U.S. patent application number 10/711444 was filed with the patent office on 2005-02-03 for chip structure with bumps and a process for fabricating the same.
Invention is credited to Weng, Chao-Fu.
Application Number | 20050023678 10/711444 |
Document ID | / |
Family ID | 21688168 |
Filed Date | 2005-02-03 |
United States Patent
Application |
20050023678 |
Kind Code |
A1 |
Weng, Chao-Fu |
February 3, 2005 |
CHIP STRUCTURE WITH BUMPS AND A PROCESS FOR FABRICATING THE
SAME
Abstract
A chip structure with bumps comprising: a chip and at least a
bump. The chip has an active surface and at least a bonding pad
that is formed on the active surface. The bump is disposed on the
bonding pad, and the bump comprises a medium layer, a bump body and
a bump body passivation layer. The medium layer whose material
includes zinc is disposed on the bonding pad. The bump body whose
material includes nickel is disposed on the medium layer. The bump
body passivation layer whose material includes gold covers the bump
body except for a portion of the bump body that connects to the
medium layer.
Inventors: |
Weng, Chao-Fu; (Tainan,
TW) |
Correspondence
Address: |
JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE
7 FLOOR-1, NO. 100
ROOSEVELT ROAD, SECTION 2
TAIPEI
100
TW
|
Family ID: |
21688168 |
Appl. No.: |
10/711444 |
Filed: |
September 20, 2004 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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10711444 |
Sep 20, 2004 |
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10065632 |
Nov 5, 2002 |
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6812124 |
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Current U.S.
Class: |
257/737 ;
257/780; 257/E23.021; 438/613 |
Current CPC
Class: |
H01L 24/13 20130101;
H01L 2224/05571 20130101; H01L 2224/05027 20130101; H01L 2924/0103
20130101; H01L 2224/05022 20130101; H01L 2924/01033 20130101; H01L
24/11 20130101; H01L 24/05 20130101; H01L 2924/01078 20130101; H01L
2924/01079 20130101; H01L 24/03 20130101; H01L 2224/05001 20130101;
H01L 2224/13 20130101; H01L 2224/13099 20130101; H01L 2224/1147
20130101; H01L 2924/014 20130101; H01L 2224/11 20130101; H01L
2224/05572 20130101; H01L 2224/13 20130101; H01L 2924/00 20130101;
H01L 2224/11 20130101; H01L 2924/00 20130101 |
Class at
Publication: |
257/737 ;
438/613; 257/780 |
International
Class: |
H01L 021/44; H01L
023/52 |
Foreign Application Data
Date |
Code |
Application Number |
Jan 7, 2002 |
TW |
91100094 |
Claims
What is claimed is:
1. A chip structure with bumps comprising: a chip having an active
surface and at least a bonding pad, wherein the bonding pad is
formed on the active surface; and at least a bump disposed on the
bonding pad, and the bump comprising: a medium layer disposed on
the bonding pad, wherein a material of the medium layer includes
zinc; a bump body disposed on the medium layer, wherein a material
of the bump body includes nickel; and a bump body passivation layer
covering the bump body except for a portion of the bump body that
connects to the medium layer, wherein a material of the bump body
passivation layer includes gold.
2. The chip structure with bumps of claim 1, wherein a height of
the bump is about 5 to 10 microns.
3. The chip structure with bumps of claim 1, wherein a thickness of
the bump body passivation layer is about 1 to 3 microns.
4. A bump suitable to be disposed on a chip, wherein the chip has
an active surface and at least a bonding pad that exposes the
active surface, and the bump comprising: a medium layer disposed on
the bonding pad; and a bump body disposed on the medium layer,
wherein a material of the bump body includes nickel.
5. The bump of claim 4, further comprising a bump body passivation
layer covering the bump body except for a portion of the bump body
that connects to the medium layer.
6. The bump of claim 5, wherein a material of the bump body
passivation layer includes gold.
7. The bump of claim 5, wherein a thickness of the bump body
passivation layer is about 1 to 3 microns.
8. The bump of claim 4, wherein a height of the bump is about 5 to
10 microns.
9. The bump of claim 4, wherein a material of the medium layer
includes zinc.
10. A bump suitable to be disposed on a chip, wherein the chip has
an active surface and at least a bonding pad that exposes the
active surface, and the bump comprising: a medium layer disposed on
the bonding pad, wherein a material of the medium layer includes
zinc; and a bump body disposed on the medium layer.
11. The bump of claim 10, further comprising a bump body
passivation layer covering the bump body except for a portion of
the bump body that connects to the medium layer.
12. The bump of claim 11, wherein a material of the bump body
passivation layer includes gold.
13. The bump of claim 11, wherein a thickness of the bump body
passivation layer is about 1 to 3 microns.
14. The bump of claim 10, wherein a height of the bump is about 5
to 10 microns.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a divisional of a prior application Ser.
No. 10/065,632, filed Nov. 5, 2002, which claims the priority
benefit of Taiwan application serial no. 91100094, filed on Jan. 7,
2002.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] This invention relates in general to a chip structure with
bumps and a process for fabricating the chip, and more specifically
relates to bumps made of specific material so that the bumping
process is simplified and the manufacturing cost is reduced.
[0004] 2. Description of Related Art
[0005] Recently, following the high-development of information
technology, electronic products are commonly used in the public.
The design fashions of various electronic products trends also
generally towards lightness, thinness, shortness and smallness.
Therefore, as far as the field of semiconductor packages is
concerned, a lot of package structures are provided in high density
type. In some fields of package, bumps are formed on a chip to
perform Flip Chip Packaging or Tape Carrier Packaging. Bumps are
generally divided into 2 types, one is made of solder, the other is
made of gold. The bumps made of gold in prior art will be described
as follows.
[0006] FIG. 1 to FIG. 5 are schematic cross-sectional views showing
the progression of steps for producing a bump made of gold in
accordance with a conventional method.
[0007] As shown in FIG. 1, a chip 110 which has an active surface
112 and bonding pads 116 (only one bonding pad is shown) is
provided. The bonding pads 116 are formed on the active surface. A
passivation layer 114 is formed on the active surface 112 and
exposes the bonding pads 116 so that the chip 110 is electrically
connected to other outside circuit (not shown) through the bonding
pads 116. The Under Bump Metal process is followed to form a
barrier layer 120 on the active surface 112 of the chip 110 by
sputtering method. The barrier layer 120 covers bonding pads 116
and the passivation layer 114. The material of the barrier layer
120 is for example TiW etc., wherein a thickness of the barrier is
about thousands of angstrom. Then a seed layer 130 is formed on the
barrier layer 120 by electrical plating or sputtering method. After
that, the Under Bump Metal 140 is completed. The material of seed
layer 130 is for example gold, wherein a thickness of the seed
layer is about 1000 angstrom, and the Under Bump Metal 140 is
composed of the barrier layer 120 and seed layer 130.
[0008] As shown in FIG. 2, a photolithography process is performed.
A photo resist layer 150 is formed on the seed layer 130. After the
photo resist layer 150 has been exposed and developed, a pattern
(not shown) is transferred to the photo resist layer 150 so that
openings 152 (only one opening is shown) which exposes bonding pads
116 are formed in the photo resist layer 150.
[0009] As shown in FIG. 3, a bumping process follows. Bumps 160
(only one bump is shown) are filled in the openings 152 of the
photo resist layer 150, wherein the material of the bump 160 is
gold.
[0010] Referring to FIG. 3 and FIG. 4, the photo resist layer 150
is removed from the surface of the seed layer 130.
[0011] Referring to FIG. 4 and FIG. 5, the Under Bump Metal 140
which is exposed is removed by an etching method. Then an annealing
process is performed so that the metal ions with defects which are
in the bumps 160 are rearranged to be in a stable state.
[0012] As it is described above, the bumping process is
complicated, high cost and is not so effective a manufacturing
process.
SUMMARY OF THE INVENTION
[0013] According to the foregoing description, an object of this
invention is to provide a structure and a fabricating process of a
bump so that the bumping process is simplified and cost down by
changing the material of the bumps.
[0014] To attain the foregoing and other aspects, the present
invention proposes a chip structure with bumps comprising: a chip
and at least a bump. Wherein the chip has an active surface and at
least a bonding pad, and the bonding pad is formed on the active
surface. The bump is disposed on the bonding pad, and the bump
comprises a medium layer, a bump body and a bump body passivation
layer. The medium layer is disposed on the bonding pad, and a
material of the medium layer includes zinc. A bump body is disposed
on the medium layer, and a material of the bump body includes
nickel. A bump body passivation layer covers the bump body except
for a portion of the bump body that connects to the medium layer,
wherein a material of the bump body passivation layer includes
gold.
[0015] Also to attain the foregoing and other aspects, the present
invention proposes a process for fabricating a chip with bumps
comprising the following steps. First providing a chip that has an
active surface and at least a bonding pad, wherein the bonding pad
exposes the active surface. Then performing an activation step,
depositing a medium layer on the bonding pad. Forming at least a
bump body on the medium layer in an electricless plating way, and
forming a bump body passivation layer covering the bump body except
for a portion of the bump body that connects to the medium
layer.
[0016] According to a preferred embodiment of the present
invention, the material of the bump body is nickel, and the
material of the bump body passivation layer is gold. The height of
the bump body is about 5 to 10 microns, and the height of the bump
body passivation layer is about 1 to 3 microns. The bump body and
the bump body passivation layer are formed by electricless
plating.
[0017] As it is described above, the feature of the present
invention is to change the material of the bumps so that the bumps
can be formed on the bonding pads of a chip in a simplified
manufacturing process.
BRIEF DESCRIPTION OF THE DRAWINGS
[0018] While the specification concludes with claims particularly
pointing out and distinctly claiming the subject matter which is
regarded as the invention, the objects and features of the
invention and further objects, features and advantages thereof will
be better understood from the following description taken in
connection with the accompanying drawings.
[0019] FIG. 1 through FIG. 5 are schematic cross-sectional views
showing the progression of steps for producing a bump made of gold
in accordance with a conventional method.
[0020] FIG. 6 and FIG. 7 are schematic cross-sectional views
showing the progression of steps for producing a bump in accordance
with a preferred embodiment of the present invention.
[0021] FIG. 8 through FIG. 10 are schematic cross-sectional views
showing the progression of steps for producing a bump in accordance
with another preferred embodiment of the present invention.
DESCRIPTION OF THE PREFERRED EMBODIMENT
[0022] FIG. 6 and FIG. 7 are schematic cross-sectional views
showing the progression of steps for producing a bump in accordance
with a preferred embodiment of the present invention.
[0023] With reference to FIG. 6, a chip 210 which has an active
surface 212 and at least a bonding pad 216 (only one bonding pad is
shown) is provided. The bonding pad 216 is formed on the active
surface 212. A passivation layer 214 is formed on the active
surface 212 and exposes the bonding pad 216 so that the chip 210 is
electrically connected to other outside circuit (not shown) through
the bonding pad 216.
[0024] A bumping process which includes steps of producing a bump
body and a bump body passivation layer follows. In the step of
producing a bump body, at least a bump body 220 is formed by
electricless plating to be electrically connected to the bonding
pad 216. It is accomplished by following steps. First, an
activation step is performed. During the activation step, the chip
210 is dipped into a zinc ions containing solution, then zinc is
deposited on the bonding pad 216 of the chip 210 to form a medium
layer 228, wherein a material of the medium layer includes zinc.
Since zinc is utilized to be an activator before the following
electricless plating, the deposition thickness of zinc doesn't need
to be thick. Then an electricless plating step is performed. The
chip 210 is dipped into a nickel ions containing solution, then
nickel is formed on the medium layer 228 on the chip 210 in an
electricless plating way. Nickel is deposited on zinc so that a
bump body 220 is formed. The size of the bump body 220 can be
controlled by the dipping time in nickel ions containing solution.
Therefore, the bump body 220 is connected to the bonding pad 216
through the medium layer 228, wherein a material of the bump body
220 includes nickel.
[0025] With reference to FIG. 7, a step of producing a bump body
passivation is performed.
[0026] A bump body passivation 230 is formed to cover the bump body
220 except for a portion of the bump body 220 that connects to the
medium layer 228. The material of the bump body passivation layer
230 is gold so that the oxidization of the bump body 220 (nickel)
can be prevented. After these steps, the bump 240, which comprises
the bump body 220 and the bump body passivation layer 230, is
accomplished. Since the hardness of the bump body 220 whose
material is nickel is relatively high, the height of the bump 240
only needs to be 5 to 10 microns to perform the Tape Carrier
Packing process. The thickness of the bump body passivation layer
230 is about 1 to 3 microns.
[0027] Comparing this preferred embodiment with the prior art, the
bumping process described above can eliminate the Under Bump Metal
process, photolithography and etching process. Furthermore, it is
not necessary to form the bump using electrical plating. Therefore,
the bumping process of the present invention is simplified and the
manufacturing cost is down.
[0028] FIG. 8 through FIG. 10 are schematic cross-sectional views
showing the progression of steps for producing a bump in accordance
with another preferred embodiment of the present invention. In the
previous embodiment, the bump body is formed on a chip in an
electricless plating way. Furthermore, a photolithography process
can also be added to control the shape of the bump.
[0029] With reference to FIG. 8, a photolithography process is
performed after a chip 310 is provided.
[0030] First a photo resist layer 350 is formed on the chip 310.
After the photo resist layer 350 has been exposed and developed, a
pattern (not shown) is transferred to the photo resist layer 350 so
that at least an opening 352 (only one opening is shown), which
exposes bonding pad 316, is formed in the photo resist layer 350.
An activation step is followed to form a medium layer 328, zinc, on
the bonding pad 316 of the chip 310. Then a bump body 320, nickel,
is formed on the medium layer 328 inside the opening by
electricless plating.
[0031] With reference to FIG. 8 and FIG. 9, the photo resist layer
350 is removed form the surface of the chip 310.
[0032] With reference to FIG. 10, finally, a step of producing a
bump body passivation layer is performed. A bump body passivation
layer 330, gold is formed to cover the bump body 320 except for a
portion of the bump body 320 that connects to the medium layer
328.
[0033] With reference to FIG. 8, since the bump body 320 is formed
inside the opening 352, the shape of the bump body 320 can be
controlled by the shapes of the openings 352. Accordingly, the bump
body 320 can be formed higher than that in the previous
embodiment.
[0034] As it is described above, the structure and the fabricating
process of the bump in the present invention can simplify the
bumping process and can reduce the manufacturing cost.
[0035] While the present invention has been described with 2
preferred embodiments, these descriptions are not intended to limit
our invention. Various modifications of the embodiments will be
apparent to those skilled in the art. It is therefore contemplated
that the appended claims will cover any such modifications or
embodiments as fall within the true scope of the invention.
* * * * *