U.S. patent application number 10/936664 was filed with the patent office on 2005-02-10 for high-strength, high-conductivity copper alloy wire excellent in resistance to stress relaxation.
This patent application is currently assigned to The Furukawa Electric Co., Ltd.. Invention is credited to Hasegawa, Katsumasa, Mihara, Kuniteru, Miyoshi, Takashi, Uda, Katsuhiko.
Application Number | 20050028907 10/936664 |
Document ID | / |
Family ID | 27800287 |
Filed Date | 2005-02-10 |
United States Patent
Application |
20050028907 |
Kind Code |
A1 |
Hasegawa, Katsumasa ; et
al. |
February 10, 2005 |
High-strength, high-conductivity copper alloy wire excellent in
resistance to stress relaxation
Abstract
A high-strength, high-conductivity copper alloy wire that is
excellent in resistance to stress relaxation, which contains 1.0 to
4.5% by mass of Ni, 0.2 to 1.1% by mass of Si, 0.05 to 1.5% by mass
of Sn, and less than 0.005% (including zero) by mass of S, with the
balance being Cu and inevitable impurities, wherein the wire has a
conductivity of from 20% to 60% IACS and a tensile strength of from
700 to 1,300 MPa, and a method of producing the same.
Inventors: |
Hasegawa, Katsumasa; (Tokyo,
JP) ; Mihara, Kuniteru; (Tokyo, JP) ; Uda,
Katsuhiko; (Tokyo, JP) ; Miyoshi, Takashi;
(Tokyo, JP) |
Correspondence
Address: |
WESTERMAN, HATTORI, DANIELS & ADRIAN, LLP
1250 CONNECTICUT AVENUE, NW
SUITE 700
WASHINGTON
DC
20036
US
|
Assignee: |
The Furukawa Electric Co.,
Ltd.
Tokyo
JP
|
Family ID: |
27800287 |
Appl. No.: |
10/936664 |
Filed: |
September 9, 2004 |
Related U.S. Patent Documents
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
|
|
10936664 |
Sep 9, 2004 |
|
|
|
PCT/JP03/02914 |
Mar 12, 2003 |
|
|
|
Current U.S.
Class: |
148/683 ;
148/686; 420/473 |
Current CPC
Class: |
C22C 9/06 20130101 |
Class at
Publication: |
148/683 ;
148/686; 420/473 |
International
Class: |
C22C 009/06 |
Foreign Application Data
Date |
Code |
Application Number |
Mar 12, 2002 |
JP |
2002-67602 |
Claims
1. A high-strength, high-conductivity copper alloy wire that is
excellent in resistance to stress relaxation, comprising 1.0 to
4.5% by mass of Ni, 0.2 to 1.1% by mass of Si, 0.05 to 1.5% by mass
of Sn, and less than 0.005% (including zero) by mass of S, with the
balance being Cu and inevitable impurities, wherein the wire has a
conductivity of from 20% to 60% IACS, and a tensile strength of
from 700 to 1,300 MPa.
2. A high-strength, high-conductivity copper alloy wire that is
excellent in resistance to stress relaxation, comprising 1.0 to
4.5% by mass of Ni, 0.2 to 1.1% by mass of Si, 0.05 to 1.5% by mass
of Sn, 0.2 to 1.5% by mass of Zn, and less than 0.005% (including
zero) by mass of S, with the balance being Cu and inevitable
impurities, wherein the wire has a conductivity of from 20% to 60%
IACS, and a tensile strength of from 700 to 1,300 MPa.
3. A high-strength, high-conductivity copper alloy wire that is
excellent in resistance to stress relaxation according to claim 1
or 2, further containing at least one or plural elements selected
from the group consisting of 0.005 to 0.3% by mass of Ag, 0.01 to
0.5% by mass of Mn, 0.01 to 0.2% by mass of Mg, 0.005 to 0.2% by
mass of Fe, 0.005 to 0.2% by mass of Cr, 0.05 to 2% by mass of Co,
and 0.005 to 0.1% by mass of P in a total amount of 0.005 to 2% by
mass, wherein the wire has a conductivity of from 20% to 60% IACS,
and a tensile strength of from 700 to 1,300 MPa.
4. A method for producing a high-strength, high-conductivity copper
alloy wire that is excellent in resistance to stress relaxation,
comprising: rough drawing a copper alloy comprising 1.0 to 4.5% by
mass of Ni, 0.2 to 1.1% by mass of Si, 0.05 to 1.5% by mass of Sn,
and less than 0.005% (including zero) by mass of S, with the
balance being Cu and inevitable impurities, to form a wire rod;
subjecting the wire rod to a solution treatment; and subjecting the
wire rod to at least one step selected from an aging treatment and
drawing, thereby obtaining a copper alloy wire having a
conductivity of from 20% to 60% IACS and a tensile strength of from
700 to 1,300 MPa.
5. A method for producing a high-strength, high-conductivity copper
alloy wire that is excellent in resistance to stress relaxation,
comprising: rough drawing a copper alloy comprising 1.0 to 4.5% by
mass of Ni, 0.2 to 1.1% by mass of Si, 0.05 to 1.5% by mass of Sn,
0.2 to 1.5% by mass of Zn, and less than 0.005% (including zero) by
mass of S, with the balance being Cu and inevitable impurities, to
form a wire rod; subjecting the wire rod to a solution treatment;
and subjecting the wire rod to at least one step selected from an
aging treatment and drawing, thereby obtaining a copper alloy wire
having a conductivity of from 20% to 60% IACS and a tensile
strength of from 700 to 1,300 MPa.
6. A method for producing a high-strength, high-conductivity copper
alloy wire that is excellent in resistance to stress relaxation,
comprising: rough drawing the copper alloy according to claim 1 or
2, further containing at least one or plural elements selected from
the group consisting of 0.005 to 0.3% by mass of Ag, 0.01 to 0.5%
by mass of Mn, 0.01 to 0.2% by mass of Mg, 0.005 to 0.2% by mass of
Fe, 0.005 to 0.2% by mass of Cr, 0.05 to 2% by mass of Co, and
0.005 to 0.1% by mass of P, in a total amount of 0.005 to 2% by
mass, to form a wire rod; subjecting the wire rod to a solution
treatment; and subjecting the wire rod to at least one step
selected from an aging treatment and drawing, thereby obtaining a
copper alloy wire having a conductivity of from 20% to 60% IACS and
a tensile strength of from 700 to 1,300 MPa.
7. A method for producing a high-strength, high-conductivity copper
alloy wire that is excellent in resistance to stress relaxation,
comprising: rough drawing the copper alloy according to claim 1 or
2, to form a wire rod; subjecting the wire rod to a solution
treatment; drawing the wire rod at a reduction ratio of from 0 to
4, aging at from 400.degree. C. to 550.degree. C. for 1.5 hours or
more; and drawing at a reduction ratio of 3 or more, thereby
obtaining a copper alloy wire having a tensile strength of 1,000
MPa or more and a conductivity of 20% IACS or more.
8. A method for producing a high-strength, high-conductivity copper
alloy wire that is excellent in resistance to stress relaxation,
comprising: rough drawing the copper alloy according to claim 1 or
2, to form a wire rod; subjecting the wire rod to a solution
treatment; drawing the wire rod at a reduction ratio of from 0 to
4, aging at from 400.degree. C. to 550.degree. C. for 1.5 hours or
more; drawing at a reduction ratio of 3 or more; and annealing at
from 350.degree. C. to 500.degree. C. for 1.5 hours or more,
thereby obtaining a copper alloy wire having a conductivity of 40%
IACS or more and a tensile strength of 700 MPa or more.
9. A method for producing a high-strength,high-conductivity copper
alloy wire that is excellent in resistance to stress relaxation,
comprising: rough drawing the copper alloy according to claim 1 or
2, to form a wire rod; subjecting the wire rod to a solution
treatment; and drawing the wire rod at a reduction ratio of 7 or
more, thereby obtaining a copper alloy wire having a tensile
strength of 1,000 MPa or more and a conductivity of 20% IACS or
more.
10. A method for producing a high-strength, high-conductivity
copper alloy wire that is excellent in resistance to stress
relaxation, comprising: rough drawing the copper alloy according to
claim 1 or 2, to form a wire rod; subjecting the wire rod to a
solution treatment; drawing at a reduction ratio of 7 or more; and
annealing at a temperature of from 200.degree. C. to 400.degree. C.
for 1.5 hours or more, thereby obtaining a copper alloy wire having
a tensile strength of 1,000 MPa or more and a conductivity of 20%
IACS or more.
11. A method for producing a high-strength, high-conductivity
copper alloy wire that is excellent in resistance to stress
relaxation, comprising: rough drawing the copper alloy according to
claim 1 or 2, to form a wire rod; subjecting the wire rod to a
solution treatment; drawing at a reduction ratio of 3 or more;
aging at from 400.degree. C. to 600.degree. C. for 1.5 hours or
more; and drawing at a reduction ratio of from 0 to less than 3,
thereby obtaining a copper alloy wire having a conductivity of 40%
IACS or more and a tensile strength of 700 MPa or more.
12. A method for producing a high-strength, high-conductivity
copper alloy wire that is excellent in resistance to stress
relaxation, comprising: rough drawing the copper alloy according to
claim 1 or 2, to form a wire rod; subjecting the wire rod to a
solution treatment; drawing at a reduction ratio of from 0.7 to 4;
aging at from 400.degree. C. to 600.degree. C. for 1.5 hours or
more; and drawing at a reduction ratio of less than 6, thereby
obtaining a copper alloy wire having a tensile strength of from 900
to 1100 MPa and a conductivity of from 30% to 45% IACS.
13. A method for producing a high-strength, high-conductivity
copper alloy wire that is excellent in resistance to stress
relaxation, comprising: rough drawing the copper alloy according to
claim 1 or 2, to form a wire rod; subjecting the wire rod to a
solution treatment; drawing at a reduction ratio of from 0 to 4;
aging at from 400.degree. C. to 600.degree. C. for 1.5 hours or
more; repeating a set of steps (I) and (II) twice or more, in which
step (I) is a step of drawing at a reduction ratio of exceeding 0
and 4 or less, and step (II) after step (I) is a step of annealing
at a temperature lower than the first aging temperature in a range
of 300.degree. C. to 550.degree. C. for 1.5 hours or more; and
drawing at a reduction ratio of from 0 to 4, thereby obtaining a
copper alloy wire having a tensile strength of from 900 to 1100 MPa
and a conductivity of from 30% to 45% IACS.
14. A method for producing a high-strength, high-conductivity
copper alloy wire that is excellent in resistance to stress
relaxation, comprising: rough drawing the copper alloy according to
claim 1 or 2, to form a wire rod; subjecting the wire rod to a
solution treatment; and aging at from 400.degree. C. to 600.degree.
C. for 1.5 hours or more, thereby obtaining a copper alloy wire
having a tensile strength of from 700 to 1100 MPa and a
conductivity of from 20% to 50% IACS.
Description
TECHNICAL FIELD
[0001] The present invention relates to a high-strength,
high-conductivity copper alloy wire excellent in resistance to
stress relaxation, and to a method for producing the same.
BACKGROUND ART
[0002] Hitherto, a worked beryllium-copper alloy prepared by adding
beryllium to copper has exclusively been used for wire products
required to have high strength and high conductivity. On the other
hand, precipitation type alloys have been seldom used in the field
of wires.
[0003] However, the conventional wires, represented by wires using
beryllium copper alloy, have involved the following problems:
[0004] (1) Beryllium copper alloy is more expensive than alloys
such as phosphor bronze;
[0005] (2) Hygiene and safety problems for the workers may arise
with use of beryllium, a harmful substance;
[0006] (3) While phosphor bronze is used as a substitute for
beryllium copper alloy, both the conductivity and strength of the
former are low;
[0007] (4) The strength of a low-beryllium copper alloy (a
beryllium content of 1.0% by mass or less) is low; and
[0008] (5) While high-beryllium copper alloy (a beryllium content
of 1.5% by mass or more) has low conductivity and high strength,
the quality is too good for the recent service life of the
product.
DISCLOSURE OF INVENTION
[0009] The present invention resides in a high-strength,
high-conductivity copper alloy wire that is excellent in resistance
to stress relaxation, which comprises 1.0 to 4.5% by mass of Ni,
0.2 to 1.1% by mass of Si, 0.05 to 1.5% by mass of Sn, and less
than 0.005% (including zero) by mass of S, with the balance being
Cu and inevitable impurities, wherein the wire has a conductivity
of from 20% to 60% IACS, and a tensile strength of from 700 to
1,300 MPa.
[0010] Further, the present invention resides in a high-strength,
high-conductivity copper alloy wire that is excellent in resistance
to stress relaxation, which comprises 1.0 to 4.5% by mass of Ni,
0.2 to 1.1% by mass of Si, 0.05 to 1.5% by mass of Sn, 0.2 to 1.5%
by mass of Zn, and less than 0.005% (including zero) by mass of S,
with the balance being Cu and inevitable impurities, wherein the
wire has a conductivity of from 20% to 60% IACS, and a tensile
strength of from 700 to 1,300 MPa.
[0011] Further, the present invention resides in a high-strength,
high-conductivity copper alloy wire that is excellent in resistance
to stress relaxation, which comprises any one of the above stated
copper alloys which further contains at least one or plural
elements selected from the group consisting of 0.005 to 0.3% by
mass of Ag, 0.01 to 0.5% by mass of Mn, 0.01 to 0.2% by mass of Mg,
0.005 to 0.2% by mass of Fe, 0.005 to 0.2% by mass of Cr, 0.05 to
2% by mass of Co, and 0.005 to 0.1% by mass of P, in a total amount
of 0.005 to 2% by mass, wherein the wire has a conductivity of from
20% to 60% IACS, and a tensile strength of from 700 to 1,300
MPa.
[0012] Further, the present invention resides in a method for
producing a high-strength, high-conductivity copper alloy wire that
is excellent in resistance to stress relaxation, which comprises:
rough drawing a copper alloy, comprising 1.0 to 4.5% by mass of Ni,
0.2 to 1.1% by mass of Si, 0.05 to 1.5% by mass of Sn, and less
than 0.005% (including zero) by mass of S, with the balance being
Cu and inevitable impurities, to form a wire rod; subjecting the
wire rod to a solution treatment; and subjecting the wire rod to at
least one step selected from an aging treatment and drawing,
thereby obtaining a copper alloy wire having a conductivity of from
20% to 60% IACS and a tensile strength of from 700 to 1,300
MPa.
[0013] Further, the present invention resides in a method for
producing a high-strength, high-conductivity copper alloy wire that
is excellent in resistance to stress relaxation, which comprises:
rough drawing a copper alloy comprising 1.0 to 4.5% by mass of Ni,
0.2 to 1.1% by mass of Si, 0.05 to 1.5% by mass of Sn, 0.2 to 1.5%
by mass of Zn and less than 0.005% (including zero) by mass of S,
with the balance being Cu and inevitable impurities, to form a wire
rod; subjecting the wire rod to a solution treatment; and
subjecting the wire rod to at least one step selected from an aging
treatment and drawing, thereby obtaining a wire having a
conductivity of from 20% to 60% IACS and a tensile strength of from
700 to 1,300 MPa.
[0014] Besides, the present invention resides in a method for
producing a high-strength, high-conductivity copper alloy wire that
is excellent in resistance to stress relaxation, which comprises:
rough drawing any one of the above-mentioned copper alloys further
containing at least one or plural elements selected from the group
consisting of 0.005 to 0.3% by mass of Ag, 0.01 to 0.5% by mass of
Mn, 0.01 to 0.2% by mass of Mg, 0.005 to 0.2% by mass of Fe, 0.005
to 0.2% by mass of Cr, 0.05 to 2% by mass of Co, and 0.005 to 0.1%
by mass of P, in a total amount of 0.005 to 2% by mass, to form a
wire rod; subjecting the wire rod to a solution treatment; and
subjecting the wire rod to at least one step selected from an aging
treatment and drawing, thereby obtaining a copper alloy wire having
a conductivity of from 20% to 60% IACS and a tensile strength of
from 700 to 1,300 MPa.
[0015] Other and further features and advantages of the present
invention will appear more fully from the following
description.
BEST MODE FOR CARRYING OUT THE INVENTION
[0016] According to the present invention, there are provided the
following means:
[0017] (1) A high-strength, high-conductivity copper alloy wire
that is excellent in resistance to stress relaxation, comprising
1.0 to 4.5% by mass of Ni, 0.2 to 1.1% by mass of Si, 0.05 to 1.5%
by mass of Sn, and less than 0.005% (including zero) by mass of S,
with the balance being Cu and inevitable impurities, wherein the
wire has a conductivity of from 20% to 60% IACS, and a tensile
strength of from 700 to 1,300 MPa;
[0018] (2) A high-strength, high-conductivity copper alloy wire
that is excellent in resistance to stress relaxation, comprising
1.0 to 4.5% by mass of Ni, 0.2 to 1.1% by mass of Si, 0.05 to 1.5%
by mass of Sn, 0.2 to 1.5% by mass of Zn, and less than 0.005%
(including zero) by mass of S, with the balance being Cu and
inevitable impurities, wherein the wire has a conductivity of from
20% to 60% IACS, and a tensile strength of from 700 to 1,300
MPa;
[0019] (3) A high-strength, high-conductivity copper alloy wire
that is excellent in resistance to stress relaxation according to
(1) or (2), further containing at least one or plural elements
selected from the group consisting of 0.005 to 0.3% by mass of Ag,
0.01 to 0.5% by mass of Mn, 0.01 to 0.2% by mass of Mg, 0.005 to
0.2% by mass of Fe, 0.005 to 0.2% by mass of Cr, 0.05 to 2% by mass
of Co, and 0.005 to 0.1% by mass of P in a total amount of 0.005 to
2% by mass, wherein the wire has a conductivity of from 20% to 60%
IACS, and a tensile strength of from 700 to 1,300 MPa;
[0020] (4) A method for producing a high-strength,
high-conductivity copper alloy wire that is excellent in resistance
to stress relaxation, comprising: rough drawing a copper alloy
comprising 1.0 to 4.5% by mass of Ni, 0.2 to 1.1% by mass of Si,
0.05 to 1.5% by mass of Sn, and less than 0.005% (including zero)
by mass of S, with the balance being Cu and inevitable impurities,
to form a wire rod; subjecting the wire rod to a solution
treatment; and subjecting the wire rod to at least one step
selected from an aging treatment and drawing, thereby obtaining a
copper alloy wire having a conductivity of from 20% to 60% IACS and
a tensile strength of from 700 to 1,300 MPa;
[0021] (5) A method for producing a high-strength,
high-conductivity copper alloy wire that is excellent in resistance
to stress relaxation, comprising: rough drawing a copper alloy
comprising 1.0 to 4.5% by mass of Ni, 0.2 to 1.1% by mass of Si,
0.05 to 1.5% by mass of Sn, 0.2 to 1.5% by mass of Zn, and less
than 0.005% (including zero) by mass of S, with the balance being
Cu and inevitable impurities, to form a wire rod; subjecting the
wire rod to a solution treatment; and subjecting the wire rod to at
least one step selected from an aging treatment and drawing,
thereby obtaining a copper alloy wire having a conductivity of from
20% to 60% IACS and a tensile strength of from 700 to 1,300
MPa.
[0022] (6) A method for producing a high-strength,
high-conductivity copper alloy wire that is excellent in resistance
to stress relaxation, comprising: rough drawing the copper alloy
according to (1) or (2), further containing at least one or plural
elements selected from the group consisting of 0.005 to 0.3% by
mass of Ag, 0.01 to 0.5% by mass of Mn, 0.01 to 0.2% by mass of Mg,
0.005 to 0.2% by mass of Fe, 0.005 to 0.2% by mass of Cr, 0.05 to
2% by mass of Co, and 0.005 to 0.1% by mass of P in a total amount
of 0.005 to 2% by mass, to form a wire rod; subjecting the wire rod
to a solution treatment; and subjecting the wire rod to at least
one step selected from an aging treatment and drawing, thereby
obtaining a copper alloy wire having a conductivity of from 20% to
60% IACS and a tensile strength of from 700 to 1,300 MPa.
[0023] (7) A method for producing a high-strength,
high-conductivity copper alloy wire that is excellent in resistance
to stress relaxation, comprising: rough drawing the copper alloy
according to any one of (1) to (3), to form a wire rod; subjecting
the wire rod to a solution treatment; drawing the wire rod at a
reduction ratio of from 0 to 4, aging at from 400.degree. C. to
550.degree. C. for 1.5 hours or more, and drawing at a reduction
ratio of 3 or more, thereby obtaining a copper alloy wire having a
tensile strength of 1,000 MPa or more (generally 1,300 MPa or less)
and a conductivity of 20% IACS or more (generally 60% IACS or
less);
[0024] (8) A method for producing a high-strength,
high-conductivity copper alloy wire that is excellent in resistance
to stress relaxation, comprising: rough drawing the copper alloy
according to any one of (1) to (3), to form a wire rod; subjecting
the wire rod to a solution treatment; drawing the wire rod at a
reduction ratio of from 0 to 4; aging at from 400.degree. C. to
550.degree. C. for 1.5 hours or more; drawing at a reduction ratio
of 3 or more; and annealing at from 350.degree. C. to 500.degree.
C. for 1.5 hours or more, thereby obtaining a copper alloy wire
having a conductivity of 40% IACS or more (generally 60% IACS or
less) and a tensile strength of 700 MPa or more (generally 1,300
MPa or less);
[0025] (9) A method for producing a high-strength,
high-conductivity copper alloy wire that is excellent in resistance
to stress relaxation, comprising: rough drawing the copper alloy
according to any one of (1) to (3), to form a wire rod; subjecting
the wire rod to a solution treatment; and drawing the wire rod at a
reduction ratio of 7 or more, whereby obtaining a copper alloy wire
having a tensile strength of 1,000 MPa or more (generally 1,300 MPa
or less) and a conductivity of 20% IACS or more (generally 60% IACS
or less);
[0026] (10) A method for producing a high-strength,
high-conductivity copper alloy wire that is excellent in resistance
to stress relaxation, comprising: rough drawing the copper alloy
according to any one of (1) to (3), to form a wire rod; subjecting
the wire rod to a solution treatment; drawing at a reduction ratio
of 7 or more; and annealing at such a temperature of from
200.degree. C. to 400.degree. C. as not to deteriorate the tensile
strength for 1.5 hours or more, thereby obtaining a copper alloy
wire having a tensile strength of 1,000 MPa or more (generally
1,300 MPa or less) and a conductivity of 20% IACS or more
(generally 60% IACS or less);
[0027] (11) A method for producing a high-strength,
high-conductivity copper alloy wire that is excellent in resistance
to stress relaxation, comprising: rough drawing the copper alloy
according to any one of (1) to (3), to form a wire rod; subjecting
the wire rod to a solution treatment; drawing at a reduction ratio
of 3 or more; aging at from 400.degree. C. to 600.degree. C. for
1.5 hours or more; and drawing at a reduction ratio of from 0 to
less than 3, thereby obtaining a copper alloy wire having a
conductivity of 40% IACS or more (generally 60% IACS or less) and a
tensile strength of 700 MPa or more (generally 1,300 MPa or
less);
[0028] (12) A method for producing a high-strength,
high-conductivity copper alloy wire that is excellent in resistance
to stress relaxation, comprising: rough drawing the copper alloy
according to any one of (1) to (3), to form a wire rod; subjecting
the wire rod to a solution treatment; drawing at a reduction ratio
of from 0.7 to 4; aging at from 400.degree. C. to 600.degree. C.
for 1.5 hours or more; and drawing at a reduction ratio of less
than 6, thereby obtaining a copper alloy wire having a tensile
strength of from 900 to 1100 MPa and a conductivity of from 30% to
45% IACS;
[0029] (13) A method for producing a high-strength,
high-conductivity copper alloy wire that is excellent in resistance
to stress relaxation, comprising: rough drawing the copper alloy
according to any one of (1) to (3), to form a wire rod; subjecting
the wire rod to a solution treatment; drawing at a reduction ratio
of from 0 to 4; aging at from 400.degree. C. to 600.degree. C. for
1.5 hours or more; and then repeating a set of steps (I) and (II)
twice or more, in which step (I) is a step of drawing at a
reduction ratio of exceeding 0 and 4 or less, and step (II) after
step (I) is a step of annealing at a temperature lower than the
first aging temperature in a range of 300.degree. C. to 550.degree.
C. for 1.5 hours or more; and drawing at a reduction ratio of from
0 to 4, thereby obtaining a copper alloy wire having a tensile
strength of from 900 to 1100 MPa and a conductivity of from 30% to
45% IACS; and
[0030] (14) A method for producing a high-strength,
high-conductivity copper alloy wire that is excellent in resistance
to stress relaxation, comprising: rough drawing the copper alloy
according to any one of (1) to (3), to form a wire rod; subjecting
the wire rod to a solution treatment; and aging at from 400.degree.
C. to 600.degree. C. for 1.5 hours or more, thereby obtaining a
copper alloy wire having a tensile strength of from 700 to 1100 MPa
and a conductivity of from 20% to 50% IACS.
[0031] The present invention will be described below in more
detail.
[0032] Each component contained in a high-strength, high
conductivity alloy wire of the present invention used for parts of
electronic and electric machinery and tools will be explained at
first.
[0033] It is known in the art that adding Ni and Si to Cu increases
strength and electric conductivity of the alloy owing to
precipitation of a Ni-Si compound (a Ni.sub.2Si phase) in the Cu
matrix.
[0034] A desired mechanical strength cannot be obtained when the
content of Ni is less than 1.0% by mass due to a small amount of
the precipitates. When the content of added Ni exceeds 4.5% by
mass, on the contrary, precipitates that would not contribute to
increase of strength are generated during casting and heat
treatment (for example a solution treatment, an aging treatment and
an annealing treatment) and cause not only failure in obtaining the
strength comparable to the amount of the addition, but also adverse
effect on drawing property and bending property.
[0035] Regarding the content of Si, the most proper amount of
addition of Si is determined by determining the amount of addition
of Ni, since the precipitation of the compound of Ni and Si is
considered to mainly comprise the Ni.sub.2Si phase. A sufficient
strength cannot be obtained when the content of Si is less than
0.2% by mass, as when the content of Ni is small. On the contrary,
the same problem as when the content of Ni is large arises when the
content of Si exceeds 1.1% by mass.
[0036] The content of Ni is adjusted to be preferably 1.7 to 4.5%
by mass, more preferably 2.0 to 4.0% by mass, and the content of Si
is adjusted to be preferably 0.4 to 1.1% by mass, more preferably
0.45 to 1.0% by mass.
[0037] Sn and Zn are crucial added elements for constituting the
present invention. A good balance of characteristics is attained by
a mutual interaction of these elements.
[0038] Sn improves resistance to stress relaxation as well as
drawing property. Such improving effects cannot be manifested when
the content of Sn is less than 0.05% by mass, while electric
conductivity decreases by adding more than 1.5% by mass of Sn.
[0039] Zn is able to improve bending property. Zn is preferably
added in a proportion of 0.2% by mass or more, since Zn can improve
resistance to peeling under heat of Sn plating and solder plating,
and resistance to migration. On the other hand, adding more than
1.5% by mass of Zn is not preferable considering the electric
conductivity.
[0040] The content of Sn is preferably 0.05 to 1.0% by mass, more
preferably 0.1 to 0.5% by mass, while the content of Zn is
preferably 0.2 to 1.0% by mass, more preferably 0.4 to 0.6% by
mass, in the present invention.
[0041] S is an element that makes hot workability to be
deteriorated, and the content thereof is restricted to be less than
0.005% by mass. It is particularly preferable to restrict the
content of S in the range of 0 to less than 0.002% by mass.
[0042] The reasons for restricting the contents of Ag, Mn, Mg, Fe,
Cr, Co and P in the case where these elements are contained will be
described hereinafter. Ag, Mn, Mg, Fe, Cr, Co and P have similar
functions with each other with respect to improving formability.
The total content of one or plural elements selected from Ag, Mn,
Mg, Fe, Cr, Co and P, if any, is 0.005 to 2% by mass, preferably
0.03 to 1.5% by mass.
[0043] Ag improves heat resistance and strength while improving
bending property by preventing crystal grains from being coarse.
The effect cannot be fully attained at a content of Ag of less than
0.005% by mass, while adding an amount of exceeding 0.3% by mass
increases the production cost, although the amount does not
adversely affect the characteristics. From these view points, the
content of Ag, if any, is 0.005% to 0.3% by mass, preferably 0.01
to 0.2% by mass.
[0044] Mn is effective for increasing the strength while improving
hot workability. A content of Mn of less than 0.01% by mass gives
only a small effect, while a content of exceeding 0.5% by mass not
only gives no effect comparable to the amount of addition but also
deteriorates the electric conductivity. Accordingly, the content of
Mn, if any, is 0.01 to 0.5% by mass, preferably 0.1 to 0.35% by
mass.
[0045] Although Mg improves resistance to stress relaxation,
bending property is adversely affected by Mg. The content of Mg is
desirably 0.01% by mass or more from the view point of resistance
to stress relaxation, and the larger the content is better. On the
contrary, good bending property is difficult to be obtained when
the content exceeds 0.2% by mass with respect to improvement of
bending property. Accordingly, the content of Mg, if any, is 0.01
to 0.2% by mass, preferably 0.05 to 0.15% by mass.
[0046] Fe and Cr combine with Si to form a Fe--Si compound and
Cr--Si compound, which increase the strength. The elements trap Si
remaining in the copper matrix without forming a compound with Ni,
thereby being effective for improving the electric conductivity.
Since the Fe--Si compound and Cr--Si compound have a low
precipitation hardening ability, it is not advantageous to form a
large amount of these compounds.
[0047] Bending property becomes deteriorated when the contents of
Fe or Cr exceeds 0.2% by mass. Accordingly, the contents of Fe and
Cr, if any, are 0.005 to 0.2% by mass, preferably 0.03 to 0.15% by
mass, respectively.
[0048] Co forms a compound with Si, as Ni does, to improve the is
more expensive than Ni, Cu--Co--Si series alloys and Cu--Ni--Co--Si
series alloys may be selected in the present invention if they are
acceptable considering the cost. The strength and electric
conductivity of the Cu--Co--Si series alloys are improved by aging
precipitation and slightly better than those of the Cu--Ni--Si
series alloys. Accordingly, the former alloys are effective in the
members in which thermal conductivity and electric conductivity are
important. Since the Co--Si compound has a slightly higher
precipitation hardening ability, resistance to stress relaxation
also tends to be a little improved. Accordingly, the content of Co,
if any, is 0.05 to 2% by mass, preferably 0.08 to 1.5% by mass.
[0049] Phosphor (P) has an effect for increasing the strength while
improving the electric conductivity. A large content of P decreases
bending property owing to enhanced grain boundary precipitation.
Accordingly, the content of P, if any, is preferably 0.005 to 0.1%
by mass, more preferably 0.01 to 0.05% by mass.
[0050] While the amount of addition of at least two of these
elements above at the same time may be appropriately determined
depending on the required characteristics, the total content of
them was determined to be 0.005 to 2.0% by mass, considering heat
resistance, resistance to peeling under heat of the Sn plating,
resistance to peeling under heat of the solder plating and electric
conductivity.
[0051] In the present invention, other elements, for example, B,
Ti, Zr, V, Al, Pb and Bi, may be added in such a total content of
generally 0.01 to 0.5% by mass, and preferably 0.01 to 0.3% by
mass, as basic characteristics such as mechanical strength and
electric conductivity are not deteriorated. For example, since B is
effective for suppressing crystal grains from being coarsened
thereby for improving the strength, the element is effectively
added in an amount of 0.005 to 0.1% by mass to such an extent as
not to decrease the electric conductivity. Ti, Zr, V, Al, Pb and Bi
may be contained, as the content of each element, generally in the
range of 0.005 to 0.15% by mass, preferably in the range of 0.005
to 0.1% by mass. When the contents of Pb and Bi are too large, for
example, the copper alloy wire obtained may be poor in bending
property.
[0052] The balance of the components described above is comprised
of Cu and inevitable impurities, in the copper alloys for use in
the present invention.
[0053] The following composition ranges are examples of the
preferable composition ranges of the copper alloys used for the
wire of the present invention.
[0054] The first example of the composition of the copper alloy
comprises 1.0 to 3.0% by mass of Ni, 0.2 to 0.7% by mass of Si,
0.05 to 1.5% by mass of Sn, and less than 0.005% (including zero)
by mass of S, with the balance being Cu and inevitable impurities.
More preferably, the copper alloy comprises 1.8 to 3.0% by mass of
Ni, 0.4 to 0.7% by mass of Si, 0.1 to 0.35% by mass of Sn, and less
than 0.005% (including zero) by mass of S, with the balance being
Cu and inevitable impurities. Further preferably, the copper alloy
comprises 2.2 to 2.4% by mass of Ni, 0.52 to 0.57% by mass of Si,
0.12 to 0.26% by mass of Sn, and less than 0.005% (including zero)
by mass of S, with the balance being Cu and inevitable
impurities.
[0055] The second example of the composition of the copper alloy
comprises 1.0 to 3.0% by mass of Ni, 0.2 to 0.7% by mass of Si,
0.05 to 1.5% by mass of Sn, 0.2 to 1.5% by mass of Zn, and less
than 0.005% (including zero) by mass of S, with the balance being
Cu and inevitable impurities. More preferably, the copper alloy
comprises 1.8 to 3.0% by mass of Ni, 0.4 to 0.7% by mass of Si, 0.1
to 0.35% by mass of Sn, 0.3 to 0.8% by mass of Zn, and less than
0.005% (including zero) by mass of S, with the balance being Cu and
inevitable impurities. Further preferably, the copper alloy
comprises 2.2 to 2.4% by mass of Ni, 0.52 to 0.57% by mass of Si,
0.12 to 0.26% by mass of Sn, 0.45 to 0.55% by mass of Zn, and less
than 0.005% (including zero) by mass of S, with the balance being
Cu and inevitable impurities.
[0056] The third example of the composition of the copper alloy
comprises 1.0 to 3.0% by mass of Ni, 0.2 to 0.7% by mass of Si,
0.05 to 1.5% by mass of Sn, 0.2 to 1.5% by mass of Zn, 0.01 to 0.2%
by mass of Mg, and less than 0.005% (including zero) by mass of S,
with the balance being Cu and inevitable impurities. More
preferably, the copper alloy comprises 1.8 to 3.0% by mass of Ni,
0.4 to 0.7% by mass of Si, 0.1 to 0.35% by mass of Sn, 0.3 to 0.8%
by mass of Zn, 0.05 to 0.17% by mass of Mg, and less than 0.005%
(including zero) by mass of S, with the balance being Cu and
inevitable impurities. Further preferably, the copper alloy
comprises 2.2 to 2.4% by mass of Ni, 0.52 to 0.57% by mass of Si,
0.12 to 0.26% by mass of Sn, 0.45 to 0.55% by mass of Zn, 0.08 to
0.16% by mass of Mg, and less than 0.005% (including zero) by mass
of S, with the balance being Cu and inevitable impurities.
[0057] The fourth example of the composition of the copper alloy
comprises 3.0 to 4.5% by mass of Ni, 0.7 to 1.1% by mass of Si,
0.05 to 1.5% by mass of Sn, and less than 0.005% (including zero)
by mass of S, with the balance being Cu and inevitable impurities.
More preferably, the copper alloy comprises 3.5 to 4.0% by mass of
Ni, 0.8 to 1.0% by mass of Si, 0.1 to 0.35% by mass of Sn, and less
than 0.005% (including zero) by mass of S, with the balance being
Cu and inevitable impurities. Further preferably, the copper alloy
comprises 3.6 to 3.9% by mass of Ni, 0.85 to 0.95% by mass of Si,
0.12 to 0.26% by mass of Sn, and less than 0.005% (including zero)
by mass of S, with the balance being Cu and inevitable
impurities.
[0058] The fifth example of the composition of the copper alloy
comprises 3.0 to 4.5% by mass of Ni, 0.7 to 1.1% by mass of Si,
0.05 to 1.5% by mass of Sn, 0.2 to 1.5% by mass of Zn, and less
than 0.005% (including zero) by mass of S, with the balance being
Cu and inevitable impurities. More preferably, the copper alloy
comprises 3.5 to 4.0% by mass of Ni, 0.8 to 1.0% by mass of Si, 0.1
to 0.35% by mass of Sn, 0.3 to 0.8% by mass of Zn, and less than
0.005% (including zero) by mass of S, with the balance being Cu and
inevitable impurities. Further preferably, the copper alloy
comprises 3.6 to 3.9% by mass of Ni, 0.85 to 0.95% by mass of Si,
0.12 to 0.26% by mass of Sn, 0.45 to 0.55% by mass of Zn, and less
than 0.005% (including zero) by mass of S, with the balance being
Cu and inevitable impurities.
[0059] The sixth example of the composition of the copper alloy
comprises 3.0 to 4.5% by mass of Ni, 0.7 to 1.1% by mass of Si,
0.05 to 1.5% by mass of Sn, 0.2 to 1.5% by mass of Zn, 0.01 to 0.2%
by mass of Mg, and less than 0.005% (including zero) by mass of S,
with the balance being Cu and inevitable impurities. More
preferably, the copper alloy comprises 3.5 to 4.0% by mass of Ni,
0.8 to 1.0% by mass of Si, 0.1 to 0.35% by mass of Sn, 0.3 to 0.8%
by mass of Zn, 0.05 to 0.17% by mass of Mg, and less than 0.005%
(including zero) by mass of S, with the balance being Cu and
inevitable impurities. Further preferably, the copper alloy
comprises 3.6 to 3.9% by mass of Ni, 0.85 to 0.95% by mass of Si,
0.12 to 0.26% by mass of Sn, 0.45 to 0.55% by mass of Zn, 0.08 to
0.16% by mass of Mg, and less than 0.005% (including zero) by mass
of S, with the balance being Cu and inevitable impurities.
[0060] While the method for producing the copper alloy wire used in
the present invention is not particularly restricted, examples of
the method include the following processes after rough drawing to
form the copper alloy into wire rods:
[0061] Solution treatment.fwdarw.aging treatment
[0062] Solution treatment.fwdarw.aging treatment.fwdarw.drawing
[0063] Solution treatment.fwdarw.drawing
[0064] Solution treatment.fwdarw.drawing aging.fwdarw.treatment
[0065] Solution treatment.fwdarw.drawing
aging.fwdarw.treatment.fwdarw.dra- wing
[0066] The wire produced by any of the processes above may be
subjected to an annealing treatment for improving the electric
conductivity.
[0067] The process for rough drawing to form the wire rod of the
copper alloy comprises casting into a billet, forming an extrusion
rod by a hot extrusion press, and rough drawing to form a wire rod
by wire-drawing and the like. Of course, a further drawing may not
always be required at the later steps provided that the diameter of
the wire rod roughly drawn is fitted to the final diameter of the
desired wire.
[0068] For the solution treatment, the wire rod formed by rough
drawing is maintained preferably at from 700 to 950.degree. C. for
10 minutes or more, more preferably at from 800.degree. C. to
950.degree. C. for from 10 minutes to 180 minutes, and further
preferably at from 850 to 950.degree. C. for from 10 minutes to 120
minutes. For the aging treatment, the wire rod is maintained
preferably at from 350 to 600.degree. C. for from 1.5 hours to 10
hours, more preferably at from 400.degree. C. to 600.degree. C. for
from 2 hours to 8 hours, and further preferably at from 450 to
600.degree. C. for from 2 hours to 6 hours. By the aging treatment,
precipitation of intermetallic compounds is enhanced, to improve
the electric conductivity and the strength. Drawing (or wire
drawing) means that the wire rod obtained by rough drawing is drawn
into a wire having a desired diameter. Wire drawing is preferably
applied at room temperature with a reduction ratio (.eta.) of from
0 to 10. The reduction ratio is defined by a value calculated from
.eta.=ln (S.sub.0/S), where S.sub.0 is a cross sectional area of
the cross section when the wire before wire drawing is cut in the
direction vertical to the direction of drawing the wire, and S is a
cross sectional area after wire drawing. The reduction ratio
(.eta.) of zero at a step means that no drawing of the wire is
applied at the step.
[0069] The process for forming plate (or bar) materials cannot be
directly employed in the process for producing the wire of the
present invention. While the plate material is worked at most with
a reduction ratio of up to about 3 by rolling, the wire material
should be readily worked with a reduction ratio of 3 or more by
drawing. Increment of the strength of the wire material is larger
being compared with the plate (or bar) materials, since the wire
material is generally worked with the higher degree of reduction
ratio. Further, even in the production of the wires with a low
degree of reduction ratio, the relationship between the temperature
in the aging treatment and characteristics (strength, electric
conductivity and the like) is different from that in the production
of the plate materials.
[0070] Generally, the wire material is subjected to drawing in the
production process of the wire according to the present invention,
although in some cases no drawing is applied after a solution
treatment depending on a composition of a copper alloy or a heat
treatment step. Applying the drawing tend to increase the strength
of the wire obtained, and to decrease the resistance to stress
relaxation. The present invention resolves these problems peculiar
to the wire production and provides the wires with desired strength
and resistance to stress relaxation.
[0071] The wire of the present invention is excellent in drawing
property. Drawing property as used herein refers to property
(formability) for re-drawing a given wire, wherein break of the
wire seldom occurs and wear of a drawing dies is little during
re-drawing. Drawing property is evaluated, for example, by counting
the number of incidence of break of wire when a material having a
given length (or a given mass) is subjected to drawing. Regarding
wear of drawing dies, there is such a method as wear of drawing die
is evaluated, for example, by measuring the diameters of the wire
at the start of drawing and after completing drawing, when a
material having a given length (or a given mass) is subjected to
drawing.
[0072] Next, preferable methods for producing the high strength,
high-conductivity copper alloy wire of the present invention used
for electronic and electrical machinery and tools will be described
hereinafter.
[0073] The inventors have performed experiments by variously
changing the combinations among the solution treatment, aging
treatment and drawing conditions. Consequently, it was found that
the precipitation behaviors of the Cu--Ni--Si compound that is
responsible for increasing the strength and electric conductivity
are influenced by the reduction ratio or the like in the processing
steps of the wire.
[0074] In the production process of the copper alloy wire of the
present invention, the wire is subjected to a finishing drawing
wherein the wire is finished to a desired diameter, for example,
after aging following the solution treatment, or after aging
following drawing after the solution treatment.
[0075] The methods for obtaining an especially high strength wire
will be described below.
[0076] <The Methods Described in Items (7) and (8) Above>
[0077] With respect to the increment of the strength by both work
hardening in the intermediate drawing and precipitation hardening
in the aging treatment, the degree of increment of the strength by
the aging treatment is small when the reduction ratio exceeding 4
is applied in the intermediate drawing, and further, the wire is
softened by the aging treatment when the reduction ratio in the
intermediate drawing is too high. Accordingly, the reduction ratio
in the intermediate drawing is defined to be from 0 to 4,
preferably from 0.5 to 3. On the other hand, a wire material having
mechanical strength of as high as 1,000 MPa or more can be hardly
obtained when the reduction ratio in the final finish drawing is
less than 3. Accordingly, the reduction ratio in the finish drawing
is determined to be 3 or more, preferably from 4 to 10.
[0078] Then, by an annealing treatment, the electric conductivity,
bending property and resistance to stress relaxation can be
improved. The annealing treatment is applied at from 350.degree. C.
to 500 .degree. C. for 1.5 hours or more, preferably at from
400.degree. C. to 500.degree. C. for from 2 hours to 8 hours.
[0079] <The Methods Described in Items (9) and (10)
Above>
[0080] Although the strength is also increased by drawing without
applying the aging treatment after the solution treatment, a
sufficient strength cannot be obtained at a reduction ratio of less
than 7. Accordingly, the reduction ratio is determined to be 7 or
more, preferably from 8.5 to 10.
[0081] The electric conductivity, bending property and resistance
to stress relaxation can be improved by applying an annealing
treatment to the extent that the tensile strength does not
decrease. The wire is annealed at from 200.degree. C. to
400.degree. C. for 1.5 hours or more, preferably at from
250.degree. C. to 350.degree. C. for from 2 hours to 8 hours.
[0082] The methods for obtaining a higher conductivity wire will be
described below.
[0083] <The Methods Described in Item (11) Above>
[0084] The rate of increment of the electric conductivity after the
aging treatment is increased more as the reduction ratio in the
intermediate drawing is higher, when the aging treatment is applied
after applying the intermediate drawing after the solution
treatment. On the other hand, the electric conductivity is more
decreased as the reduction ratio in the finish drawing is higher,
when the wire is subjected to a finishing drawing after the aging
treatment. Therefore, it is preferable that the reduction ratio in
the intermediate drawing is made larger and the reduction ratio in
the finish drawing is made to be as small as possible, or the
finish drawing is not applied at all, for obtaining a wire having a
higher electric conductivity. Accordingly, the reduction ratio
after the solution treatment (in the intermediate drawing) is
determined to be 3 or more, preferably from 4 to 10, and the
reduction ratio after the aging treatment (in the finish drawing)
is determined to be from 0 to less than 3, preferably from 0.5 to
2. The above aging treatment is applied at from 400.degree. C. to
600.degree. C. for 1.5 hours or more, preferably at from
450.degree. C. to 550.degree. C. for from 2 hours to 8 hours.
[0085] The methods for obtaining a wire in good balance between the
mechanical strength and electric conductivity will be described
below.
[0086] <The Methods Described in Item (12) Above>
[0087] A fine balance between the reduction ratio in the
intermediate drawing and the reduction ratio in the finish drawing
is necessary for obtaining the wire in good balance between the
strength and the electric conductivity. When the reduction ratio in
the intermediate drawing is less than 0.7, a sufficient improvement
of the conductivity cannot be attained in the succeeding aging
treatment and the electric conductivity rather decreases in the
finish drawing after the aging treatment. When the reduction ratio
in the intermediate drawing exceeds 4, the electric conductivity is
largely improved in the aging treatment, however, the age hardening
is not manifested on the strength, and the wire is rather softened.
In this case, if the wire is subjected to a drawing with a high
degree of reduction ratio in the finish drawing step after the
aging treatment in order to compensate the strength decreased owing
to softening, the electric conductivity is decreased. Accordingly,
the reduction ratio in the intermediate drawing between the
solution treatment and the aging treatment is from 0.7 to 4,
preferably from 1 to 3. The reduction ratio in the finish drawing
is defined to be less than 6, preferably from 0.5 to 5, because,
when the reduction ratio is 6 or more, the conductivity is
decreased to less than 30% IACS by applying a drawing. The above
aging treatment is preferably applied at from 400.degree. C. to
600.degree. C. for 1.5 hours or more, more preferably at from
450.degree. C. to 550.degree. C. for from 2 to 8 hours.
[0088] <The Methods Described in Item (13) Above>
[0089] In another method, the wire is finished to a desired
diameter by allowing the strength and electric conductivity to
gradually increase by repeating a sequence of a drawing, an aging
treatment and an annealing treatment after the solution treatment.
The reduction ratio in the drawing between the respective heat
treatments is defined to be more than 0 and 4 or less, preferably
from 0.5 to 3, because the electric conductivity is decreased too
low when the reduction ratio exceeds 4 that a sufficient electric
conductivity cannot be attained in the succeeding aging treatment
or the annealing treatment. The temperatures in the annealing
treatment applied in the next step and thereafter are made to be
lower than the temperature in the first aging treatment, since,
when the temperature of the annealing treatment in the next step is
higher than the temperature in the first aging treatment, the
precipitates formed in the former step is dissolved again as a
solid solution, and the effect of the aging treatment in the former
step is canceled. The aging treatment as the first heat treatment
is preferably applied at a temperature of from 400.degree. C. to
600.degree. C. for 1.5 hours or more, more preferably at from
450.degree. C. to 550.degree. C. for from 2 hours to 8 hours in the
heat treatment after the solution treatment. The annealing
treatment as a second heat treatment and thereafter is preferably
applied at from 300.degree. C. to 550.degree. C. (more preferably
at from 300.degree. C. to 500.degree. C.), and at a temperature
lower than the first aging temperature for 1.5 hours or more (more
preferably from 2 to 8 hours).
[0090] Repeating the drawing and the annealing twice or more in
this method, for example,
[0091] solution treatment.fwdarw.drawing.fwdarw.aging
treatment.fwdarw.(drawing.fwdarw.annealing).sub.n.fwdarw.finish
drawing
[0092] (n is an integer of 2 or more),
[0093] means that at least twice annealing treatments are
applied.
[0094] The annealing treatment may be the final treatment by
omitting the finish drawing.
[0095] <The Methods Described in Item (14) Above>
[0096] In still another method, the wire is finished to a desired
diameter by rough drawing to form a wire rod before the solution
treatment and then applied with both the solution treatment and the
aging treatment. The aging treatment above is applied at from
400.degree. C. to 600.degree. C. for 1.5 hours or more, preferably
at from 450.degree. C. to 550.degree. C. for from 2 to 8 hours.
[0097] It is also preferable to apply plating on the copper alloy
wire for the electronic and electric machinery and tools of the
present invention. The plating method is not particularly
restricted, and conventionally used methods may be employed.
[0098] While the diameter of the copper alloy wire of the present
invention is not particularly restricted, and is appropriately
determined depending on the uses, it is preferably 10 .mu.m or
more, more preferably from 50 .mu.m to 5 mm.
[0099] The copper alloy wire of the present invention is excellent
in the strength, the electric conductivity and the resistance to
stress relaxation.
[0100] Further, the copper alloy wire of the present invention is
excellent in bending property, straightness and roundness as well
as platability by, for example, gold plating. The copper alloy wire
of the present invention is also excellent in drawing property when
the wire is subjected to an additional drawing.
[0101] Furthermore, since the copper alloy wire of the present
invention requires no beryllium at all, drawbacks of the wire made
of beryllium copper alloy are conquered to afford excellent
advantages that the wire could be manufactured with low cost and
with high safety in the production process.
[0102] According to the method of the present invention, the copper
alloy wire having these excellent characteristics and properties
can be safely produced with low production costs.
EXAMPLES
[0103] The present invention is described in more detail with
reference to the following examples, but the present invention is
not meant to be limited to these examples.
[0104] Billets were produced by melting and casting the alloys
having the compositions, as shown in Table 1, in a high-frequency
furnace. The billets were subjected to hot extrusion, followed by
cold (wire drawing) working, to produce wire rods with a diameter
of 15 mm. These wire rods were subjected to solution treatment (at
900.degree. C. for 90 minutes), and then drawing with a reduction
ratio .eta. of 0.7, to obtain wires with a diameter of 0.5 mm.
These wires were subjected to aging treatment at 500.degree. C. for
2 hours in an inert gas atmosphere, and then drawing at a reduction
ratio .eta. of 2.3, to produce wires with a diameter of 0.15 mm.
The wires thus obtained were evaluated with respect to various
characteristics.
[0105] The tensile strength was measured according to JIS Z2241,
and the electric conductivity was measured according to JIS
H0505.
[0106] For evaluating repeated bending property, a weight was hung
at the end of the test wire so as to give a load of 230 g, the wire
was repeatedly bent to 90.degree., and the number of bending before
break of the wire was counted. One reciprocating bending was
counted as one time of bending, and the number of bending before
breakage was averaged for five wires for each testing condition.
The wire capable of five times or more of bending before breakage
is evaluated as successful.
[0107] For evaluating bending property, the wire was subjected to
closely contact bending, wherein the wire was bent to 180.degree.
toward the inside with an inner radius of curvature of 0 mm. The
evaluation indices are the following ranks:
[0108] A: excellent with no wrinkles;
[0109] B: tiny wrinkles are observed;
[0110] C: while large wrinkles are observed, no cracks are
generated yet;
[0111] D: fine cracks are observed; and
[0112] E: cracks are obviously observed.
[0113] The evaluation ranks A, B and C are judged to be levels of
no practical problems, and the evaluation ranks D and E are judged
to be problematic level.
[0114] Resistance to stress relaxation was measured by an open
sided block method according to the Standard of the Electronic
Materials Manufacturers Association of Japan (EMAS-3003). The load
stress was set so that the maximum surface stress would be 80% of
the proof stress, and the stress relaxation ratio (SRR) was
determined by holding the sample in a constant temperature chamber
at 150.degree. C. for 1,000 hours.
[0115] Results are shown in Table 2.
1 TABLE 1 Alloy Alloy composition (mass %) No. Ni Si Sn S Zn Others
Cu Examples 1 1.2 0.28 0.17 0.001 Balance according to 2 2.2 0.52
0.21 0.002 Balance this invention 3 3.5 0.86 0.13 0.003 Balance 4
4.2 1.03 0.33 0.002 Balance 5 2.3 0.50 0.08 0.001 Balance 6 2.5
0.55 1.21 0.004 Balance 7 3.6 0.88 0.11 0.001 Balance 8 3.8 0.90
1.32 0.003 Balance 9 1.9 0.47 0.22 0.002 0.18Ag Balance 10 3.3 0.77
0.10 0.001 0.22Ag Balance 11 2.0 0.50 0.33 0.002 0.23Mn Balance 12
3.9 0.90 0.38 0.003 0.32Mn Balance 13 2.5 0.61 0.25 0.002 0.15Mg
Balance 14 4.0 0.95 0.10 0.001 0.21Mn, 0.11Fe Balance 15 3.8 0.88
0.20 0.001 0.05Fe, 0.15Cr Balance 16 2.4 0.80 0.23 0.002 0.10Ag,
1.05Co Balance 17 2.7 0.65 0.18 0.003 0.05P Balance 18 3.0 0.68
0.27 0.001 0.19Mg, 0.05Pb Balance 19 2.4 0.52 0.17 0.002 0.26
Balance 20 2.2 0.54 0.21 0.004 1.32 Balance 21 3.6 0.85 0.15 0.001
0.37 Balance 22 3.8 0.89 0.12 0.002 1.26 Balance 23 2.2 0.55 0.23
0.002 0.60 0.24Ag Balance 24 3.7 0.90 0.15 0.001 0.49 0.13Ag
Balance 25 2.1 0.42 0.16 0.001 0.48 0.10Mn Balance 26 2.4 0.56 0.18
0.003 0.58 0.47Mn Balance 27 3.5 0.86 0.19 0.002 0.57 0.12Mn
Balance 28 3.2 0.73 0.21 0.003 0.60 0.40Mn Balance 29 2.3 0.56 0.17
0.001 0.52 0.09Mg Balance 30 3.8 0.91 0.15 0.002 0.49 0.12Mg
Balance 31 2.6 0.45 0.22 0.002 0.32 0.12Fe Balance 32 2.4 0.53 0.24
0.001 0.43 0.26Mn, 0.14Fe Balance 33 3.3 0.78 0.18 0.001 0.42
0.08Cr, 0.03B Balance 34 2.3 0.77 0.15 0.001 0.68 1.20Co Balance 35
2.8 0.65 0.13 0.004 0.62 0.04P Balance 36 2.1 0.45 0.18 0.002 0.32
0.02Ag, 0.07Pb Balance 37 3.5 0.86 0.17 0.003 0.52 0.23Mn, 0.02Bi
Balance Comparative 38 0.5 0.24 0.16 0.001 Balance example 39 5.2
0.92 0.17 0.001 Balance 40 1.2 0.11 0.13 0.002 Balance 41 3.9 1.93
0.18 0.004 Balance 42 3.2 0.65 0.02 0.002 Balance 43 3.4 0.72 2.40
0.003 Balance 44 2.5 0.62 0.21 0.15 Balance 45 3.0 0.80 0.13 0.001
2.31 Balance 46 3.2 0.66 0.19 0.002 0.62 1.13Mn Balance 47 2.6 0.61
0.15 0.001 0.46 1.02Mg Balance 48 2.5 0.48 0.20 0.003 0.30 0.56Fe
Balance 49 3.1 0.68 0.16 0.002 0.45 0.45Cr Balance 50 2.6 0.54 0.16
0.003 0.45 0.49P Balance Conventional 51 Cu--1.8 mass % Ni--0.3
mass % Be example 52 Cu--1.9 mass % Be--0.25 mass % Co
[0116]
2TABLE 2 Repeated Resistance to Tensile Electric bending stress
strength conductivity property Bending relaxation Alloy No. (MPa)
(% IACS) (times) property (%) Examples 1 815 38.2 11.4 A 21
according to 2 1032 34.6 9.8 B 18 this invention 3 1100 25.4 10.4 B
10 4 1135 21.2 8.2 C 11 5 1035 37.9 9.2 B 19 6 1043 33.1 8.8 B 10 7
1095 27.3 8.2 B 21 8 1089 20.7 7.6 B 10 9 1028 35.8 8.2 A 20 10
1112 37.0 10.0 A 11 11 1046 32.3 8.2 B 17 12 1125 20.4 7.6 B 10 13
1046 33.2 8.4 C 12 14 1124 23.3 8.2 C 10 15 1087 28.4 8.2 C 15 16
1113 35.1 7.6 B 12 17 1062 36.0 8.4 B 18 18 1069 25.3 8.8 C 9 19
1039 32.2 10.2 A 17 20 1036 29.8 10.0 A 18 21 1099 25.2 10.0 B 11
22 1090 22.4 9.8 A 12 23 1052 34.0 9.2 A 16 24 1121 23.5 8.6 A 16
25 1043 30.6 9.6 A 18 26 1051 28.3 9.4 A 19 27 1111 22.4 10.2 A 10
28 1117 21.4 96.0 B 12 29 1054 32.5 8.2 B 14 30 1104 26.2 7.2 B 8
31 1044 33.2 8.4 B 18 32 1062 30.8 6.8 C 16 33 1100 26.3 7.2 B 12
34 1082 25.6 8.4 A 12 35 1060 28.7 8.2 B 16 36 1045 31.1 7.8 B 17
37 1114 22.2 7.2 C 11 Comparative 38 672 44.5 10.8 A 18 example 39
1109 20.4 6.6 D 14 40 688 42.1 10.0 A 18 41 1095 27.2 7.8 D 16 42
1055 26.1 8.0 B 28 43 1067 18.3 7.8 B 11 44 (Cracked during
hot-extrusion.Experiment canceled.) 45 1042 18.3 8.2 A 14 46 1077
17.8 7.4 B 13 47 1050 28.7 7.2 D 9 48 1044 34.3 6.8 D 17 49 1057
28.7 6.4 D 15 50 1054 28.0 6.0 D 19 Conventional 51 915 51.2 7.0 B
17 example 52 1531 23.5 6.2 C 18
[0117] Table 2 clearly shows that the samples in Examples 1 to 37
according to the present invention are excellent in all the
characteristics such as the tensile strength, electric
conductivity, repeated bending property, and resistance to stress
relaxation.
[0118] On the other hand, the desired strength cannot be obtained
in the sample in Comparative Example 38 containing a too small
amount of Ni and in the sample in Comparative Example 40 containing
a too small amount of Si. On the contrary, while the strength of
the sample in Comparative Example 39 containing a too large amount
of Ni is not different from the strength of the samples in Examples
2 to 4 according to the present invention, the former sample is
poor in bending property. Further, although the strength of the
sample in Comparative Example 41 containing a too large amount of
Si is not different from the strength of the samples in Examples 2
to 4 according to the present invention, the former sample is poor
in bending property.
[0119] Resistance to stress relaxation is conspicuously
deteriorated in the sample in Comparative Example 42 containing a
too small amount of Sn as compared with the sample in Example 7
according to the present invention. On the contrary, although
resistance to stress relaxation of the sample in Comparative
Example 43 containing a too large amount of Sn is not so largely
different from resistance to stress relaxation of the sample in
Example 8 according to the present invention, a desired electric
conductivity cannot be obtained in the former sample.
[0120] Since cracks were generated in the hot extrusion process in
the sample in Comparative Example 44 in which the amount of
addition of S exceeds the amount defined in the present invention,
the process flow thereafter was canceled.
[0121] The electric conductivity became deteriorated in the sample
in Comparative example 45 in which the amount of addition of Zn
exceeds the amount defined in the present invention.
[0122] Although the effect of increasing the strength was observed
in the sample in Comparative Example 46 in which the amount of
addition of Mn exceeds the amount defined in the present invention
as compared with the samples in Examples 25 and 26 according to the
present invention containing a smaller amount of Mn, the electric
conductivity was deteriorated.
[0123] Bending property is poor in the sample in Comparative
Example 47 in which the amount of addition of Mg exceeds the amount
defined in the present invention, and, although resistance to
stress relaxation is improved as compared with the sample in
Example 29 according to the present invention, the desired
conductivity is deteriorated.
[0124] Although the electric conductivity is slightly improved in
the sample in Comparative Example 48 in which the amount of
addition of Fe exceeds the amount defined in the present invention
as compared with the sample in Example 31 according to the present
invention, the improvement is not consistent with the amount of
addition. Besides, bending property is conspicuously
deteriorated.
[0125] Although the electric conductivity is slightly improved in
the sample in Comparative Example 49 in which the amount of
addition of Cr exceeds the amount defined in the present invention
as compared with the sample in Example 33 according to the present
invention, the improvement is not consistent with the amount of
addition. Besides, bending property is conspicuously
deteriorated.
[0126] Although the strength and electric conductivity of the
sample in Comparative Example 50, in which the amount of addition
of P exceeds the amount defined in the present invention, are
little different from those of the sample in Example 35 according
to the present invention, bending property is conspicuously
deteriorated.
[0127] Then, the alloys having the compositions in Examples 29 and
30 among the alloys in Table 1 were melted and cast into billets.
After hot-extrusion of these billets, they were formed into wire
rods with a diameter of 15 mm by cold (wire drawing) working. These
wire rods were formed into wires with a diameter of 0.15 mm by
applying any one of the steps A to L shown in Table 3. Likewise,
the alloys having the compositions in Examples 29 and 30 were
melted and cast into billets and, after hot extrusion of these
billets, wires with a diameter of 0.15 mm were formed by applying
any one of the steps M, N, 0 and P shown in Table 3. Various
characteristics as shown above were evaluated using the wires
obtained above. The results are shown in Table 4.
3TABLE 3 Process No. Processing steps A Solution
treatment(900.degree. C. .times. 0.5 h).fwdarw.Drawing(.eta. =
9).fwdarw.Aging(450.degree. C. .times. 2 h) B Solution
treatment(900.degree. C. .times. 0.5 h).fwdarw.Drawing(.eta. = 9) C
Solution treatment(900.degree. C. .times. 0.5
h).fwdarw.Drawing(.eta. = 9).fwdarw.Aging(350.degree. C. .times. 2
h) D Solution treatment(900.degree. C. .times. 0.5
h).fwdarw.Aging(500.degree. C. .times. 2 h).fwdarw.Drawing(.eta. =
7) E Solution treatment(900.degree. C. .times. 0.5
h).fwdarw.Drawing(.eta. = 3).fwdarw.Aging(450.degree. C. .times. 2
h).fwdarw. Drawing(.eta. = 4) F Solution treatment(900.degree. C.
.times. 0.5 h).fwdarw.Drawing(.eta. = 3).fwdarw.Aging(450.degree.
C. .times. 2 h).fwdarw. Drawing(.eta. = 0.9) G Solution
treatment(900.degree. C. .times. 0.5 h).fwdarw.Drawing(.eta. =
4.5).fwdarw.Aging(450.degree. C. .times. 2 h).fwdarw. Drawing(.eta.
= 0.7) H Solution treatment(900.degree. C. .times. 0.5
h).fwdarw.Drawing(.eta. = 0.7).fwdarw.Aging(450.degree. C. .times.
2 h).fwdarw. Drawing(.eta. = 6.3).fwdarw.Annealing(400.degree. C.
.times. 2 h) I Solution treatment(900.degree. C. .times. 0.5
h).fwdarw.Drawing(.eta. = 3).fwdarw.Aging(525.degree. C. .times. 2
h).fwdarw. Drawing(.eta. = 4) J Solution treatment(900.degree. C.
.times. 0.5 h).fwdarw.Drawing(.eta. = 2.3).fwdarw.Aging(500.degree.
C. .times. 2 h).fwdarw. Drawing(.eta. =
2.3).fwdarw.Annealing(350.degree. C. .times. 2 h).fwdarw.
Drawing(.eta. = 2.3).fwdarw.Annealing(325 .times. 2 h) K Solution
treatment(900.degree. C. .times. 0.5 h).fwdarw.Drawing(.eta. =
9).fwdarw.Annealing(300.degree. C. .times. 2h) L Solution
treatment(900.degree. C. .times. 0.5 h).fwdarw.Aging(500.degree. C.
.times. 2 h) M Solution treatment(900.degree. C. .times. 0.5 h) N
Drawing(.eta. = 9.8) O Drawing(.eta. =
9.8).fwdarw.Aging(450.degree. C. .times. 2 h) P Aging(450.degree.
C. .times. 2 h).fwdarw.Drawing(.eta. = 9.8) (Note) Wire-drawing is
abbreviated to "Drawing"
[0128]
4TABLE 4 Repeated Resistance Tensile Electric bending to stress
Alloy Process strength conductivity property Bending relaxation No.
No. (MPa) (% IACS) (times) property (%) Examples 53 29 A 706 58.7
10.6 A 10 according 54 29 B 1210 20.3 8.6 C 19 to this 55 29 C 1061
40.2 7.6 B 12 invention 56 29 D 1066 20.5 8.2 C 17 57 29 E 1034
27.8 7.4 B 14 58 29 F 929 37.1 7.8 B 11 59 29 G 786 43.8 6.8 A 13
60 29 H 732 46.8 9.2 B 12 61 29 I 943 38.4 8.8 B 15 62 29 J 964
43.3 10.0 B 14 63 30 A 754 52.1 9.8 B 8 64 30 C 1105 34.6 7.6 B 9
65 30 D 1196 21.5 6.6 C 10 66 30 E 1070 22.6 7.2 C 12 67 30 F 951
30.1 7.4 B 9 68 30 G 813 40.8 8.6 B 7 69 30 H 779 40.3 7.6 B 15 70
30 I 977 33.7 8.4 C 13 71 30 K 1256 22.9 9.6 B 11 72 30 L 915 37.0
10.8 B 10 Comparative 73 29 M 350 20.2 13.2 A 12 example 74 29 N
1254 19.5 7.2 B 24 75 29 O 590 56.3 7.6 B 16 76 29 P 1056 19.2 7.0
B 20 77 30 M 390 15.2 12.4 A 10 78 30 N 1298 15.3 6.4 D 22 79 30 O
683 53.2 7.8 A 13 80 30 P 1197 14.8 6.6 B 23
[0129] Table 4 clearly shows that the samples of the examples
according to the present invention are excellent in every evaluated
characteristics.
[0130] On the contrary, the sample in Comparative Example 73 is
poor in the tensile strength. The sample in Comparative Example 74
is poor in the electric conductivity and the resistance to stress
relaxation. The sample in Comparative Example 75 is poor in the
tensile strength. The sample in Comparative Example 76 is poor in
the electric conductivity.
[0131] Further, the sample in Comparative Example 77 is poor in
both the tensile strength and the electric conductivity. The sample
in Comparative Example 78 is poor in the electric conductivity, the
bending property and the resistance to stress relaxation. The
sample in Comparative Example 79 is poor in the tensile strength.
The sample in Comparative Example 80 is poor in both the electric
conductivity and the resistance to stress relaxation.
Industrial Applicabillty
[0132] The high-strength, high-conductivity copper alloy wire of
the present invention being excellent in resistance to stress
relaxation is preferable as high-strength, high-conductivity copper
alloy wires for parts of electronic and electric machinery and
tools, particularly preferable as pins such as IC socket pins,
connector pins, or the like, terminals such as terminals for
butteries, conductors such as flat cable conductors, wiring cable
conductors for machinery and tools, or the like, and spring
materials such as coil springs.
[0133] The method of the present invention is advantageous for
producing the high-strength, high-conductivity copper alloy wire
being excellent in resistance to stress relaxation.
[0134] Having described our invention as related to the present
embodiments, it is our intention that the present invention not be
limited by any of the details of the description, unless otherwise
specified, but rather be construed broadly within its spirit and
scope as set out in the accompanying claims.
* * * * *