U.S. patent application number 10/933389 was filed with the patent office on 2005-03-03 for solder ball supplying method and supplying device.
This patent application is currently assigned to TDK CORPORATION. Invention is credited to Andoh, Youichi, Mizuno, Toru, Shindo, Osamu, Yamaguchi, Satoshi.
Application Number | 20050045701 10/933389 |
Document ID | / |
Family ID | 34214242 |
Filed Date | 2005-03-03 |
United States Patent
Application |
20050045701 |
Kind Code |
A1 |
Shindo, Osamu ; et
al. |
March 3, 2005 |
Solder ball supplying method and supplying device
Abstract
After introducing a solder ball from a hopper into a receiving
hole of a ball separator, the ball separator is slid between
blocks, and the solder ball is sent out to a portion outside of the
blocks. By suctioning the solder ball from within a projected
region on a lower block which is situated inside of the receiving
hole at a time when the solder ball is taken into the receiving
hole and surrounds a rolling trajectory of the solder ball that has
been taken into the receiving hole, the solder ball is forcibly
introduced into the receiving hole.
Inventors: |
Shindo, Osamu; (Tokyo,
JP) ; Mizuno, Toru; (Tokyo, JP) ; Andoh,
Youichi; (Tokyo, JP) ; Yamaguchi, Satoshi;
(Tokyo, JP) |
Correspondence
Address: |
OBLON, SPIVAK, MCCLELLAND, MAIER & NEUSTADT, P.C.
1940 DUKE STREET
ALEXANDRIA
VA
22314
US
|
Assignee: |
TDK CORPORATION
Tokyo
JP
|
Family ID: |
34214242 |
Appl. No.: |
10/933389 |
Filed: |
September 3, 2004 |
Current U.S.
Class: |
228/246 ;
228/41 |
Current CPC
Class: |
B23K 3/0623 20130101;
H05K 3/3478 20130101 |
Class at
Publication: |
228/246 ;
228/041 |
International
Class: |
B23K 035/12 |
Foreign Application Data
Date |
Code |
Application Number |
Sep 3, 2003 |
JP |
2003-311010 |
Claims
What is claimed is:
1. A solder ball supplying method comprising: introducing a solder
ball from a hopper formed in an upper block to a receiving hole of
a ball separator that is sandwiched between the upper block and a
lower block; sliding the ball separator between the upper block and
the lower block; and sending the solder ball that has been taken
into the receiving hole to an outside of the upper block and the
lower block, wherein when introducing the solder ball from the
hopper into the receiving hole, the solder ball is forcibly
introduced into the receiving hole by sucking the solder ball from
within a projected region on the lower block, the projected region
being situated inside of the receiving hole at a time when the
solder ball is taken into the receiving hole and surrounding a
rolling trajectory of the solder ball that has been taken into the
receiving hole.
2. A solder ball supplying method according to claim 1, further
comprising increasing a pressure within the hopper when introducing
the solder ball from the hopper into the receiving hole.
3. A solder ball supplying method according to claim 1, further
comprising swinging the upper block in a direction in which the
ball separator slides when introducing the solder ball from the
hopper into the receiving hole.
4. A solder ball supplying method according to claim 1, further
comprising: inserting an intermediate block between the upper block
and the ball separator, the intermediate block having a plate
thickness of a multiple of a diameter of the solder ball and
including a solder ball introduction path of a size corresponding
to an inner diameter of the receiving hole; and performing
alignment on the solder ball in the solder ball introduction path
before the solder ball is introduced into the receiving hole.
5. A solder ball supplying method according to claim 1, further
comprising, when the solder ball is jammed while being conveyed
from the hopper to the receiving hole, removing the jammed solder
ball by moving the upper block in a direction in which the ball
separator slides, and feeding air into a path extending from the
upper block to the lower block through a cleaning path that is
formed in the upper block.
6. A solder ball supplying device comprising: an upper block in
which a hopper for introducing a solder ball is provided; a lower
block; a ball separator that is sandwiched between the upper block
and the lower block and that has a receiving hole to which the
solder ball is taken in from a bottom portion of the hopper, the
ball separator sending the solder ball, which has been taken into
the receiving hole by sliding of the ball separator, to any outside
of the upper block and the lower block as the ball separator
slides; and a solder ball suction path provided within a projected
region on the lower block, the projected region being situated
inside of the receiving hole at a position where the solder ball is
taken in and surrounding a rolling trajectory of the solder ball
that has been taken into the receiving hole, the solder ball being
forcibly introduced form the hopper into the receiving hole by
using the solder ball suction path.
7. A solder ball supplying device according to claim 6, further
comprising a gas supplying means connected to the upper block, for
increasing a pressure within the hopper.
8. A solder ball supplying device according to claim 6, further
comprising swinging means provided to the upper block, for enabling
the upper block to move reciprocatively in a direction in which the
ball separator slides.
9. A solder ball supplying device according to claim 6, further
comprising an intermediate block provided between the upper block
and the ball separator, the intermediate block having a plate
thickness that is a multiple of a diameter of the solder ball and
having a solder ball introduction path of a size that corresponds
to an inner diameter of the receiving hole.
10. A solder ball supplying device according to claim 6, further
comprising a cleaning path that is provided in the upper block and
by a side of the hopper, wherein the solder ball that is jammed
within a path extending from the upper block to the lower block
through the cleaning path is removed by feeding air into the path.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a solder ball supplying
method and a solder ball supplying device. In particular, the
present invention relates to a solder ball supplying method and a
solder ball supplying device that are suited for making fine
connections, such as connections between a bonding pad that is
formed on a magnetic head slider and a pad that is formed on a lead
frame side.
[0003] 2. Description of the Related Art
[0004] A connection method is conventionally known, with which
electrodes that are objects to be joined are placed close to each
other, the electrodes are made to contact ball-shaped solder
(hereinafter called solder ball) by using a suctioning jig or the
like, and the solder ball is melted, thus making an electrical
connection between the electrodes.
[0005] A solder ball supplying device that reliably supplies solder
balls to the suctioning jig is used in this type of connection
method.
[0006] FIG. 7 is a structural explanatory diagram that shows a
conventional solder ball supplying device.
[0007] As shown in FIG. 7, a conventional solder ball supplying
device 1 has an upper block 2 and a lower block 3. A ball separator
4 that can slide along a gap between the upper block 2 and the
lower block 3 is provided in a location where it is sandwiched by
the upper block 2 and the lower block 3.
[0008] A hopper 5 that has an opening in an upper surface is
provided to the upper block 2. The hopper 5 can store a large
number of solder bails 6 with the ball separator 4 used as a bottom
surface. Further, an air path 7 that passes through the upper block
2 in a vertical direction is formed in the upper block 2 in the
vicinity of the hopper 5.
[0009] It is thus possible to supply nitrogen gas that is used to
prevent oxidation of the solder balls 6 from a nitrogen supplying
means (not shown) provided above the upper block 2 to the air path
7.
[0010] A receiving hole 8 that can only take in one of the solder
balls 6 is provided in the ball separator 4. The solder balls 6
that freely fall from the hopper 5 go into the receiving hole 8,
and the ball separator 4 is made to slide. It is thus possible to
convey the solder ball 6 that has gone into the receiving hole 8 to
a position directly below the air path 7.
[0011] A delivery path 9 that is provided with a diameter that is
at least equal to or greater than the outer diameter of the solder
balls 6 is provided to the lower block 3, coaxially with the air
path 7 formed in the upper block 2. Accordingly, when the ball
separator 4 is slid, and the solder ball 6 that has gone into the
receiving hole 8 is moved to a position directly below the air path
7, the solder ball 6 is sent through the delivery path 9 to a
portion outside of the supplying device by the nitrogen gas that is
supplied within the air path 7. The solder ball 6 then moves to a
ball receiving pad (not shown) that is formed in an end portion of
the delivery path 9. Suctioning is provided to the solder ball 6 by
using a suctioning jig or the like, and the solder ball 6 is
conveyed to a target joining portion.
[0012] It should be noted that ball separators that simply move
reciprocatively between the hopper 5 and the air path 7, and those
configured by a porous disk are known and may be used as the ball
separator 4 described above (refer to JP 2002-25025 A (FIG. 9), and
JP 11-509375 A (page 12, lines 18 to 22)).
[0013] Further, other configurations of a solder ball supplying
device are known. One solder ball supplying device uses a three
layer structure consisting of an arrangement mask, a shutter mask,
and a supply mask. By sliding the shutter mask that is sandwiched
between the arrangement mask and the supply mask, a solder ball
freely falls from the arrangement mask side to the supply mask side
to be supplied onto a pad (refer to JP 8-236916 A (FIG. 8)).
Another device uses an ejector pin that has a suctioning function
to push up a hopper, in which a plurality of solder balls are
stored, from below to separate out one solder ball from the hopper
(refer to JP 7-245473 A, FIG. 4 and FIG. 6, for example).
[0014] However, problems such as those described below exist with
the solder ball supplying devices mentioned above.
[0015] That is, with the connection method that uses a solder ball,
the outer diameter of the solder ball becomes smaller with
miniaturization of an object to be joined. Accordingly, if the
solder balls themselves are charged with static electricity, there
is a problem in that the solder ball cannot be reliably supplied
with a method (the so-called free fall method) in which each solder
ball is separated out by its own weight, because separation
characteristics between the balls worsen due to the reduced weight
of the solder balls.
[0016] Further, the separation characteristics of the solder balls
worsen also when using the method of pushing up and separating a
solder ball from a hopper, in which a large number of solder balls
are stored, by using an ejector pin. Accordingly, other solder
balls are connected to the solder ball that is pushed up, taking on
the shape of a bunch of grapes. A problem exists in that it is
difficult to extract a single solder ball.
[0017] With the solder ball supplying device 1 described above, the
solder ball 6 may rub against a block side, causing a jam in a
device main body, if the solder ball 6 is not completely received
within the receiving hole 8. Disassembly work to remove the upper
block 2 becomes necessary in order to remove the solder ball 6 from
the receiving hole 8, and this is difficult from the viewpoint of
maintenance.
SUMMARY OF THE INVENTION
[0018] In consideration of the conventional problems described
above, a first object of the present invention is to provide a
solder ball supplying method and a solder ball supplying device
with which individual solder balls are reliably separated and
supplied, even if the solder balls are small in size and the
separation characteristics between the solder balls worsen due to
static electricity. In addition, a second object of the present
invention is to provide a solder ball supplying method and a solder
ball supplying device with which it is possible to easily remove
solder balls without needing to disassemble the solder ball
supplying device itself if jamming of solder balls develops.
[0019] The present invention is made based upon the finding that
solder balls whose separation characteristics have worsened due to
static electricity can easily be separated provided that the
separation of the solder balls is forcibly performed by an external
force, not only by the weight of the solder balls themselves. In
addition, the present invention is made based upon the finding that
the solder balls can be removed when a solder ball jam occurs
within a supply path provided that air is fed within the supply
path.
[0020] That is, according to the present invention, there is
provided a solder ball supplying method including: introducing a
solder ball from a hopper formed in an upper block to a receiving
hole of a ball separator that is sandwiched between the upper block
and a lower block; sliding the ball separator between the upper
block and the lower block; and sending the solder ball that has
been taken into the receiving hole to an outside of the upper block
and the lower block, wherein when introducing the solder ball from
the hopper into the receiving hole, the solder ball is forcibly
introduced into the receiving hole by sucking the solder ball from
within a projected region on the lower block, the projected region
being situated inside of the receiving hole at a time when the
solder ball is taken into the receiving hole and surrounding a
rolling trajectory of the solder ball that has been taken into the
receiving hole.
[0021] Further, it is desirable to increase a pressure within the
hopper when introducing the solder ball from the hopper into the
receiving hole, or swing the upper block in a direction in which
the ball separator slides when introducing the solder ball from the
hopper into the receiving hole.
[0022] Further, the solder ball supplying method may also include:
inserting an intermediate block between the upper block and the
ball separator, the intermediate block having a plate thickness of
a multiple of a diameter of the solder ball and including a solder
ball introduction path of a size corresponding to an inner diameter
of the receiving hole; and performing alignment on the solder ball
in the solder ball introduction path before the solder ball is
introduced into the receiving hole.
[0023] Further, the solder ball supplying method preferably
includes, when the solder ball is jammed while being conveyed from
the hopper to the receiving hole, removing the jammed solder ball
by moving the upper block in a direction in which the ball
separator slides, and feeding air into a path extending from the
upper block to the lower block through a cleaning path that is
formed in the upper block.
[0024] Further, according to the present invention, there is
provided a solder ball supplying device including: an upper block
in which a hopper for introducing a solder ball is provided; a
lower block; a ball separator that is sandwiched between the upper
block and the lower block and that has a receiving hole to which
the solder ball is taken in from a bottom portion of-the hopper,
the ball separator sending the solder ball, which has been taken
into the receiving hole by sliding of the ball separator, to an
outside of the upper block and the lower block as the ball
separator slides; and a solder ball suction path provided within a
projected region on the lower block, the projected region being
situated inside of the receiving hole at a position where the
solder ball is taken in and surrounding a rolling trajectory of the
solder ball that has been taken into the receiving hole, the solder
ball being forcibly introduced form the hopper into the receiving
hole by using the solder ball suction path.
[0025] Here, it is desirable that a gas supplying means for
increasing a pressure within the hopper be connected to the upper
block, or that swinging means be provided to the upper block, for
enabling the upper block to move reciprocatively in a direction in
which the ball separator slides.
[0026] Further, the solder ball supplying device may include an
intermediate block provided between the upper block and the ball
separator, the intermediate block having a plate thickness that is
a multiple of a diameter of the solder ball and having a solder
ball introduction path of a size that corresponds to an inner
diameter of the receiving hole.
[0027] Further, it is preferable that a cleaning path be provided
in the upper block and by a side of the hopper, and that the solder
ball that is jammed within a path extending from the upper block to
the lower block through the cleaning path be removed by feeding air
into the path.
[0028] According to the configuration described above, by
performing suction from the solder ball suction path, a large
number of solder balls introduced into the hopper are reliably
taken into the receiving hole by being directly sucked from the
receiving hole that is continuous with the solder ball suction
path.
[0029] The solder ball suction path discussed here is formed within
a projected region on a lower block which is situated inside of the
receiving hole at a position where a solder ball is taken in, and
which surrounds a rolling trajectory of the solder ball that has
been taken into the receiving hole. Accordingly, the lowest point
of the solder ball does not interfere with the solder ball suction
path, even if the ball separator is made to slide. That is, the
lowest point of the solder ball is always in rolling contact with a
surface of the lower block on which the ball separator slides, and
the height of the ball is maintained as constant. Therefore, it is
possible to prevent a situation where the solder ball and the
vicinity of an end of the solder ball suction path interfere with
each other due to a step formed therebetween, causing defects such
as the solder ball being caught in the step.
[0030] In addition, it is possible to increase the pressure within
the hopper (internal pressure) because the gas supplying means is
connected to the upper block. Accordingly, it becomes possible to
push out the solder ball from the hopper side to the receiving
hole, and introduction of the solder ball into the receiving hole
can be made more reliable together with the suction from the solder
ball suction path. It should be noted that it becomes possible to
prevent oxidation of the solder balls within the hopper by using an
inert gas, typically nitrogen gas or the like, for the gas that is
supplied from the gas supplying means. Further, it becomes possible
to agitate the solder balls within the hopper when swinging means
is provided to the upper block, and introduction of the solder ball
into the receiving hole can be made more reliable together with the
suction from the solder ball suction path.
[0031] It should be noted that the solder balls can be aligned
prior to being introduced into the receiving hole by inserting an
intermediate block between the upper block and the ball separator.
It thus becomes possible to reliably introduce the solder ball into
the receiving hole. The solder balls that are located within the
solder ball introduction path do not protrude out form the
intermediate block because the plate thickness of the intermediate
block is set to an integer multiple of the diameter of the solder
balls. Accordingly, the solder balls located within the solder ball
introduction path can be prevented from interfering with the ball
separator side, that is, with an edge portion of the receiving
hole. Jamming due to the solder ball becoming caught in the edge
portion can thus be prevented.
[0032] In addition, when a cleaning path is provided by the side of
the upper block, an air feed pathway made up of a cleaning path,
the solder ball introduction path, the receiving hole, and the
solder ball suction path can be formed by sliding the upper block.
Accordingly, even if solder ball jam occurs while the solder ball
is being sent out, the solder ball that is causing the jam can be
removed to an outer portion of the solder ball supplying device,
without disassembling the solder ball supplying device itself, by
forming the air feed pathway and feeding air to the air feed
pathway.
[0033] According to the present invention as discussed above, the
solder ball supplying device has the upper block in which the
hopper for introducing the solder ball is formed, the lower block,
and the ball separator sandwiched between the two blocks and having
the receiving hole into which the solder ball is taken in from a
bottom portion of the hopper. The ball separator sends the solder
ball held in the receiving hole out to an external portion of the
blocks by sliding. The solder ball suction path is formed within a
projected region on a lower block which is situated inside of the
receiving hole at the position where the solder ball is taken in
and which surrounds the rolling trajectory of the solder ball that
has been taken into the receiving hole. The solder ball is forcibly
introduced into the receiving hole from the hopper. Accordingly,
even if the solder balls are small in size, and the separation
characteristics of the solder balls worsen due to static
electricity, it becomes possible to reliably separate and supply
each of the solder balls. The cleaning path is provided by the side
of the hopper in the upper block, and air is fed to a path
extending from the upper block to the lower block via the cleaning
path. Therefore, even when a solder ball jam occurs, for example,
the solder ball can be easily removed without needing to
disassemble the solder ball supplying device itself.
BRIEF DESCRIPTION OF THE DRAWINGS
[0034] FIG. 1 is a cross sectional explanatory diagram that shows
the structure of a solder ball supply device according to an
embodiment of the present invention;
[0035] FIG. 2 is a top view of a lower block for explaining the
concept of setting the location of an upper opening of a solder
ball suction path;
[0036] FIG. 3 is a main portion cross sectional explanatory diagram
that shows the location of the upper opening of the suction path
according to the embodiment of the present invention;
[0037] FIG. 4 is a flowchart that shows a procedure for operating a
solder ball supplying device;
[0038] FIG. 5 is a flowchart that shows a cleaning procedure of a
solder ball supplying device;
[0039] FIG. 6 is a cross sectional explanatory diagram of a
supplying device that performs cleaning operations by aligning a
cleaning path with a solder ball suction path; and
[0040] FIG. 7 is a structural explanatory diagram that shows-a
conventional solder ball supplying device.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0041] Preferred embodiments of a solder ball supplying method and
a solder ball supplying device according to the present invention
are explained in detail below with reference to the drawings. FIG.
1 is a cross sectional explanatory diagram that shows the structure
of a solder ball supply device according to this embodiment.
[0042] Referring to FIG. 1, a solder ball supplying device 10
includes an upper block 12, an intermediate block 14, a ball
separator 16, and a lower block 18 that are disposed in the stated
order from an upper side in a vertical direction.
[0043] A hopper 20 having an opening in an upper surface is
provided to the upper block 12, and it is possible to introduce a
large number of solder balls 22 into the hopper 20. Further, a
cleaning path 24 that passes through the upper block 12 in a
vertical direction is provided in the vicinity of the hopper 20. It
should be noted that, in order to discharge jammed solder balls to
an outer portion of the solder ball supplying device, the cleaning
path 24 is set larger than at least a receiving hole formed in the
ball separator 16 and described later (the cleaning path 24 and the
receiving hole are set to the same size in this embodiment).
[0044] A top plate 26 that blocks the opening of the hopper 20 is
provided in the upper block 12 and above the hopper 20. It is also
possible to connect a gas supplying means (not shown) to the top
plate 26 by using a gas feed pipe (also not shown), and supply
nitrogen gas as an inert gas to prevent oxidation of the solder
balls 22 into the inner portion of the hopper 20 (refer to an arrow
28 in FIG. 1).
[0045] Agitation of the large number of solder balls 22 that are
introduced into the hopper 20 is performed by further providing a
swinging means (not shown) to the upper block 12, and operating the
swinging means in a direction of an arrow 30 in FIG. 1.
[0046] The intermediate block 14 that is provided below the upper
block 12 can move relative to the upper block 12 and to the
swinging direction (the arrow 30) of the upper block 12. The
thickness of the intermediate block 14 is set to be an integer
multiple of the diameter of the solder balls 22. A solder ball
introduction path 32 that has an inner diameter such that the
solder balls 22 can pass through the solder ball introduction path
32 while being arranged in a single line is further provided to the
intermediate block 12. The solder balls are thus housed in the
intermediate block 16 in a state where the solder balls are
arranged in a single line (without protruding out from front and
rear surfaces), along the solder ball introduction path 32, when an
opening of the solder ball introduction path 32 is positioned at a
bottom portion of the hopper 20.
[0047] The ball separator 16 that is sandwiched between the
intermediate block 14 and the lower block 18 is made from a plate
member having a thickness large enough to house a single solder
ball 22. The ball separator 16 can slide between the intermediate
block 14 and the lower block 18 in the direction of an arrow 34 in
FIG. 1. It should be noted that a receiving hole 36 is formed in
the ball separator 16. The receiving hole 36 is sized such that it
can take in only a single solder ball 22. The solder ball 22 can be
taken in from the hopper 20 via the solder ball introduction path
32. It should also be noted that the solder ball 22 that has been
taken into the receiving hole 36 is exposed from an end surface of
the upper block 12 upon moving to a leftmost edge in the figure by
the sliding motion of the ball separator 16. The solder ball 22 can
be taken out from the receiving hole 36 by upward and downward
motion (in the direction of an arrow 42 in FIG. 1) of a handling
means 38 that is provided in a side portion of the upper block 12.
Further, a guide block 40 that connects with the lower block 18 is
provided directly below the handling means 38. The guide block 40
guides the sliding motion of the ball separator 16.
[0048] The lower block 18 that supports the members constituting
the solder ball supplying device 10 as described above slidably
guides the ball separator 16 together with the guide block 40. A
solder ball suction path 44 having an opening in an upper surface
is formed in the lower block 18. The solder balls in the hopper are
forcibly taken into the receiving hole 36 by a suction action
(indicated by an arrow 46 in FIG. 1) by using the solder ball
suction path 44.
[0049] A positional relationship for the upper opening of the
solder ball suction path 44 is set based on a concept described
below.
[0050] FIG. 2 is a main portion cross sectional diagram for
explaining the concept of setting the position of the upper opening
of the solder ball suction path.
[0051] Referring to FIG. 2, in setting the position of the upper
opening of the solder ball suction path, the ball separator 16 is
moved to a position at which the solder ball 22 is introduced into
the receiving hole 36. Thus, an inner region of the receiving hole
36 at the position where the solder ball 22 is taken in is first
determined. After determining the inner region of the receiving
hole 36, a rolling trajectory 48 of the solder ball 22 along which
the ball separator 16 is moved to the handling means 38 side is
made to overlap the inner region. A region 50 that surrounds the
rolling trajectory 48 in the inner region can thus be derived by
overlapping the inner region with the rolling trajectory. A
superior suctioning action on the solder ball 22 can be obtained
provided that the position of the upper opening of the solder ball
suction path 44 is set to be within the region 50. Further, the
position of the upper opening of the solder ball suction path 44
does not overlap with the rolling trajectory 48, and therefore the
solder ball 22 that has been taken into the receiving hole 36 can
roll at a constant height on an upper surface of the lower block
18. The solder ball 22 can easily be moved to the handling means 38
side.
[0052] It should be noted that the region 50 in FIG. 2 shows a
range within which it is possible to set the position of the upper
opening of the solder ball suction path 44. However, it is not
necessary to set the upper opening of the solder ball suction path
so as to cover the entirety of the region 50. The position of the
upper opening of the solder ball suction path 44 can of course be
flexibly set according to a variety of requirements regarding the
machining method and design.
[0053] FIG. 3 is a main portion cross sectional explanatory diagram
that shows the location of the upper opening of the suction path
according to this embodiment. Referring to FIG. 3 (and to FIG. 1),
the upper opening of the solder ball suction path 44 may be given a
round shape, and may be made to overlap the region 50 such that it
does not interfere with the rolling trajectory 48 of the solder
ball 22 projected onto the lower block 18. A cross hatched portion
52 shown in FIG. 3, where the round upper opening and the region 50
overlap, is a portion where actual suctioning action is performed.
However, the upper opening is located in an inner portion of the
region 50, and therefore suctioning of the solder ball 22 can be
reliably performed even with this opening shape. It should be noted
that it becomes possible to perform machining by using a general
purpose cutting tool such as a drill if the upper opening is given
a round shape. The time required to machine the lower block 18, and
the manufacturing costs can thus be reduced.
[0054] A procedure for supplying the solder balls 22 used in
connecting a bonding pad that is formed on a magnetic head slider
and a pad that is formed on a lead frame side by using the solder
ball supplying device 10 configured as described above is
explained.
[0055] It should be noted that the solder balls 22 that are used in
connecting the pad formed on the magnetic head slider and the pad
formed on the lead frame side are minute, having an outer diameter
on the order of 80 to 150 microns.
[0056] FIG. 4 is a flowchart that shows a procedure for operating
the solder ball supplying device.
[0057] After supplying a plurality of the solder balls 22 to the
hopper 20, the gas supplying means is operated and nitrogen gas is
supplied to the hopper 20 as shown in FIG. 4 in order to supply the
solder balls 22 by using the solder ball supplying device 10.
Further, suctioning of the solder balls 22 from the solder ball
suction path 44 is started together with the nitrogen gas supply
(step 100).
[0058] After performing the operations of step 100, the upper block
is moved reciprocatively two times in the arrow 30 direction by
using the swinging means, eliminating any bias in the solder balls
22 within the hopper 20 and moving the solder balls 22 to the
bottom of the hopper 20 (step 110).
[0059] The solder balls 22 can be reliably sent from the hopper 20
side to the receiving hole 36 of the ball separator 16 by
performing the operations of step 100 and step 110, even if the
solder balls 22 are small and lightweight, and further, even if the
solder balls 22 are difficult to separate due to static
electricity.
[0060] After introducing the solder ball 22 to the ball separator
16 side, the ball separator 16 is moved in the direction of the
arrow 34 to the location of the handling means 38 (step 120). It
should be noted that, when moving the ball separator 16 from below
the hopper 20 to the handling means 38 side, the solder ball 22
that has been taken into the receiving hole 36 rolls on the lower
block 18, along the rolling trajectory 48. Accordingly, defects
such as one in which the solder ball 22 approaches the vicinity of
the edge of the opening of the solder ball suction path 44, and the
solder ball 22 gets caught, can be avoided.
[0061] After the ball separator 16 is moved to the handling means
38 side, the handling means 38 is lowered to the receiving hole 36
side, and the solder ball 22 is taken out by using means such as
vacuum suction (step 130).
[0062] It thus becomes possible to remove one of the solder balls
22 from within the plurality of solder balls 22 if the procedure
described above is performed. After the solder ball 22 is taken out
by the handling means 38, the handling means 38 is raised, and the
ball separator 16 is again moved to the hopper 20 side (step 140).
The operations described above may then be repeated.
[0063] The solder ball supplying means 10 according to this
embodiment does not only supply the solder balls 22. A cleaning
function is also provided. The cleaning function is capable of
removing a jammed solder ball 22 without disassembling the solder
ball supplying device itself for cases where a jam occurs while the
solder ball 22 is being sent out.
[0064] FIG. 5 is a flowchart that shows a procedure for cleaning
the solder ball supplying device.
[0065] Referring to FIG. 5, when a jam occurs in the solder ball
supplying device 10 due to the solder ball 22, first the gas
supplying means in the solder ball supplying device 10 is stopped,
and nitrogen gas is no longer supplied to the hopper 20. Further,
suctioning of the solder ball 22 by the solder ball suction path 44
is also stopped at the same time as the nitrogen gas supply to the
hopper 20 is stopped (step 200).
[0066] After performing the operations of step 200, the upper block
12 is moved to the handling means 38 side, and the cleaning path 24
formed in the upper block 12 is made to align with the solder ball
suction path 44 instead of the hopper 20 (step 210). FIG. 6 is a
cross sectional explanatory diagram of the solder ball supplying
device performing cleaning operations by making the cleaning path
align with the solder ball suction path.
[0067] Referring to FIG. 6, after movement of the upper block 12
makes the cleaning path 24 align with the solder ball suction path
44, air is fed to the solder ball suction path 44 from the lower
block 18 side, and suctioning for removing the jammed solder ball
22 is performed from an air feeding pipe (not shown) that is
connected to the top plate 26 (step 220). An arrow 54 in FIG. 6
shows the direction of a cleaning air flow during cleaning.
[0068] After the cleaning air flow is fed in the direction of the
arrow 54, the ball separator 16 is moved reciprocatively two times
from this state (step 230).
[0069] There is a danger that the solder ball may deform within the
solder ball introduction path 32, causing a jam as shown in FIG. 6,
with the solder ball supplying device 10. If a solder ball 56 that
has deformed exists within the solder ball introduction path 32,
the solder ball 22 that is positioned directly below the solder
ball 56 is pushed out due to the deformation of the solder ball 56,
protruding out from a lower opening of the intermediate block 16.
In this case, moving the ball separator 16 reciprocatively can make
an edge portion of the receiving hole 36 push up the solder ball 22
directly below the solder ball 56, and the solder ball 56 can be
removed from within the solder ball introduction path 32. The
cleaning air flow is fed into the solder ball introduction path 32
in the direction of the arrow 54 here as described above.
Accordingly, the solder ball 56 that has been removed from within
the solder ball introduction path 32 by the reciprocative motion of
the ball separator 16 (and the solder ball 22 that is positioned
below the solder ball 56 as well), moves further upward, and is
then expelled to a portion outside of the solder ball supplying
device 10.
[0070] After removing the solder ball 56 that is jammed within the
solder ball supplying device 10 to a portion outside of the solder
ball supplying device 10 by the sequence of operations described
above, the air feed to the solder ball suction path 44 and the
suctioning action from the air feed pipe are stopped in order to
stop the cleaning air flow shown by the arrow 54 (step 240).
[0071] In addition, after performing step 240, the upper block 12
is moved until the solder ball introduction path 32 or the like is
directly below the hopper 20 (step 250). After moving the upper
block 12 from the state of FIG. 6 to the state of FIG. 1 by the
operations of step 250, the gas supplying means may again be
operated, supplying nitrogen gas to the hopper 20 and starting the
suctioning of the solder balls 22 by the solder ball suction path
44 (step 260). Operations for supplying the solder balls 22 may
thus be restarted.
[0072] For cases where a jam occurs due to the solder ball 22 while
operations for supplying the solder. ball 22 are being performed,
the solder ball supplying device 10 may be placed in a cleaning
state, and the solder ball that is causing the jam may be removed.
After cleaning is complete by removing the solder ball, processing
may again return to operations for supplying the solder balls 22.
It is not necessary to disassemble the solder ball supplying device
10 in order to remove the solder ball that is causing the jam. It
thus becomes possible to increase the operating efficiency of the
solder ball supplying device 10.
[0073] It should be noted that, although solder balls used for the
slider pad in the magnetic head are taken as an example in this
embodiment, there are no limitations placed on the use of the
solder ball supplying device. In addition, the solder ball
supplying device can of course also be applied to solder balls
having different outer diameters.
[0074] This application claims priority from Japanese Patent
Application No. 2003-311010 filed Sep. 3, 2003, which is hereby
incorporated by reference herein.
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