U.S. patent application number 10/858961 was filed with the patent office on 2005-01-27 for optical package.
This patent application is currently assigned to Agilent Technologies, Inc.. Invention is credited to Amorim, Goncalo Agra, Keeble, Daniel John, Meadowcroft, David John Kenneth.
Application Number | 20050018980 10/858961 |
Document ID | / |
Family ID | 27772802 |
Filed Date | 2005-01-27 |
United States Patent
Application |
20050018980 |
Kind Code |
A1 |
Keeble, Daniel John ; et
al. |
January 27, 2005 |
Optical package
Abstract
An optical package that includes a component for supporting a
printed circuit board. The optical package comprises a housing
containing a printed circuit board having a connecting edge for
connecting to external components; an optical component supported
by the printed circuit board; an optical connector for coupling the
optical component to an optical fibre; and a support supporting the
connecting edge.
Inventors: |
Keeble, Daniel John;
(Felixstowe, GB) ; Amorim, Goncalo Agra; (Ipswich,
GB) ; Meadowcroft, David John Kenneth; (Stowmarket,
GB) |
Correspondence
Address: |
Paul D. Greeley, Esq.
Ohlandt, Greeley, Ruggiero & Perle, L.L.P.
10th Floor
One Landmark Square
Stamford
CT
06901-2682
US
|
Assignee: |
Agilent Technologies, Inc.
|
Family ID: |
27772802 |
Appl. No.: |
10/858961 |
Filed: |
June 2, 2004 |
Current U.S.
Class: |
385/92 |
Current CPC
Class: |
G02B 6/4255 20130101;
G02B 6/428 20130101; G02B 6/4277 20130101; G02B 6/4256 20130101;
G02B 6/4201 20130101 |
Class at
Publication: |
385/092 |
International
Class: |
G02B 006/36 |
Foreign Application Data
Date |
Code |
Application Number |
Jul 26, 2003 |
GB |
0317593.2 |
Claims
1. An optical package comprising a housing containing a printed
circuit board having a connecting edge for connecting to external
components; an optical component supported by the printed circuit
board; an optical connector for coupling the optical component to
an optical fibre; and a support supporting said connecting
edge.
2. An optical package according to claim 1, in which the support is
arranged to close any gap between the printed circuit board and the
housing and in which the support has a metalised portion and a
non-metalised portion such that EMI radiation from and to the
interior of the package is reduced.
3. An optical package according to claim 2, in which the
non-metalised portion is immediately adjacent said connecting
edge.
4. An optical package according to claim 1, in which the support
also includes means for locating and supporting a second printed
circuit board.
5. An optical package according to claim 1, in which the support is
an injection moulded plastic component.
Description
[0001] This invention relates to an optical package including a
component for supporting a printed circuit board (PCB).
[0002] Standard packages housing such optical components are open
at the rear in order to allow a connecting edge of a printed
circuit board supporting one or more optical components to
protrude. This can result in the printed circuit board flexing due
to lack of rigidity.
[0003] Optical components such as optical transmitters and
receivers require shielding in order to reduce electromagnetic
interference (EMI) entering or leaving the component. In standard
package designs EMI may escape from or enter the module via the
rear of the package. Another problem with standard modules is that
where two or more printed circuit boards are housed in a single
package, the two PCB's are connected by soldered connection pins
which adds an extra step in the manufacturing process hamper any
reworking that may be required.
[0004] The above problems are alleviated by the present invention
in which there is provided an optical package comprising a housing
containing a printed circuit board having a connecting edge for
connecting to external components; an optical component supported
by the printed circuit board; an optical connector for coupling the
optical component to an optical fibre; and a support supporting
said connecting edge.
[0005] It is an advantage if the support is arranged to close any
gap between the printed circuit board and the housing and in which
the support has a metalised portion and a non-metalised portion,
such that EMI radiation from and to the interior of the package is
reduced. Preferably the non-metalised portion is immediately
adjacent said connecting edge.
[0006] In order to alleviate the problems of supporting a printed
circuit board upon a second printed circuit board, it is an
advantage if the support also includes means for locating and
supporting a second printed circuit board.
[0007] The support may be an injection moulded plastic component.
Alternatively, the component could be manufactured by other
processes, such as machining or metal injection moulding.
[0008] Embodiments of the invention will now be described, by way
of example only, with reference to the accompanying drawings, in
which:
[0009] FIG. 1 illustrates a perspective view of an optical package
having a printed circuit board support according to one aspect of
the present invention;
[0010] FIG. 2 illustrates two circuit boards connected by soldered
pins;
[0011] FIG. 3 illustrates a support including means for locating
and supporting a second printed circuit board;
[0012] FIG. 4 illustrates a support according to a second
embodiment of the present invention;
[0013] FIG. 5 illustrates the support of FIG. 4 from another angle,
and in which circuit boards are located and supported; and
[0014] FIG. 6 illustrates use of a printed circuit board spacer for
use in conjunction with certain embodiments of the present
invention.
[0015] Referring now to FIG. 1, and optical package 1 comprises a
housing 2 containing a printed circuit board 3. The printed circuit
board 3 has a connecting edge 4 having conventional metalised pads
for plugging into a socket and for connection with external
components. The printed circuit board supports one or more optical
components (not shown) and has an optical connector (not shown) for
connection to an optical fibre. The optical package has a support
5, which is marker with crossed lines for illustrative purposes,
which supports the connecting edge of the printed circuit board. In
conventional optical packages the area marked with crossed lines is
left open, and the printed circuit board 3 is not supported.
[0016] FIG. 2 illustrates two printed circuit boards 4a, 4b.
Circuit boards 4a is mounted upon circuit board 4b by means of
soldered securing pins, of which one securing pin 6 is shown. FIG.
3 illustrates a support 5a supporting both connecting the edge of
the circuit board 4a in an aperture 7, and locating and supporting
the second circuit board 4b by slots, of which one slot 8 is shown.
In other embodiments there may be more than two printed circuit
boards.
[0017] FIG. 4 illustrates a second embodiment of the invention
showing a support 5b having a foot 9. Circuit board 4d is inserted
through the aperture 7, and circuit board 4e is supported by slots
8a, 8b. In this view optical connectors 11, 12 are illustrated. It
is an advantage if the support 5b is partially metalised. A
non-metalised portion 13 surrounding the aperture 7 serves to
electrically isolate the support 5b from the printed circuit board
4d, and metalised portion 14 serves to isolate the package from
electromagnetic interference.
[0018] FIG. 5 illustrates the support 5b located so as to support
the circuit boards 4d and 4e.
[0019] FIG. 6 illustrates a spacer 15, which serves to support the
end of the circuit board 4d, which is remote from the support 5b.
Use of a single spacer 15 is much more convenient than using three
or more soldered location/securing pins.
[0020] The supports 5, 5b are manufactured by injection moulding a
plastic material.
[0021] It will be understood that various alterations,
modifications, and/or additions may be introduced into the
constructions and arrangements of parts described above without
departing scope of the present invention as defined in the
following claims.
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