U.S. patent application number 10/791771 was filed with the patent office on 2005-03-03 for electronic apparatus.
Invention is credited to Kondo, Yoshihiro, Nakagawa, Tsuyoshi.
Application Number | 20050045309 10/791771 |
Document ID | / |
Family ID | 34131830 |
Filed Date | 2005-03-03 |
United States Patent
Application |
20050045309 |
Kind Code |
A1 |
Kondo, Yoshihiro ; et
al. |
March 3, 2005 |
Electronic apparatus
Abstract
In an electronic apparatus, having a heat diffusion structure
having high efficiency, for corresponding to small-sizing and
high-performances of an electronic part therein, a liquid sealing
portion is provide on a cover on a side of the electronic part,
which builds up a water-cooling jacket attached on an upper portion
of the electronic part. Further, within an inside of this liquid
sealing portion, a heat diffusion plate is provided, extending from
the vicinity of the center of the water-cooling jacket in zigzag
manner. With this, heat generated from the electronic part can be
spread all over the cover, as a whole, on the side of the
electronic part, with an aid of the evaporation heat of the liquid.
The heat spread can be transmitted into the cooling liquid
circulating within a housing thereof, through liquid flow passages
of the water-cooling jacket, thereby being radiated into the
atmosphere from the portion having a large or wide heat radiation
area of the housing. Further, the heat generated from the
electronic parts can be further spread, up to the water-cooling
jacket having a wide area.
Inventors: |
Kondo, Yoshihiro;
(Tsuchiura, JP) ; Nakagawa, Tsuyoshi; (Hadano,
JP) |
Correspondence
Address: |
ANTONELLI, TERRY, STOUT & KRAUS, LLP
1300 NORTH SEVENTEENTH STREET
SUITE 1800
ARLINGTON
VA
22209-9889
US
|
Family ID: |
34131830 |
Appl. No.: |
10/791771 |
Filed: |
March 4, 2004 |
Current U.S.
Class: |
165/80.3 ;
257/E23.088; 257/E23.098 |
Current CPC
Class: |
H01L 23/473 20130101;
H01L 2924/3011 20130101; H01L 23/427 20130101; H01L 2924/0002
20130101; H01L 2924/0002 20130101; H01L 2924/00 20130101 |
Class at
Publication: |
165/080.3 |
International
Class: |
F28F 007/00; F28D
015/00 |
Foreign Application Data
Date |
Code |
Application Number |
Sep 3, 2003 |
JP |
2003-310850 |
Claims
What is claimed is:
1. An electronic apparatus, comprising: a semiconductor element
installed within a housing; a heat-receiving portion for receiving
heat generated from said semiconductor element; and a heat
radiation portion being connected between said heat radiation
portion and said heat-receiving portion through conduits, wherein a
heat diffusion plate is provided between said heat-receiving
portion and said semiconductor element.
2. The electronic apparatus, as described in the claim 1, wherein:
said heat diffusion plate is made of a metal defining a
hermetically closed space therein, for enclosing evaporation medium
within an inside thereof.
3. The electronic apparatus, as described in the claim 2, wherein:
within the inside of said hermetically close space is attached a
metal plate, expanding radial directions from a portion of said
semiconductor element.
4. The electronic apparatus, as described in the claim 3, wherein:
said metal plate is formed zigzagging.
5. The electronic apparatus, as described in the claim 1, wherein:
said heat-receiving portion comprises four (4) pieces of liquid
circulation flow passages within an inside thereof.
6. The electronic apparatus, as described in the claim 1, wherein:
said liquid circulation flow passages are defined by three (3)
pieces of partition walls attached on an interior wall surface of
an upper cover for building up said heat-receiving portion.
Description
BACKGROUND OF THE INVENTION
[0001] The present invention relates to an electronic apparatus
having a heat-generation element therein.
[0002] Among the electronic apparatuses, comprising a water-cooling
system therein, a cooling structure for aiming a high efficiency of
the water-cooling jacket is already known, for example, in Japanese
Patent Laying-Open No. 2003-21480 (2003).
[0003] The structure for receiving and radiating heat, putting a
thermo-element between a water-cooling jacket and a plate heat
pile, is already known, for example, in Japanese Patent Laying-Open
No. 2002-16204 (2002).
[0004] Further, in Japanese Patent Laying-Open No. Hei 6-216554
(1994), there is described a technology for cooling a
heat-generation element to be used into a part of an electronic
appliances or equipments, such as, a printed circuit board, etc.,
through a metal case made up with a group of flat heat pipes.
[0005] However, those of the conventional arts mentioned above
relate to the technology of removing the heat generated from an
electronic part through circulation of a liquid, but none of those
pays the considerations on small-sizing of the electronic
apparatus, and also the diffusion of heat with high efficiency, for
dealing with an increase of heat-generation density accompanying
with high performances thereof.
[0006] Namely, with only attaching the water-cooling jacket on the
electronic part, it is impossible to spread out the heat over the
water-cooling jacket, but rather brings about localization of the
temperature thereon, easily.
[0007] Further, if putting the thermo-element between the heat pipe
and the water-cooling jacket, the heat resistance established upon
the contact surface between them; therefore there is also other
problem of causing the difference in temperature thereon.
SUMMARY OF THE INVENTION
[0008] An object of the present invention, accordingly, is to
provide a heat diffusion structure, having high efficiency for
coping or treating with the small-sizing and high-performances of
an electronic part in the electronic apparatus.
[0009] For accomplishing the object mentioned above, according to
the present invention, there is provided an electronic apparatus,
comprising: a semiconductor element installed within a housing; a
heat-receiving portion for receiving heat generated from said
semiconductor element; and a heat radiation portion being connected
between said heat radiation portion and said heat-receiving portion
through conduits, wherein a heat diffusion plate is provided
between said heat-receiving portion and said semiconductor
element.
[0010] Also, for accomplishing the object mentioned above,
according to the present invention, there is provided the
electronic apparatus, as described in the above, wherein: said heat
diffusion plate is made of a metal defining a hermetically closed
space therein, for enclosing evaporation medium within an inside
thereof.
[0011] Further, for accomplishing the object mentioned above,
according to the present invention, there is provided the
electronic apparatus as mentioned above, wherein: within the inside
of said hermetically close space is attached a metal plate,
expanding radial directions from a portion of said semiconductor
element.
[0012] Also, according to the present invention, for accomplishing
the object mentioned above, there is provided the electronic
apparatus as mentioned above, wherein: said metal plate is formed
zigzagging.
[0013] And further, according to the present invention, for
accomplishing the object mentioned above, there is provided the
electronic apparatus as mentioned above, wherein: said
heat-receiving portion comprises four (4) pieces of liquid
circulation flow passages within an inside thereof.
[0014] And also, for accomplishing the object mentioned above,
according to the present invention, there is provided the
electronic apparatus as mentioned above, wherein: said liquid
circulation flow passages are defined by three (3) pieces of
partition walls attached on an interior wall surface of an upper
cover for building up said heat-receiving portion.
BRIEF DESCRIPTION OF THE VARIOUS VIEWS OF THE DRAWING
[0015] Those and other objects, features and advantages of the
present invention will become more readily apparent from the
following detailed description when taken in conjunction with the
accompanying drawings wherein:
[0016] FIG. 1 is a perspective view of an electronic apparatus,
according to a first embodiment of the present invention;
[0017] FIG. 2 is an outline view for showing a water-cooling
system, according to the first embodiment, in particular, seen from
the right-hand side surface thereof;
[0018] FIG. 3 is a cross-section view of the water-cooling jacket,
according to the first embodiment;
[0019] FIG. 4 is A-A cross-section view of the water-cooling jacket
shown in FIG. 3 mentioned above;
[0020] FIG. 5 is a cross-section view of the water-cooling jacket,
according to a second embodiment of the present invention;
[0021] FIG. 6 is B-B cross-section view of the water-cooling jacket
shown in FIG. 5 mentioned above; and
[0022] FIG. 7 is a cross-section view of a liquid sealing portion,
according to a third embodiment of the present invention.
DETAILED DESCRIPTION OF THE INVENTION
[0023] Explanation will be given about embodiments according to the
present invention, by referring to figures attached herewith.
[0024] [Embodiment 1]
[0025] FIG. 1 is a perspective view of an electronic apparatus,
according to an embodiment of the present invention.
[0026] In FIG. 1, an electronic apparatus 1 is built up with a
cabinet 2 and a plural number of electronic apparatus units 3. Each
of the electronic apparatus units 3 is provided with a display
portion 4 on a front surface 5 thereof, for indicating the
apparatus being in the condition of turning electricity or not
therethrough (e.g., ON or OFF of power thereof), etc., for example.
This electronic apparatus unit is, so-called a server.
[0027] FIG. 2 is an outlook view of the electronic apparatus shown
in FIG. 1, but seen from the right-hand side thereof.
[0028] In FIG. 2, within an inside of the cabinet 2 building up the
electronic apparatus 1, a plural number of the electronic apparatus
units 3 are installed in a manner of multi-stages (in the present
embodiment, eight (8) stages, for example, and the details of the
electronic apparatus unit will be mentioned about only the unit
installed at the lowest stage thereof).
[0029] Within the electronic apparatus unit 3 is received a CPU 7
(i.e., a semiconductor element) generating heat therefrom. For the
purpose of cooling of this CPU 7, a first cooling system is
installed, for circulating a liquid for the purpose of cooling
thereof.
[0030] Explaining the details of this first cooling system, a
micro-pump 6, a heat-receiving jacket 15 and also a heat exchanger
8 are connected sequentially, by means of conduits. The
heat-receiving jacket 15 is thermally connected to the CPU 7,
therefore the heat generated from the CPU 7 is absorbed by means of
the heat-receiving jacket 15. The cooling water absorbing the heat
therein is driven to circulate within the direction (i.e., the
circulation direction of liquid), as indicted by an arrow 15a, with
an aid of the function of the micro-pump 6.
[0031] While, explaining about the details of a second cooling
system, a large-sized pump 9 is attached on a rear side of the
cabinet 2. To this large-sized pump 9 is connected a conduit 12.
This conduit is inserted into an inside of the electronic apparatus
unit 3 at each stage, and at the same time, a conduit 14 rising up
from the large-sized pump 9 in parallel with the cabinet 2 is in
contact with an interior wall surface of the cabinet 12. Onto the
conduit inserted into the inside of the electronic apparatus unit 3
are attached two (2) heat-receiving portions 11 and 12, wherein the
heat-receiving portion 10 is thermally connected with the
heat-receiving jacket 15 of the first cooling system while the
heat-receiving portion 11 is thermally connected with the heat
exchanger 8. The cooling liquid discharged from the pump 9
circulates in a direction of an arrow 14, and is collected into the
large-sized pump, again, after circulating around the electronic
apparatus unit 3 installed at each of the stages.
[0032] However, the first and the second cooling systems differ in
the circulation direction of the cooling water, as are indicated by
the arrows 14 and 15a.
[0033] With this, the heat generated from the CPU 7 in each the
electronic apparatus unit 3 is transmitted to the cabinet 2 via the
conduit 12, and the heat transmitted up to the cabinet 2 is
discharged into an atmosphere, through the natural heat radiation
upon the cabinet 2, as a whole, or by means of a cooling fan (not
shown in the figure), compulsively, which is provided in the
cabinet.
[0034] Since the first water-cooling system is attached onto each
of the electronic apparatus units 3, while also the second
water-cooling system is attached onto the cabinet 2, respectively,
there is no connection portion of the cooling water between the
first water-cooling system and the second water-cooling system.
Accordingly, it is possible to eliminate leakage of the cooling
water, in particular, when the electronic apparatus unit 3 is
attached/detached thereto.
[0035] Further, even in a case where one of the first and second
water-cooling systems is in trouble and/or stall thereof,
assumingly, either one of the water-cooling systems is still on the
operation thereof, and therefore, there is no necessity of stopping
the electronic apparatus, as a whole. Also, the circulating
direction of the cooling water in the first water-cooling system;
i.e., the cooling liquid becoming hot due to the heat-generation of
the CPU, and the circulating direction of the cooling water in the
second water-cooling system, which is mounted on the cabinet 2,
they are reversed or opposing to each other; then, the cooling
water of the second water-cooling system passes through a
high-temperature portion of the electronic apparatus unit 3, and
therefore it is possible to mitigate an increase of temperature of
the cooling water and also to increase the reliability of the
materials of building up the water-cooling system.
[0036] FIG. 3 is a cross-section view for explaining the structure
of the water-cooling jacket 15 described in FIG. 2 mentioned
above.
[0037] FIG. 4 is A-A cross-section view of the water-cooling jacket
shown in FIG. 3 mentioned above.
[0038] In those FIGS. 3 and 4, the heat-receiving jacket 15 is
thermally connected with the CPU 7 through heat-conductive grease
or the like. The CPU 7 is mounted on an electronic substrate or
board 21. The CPU 7, since it is not only coming to be fine due to
the high-integration of a semiconductor element; i.e., being small
in an external sizes thereof, but also increasing the consumption
electric power thereof accompanying with the high-performances
thereof, therefore it rises up an amount of heat-generation per a
unit of area thereof. For example, it is about 200W per. 1 square
centimeter.
[0039] The heat-receiving jacket 15 is built up with an upper cover
16 and a lower cover 18, wherein onto the upper cover 16 is fixed
the lower cover 18 by means of screws 17, which are inserted from
tapped holes formed on the upper cover 16 into tapped holes formed
on the lower cover 18. Onto the lower cover 18 are formed three (3)
pieces of partition walls 18a in one body, and each of tips of the
portion wall is closely in contact with an interior wall surface of
the upper cover 16. Due to this partition wall 18a, four (4) pieces
of flow passages 19 are formed therewith. A reference numeral 18b
depicts a supply opening of the cooling water, while 18c a
discharge opening of the cooling water.
[0040] With this, as indicated by arrows 15a, the cooling water
flows within the four (4) pieces of the flow passages 19, in
parallel with, which are defined by the partition walls 18a.
[0041] A reference numeral 20 depicts a liquid sealing portion,
within which a very small amount of the cooling water is filled up
with. This liquid sealing portion 20 carries out the function of
so-called a heat pipe. Thus, while one surface thereof is in
contact with the CPU, the cooling liquid filled within an inside
thereof expands due to the heat generated from the CPU 7, thereby
spreading within an inside of the liquid sealing portion 20. With
this, the heat of the CPU 7 spreads out over the entire surface of
the liquid sealing portion 20. The heat spread is transmits to the
cooling liquid within the liquid flow passages 19 of the lower
cover 19, and the cooling liquid repeats the following cycle: i.e.,
being condensed, being liquefied, and turning back to the
heat-generation body 7. With an aid of this heat-receiving jacket
15 provided with the liquid sealing portion 20, it is possible to
treat with an increase in the density of heat-generation on the
heat-generation body 7, thereby enabling cooling down of the
heat-generation body 7, with ease.
[0042] Although having the liquid sealing portion 20, thereby
forming the heat pipe therewith, in FIG. 3, however the portion
where the liquid sealing portion 20 is provided may be made from a
plate-like member (i.e., a heat diffusion plate) of a material,
being very large in the heat conductivity thereof. This heat
diffusion plate may be made from a sintered body of carbon, or
diamond, for example. In this case, there is no necessity of the
space, in which the liquid is enclosed therein; thus, being simple
in the structure thereof, and also, it can be obtained with low
cost, because of no necessity of enclosing the liquid therein.
[0043] [Embodiment 2]
[0044] FIG. 5 is a cress-section view of the water-cooling jacket,
according to other embodiment.
[0045] FIG. 6 is B-B cross-section view of the water-cooling jacket
shown in FIG. 5 mentioned above.
[0046] In those FIGS. 5 and 6, an aspect of the present embodiment
differing from the embodiment 1 lies in that the liquid flow
passages 19 are formed in the upper cover 16.
[0047] The heat-receiving jacket 15 is connected with the CPU,
through the heat-conductive grease, etc., thermally. The CPU 7 is
mounted on the electronic substrate or board 21.
[0048] This heat-receiving jacket 15 is built up with an upper
cover 16 and a lower cover 18, wherein onto the upper cover 16 is
fixed the lower cover 18 by means of screws 17, which are inserted
from tapped holes formed on the upper cover 16 into tapped holes
formed on the lower cover 18. Onto the lower cover 18 are formed
three (3) pieces of partition walls 18a in one body, and each of
tips of the portion wall is closely in contact with an interior
wall surface of the upper cover 16. Due to this partition wall 18a,
four (4) pieces of flow passages 19 are formed with. Since the
circulation route of the cooling liquid is completely same to that
explained in relation with FIG. 3 mentioned above, therefore
explanation thereof will be omitted herein.
[0049] Onto the lower cover 18 is attached the liquid sealing
portion 20, explanation of which was given in the above, by
referring to FIG. 3 motioned above. This liquid sealing portion 20
is plate-like in the configuration thereof, and has a hermetically
sealed space therein, in which a very small amount of the cooling
liquid is filled up with. This liquid sealing portion 20 is a means
for carry out the function of the heat pile, as was mentioned
previously. Thus, being in contact with the CPU 7 on one side
surface thereof, the cooling liquid within inside thereof is
expanded due to the heat generated from the CPU 7, thereby
spreading the heat within the inside of the liquid sealing portion
20. With this, the heat of the CPU 7 spreads all over the entire
surface of the liquid sealing portion 20. The heat spreading is
transmits to the cooling liquid within the liquid flow passages 19
of the lower cover 19, and the cooling liquid repeats the following
cycle: i.e., being condensed, being liquefied, and turning back to
the heat-generation body 7. With an aid of this heat-receiving
jacket 15 provided with the liquid sealing portion 20, it is
possible to treat with the increase in the density of
heat-generation of the heat-generation body 7, thereby enabling the
cooling down of the heat-generation body 7, with ease.
[0050] FIG. 7 is a cross-section view of the liquid sealing portion
corresponding to the B-B cross-section view shown in FIG. 5
mentioned above.
[0051] In this FIG. 7, this embodiment is provided for the purpose
of further improving or enhancing the heat diffusion, and wherein a
zigzagging heat diffusion plate 22 is extended from an outer edge
in the vicinity of the heat-generation body 7 located at a central
portion of the lower cover 18, up to an outer peripheral wall
surface of the lower cover 18. With an aid of this heat diffusion
plate 22, the very small amount of the cooling liquid can flow up
to the outer peripheral wall surface of the lower cover 18 along
with the heat diffusion plate 22, and further it can also turn back
to the heat-generation body, again, therefore it is possible to
spread the heat swiftly and uniformly.
[0052] In this manner, with provision of the liquid sealing portion
on the cover at the side of the electronic part, which builds up
the water-cooling jacket attached on an upper portion of the
electronic parts in the electronic apparatus, it is also possible
to spread out the heat generated from the electronic part all over
the cover, as a whole, with an aid of the evaporation heat of the
liquid.
[0053] The heat spread is transmitted to the cooling liquid
circulating within the housing through the liquid flow passage in
the water cooling jacket, therefore it can be radiated into the
atmosphere from the portion having a large or wide heat radiation
area of the housing. Also, with provision of the heat diffusion
plate zigzagging from the vicinity of the center of the water
cooling jacket, within the inside of the water-cooling jacket, it
is possible to spread the heat generated from the electronic parts
further to the water-cooling jacket having a wide area.
[0054] Also, as was mentioned in the above, according to the
present invention, with provision of the liquid sealing portion on
the cover at the side of the electronic parts, which builds up the
water-cooling system being attached on the upper portion of the
electronic parts of the electronic apparatus, the heat generated
from the electronic part can be spread out all over the entire of
the cover on the side of the electronic parts through the
evaporation heat of the liquid. Further, the heat spread can be
radiated into the atmosphere from the portion having a large or
wide heat radiation area of the housing. Further, with provision of
the heat diffusion plate zigzagging from a position in the vicinity
of the center of the water-cooling jacket within the inside of the
liquid sealing portion of the water-cooling jacket, the heat
generated from the electronic parts can be further spread out, up
to the water-cooling jacket having a wide area.
[0055] As was fully explained in the above, according to the
present invention, it is possible to provide an electronic
apparatus, enabling the heat diffusion with high efficiency, in
coping with the small-sizing and high-performances of the
electronic parts thereof.
[0056] The present invention may be embodied in other specific
forms without departing from the spirit or essential feature or
characteristics thereof. The present embodiment(s) is/are therefore
to be considered in all respects as illustrative and not
restrictive, the scope of the invention being indicated by the
appended claims rather than by the forgoing description and range
of equivalency of the claims are therefore to be embraces
therein.
* * * * *