U.S. patent application number 10/859749 was filed with the patent office on 2005-02-17 for electrochemical deposition chambers for depositing materials onto microfeature workpieces.
Invention is credited to Dolechek, Kert L., Hanson, Kyle M., McHugh, Paul R., Wilson, Gregory J..
Application Number | 20050034977 10/859749 |
Document ID | / |
Family ID | 38646089 |
Filed Date | 2005-02-17 |
United States Patent
Application |
20050034977 |
Kind Code |
A1 |
Hanson, Kyle M. ; et
al. |
February 17, 2005 |
Electrochemical deposition chambers for depositing materials onto
microfeature workpieces
Abstract
An electrochemical deposition chamber comprises a head assembly
and a vessel under the head assembly. The head assembly includes a
workpiece holder configured to position a microfeature workpiece at
a processing location and electrical contacts arranged to provide
electrical current to a layer on the workpiece. The vessel has a
fixed unit including a mounting fixture to attach the fixed unit to
a deck of a tool, a detachable unit releasably attachable to the
fixed unit below the mounting fixture to be positioned below the
deck of the tool, an interface element between the fixed unit and
the detachable unit to control processing fluid between the fixed
unit and the detachable unit, and an attachment system releasably
coupling the detachable unit to the fixed unit. The electrochemical
deposition chamber also includes an electrode in the detachable
unit.
Inventors: |
Hanson, Kyle M.; (Kalispell,
MT) ; Dolechek, Kert L.; (Kalispell, MT) ;
McHugh, Paul R.; (Kalispell, MT) ; Wilson, Gregory
J.; (Kalispell, MT) |
Correspondence
Address: |
PERKINS COIE LLP
PATENT-SEA
P.O. BOX 1247
SEATTLE
WA
98111-1247
US
|
Family ID: |
38646089 |
Appl. No.: |
10/859749 |
Filed: |
June 3, 2004 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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60476786 |
Jun 6, 2003 |
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|
60501566 |
Sep 9, 2003 |
|
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60476776 |
Jun 6, 2003 |
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60476881 |
Jun 6, 2003 |
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60476333 |
Jun 6, 2003 |
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Current U.S.
Class: |
204/242 |
Current CPC
Class: |
C25D 17/00 20130101;
H01L 21/67742 20130101; B01D 61/425 20130101; H01L 21/6719
20130101; H01L 21/68707 20130101; H01L 21/67005 20130101; H01L
21/6723 20130101 |
Class at
Publication: |
204/242 |
International
Class: |
C25D 017/00 |
Claims
I/We claim:
1. An electrochemical deposition chamber for depositing material
onto microfeature workpieces having submicron features, comprising:
a head assembly having a workpiece holder configured to position a
microfeature workpiece at a processing site; a fixed unit having a
first flow system to provide a processing fluid to the processing
site and a mounting fixture for fixedly attaching the fixed unit to
a support member of a tool; a detachable unit having a second flow
system in fluid communication with the first flow system of the
fixed unit; a seal to prevent leaking of the processing fluid
between the fixed unit and the detachable unit; an attachment
assembly releasably coupling the detachable unit to the fixed unit;
and at least a first electrode in the detachable unit and at least
a first electrical connector coupled to the first electrode.
2. The chamber of claim 1, further comprising a second electrode in
the detachable unit and a dielectric divider between the first
electrode and the second electrode.
3. The chamber of claim 1, further comprising a filter in the first
flow system and/or the second flow system.
4. The chamber of claim 1, further comprising a membrane in the
first flow system and/or the second flow system, wherein the
membrane is configured to conduct electrical current.
5. The chamber of claim 1, wherein the attachment assembly
comprises a clamp ring configured to move radially inwardly from a
first position to a second position to clamp the detachable unit to
the fixed unit.
6. The chamber of claim 1 wherein: the fixed unit further comprises
a beveled guide surface inclined upwardly with increasing radius, a
beveled bearing ring having a bearing surface inclined upwardly
with decreasing radius, and a first seal surface contacting one
side of the seal; and the detachable unit further comprises a rim
having a lower surface inclined upwardly with increasing radius, an
upper surface inclined upwardly with increasing radius, and a
second seal surface contacting another side of the seal.
7. The chamber of claim 1 wherein the fixed unit further comprises
a field shaping module that shapes an electrical field in the
processing fluid induced by the electrode.
8. The chamber of claim 1 further comprising: a second electrode
arranged concentrically with the first electrode in the detachable
unit; and a field shaping module in the fixed unit, wherein the
field shaping module is composed of a dielectric material and has a
first opening facing a first section of the processing site through
which ions influenced by the first electrode can pass and a second
opening facing a second section of the processing site through
which ions influenced by the second electrode can pass.
9. The chamber of claim 8 further comprising a second electrical
connector coupled to the second electrode, and the first and second
electrodes are operable independently from each other.
10. The chamber of claim 1 further comprising: a second electrode
concentric with the first electrode in the detachable unit and a
dielectric divider between the first and second electrodes; a field
shaping module in the fixed unit, the field shaping module being
composed of a dielectric material configured to shape electrical
fields in the processing fluid generated by the first and second
electrodes; and a filter in the fixed unit and/or the detachable
unit.
11. The chamber of claim 1 further comprising: a second electrode
concentric with the first electrode in the detachable unit and a
dielectric divider between the first and second electrodes; a field
shaping module in the fixed unit, the field shaping module being
composed of a dielectric material configured to shape electrical
fields in the processing fluid generated by the first and second
electrodes; and a membrane in the fixed unit and/or the detachable
unit that conducts electrical current.
12. The chamber of claim 1 wherein the detachable unit is
positioned externally underneath the fixed unit.
13. The chamber of claim 1 wherein the detachable unit further
includes an externally accessible fluid fitting through which the
processing fluid can flow.
14. An electrochemical deposition chamber for depositing material
onto microfeature workpieces having submicron features, comprising:
a head assembly having a workpiece holder configured to position a
microfeature workpiece at a processing site and electrical contacts
arranged to provide electrical current to a layer on the workpiece;
a vessel having a fixed unit including a mounting fixture to attach
the fixed unit to a deck of a tool, an externally accessible
detachable unit releasably attachable to the fixed unit below the
mounting fixture to be positioned below the deck of the tool, an
interface element between the fixed unit and the detachable unit to
control processing fluid between the fixed unit and the detachable
unit, and an attachment assembly releasably coupling the detachable
unit to the fixed unit; and an electrode in the detachable
unit.
15. The chamber of claim 14, further comprising a second electrode
in the detachable unit and a dielectric divider between the first
electrode and the second electrode.
16. The chamber of claim 14, further comprising a filter in the
vessel.
17. The chamber of claim 14, further comprising a membrane in the
vessel configured to conduct electrical current.
18. The chamber of claim 14, wherein the attachment assembly
comprises a clamp ring configured to move radially inwardly from a
first position to a second position to clamp the detachable unit to
the fixed unit.
19. The chamber of claim 14 wherein: the interface element
comprises a gasket between the fixed unit and the detachable unit;
and an externally accessible fluid fitting through which processing
fluid can flow.
20. The chamber of claim 14, further comprising: a flow system in
the vessel configured to direct a flow of processing fluid to be at
least substantially normal to a workpiece at the processing site;
and a field shaping module in the vessel that shapes an electrical
field in the processing fluid induced by the electrode.
21. The chamber of claim 14, further comprising: a second electrode
arranged concentrically with the first electrode in the detachable
unit; and a field shaping module in the vessel, the field shaping
module being composed of a dielectric material, and the field
shaping module having a first opening facing a first section of a
workpiece processing site through which ions influenced by the
first electrode can pass and a second opening facing a second
section of the workpiece processing site through which ions
influenced by the second electrode can pass.
22. The chamber of claim 14, further comprising: a second electrode
concentric with the first electrode in the detachable unit and a
dielectric divider between the first and second electrodes; a field
shaping module in the vessel, the field shaping module being
configured to shape electrical fields in the processing fluid
generated by the first and second electrodes; a flow system in the
vessel having a wall that directs a flow of processing fluid to be
at least substantially normal to a workpiece at the processing
site; and filter in the vessel in fluid communication with the
processing fluid.
23. The chamber of claim 14 wherein: a second electrode concentric
with the first electrode in the detachable unit and a dielectric
divider between the first and second electrodes; a field shaping
module in the vessel, the field shaping module being configured to
shape electrical fields in a processing fluid within the vessel
generated by the first and second electrodes; a flow system in the
vessel having a wall that directs the processing fluid to be at
least substantially normal to a workpiece at the processing site;
and a membrane in the vessel that conducts an electrical current in
the processing fluid.
24. An integrated tool for wet chemical processing of microfeature
workpieces, comprising: a frame; a mounting module carried by the
frame, the mounting module having a plurality of positioning
elements and attachment elements; an electrochemical deposition
chamber comprising a head assembly having a workpiece holder
configured to position a microfeature workpiece at a processing
site, a fixed unit having a first flow system to provide a
processing fluid to the processing site and a mounting fixture for
fixedly attaching the fixed unit to a support member of a tool, a
detachable unit having a second flow system in fluid communication
with the first flow system of the fixed unit, a seal to prevent
leaking of the processing fluid between the fixed unit and the
detachable unit, an attachment assembly releasably coupling the
detachable unit to the fixed unit, and at least a first electrode
in the detachable unit; a transport system carried by the mounting
module for transporting the workpiece within the tool, the
transport system having a second interface member engaged with one
of the positioning elements and a second fastener engaged with one
of the attachment elements; and wherein the mounting module is
configured to maintain relative positions between positioning
elements such that the transport system does not need to be
recalibrated when the processing chamber is replaced with another
processing chamber.
25. The tool of claim 24 wherein the mounting module further
comprises a deck having a rigid first panel, a rigid second panel
superimposed under the first panel, joists between the first and
second panel, and bolts through the first panel, the joists and the
second panel.
26. The tool of claim 24 wherein the mounting module further
comprises a deck having a rigid first panel, a rigid second panel
juxtaposed to the first panel, and bracing between the first and
second panels.
27. The tool of claim 24, further comprising a second electrode in
the detachable unit and a dielectric divider between the first
electrode and the second electrode.
28. The tool of claim 24, further comprising a filter in the first
flow system and/or the second flow system.
29. The tool of claim 24, further comprising a membrane in the
first flow system and/or the second flow system, wherein the
membrane is configured to conduct electrical current.
30. The tool of claim 24, wherein the attachment assembly comprises
a clamp ring configured to move radially inwardly from a first
position to a second position to clamp the detachable unit to the
fixed unit.
31. The tool of claim 24 wherein: the fixed unit further comprises
a beveled guide surface inclined upwardly with increasing radius, a
beveled bearing ring having a bearing surface inclined upwardly
with decreasing radius, and a first seal surface contacting one
side of the seal; and the detachable unit further comprises a rim
having a lower surface inclined upwardly with increasing radius, an
upper surface inclined upwardly with increasing radius, and a
second seal surface contacting another side of the seal.
32. The tool of claim 24 wherein the fixed unit further comprises a
field shaping module that shapes an electrical field in the
processing fluid induced by the electrode.
33. The tool of claim 24 further comprising: a second electrode
arranged concentrically with the first electrode in the detachable
unit; and a field shaping module in the fixed unit, wherein the
field shaping module is composed of a dielectric material and has a
first opening facing a first section of the processing site through
which ions influenced by the first electrode can pass and a second
opening facing a second section of the processing site through
which ions influenced by the second electrode can pass.
34. The tool of claim 33 further comprising a second electrical
connector coupled to the second electrode, and the first and second
electrodes are operable independently from each other.
35. The tool of claim 24 further comprising: a second electrode
concentric with the first electrode in the detachable unit and a
dielectric divider between the first and second electrodes; a field
shaping module in the fixed unit, the field shaping module being
composed of a dielectric material configured to shape electrical
fields in the processing fluid generated by the first and second
electrodes; and a filter in the fixed unit and/or the detachable
unit.
36. The tool of claim 24 further comprising: a second electrode
concentric with the first electrode in the detachable unit and a
dielectric divider between the first and second electrodes; a field
shaping module in the fixed unit, the field shaping module being
composed of a dielectric material configured to shape electrical
fields in the processing fluid generated by the first and second
electrodes; and a membrane in the fixed unit and/or the detachable
unit that conducts electrical current.
37. An integrated tool for wet chemical processing of microfeature
workpieces, comprising: a frame; a mounting module carried by the
frame, the mounting module having a plurality of positioning
elements and attachment elements; an electrochemical deposition
chamber comprising a head assembly and a vessel, the head assembly
having a workpiece holder configured to position a microfeature
workpiece at a processing site and electrical contacts arranged to
provide electrical current to a layer on the workpiece, and the
vessel having a fixed unit including a mounting fixture to attach
the fixed unit to a deck of a tool, an externally accessible
detachable unit releasably attachable to the fixed unit below the
mounting fixture to be positioned below the deck of the tool, an
interface element between the fixed unit and the detachable unit to
control processing fluid between the fixed unit and the detachable
unit, an electrode in the detachable unit, and an attachment
assembly releasably coupling the detachable unit to the fixed unit;
a transport system carried by the mounting module for transporting
the workpiece within the tool, the transport system having a second
interface member engaged with one of the positioning elements and a
second fastener engaged with one of the attachment elements; and
wherein the mounting module is configured to maintain relative
positions between positioning elements such that the transport
system does not need to be recalibrated when the processing chamber
is replaced with another processing chamber.
38. The tool of claim 37 wherein the mounting module further
comprises a deck having a rigid first panel, a rigid second panel
superimposed under the first panel, joists between the first and
second panel, and bolts through the first panel, the joists and the
second panel.
39. The tool of claim 37 wherein the mounting module further
comprises a deck having a rigid first panel, a rigid second panel
juxtaposed to the first panel, and bracing between the first and
second panels.
40. The tool of claim 37, further comprising a second electrode in
the detachable unit and a dielectric divider between the first
electrode and the second electrode.
41. The tool of claim 37, further comprising a filter in the
vessel.
42. The tool of claim 37, further comprising a membrane in the
vessel configured to conduct electrical current.
43. The tool of claim 37, wherein the attachment assembly comprises
a clamp ring configured to move radially inwardly from a first
position to a second position to clamp the detachable unit to the
fixed unit.
44. The tool of claim 37 wherein: the interface element comprises a
gasket between the fixed unit and the detachable unit; the fixed
unit further comprises a beveled guide surface inclined upwardly
with increasing radius, a beveled bearing ring having a bearing
surface inclined upwardly with decreasing radius, and a first seal
surface contacting one side of the gasket; and the detachable unit
further comprises a rim having a lower surface inclined upwardly
with increasing radius, an upper surface inclined upwardly with
increasing radius, and a second seal surface contacting another
side of the gasket.
45. The tool of claim 37, further comprising: a flow system in the
vessel configured to direct a flow of processing fluid to be at
least substantially normal to a workpiece at the processing site;
and a field shaping module in the vessel that shapes an electrical
field in the processing fluid induced by the electrode.
46. The tool of claim 37, further comprising: a second electrode
arranged concentrically with the first electrode in the detachable
unit; and a field shaping module in the vessel, the field shaping
module being composed of a dielectric material, and the field
shaping module having a first opening facing a first section of a
workpiece processing site through which ions influenced by the
first electrode can pass and a second opening facing a second
section of the workpiece processing site through which ions
influenced by the second electrode can pass.
47. The tool of claim 37, further comprising: a second electrode
concentric with the first electrode in the detachable unit and a
dielectric divider between the first and second electrodes; a field
shaping module in the vessel, the field shaping module being
configured to shape electrical fields in the processing fluid
generated by the first and second electrodes; a flow system in the
vessel having a wall that directs a flow of processing fluid to be
at least substantially normal to a workpiece at the processing
site; and filter in the vessel in fluid communication with the
processing fluid.
48. The tool of claim 37, further comprising: a second electrode
concentric with the first electrode in the detachable unit and a
dielectric divider between the first and second electrodes; a field
shaping module in the vessel, the field shaping module being
configured to shape electrical fields in a processing fluid within
the vessel generated by the first and second electrodes; a flow
system in the vessel having a wall that directs the processing
fluid to be at least substantially normal to a workpiece at the
processing site; and a membrane in the vessel that conducts an
electrical current in the processing fluid.
49. A method for electrochemically depositing material onto a
workpiece in an electrochemical deposition chamber comprising a
head assembly having a workpiece holder and a vessel having a fixed
unit with a processing location, a first detachable unit releasably
attached to the fixed unit, and a first electrode in the first
detachable unit, the method comprising: depositing a layer onto a
first workpiece having submicron features by positioning the first
workpiece at the processing location of the fixed unit to contact a
processing fluid in the vessel and establishing an electrical field
between the first workpiece and the first electrode; replacing the
first electrode by releasing the first detachable unit from the
fixed unit, removing the detachable unit from underneath the fixed
unit, positioning a second detachable unit with a second electrode
underneath the fixed unit, and releasably attaching the second
detachable unit to the fixed unit; and depositing a layer onto a
second workpiece having submicron features by positioning the
second workpiece at the processing location of the fixed unit to
contact a processing fluid in the vessel and establishing an
electrical field between the second workpiece and the second
electrode.
50. A method of servicing an electrochemical chamber for depositing
material onto a workpiece having submicron features, the method
comprising: providing an electrochemical deposition chamber
comprising a head assembly having a workpiece holder and a vessel
having a fixed unit with a processing location, a first detachable
unit releasably attached to the fixed unit, and a first electrode
in the first detachable unit; removing the first detachable unit
from the fixed unit by disconnecting the detachable unit from the
fixed unit at an external location outside of the fixed unit; and
releasably attaching a second detachable unit having a second
electrode to a portion of the fixed unit.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] The present application claims the benefit of U.S.
Application No. 60/476,786 filed on Jun. 6, 2003; 60/476,333 filed
on Jun. 6, 2003; 60/476,881 filed on Jun. 6, 2003; and 60/476,776
filed on Jun. 6, 2003, all of which are incorporated herein in
their entirety, including appendices, by reference. Additionally,
U.S. Application No. 60/501,566 filed on Sep. 9, 2003 is also
incorporated herein in its entirety by reference.
TECHNICAL FIELD
[0002] The present invention is directed toward apparatus and
methods for processing microfeature workpieces having a plurality
of microdevices integrated in and/or on the workpiece. The
microdevices can include submicron features. Particular aspects of
the present invention are directed toward electrochemical
deposition chambers having a fixed unit, a detachable unit that can
be quickly removed from the fixed unit, and an electrode in the
detachable unit.
BACKGROUND
[0003] Microdevices are manufactured by depositing and working
several layers of materials on a single substrate to produce a
large number of individual devices. For example, layers of
photoresist, conductive materials, and dielectric materials are
deposited, patterned, developed, etched, planarized, and otherwise
manipulated to form features in and/or on a substrate. The features
are arranged to form integrated circuits, micro-fluidic systems,
and other structures.
[0004] Wet chemical processes are commonly used to form features on
microfeature workpieces. Wet chemical processes are generally
performed in wet chemical processing tools that have a plurality of
individual processing chambers for cleaning, etching,
electrochemically depositing materials, or performing combinations
of these processes. FIG. 1 schematically illustrates an integrated
tool 10 that can perform one or more wet chemical processes. The
tool 10 includes a housing or cabinet 20 having a platform 22, a
plurality of wet chemical processing chambers 30 in the cabinet 20,
and a transport system 40. The tool 10 also includes lift-rotate
units 32 coupled to corresponding processing chambers 30 for
loading/unloading the workpieces W. The processing chambers 30 can
be rinse/dry chambers, cleaning capsules, etching capsules,
electrochemical deposition chambers, or other types of wet chemical
processing vessels. The transport system 40 includes a linear track
42 and a robot 44 that moves along the track 42 to transport
individual workpieces W within the tool 10. The integrated tool 10
further includes a workpiece storage unit 60 having a plurality of
containers 62 for holding workpieces W. In operation, the robot 44
transports workpieces to/from the containers 62 and the processing
chambers 30 according to a predetermined workflow within the tool
10.
[0005] One concern of integrated wet chemical processing tools is
that the processing chambers must be maintained and/or repaired
periodically. In electrochemical deposition chambers, for example,
consumable electrodes degrade over time because the reaction
between the electrodes and the electrolytic solution decomposes the
electrodes. The consumable electrodes accordingly change causing
variations in the electrical field. As a result, consumable
electrodes must be replaced periodically to maintain the desired
deposition parameters across the workpiece. The electrical contacts
that contact the workpiece also may need to be cleaned or replaced
periodically.
[0006] One problem with repairing or maintaining existing
electrochemical deposition chambers is that the tool must be taken
offline for an extended period of time to replace the electrodes or
service other components in the processing chambers 30. In a
typical application, the electrodes are removed while the
processing chamber 30 remains in-situ on the platform. To remove
the worn electrodes, the lift/rotate unit 32 is generally moved out
of the way and other components above the electrodes are removed
from the chamber 30 to provide access to the electrodes through the
top of the chamber. The worn electrodes are then disconnected and
removed through the top of the chamber, and new electrodes are
installed in the chamber 30. Finally, the other components are
reinstalled in the chamber 30 above the electrodes. This process
requires a significant amount of time to disassemble and then
reassemble the chamber 30. This process is also extremely
cumbersome because there is only a limited amount of space to
access the electrodes through the top opening of the chamber 30.
Moreover, after the electrodes have been replaced, the robot 44 and
the lift- rotate unit 32 are recalibrated to operate with the
processing chamber. Thus, replacing worn electrodes requires a
significant amount of time during which the tool cannot process
workpieces.
[0007] This is not the only problem with existing electrochemical
deposition tools. For example, when only one processing chamber 30
of the tool 10 does not meet specifications, it is often more
efficient to continue operating the tool 10 without stopping to
repair the one processing chamber 30 until more processing chambers
do not meet the performance specifications. The loss of throughput
of a single processing chamber 30, therefore, is not as severe as
the loss of throughput caused by taking the tool 10 offline to
repair or maintain a single one of the processing chambers 30.
[0008] The practice of operating the tool 10 until at least two
processing chambers 30 do not meet specifications severely impacts
the throughput of the tool 10. For example, if the tool 10 is not
repaired or maintained until at least two or three processing
chambers 30 are out of specification, then the tool operates at
only a fraction of its full capacity for a period of time before it
is taken offline for maintenance. This further increases the
operating costs of the tool 10 because the throughput not only
suffers while the tool 10 is offline to replace the electrodes and
recalibrate the robot 44, but the throughput is also reduced while
the tool is online because it operates at only a fraction of its
full capacity. Moreover, as the feature sizes of devices decrease,
the electrochemical deposition chambers 30 must consistently meet
much higher performance specifications. This causes the processing
chambers 30 to fall out of specifications sooner, which results in
shutting down the tool more frequently. Therefore, the downtime
associated with replacing the electrodes is significantly
increasing the cost of operating electrochemical deposition
tools.
SUMMARY
[0009] The present invention is directed toward electrochemical
deposition chambers with at least one electrode in a quick-release
detachable unit that reduces the downtime for replacing worn
electrodes. In several embodiments of the inventive electrochemical
deposition chambers, one or more consumable electrodes are housed
within a detachable unit that can be quickly removed and replaced
with another detachable unit. Worn electrodes can accordingly be
quickly replaced with new electrodes by simply removing the
detachable unit with the worn electrodes and installing a
replacement detachable unit with new electrodes. The detachable
unit is generally a lower portion of the chamber that is accessible
without having to move the lift-rotate unit or otherwise open the
chamber from above. The detachable units are also coupled to the
chamber by a quick-release mechanism that can be easily accessible.
As such, the downtime for repairing or maintaining electrodes is
greatly reduced by locating the electrodes in quick-release
detachable units that can be removed and replaced in only a few
minutes compared to the several hours it normally takes for
replacing electrodes on existing electrochemical deposition
chambers.
[0010] In one embodiment, an electrochemical deposition chamber
comprises a head assembly and a vessel under the head assembly. The
head assembly includes a workpiece holder configured to position a
microfeature workpiece at a processing location and electrical
contacts arranged to provide electrical current to a layer on the
workpiece. The vessel has a fixed unit including a mounting fixture
to attach the fixed unit to a deck of a tool, a detachable unit
releasably attachable to the fixed unit below the mounting fixture
to be positioned below the deck of the tool, an interface element
between the fixed unit and the detachable unit to control
processing fluid between the fixed unit and the detachable unit,
and an attachment system releasably coupling the detachable unit to
the fixed unit. The electrochemical deposition chamber also
includes an electrode in the detachable unit. In several particular
embodiments, the detachable unit further includes a fluid inlet for
providing the processing fluid to the vessel and a fluid outlet for
discharging processing fluid from the vessel.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] FIG. 1 is a schematic top plan view of a wet chemical
processing tool in accordance with the prior art.
[0012] FIG. 2 is cross-sectional view schematically illustrating an
electrochemical deposition chamber in a detached configuration in
accordance with an embodiment of the invention.
[0013] FIG. 3 is a cross-sectional view schematically illustrating
an electrochemical deposition chamber in an assembled configuration
in accordance with an embodiment of the invention.
[0014] FIG. 4 is a cross-sectional view illustrating an
electrochemical deposition chamber in accordance with an embodiment
of the invention.
[0015] FIG. 5 is a cross-sectional view illustrating the
electrochemical deposition chamber of FIG. 4 along a different
cross section.
[0016] FIG. 6 is a cross-sectional view illustrating a vessel for
an electrochemical deposition chamber in accordance with another
embodiment of the invention.
[0017] FIG. 7 is a bottom isometric view of an electrochemical
deposition chamber in accordance with an embodiment of the
invention.
[0018] FIG. 8 is a cross-sectional view illustrating an
electrochemical deposition chamber in accordance with another
embodiment of the invention.
[0019] FIG. 9A is a top isometric view of a carriage for
loading/unloading a detachable unit from a wet chemical processing
chamber in accordance with an embodiment of the invention.
[0020] FIG. 9B is a bottom isometric view of a carriage for
loading/unloading a detachable unit of a wet chemical processing
chamber in accordance with an embodiment of the invention.
[0021] FIG. 10 is a top plan view of wet chemical processing tool
including an electrochemical deposition chamber in accordance with
another aspect of the invention.
[0022] FIG. 11 is an isometric view of a mounting module for
holding a wet chemical processing chamber in a wet chemical
processing tool in accordance with an embodiment of the
invention.
[0023] FIG. 12 is a cross-sectional view taken along line 12-12 of
FIG. 11 of a mounting module for carrying a wet chemical processing
chamber in accordance with an embodiment of the invention.
[0024] FIG. 13 is a cross-sectional view showing a portion of a
deck of a mounting module in greater detail.
[0025] FIG. 14 is a cross-sectional isometric view schematically
illustrating a wet chemical processing chamber carried by a
mounting module of a wet chemical processing tool in accordance
with an embodiment of the invention.
DETAILED DESCRIPTION
[0026] As used herein, the terms "microfeature workpiece" or
"workpiece" refer to substrates' on or in which microdevices are
formed integrally. Typical microdevices include microelectronic
circuits or components, thin-film recording heads, data storage
elements, microfluidic devices, and other products. Micromachines
or micromechanical devices are included within this definition
because they are manufactured using much of the same technology as
used in the fabrication of integrated circuits. The substrates can
be semiconductive pieces (e.g., doped silicon wafers or gallium
arsenide wafers), nonconductive pieces (e.g., various ceramic
substrates) or conductive pieces.
[0027] Several embodiments of electrochemical deposition chambers
for processing microfeature workpieces are particularly useful for
electrolytically depositing metals or electrophoretic resist in or
on structures of a workpiece. The electrochemical deposition
chambers in accordance with the invention can accordingly be used
in tools with wet chemical processing chambers for etching,
rinsing, or other types of wet chemical processes in the
fabrication of microfeatures in and/or on semiconductor substrates
or other types of workpieces. Several embodiments of
electrochemical deposition chambers and integrated tools in
accordance with the invention are set forth in FIGS. 2-14 and the
corresponding text to provide a thorough understanding of
particular embodiments of the invention. A person skilled in the
art will understand, however, that the invention may have
additional embodiments or that the invention may be practiced
without several of the details of the embodiments shown in FIG.
2-14.
[0028] A. Embodiments of Wet Chemical Processing Chambers
[0029] FIG. 2 schematically illustrates a cross-section of an
electrochemical deposition chamber 100 that enables quick
replacement of electrodes and other components to reduce the
downtime for maintaining processing chambers. The processing
chamber 100 includes a wet chemical vessel 102 and a head 104
(shown schematically). The vessel 102 is carried by a deck 106
(shown schematically) of a tool that can include several other
processing chambers (not shown) and a workpiece transport system
(not shown) for automatically handling workpieces. The vessel 102
contains the processing fluid and several components for directing
the processing fluid or otherwise imparting properties to the
processing fluid for processing a workpiece. The head 104 is
carried by a lift- rotate unit 108 (shown schematically) that moves
the head 104 to load/unload the workpiece and to position the
workpiece at a processing site 109 relative to the vessel 102. The
head 104 typically includes a workpiece holder 105 having a contact
assembly with a plurality of electrical contacts configured to
engage a conductive layer on the workpiece. Suitable workpiece
holders are disclosed in U.S. Pat. No. 6,309,524, U.S. application
Ser. No. 09/717,927, and U.S. application Ser. No. 09/823,948, all
of which are herein incorporated by reference.
[0030] The vessel 102 includes a fixed unit 110 mounted to the deck
106 and a detachable unit 120 carried by the fixed unit 110. The
fixed unit 110 can include a chassis 112, a first flow system 114
(shown schematically), and a mounting fixture 116. The chassis 112
can be a dielectric housing that is chemically compatible with the
processing fluid. The chassis 112, for example, can be a high
density polymer or other suitable material. The first flow system
114 can be configured to provide the desired flow to the processing
site 109. In electrochemical deposition chambers, the first flow
system 114 can be configured to provide a flow that has a
substantially uniform velocity in a direction normal to the
workpiece along the processing site 109. The mounting fixture 116
can be flanges or a ring projecting outwardly from the chassis 112
to engage the top surface of the deck 106. The mounting fixture 116
can be configured to precisely locate the fixed unit 110 relative
to the deck 106. The fixed unit 110 can further include a
processing component 118 to impart a property to the processing
fluid flowing through the fixed unit 110. For example, the
processing component 118 can be an electric field shaping element
or field shaping module that shapes the electric field in the
processing site 109. The field shaping element can be a static
dielectric insert that controls the current density in the
processing site 109. The field shaping element can also be a
dynamic member that moves to alter or otherwise control the
electrical field at the processing site 109 during a plating cycle.
The processing component 118 can also be a filter, membrane, or any
combination of these types of structures.
[0031] The detachable unit 120 of the vessel 102 includes a
container 122 and a second flow system 124 (shown schematically)
configured to direct the processing fluid to and/or from the first
flow system 114 of the fixed unit 110. The second flow system 124
can include an inlet 126 to deliver processing fluid to the vessel
102 and an outlet 127 through which processing fluid exits the
vessel 102. The first and second flow systems operate together to
provide a desired flow of processing fluid through the vessel 102.
The first and second flow systems 114 and 124 can be configured to
provide a forward flow relative to the processing component 126. In
a forward flow system, at least a portion of the processing fluid
passes the electrode 130 in the detachable unit 120 before the
processing fluid reaches the processing site 109. The first and
second flow systems can also be configured to provide a reverse
flow in which at least a portion of the processing fluid passes the
electrode after the processing fluid has passed through the
processing site 109.
[0032] The chamber 100 can also include one or more electrodes 130
(shown schematically) and optional processing components 150 (shown
schematically) disposed in the detachable unit 120. The processing
component 150 can be a filter and/or a membrane. Several
embodiments of electrodes, filters, and membranes are described
below.
[0033] The vessel 102 also includes an interface element 160 to
prevent leaking or to otherwise control the flow of processing
fluid between the fixed unit 110 and the detachable unit 120. The
interface element 160 can be a seal positioned between the fixed
unit 110 and the detachable unit 120. The seal can include at least
one orifice to allow the processing fluid to flow between the first
flow system 114 in the fixed unit 110 and the second flow system
124 in the detachable unit 120. In many embodiments, the interface
element 160 is a gasket with a pattern of orifices to allow fluid
to flow between the first and second flow systems 114 and 124. The
interface element 160 is typically a compressible member that
prevents liquid from leaking between the various flow channels of
the flow systems. The interface element 160 can also be made from a
dielectric material that electrically isolates different fluid
flows as they flow between the first and second flow systems 114
and 124. Suitable materials for the interface element 160 include
VITON.RTM. closed cell foams, closed cell silicon, elastomers,
polymers, rubber and other materials.
[0034] The vessel 102 also includes an attachment assembly 170 for
attaching the detachable unit 120 to the fixed unit 110. The
attachment assembly 170 can be a quick-release unit, such as a
clamp or a plurality of clamps, that securely holds the detachable
unit 120 to the fixed unit 110. The attachment assembly 170 can be
configured to move from a first position in which the detachable
unit 120 is secured to the fixed unit 110 and a second position in
which the detachable unit 120 can be removed from the fixed unit
110. In several embodiments, as the attachment assembly 170 moves
from the second position to the first position, the attachment
assembly 170 drives the detachable unit 120 toward the fixed unit
110. This motion compresses the interface element 160 and positions
the detachable unit 120 at a desired location with respect to the
fixed unit 110. The attachment assembly 170 can be a clamp ring, a
plurality of latches, a plurality of bolts, or other types of
fasteners.
[0035] In the embodiment shown in FIG. 2, the fixed unit 110,
detachable unit 120, and attachment assembly 170 interact with each
other to accurately position and secure the detachable unit 120 to
the fixed unit 110. The fixed unit 110 can further include a
plurality of hangers 180 arranged at a common radius with respect
to a center line of the fixed unit 110 or in another configuration.
The hangers 180 can include shoulders 182 to hold the attachment
assembly 170. For example, the attachment assembly 170 can be a
ring that springs radially outwardly to contact the hangers 180 and
rest on the shoulders 182 in an open position. The fixed unit 110
further includes a beveled guide surface 183, a bearing ring 184
above the beveled guide surface 183, and a seal surface 186. The
guide surface 183 can be an annular surface or a series of arcuate
segments inclined upwardly with increasing radius. The bearing ring
184 can be a metal ring having a bearing surface inclined upwardly
with decreasing radius. The bearing ring 184 can also be made from
other materials that are typically harder than the material of the
chassis 112.
[0036] The detachable unit 120 can include a rim 190 having a lower
surface 192 and an upper surface 194. The lower surface 192 and the
upper surface 194 can be inclined upwardly with increasing radius.
The upper surface 194, more specifically, can be inclined at an
angle to mate with the guide surface 183 of the fixed unit 110. The
detachable unit 120 can further include a seal surface 195
configured to retain the interface element 160, slide channels 196a
and 196b, and a bottom surface 197.
[0037] The attachment assembly 170 can include a first rim 172
configured to engage the lower surface 192 of the detachable unit
120 and a second rim 174 configured to engage the bearing surface
of the bearing ring 184. The attachment assembly 170 can include a
latch (shown in FIG. 7) or lever that moves the ring radially
inwardly and locks the ring into a fixed position.
[0038] FIG. 3 illustrates the vessel 102 after the detachable unit
120 has been attached to the fixed unit 110. In operation, the
attachment assembly 170 moves radially inwardly so that the first
rim 172 engages the lower surface 192 of the detachable unit 120
and the second rim 174 engages the bearing surface of the bearing
ring 184. As the detachable unit 120 moves upwardly, the upper
surface 194 engages the guide surface 183 to position the
detachable unit 120 at a desired position with respect to the fixed
unit 110. The firm rim 172 and the second rim 174 of the attachment
assembly 170 move radially inwardly along the bottom surface 192
and the bearing ring 184, respectively, to clamp the interface
element 160 between the seal surfaces 185 and 195. A lever (shown
in FIG. 7) on the attachment assembly 170 can be moved from an open
position to a closed position to induce a hoop stress in the
attachment assembly 170 for securely holding the detachable unit
120 to the fixed unit 110.
[0039] One advantage of the processing chamber 100 illustrated in
FIGS. 2 and 3 is that worn electrodes can be quickly replaced with
new or refurbished electrodes without shutting down the processing
chamber 100 for a significant period of time. A detachable unit 120
with worn electrodes 130 can be quickly removed from the fixed unit
110, and then a replacement detachable unit 120 with new electrodes
130 can be installed in only a matter of a few minutes. This
significantly reduces the downtime for repairing electrodes or
other processing components compared to conventional systems that
require the components to be repaired in-situ on the tool or
require the entire chamber to be removed from the tool. Another
advantage of the processing chamber 100 is that the electrodes
and/or other processing components 150 in the detachable units 120
can be replaced from a location that is easily accessible under the
deck 106. As a result, there is no need to move either the fixed
unit 110, the head 104, or the lift-rotate unit 108 to replace worn
processing components. This further reduces the downtime for
maintaining processing components because the head 104 and lift-
rotate unit 108 do not need to be repositioned with respect to the
fixed unit 110. Moreover, a workpiece transport system that
delivers the workpieces to the head 104 and retrieves the
workpieces from the head 104 does not need to be recalibrated to
the processing chamber 100 because replacing the electrodes does
not change the position between the head 104 and the workpiece
transport system. The significant reduction in downtime for
replacing processing components provided by the processing chamber
100 is expected to significantly increase the productivity of the
tool compared to existing tools.
[0040] B. Embodiments of Multiple Electrode Electrochemical
Deposition Vessels
[0041] FIGS. 4-6 illustrate aspects of embodiments of vessels
having multiple electrodes for electrochemical deposition of
materials. Many aspects of these embodiments are described in the
context of having four independently operable electrodes in the
detachable unit. Each electrode can be controlled independent of
the other electrodes such that each electrode can generate an
individual current density that can remain constant or can change
dynamically during a plating cycle. Suitable processes for
operating the electrodes are set forth in U.S. patent application
Ser. Nos. 09/849,505; 09/866,391; and 09/866,463, all of which are
herein incorporated by reference. Additionally, it will be
appreciated that other embodiments of the multiple electrode
vessels can have any combination of two or more electrodes such
that the invention is not limited to having four electrodes.
[0042] FIG. 4 is a cross-sectional view illustrating a vessel 400
having a fixed unit 402 configured to be fixedly attached to a deck
(not shown) and a detachable unit 404 releasably attachable to the
fixed unit 402. The fixed unit 402 can include a mounting fixture
116 to fixedly attach the fixed unit 402 to the deck of a tool as
described above. The detachable unit 404 can be releasably attached
to the fixed unit 402 using a clamp ring 170 and hangers 180 as
described above. Additionally, the detachable unit 404 has a rim
190 and the fixed unit 402 has an inclined guide surface 183 to
position the detachable unit 404 with respect to the fixed unit
402. The detachable unit 404 can accordingly be removed from the
fixed unit 402 in a short period of time as described above with
respect to the embodiments shown in FIGS. 2 and 3.
[0043] The fixed unit 402 includes a chassis 410 having a flow
system 414 to direct the flow of processing fluid through the
chassis 410. The flow system 414 can be a separate component
attached to the chassis 410, or the flow system 414 can be a
combination of fluid passageways formed in the chassis 410 and
separate components attached to the chassis 410. In this
embodiment, the flow system 414 includes an inlet 415 that receives
a flow of processing fluid from the detachable unit 404, a first
flow guide 416 having a plurality of slots 417, and an antechamber
418. The slots 417 in the first flow guide 416 distribute the flow
radially to the antechamber 418.
[0044] The flow system 414 further includes a second flow guide 420
that receives the flow from the antechamber 418. The second flow
guide 420 can include a sidewall 421 having a plurality of openings
422 and a flow projector 424 having a plurality of apertures 425.
The openings 422 can be horizontal slots arranged radially around
the sidewall 421 to provide a plurality of flow components
projecting radially inwardly toward the flow projector 424. The
apertures 425 in the flow projector can be a plurality of elongated
slots or other openings that are inclined upwardly and radially
inwardly. The flow projector 424 receives the radial flow
components from the openings 422 and redirects the flow through the
apertures 425. It will be appreciated that the openings 422 and the
apertures 425 can have several different configurations. For
example, the apertures 425 can project the flow radially inwardly
without being canted upwardly, or the apertures 425 can be canted
upwardly at a greater angle than the angle shown in FIG. 4. The
apertures can accordingly have an inclination ranging from
0.degree.-45.degree., and in several specific embodiments the
apertures can be canted upwardly at an angle of approximately
5.degree.-25.degree..
[0045] The fixed unit 402 can also include a field shaping insert
440 for shaping the electrical field(s) and directing the flow of
processing fluid at the processing site. In this embodiment, the
field shaping insert 440 has a first partition 442a with a first
rim 443a, a second partition 442b with a second rim 443b, and a
third partition 442c with a third rim 443c. The first rim 443a
defines a first opening 444a. The first rim 443a and the second rim
443b define a second opening 444b, and the second rim 443b and the
third rim 443c define a third opening 444c. The fixed unit 402 can
further include a weir 445 having a rim 446 over which the
processing fluid can flow into a recovery channel 447. The third
rim 443c and the weir 445 define a fourth opening 444d. The field
shaping unit 440 and the weir 445 are attached to the fixed unit
402 by a plurality of bolts or screws 448, and a number of seals
449 are positioned between the fixed unit 402 and both the field
shaping unit 440 and the weir 445.
[0046] FIG. 5 is a cross-sectional view of the vessel 400 shown in
FIG. 4 taken along a different section that shows the interaction
between the fixed unit 402 and the detachable unit 404 in greater
detail. Referring to FIGS. 4 and 5 together, the detachable unit
404 includes a container 510 that houses an electrode assembly and
a second flow system. The container 510 is also releasably
attachable to the chassis 410 as described above. In this
embodiment, the container 510 includes a plurality of dividers or
walls 512 that define a plurality of compartments 513. The specific
embodiment shown in FIGS. 4 and 5 has four compartments 513, but in
other embodiments the container 510 can include any number of
compartments to house the electrodes individually. The compartments
513 can also define a part of a second flow system through which
processing fluid can flow.
[0047] The detachable unit 404 includes a flow system having an
inlet 515 that provides the flow to the inlet 415 of the fixed unit
402 and an outlet 516 that receives the fluid flow from the
compartments 513. In the specific embodiment shown in FIG. 5, the
flow system 414 in the fixed unit 402 further includes a first
channel 520a between the antechamber 418 and a first compartment
513, a second channel 520b between the first opening 444b and a
second compartment 513, a third channel 520c between the third
opening 444c and a third compartment 513, and a fourth channel 520d
between the fourth opening 444d and a fourth compartment 513.
[0048] The vessel 400 also includes an interface element 530
between the fixed unit 402 and the detachable unit 404. In this
embodiment, the interface element 530 is a seal having a plurality
of openings 532 to allow fluid communication between the channels
520a-d and the corresponding compartments 513. The seal is a
dielectric material that electrically isolates the electric fields
within the compartments 513 and the corresponding channels
520a-d.
[0049] The vessel 400 can further include a plurality of electrodes
disposed in the detachable unit 404. In the embodiment shown in
FIGS. 4 and 5, the vessel 400 includes a first electrode 551 in the
first compartment 513, a second electrode 552 in the second
compartment 513, a third electrode 553 in the third compartment
513, and a fourth electrode 554 in the fourth compartment 513. The
electrodes 551-554 can be annular or circular conductive elements
arranged concentrically with one another. The electrodes, however,
can be arcuate segments or have other shapes and arrangements. In
this embodiment, each electrode is coupled to an electrical
connector 560 that extends through the container 510 of the
detachable unit 404 to couple the electrodes to a power supply. The
electrodes 551-554 can each provide a constant current throughout a
plating cycle, or the current through one or more of the electrodes
551-554 can be changed during a plating cycle according to the
particular parameters of the workpiece. Moreover, each electrode
can have a unique current that is different than the current of the
other electrodes.
[0050] Referring to FIG. 5, the fixed unit 402, the detachable unit
404, and the electrodes 551-554 operate together to provide a
desired flow profile of processing fluid and electrical profile at
the processing site 109. In this particular embodiment, the
processing fluid enters through the inlets 515 and 415 and passes
through the first flow guide 416. The fluid flow then bifurcates
with a portion of the fluid flowing up through the second fluid
guide 420 via the antechamber 418 and another portion of the fluid
flowing down across the first electrode 551 via the channel 520a.
The upward fluid flow through the second flow guide 420 passes
through the flow projector 424 and the first opening 444a. The
first electrode 551 accordingly provides an electrical field that
is effectively exposed to the processing site 109 through the first
opening 444a defined by the rim 443a of the first partition 442a
(FIGS. 4). The opening 444a accordingly shapes the field of the
first electrode 551 according to the configuration of the rim 443a.
A portion of the flow passes upwardly over the rim 443a, goes
through the processing site 109, and then flows over the rim 446 of
the weir 445. Another portion of the processing fluid flows
downwardly through each of the channels 520b-d to the electrodes
552-554. The portion of the flow passing through the second channel
520b passes over the second electrode 552 such that the opening
444b defined by the first rim 443a and the second rim 443b shapes
the electrical field of the second electrode 552. Similarly, the
flow through the third channel 520c passes over the third electrode
553 and the flow through the fourth channel 520d passes over the
fourth electrode 554. The opening 444c accordingly shapes the
electrical field from the third electrode 553, and the opening 444d
shapes the electrical field from the fourth electrode 554. The flow
then passes through the compartments 513 and exits the vessel 400
through the outlet 516. This flow profile is a reverse flow in
which the electrodes 551-554 are downstream from the processing
site 109 so that bubbles or particulate matter in the processing
fluid generated by the electrodes 551-554 is carried away from the
processing site 109. The downstream configuration is expected to be
particularly useful for consumable electrodes because they are
subject to generating bubbles and particulate matter that can cause
defects on the plated surface of a workpiece.
[0051] The vessel 400 is expected to significantly:reduce the
downtime associated with replacing multiple electrodes compared to
existing electrochemical deposition chambers. Referring to FIG. 5,
all of the electrodes 551-554 can be replaced with new electrodes
by simply opening the attachment assembly 170, removing the
detachable unit 404 from the fixed unit 402, positioning a
replacement detachable unit with new electrodes under the fixed
unit 402, and then closing the attachment assembly 170. Because the
detachable unit 404 is located externally of the fixed unit 402, an
operator does not need to reach through the top opening of the
fixed unit 402 to reach the electrodes 551-554 as in conventional
chambers. This not only allows faster access to the electrodes
551-554, but it also saves time compared to conventional chambers
because the field shaping insert 440 does not need to be removed
and then reinstalled. The electrodes 551-554, in fact, do not need
to be disassembled from the vessel while the chamber is off-line
because the replacement detachable unit can be ready to install as
soon as the detachable unit with the worn electrodes is removed.
The electrochemical deposition chambers with embodiments of the
vessels 102 or 400 can accordingly be brought back online in
significantly less time than conventional chambers.
[0052] FIG. 6 is a cross-sectional view of another embodiment of a
vessel 400. This embodiment is similar to the embodiment shown in
FIGS. 4 and 5, and thus like reference numbers refer to like
components in these figures. The embodiment of the vessel 400 shown
in FIG. 6 includes an interface element 610 having a gasket 620 and
a liner 630. The gasket 620 can be positioned between the fixed
unit 402 and the detachable unit 404, and the liner 630 can be
disposed in the detachable unit 404 and/or the fixed unit 402. The
liner 630 can be a membrane or filter that entraps bubbles or
particulate matter in the compartments 513 to prevent them from
migrating to the processing site 109. In the case of a filter, the
processing fluid flows through the liner 630 between the fixed unit
402 and the detachable unit 404 in accordance with the flow for
either a forward flow system or a reverse flow system. In the case
of a membrane, the liner 630 can be impermeable to fluid flow but
allow ions to pass from the electrodes 551-554 through the
corresponding channels 520a-d to provide ions for plating onto the
surface of the workpiece. The liner 630 can have a plurality of
discrete sections positioned in the compartments 513 and/or the
channels 520a-d. The gasket 620 can be attached to the liner 630 so
the interface element 610 can be installed or removed as a single
component.
[0053] The embodiment of the chamber 400 shown in FIG. 6 is
expected to be very useful in applications where bubbles and
particulate matter create defects. It will be appreciated that the
liner 630 should further impair bubbles or particulate matter from
reaching the processing site 109. The chamber 400 shown in FIG. 6
may also be useful in applications where one processing fluid is
used in the fixed unit and another processing fluid is used in the
detachable unit. In such an embodiment, the detachable liner 630
can be a membrane that allows ions to flow from the compartments
513 to the channels 520a-520d, but does not allow the processing
fluids to flow between the compartments 513 and the channels 520a-
520d.
[0054] FIG. 7 is a bottom isometric view illustrating various
aspects of the vessel 400 in accordance with additional embodiments
of the invention. The vessel 400 can further includes a first
fitting 701 to couple the inlet 515 with a supply of processing
fluid and a second fitting 702 to connect the outlet 516 with a
holding tank of processing fluid. In one particular embodiment, the
fitting 701 is a female fitting and the inlet 515 is a male
fitting, and the fitting 702 is a male fitting and the outlet 516
is a female fitting. By having a female fitting 701 coupled to the
inlet 515 and a male fitting 702 coupled to the outlet 516, the
processing fluid supply line can only be connected to the inlet 515
and the processing fluid exit line can only be connected to the
outlet 516. This configuration accordingly ensures that the
detachable unit 404 is installed properly.
[0055] FIG. 7 also illustrates the attachment assembly 170 in
further detail. In this embodiment, the attachment assembly 170
includes a clamp ring 708 and a latch 710 that moves the clamp ring
between a first position having a first diameter and a second
position having a second diameter less than the first diameter. As
the latch 710 moves the clamp ring from the first position to the
second position, the diameter of the clamp ring 708 decreases to
clamp the detachable unit 404 to the fixed unit 402.
[0056] FIG. 8 illustrates another embodiment of a vessel in
accordance with the invention. Several features of FIG. 8 are
similar to those described above with respect to FIGS. 4-7. The
vessel 800 shown in FIG. 8 has a fixed unit 810, a detachable unit
820 releasably attachable to the fixed unit 810 by a clamp 830, and
an interface element 840 between the fixed unit 810 and the
detachable unit 820. The primary difference between the vessel 800
and the vessel 400 is that the vessel 800 has a non-planer
interface element 840 and the vessel 400 has a planer interface
element 530.
[0057] C. Embodiments of Carriages for Installing/Removing
Detachable Units
[0058] The chambers 100, 400 and 800 described above can further
include carriages under the chambers to install and remove the
detachable units. Several embodiments of carriages are described
below in the context of the detachable unit 404, but it will be
appreciated that the carriages can work with any detachable units
of the invention.
[0059] FIG. 9A is a top isometric view of a carriage 900 for
installing and removing the detachable unit 404 (FIG. 4). The
carriage 900 can include a bracket 910 that mounts to the underside
of the deck 106 (FIG. 2) of the tool. The carriage 900 can further
include guide rails 912 and an end stop 914. The guide rails 912
receive the slide channels 196a and 196b (FIGS. 2, 3, 5 and 7) and
the end stop 914 engages a rounded portion of the detachable unit
404. In operation, an operator slides the detachable unit 404 along
the rails 912 until the detachable unit engages the end stop
914.
[0060] FIG. 9B is a bottom isometric view illustrating additional
aspects of the carriage 900. The carriage 900 can further include
an actuator 920 having a handle 922, a shaft 924, and lifters 926
that are moved by the shaft 924. The actuator 920 can further
include a rod 928 connected to the lifters 926 and positioned in a
joint 929. The rotation of the handle accordingly rotates the rod
928 within the joint 929 to raise and lower the lifters 926. To
install a detachable unit, the actuator 920 is moved to a first
position as shown in FIG. 9B, and a detachable unit is inserted
along the rails 912. The actuator 920 is then lifted upwardly
(arrow R) to a second position, which causes the lifters 926 to
raise the detachable unit 404 to the fixed unit 402. As the
actuator 920 rotates upwardly, the handle 922 passes through a gap
930 in a bottom flange 931 of the bracket 910. The actuator 920 is
held in the second position by sliding the handle 922 axially along
the shaft 924 so that the flange 931 supports the handle 922.
[0061] The carriage 900 further enhances the process of replacing
one detachable unit with another. First, the carriage 900 ensures
that the detachable unit 404 is generally aligned with fixed unit
402. Second, the carriage ensures that the inlet 515 and the outlet
516 are aligned with the supply line and exit line. Third, the
carriage makes it easier to install and remove the detachable unit
404 because the operator does not need to hold the detachable unit
404 against the fixed unit 402 while simultaneously operating the
attachment assembly 170. Therefore, the carriage is expected to
further reduce the time the replace one detachable unit with
another.
[0062] D. Embodiments of Wet Chemical Processing Tools
[0063] The electrochemical processing chambers described above can
be used in wet chemical processing tools having a plurality of
electrochemical deposition chambers, other types of wet chemical
processing chambers, annealing stations, metrology stations, and
other types of processing equipment. FIGS. 10-13 illustrate an
embodiment of a processing tool in which the electrochemical
deposition chambers can be used.
[0064] FIG. 10 is a top plan view showing a portion of an
integrated tool 1600 in accordance with an embodiment of the
invention. In this embodiment, the integrated tool 1600 includes a
frame 1610, a dimensionally stable mounting module 1620 mounted to
the frame 1610, a plurality of wet chemical processing chambers
1670, and a plurality of lift-rotate units 1680. The tool 1600 can
also include a transport system 1690. The mounting module 1620
carries the processing chambers 1670, the lift-rotate units 1680,
and the transport system 1690. The wet chemical processing chambers
1670 in the tool 1600 can include electrochemical deposition
chambers having fixed units and detachable units as described above
with reference to FIGS. 2-9B. As such, any of the embodiments of
the electrochemical deposition chambers described above can be the
wet chemical processing chambers 1670 in the integrated tool
1600.
[0065] The frame 1610 of the tool 1600 has a plurality of posts and
cross-bars that are welded together in a manner known in the art.
The mounting module 1620 is at least partially housed within the
frame 1610. In one embodiment, the mounting module 1620 is carried
by the frame 1610, but the mounting module 1620 can stand directly
on the floor of the facility or other structures in other
embodiments.
[0066] The mounting module 1620 is a rigid, stable structure that
maintains the relative positions between the wet chemical
processing chambers 1670, the lift- rotate units 1680, and the
transport system 1690. One aspect of the mounting module 1620 is
that it is much more rigid and has a significantly greater
structural integrity compared to the frame 1610 so that the
relative positions between the wet chemical processing chambers
1670, the lift-rotate units 1680, and the transport system 1690 do
not change over time. Another aspect of the mounting module 1620 is
that it includes a dimensionally stable deck 1630 with positioning
elements at precise locations for positioning the processing
chambers 1670 and the lift-rotate units 1680 at known locations on
the deck 1630. In one embodiment (not shown), the transport system
1690 can be mounted directly to the deck 1630. In other
embodiments, the mounting module 1620 also has a dimensionally
stable platform 1650 and the transport system 1690 is mounted to
the platform 1650. The deck 1630 and the platform 1650 are fixedly
positioned relative to each other so that positioning elements on
the deck 1630 and positioning elements on the platform 1650 do not
move relative to each other. The mounting module 1620 accordingly
provides a system in which wet chemical processing chambers 1670
and lift-rotate units 1680 can be removed and replaced with
interchangeable components in a manner that accurately positions
the replacement components at precise locations on the deck
1630.
[0067] The tool 1600 is particularly suitable for applications that
have demanding specifications which require frequent maintenance of
the wet chemical processing chambers 1670, the lift-rotate units
1680, or the transport system 1690. A wet chemical processing
chamber 1670 can be repaired or maintained by simply detaching the
chamber from the processing deck 1630 and replacing the chamber
1670 with an interchangeable chamber having mounting hardware
configured to interface with the positioning elements on the deck
1630. Because the mounting module 1620 is dimensionally stable and
the mounting hardware of the replacement processing chamber 1670
interfaces with the deck 1630, the chambers 1670 can be
interchanged on the deck 1630 without having to recalibrate the
transport system 1690. This is expected to significantly reduce the
downtime associated with repairing or maintaining processing
chambers 1670 so that the tool can maintain a high throughput in
applications that have stringent performance specifications. This
aspect of the tool 1600 is particularly useful when the fixed unit
110 (FIG. 2) must be removed to repair the chamber, but it is also
useful when only the detachable unit is removed from the fixed
unit.
[0068] The transport system 1690 retrieves workpieces from a
load/unload module 1698 attached to the mounting module 1620. The
transport system 1690 includes a track 1692, a robot 1694, and at
least one end-effector 1696. The track 1692 is mounted to the
platform 1650. More specifically, the track 1692 interfaces with
positioning elements on the platform 1650 to accurately position
the track 1692 relative to the chambers 1670 and the lift-rotate
units 1680 attached to the deck 1630. The robot 1694 and
end-effectors 1696 can accordingly move in a fixed, dimensionally
stable reference frame established by the mounting module 1620. The
tool 1600 can further include a plurality of panels 1699 attached
to the frame 1610 to enclose the mounting module 1620, the wet
chemical processing chambers 1670, the lift-rotate units 1680, and
the transport system 1690 in a cabinet. In other embodiments, the
panels 1699 on one or both sides of the tool 1600 can be removed in
the region above the processing deck 1630 to provide an open
tool.
[0069] E. Embodiments of Dimensionally Stable Mounting Modules
[0070] FIG. 11 is an isometric view of a mounting module 1620 in
accordance with an embodiment of the invention for use in the tool
1600. In this embodiment, the deck 1630 includes a rigid first
panel 1631 and a rigid second panel 1632 superimposed underneath
the first panel 1631. The first panel 1631 can be an outer member
and the second panel 1632 can be an interior member juxtaposed to
the outer member. The first and second panels 1631 and 1632 can
also have different configurations than the configuration in FIG.
11. A plurality of chamber receptacles 1633 are disposed in the
first and second panels 1631 and 1632 to receive the wet chemical
processing chambers 1670 (FIG. 10).
[0071] The deck 1630 can further include a plurality of positioning
elements 1634 and attachment elements 1635 arranged in a precise
pattern across the first panel 1631. The positioning elements 1634
can be holes machined in the first panel 1631 and dowels or pins
that are positioned in the machined holes. In other embodiments,
the positioning elements 1634 can be pins, such as cylindrical pins
or conical pins, that are not positioned in holes on the deck 1630,
but still project upwardly from the first panel 1631 to be received
by mating structures in the wet chemical processing chambers 1670.
The deck 1630 has a first set of positioning elements 1634 located
at each chamber receptacle 1633 to accurately position the
individual wet chemical processing chambers at precise locations on
the mounting module 1620. The deck 1630 can also include a second
set of positioning elements 1634 near each receptacle 1633 to
accurately position individual lift-rotate units 1680 at precise
locations on the mounting module 1620. The attachment elements 1635
can be threaded holes in the first panel 1631 that receive bolts to
secure the chambers 1670 and the lift-rotate units 1680 to the deck
1630.
[0072] The mounting module 1620 also includes exterior side plates
1660 along longitudinal outer edges of the deck 1630, interior side
plates 1661 along longitudinal inner edges of the deck 1630, and
endplates 1662 and 1664 attached to the ends of the deck 1630. The
transport platform 1650 is attached to the interior side plates
1661 and the end plates 1662 and 1664. The transport platform 1650
includes positioning elements 1652 for accurately positioning the
track 1692 (FIG. 10) of the transport system 1690 on the mounting
module 1620. The transport platform 1650 can further include
attachment elements, such as tapped holes, that receive bolts to
secure the trackl 692 to the platform 1650.
[0073] FIG. 12 is a cross-sectional view illustrating one suitable
embodiment of the internal structure of the deck 1630, and FIG. 13
is a detailed view of a portion of the deck shown in FIG. 12. In
this embodiment, the deck 1630 includes bracing 1640, such as
joists, extending laterally between the exterior side plates 1660
and the interior side plates 1661. The first panel 1631 is attached
to the upper side of the bracing 1640, and the second panel 1632 is
attached to the lower side of the bracing 1640. The deck 1630 can
further include a plurality of through-bolts 1642 and nuts 1644
that secure the first and second panels 1631 and 1632 to the
bracing 1640. As best shown in FIG. 13, the bracing 1640 has a
plurality of holes 1645 through which the through-bolts 1642
extend. The nuts 1644 can be welded to the bolts 1642 to enhance
the connection between these components.
[0074] The panels and bracing of the deck 1630 can be made from
stainless steel, other metal alloys, solid cast materials, or
fiber-reinforced composites. For example, the panels and plates can
be made from Nitronic 50 stainless steel, Hastelloy 625 steel
alloys, or a solid cast epoxy filled with mica. The fiber-
reinforced composites can include a carbon-fiber or Kevlar.RTM.
mesh in a hardened resin. The material for the panels 1631 and 1632
should be highly rigid and compatible with the chemicals used in
the wet chemical processes. Stainless steel is well-suited for many
applications because it is strong but not affected by many of the
electrolytic solutions or cleaning solutions used in wet chemical
processes. In one embodiment, the panels and plates 1631, 1632,
1660, 1661, 1662 and 1664 are 0.125 to 0.375 inch thick stainless
steel, and more specifically they can be 0.250 inch thick stainless
steel. The panels and plates, however, can have different thickness
in other embodiments.
[0075] The bracing 1640 can also be stainless steel,
fiber-reinforced composite materials, other metal alloys, and/or
solid cast materials. In one embodiment, the bracing can be 0.5 to
2.0 inch wide stainless steel joists, and more specifically 1.0
inch wide by 2.0 inches tall stainless steel joists. In other
embodiments the bracing 1640 can be a honey-comb core, a
light-weight foamed metal or other type of foam, polymers, fiber
glass or other materials.
[0076] The mounting module 1620 is constructed by assembling the
sections of the deck 1630, and then welding or otherwise adhering
the end plates 1662 and 1664 to the sections of the deck 1630. The
components of the deck 1630 are generally secured together by the
through-bolts 1642 without welds. The outer side plates 1660 and
the interior side plates 1661 are attached to the deck 1630 and the
end plates 1662 and 1664 using welds and/or fasteners. The platform
1650 is then securely attached to the end plates 1662 and 1664, and
the interior side plates 1661.
[0077] The mounting module 1620 provides a heavy-duty,
dimensionally stable structure that maintains the relative
positions between the positioning elements 1634 on the deck 1630
and the positioning elements 1652 on the platform 1650 within a
range that does not require the transport system 1690 to be
recalibrated each time a replacement processing chamber 1670 or
lift-rotate unit 1680 is mounted to the deck 1630. The mounting
module 1620 is generally a rigid structure that is sufficiently
strong to maintain the relative positions between the positioning
elements 1634 and 1652 when the wet chemical processing chambers
1670, the lift-rotate units 1680, and the transport system 1690 are
mounted to the mounting module 1620. In several embodiments, the
mounting module 1620 is configured to maintain the relative
positions between the positioning elements 1634 and 1652 to within
0.025 inch. In other embodiments, the mounting module is configured
to maintain the relative positions between the positioning elements
1634 and 1652 to within approximately 0.005 to 0.015 inch. As such,
the deck 1630 often maintains a uniformly flat surface to within
approximately 0.025 inch, and in more specific embodiments to
approximately 0.005-0.015 inch.
[0078] F. Embodiments of Wet Chemical Processing Chambers
[0079] FIG. 14 is an isometric cross-sectional view showing the
interface between a wet chemical processing chamber 1670 and the
deck 1630. The chamber 1670 can include the processing vessels 102
or 400 described above and a collar 1672. The collar 1672 and the
vessel 102 can be separate components that are connected together.
In such cases, the collar 1672 can be made from a dimensionally
stable material, such as stainless steel, fiber- reinforced
materials, steel alloys, cast solid materials, or other suitably
rigid materials. In other embodiments, the collar 1672 is integral
with the vessel 102 and formed from a high-density polymer or other
suitable material, such as the mounting fixture 116 shown in FIG.
2.
[0080] The collar 1672 includes a plurality of interface members
1674 that are arranged in a pattern to be aligned with the
positioning elements 1634 on the deck 1630. The positioning
elements 1634 and the interface members 1674 are also configured to
mate with one another to precisely position the collar 1672, and
thus the chamber 1670, at a desired operating location on the deck
1630 to work with lift-rotate unit 1680 and the transport system
1690. As explained above, the positioning elements 1634 can be a
set of precisely machined holes in the deck 1630 and dowels
received in the holes. The interface members 1674 can accordingly
be holes precisely machined in the collar 1672 to mate with the
dowels. The dowels can be pins with cylindrical, spherical, conical
or other suitable shapes to align and position the collar 1672 at a
precise location relative to the deck 1630. The collar 1672 can
further include a plurality of fasteners 1675 arranged to be
aligned with the attachment elements 1635 in the deck 1630. The
fasteners 1675 can be bolts or other threaded members that securely
engage the attachment elements 1635 to secure the collar 1672 to
the deck 1630. The collar 1672 accordingly holds the processing
vessel 102 at a fixed, precise location on the deck.
[0081] From the foregoing, it will be appreciated that specific
embodiments of the invention have been described herein for
purposes of illustration, but that various modifications may be
made without deviating from the spirit and scope of the invention.
Accordingly, the present invention is not limited except as by the
appended claims.
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