under
400.degree. C. (degree) within 30 minutes.
61. The method of claim 2, wherein the second barrier layer neither
diffuses into nor interacts with the first structural layer under
400.degree. C. (degree) within 30 minutes.
62. The method of claim 3, wherein the second barrier layer neither
diffuses into nor interacts with the first structural layer under
400.degree. C. (degree) within 30 minutes.
63. A method comprising: providing a substrate, on which a first
sacrificial layer with a target thickness can be deposited;
depositing the first sacrificial layer at a thickness less than the
target thickness; measuring a thickness of the deposited first
sacrificial layer; and depositing a second sacrificial layer with a
thickness substantially equal to the difference between the target
thickness and the measured thickness of the deposited first
sacrificial layer.
64. The method of claim 63, wherein the second sacrificial layer is
different from the first sacrificial layer.
65 The method of claim 63 wherein the first sacrificial layer
comprises amorphous silicon.
66 The method of claim 63 wherein the second sacrificial layer
comprises one or more early transition metal elements.
67. The method of claim 63, wherein the second sacrificial layer
comprises one or more early transition metal alloys.
68. The method of claim 63, wherein the second sacrificial layer
comprises one or more early transition metal compounds.
69. The method of claim 63, wherein the second sacrificial layer
comprises one or more inter-metallic compounds.
70. The method of claim 63, wherein the second sacrificial layer
comprises one or more early transition metal nitrides.
71. The method of claim 63, wherein the second sacrificial layer
comprises one or more early transition metal silicides.
72. The method of claim 63, wherein the second sacrificial layer
comprises one or more early transition metal oxides.
73. The method of claim 63, wherein the second sacrificial layer
comprises one or more early transition metal oxynitrides.
74. The method of claim 63, wherein the second sacrificial layer is
removable by isotropic gas-phase etching technique with non-plasma
spontaneous chemical vapor-phase etchant.
75. The method of claim 73, wherein the chemical vapor-phase
etchant is vapor-phase interhalogen.
76. The method of claim 73, wherein the chemical vapor-phase
etchant is vapor-phase noble gas halide.
77. The method of claim 73, wherein the noble gas halide is xenon
difluoride.
78. The method of claim 73, wherein the chemical vapor-phase
etchant is a mixture of noble gas halide and one or more
non-etchant gaseous additives.
79. The method of claim 77, wherein the additives are inert
gases.
80. The method of claim 63, wherein the second sacrificial layer is
not removable by isotropic gas-phase etching technique with
non-plasma spontaneous chemical vapor-phase etchant; and wherein
the first sacrificial layer is removable by the same etching
technique with the same etchant.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This is a continuation of U.S. patent application Ser. No.
10/402,789 to Patel et al. filed Mar. 28, 2003; and a
continuation-in-part of U.S. patent application Ser. No. 10/948,871
to Huibers filed Sep. 24, 2004, which is a continuation of U.S.
patent application Ser. No. 10/748,899 to Huibers filed Dec. 29,
2003 which is a continuation of 10/153,138 to Huibers filed May 20,
2002, which is a divisional application of U.S. patent application
Ser. No. 10/043,703 to Huibers filed on Jan. 9, 2002, (now U.S.
Pat. No. 6,538,800) which is a continuation of U.S. patent
application Ser. No. 09/624,591 to Huibers filed Jul. 24, 2000 (now
U.S. Pat. No. 6,356,378), which is a continuation of U.S. patent
application Ser. No. 09/437,586 to Huibers filed Nov. 9, 1999 (now
U.S. Pat. No. 6,172,797), which is a continuation of U.S. patent
application Ser. No. 09/160,361 to Huibers filed Sep. 24, 1998 (now
U.S. Pat. No. 6,046,840), which is a continuation-in-part of U.S.
patent application Ser. No. 08/665,380 filed on Jun. 18, 1996 (now
U.S. Pat. No. 5,835,256), which claims priority from a U.S.
provisional patent application Ser. No. 60/000,322 filed on Jun.
19, 1995, the subject matter of each being incorporated herein by
reference.
TECHNICAL FIELD OF THE INVENTION
[0002] The present invention is related generally to
microelectromechanical systems, and, more particularly, to
fabricating microelectromechanical systems using barrier layers
SUMMARY OF THE INVENTION
[0003] The present invention provides a method of fabricating
microelectromechanical systems. The method precludes interaction
and diffusion of sacrificial layers with structure layers of
microelectromechanical systems by depositing selected barrier
materials between structure and sacrificial layers. The barrier
materials can be either removed along with the sacrificial
materials during the releasing process or kept along with the
structure layers of the system after releasing.
[0004] In an embodiment of the invention, a method is disclosed.
The method comprises: depositing a first sacrificial layer;
depositing a first barrier layer after the first sacrificial layer;
forming a structural layer of a microelectromechanical device after
the first barrier layer; releasing the microelectromechanical
device by removing the first sacrificial layer and the first
barrier layer; and wherein the first barrier layer prevents
diffusion and reaction between the first sacrificial layer and the
structural layer.
[0005] As a feature of the embodiment, the method further
comprises: before releasing the microelectromechanical device by
removing the first sacrificial layer and the first barrier layer,
depositing a second barrier layer after the structural layer formed
on the first barrier layer; depositing a second sacrificial layer
after the second barrier layer; forming one or more structure
layers of the microelectromechanical device after the second
sacrificial layer; and wherein the second barrier layer prevents
diffusion and interaction between the second sacrificial layer and
the structural layer formed underneath the second barrier layer;
and wherein the step of releasing the microelectromechanical device
by removing the first sacrificial layer and the first barrier layer
further comprises: removing the second sacrificial layer and the
second barrier layer.
[0006] As another feature of the embodiment, the method further
comprises: before releasing the microelectromechanical device by
removing the first sacrificial layer and the first barrier layer,
depositing a second barrier layer after the structural layer formed
on the first barrier layer; depositing a second sacrificial layer
after the second barrier layer; forming one or more structural
layers of the microelectromechanical device after the second
sacrificial layer; and wherein the second barrier layer prevents
diffusion and interaction between the second sacrificial layer and
the structure layer formed underneath the second barrier layer; and
wherein the step of releasing the microelectromechanical device by
removing the first sacrificial layer and the first barrier layer
further comprises: removing the second sacrificial layer; and
wherein the second barrier layer is not removed after releasing the
microelectromechanical device.
[0007] In another embodiment of the invention, a method is
disclosed herein. The method comprises: depositing a first
sacrificial layer; depositing a first barrier layer after the first
sacrificial layer; patterning the first barrier layer; forming a
structural layer of a microelectromechanical device after the
patterned first barrier layer; releasing the microelectromechanical
device by removing the first sacrificial layer; and wherein the
first barrier layer prevents diffusion and reaction between the
first sacrificial layer and the structural layer, and the first
barrier layer is not removed after releasing the
microelectromechanical device.
[0008] As a feature of the embodiment, the method of said
embodiment of the invention further comprises: before releasing the
microelectromechanical device by removing the first sacrificial
layer, depositing a second barrier layer after the structural layer
formed on the first barrier layer; depositing a second sacrificial
layer after the second barrier layer; forming one or more structure
layers of the microelectromechanical device after the second
sacrificial layer; and wherein the second barrier layer prevents
diffusion and interaction between the second sacrificial layer and
the structural layer formed underneath the second barrier layer;
and wherein the step of releasing the microelectromechanical device
by removing the first sacrificial layer further comprises: removing
the second sacrificial layer and the second barrier layer.
[0009] As another feature of the embodiment, the method of said
embodiment of the invention further comprises: before releasing the
microelectromechanical device by removing the first sacrificial
layer, depositing a second barrier layer after the structural layer
formed on the first barrier layer; depositing a second sacrificial
layer after the second barrier layer; forming one or more
structural layers of the microelectromechanical device after the
second sacrificial layer; and wherein the second barrier layer
prevents diffusion and interaction between the second sacrificial
layer and the structure layer formed underneath the second barrier
layer; and wherein the step of releasing the microelectromechanical
device by removing the first sacrificial layer further comprises:
removing the second sacrificial layer; and wherein the second
barrier layer is not removed after releasing the
microelectromechanical device.
[0010] In further embodiment of the invention, a method is
disclosed herein. The method comprises: providing a substrate, on
which a first sacrificial layer with a target thickness can be
deposited; depositing the first sacrificial layer at a thickness
less than the target thickness; measuring a thickness of the
deposited first sacrificial layer; and depositing a second
sacrificial layer with a thickness substantially equal to the
difference between the target thickness and the measured thickness
of the deposited first sacrificial layer.
BRIEF DESCRIPTION OF DRAWINGS
[0011] While the appended claims set forth the features of the
present invention with particularity, the invention, together with
its objects and advantages, may be best understood from the
following detailed description taken in conjunction with the
accompanying drawings of which:
[0012] FIG. 1 is a cross-sectional view of a structure illustrating
a barrier layer formed between a structural layer of a
microelectromechanical device and a sacrificial layer according to
an embodiment of the invention;
[0013] FIG. 2a is a cross-sectional view of a structure
illustrating a barrier layer formed between a structural layer of a
microelectromechanical device and a sacrificial layer according to
another embodiment of the invention;
[0014] FIG. 2b is a cross-sectional view of a structure
illustrating a barrier layer formed between a structural layer of a
microelectromechanical device and a sacrificial layer according to
yet another embodiment of the invention;
[0015] FIG. 3 is a cross-sectional view of a structure illustrating
a barrier layer formed between a structural layer of a
microelectromechanical device and a sacrificial layer according to
a further embodiment of the invention;
[0016] FIG. 4a is a cross-sectional view of a structure
illustrating two barrier layers formed between a structural layer
of a microelectromechanical device and two sacrificial layers
according to yet another embodiment of the invention;
[0017] FIG. 4b is a cross-sectional view of a structure
illustrating two barrier layers formed between a structural layer
of a microelectromechanical device and two sacrificial layers
according to still yet another embodiment of the invention;
[0018] FIG. 5 is a cross-sectional view of a structural
illustrating a barrier layer deposited on a sacrificial layer for
compensating the decrease of the sacrificial layer after
deposition;
[0019] FIG. 6 is diagram illustrating an exemplary display system
employing a spatial light modulator;
[0020] FIG. 7 is a cross-sectional view of a portion of the spatial
light modulator used in the display system of FIG. 6 and a portion
of an array of micro-mirrors comprised in the spatial light
modulator;
[0021] FIG. 8a is a cross-sectional views of a micromirror device
of FIG. 7 before patterning the hinge layers during an exemplary
fabrication process;
[0022] FIG. 8b is a cross-sectional view of FIG. 8a after
patterning the hinge layers;
[0023] FIG. 9 is the cross-sectional view of FIG. 8b after removing
the sacrificial and barrier layers;
[0024] FIG. 10a shows an exemplary micromirror device after
releasing;
[0025] FIG. 10b presents an exemplary micromirror array comprising
a plurality of micromirrors of FIG. 10a;
[0026] FIG. 11a is a back-view of another exemplary micromirror
device after releasing;
[0027] FIG. 11b is a back-view of a micromirror array comprising a
plurality of micromirrors of FIG. 11a;
[0028] FIG. 12 is a diagram showing an exemplary etching system
used in the embodiments of the invention;
[0029] FIG. 13 is a diagram showing another exemplary etching
system used in the embodiments of the invention;
[0030] FIG. 14a is a side elevation view of an exemplary
reciprocating pump for use in the exemplary etching system of FIG.
13;
[0031] FIG. 14b is a pump flow diagram of the reciprocating pump of
FIG. 14a together with associated flow lines and shutoff valves;
and
[0032] FIG. 15 is another exemplary etching system used in the
embodiments of the present invention.
DETAILED DESCRIPTION OF THE EMBODIMENTS
[0033] The present invention provides a barrier layer that
comprises selected barrier material(s) between a structure layer of
the microelectromechanical device and a sacrificial layer during
fabrication process. The barrier layer prevents diffusion and
interaction between the sacrificial layer and the structure layer.
The material for the barrier layer is selected depending upon
detailed fabrication process. Specifically, the barrier material
can be selected such that the barrier layer is removed with the
sacrificial layer after releasing the microelectromechanical
device. Alternatively, the barrier material can be such one that
the barrier layer is not removed with the sacrificial layer after
releasing.
[0034] As a feature of the embodiment, a barrier layer is deposited
on a deposited sacrificial layer for compensating the deposition
thickness inaccuracy of the deposited sacrificial layer.
[0035] In an embodiment of the invention, a barrier layer is
deposited between a sacrificial layer and a structure layer of a
microelectromechanical device, as shown in FIG. 1. Referring to
FIG. 1, layer 132 is a sacrificial layer deposited on substrate 120
for building desired structures of a microelectromechanical (MEMS)
device during a fabrication process, and layer 136 is a structure
layer of the device. If the structure layer 136 is directly
deposited on the sacrificial layer 132, the material of the
structural layer may sometimes diffuse into the sacrificial layer
and/or interact with the material of the sacrificial layer, or vice
versa. Such diffusion and interaction can deteriorate desired
properties of the structure layer and expected performances of the
MEMS device. In order to prevent such diffusion and interaction,
barrier layer 134 is provide between the sacrificial layer and the
structure layer. Preferably, the barrier layer is deposited on the
sacrificial layer, and the structure layer is deposited on the
barrier layer, as shown in the figure. In the preferred embodiment
of the invention, the barrier layer comprises one or more barrier
materials that are different from the sacrificial layer 132.
[0036] A preferred barrier layer is a layer that, in addition to
preventing diffusion and interaction between the sacrificial and
structure layers, there is substantially no diffusion and
interaction between the two layers (e.g. the barrier layer and the
given structure layer). By "no diffusion between two layers", it is
meant that no material from a first layer diffuses into a second
layer, and no material from the second layer diffuses into the
first layer. Moreover, the ideal barrier layer is a layer that
substantially has no interaction and diffusion between the barrier
layer and the sacrificial layer. Otherwise, the residue(s) of the
interaction or diffusion of between the barrier layer and the
sacrificial layer may not be removable with the sacrificial layer.
Such ideal materials, however, may not be promptly available for
many currently used structure materials, such as aluminum,
especially when the non-diffusion and non-interaction property
requirements is to be balanced with other requirements on, for
example, electrical and/or mechanical properties of the barrier
layer. Other materials that neither diffuse into nor interact with
the structure layer during a certain time period (e.g. time elapsed
from the deposition of the structural layer and to the removal of
the sacrificial layer) under a certain temperature (e.g. highest
temperature during the fabrication time period) are also preferred
because the deterioration resulting from the diffusion and
interaction may only happen during the fabrication process and
above certain processing temperatures. Furthermore, it is preferred
that there is substantially no interaction or diffusion between the
barrier layer and the sacrificial layer within the certain time
period and under the certain temperature. Alternatively, another
layer that is different from the sacrificial layer and the barrier
layer (not shown) can be deposited between the barrier layer and
the sacrificial layer. After structure layer 136, another
sacrificial layer 138 may be deposited for forming other structure
layers of the MEMS device. According to the embodiment, barrier
layer 134 is removed with the sacrificial layers. It is worthwhile
to point out that barrier layer can be removed along with the
sacrificial layer using one etching step. In this case, the barrier
material for the barrier layer is removable in the etching process
(and the etchant) that is selected for removing the sacrificial
layer. Alternatively, the barrier layer and the sacrificial layer
can be removed using separate etching steps, but not necessarily in
this order.
[0037] As an aspect of the embodiment, a second barrier layer 142
is deposited after structure layer 136, as shown in FIG. 2a.
Preferably, the second barrier layer is deposited on the structure
layer and covers the structure layer, including the vertical edges
of the structure layer. By doing so, possibilities of diffusion and
interaction between the edges of the structure layer and the
sacrificial layer are eliminated. It is further preferred that the
second barrier layer is provided when the second sacrificial layer
needs to be deposited. Second barrier layer 142 can be used without
second sacrificial layer 138, such as when there is a time period
lag between depositing the layers and later (e.g. at a different
location), releasing the MEMS device. In this case, these layers
act as a protecting film in the interim. Similar to layer 134, the
second barrier layer prevents diffusion and interaction between
structure layer 136 and the second sacrificial layer 138, if
present. Layer 142 is preferably a layer that there is
substantially no diffusion and interaction, or substantially no
diffusion and interaction within a certain time period (e.g.
fabrication duration) and under a certain temperature (e.g. the
highest temperature during fabrication) between structure layer 136
and barrier layer 142. In the aspect of the invention, the second
barrier layer 142 is removed with sacrificial layers 132 and 138.
Similar to barrier layer 134, barrier layer 142 can be removed
along with the sacrificial layers using one etching step.
Alternatively, the second barrier layer can be removed by a
separate etching step from that for sacrificial layers.
[0038] In another embodiment of the invention, different from the
removable first barrier layer 134, the second barrier layer 142 is
not removed after releasing, as shown in FIG. 2b. Specifically, the
second sacrificial layer 142 may be patterned according to the
structure layer and remains with structure layer 136 after
releasing. Particularly, the patterned barrier layer covers, in
addition to the surfaces of the structure layer, the vertical edges
of the structure layer. In this case, the second barrier layer
comprises a different barrier material from that of the first
barrier layer. And the barrier material for the second barrier
layer is not removable using the etching method(s) selected for
removing the sacrificial layers and the first barrier layer, either
in one etching step or in separate etching steps.
[0039] According to yet another embodiment of the invention, a
first barrier layer 140 is deposited between the structure layer
and the first sacrificial layer for preventing the diffusion and
interaction between the first sacrificial layer 132 and structure
layer 136, as shown in FIG. 3. Referring to FIG. 3, similar to
barrier layer 134, barrier layer 140 neither interacts with nor
diffuses into structure layer 136, or barrier layer 140 neither
interacts with nor diffuses into structure layer 136 within a
certain time period (e.g. fabrication duration) and under a certain
temperature (e.g. the highest temperature in fabrication process).
Unlike the first barrier layer 134 in FIG. 1, the first barrier
layer 140 is not removed after releasing the microelectromechanical
device by removing the sacrificial layers. Instead, the first
barrier layer 140 is patterned after its deposition according to
the structure layer formed thereon afterwards and remains after the
releasing. In this case, the material of the first barrier layer
140 is not removable using the etching method selected for removing
the sacrificial layer 132. After the formation of structure layer
136, a second sacrificial layer 138 may be deposited as appropriate
for forming other structure layers of the microelectromechanical
device.
[0040] As an aspect of the embodiment, a second barrier layer 142
may be deposited on the formed structure layer 136, as shown in
FIG. 4a. The second barrier layer 136 is provided for preventing
the diffusion and interaction between structure layer 136 and the
second sacrificial layer 138. It is preferred that the second
barrier 142 neither interacts with nor diffuses into structure
layer 136, or neither interacts with not diffuses into structure
layer 136 within a certain time period (e.g. fabrication duration)
and under a certain temperature (e.g. the highest temperature in
the fabrication process). The same as the first barrier layer 134,
the second barrier layer 142 is patterned according to structure
layer 136 and remains after the releasing. That is, the barrier
material of the second barrier layer is not removable using the
etching method (including the etchant) selected for removing the
sacrificial layers (132 and 138). Preferably, the patterned barrier
layer also covers, in addition to the surfaces of the structure
layer, the vertical edges of the structure layer. Of course, the
barrier material of the second barrier layer 142 is not necessarily
the same as that of the first barrier layer 134.
[0041] According to a further embodiment of the invention, the
second barrier layer 142 is removed along with the sacrificial
layers after releasing, as shown in FIG. 4b. Specifically, the
second barrier layer is deposited on the structure layer. The
deposited second barrier layer covers, in addition to the surfaces
of the structure layer, the vertical edges of the structure layer.
The second barrier layer is preferably a material that neither
interacts with not diffuses into structure layer 136, or neither
interacts with not diffuses into structure layer 136 within a
certain time period (e.g. fabrication duration) and under a certain
temperature (e.g. the highest temperature in the fabrication
process), but it is removable using the etching method (including
the etchant) selected for removing the sacrificial layers.
Alternatively, the second barrier layer can be removed at a
separate etching step than that for the sacrificial layers. The
samples above where two sacrificial layers are deposited can be
where a micromirror plate 136 is on one sacrificial layer, and
hinges are formed on the second sacrificial layer, such as will be
described in reference to FIG. 8a and FIG. 8b.
[0042] Alternatively, a barrier layer can be applied to compensate
the deposition thickness inaccuracy of a deposited sacrificial
layer. Referring to FIG. 5, sacrificial layer 132 with a total
target thickness, represented by H, is desired on substrate 144
during a fabrication process for a microelectromechanical device
(not shown). After deposition, the thickness of the deposited
sacrificial layer is H', which is smaller than the target thickness
H (H'<H). This deposited thickness can be lower for many
reasons. For example, it can be deliberately lower. It can also be
lower due to process variations. In order to compensate this
reduced thickness, barrier layer 146 is deposited on the
sacrificial layer after measuring the thickness of the deposited
sacrificial layer. Barrier layer 146 can be removed with layer 132
or separately from layer 132.
[0043] As an exemplary implementation of the embodiments of the
present invention, a fabrication process for a micromirror device
used in display systems will be discussed in the following. It will
be understood by those skills in the art that the following
discussion of the fabrication process is for demonstration
purposely. It should not by any means be interpreted as a
limitation. Instead, other suitable fabrication processes, such as
those set forth in U.S. Pat. Nos. 5,835,256 and 6,046,840 both to
Huibers, and U.S. patent application Ser. No. 10/366,297 filed on
Feb. 12, 2003 to Patel, the subject matter of each being
incorporated herein by reference, are also applicable. U.S. patent
applications Ser. No. 09/910,537 filed Jul. 20, 2001, and
06/300,533 filed Jun. 22, 2001 both to Reid contain examples of
materials that may be used for the various components of the
current invention. These applications are incorporated herein by
reference.
[0044] Referring to FIG. 6, a typical display system employing a
spatial light modulator that comprises a plurality of micromirror
devices is illustrated in FIG. 1. In its very basic configuration,
the display system comprises light source 102, optical devices
(e.g. light pipe 104, lens 106 and 108), color wheel 103, display
target 112 and spatial light modulator 110. Light source 102 (e.g.
an arc lamp) directs incident light through the color wheel and
optical devices (e.g. light pipe 104 and object lens 106) and
shines on spatial light modulator 110. Spatial light modulator 110
selectively reflects the incident light toward optical device 108
and results in an image on display target 112. The display system
can be operated in many ways, such as those set forth in U.S. Pat.
No. 6,388,661, and U.S. patent application Ser. No. 10/340,162,
filed on Jan. 10, 2003, both to Richards, the subject matter of
each being incorporated herein by reference.
[0045] In another exemplary display system (not shown), light
source 102, optical elements 104, 106 and 108, and display target
112, as shown in FIG. 6, are provided, while color wheel 103 is
removed. In this display system, three spatial light modulators are
provided with each spatial light modulator being designated for
modulating one of the three primary colors. Specifically, incident
light from the light source is split, for example by a prism, into
green, blue and red light. Each light impinges one of the three
spatial light modulators and is modulated. The modulated light from
all three spatial light modulators are then mapped onto the display
target properly for displaying color images.
[0046] In either display systems, the spatial light modulator of
the system generally comprises an array of thousands or millions of
micro-mirrors, a portion of a cross-sectional view of which is
illustrated in FIG. 7. Referring to FIG. 7, an array of
micromirrors (e.g. micromirrors 122) is formed on a substrate 120,
such as glass that is transparent to visible light. Substrate 124,
which comprises an array of electrodes (e.g. electrode 126) and
circuitry (not shown), is placed proximate to the array of
micromirrors for electrostatically controlling the motion of the
micromirrors. In operation, each individual micromirror can be
deformed as desired under the control of one or more electrodes and
circuitry; thereby the spatial modulation of the incident light
traveling through substrate 120 and shining on the surfaces of the
micromirrors can be achieved.
[0047] The micromirror devices, such as micromirror device 130 can
be fabricated in many ways, such as those set forth in U.S. Pat.
Nos. 5,835,256 and 6,046,840 both to Huibers, and U.S. patent
application Ser. No. 10/366,297 filed on Feb. 12, 2003 to Patel. An
exemplary fabrication method according to embodiments of the
present invention will be discussed in the following with
references to FIG. 8a through FIG. 9.
[0048] Referring to FIG. 8a, substrate 120 is provided. First
sacrificial layer 132 is deposited on the substrate followed by a
deposition of a first barrier layer 134, on which micromirror plate
layer 136 is deposited thereafter. The substrate can be a glass
(e.g. 1737F, Eagle 2000), quartz, Pyrex.TM., sapphire etc. The
substrate may also be a semiconductor substrate (e.g. silicon
substrate) with one or more actuation electrodes and/or control
circuitry (e.g. CMOS type DRAM) formed thereon. First sacrificial
layer 132 may be any suitable material, such as amorphous silicon,
depending upon the structural materials selected to be resistant to
the etchant, and the etchant selected. If the first sacrificial
layer is amorphous silicon, it can be deposited at 300-350.degree.
C. The thickness of the first sacrificial layer can be wide ranging
depending upon the micromirror size and desired titled angle of the
micromirror plate, though a thickness of from 500 .ANG. to 50,000
.ANG., preferably around 10,000 .ANG., is preferred. The first
sacrificial layer may be deposited on the substrate using any
suitable method, such as LPCVD or PECVD.
[0049] After depositing the first sacrificial layer, micromirror
plate layer 136 for a micromirror plate is going to be deposited.
Because the micromirror plate is designated for reflecting incident
light in the spectrum of interest (e.g. visible light spectrum), it
is preferred that the micro-mirror plate layer comprises of one or
more materials that exhibit high reflectivity (preferably 90% or
higher) to the incident light. Examples of such materials are Al,
Ti, Ag, AlSi.sub.xCu.sub.y, AlTi.sub.x or AlSi.sub.x. Of course,
other suitable materials having high reflectivity to the incident
light of interest may also be adopted for the micro-mirror plate.
The materials, such as Al, for the micromirror plate layer,
however, diffuse into and/or interact with the sacrificial layer,
such as an amorphous silicon layer. The diffusion and interaction
certainly deteriorate the expected property of the micromirror
plate and desired performance of the micromirror device.
Specifically, the diffusion and interaction may create defects on
the micromirror device. In order to prevent such diffusion and
interaction, first barrier layer 134 that will be removed with the
sacrificial layers afterwards is deposited between sacrificial
layer 132 and micromirror plate layer 136. It is preferred that
there is substantially no interaction or diffusion between the
barrier layer and the micromirror plate, or substantially no
interaction or diffusion between the barrier layer and the
micromirror plate within the fabrication time period, such as 30
minutes, and under 400.degree. C. (degree), which is the highest
temperature during the fabrication time period. It is further
preferred that there is substantially no interaction or diffusion
between the barrier layer and the sacrificial layer, or
substantially no interaction or diffusion between the barrier layer
and the sacrificial layer within the certain time period and under
the certain temperature. Exemplary barrier materials for the
barrier layer are early transition metal elements (e.g. W, Ti, Ta
and Mo), early transition metal alloys (e.g. WTi.sub.x, WMo.sub.x,
and WTa.sub.x), early transition metal compounds (e.g. WAl.sub.x)
including early transition metal silicides (e.g. WSi.sub.x,
MoSi.sub.x, TiSi.sub.x, ZrSi.sub.x, CrSi.sub.x, TaSi.sub.x and
TiW.sub.xSi.sub.y). Other early transition metal silicide, such as
CoSi.sub.x, is also applicable. The early transition metals are
those elements in the periodic table in columns 3 through 7, namely
columns beginning with Sc, Ti, V, Cr, and Mn. Preferred are those
elements in columns 4 through 6 (i.e. Ti, Zr, Hf, V, Nb, Ta, Cr, Mo
and W). Of course, other suitable barrier materials that prevent
the diffusion and interaction between the micromirror plate and the
first sacrificial layer and are removable with the sacrificial
layer are also applicable.
[0050] After the first barrier layer 134, micromirror plate layer
136 is deposited thereon for forming a micromirror plate of the
micromirror device (e.g. micromirror device 130 in FIG. 7). In
depositing the micro-mirror plate layer, PVD is preferably used.
The thickness of the micro-mirror plate layer can be wide ranging
depending upon many factors, such as desired mechanical (e.g.
stiffness and strength) and electronic (e.g. conductivity)
properties, the size, desired rotation angle of the micro-mirror
plate and the properties of the materials selected for the
micromirror plate. According to the invention, a thickness of from
500 .ANG. to 50,000 .ANG., preferably around 2500 .ANG., is
preferred. If the micromirror plate layer comprises aluminum, it is
preferred to be deposited at 150.degree. C. to 300.degree. C. or
other temperatures preferably less than 400.degree. C.
[0051] Micromirror plate layer 136 is then patterned into a desired
shape, an example of which is illustrated in FIG. 10a. Though
preferred, it would be appreciated by those ordinary skilled in the
arts that this particular example of micromirror shape is a
selection from a variety of optional choices of mirror shapes and
is for demonstration purpose only. It should not be interpreted as
a limitation. Instead, the micro-mirror plate can be of any desired
shape. The patterning of the micro-mirror plate can be achieved
using the standard photoresist patterning followed by etching
using, for example CF.sub.4, Cl.sub.2, or other suitable etchant
depending upon the specific material of the micromirror plate.
[0052] After the formation of the micro-mirror plate, second
barrier layer 142 is deposited followed by deposition of second
sacrificial layer 138 for forming other structures, such as hinge
152 in FIG. 10a, of the micromirror device. Similar to the first
barrier layer 134, the second barrier layer 142 is deposited for
preventing diffusion and interaction between micromirror plate 136
and second sacrificial layer 138, and it will be removed along with
the sacrificial layers afterwards. The same as first barrier layer
134, second barrier layer is preferably is layer that neither
interact with nor diffuses into micromirror plate 136. Exemplary
barrier materials for the second barrier layer can be the same as
those in reference to first barrier layer 134. Though preferably
the same, the material for the second barrier layer may not be the
same as that for the first barrier layer.
[0053] After the second barrier layer, second sacrificial layer 138
is deposited and patterned according to the desired configuration
of the hinge structure. Second sacrificial layer 138 may comprise
amorphous silicon, or could alternatively comprise one or more of
the various materials mentioned above in reference to first
sacrificial layer 132. First and second sacrificial layers need not
be the same, though are the same in the preferred embodiment such
that the etching process for removing these sacrificial layers can
be greatly simplified. Similar to the first sacrificial layer,
second sacrificial layer 138 may be deposited using any suitable
method, such as LPCVD or PECVD. If the second sacrificial layer
comprises amorphous silicon, the layer can be deposited around
350.degree. C. The thickness of the second sacrificial layer can be
on the order of 10000 .ANG., but may be adjusted to any reasonable
thickness, such as between 2000 .ANG. and 20,000 .ANG. depending
upon the desired distance (in the direction perpendicular to the
micromirror plate and the substrate) between the micromirror plate
and the hinge. Second sacrificial layer 138 may also fill in the
trenches left from the patterning of the micromirror plate.
[0054] The deposited sacrificial layers and barrier layers are then
patterned for forming two deep-via areas 143 and shallow via area
144 using standard lithography technique followed by etching. The
etching step may be performed using Cl.sub.2, BCl.sub.3, or other
suitable etchant depending upon the specific material(s) of the
second sacrificial layer. The distance across the two deep-via
areas 150 depends upon the side-to-side distance of the
micro-mirror plate. In an embodiment of the invention, the distance
across the two deep-via areas after the patterning is preferably
around 10 .mu.m, but can be any suitable distance as desired. In
order to form shallow-via area 144, an etching step using CF.sub.4
or other suitable etchant may be executed. The shallow-via area,
which can be of any suitable size, is preferably on the order of
2.2 .mu.m.
[0055] In order to form the desired deep-via area 143 profiles as
shown, a via-mask and partial sacrificial layer etching are
applied. According to an embodiment of the invention, the wider
region of each deep-via area 143 is on the order of 1.0 to 2.0 um,
preferably 1.4 um, and the smaller region is on the order of 0.5 to
1.5 um, preferably 1.0 um. Of course, other dimensions are possible
depending upon the final size and shape of the micro-mirror plate.
Alternatively, the deep-via areas may reach through first
sacrificial layer 132 and may reach from 500 .ANG. to 2000 .ANG.
into substrate 120. As discussed above, the deep-via areas are
formed in two etching steps. By doing so, the effect of resist
erosion may be reduced, and step coverage of SiN.sub.x in the
subsequent deep-via fill deposition may be improved. However, a
single etching step can also be used.
[0056] After patterning the sacrificial and barrier layers, one or
more hinge structure layers (e.g. 148) are deposited for forming a
hinge support. During the deposition, layer 148 fills the formed
deep-via areas and shallow-via area. Because the hinge structure
layer is designated to form the posts (e.g. 153 in FIG. 10a) for
holding the hinge (e.g. 253 in FIG. 10a) and the micromirror plate
(e.g. 136 in FIG. 10a) attached thereto such that the micromirror
plate can rotate relative to the substrate by the hinge, it is
desired that the hinge structure layer comprise materials having a
sufficiently large elastic modulus. According to an embodiment of
the invention, layer 148 comprises a 300 .ANG. thickness of
TiN.sub.x layer deposited by PVD, and a 3500 .ANG. thickness of
SiN.sub.x layer deposited by PECVD. Of course, other suitable
methods of deposition may be used, such as LPCVD or sputtering. Of
course, other suitable materials, such as CoSiN.sub.x, TiSiN.sub.x
and/or TiO.sub.x may also be used for the hinge structure.
[0057] After the deposition, the hinge structure layer is patterned
for forming two posts 150 and contact (not shown) by etching using
one or more proper etchants. In particular, the layers can be
etched with a chlorine chemistry or a fluorine chemistry where the
etchant is a perfluorocarbon or hydrofluorocarbon (or SF.sub.6)
that is energized so as to selectively etch the hinge layers both
chemically and physically (e.g. a plasma/RIE etch with CF.sub.4,
CHF.sub.3, C.sub.3F.sub.8, CH.sub.2F.sub.2, C.sub.2F.sub.6,
SF.sub.6, etc. or more likely combinations of the above or with
additional gases, such as CF.sub.4/H.sub.2, SF.sub.6/Cl.sub.2, or
gases using more than one etching species such as CF.sub.2Cl.sub.2,
all possibly with one or more optional inert diluents). Different
etchants may, of course, be employed for etching each hinge layer
(e.g. chlorine chemistry for a metal layer, hydrocarbon or
fluorocarbon (or SF.sub.6) plasma for silicon or silicon compound
layers, etc.).
[0058] After the patterning of the hinge structure layer, hinge
layer 151 is deposited and then patterned as shown in FIG. 8b.
Because the hinge deforms with the micromirror plate rotating, it
is expected that the hinge is more compliant. Furthermore, when the
hinge is also used as electric conducting media for the
micro-mirror plate, it is further expected that the hinge is
electrically conductive. Examples of suitable materials for the
hinge layer are silicon nitride, silicon carbide, polysilicon, Al,
Ir, titanium, titanium nitride, titanium oxide(s), titanium
carbide, CoSi.sub.xN.sub.y, TiSi.sub.xN.sub.y, TaSi.sub.xN.sub.y,
or other ternary and higher compounds. When titanium is selected
for the hinge layer, it can be deposited at 100.degree. C. to
400.degree. C. Other ternary compositions, such as set forth in
U.S. patent application Ser. Nos. 09/910,537 to Reid filed Jul. 20,
2001 and 10/198,389 to Reid, filed Jul. 16, 2002, each incorporated
herein by reference, are also applicable. Alternatively, the hinge
can be a multilayered structure, such as those disclosed in U.S.
patent application Ser. No. 10/366,297 filed on Feb. 12, 2003 to
Patel, the subject matter of which being incorporated herein by
reference.
[0059] After deposition, the hinge layer is patterned and etched.
Similar to the hinge structure layer (layer 148), the hinge layer
can be etched with a chlorine chemistry or a fluorine chemistry
where the etchant is a perfluorocarbon or hydrofluorocarbon (or
SF.sub.6) that is energized so as to selectively etch the hinge
layers both chemically and physically (e.g. a plasma/RIE etch with
CF.sub.4, CHF.sub.3, C.sub.3F.sub.8, CH.sub.2F.sub.2,
C.sub.2F.sub.6, SF.sub.6, etc. or more likely combinations of the
above or with additional gases, such as CF.sub.4/H.sub.2,
SF.sub.6/Cl.sub.2, or gases using more than one etching species
such as CF.sub.2Cl.sub.2, all possibly with one or more optional
inert diluents). Different etchants may, of course, be employed for
etching the hinge layer (e.g. chlorine chemistry for a metal layer,
hydrocarbon or fluorocarbon (or SF.sub.6) plasma for silicon or
silicon compound layers, etc.).
[0060] Finally, the sacrificial layers (132 and 138) and the
barrier layers (134 and 142) are removed using etching so as to
release micromirror device 130, which will be discussed as
afterwards.
[0061] The above exemplary fabrication process is illustrated with
reference to the two barrier layers being removable with the
sacrificial layers after releasing. According to another embodiment
of the invention, first barrier layer 136 is removable after
releasing, while second barrier layer 142 is non-removable after
releasing. In this case, the second barrier layer is patterned
according to the micromirror plate after its deposition and before
depositing second sacrificial layer 138. As a result, the patterned
second barrier layer remains after releasing the micromirror
device. This remained patterned barrier layer can be used for
protecting the micromirror plate in operation. Because unlike the
removable first barrier layer 134, the second barrier layer is not
removable after releasing, it comprises different barrier
material(s) from the first barrier layer. Exemplary barrier
materials for the second barrier layer are inter-metallic metal
compounds, early transition metal nitrides (e.g. WN.sub.x,
TiN.sub.x, TaN.sub.x and AlTi.sub.xN.sub.y), early transition metal
oxides, early transition metal oxynitrides (e.g. TaO.sub.xN.sub.y
and TiO.sub.xN.sub.y), and early transition metal carbides.
Alternatively, the barrier layer can be an early transition metal
silicon nitride, such as WSi.sub.xN.sub.y, TiSi.sub.xN.sub.y or
TaSi.sub.xN.sub.y. Other suitable materials, such as those
materials for the structures (comprising, the micromirror plate,
the hinge and the hinge structure) of the micromirror device, are
also applicable for the non-removable barrier layer.
[0062] According to yet another embodiment of the invention, the
first barrier layer (e.g. layer 134) is non-removable, while the
second barrier layer (e.g. layer 142) is removable with the
sacrificial layers after releasing. In this case, first barrier
layer 134 is patterned along with the structure layer 136 or before
depositing micromirror plate layer 136. Exemplary barrier materials
for the first barrier layer are inter-metallic metal compounds,
early transition metal nitrides (e.g. WN.sub.x, TiN.sub.x,
TaN.sub.x and AlTi.sub.xN.sub.y), early transition metal oxides,
early transition metal oxynitrides, and early transition metal
carbides. Alternatively, the barrier layer can be an early
transition metal silicon nitride, such as WSi.sub.xN.sub.y,
TiSi.sub.xN.sub.y or TaSi.sub.xN.sub.y. And exemplary barrier
materials for the second barrier layer are early transition metal
elements (e.g. W, Ti, Ta and Mo), early transition metal alloys
(e.g. WTi, WTa, WMo and MoTi), early transition metal compounds,
early transition metal silicides (e.g. WSi.sub.x, MoSi.sub.x,
TiSi.sub.x, ZrSi.sub.x, CrSi.sub.x, TaSi.sub.x and
TiW.sub.xSi.sub.y), early transition metal oxides and proper early
transition metal oxynitrides. Other suitable materials, such as
those materials for the structures (e.g. the hinge and the hinge
structure) of the micromirror device, are also applicable for the
non-removable barrier layer.
[0063] According to a further embodiment of the invention, both the
first and second barrier layers are not removable after releasing.
In this case, first barrier layer 134 is patterned preferably along
with structure layer 136 or before depositing micromirror plate
layer 136. And second barrier layer 142 is patterned preferably
according to the structure of the micromirror plate (e.g. 136)
after its deposition and before depositing second sacrificial layer
138. Exemplary barrier materials for both first and second barrier
layers are inter-metallic metal compounds, early transition metal
nitrides (e.g. WN.sub.x, TiN.sub.x, TaN.sub.x and
AlTi.sub.xN.sub.y), early transition metal oxides, early transition
metal oxynitrides, early transition metal carbides and early
transition metal silicon nitrides.
[0064] The method of the present invention can be applied in
fabricating a variety of micromirror devices, one of which is shown
in FIG. 10a. Other micromirror devices, such as the micromirror
device in FIG. 11a, can also be fabricated using the method
disclosed in the presented invention. As seen in FIG. 11a,
micromirror device 160 comprises hinge structure 154 and
micromirror plate 156, and other features such as those described
in U.S. patent application Ser. No. 10/366,297 filed on Feb. 12,
2003 to Patel, the subject matter of which being incorporated
herein by reference. The released micromirror devices, such as
those in FIG. 10a and FIG. 11a can be used in micromirror arrays,
as shown in FIG. 10b and FIG. 11b. The micromirror arrays may be
employed by spatial light modulators, such as that in FIG. 7, which
is used in a display system, such as shown in FIG. 6.
[0065] Releasing Process
[0066] The release etch utilizes an etchant gas capable of
spontaneous chemical etching of the sacrificial material,
preferably isotropic etching that chemically (and not physically)
removes the sacrificial material. Such chemical etching and
apparatus for performing such chemical etching are disclosed in
U.S. patent application Ser. No. 09/427,841 to Patel et al. filed
Oct. 26, 1999, and in U.S. patent application Ser. No. 09/649,569
to Patel at al. filed Aug. 28, 2000, the subject matter of each
being incorporated herein by reference. Preferred etchants for the
release etch are spontaneous chemical vapor phase fluoride etchants
that, except for the optional application of temperature, are not
energized. Examples include HF gas, noble gas halides such as xenon
difluoride, and interhalogens such as IF.sub.5, BrCl.sub.3,
BrF.sub.3, IF.sub.7 and ClF.sub.3. The release etch may comprise
additional gas components such as N.sub.2 or an inert gas (Ar, Xe,
He, etc.). In this way, the remaining sacrificial material and/or
removable barrier layers are removed and the micromirror device is
released. In one aspect of such an embodiment, XeF.sub.2 is
provided in an etching chamber with diluent (e.g. N.sub.2 and He).
The concentration of XeF.sub.2 is preferably 8 Torr, although the
concentration can be varied from 1 Torr to 30 Torr or higher. This
non-plasma etch is employed for preferably 900 seconds, although
the time can vary from 60 to 5000 seconds, depending on
temperature, etchant concentration, pressure, quantity of
sacrificial material to be removed, or other factors. The etch rate
may be held constant at 18 .ANG./s/Torr, although the etch rate may
vary from 1 .ANG./s/Torr to 100 .ANG./s/Torr. Each step of the
release process can be performed at room temperature.
[0067] In the following, exemplary etching methods and appropriate
etchants are discussed with reference to FIG. 12 through FIG. 16.
As can be seen in FIG. 12, an apparatus is provided for etching a
sample that includes a source chamber 11 containing a source of
chemical etchant, maintained at a particular temperature and
pressure for maintaining the etchant source in a solid or liquid
state (e.g. solid state for XeF2 crystals, liquid state for BrF3,
etc.). An expansion chamber 12 is in fluid communication with
source chamber 11 and has any suitable size (e.g. a volumetric
capacity of 29 cubic inches (0.46 liter)) to receive etchant gas
from the source chamber 11, with a shutoff valve 13 joining these
two chambers. An etch chamber 14 is provided in fluid communication
with expansion chamber 12 and has any suitable size (e.g.
volumetric capacity of 12 cubic inches (0.18 liter)) to contain the
sample microstructure to be etched. It is preferred that the etch
chamber be smaller than the expansion chamber. The etch chamber 14
is connected to the expansion chamber 12 via a shutoff valve 15.
Also included in the apparatus is a first gas source 16 in fluid
communication with the expansion chamber 12 via a further shutoff
valve 17, a second gas source 18 in fluid communication with the
expansion chamber through a separate shutoff valve 19, a vacuum
pump 21 and associated shutoff valves 22, 23 to control the
evacuation of the chambers.
[0068] Also shown in FIG. 12 are a third gas source 24 serving as a
pump ballast with an associated shutoff valve 25 to prevent
backstreaming from the pump 21, and needle valves 26, 27, 28 to set
the gas flow rates through the various lines and to permit fine
adjustments to the pressures in the chambers. Also shown, as will
be discussed in more depth below, are gas analyzer 1 and valves 3
and 5 on opposite sides of the analyzer. The expansion chamber 12
and the etch chamber 14 can both be maintained at a particular
temperature, while different gases are placed in the first and
second gas sources for the various etching processes. It should be
noted that a single gas source could be used in place of gas
sources 16 and 18.
[0069] The general procedure followed in these experiments began
with the evacuation of both the expansion chamber 12 and the etch
chamber 14, followed by venting both chambers to atmospheric
pressure with gas from the first gas source 16 by opening the two
shutoff valves 17, 15, between this gas source and the two
chambers. The sample was then placed in the etch chamber 14 (with
the shutoff valves 7, 15 open during the sample insertion) which
was then sealed, and both the expansion chamber 12 and the etch
chamber 14 were evacuated. All valves were then closed.
[0070] The connecting valve 15 between the expansion chamber 12 and
the etch chamber 14 was opened, and the shutoff valve 17 at the
outlet of the first gas source 16 was opened briefly to allow the
gas from the first gas source to enter the expansion and etch
chambers. The shutoff valve 17 is then closed. The connecting valve
15 is then closed, and the expansion chamber 12 is evacuated and
isolated. The supply valve 13 from the etchant source chamber 11 is
then opened to allow etchant gas to enter the expansion chamber
(due to the higher temperature of the expansion chamber). The
supply valve 13 is then closed, outlet valve 23 is opened, and the
needle valve 27 is opened slightly to lower the etchant pressure in
the expansion. Both the outlet valve 23 and the needle valve 27 are
then closed. The shutoff valve 19 at the second gas source 18 is
then opened and with the assistance of the needle valve 26, gas
from the second gas source is bled into the expansion. At this
point the expansion chamber 12 contains the etchant gas plus gas
from the second gas source 18, while the etch chamber 14 contains
gas from the first gas source.
[0071] With pump 21 on, the connecting valve 15 between the
expansion chamber 12 and the etch chamber 14 is then opened, and
valves 3 and 5 are opened on both sides of gas analyzer 1, to allow
the gas mixture from the expansion chamber to enter the etch
chamber and flow through the etch chamber and gas analyzer, thereby
beginning the etch process. The gas analyzer 1 could also be
directly connected to the etching chamber. As will be discussed
further below, the etch process is continued until an endpoint is
detected via the gas analyzer.
[0072] Many alternatives to the process scheme described above can
be used. Additional gas sources and chambers, for example, can be
utilized. For example, depending upon the diluent(s) used (gas
sources 16 and 18), a plurality of diluent sources (N2, Ar, He,
etc.) can be connected to the expansion chamber and/or to the
recirculation loop for bleeding the system after an etch. The air
distribution system within the etching chamber can also be varied,
for example by including U-shaped or cone-shaped baffles, or by
using additional perforated plates and/or baffles.
[0073] A specific alternative to the embodiment of FIG. 12 is
illustrated in FIG. 13. FIG. 13 represents such a process flow
arrangement in which the process is an etching process having a
detectable end point. The etchant gas originates in a source
chamber 11. An example of an etchant gas that is conveniently
evaporated from a liquid is bromine trifluoride, whereas an example
of an etchant gas that is conveniently sublimated from solid
crystals is xenon difluoride. Effective results can be achieved by
maintaining the crystals under 40 degrees C (e.g. at a temperature
of 28.5.degree. C.). (Xenon difluoride is only one of several
etchant gases that can be used. Examples of other gases are
presented below.) The sublimation pressure of xenon difluoride
crystals at 28.5.degree. C. is 5-11 mbar (4-8 torr). An expansion
chamber 12 receives xenon difluoride gas from the crystals in the
source chamber(s) 11, and a shutoff valve 13 is positioned between
the source and expansion chambers. The sample 14 to be etched is
placed in an etch chamber 15 (which contains a baffle 16 a
perforated plate 17), and a reciprocating pump 18 that is
positioned between the expansion chamber 12 and the etch chamber
15. (The reciprocating pump and its valves are shown in more detail
in a FIGS. 3a and 3b and described below.) Also illustrated in FIG.
12, and will be discussed further below, is a gas analyzer 1 with
valves 3 and 5 that control the flow of gas from the etching
chamber through the gas analyzer.
[0074] Also shown are two individual gas sources 19, 20 supplying
the expansion chamber 12 through shutoff valves 21, 22, a vacuum
pump 23 and associated shutoff valves 24, 25, 26, 27, 28 to control
the evacuation of the chambers, a third gas source 29 serving as a
pump ballast with an associated shutoff valve 30 to prevent
backstreaming from the pump 23, and manually operated needle valves
31, 32, 33, 34, 35, 83 to set the gas flow rates through the
various lines and to permit fine adjustments to the pressures in
the chambers. When xenon difluoride is used, the expansion chamber
12 and the etch chamber 15 are typically maintained at around room
temperature (e.g. 25.0.degree. C.). However, the expansion chamber
and etch chamber could also be heated (e.g. to between 25 and 40
degrees C.), though this would likely be performed in conjunction
with directly cooling the sample being processed, as will be
discussed below. A recirculation line 36 permits gas to flow
continuously through the etch chamber 15 in a circulation loop that
communicates (via valves 26, 27, and 34, 35) with the expansion
chamber 12 and reenters the etch chamber 15 by way of the
reciprocating pump 18. Valve 85 permits gas transfer between
expansion chamber 12 and etch chamber 15 via a portion of the
recirculation line 36 without traversing recirculation pump 18.
Valve 86 in path 40 permits introduction of etchant gas into the
expansion chamber 12 to replenish the etchant mixture during the
etching process. The valves are preferably corrosive gas resistant
bellows-sealed valves, preferably of aluminum or stainless steel
with corrosive resistant O-rings for all seals (e.g. Kalrez.TM. or
Chemraz.TM.). The needle valves are also preferably corrosion
resistant, and preferably all stainless steel. A filter 39 could be
placed in the recirculation line 36 to remove etch byproducts from
the recirculation flow (though preferably not the product(s) being
monitored for end point detection), thereby reducing the degree of
dilution of the etchant gas in the flow. The filter can also serve
to reduce the volume of effluents from the process.
[0075] The etch chamber 15 can be of any shape or dimensions, but
the most favorable results will be achieved when the internal
dimensions and shape of the chamber are those that will promote
even and steady flow with no vortices or dead volumes in the
chamber interior. A preferred configuration for the etch chamber is
a circular or shallow cylindrical chamber, with a process gas inlet
port at the center of the top of the chamber, plus a support in the
center of the chamber near the bottom for the sample, and an exit
port in the bottom wall or in a side wall below the sample support.
The baffle 16 is placed directly below the entry port. The distance
from the port to the upper surface of the baffle is not critical to
this invention and may vary, although in preferred embodiments of
the invention the distance is within the range of from about 0.1 cm
to about 6.0 cm, and most preferably from about 0.5 cm to about 3.0
cm. Although its shape is not shown in FIG. 12, the baffle is
preferably circular or otherwise shaped to deflect the gas stream
radially over a 360.degree. range. The perforated plate 17 is wider
than the baffle 16 and preferably transmits all gas flow towards
the sample. A preferred configuration for the perforated plate is
one that matches the geometry of the sample; thus, for a circular
sample the perforated plate is preferably circular as well.
[0076] FIG. 14a and FIG. 14b are diagrams of an example of a
reciprocating pump 18 that can be used in the practice of this
invention. The design shown in these diagrams can be varied in
numerous ways, such as by increasing the number of chambers to
three or more, or by arranging a series of such pumps in parallel.
The following discussion is directed to the particular design shown
in these diagrams.
[0077] The side elevation view of FIG. 14a shows the pump housing
41, which consists of two stationary end walls 42, 43 joined by
bellows-type side walls 44, 45. The bellows-type side walls 44, 45
are so-called because they are either pleated like an accordion or
otherwise constructed to permit bellows-type expansion and
contraction. The end walls 42, 43 and the bellows-type side walls
44, 45 together fully enclose the interior of the pump except for
inlet/outlet ports on each side wall. The arrangement of these
ports is shown in the pump flow diagram of FIG. 3b, the left side
wall 42 having one inlet/outlet port 46, and the right side wall 43
likewise having one inlet/outlet port 48. Remotely controlled
shutoff valves 51, 52, 53, 54 are placed on the external lines
leading to or from each inlet/outlet port. For fail-safe operation,
shutoff valves 51, 54 are normally open and shutoff valves 52, 53
are normally closed.
[0078] The movable partition 60 shown in FIG. 14a divides the pump
interior into two chambers 61, 62, the partition and its
connections to the remaining portions of the housing being
fluid-impermeable so that the two chambers are completely separate
with no fluid communication between them. The partition 60 joins
the bellows-type side walls 44, 45 and moves in the two directions
indicated by the two-headed arrow 63. The movement is driven by a
suitable drive mechanism (not shown) capable of reciprocating
movement. Many such drive mechanisms are known to those skilled in
the art and can be used. In the view shown in FIG. 3a, movement of
the partition to the left causes the left chamber 61 to contract
and the right chamber 62 to expand. With the pump shutoff valves
appropriately positioned, i.e., valves 52 and 53 open and valves 51
and 54 closed, the contracting left chamber 61 will discharge its
contents through its inlet/outlet port 46 while the expanding right
chamber 62 will draw gas in through its inlet/outlet port 48. Once
the partition 60 has reached the end of its leftward travel, it
changes direction and travels to the right and the shutoff valves
are switched appropriately, causing the expanded right chamber 62
to contract and discharge its contents through its inlet/outlet
port 48 while the contracted left chamber 61 expands and draws
fresh gas in through its inlet/outlet port 46. In this manner, the
pump as a whole produces a gas flow in a substantially continuous
manner, the discharge coming alternately from the two chambers. A
controller 64 governs the direction and range of motion, and the
speed and cycle time of the partition 60, and coordinates the
partition movement with the opening and closing of the shutoff
valves 51, 52, 53, and 54. Conventional controller circuitry and
components can be used.
[0079] The pump for recirculating the process gas as shown, and
others within the scope of this invention, has no sliding or
abrading parts or lubricant that come into contact with the process
gas. Alternative pumps that meet this criterion are possible,
including pumps with expandable balloon chambers, pumps with
concentric pistons connected by an elastic sealing gasket, or
peristaltic pumps. The pump materials, including the bellows-type
walls, can thus be made of materials that are resistant or
impervious to corrosion from the etchant gas. One example of such a
material, useful for operating temperatures below 50.degree. C., is
stainless steel. Others are aluminum, Inconel, and Monel. Still
others will be readily apparent to those experienced in handling
these gases. While the capacity and dimensions of the pump and its
chambers may vary, a presently preferred embodiment is one in which
the change in volume of each chamber upon the movement of the
partition across its full range is approximately from 0.05 to 4.2
L, though preferably from 0.1 to 1.5 L, with one example being 0.5
L. Larger chamber sizes (e.g. 5 to 20 L) are possible, which, if
combined with a slower pumping speed, can benefit from lower wear
on the pump. At a partition speed of one cycle every two seconds,
the pump rate (for 0.5 L) will be 30 L/min. Different combinations
of pump sizes and pump speeds are possible, though the preferred
pump volume per time is between 7 and 150 L/min, with a preferred
range of from 30 to 90 L/min.
[0080] The pump described above can be lined with a suitable lining
to further reduce particulate contamination of the process gas
mixture during etching. Pumps that are not of the bellows type can
also be used. The preferred pumps are those that are resistant to
corrosion by the process gas mixture and those that are designed to
avoid introducing particulate or liquid material into the process
gas mixture. Dry pumps, i.e., those that do not add exogenous purge
or ballast gas into the process gas mixture, are preferred.
Alternatively, the process gas could be circulated by temperature
cycling (with large variations in the heating and cooling of the
recirculation path).
[0081] The following is a generalized description of the etching
process and its chemical parameters in relation to FIG. 13. This
description is included to show the context in which the features
described above are most likely to be used.
[0082] The apparatus and methods of this invention can be used in
etching processes that are known in the art and in the literature.
These processes include the use of dry-etch gases in general,
including Cl2, HBr, HF, CCl2F2 and others. Preferred etchant gases,
particularly for etching silicon, are gaseous halides (e.g.
fluorides) such as noble gas fluorides, gaseous halogen fluorides,
or combinations of gases within these groups (again, preferably
without energizing the gas, other than heating to cause
vaporization or sublimation). The noble gases are helium, neon,
argon, krypton, xenon and radon, and among these the preferred
fluorides are fluorides of krypton and xenon, with xenon fluorides
the most preferred. Common fluorides of these elements are krypton
difluoride, xenon difluoride, xenon tetrafluoride, and xenon
hexafluoride. The most commonly used noble gas fluoride in silicon
etch procedures is xenon difluoride. Halogen fluorides include
bromine fluoride, bromine trifluoride, bromine pentafluoride,
chlorine fluoride, chlorine trifluoride, chlorine pentafluoride,
iodine pentafluoride and iodine heptafluoride. Preferred among
these are bromine trifluoride, bromine trichloride, and iodine
pentafluoride, with bromine trifluoride and chlorine trifluoride
the more preferred. Combinations of bromine trifluoride and xenon
difluoride are also of interest. The etch process is generally
performed at a pressure below atmospheric. It is preferred that the
etchants described herein be used in the gaseous state (e.g.
non-plasma) or otherwise in the absence of added energy (except
heat to aid sublimation or vaporization of the starting etchant gas
or liquid), and in the absence of electric fields, UV light or
other electromagnetic energy, or other added fields or energy
sources which would energize the etchant gas beyond it's normal
energy as a gas at a particular temperature.
[0083] The etch preferably utilizes an etchant gas capable of
spontaneous chemical etching of the sacrificial material at room
temperature, preferably isotropic etching that chemically (and not
physically) removes the sacrificial material. In a preferred
embodiment, the etchant is capable at room temperature of reacting
with the sacrificial material and where the reaction product(s) is
a gaseous component that is released from the sacrificial material
surface due to being in a gaseous state. No UV or visible light or
other electromagnetic radiation or electric fields are needed, or
any energy that would energize the gas molecules to physically
bombard and physically remove the sacrificial material. Though the
etch could be performed with the application of heat or the
presence of light from the room surrounding the etch chamber, the
etchant is capable of spontaneously etching the sacrificial
material at room temperature without any applied heat, visible, UV
or other electromagnetic radiation, ultrasonic energy, electric or
magnetic fields, etc. The etchant is preferably not broken down
into atoms, radicals and/or ions by an rf glow discharge, the
etchant is transported by diffusion to the surface of the material
being etched (in addition to pumping--e.g. by recirculating the
etchant repeatedly through the etching chamber), the etchant is
adsorbed on the surface, a chemical reaction occurs between the
etchant and the material being etched with the formation of a
volatile product, and the product is desorbed from the surface and
diffuses into the bulk of the gas and eventually exits the etching
chamber. The apparatus, therefore, can be without a source of RF or
microwave energy, though it is possible to run the process of the
invention in a plasma apparatus without energizing the etchant to
form a plasma.
[0084] Taking as an example BrCl3, a molecule of BrCl3 could
hypothetically be placed next to a silicon molecule bound to other
silicon molecules in crystalline silicon, polysilicon or in an
amorphous silicon matrix. The bond energies of the Cl atoms to the
Br atoms are sufficiently weak, and the bond energy of the silicon
atom to other silicon atoms is sufficiently weak, and the
attraction forces between Si and Cl are sufficiently strong, that
without a physical bombardment of the BrCl3 on the silicon, Cl will
disassociate from Br and bond to Si to form various products such
as SiCl, SiCl2, SiCl3, SiCl4, etc., which etch products are a gas a
room temperature and dissipate from the silicon surface, thus
removing sacrificial silicon material. The same process occurs with
XeF2, BrF3 and the other vapor phase spontaneous chemical
etchants.
[0085] Such chemical etching and apparatus for performing such
chemical etching are disclosed in U.S. patent application Ser. No.
09/427,841 to Patel et al. filed Oct. 26, 1999, in U.S. patent
application Ser. No. 09/649,569 to Patel at al. filed Aug. 28,
2000, mentioned previously, and in U.S. patent application Ser. No.
60/293,092 to Patel et al. filed May 22, 2001 incorporated herein
by reference. Preferred etchants for the etch are gas phase
fluoride etchants that, except for the optional application of
temperature, are not energized. Examples include gaseous acid
etchants (HF, HCl, HI etc.), noble gas halides such as XeF2, XeF6,
KrF2, KrF4 and KrF6, and interhalogens such as IF5, BrCl3, BrF3,
IF7 and ClF3. It is also possible to use fluorine gas, though
handling of fluorine gas makes this a less desirable option. The
etch may comprise additional gas components such as N2 or an inert
gas (Ar, Xe, He, etc.). In the etching process, except for optional
heating, the gas is not energized and chemically etches the
sacrificial material isotropically. In this way, the sacrificial
material is removed and the micromechanical structure is released.
In one aspect of such an embodiment, BrF3 or XeF2 are provided in a
chamber with diluent (e.g. N2 and He). An initial plasma etch,
preferably in a separate etching apparatus, can be performed prior
to etching as set forth above. This sequential etch is set forth
further in U.S. patent application Ser. No. 60/293,092 to Patel et
al. filed May 22, 2001, the subject matter of which is incorporated
herein by reference.
[0086] While the source chamber 11 can be a single chamber, the
arrangement shown in FIG. 15 is an optional one in which the source
chamber is actually a pair of chambers 11a and 11b arranged in
series. The first of these chambers 11a contains the source
material primarily in its condensed form, i.e., either as crystals
to be sublimated or liquid to be vaporized. The second chamber 11b
receives the source material gas evolved by sublimation from the
crystals or by vaporization from the liquid in the first chamber
11a. To maintain these phases, the two chambers 11a and 11b will
preferably be maintained at different temperatures (preferably at
least 5 degrees C. difference), the former 11a at the lower
temperature to keep the material in its condensed form (solid
crystals or liquid) and the latter 11b at the higher temperature
(and possibly a higher pressure as well) to keep the material in
the vapor form (and to avoid the problem of condensation) at a
pressure sufficiently high to allow it to be supplied to the
succeeding chambers at the pressures needed in those chambers. In
one embodiment, the two chambers are held at temperatures above
room temperature, with chamber 11b held at a temperature from 2 to
24 degrees C. (preferably around 5 to 10 degrees C.) higher than
the temperature of chamber 11a. Such a two-chamber embodiment could
likewise be utilized in a system such as that illustrated in FIG.
12. Chambers 11a and 11b could also be arranged in parallel. Also
shown in FIG. 15 are the expansion chamber 12, the etching chamber
15, pumps 18 and 23 and gas analyzer 1.
[0087] The terms "sample" and "microstructure" are used herein to
denote the article from which a material is sought to be removed or
to which a material is to be added, whether the material forms a
layer among a plurality of layers, layers among a plurality of
layers or a region adjacent to other regions in the same plane. The
"sample" may thus be a single mirror element and its associated
layers of other materials, a test pattern, a die, a device, a
wafer, a portion of a wafer, or any article from which a portion is
to be removed or added. The invention is particularly suitable for
processes where the size of the portion of material that is being
added or removed is less than 5 mm in at least one of its
dimensions, preferably less than 1 mm, more preferably less than
500 .mu.m, and most preferably less than 100 .mu.m. The invention
is also well suited to adding or removing material (e.g., in the
form of holes or layers) in a submicron environment (e.g. in the
range of 10 nm to less than 1000 nm) (as sometimes needed, for
example, in MEMS and MOEMS).
[0088] In the system depicted in the drawings, as well as other
systems within the scope of this invention, a single charge of
etchant can be placed in the source chamber or the expansion
chamber, then released (with or without diluents) into the
recirculation loop. Additional etchant can be introduced to
replenish the circulating stream as the amount of etchant in the
recirculation loop decreases over time. Other variations of the
process will be apparent to those skilled in the art.
[0089] When the material to be removed by etching is silicon,
certain etching processes supply the etchant gas as a mixture of
gases of which one component is the etchant gas itself (or a
mixture of etchant gases) while other components are non-etchant
diluents. Whether the gas consists entirely of etchant gas(es) or
contains non-etchant components as well, the rate of the etch
reaction may vary with the partial pressure of the etchant gas. The
pressure may vary, but in most applications, particularly those in
which silicon is being etched, best results will be obtained with
the etchant gas at a partial pressure of at least about 0.01 mbar
(0.0075 torr), preferably at least 0.1 Torr, more preferably within
the range of from about 1 to 760 Torr, and most preferably from
about 50 to 600 Torr. These pressure ranges are particularly
applicable to xenon difluoride etching.
[0090] In certain processes, non-etchant gas additive(s) are
included to increase the selectivity of the silicon etch. Preferred
additives for this purpose are non-halogen-containing gases. A
single such additive or a mixture of such additives can be used. In
preferred embodiments of this invention, the additives are those
whose molar-averaged formula weight (expressed in daltons or grams
per mole) is less than the formula weight of molecular nitrogen,
preferably about 25 or less, still more preferably within the range
of from about 4 to about 25, still more preferably within the range
of from about 4 to about 20, and most preferably within the range
of from about 4 to about 10. If a single additive species is used,
the "molar-averaged formula weight" is the actual formula weight of
that species, whereas if two or more additive species are used in
the same gas mixture, the molar-averaged formula weight is the
average of the formula weights of each species in the mixture
(exclusive of the noble gas fluoride) calculated on the basis of
the relative molar amounts (approximately equal to the partial
pressures) of each species. In terms of thermal conductivity,
preferred additives are those whose thermal conductivity at 300 K
(26.9.degree. C.) and atmospheric pressure ranges from about 10
mW/(m K) (i.e., milliwatts per meter per degree Kelvin) to about
200 mW/(m K), and most preferably from about 140 mW/(m K) to about
190 mW/(m K). In general, the higher the thermal conductivity of
the additive, the greater the improvement in selectivity. Examples
of additives suitable for use in this invention are nitrogen (N2,
thermal conductivity at 300 K: 26 mW/(m K)), argon (Ar, thermal
conductivity at 300 K: 18 mW/(m K)), helium (He, thermal
conductivity at 300 K: 160 mW/(m K)), neon (Ne, thermal
conductivity at 300 K: 50 mW/(m K)), and mixtures of two or more of
these gases. Preferred additive gases are helium, neon, mixtures of
helium and neon, or mixtures of one or both of these with one or
more non-etchant gases of higher formula weight such as nitrogen
and argon. Particularly preferred additives are helium and mixtures
of helium with either nitrogen or argon.
[0091] The degree of selectivity improvement may vary with molar
ratio of the additive to the etchant gas. Here again, the molar
ratio is approximately equal to the ratio of the partial pressures,
and in this case the term "molar ratio" denotes the ratio of the
total number of moles of the additive gas (which may be more than
one species) divided by the total number of moles of the etchant
gas (which may also be more than one species). In most cases, best
results will be obtained with a molar ratio of additive to etchant
that is less than about 500:1, preferably within the range of from
about 1:1 to about 500:1, preferably from about 10:1 to about
200:1, and most preferably from about 20:1 to about 150:1. In one
example, the ratio is set at 125:1.
[0092] The temperature at which the etch process is conducted can
likewise vary, although the partial pressure of the etchant gas
will vary with temperature. The optimal temperature may depend on
the choice of etchant gas, gaseous additive or both. In general,
and particularly for procedures using xenon difluoride as the
etchant gas, suitable temperatures will range from about
-60.degree. C. to about 120.degree. C., preferably from about
-20.degree. C. to about 80.degree. C., and most preferably from
about 0.degree. C. to about 60.degree. C. For xenon difluoride, the
silicon etch rate is inversely proportional to the temperature over
the range of -230.degree. C. to 60.degree. C. The improvement in
selectivity can thus be further increased by lowering the etch
process temperature.
[0093] The flow parameters will be selected such that the time
during which the sample will be exposed to the etchant gas will be
sufficient to remove all or substantially all of the silicon. By
"silicon" it is meant any type of silicon, including amorphous
silicon, single crystal silicon and polysilicon, which silicon can
have up to 40 at % or more (typically from 5 to 25 at %) hydrogen
depending upon the deposition technique, as well as impurities that
can result from the target or atmosphere. The expression
"substantially all of the silicon" is used herein to denote any
amount sufficient to permit the finished product to function
essentially as effectively as if all of the silicon had been
removed. An example of the structures to which this invention will
be applied is that depicted in U.S. Pat. No. 5,835,256, in which a
silicon nitride layer is deposited over a polysilicon layer, and
the silicon nitride layer is patterned to leave vias that define
the lateral edges of the mirror elements. Access to the sacrificial
polysilicon layer is through the vias, and the etching process
removes the polysilicon below the vias by etching in the vertical
direction (i.e., normal to the planes of the layers) while also
removing the polysilicon underneath the silicon nitride by etching
in the lateral direction (parallel to the planes of the layers).
The process is also effective for etching silicon relative to
multiple non-silicon layers. Also, it should be noted that the
silicon can contain impurities, and in particular may contain a
large amount of hydrogen (e.g. up to 25 at % or more) depending
upon the deposition method used.
[0094] It will be appreciated by those of skill in the art that a
new and useful method for fabricating microelectromechanical
devices has been described herein. In view of the many possible
embodiments to which the principles of this invention may be
applied, however, it should be recognized that the embodiments
described herein with respect to the drawing figures are meant to
be illustrative only and should not be taken as limiting the scope
of invention. For example, those of skill in the art will recognize
that the illustrated embodiments can be modified in arrangement and
detail without departing from the spirit of the invention. In
particular, the removable barrier layer(s) and the sacrificial
layers may be removed by one etching step. Rather, the barrier
layer(s) and the sacrificial layers can be removed using separate
etching steps. For another example, the Sandia SUMMiT process
(using polysilicon for structural layers) or the Cronos MUMPS
process (also polysilicon for structural layers) could be used in
the present invention. Also, a MOSIS process (AMI ABN -1.5 um CMOS
process) could be adapted for the present invention. Also, the
sacrificial layer and etchant disclosed herein are exemplary only.
For example, a silicon dioxide sacrificial layer could be used and
removed with HF (or HF/HCl), or a silicon sacrificial could be
removed with ClF.sub.3 or BrF.sub.3. Also a PSG sacrificial layer
could be removed with buffered HF, or an organic sacrificial such
as polyimide could be removed in a dry plasma oxygen release step.
Of course the etchant and sacrificial material should be selected
depending upon the structural material to be used. Also, though PVD
and CVD are referred to above, other thin film deposition methods
could be used for depositing the layers, including spin-on,
sputtering, anodization, oxidation, electroplating and evaporation.
Therefore, the invention as described herein contemplates all such
embodiments as may come within the scope of the following claims
and equivalents thereof.
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