U.S. patent application number 10/860384 was filed with the patent office on 2005-02-17 for wet chemical processing chambers for processing microfeature workpieces.
Invention is credited to Dolechek, Kert L., Hanson, Kyle M..
Application Number | 20050035046 10/860384 |
Document ID | / |
Family ID | 38646089 |
Filed Date | 2005-02-17 |
United States Patent
Application |
20050035046 |
Kind Code |
A1 |
Hanson, Kyle M. ; et
al. |
February 17, 2005 |
Wet chemical processing chambers for processing microfeature
workpieces
Abstract
A wet chemical processing chamber comprising a fixed unit, a
detachable unit releasably coupled to the fixed unit, a seal
contacting the fixed unit and the detachable unit, and a processing
component disposed in the fixed unit and/or the detachable unit.
The fixed unit can have a first flow system configured to direct a
processing fluid through the fixed unit and a mounting fixture for
fixedly attaching the fixed unit to a platform or deck of an
integrated processing tool. The detachable unit can include a
second flow system configured to direct the processing fluid to
and/or from the first flow system of the fixed unit. The seal has
an orifice through which processing fluid can flow between the
first and second flow systems, and the processing component can
impart a property to the processing fluid for processing a surface
on a microfeature workpiece having submicron microfeatures.
Inventors: |
Hanson, Kyle M.; (Kalispell,
MT) ; Dolechek, Kert L.; (Kalispell, MT) |
Correspondence
Address: |
PERKINS COIE LLP
PATENT-SEA
P.O. BOX 1247
SEATTLE
WA
98111-1247
US
|
Family ID: |
38646089 |
Appl. No.: |
10/860384 |
Filed: |
June 3, 2004 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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60476786 |
Jun 6, 2003 |
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60476333 |
Jun 6, 2003 |
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60476881 |
Jun 6, 2003 |
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60476776 |
Jun 6, 2003 |
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60501566 |
Sep 9, 2003 |
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Current U.S.
Class: |
210/321.6 ;
216/2; 216/56; 438/689 |
Current CPC
Class: |
H01L 21/6719 20130101;
H01L 21/6723 20130101; H01L 21/67005 20130101; H01L 21/68707
20130101; B01D 61/425 20130101; H01L 21/67742 20130101; C25D 17/00
20130101 |
Class at
Publication: |
210/321.6 ;
216/002; 438/689; 216/056 |
International
Class: |
B01D 063/00 |
Claims
I/We claim:
1. A chamber for wet chemical processing of microfeature
workpieces, comprising: a fixed unit having a first flow system
configured to direct a processing fluid through the fixed unit and
a mounting fixture for fixedly attaching the fixed unit to a
support member of a tool; a detachable unit having a second flow
system configured to direct the processing fluid to and/or from the
first flow system of the fixed unit and a processing component that
imparts a property to the processing fluid for processing a surface
on a microfeature workpiece having submicron microfeatures; and an
attachment system releasably coupling the detachable unit to the
fixed unit, wherein the attachment system has a first position in
which the detachable unit is secured to the fixed unit and a second
position in which the detachable unit can be detached from the
fixed unit; and a processing site configured to receive the
microfeature workpiece, the processing site being disposed in one
of the fixed unit or the detachable unit to contact the workpiece
with a portion of the processing fluid having the property imparted
by the processing component.
2. The chamber of claim 1, further comprising a head positioned
over the fixed unit, wherein the head comprises a workpiece holder
configured to hold the workpiece at the processing site.
3. The chamber of claim 1 wherein: the processing component
comprises an electrode in the detachable unit; and the chamber
further comprises a head having a workpiece holder including
electrical contacts configured to hold a workpiece at the
processing site and engage a conductive layer on the workpiece.
4. The chamber of claim 1 wherein: the processing component
comprises an electrode assembly having a plurality of independently
operable electrodes separated from each other by dielectric
dividers, and the electrode assembly being positioned in the
detachable unit; and the chamber further comprises a head having a
workpiece holder including electrical contacts configured to hold a
workpiece at the processing site and engage a conductive layer on
the workpiece.
5. The chamber of claim 1 wherein the processing component
comprises a filter in the detachable unit.
6. The chamber of claim 1 wherein the processing component
comprises a membrane configured to conduct electrical current
across the membrane.
7. The chamber of claim 1 wherein the attachment assembly comprises
a clamp ring configured to move radially inwardly from a first
position to a second position to clamp the detachable unit to the
fixed unit.
8. The chamber of claim 1, further comprising a seal between a
first seal surface of the fixed unit and a second seal surface of
the detachable unit.
9. The chamber of claim 1 wherein: the fixed unit further comprises
a beveled guide surface inclined upwardly with increasing radius, a
beveled bearing ring having a bearing surface inclined upwardly
with decreasing radius, and a first seal surface; a detachable unit
further comprises a rim having a lower surface inclined upwardly
with increasing radius, an upper surface inclined upwardly with
increasing radius, and a second seal surface; and a seal between
the first and second seal surfaces.
10. The chamber of claim 1 wherein: the processing component
comprises an electrode in the detachable unit; and the chamber
further comprises (a) a head having a workpiece holder including
electrical contacts configured to hold a workpiece at the
processing site and engage a conductive layer on the workpiece, and
(b) a seal between a portion of the fixed unit and the detachable
unit.
11. The chamber of claim 1 wherein: the processing component
comprises an electrode in the detachable unit and a filter between
the electrode and the processing site; and the chamber further
comprises (a) a head having a workpiece holder including electrical
contacts configured to hold a workpiece at the processing site and
engage a conductive layer on the workpiece, and (b) a seal between
a portion of the fixed unit and the detachable unit.
12. The chamber of claim 1 wherein: the processing component
comprises an electrode in the detachable unit and a membrane
between the electrode and the processing site, wherein the membrane
is configured to conduct electrical current; and the chamber
further comprises (a) a head having a workpiece holder including
electrical contacts configured to hold a workpiece at the
processing site and engage a conductive layer on the workpiece, and
(b) a seal between a portion of the fixed unit and the detachable
unit.
13. A chamber for wet chemical processing of microfeature
workpieces, comprising: a fixed unit having a first flow system
configured to direct a processing fluid through the fixed unit and
a mounting fixture for fixedly attaching the fixed unit to a
support surface of a tool; a detachable unit releasably coupled to
the fixed unit, the detachable unit having a second flow system
configured to direct the processing fluid to and/or from the first
flow system of the fixed unit; a seal between the fixed unit and
the detachable unit to prevent processing fluid from leaking
between the fixed unit and the detachable unit, the seal having an
orifice through which processing fluid can flow between the first
and second flow systems; and a processing component disposed in the
fixed unit and/or the detachable unit, wherein the processing
component imparts a property to the processing fluid for processing
a surface on a microfeature workpiece having submicron
microfeatures.
14. The chamber of claim 13, further comprising a head positioned
over the fixed unit, wherein the head comprises a workpiece holder
configured to hold the workpiece at the processing site.
15. The chamber of claim 13 wherein: the processing component
comprises an electrode in the detachable unit; and the chamber
further comprises a head having a workpiece holder including
electrical contacts configured to hold a workpiece at the
processing site and engage a conductive layer on the workpiece.
16. The chamber of claim 13 wherein: the processing component
comprises an electrode assembly having a plurality of independently
operable electrodes separated from each other by dielectric
dividers, and the electrode assembly being positioned in the
detachable unit; and the chamber further comprises a head having a
workpiece holder including electrical contacts configured to hold a
workpiece at the processing site and engage a conductive layer on
the workpiece.
17. The chamber of claim 13 wherein the processing component
comprises a filter in the detachable unit.
18. The chamber of claim 13 wherein the processing component
comprises a membrane in the detachable unit, and the membrane being
configured to conduct electrical current across the membrane.
19. The chamber of claim 13, further comprising an attachment
assembly having a clamp ring configured to move radially inwardly
from a first position to a second position to clamp the detachable
unit to the fixed unit.
20. The chamber of claim 13 wherein: the processing component
comprises an electrode in the detachable unit and a filter between
the electrode and the processing site; and the chamber further
comprises a head having a workpiece holder including electrical
contacts configured to hold a workpiece at the processing site and
engage a conductive layer on the workpiece.
21. The chamber of claim 13 wherein: the processing component
comprises an electrode in the detachable unit and a membrane
between the electrode and the processing site, wherein the membrane
is configured to conduct electrical current; and the chamber
further comprises a head having a workpiece holder including
electrical contacts configured to hold a workpiece at the
processing site and engage a conductive layer on the workpiece.
22. An integrated tool for wet chemical processing of microfeature
workpieces, comprising: a frame; a mounting module carried by the
frame, the mounting module having a plurality of positioning
elements and attachment elements; a wet chemical processing chamber
carried by the mounting module, the wet chemical processing chamber
comprising a fixed unit, a detachable unit, an attachment system
and a processing site, wherein (a) the fixed unit has a first flow
system configured to direct a processing fluid through the fixed
unit and a mounting fixture having a first interface member engaged
with one of the positioning elements and a first fastener engaged
with one of the attachment elements, (b) the detachable unit has a
second flow system configured to direct the processing fluid to
and/or from the first flow system of the fixed unit and a
processing component that imparts a property to the processing
fluid for processing a surface on a microfeature workpiece having
submicron microfeatures, (c) the attachment system releasably
couples the detachable unit to the fixed unit, and (d) the
processing site is configured to receive the microfeature
workpiece, the processing site being disposed in one of the fixed
unit or the detachable unit to contact the workpiece with a portion
of the processing fluid having the property imparted by the
processing component; a transport system carried by the mounting
module for transporting the workpiece within the tool, the
transport system having a second interface member engaged with one
of the positioning elements and a second fastener engaged with one
of the attachment elements; and wherein the mounting module is
configured to maintain relative positions between positioning
elements such that the transport system does not need to be
recalibrated when the processing chamber is replaced with another
processing chamber.
23. The tool of claim 22 wherein the mounting module further
comprises a deck having a rigid first panel, a rigid second panel
superimposed under the first panel, joists between the first and
second panel, and bolts through the first panel, the joists and the
second panel.
24. The tool of claim 22 wherein the mounting module further
comprises a deck having a rigid first panel, a rigid second panel
juxtaposed to the first panel, and bracing between the first and
second panels.
25. The tool of claim 24, further comprising a head positioned over
the fixed unit, wherein the head comprises a workpiece holder
configured to hold the workpiece at the processing site.
26. The tool of claim 24 wherein: the processing component
comprises an electrode in the detachable unit; and the chamber
further comprises a head having a workpiece holder including
electrical contacts configured to hold a workpiece at the
processing site and engage a conductive layer on the workpiece.
27. The tool of claim 24, further comprising a seal between a first
seal surface of the fixed unit and a second seal surface of the
detachable unit.
28. The tool of claim 24 wherein: the processing component
comprises an electrode in the detachable unit; and the chamber
further comprises (a) a head having a workpiece holder including
electrical contacts configured to hold a workpiece at the
processing site and engage a conductive layer on the workpiece, and
(b) a seal between a portion of the fixed unit and the detachable
unit.
29. The tool of claim 24 wherein: the processing component
comprises an electrode in the detachable unit and a filter between
the electrode and the processing site; and the chamber further
comprises (a) a head having a workpiece holder including electrical
contacts configured to hold a workpiece at the processing site and
engage a conductive layer on the workpiece, and (b) a seal between
a portion of the fixed unit and the detachable unit.
30. The tool of claim 24 wherein: the processing component
comprises an electrode in the detachable unit and a membrane
between the electrode and the processing site, wherein the membrane
is configured to conduct electrical current; and the chamber
further comprises (a) a head having a workpiece holder including
electrical contacts configured to hold a workpiece at the
processing site and engage a conductive layer on the workpiece, and
(b) a seal between a portion of the fixed unit and the detachable
unit.
31. An integrated tool for wet chemical processing of microfeature
workpieces, comprising: a frame; a mounting module carried by the
frame, the mounting module having a plurality of positioning
elements and attachment elements; a wet chemical processing chamber
carried by the mounting module, the wet chemical processing chamber
comprising a fixed unit, a detachable unit releasably coupled to
the fixed unit, a seal between the fixed unit and the detachable
unit, and processing component disposed in the fixed unit and/or
the detachable unit, wherein (a) the a fixed unit has a first flow
system configured to direct a processing fluid through the fixed
unit and a mounting fixture having a first interface member engaged
with one of the positioning elements and a first fastener engaged
with one of the attachment elements, (b) the detachable unit has a
second flow system configured to direct the processing fluid to
and/or from the first flow system of the fixed unit, (c) the seal
has an orifice through which processing fluid can flow between the
first and second flow systems, (d) the processing component imparts
a property to the processing fluid for processing a surface on a
microfeature workpiece having submicron microfeatures; a transport
system carried by the mounting module for transporting the
workpiece within the tool, the transport system having a second
interface member engaged with one of the positioning elements and a
second fastener engaged with one of the attachment elements; and
wherein the mounting module is configured to maintain relative
positions between positioning elements such that the transport
system does not need to be recalibrated when the processing chamber
is replaced with another processing chamber.
32. The tool of claim 31 wherein the mounting module further
comprises a deck having a rigid first panel, a rigid second panel
superimposed under the first panel, joists between the first and
second panel, and bolts through the first panel, the joists and the
second panel.
33. The tool of claim 31 wherein the mounting module further
comprises a deck having a rigid first panel, a rigid second panel
juxtaposed to the first panel, and bracing between the first and
second panels.
34. The tool of claim 31 further comprising a head positioned over
the fixed unit, wherein the head comprises a workpiece holder
configured to hold the workpiece at the processing site.
35. The tool of claim 31 wherein: the processing component
comprises an electrode in the detachable unit; and the chamber
further comprises a head having a workpiece holder including
electrical contacts configured to hold a workpiece at the
processing site and engage a conductive layer on the workpiece.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] The present application claims the benefit of U.S.
Application No. 60/476,786 filed on Jun. 6, 2003; 60/476,333 filed
on Jun. 6, 2003; 60/476,881 filed on Jun. 6, 2003; and 60/476,776
filed on Jun. 6, 2003, all of which are incorporated herein in
their entirety, including appendices, by reference. Additionally,
U.S. Application No. 60/501,566 filed on Sep. 9, 2003 is also
incorporated herein in its entirety by reference.
TECHNICAL FIELD
[0002] The present invention is directed toward apparatus and
methods for processing microfeature workpieces having a plurality
of microdevices integrated in and/or on the workpiece. The
microdevices can include submicron features. Particular aspects of
the present invention are directed toward a wet chemical processing
chamber having a fixed unit and a detachable unit that can be
removed quickly for servicing components within the chamber.
BACKGROUND
[0003] Microdevices are manufactured by depositing and working
several layers of materials on a single substrate to produce a
large number of individual devices. For example, layers of
photoresist, conductive materials, and dielectric materials are
deposited, patterned, developed, etched, planarized, and otherwise
manipulated to form features in and/or on a substrate. The features
are arranged to form integrated circuits, micro-fluidic systems,
and other structures.
[0004] Wet chemical processes are commonly used to form features on
microfeature workpieces. Wet chemical processes are generally
performed in wet chemical processing tools that have a plurality of
individual processing chambers for cleaning, etching,
electrochemically depositing materials, or performing combinations
of these processes. FIG. 1 schematically illustrates an integrated
tool 10 that can perform one or more wet chemical processes. The
tool 10 includes a housing or cabinet 20 having a platform 22, a
plurality of wet chemical processing chambers 30 in the cabinet 20,
and a transport system 40. The tool 10 also includes lift-rotate
units 32 coupled to corresponding processing chambers 30 for
loading/unloading the workpieces W. The processing chambers 30 can
be rinse/dry chambers, cleaning capsules, etching capsules,
electrochemical deposition chambers, or other types of wet chemical
processing vessels. The transport system 40 includes a linear track
42 and a robot 44 that moves along the track 42 to transport
individual workpieces W within the tool 10. The integrated tool 10
further includes a workpiece storage unit 60 having a plurality of
containers 62 for holding workpieces W. In operation, the robot 44
transports workpieces to/from the containers 62 and the processing
chambers 30 according to a predetermined workflow within the tool
10.
[0005] One concern of integrated wet chemical processing tools is
that the processing chambers must be maintained and/or repaired
periodically. In electrochemical deposition chambers, for example,
consumable electrodes degrade over time because the reaction
between the electrodes and the electrolytic solution decomposes the
electrodes. The shape of consumable electrodes accordingly changes
causing variations in the electrical field. As a result, consumable
electrodes must be replaced periodically to maintain the desired
deposition parameters across the workpiece. The electrical contacts
that contact the workpiece also may need to be cleaned or replaced
periodically. To maintain or repair electrochemical deposition
chambers, they can be removed from the tool 10 and replaced with an
extra chamber, or they can be serviced in-situ within the tool.
[0006] One problem with repairing or maintaining existing wet
chemical processing chambers is that the tool must be taken offline
for an extended period of time to replace the electrodes or service
other components in the processing chambers 30. When the processing
chamber 30 is removed from the tool, a pre-maintained processing
chamber 30 is mounted to the platform 22 at the vacant station.
When the processing chamber 30 is serviced in-situ on the platform,
the lift/rotate unit 32 is generally moved out of the way and the
operator reaches into the processing chamber 30 from above to
repair or replace the components within the chamber 30. For
example, to replace consumable electrodes, the worn electrodes are
disconnected from the chamber 30 and new electrodes are then
installed. This can be an extremely cumbersome process because
there is only a limited amount of space in the tool 10 to access
the lower portion of the chambers 30 where the electrodes are
positioned. After the chamber 30 has been repaired or replaced, the
robot 44 and the lift-rotate unit 32 are recalibrated to operate
with the processing chamber.
[0007] The processes for replacing worn electrodes, servicing other
components in-situ within the tool, or replacing a chamber with
another chamber require a significant amount of time during which
the tool cannot process workpieces. Moreover, the robot 44 and the
lift-rotate unit 32 are generally recalibrated to the repaired
chamber after each repair; this is a time-consuming process that
increases the downtime for repairing or maintaining processing
chambers. As a result, when only one processing chamber 30 of the
tool 10 does not meet specifications, it is often more efficient to
continue operating the tool 10 without stopping to repair the one
processing chamber 30 until more processing chambers do not meet
the performance specifications. The loss of throughput of a single
processing chamber 30, therefore, is not as severe as the loss of
throughput caused by taking the tool 10 offline to repair or
maintain a single one of the processing chambers 30.
[0008] The practice of operating the tool 10 until at least two
processing chambers 30 do not meet specifications severely impacts
the throughput of the tool 10. For example, if the tool 10 is not
repaired or maintained until at least two or three processing
chambers 30 are out of specification, then the tool operates at
only a fraction of its full capacity for a period of time before it
is taken offline for maintenance. This increases the operating
costs of the tool 10 because the throughput not only suffers while
the tool 10 is offline to replace the wet processing chambers 30
and recalibrate the robot 44, but the throughput is also reduced
while the tool is online because it operates at only a fraction of
its full capacity. Moreover, as the feature sizes decrease, the
electrochemical deposition chambers 30 must consistently meet much
higher performance specifications. This causes the processing
chambers 30 to fall out of specifications sooner, which results in
shutting down the tool more frequently. Therefore, the downtime
associated with repairing and/or maintaining electrochemical
deposition chambers and other types of wet chemical processing
chambers is significantly increasing the cost of operating wet
chemical processing tools.
SUMMARY
[0009] The present invention is directed toward wet chemical
processing chambers with quick-release detachable units that reduce
the downtime for repairing or maintaining processing components in
the chambers compared to existing wet chemical processing chambers.
In several embodiments of the inventive wet chemical processing
chambers, processing components that require periodic maintenance
or repair are housed or otherwise carried by the detachable units.
For example, an electrode can be one type of processing component
that is housed within a detachable unit. Such processing components
can be quickly replaced by simply removing the detachable unit from
the chamber and installing a replacement detachable unit. The
detachable unit is generally accessible without having to move the
lift-rotate units or detach the head assembly of the chambers. The
detachable unit can also be coupled to the chamber by a
quick-release mechanism that is easily accessible. As such, the
downtime for repairing or maintaining electrodes or other
processing components in chambers is reduced by locating such
components in detachable units that can be removed and replaced in
only a few minutes compared to several hours for performing the
same work on existing wet chemical processing chambers.
[0010] In one embodiment, a wet chemical processing chamber in
accordance with the invention comprises a fixed unit, a detachable
unit releasably coupled to the fixed unit, a seal contacting the
fixed unit and the detachable unit, and a processing component
disposed in the fixed unit and/or the detachable unit. The fixed
unit can have a first flow system configured to direct a processing
fluid through the fixed unit and a mounting fixture for fixedly
attaching the fixed unit to a platform or deck of an integrated
processing tool. The detachable unit can include a second flow
system configured to direct the processing fluid to and/or from the
first flow system of the fixed unit. The seal has an orifice
through which processing fluid can flow between the first and
second flow systems, and the processing component can impart a
property to the processing fluid for processing a surface on a
microfeature workpiece having submicron microfeatures.
[0011] Another aspect of the invention is an integrated tool for
wet chemical processing of microfeature workpieces. In one
embodiment, the tool can include a frame and a mounting module
carried by the frame. The mounting module can include a plurality
of positioning elements and attachment elements. In this
embodiment, the wet chemical processing chamber can have a fixed
unit including a mounting fixture with a first interface member
engaged with one of the positioning elements of the mounting module
and a first fastener engaged with one of the attachment elements of
the mounting module. The mounting module is configured to maintain
relative positions between positioning elements such that a
transport system for transporting workpieces to/from the wet
chemical processing chamber does not need to be recalibrated when
the processing chamber is replaced with another processing chamber
or when one detachable unit is replaced with another detachable
unit.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] FIG. 1 is a schematic top plan view of a wet chemical
processing tool in accordance with the prior art.
[0013] FIG. 2 is a schematic view illustrating a wet chemical
processing chamber in accordance with one embodiment of the
invention.
[0014] FIG. 3 is a schematic view illustrating the operation of a
wet chemical processing chamber in accordance with an embodiment of
the invention.
[0015] FIG. 4A is cross-sectional view schematically illustrating a
wet chemical processing chamber in a detached configuration in
accordance with an embodiment of the invention.
[0016] FIG. 4B is a cross-sectional view schematically illustrating
a wet chemical processing chamber in an assembled configuration in
accordance with an embodiment of the invention.
[0017] FIG. 5A is a top isometric view of a carriage for
loading/unloading a detachable unit from a wet chemical processing
chamber in accordance with an embodiment of the invention.
[0018] FIG. 5B is a bottom isometric view of a carriage for
loading/unloading a detachable unit of a wet chemical processing
chamber in accordance with an embodiment of the invention.
[0019] FIG. 6 is a top plan view of a wet chemical processing tool
including a wet chemical processing chamber in accordance with
another aspect of the invention.
[0020] FIG. 7 is an isometric view of a mounting module for holding
a wet chemical processing chamber in a wet chemical processing tool
in accordance with an embodiment of the invention.
[0021] FIG. 8 is a cross-sectional view taken along line 8-8 of
FIG. 7 of a mounting module for carrying a wet chemical processing
chamber in accordance with an embodiment of the invention.
[0022] FIG. 9 is a cross-sectional view showing a portion of a deck
of a mounting module in greater detail.
[0023] FIG. 10 is a cross-sectional isometric view schematically
illustrating a wet chemical processing chamber carried by a
mounting module of a wet chemical processing tool in accordance
with an embodiment of the invention.
DETAILED DESCRIPTION
[0024] As used herein, the terms "microfeature workpiece" or
"workpiece" refer to substrates on or in which microdevices are
formed integrally. Typical microdevices include microelectronic
circuits or components, thin-film recording heads, data storage
elements, microfluidic devices, and other products. Micromachines
or micromechanical devices are included within this definition
because they are manufactured using much of the same technology as
used in the fabrication of integrated circuits. The substrates can
be semiconductive pieces (e.g., doped silicon wafers or gallium
arsenide wafers), nonconductive pieces (e.g., various ceramic
substrates) or conductive pieces.
[0025] Several embodiments of wet chemical processing chambers for
processing microfeature workpieces are described in the context of
electrochemical deposition chambers for electrolytically or
electrolessly depositing metals or electrophoretic resist in or on
structures of a workpiece. The wet chemical processing chambers in
accordance with the invention, however, can also be used for
etching, rinsing, or other types of wet chemical processes in the
fabrication of microfeatures in and/or on semiconductor substrates
or other types of workpieces. Several embodiments of wet chemical
processing chambers and integrated tools in accordance with the
invention are set forth in FIGS. 2-10 and the corresponding text to
provide a thorough understanding of particular embodiments of the
invention. A person skilled in the art, however, will understand
that the invention may have additional embodiments or that the
invention may be practiced without several of the details of the
embodiments shown in FIGS. 2-10.
[0026] A. Embodiments of Wet Chemical Processing Chambers
[0027] FIG. 2 schematically illustrates a wet chemical processing
chamber 100 that enables quick repair or replacement of components
to reduce the downtime for maintaining processing chambers. The
processing chamber 100 includes a wet chemical vessel 102 and a
head 104. The vessel 102 is carried by a deck 106 of a tool that
can include several other processing chambers (not shown) and a
workpiece transport system (not shown) for automatically handling
workpieces. The vessel 102 contains the processing fluid and
several components for directing the processing fluid or otherwise
imparting properties to the processing fluid for processing a
workpiece. The head 104 is carried by a lift-rotate unit 108 that
moves the head 104 to load/unload the workpiece and to position the
workpiece at a processing site 109 within the vessel 102. When the
processing chamber 100 is an electrochemical deposition station for
electroplating materials onto a workpiece, the vessel 102 typically
has a fluid flow system and at least one electrode, and the head
104 typically includes a workpiece holder having a contact assembly
with a plurality of electrical contacts configured to engage a
conductive layer on the workpiece. When the processing chamber 100
is a cleaning chamber or other type of capsule, the vessel 102
includes a plurality of fluid dispensers for flowing a fluid across
the workpiece and the head 104 typically includes a workpiece
holder. Suitable configurations of fluid flow systems, electrodes,
and other processing components in the vessel 102 are disclosed in
U.S. application Ser. Nos. 09/804,696; 09/804,697; 10/234,637;
10/234,982; 10/234,628; 10/234,442; 09/849,505; 09/866,391;
09/866,463; 09/875,365; 09/872,151; and 10/295,302, all of which
are herein incorporated by reference. Additionally, suitable
workpiece holders are disclosed in U.S. Pat. No. 6,309,524 and U.S.
application Ser. Nos. 09/717,927; and 09/823,948, all of which are
also herein incorporated by reference.
[0028] The vessel 102 includes a fixed unit 110 mounted to the deck
106 and a detachable unit 120 carried by the fixed unit 110. The
fixed unit 110 can include a chassis 112, a first flow system 114,
and a mounting fixture 116. The chassis 112 can be a dielectric
housing that is chemically compatible with the processing fluid.
The chassis 112, for example, can be a high density polymer or
other suitable material. The first flow system 114 can be
configured to provide the desired flow to the processing site 109.
In electrochemical deposition chambers, the first flow system 114
can be configured to provide a flow that has a substantially
uniform velocity in a direction normal to the workpiece throughout
the processing site 109. The mounting fixture 116 can be flanges or
a ring projecting outwardly from the chassis 112 to engage the top
surface of the deck 106. The mounting fixture 116 can be configured
to precisely locate the fixed unit 110 relative to the deck 106 as
explained in more detail below. The fixed unit 110 can further
include a processing component 118 to impart a property to the
processing fluid flowing through the fixed unit 110. For example,
the processing component 118 can be an electric field shaping
element that shapes the electric field in the processing site 109,
a filter, a membrane, a nozzle, or another type of fluid dispenser.
The processing component 118 can also be any combination of these
types of structures. Suitable structures for first flow systems
114, mounting fixtures 116 and processing components 118 for the
fixed unit 110 are disclosed in U.S. application Ser. Nos.
09/872,151 and 09/804,697 incorporated by reference above.
[0029] The detachable unit 120 of the vessel 102 includes a
container 122, a second flow system 124 configured to direct the
processing fluid to and/or from the first flow system 114 of the
fixed unit 110, and a processing component 126 that imparts a
property to the processing fluid. The second flow system 124 can
include inlets and outlets to deliver processing fluid to the first
flow system 114 and to receive processing from the first flow
system 114. The first and second flow systems operate together to
provide a desired flow of processing fluid at the processing site.
The first and second flow systems 114 and 124 can also be
configured to provide a forward flow relative to the processing
component 126. In a forward flow system, the processing fluid
passes the processing component 126 in the detachable unit 120
before the processing fluid reaches the processing site 109. The
first and second flow systems can also be configured to provide a
reverse flow past the processing component 126. In a reverse flow
configuration, the processing fluid passes the processing component
126 after the processing fluid has passed through the processing
site 109.
[0030] The processing component 126 is disposed in the detachable
unit 120. The processing component 126 can be a filter, membrane,
or electrode. In addition, the processing component 126 can be an
electrode assembly having a plurality of electrodes arranged in a
concentric configuration or another configuration suitable for
electroplating materials onto the workpiece. In still other
embodiments, the processing component 126 can be a combination of
filters, membranes, electrodes, dielectric partitions between
electrodes that define individual electrode compartments, spray
bars with a plurality of nozzles, paddle platers, or other
components used to process microfeature workpieces. The processing
component 126 is generally a consumable component (e.g., a
consumable electrode), a component that collects particulate matter
or other undesirable constituents in the processing fluid to
protect the surface of the workpiece (e.g., filters of membranes),
or other components that may fail or need to be cleaned. The
processing component 126 in the detachable unit 120 is accordingly
subject to regular maintenance or replacement to maintain the
performance of the processing chamber 100 within predetermined
specifications. Such processing components can accordingly be
quickly replaced with new or refurbished components by simply
replacing one detachable unit 120 with a replacement detachable
unit without having to move the head 104 or the fixed unit 110.
[0031] The vessel 102 also includes a seal 130 to prevent leaking
between the fixed unit 110 and the detachable unit 120. The seal is
typically positioned between the fixed unit 110 and the detachable
unit 120. The seal 130 can include at least one orifice to allow
the processing fluid to flow between the first flow system 114 in
the fixed unit 110 and the second flow system 124 in the detachable
unit 120. In many embodiments, the seal 130 is a gasket with a
pattern of orifices to allow fluid to flow between the first and
second flow systems 114 and 124. The seal 130 orgasket is typically
a compressible member that prevents liquid from leaking between the
various flow channels of the flow systems. The seal 130 can also be
made from a dielectric material that electrically isolates
different fluid flows as they flow between the first and second
flow systems 114 and 124. Suitable materials for the seal 130
include VITON.RTM. closed cell foams, closed cell silicon,
elastomers, polymers, rubber and other materials.
[0032] The vessel 102 also includes an attachment assembly 140 for
attaching the detachable unit 120 to the fixed unit 110. The
attachment assembly 140 can be a quick-release unit, such as a
clamp or a plurality of clamps, that guides the detachable unit 120
to a desired orientation with respect to the fixed unit 110 and
securely holds the detachable unit 120 to the fixed unit 110. The
attachment assembly 140 can be configured to move from a first
position in which the detachable unit 120 is secured to the fixed
unit 110 and a second position in which the detachable unit 120 can
be removed from the fixed unit 110. In several embodiments, as the
attachment assembly 140 moves from the second position to the first
position, the attachment assembly 140 drives the detachable unit
120 toward the fixed unit 110. This motion compresses the seal 130
and positions the detachable unit 120 at a desired location with
respect to the fixed unit 110. The attachment assembly 140 can be a
clamp ring, a plurality of latches, a plurality of bolts, or other
types of fasteners.
[0033] FIG. 3 schematically illustrates the operation of the wet
chemical processing chamber 100 for repairing or maintaining
processing components in the detachable unit. Like reference
numbers refer to like components in FIGS. 2 and 3. A first
detachable unit 120a is removed from the fixed unit 110 after the
flow system 124a and/or the processing component 126a in the first
detachable unit 120a no longer meet specifications. The seal 130
may also be removed, but this is optional. A second detachable unit
120b is then installed by aligning it with the fixed unit 110 and
engaging the attachment assembly 140 with the second detachable
unit 120b. The second detachable unit 120b can include a flow
system 124b and processing components 126b that are new or have
been refurbished so that the processing chamber 100 can meet the
specifications required for processing microfeature workpieces.
[0034] One advantage of the processing chamber 100 illustrated in
FIGS. 2 and 3 is that components in need of repair or maintenance
can be quickly replaced with new or refurbished components without
shutting down the processing chamber 100 for a significant period
of time. One detachable unit 120 can be quickly removed from the
fixed unit 110, and then a replacement detachable unit 120 can be
installed in only a matter of a few minutes. This significantly
reduces the downtime for repairing electrodes or other processing
components compared to conventional systems that require the
components to be repaired in-situ on the tool or require the entire
chamber to be removed from the tool. Another advantage of the
processing chamber 100 is that the processing components 126 in the
detachable units 120 can be replaced from a location that is easily
accessible under the deck 106. As a result, there is no need to
move either the fixed unit 110, the head 104, or the lift-rotate
unit 108 to replace worn processing components. This further
reduces the downtime for maintaining processing components because
the head 104 and lift-rotate unit 108 do not need to be
repositioned with respect to the fixed unit 110. Moreover, a
workpiece transport system that delivers the workpieces to the head
104 and retrieves the workpieces from the head 104 does not need to
be recalibrated to the processing chamber 100 because the position
between the head 104 and such a workpiece transport system is not
changed. The significant reduction in downtime for replacing
processing components provided by the processing chamber 100 is
expected to significantly increase the productivity of the wet
chemical processing tool compared to existing tools.
[0035] FIG. 4A is a cross-sectional view illustrating a vessel 402
in accordance with an embodiment of the invention. The vessel 402
can include a fixed unit 410, a detachable unit 420, a seal 430,
and an attachment assembly 440. The fixed unit 410 can include a
chassis 412, a first flow system 414 (shown schematically), and
processing components 418 (shown schematically). The detachable
unit 420 can include a container 422, a second flow system 424
(shown schematically), and processing components 426 (shown
schematically). The seal 430 can be a gasket having an opening 431
to allow fluid to flow between the first and second flow systems
414 and 424. The attachment assembly 440 can be a clamp ring.
[0036] The fixed unit 410 can further include a plurality of
hangers 450 arranged at a common radius with respect to a center
line of the fixed unit 410 or in another pattern. The hangers 450
can include shoulders 452 to hold the attachment assembly. For
example, the attachment assembly 440 can be a ring that springs
radially outwardly to contact the hangers 450 and rest on the
shoulders 452 in an open position. The fixed unit 410 further
includes a beveled guide surface 453, a bearing ring 454 above the
beveled guide surface 453, and a seal surface 456. The guide
surface 453 can be an annular surface or a series of arcuate
segments inclined upwardly with increasing radius. The bearing ring
454 can be a metal ring having a bearing surface inclined upwardly
with decreasing radius. The bearing ring 454 can also be made from
other materials that are typically harder than the material of the
chassis 412.
[0037] The detachable unit 420 can include a rim 460 having a lower
surface 462 and an upper surface 464. The lower surface 462 and the
upper surface 464 can be inclined upwardly with increasing radius.
The upper surface 464, more specifically, can be inclined at an
angle to mate with the guide surface 453 of the fixed unit 410. The
detachable unit 420 can further include a seal surface 466
configured to retain the seal 430, slide channels 467a and 467b,
and a bottom surface 468.
[0038] The attachment assembly 440 can include a first rim 472
configured to engage the lower surface 462 of the detachable unit
420 and a second rim 474 configured to engage the bearing surface
of the bearing ring 454. The attachment assembly 440 can include a
latch (not shown) or lever that moves the ring radially inwardly
and locks the ring into a fixed position.
[0039] FIG. 4B illustrates the vessel 402 after the detachable unit
420 has been attached to the fixed unit 410. In operation, the
attachment assembly 440 moves radially inwardly so that the first
rim 472 engages the lower surface 462 of the detachable unit 420
and the second rim 474 engages the bearing surface of the bearing
ring 454. The radially inward motion of the first rim 472 along the
lower surface 462 lifts the detachable unit 420 upwardly toward the
fixed unit 410. As the detachable unit 420 moves upwardly, the
upper surface 464 engages the guide surface 453 to position the
detachable unit 420 at a desired position with respect to the fixed
unit 410. The second rim 474 of the attachment assembly 440 moves
radially inwardly along the inclined surface of the bearing ring
454 to clamp the seal 130 between the seal surfaces 456 and 466. A
lever (not shown) on the attachment assembly 440 can be moved from
an open position to a closed position to induce a hoop stress in
the attachment assembly 440 for securely holding the detachable
unit 420 to the fixed unit 410.
[0040] The chamber can also include an assembly for
loading/unloading the detachable unit 120. FIG. 5A is a top
isometric view of a carriage 500 for installing and removing a
detachable unit in a wet chemical processing chamber in accordance
with one embodiment of the invention. The carriage 500 can include
a bracket 510 that mounts to the underside of the deck 106 (FIG. 2)
of the tool. The carriage 500 can further include guide rails 512
and an end stop 514. The guide rails 512 receive the slide channels
467a and 467b (FIGS. 4A and 4B), and the end stop 514 engages a
mating rounded portion of the detachable unit 420. In operation, an
operator slides the detachable unit 420 along the rails 512 until
the detachable unit engages the end stop 514.
[0041] FIG. 5B is a bottom isometric view illustrating additional
aspects of the carriage 500. The carriage 500 can further include
an actuator 520 having a handle 522, a shaft 524, and lifters 526
that are moved by the shaft 524. The actuator 520 can further
include a rod 528 connected to the lifters 526 and positioned in a
joint 529. The rotation of the handle accordingly rotates the rod
528 within the joint 529 to raise and lower the lifters 526.
[0042] To install a detachable unit, the actuator 520 is moved to a
first position as shown in FIG. 5B. The detachable unit is then
inserted along the rails 512 as described above, and the actuator
520 is lifted. As the actuator 520 rotates upwardly (arrow R), the
handle 522 passes through a gap 530 in a bottom flange 531 of the
bracket 510. The lifters 526 accordingly engage the bottom surface
468 (FIG. 4B) and raise the detachable unit upwardly toward the
fixed unit. After reaching the raised position, the handle 522
slides axially along the shaft 524 (arrow A) to position the handle
on top of the flange 531. Referring back to FIG. 4B, the bevelled
surfaces on the bottom of the supports 450 initially align the
detachable unit 420 with the fixed unit 410. After the rim 460 of
the detachable unit 420 passes the shoulders 452 of the supports
450, the upper surface 464 of the detachable unit 420 and the guide
surface 453 of the fixed unit 410 position the detachable unit 420
into final alignment with the fixed unit 410. The attachment
assembly 440 can then be actuated to clamp the detachable unit 420
to the fixed unit 410. The carriage 500 accordingly makes it easier
to remove and install the detachable unit 420.
[0043] B. Embodiments of Integrated Tools with Wet Chemical
Processing Chambers
[0044] FIG. 6 is a top plan view showing a portion of an integrated
tool 600 in accordance with an embodiment of the invention. In this
embodiment, the integrated tool 600 includes a frame 610, a
dimensionally stable mounting module 620 mounted to the frame 610,
a plurality of wet chemical processing chambers 670, and a
plurality of lift-rotate units 680. The tool 600 can also include a
transport system 690. The mounting module 620 carries the
processing chambers 670, the lift-rotate units 680, and the
transport system 690. The wet chemical processing chambers 670 in
the tool 600 can include vessels having fixed units and detachable
units as described above with reference to FIGS. 2-5. As such, any
of the embodiments of the wet chemical processing chambers 100 and
400 can be the wet chemical processing chambers 670 in the
integrated tool 600.
[0045] The frame 610 of the tool 600 has a plurality of posts 611
and cross-bars 612 that are welded together in a manner known in
the art. The mounting module 620 is at least partially housed
within the frame 610. In one embodiment, the mounting module 620 is
carried by cross-bars 612 of the frame 610, but the mounting module
620 can stand directly on the floor of the facility or other
structures in other embodiments.
[0046] The mounting module 620 is a rigid, stable structure that
maintains the relative positions between the wet chemical
processing chambers 670, the lift-rotate units 680, and the
transport system 690. One aspect of the mounting module 620 is that
it is much more rigid and has a significantly greater structural
integrity compared to the frame 610 so that the relative positions
between the wet chemical processing chambers 670, the lift-rotate
units 680, and the transport system 690 do not change over time.
Another aspect of the mounting module 620 is that it includes a
dimensionally stable deck 630 with positioning elements at precise
locations for positioning the processing chambers 670 and the
lift-rotate units 680 at known locations on the deck 630. In one
embodiment (not shown), the transport system 690 can be mounted
directly to the deck 630. In other embodiments, the mounting module
620 also has a dimensionally stable platform 650 and the transport
system 690 is mounted to the platform 650. The deck 630 and the
platform 650 are fixedly positioned relative to each other so that
positioning elements on the deck 630 and positioning elements on
the platform 650 do not move relative to each other. The mounting
module 620 accordingly provides a system in which wet chemical
processing chambers 670 and lift-rotate units 680 can be removed
and replaced with interchangeable components in a manner that
accurately positions the replacement components at precise
locations on the deck 630.
[0047] The tool 600 is particularly suitable for applications that
have demanding specifications which require frequent maintenance of
the wet chemical processing chambers 670, the lift-rotate units
680, or the transport system 690. A wet chemical processing chamber
670 can be repaired or maintained by simply detaching the chamber
from the processing deck 630 and replacing the chamber 670 with an
interchangeable chamber having mounting hardware configured to
interface with the positioning elements on the deck 630. Because
the mounting module 620 is dimensionally stable and the mounting
hardware of the replacement processing chamber 670 interfaces with
the deck 630, the chambers 670 can be interchanged on the deck 630
without having to recalibrate the transport system 690. This is
expected to significantly reduce the downtime associated with
repairing or maintaining processing chambers 670 so that the tool
can maintain a high throughput in applications that have stringent
performance specifications. This aspect of the tool 600 is
particularly useful when the fixed unit 110 (FIG. 2) must be
removed to repair the chamber.
[0048] The transport system 690 retrieves workpieces from a
load/unload module 698 attached to the mounting module 620. The
transport system 690 includes a track 692, a robot 694, and at
least one end-effector 696. The track 692 is mounted to the
platform 650. More specifically, the track 692 interfaces with
positioning elements on the platform 650 to accurately position the
track 692 relative to the chambers 670 and the lift-rotate units
680 attached to the deck 630. The robot 694 and end-effectors 696
can accordingly move in a fixed, dimensionally stable reference
frame established by the mounting module 620. The tool 600 can
further include a plurality of panels 699 attached to the frame 610
to enclose the mounting module 620, the wet chemical processing
chambers 670, the lift-rotate units 680, and the transport system
690 in a cabinet. In other embodiments, the panels 699 on one or
both sides of the tool 600 can be removed in the region above the
processing deck 630 to provide an open tool.
[0049] C. Embodiments of Dimensionally Stable Mounting Modules
[0050] FIG. 7 is an isometric view of a mounting module 620 in
accordance with an embodiment of the invention for use in the tool
600. In this embodiment, the deck 630 includes a rigid first panel
631 and a rigid second panel 632 superimposed underneath the first
panel 631. The first panel 631 can be an outer member and the
second panel 632 can be an interior member juxtaposed to the outer
member. The first and second panels 631 and 632 can also have
different configurations than the configuration in FIG. 7. A
plurality of chamber receptacles 633 are disposed in the first and
second panels 631 and 632 to receive the wet chemical processing
chambers 670 (FIG. 6).
[0051] The deck 630 can further include a plurality of positioning
elements 634 and attachment elements 635 arranged in a precise
pattern across the first panel 631. The positioning elements 634
can be holes machined in the first panel 631 at precise locations
and with precise dimensions to receive dowels or pins that
interface with the wet chemical processing chambers 670 (FIG. 6).
In other embodiments, the positioning elements 634 can be pins,
such as cylindrical pins or conical pins, that project upwardly
from the first panel 631 to be received by mating structures in the
wet chemical processing chambers 670. The deck 630 has a first set
of positioning elements 634 located at each chamber receptacle 633
to accurately position the individual wet chemical processing
chambers at precise locations on the mounting module 620. The deck
630 can also include a second set of positioning elements 634 near
each receptacle 633 to accurately position individual lift-rotate
units 680 at precise locations on the mounting module 620. The
attachment elements 635 can be threaded holes in the first panel
631 that receive bolts to secure the chambers 670 and the
lift-rotate units 680 to the deck 630.
[0052] The mounting module 620 also includes exterior side plates
660 along longitudinal outer edges of the deck 630, interior side
plates 661 along longitudinal inner edges of the deck 630, and
endplates 662 and 664 attached to the ends of the deck 630. The
transport platform 650 is attached to the interior side plates 661
and the end plates 662 and 664. The transport platform 650 includes
positioning elements 652 for accurately positioning the track 692
(FIG. 6) of the transport system 690 on the mounting module 620.
The transport platform 650 can further include attachment elements,
such as tapped holes, that receive bolts to secure the track 692 to
the platform 650.
[0053] FIG. 8 is a cross-sectional view illustrating one suitable
embodiment of the internal structure of the deck 630, and FIG. 9 is
a detailed view of a portion of the deck shown in FIG. 8. In this
embodiment, the deck 630 includes bracing 640, such as joists,
extending laterally between the exterior side plates 660 and the
interior side plates 661. The first panel 631 is attached to the
upper side of the bracing 640, and the second panel 632 is attached
to the lower side of the bracing 640. The deck 630 can further
include a plurality of throughbolts 642 and nuts 644 that secure
the first and second panels 631 and 632 to the bracing 640. As best
shown in FIG. 9, the bracing 640 has a plurality of holes 645
through which the throughbolts 642 extend. The nuts 644 can be
welded to the bolts 642 to enhance the connection between these
components.
[0054] The panels and bracing of the deck 630 can be made from
stainless steel, other metal alloys, solid cast materials, or
fiber-reinforced composites. For example, the panels and plates can
be made from Nitronic 50 stainless steel, Hastelloy 625 steel
alloys, or a solid cast epoxy filled with mica. The
fiber-reinforced composites can include a carbon-fiber or
Kevlar.RTM. mesh in a hardened resin. The material for the panels
631 and 632 should be highly rigid and compatible with the
chemicals used in the wet chemical processes. Stainless steel is
well-suited for many applications because it is strong but not
affected by many of the electrolytic solutions or cleaning
solutions used in wet chemical processes. In one embodiment, the
panels and plates 631, 632, 660, 661, 662 and 664 are 0.125 to
0.375 inch thick stainless steel, and more specifically they can be
0.250 inch thick stainless steel. The panels and plates, however,
can have different thickness in other embodiments.
[0055] The bracing 640 can also be stainless steel,
fiber-reinforced composite materials, other metal alloys, and/or
solid cast materials. In one embodiment, the bracing can be 0.5 to
2.0 inch wide stainless steel joists, and more specifically 1.0
inch wide by 2.0 inches tall stainless steel joists. In other
embodiments the bracing 640 can be a honey-comb core, a
light-weight foamed metal or other type of foam, polymers, fiber
glass or other materials.
[0056] The mounting module 620 is constructed by assembling the
sections of the deck 630, and then welding or otherwise adhering
the end plates 662 and 664 to the sections of the deck 630. The
components of the deck 630 are generally secured together by the
throughbolts 642 without welds. The outer side plates 660 and the
interior side plates 661 are attached to the deck 630 and the end
plates 662 and 664 using welds and/or fasteners. The platform 650
is then securely attached to the end plates 662 and 664, and the
interior side plates 661.
[0057] The mounting module 620 provides a heavy-duty, dimensionally
stable structure that maintains the relative positions between the
positioning elements 634 on the deck 630 and the positioning
elements 652 on the platform 650 within a range that does not
require the transport system 690 to be recalibrated each time a
replacement processing chamber 670 or lift-rotate unit 680 is
mounted to the deck 630. The mounting module 620 is generally a
rigid structure that is sufficiently strong to maintain the
relative positions between the positioning elements 634 and 652
when the wet chemical processing chambers 670, the lift-rotate
units 680, and the transport system 690 are mounted to the mounting
module 620. In several embodiments, the mounting module 620 is
configured to maintain the relative positions between the
positioning elements 634 and 652 to within 0.025 inch. In other
embodiments, the mounting module is configured to maintain the
relative positions between the positioning elements 634 and 652 to
within approximately 0.005 to 0.015 inch. As such, the deck 630
often maintains a uniformly flat surface to within approximately
0.025 inch, and in more specific embodiments to approximately
0.005-0.015 inch.
[0058] D. Embodiments of Wet Chemical Processing Chambers
[0059] FIG. 10 is an isometric cross-sectional view showing the
interface between a wet chemical processing chamber 670 and the
deck 630. The chamber 670 can include the processing vessel 102 or
402 described above and a collar 672. The collar 672 and the vessel
102 can be separate components that are connected together. In such
cases, the collar 672 can be made from a dimensionally stable
material, such as stainless steel, fiber-reinforced materials,
steel alloys, cast solid materials, or other suitably rigid
materials. In other embodiments, the collar 672 is integral with
the vessel 102 and formed from a high-density polymer or other
suitable material.
[0060] The collar 672 is one embodiment of a mounting fixture 116
(FIG. 2). The collar 672 includes a plurality of interface members
674 that are arranged in a pattern to be aligned with the
positioning elements 634 on the deck 630. The positioning elements
634 and the interface members 674 are also configured to mate with
one another to precisely position the collar 672, and thus the
chamber 670, at a desired operating location on the deck 630 to
work with lift-rotate unit 680 and the transport system 690. The
positioning elements 634 can be a set of precisely machined holes
in the deck 630 and dowels received in the holes, and the interface
members 674 can be holes precisely machined in the collar 672 to
mate with the dowels. The dowels can be pins with cylindrical,
spherical, conical or other suitable shapes to align and position
the collar 672 at a precise location relative to the deck 630. The
collar 672 can further include a plurality of fasteners 675
arranged to be aligned with the attachment elements 635 in the deck
630. The fasteners 675 can be bolts or other threaded members that
securely engage the attachment elements 635 to secure the collar
672 to the deck 630. The collar 672 accordingly holds the
processing vessel 102 at a fixed, precise location on the deck.
[0061] From the foregoing, it will be appreciated that specific
embodiments of the invention have been described herein for
purposes of illustration, but that various modifications may be
made without deviating from the spirit and scope of the invention.
Accordingly, the present invention is not limited except as by the
appended claims.
* * * * *