U.S. patent application number 10/398146 was filed with the patent office on 2005-02-17 for moulding apparatus and method.
Invention is credited to Bagnall, Paul, Duddin, Rod, Sims, Laurie.
Application Number | 20050035491 10/398146 |
Document ID | / |
Family ID | 9900499 |
Filed Date | 2005-02-17 |
United States Patent
Application |
20050035491 |
Kind Code |
A1 |
Bagnall, Paul ; et
al. |
February 17, 2005 |
Moulding apparatus and method
Abstract
The present invention provides a method of moulding an article,
the method comprising the steps of providing a mould (20) having a
mould cavity (41); providing first and second films (26, 28), at
least one of which has a length greater than the mould cavity (41);
aligning said films (26, 28) relative to one another; injecting a
thermoplastics material between the films (26, 28) to produce a
moulded article (44) having the films (26, 28) attached thereto;
and removing said article (44) from the mould (20).
Inventors: |
Bagnall, Paul; (Stratford,
GB) ; Sims, Laurie; (Harlow, GB) ; Duddin,
Rod; (Wisbech, GB) |
Correspondence
Address: |
JOHN S. PRATT, ESQ
KILPATRICK STOCKTON, LLP
1100 PEACHTREE STREET
ATLANTA
GA
30309
US
|
Family ID: |
9900499 |
Appl. No.: |
10/398146 |
Filed: |
July 3, 2003 |
PCT Filed: |
October 2, 2001 |
PCT NO: |
PCT/GB01/04389 |
Current U.S.
Class: |
264/272.11 ;
264/272.17; 425/129.1 |
Current CPC
Class: |
B29C 2045/14967
20130101; G06K 19/07779 20130101; G06K 19/07749 20130101; B29L
2031/3456 20130101; B29C 45/14467 20130101; B29K 2995/002 20130101;
B29C 45/14811 20130101; B29C 2045/14918 20130101; B29C 2045/14532
20130101; B29K 2715/006 20130101; B29C 45/14647 20130101; G06K
19/07783 20130101 |
Class at
Publication: |
264/272.11 ;
264/272.17; 425/129.1 |
International
Class: |
B29C 070/88 |
Foreign Application Data
Date |
Code |
Application Number |
Oct 2, 2000 |
GB |
0024070.5 |
Claims
1-54. (canceled)
55. A method of moulding an article incorporating an electronic
component, the method comprising the steps of: providing a mould
having a mould cavity; providing a first film having thereupon an
electronic component; providing a second film, one of said films
having a length greater than the mould cavity; aligning said films
relative to one another such that said electronic component of said
first film is disposed within the cavity; injecting a
thermoplastics material between the films to produce a moulded
article incorporating said electronic component and films; and
removing said article from the mould.
56. A method as claimed in claim 55 wherein both films have a
length greater than the mould cavity
57. A method as claimed in claim 55 wherein the first film is
provided with a plurality of electronic components, and the films
are aligned relative to one another across the mould cavity such
that at least one of said electronic components is disposed within
the cavity.
58. A method as claimed in claim 55 wherein the electronic
component overlies an external surface of the first film.
59. A method as claimed in claim 55 wherein the electronic
component is attached to the film by adhesive.
60. A method as claimed in claim 55 wherein the first film includes
one or more antennae in electrical contact with the electronic
component.
61. A method as claimed in claim 60 wherein the or each antennae is
formed by a layer of electrically conductive ink applied to the
first film.
62. A method as claimed in claim 60 wherein the or each antennae is
formed by a layer of electrically conductive metal provided on the
first film.
63. A method as claimed in claim 55 wherein the step of aligning
the films utilises an alignment member of the mould, and comprises
the step of moving said alignment member into contact with
alignment features of the films.
64. A method as claimed in claim 55 wherein the elongate films
comprise two planar films.
65. A method as claimed in claim 64 wherein the films are connected
to one another prior to their alignment in the mould cavity.
66. A method as claimed in claim 55 wherein said electronic
component is a semiconductor device.
67. A mould for use in moulding an article, the mould comprising
two mould members movable relative to one another, the mould having
an injection port for the injection of a thermoplastics material
and a recess defining a mould cavity, the mould being adapted to
receive two films, at least one having a length greater than the
mould cavity, the films being incorporated into an article during
moulding, wherein the mould includes alignment means adapted to
align said films relative to the mould members prior to moulding of
an article, the alignment means being provided between the mould
members and remote from the mould cavity.
68. A electronic component carrying means for use in the moulding
of articles incorporating a electronic component, said carrying
means being adapted to form a surface layer of said article during
moulding and comprising an elongate film having a length greater
than a mould cavity corresponding to said article and having a
spaced plurality of electronic components provided thereon.
69. A carrying means as claimed in claim 68 wherein the film is a
plastics material.
70. A carrying means as claimed in claim 69 wherein the film
comprises a plastic substrate having overlying printing ink and
lacquer layers.
71. A carrying means as claimed in claim 68 wherein the electronic
components overlie an external surface of the film and are attached
to the film by adhesive.
72. A carrying means as claimed in claim 68 wherein the film is
provided with one or more apertures alignable, in use, with an
injection port of a mould.
73. A carrying means as claimed in claim 68 wherein the carrying
means include one or more antennae in electrical contact with the
electronic components.
74. A carrying means as claimed in claim 73 wherein said one or
more antennae is formed by a layer of electrically conductive ink
applied to the film.
75. A carrying means as claimed in claim 73 wherein the or each
antennae is formed by a layer of electrically conductive metal
provided on the film.
76. A carrying means as claimed in claim 68 wherein said electronic
components are semiconductor devices.
Description
[0001] The present invention relates to the production of plastic
articles and in particular, though not exclusively, to plastic
articles having embedded therein an electronic component,
particularly semiconductor device, commonly referred to as a
chip.
[0002] FIG. 1 shows a perspective view of a smartcard generally
designated 10. The card 10 comprises a planar plastic body 12 and a
chip 14. The chip 14 is located in a recess in one side of the card
10 such that a face 16 of the chip lies substantially flush with
said side. Typically the chip face 16 may project from the card or
be recessed into the card by up to 20 microns. The body 12
typically comprises a rigid plastic core having information bearing
labels bonded to opposing sides thereof.
[0003] The card 10 is typically formed by an injection moulding
operation. Labels corresponding to the shape of the finished card
10, one of which labels carries the chip 14 are located in a mould.
The labels may be located in the mould by any suitable means, for
example electrostatically, mechanically and/or by suction. Once the
labels are in place, the mould is closed and a thermoplastics
material injected between the labels. The thermoplastics material,
once solidified, bonds the labels thereto, and the finished card
can be ejected from the mould.
[0004] The above described method is perceived to be less than
ideal as precise alignment of the labels with respect to both the
mould, and each other, is not always possible. When moulding a
plurality of articles in a common mould, it is typically necessary
to accurately position a plurality of labels which, it will be
appreciated, is time consuming and increases the possibility that
misalignment may occur.
[0005] According to a first aspect of the present invention there
is provided a method of moulding an article, the method comprising
the steps of:
[0006] providing a mould having a mould cavity:
[0007] providing a first and second films, at least one of said
films having a length greater than the mould cavity;
[0008] aligning said films relative to one another;
[0009] injecting a thermoplastics material between the films to
produce a moulded article having the films attached thereto;
and
[0010] removing said article from the mould.
[0011] In a preferred embodiment the moulded article is
incorporated in a double web formed by the films. In this manner a
continuous web having a plurality of moulded articles therein may
be produced. In such an embodiment, the method may include the
additional steps of;
[0012] moving the films relative to the mould so as to remove the
article from the mould and realigning said films relative to one
another across the mould cavity. The moulding operation may then be
repeated as required to mould further articles. In a preferred
embodiment both films have a length greater than the mould cavity.
The step of aligning the films may take place in the mould cavity
or, alternatively, prior to the films being positioned in the mould
cavity
[0013] The method preferably includes the additional step of
releasing the moulded article from the web. The article may be
released by any appropriate means including, for example, a
pressing, cutting and/or stamping operation.
[0014] The moulded article may be substantially planar. In a
preferred embodiment the thermoplastics material is injected
through one of the films. In such an embodiment the film may be
provided with an aperture or weakened region which is alignable
with an injection port of the mould.
[0015] The films may be laminar and comprise a plastic substrate
having overlying printing ink and lacquer layers. The printing ink
layer preferably conveys information in the form of lettering or
images. In an alternative embodiment the films may comprise a
plastic substrate, a plastic scuff layer and a layer of printing
ink therebetween. Taking the example where the mould is configured
so as to produce a planar article from which one or more further
articles are released by a cutting operation, the printing ink
layer is preferably configured so as to provided regions of ink
corresponding to in size and shape to said further articles. In a
preferred embodiment the or each printing ink region covers an area
slightly larger than that of the article to be released by said
cutting operation.
[0016] The films may be wider than the mould cavity such that, in
use, the web fully surrounds the or each moulded article.
[0017] According to a second aspect of the present invention there
is provided a method of moulding an article incorporating an
electronic component, the method comprising the steps of:
[0018] providing a mould having a mould cavity;
[0019] providing a first film having thereupon a spaced plurality
of electronic components;
[0020] providing a second film, one of said films having a length
greater than the mould cavity;
[0021] aligning said films relative to one another such that at
least one of said electronic components of said first film is
disposed within the cavity;
[0022] injecting a thermoplastics material between the films to
produce a moulded article incorporating said at least one
electronic component and films; and
[0023] removing said article from the mould.
[0024] In a preferred embodiment the article is incorporated in a
web formed by the films. In this manner a continuous web having a
plurality of moulded articles therein may be produced. In such an
embodiment, the method may include the additional steps of; moving
the films relative to the mould so as to remove the article from
the mould and aligning said films relative to one another across
the mould cavity such that at least one of said electronic
components of said first film is disposed within the cavity.
[0025] The moulding operation may then be repeated to mould another
article. In a preferred embodiment both films have a length greater
than that of the mould cavity. Both films may be provided with
electronic components.
[0026] The method preferably includes the additional step of
releasing the moulded article from the web. The article may be
released by any appropriate means including, for example, a
pressing, cutting and/or stamping operation. The moulded article is
in a preferred embodiment planar and may include a plurality of
electronic components moulded therein. In such an embodiment the
first film may be configured so as to dispose more than one
electronic component within the cavity prior to moulding.
Additionally the second film may be provided with a plurality of
spaced electronic components of which at least one is disposed
within the mould cavity prior to moulding. In a preferred
embodiment the thermoplastics material is injected through one of
the films. In such an embodiment the film may be provided with an
aperture or weakened region which is alignable with an injection
port of the mould.
[0027] The films may be laminar and comprise a plastic substrate
having overlying printing ink and lacquer layers. The printing ink
layer preferably conveys information in the form of lettering or
images. In an alternative embodiment the films may comprise a
plastic substrate, a plastic scuff layer and a layer of printing
ink therebetween. Taking the example where the mould is configured
so as to produce a planar article from which one or more further
articles are released by a cutting operation, the printing ink
layer is preferably configured so as to provided regions of ink
corresponding to in size and shape to said further articles. In a
preferred embodiment the or each printing ink region covers an area
slightly larger than that of the article to be released by said
cutting operation.
[0028] The electronic component may be received in a recess of the
first film, for example a through hole. Alternatively the
electronic components may overlie an external surface of the first
film. The electronic device may be attached to the film by
adhesive. The electronic component may be a semiconductor
device.
[0029] The first film may include one or more antennae in
electrical contact with the semiconductor device. The antennae may
be formed by a layer of electrically conductive ink applied to the
first film. In such an embodiment the semiconductor device may be
attached to the first film using an electrically conductive
adhesive. In an alternative embodiment the semiconductor device may
be attached using a non-conductive adhesive. In such an embodiment
the semiconductor may be arranged so as to be brought into
electrical contact with the antenna during moulding of the article.
In such an embodiment electrical contact may be achieved by
mechanical pressure exerted on the film and semiconductor device in
the mould during moulding.
[0030] The step of aligning the films preferably utilises an
alignment member of the mould, and comprises the step of moving
said alignment member into contact with alignment features of the
films. Said alignment features may comprises apertures of the
films.
[0031] According to a third aspect of the present invention there
is provided a mould for use in moulding an article, the mould
comprising two mould members movable relative to one another, the
mould having an injection port for the injection of a
thermoplastics material and a recess defining a mould cavity, the
mould being adapted to receive two elongate films, at least one
having a length greater than the mould cavity, the films being
incorporated into an article during moulding thereof, wherein the
mould includes alignment means adapted to align said films relative
to the mould members prior to moulding of an article, the alignment
means being provided between the mould members and remote from the
mould cavity.
[0032] In a preferred embodiment the alignment means comprise a
projection of one of the mould members and a corresponding recess
of the other of said mould members, the projection, in use, serving
to align the films. Preferably alignment of the films is achieved
by the projection being received in alignment recesses of the
films, with engagement of the sides of said recesses with said
projection serving to move the films into a desired alignment.
[0033] The recess may include a spring biased seat adapted to
receive the projection. In a preferred embodiment the seat is in
the form of a cylinder. The seat may be spring biased by any
appropriate means, for example one or more a mechanical springs or,
alternatively, by the application of fluid pressure. The projection
may be tapered. In a preferred embodiment the projection has a
tapered fore portion and a substantially parallel aft portion.
[0034] The mould may be provided with a plurality of mould cavities
linked by channels adapted to guide plastics material to the
cavities during moulding. In such an embodiment the injection port
is preferably aligned with one or more of said guide channels.
[0035] According to a fourth aspect of the present invention there
is provided a mould for use in moulding an article incorporating an
electronic component, the mould comprising two mould members
movable relative to one another, the mould having an injection port
for the injection of a thermoplastics material and a recess
defining a mould cavity, the mould being adapted to receive two
films for incorporation into an article during moulding, one of
said films carrying a spaced plurality of electronic components,
wherein the mould includes alignment means adapted to align said
films relative to the mould members prior to moulding of an
article, the alignment means being provided between the mould
members and remote from the mould cavity.
[0036] In a preferred embodiment the alignment means comprise a
projection of one of the mould members and a corresponding recess
of the other of said mould members, the projection, in use, serving
to align the films. Preferably alignment of the films is achieved
by the projection being received in alignment recesses of the
films, with engagement of the sides of said recesses with said
projection serving to move the films into a desired alignment.
[0037] The recess may include a spring biased seat adapted to
receive the projection. In a preferred embodiment the seat is in
the form of a cylinder. The seat may be spring biased by any
appropriate means, for example one or more a mechanical springs or,
alternatively, by the application of fluid pressure. The projection
may be tapered. In a preferred embodiment the projection has a
tapered fore portion and a substantially parallel aft portion.
[0038] The mould may be provided with a plurality of mould cavities
linked by channels adapted to guide plastics material to the
cavities during moulding. In such an embodiment the injection port
is preferably aligned with one or more of said guide channels.
[0039] According to a fifth aspect of the present invention there
is provided an electronic component carrying means for use in the
moulding of articles incorporating an electronic component, said
carrying means being adapted to form a surface layer of said
article during moulding and comprising a film having a spaced
plurality of electronic components provided thereon. In a preferred
embodiment the length of the carrying means is greater than the
mould cavity and the carrying means may have a width greater than
that of the mould cavity. The electronic components may be
semiconductor devices.
[0040] In a preferred embodiment the carrying means is a plastics
material. The carrying means may be laminar, for example comprising
a plastic substrate having overlying printing ink and lacquer
layers. The printing ink layer preferably conveys information in
the form of lettering or images. In an alternative embodiment the
carrying means may comprise a plastic substrate, a plastic scuff
layer and a layer of printing ink therebetween.
[0041] The semiconductor devices may be received in a recess of the
carrying means for example a through hole. Alternatively the
semiconductor devices may overlie an external surface of the
carrying means and may be attached to the carrying means by
adhesive. The carrying means may also be provided with one or more
apertures alignable, in use, with an injection port of a mould. In
an alternative embodiment the carrying means may be provided with
one or more weakened regions alignable, in use, with an injection
port of a mould.
[0042] The carrying means may include one or more antennae in
electrical contact with the or each semiconductor device. The
antennae may be formed by a layer of electrically conductive ink
applied to the carrying means In such an embodiment the or each
semiconductor device may be attached to the carrying means using an
electrically conductive adhesive. In an alternative embodiment the
or each semiconductor device may be attached using a non-conductive
adhesive. In such an embodiment the semiconductor may be arranged
so as to be brought into electrical contact with the antenna during
moulding a moulding operation. In such an embodiment electrical
contact may be achieved by mechanical pressure exerted on the
carrying means and semiconductor devices in the mould during
moulding.
[0043] Embodiments of the present invention will now be described
with reference to the accompanying drawings in which:
[0044] FIG. 1 shows a perspective view of a smartcard;
[0045] FIG. 2 shows a diagrammatic side view of a moulding
apparatus according to an aspect of the present invention;
[0046] FIG. 3 shows a cross-sectional view of a mould according to
an aspect of the present invention;
[0047] FIG. 4 shows a cross-sectional view of a first embodiment of
a chip carrying film;
[0048] FIG. 5 shows a cross-sectional view of a second embodiment
of a chip carrying film;
[0049] FIG. 6 shows a cross-sectional view of a third embodiment of
a chip carrying film;
[0050] FIG. 7 shows a plan view of an antenna configuration;
[0051] FIG. 8 shows a cross-sectional view of a fourth embodiment
of a chip carrying film;
[0052] FIG. 9 shows a cross-sectional view of a fifth embodiment of
a chip carrying film;
[0053] FIG. 10 shows a cross-sectional view of a sixth embodiment
of a chip carrying film;
[0054] FIG. 11 shows perspective view of a film configuration;
[0055] FIG. 12 shows a perspective view of an alternative film
configuration; and
[0056] FIG. 13 shows a perspective view of smartcards moulded
according to the present invention;
[0057] Referring firstly to FIGS. 2 and 3 there is shown a moulding
apparatus, generally designated 20, for the moulding of articles,
for example smartcards. The apparatus 20 comprises a mould 22 and
feed means 24 adapted to supply elongate films 26,28 to the mould
22 in a substantially continuous manner. In the embodiment the
films 26,28 are stored on reels 30,32, however it will be
understood that the films 26,28 may be stored in any appropriate
manner. In the embodiment shown the upper reel 30 is loaded with
film 26 having attached thereto a plurality of spaced chips 34. The
lower reel 32 is loaded with film 28 which does not have chips
attached thereto The constitution of the films 26,28 will be
discussed in greater detail below.
[0058] The term "chip" is intended to cover various semiconductor
devices which may be incorporated in a moulded article. The chip
may comprises an etched silicon wafer which is mounted in a housing
prior attachment to a film. Alternatively the chip may be of the
type commonly referred to as a "flip chip". A flip chip comprises
an etched silicon wafer which may be affixed directly to a
substrate without the need for a holder. The semiconductor device
may be arranged so as to provide a desired function in the moulded
article. Taking the example of a smart card, the semiconductor
device may be adapted to store information relating to the holder
of the card. The moulded article may take the form of a
telecommunications SIM card of the type adapted to be fitted to a
mobile phone apparatus, and thus the semiconductor device may be
adapted to store such information as text messages and telephone
numbers. In yet a further embodiment the moulded article may define
a memory card for an apparatus such as a digital camera.
Accordingly the semiconductor device may be adapted to store
digital image data for later retrieval.
[0059] As an alternative to chips, the present invention may also
be utilised for the moulding of one or more electronic components
including, but not limited to resistors, capacitors, inductors,
transistors and the like.
[0060] The mould 22 comprises upper and lower mould halves 36,38
which are movable towards and away from one another (arrows 40,42).
The upper half 36 is provided with a recess which, in use defines a
mould cavity 41, while the lower half 38 is provided with an
injection port 43.
[0061] In use, the films 26,28 are advanced into the mould 22 until
a desired film alignment with respect to the mould 22 is achieved.
The mould halves 36,38 are then brought together to close the mould
22 and a thermoplastics material is injected into the cavity 41 via
the injection port 43. The plastics material is injected between
the films 26,28 as the film 28 resting against the lower mould half
38 is provided with an aperture or weakened region which, in use is
aligned with the injection port 43. The introduction of the
plastics material between the films 26,28 urges the films 26,28
against their respective mould halves 36,38. The plastics material
bonds the films 26,28 thereto and encapsulates the chip 34 to form
a moulded article 44, in this case a smartcard, corresponding to
the shape of the mould cavity 41. In the simplified embodiment
shown, the mould 22 and films 26, 28 are configured so as to
manufacture a single smartcard per moulding operation. However, it
will be understood that the mould 22 may have alternative
configurations. For example, the mould 22 and films 26, 28 may be
configured so as to produce a planar tile or blank having a
plurality of smartcards encapsulated therein. The smartcards may
subsequently released by an appropriate cutting operation.
[0062] Once the plastics material has cooled and is dimensionally
stable, the mould 22 can be opened and the moulded article 44
removed. The mould 22 and films 26,28 are configured such that the
moulded article 44 is retained in a web 46 formed by the films
26,28. It will thus be understood that an elongate web 46 having
multiple moulded articles 44 retained therein can be produced. The
web 46 and moulded articles 44 can be forwarded from the mould 22
in a substantially continuous manner for further processing.
[0063] In the embodiment of shown in FIG. 2 both films 26, 28 are
provided on reels however, as noted above, other storage and
delivery methods may be used. Referring to FIG. 10 there is shown a
perspective view of an alternative film arrangement comprising a
elongate film 28 of the type which may be stored on a reel and a
discrete planar film portion 94 carrying a plurality of
semiconductor devices 34. The planar film 94 is attached to the
elongate film 28 prior to both films 28,94 being introduced into
the mould 20. Attachment of the films may be accomplished by any
appropriate means, for example by tack welding or ultrasonic
welding at the corners of the planar film 94. In this way the films
28, 94 are associated with one another but are able to separate,
either wholly or partially, during the subsequent moulding
operation. The films 28, 94 include alignment apertures 60, 62
which locate the films 28, 94 relative to the mould 20 as is
described below, but which may also be utilised for alignment
purposes when the films 28, 94 are attached to one another. In an
alternative embodiment the film portion 94 may be shorter than the
length of the mould cavity. FIG. 11 shows a perspective view of yet
a further alternative arrangement wherein the films comprise two
discrete planar film portions 94, 96 one of which carries a
plurality of semiconductor devices 34. As before these films 94, 96
may be attached to one another prior to their introduction to the
mould 20. It will be understood that the length of the films 94, 96
is greater than the corresponding dimensions of the mould. As
described above the films 94,96 may be attached to one another
prior to insertion into the mould 20. While it will be appreciated
that the utilisation of discrete films 94,96 of this type would not
enable the provision of a plurality of successive moulded articles
in a substantially continuous web, automated feed and delivery
systems may be associated with the mould 20 which introduce the
film pairs 94, 96 at the same time as removing a previously moulded
article.
[0064] Referring now to FIG. 3 there is shown a more detailed view
of the mould 22. As before, the mould 22 comprises two halves 36,38
which are provided respectively with a cavity 41 and an injection
port 43. In the embodiment shown the mould 22 is provided with two
cavities 41 which are offset laterally with respect to the
injection port 43. The mould 22 is further provided with a guide
channel 48 aligned with the injection port 43, which guide channel
48 conveys the plastics material to the cavities 41, in use. In
this manner the point of injection does not form part of an article
formed in a mould cavity 41.
[0065] In an alternative embodiment the mould 22 may be provided
with a single cavity configured so as to produce a single,
substantially planar article. In such an embodiment it will be
understood that guide channels are not required. Where it is
desired to subsequently cut one or more further articles from such
a planar article, then the mould is preferably configured such that
the injection port is remote from where, in the moulded planar
article, said further articles are to be cut.
[0066] The mould 22 is further provided with alignment means,
generally designated 50, which ensure the correct alignment of the
films 26,28 with respect to the mould 22. The alignment means 50
are positioned close to an edge of the mould and thus are remote
from the cavities 41. The alignment means comprise a tapered pin 52
of one of the mould halves 36 which is receivable in a recess 54 of
the other of the mould halves 38. The recess 54 includes a
cylindrical bush 56 which is retained in the mould half 38. The
bush 56 is biased outwardly from the mould half 38 by a coil spring
58. It will be understood that any suitable biasing means may be
utilised, for example pneumatic means.
[0067] In use, the pin 52 co-operates with apertures 60,62 of the
films 26,28 to align the films 26,28 with respect to the mould 22.
As the mould halves 36,38 are brought together, the tapered fore
portion 64 of the pin 52 engages the film apertures 60,62.
Continued closing movement of the mould halves 36,38 moves the film
apertures 60,62 to the parallel portion 66 of the pin 52 thus
eliminating any misalignment between the films 26,28 and mould 22.
Alignment means 50 ensure that an injection aperture 67 of the
lower film 28 is aligned with the injection port 43 so as to enable
injection of plastics material between the films 26,28.
[0068] FIGS. 4 to 6, 8 to 10 show six embodiments of chip carrying
films 26 adapted for use with the present invention. In FIG. 4
there is shown a film 26 suitable for producing a smartcard of the
contact card type. The film 26 has a three layer construction
comprising a plastic substrate 68 upon which is provided a layer of
printing ink 70 and a layer of clear lacquer 72. The film 26 has a
typical thickness of around 57 microns The chip 34 comprises a body
74 having a contact pad 76 provided thereon. As can be seen, the
chip 34 in cross-section is essentially "T" shaped with the contact
pad 76 being wider then the body 74 and defining a flange portion
78. The chip 34 is received in a through hole 80 of the film 26
such that the flange portion 78 rests against the lacquer layer 72.
The chip 34 is retained in the through hole 80 by the use of a
suitable adhesive on the underside of the flange portion 78.
[0069] FIG. 5 shows a film 26 suitable for producing a smartcard of
the combi card type. As before the film 26 comprises layers of
plastic 68, printing ink 70 and lacquer 72 and a chip 34 provided
in a through hole 80. The film 26 further includes a layer of
conductive ink 82 on the underside of the plastic layer 68. The
conductive ink is configured so as to define an antenna which, in
use, is incorporated in a card moulded from the film 26. The
antenna is connected to the chip 34 via additional through
apertures 84 of the film 26 which communicate with the underside of
the flange portion 78 and are filled with conductive ink. In this
embodiment the chip is retained to the film 26 by the use of
electrically conductive adhesive on the underside of the flange
portion 78.
[0070] FIG. 6 shows a third embodiment of a film 26 adapted for use
in producing smartcards of the contactless type. Here the film 26
again comprises the three layers of plastic 68, printing ink 70 and
lacquer 72, however the chip 34 is attached to the underside of the
plastic layer 68 rather than being received in a through hole. The
chip 34 is again provided with a flange portion 78, however this
overlies a layer of conductive ink 82 defining an antenna on the
underside of the plastic layer 68. As before, the chip 34 is
retained to the film 26 by the provision of an electrically
conductive adhesive.
[0071] FIG. 8 shows a fourth embodiment of a film 26 adapted for
use in producing a smart card of the contact card type where the
contact pad 76 is spaced from, and provided on the opposite side of
the film 26 from, the chip 34. The chip 34 is affixed to the
underside of the film 26 and is connected to a conductive strip 98
provided on the film 26. The strip 98 may comprise a strip of
conductive metal, such as copper, which has been deposited on the
film by an etching operation. The contact pad 76 is provided on the
opposite side of the film 26 and advantageously may also be
deposited on the film by an etching operation. The contact pad 76
and conductive strip 98 are connected via a portion of electrically
conductive material 100 extending therebetween through the film 26.
Although not shown the film 26 may be provided with the
aforementioned ink and lacquer layers.
[0072] As an alternative to the provision of ink and lacquer layers
applied to the film 26, a printed adhesive label 102 may be applied
to the film prior to moulding of an article. The label 102 may
carry wording and/or images which will be present on the outer
surface of the moulded article. The label 102 may also serve to
obscure an antenna, conductive strip, electronic component or
combination thereof carried by the film and which might otherwise
be visible in the moulded article. In the embodiment shown the
label 102 includes a window or aperture 114 which, in use,
surrounds the contact pad 76. It will be under stood that such
labels 102 may be provided on both films.
[0073] FIG. 9 shows a fifth embodiment of a film 26. Here the chip
34 and an antenna 86 are provided on the outer side of the film 26
and which are adapted to be covered with an adhesive label 102
prior to moulding of an article. The label serves to both protect
the chip 34 and antenna 86 and to display information on the
moulded article without the need to print directly to the film 26.
The label 102 is provided with an aperture 114 which, in use,
overlies a portion of the chip 34. The aperture may thus allow
access to the surface of the chip in the moulded article. It will
be understood that the aperture 114 may be positioned such that it
overlies contact pads associated with the chip or a portion of a
metal layer applied to the film 26.
[0074] FIG. 10 shows a sixth embodiment of a film, generally
designated 104. The film 104 comprises an etched layer of metal
106, such as copper and defining an antenna or electrical
conduction path, an adhesive layer 108, a printing ink layer 110
and a polyester film layer 112. The polyester film layer 112 is
arranged so as to, in use, comprise the outer surface of the
moulded article. The ink layer 110 is applied to polyester layer
before application of the adhesive layer 108 The adhesive layer 108
is opaque so as to provide a background against which the ink layer
110 may be viewed. A layer 106 of metal is then applied to the
adhesive, which layer 106 is then etched to provide a desired
configuration. The adhesive layer 108 serves to protect the ink
layer 110 during the etching process. A chip 34 may be applied to
the metal layer 106 in any appropriate manner as required.
[0075] FIG. 7 shows a spiral-like arrangement for an antenna 86
printed on a film 26, the chip 34 being positioned so as to bridge
the ends 88,90 thereof. The antenna 86 is shown to follow the
shape, as indicated by broken line 92, of card which may be
produced from the film 26. The antenna 86 may be provided on the
film by any appropriate means. For example, and as described above,
the antenna 86 may be printed onto the film 26. Alternatively the
antenna 86 may be deposited on the film by an etching operation. In
such an operation a thin layer of metal is affixed by adhesive to
the film and the required form of the antenna masked by an
appropriate masking agent. The unmasked metal is then removed in an
known manner. In yet a further embodiment metal forming an antenna
may be deposited on the film by an electroplating operation. Here
the form of the antenna may be printed on the film with an ink
commonly referred to as a seeding ink. During a subsequent plating
operation metal is deposited on the seeding ink. In such plating
and etching embodiments the antenna 86 comprises a thin layer of a
conductive metal such as, for example, aluminium, copper or a
combination of the two. Alternatively the metal layer may have an
alternative function to that of an antenna. For example the metal
layer may function as a heating element.
[0076] It will be understood that the chip free second film 28
which is utilised in the present invention has a similar
construction to that of the chip film 26, for example a three ply
laminate of a plastic substrate with overlying ink and lacquer
layers. The use of films 26,28 having similar properties has the
effect of balancing out shrinkage stresses experienced by the card
during moulding.
[0077] FIG. 13 shows a perspective view of a web 46 having
incorporated therein four moulded articles 44 or blanks having
chips 34 embedded therein. A cutting, stamping or punching
operation may be utilised so as to produce a smartcard 10 from each
blank 44. It will be appreciated that the blank 44 is slightly
larger than the smartcard 10 formable therefrom. Accordingly any
printed images carried on the films 26,28 and intended to be
displayed upon the smartcard can be similarly oversized. This
ensures that, when a smartcard 10 is punched from the blank 44,
each side is fully decorated.
[0078] While the above described embodiments relate to the
manufacture of articles incorporating a semiconductor device or
chip, it will be appreciated that the moulding method is equally
applicable to the manufacture of chipless articles wherein the
films are incorporated into surfaces of a moulded article. It will
further be appreciated that both films may be provided one or more
semiconductor devices, and hence articles having a semiconductor
device in or on opposing faces may be moulded.
* * * * *