U.S. patent application number 10/807066 was filed with the patent office on 2004-12-16 for semiconductor cooling device.
Invention is credited to Ashitani, Hiromasa, Ikeda, Akira, Nakano, Masao.
Application Number | 20040250563 10/807066 |
Document ID | / |
Family ID | 33508827 |
Filed Date | 2004-12-16 |
United States Patent
Application |
20040250563 |
Kind Code |
A1 |
Nakano, Masao ; et
al. |
December 16, 2004 |
Semiconductor cooling device
Abstract
A semiconductor cooling device includes a cold plate for cooling
a semiconductor element, a condenser, and a positive-displacement
refrigerant pump. The cold plate, condenser and refrigerant pump
are fluid connected in series with each other to define a
refrigerating cycle. A centrifugal refrigerant pump can be used in
place of the positive-displacement refrigerant pump. In this case,
it is preferred that a receiver tank be interposed between the
condenser and the refrigerant pump.
Inventors: |
Nakano, Masao; (Koka-gun,
JP) ; Ikeda, Akira; (Kusatsu-shi, JP) ;
Ashitani, Hiromasa; (Otsu-shi, JP) |
Correspondence
Address: |
RATNERPRESTIA
P O BOX 980
VALLEY FORGE
PA
19482-0980
US
|
Family ID: |
33508827 |
Appl. No.: |
10/807066 |
Filed: |
March 23, 2004 |
Current U.S.
Class: |
62/259.2 ;
257/E23.088 |
Current CPC
Class: |
H01L 2924/0002 20130101;
H01L 23/427 20130101; H01L 2924/0002 20130101; H01L 2924/00
20130101 |
Class at
Publication: |
062/259.2 |
International
Class: |
F25B 015/00; F25D
023/12 |
Foreign Application Data
Date |
Code |
Application Number |
Jun 10, 2003 |
JP |
2003-164985 |
Claims
What is claimed is:
1. A semiconductor cooling device comprising: a cold plate for
cooling a semiconductor element; a condenser; and a
positive-displacement refrigerant pump, said cold plate, condenser
and refrigerant pump being fluid connected in series with each
other to define a refrigerating cycle.
2. A semiconductor cooling device comprising: a cold plate for
cooling a semiconductor element; a condenser; a receiver tank; and
a centrifugal refrigerant pump, said cold plate, condenser,
receiver tank and refrigerant pump being fluid connected in series
with each other to define a refrigerating cycle.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates generally to a cooling device
for cooling semiconductor elements which generate a substantial
quantity of heat and, in particular but not exclusively, to a
compact, easy-to-handle and efficient cooling device for cooling
such semiconductor elements by utilization of a change in phase
between a liquid phase and a vapor phase of a refrigerant.
[0003] 2. Description of the Related Art
[0004] Japanese Laid-Open Patent Publication No. 6-318656 discloses
a cooling device for cooling integrated circuit elements, as shown
in FIG. 1. The cooling device shown therein includes a condenser 12
and a refrigerant pump 13 for supplying integrated circuit elements
11 with a refrigerant. The integrated circuit elements 11, the
condenser 12 and the refrigerant pump 13 are connected in series
with a filter 14 interposed between the condenser 12 and the
refrigerant pump 13. Japanese Laid-Open Patent Publication No.
6-318656 is silent about the kind of the refrigerant pump 13.
[0005] However, in applications where the refrigerant undergoes a
phase change between a liquid phase and a vapor phase, there is a
good chance that the refrigerant pump 13 may draw a vapor
refrigerant or vapor of a gas-liquid refrigerant depending on the
location thereof in a refrigerating cycle. In such case, the
pumping power reduces or is lost in some cases, and any liquid
refrigerant does not flow through a cold plate to absorb heat
generated by the integrated circuit elements 11, resulting in an
increase in temperature of the integrated circuit elements 11.
SUMMARY OF THE INVENTION
[0006] The present invention has been developed to overcome the
above-described disadvantages.
[0007] It is accordingly an objective of the present invention to
provide a cooling device provided with a refrigerant pump capable
of positively supplying a cold plate with a liquid refrigerant even
if a vapor refrigerant is mixed therewith to some extent.
[0008] In accomplishing the above and other objectives, the
semiconductor cooling device according to the present invention
includes a cold plate for cooling a semiconductor element, a
condenser, and a positive-displacement refrigerant pump. The cold
plate, condenser and refrigerant pump are fluid connected in series
with each other to define a refrigerating cycle.
[0009] Because a positive-displacement pump that can withstand an
undesired operation in which vapor is entrapped therein is used as
the refrigerant pump, the liquid refrigerant is positively supplied
to the cold plate, making it possible to ensure a highly efficient
refrigerating cycle.
[0010] Alternatively, a centrifugal refrigerant pump can be used in
place of the positive-displacement refrigerant pump. In this case,
it is preferred that a receiver tank be interposed between the
condenser and the refrigerant pump. The receiver tank acts to
accumulate the vapor refrigerant therein and to supply the
centrifugal refrigerant pump with the liquid refrigerant, which is
in turn supplied to the cold plate, making it possible to provide a
highly efficient refrigerating cycle.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] The above and other objectives and features of the present
invention will become more apparent from the following description
of preferred embodiments thereof with reference to the accompanying
drawings, throughout which like parts are designated by like
reference numerals, and wherein:
[0012] FIG. 1 is a refrigerating cycle of a conventional cooling
device;
[0013] FIG. 2 is a refrigerating cycle of a semiconductor cooling
device according to a first embodiment of the present invention;
and
[0014] FIG. 3 is a refrigerating cycle of a semiconductor cooling
device according to a second embodiment of the present
invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0015] This application is based on an application No. 2003-164985
filed Jun. 10, 2003 in Japan, the content of which is herein
expressly incorporated by reference in its entirety.
[0016] FIG. 2 depicts a refrigerating cycle of a semiconductor
cooling device according to a first embodiment of the present
invention. The semiconductor cooling device shown in FIG. 2
includes a cold plate 1 for cooling a highly exothermic
semiconductor element or elements that tend to emit a substantial
amount of heat when in operation, a condenser 2, and a
positive-displacement refrigerant pump 3, all connected in series
with each other to define a refrigerating cycle. An outlet of the
condenser 2 and an inlet of the cold plate 1 are connected via
piping 5 with the refrigerant pump 3 interposed therebetween, while
an outlet of the cold plate 1 and an inlet of the condenser 2 are
connected via piping 6.
[0017] A refrigerant is filled in this refrigerating cycle. The
condenser 2 is adapted to be cooled by a fan 4.
[0018] The cooling device is so designed that a liquid refrigerant
emerging first from the condenser 2 is supplied towards the cold
plate 1 through the piping 5 by the refrigerant pump 3. The cold
plate 1 so supplied with the refrigerant absorbs heat generated by
the highly exothermic semiconductor element and, in the course of
absorption of the heat, a change in phase from the liquid
refrigerant to a vapor refrigerant takes place within the cold
plate 1. The vapor refrigerant is then supplied to the condenser 2
that is then cooled by the fan 4 so that the vapor refrigerant
within the condenser 2 undergoes a phase change to a liquid
refrigerant.
[0019] According to this embodiment, since a positive-displacement
pump is used as the refrigerant pump 3, even if a vapor component
is contained in the refrigerant supplied thereto from the condenser
2, the refrigerant pump 3 can positively supply the cold plate 1
with the liquid refrigerant, making it possible to suppress an
increase in temperature of the semiconductor element.
[0020] FIG. 3 depicts a refrigerating cycle of a semiconductor
cooling device according to a second embodiment of the present
invention. The semiconductor cooling device shown in FIG. 3
includes a cold plate 1 for cooling a highly exothermic
semiconductor element or elements, a condenser 2, a receiver tank
7, and a centrifugal refrigerant pump 3, all connected in series
with each other to define a refrigerating cycle. An outlet of the
condenser 2 and an inlet of the cold plate 1 are connected via
piping 5 with the receiver tank 7 and the refrigerant pump 3
interposed therebetween, while an outlet of the cold plate 1 and an
inlet of the condenser 2 are connected via piping 6.
[0021] A refrigerant is filled in this refrigerating cycle. The
condenser 2 is adapted to be cooled by a fan 4.
[0022] The cooling device is so designed that a liquid refrigerant
and a vapor refrigerant emerging from the condenser 2 are first
accumulated in the receiver tank 7, and only the liquid refrigerant
is then supplied towards the cold plate 1 through the piping 5 by
the centrifugal refrigerant pump 3. The cold plate 1 so supplied
with the liquid refrigerant absorbs heat generated by the highly
exothermic semiconductor element and, in the course of absorption
of the heat, a change in phase from the liquid refrigerant to a
vapor refrigerant takes place within the cold plate 1. The vapor
refrigerant is then supplied to the condenser 2 that is then cooled
by the fan 4 so that the vapor refrigerant within the condenser 2
undergoes a phase change to a liquid refrigerant.
[0023] According to this embodiment, since the receiver tank 7 and
the centrifugal refrigerant pump 3 are provided in the
refrigerating cycle, even if a vapor component is contained in the
refrigerant supplied from the condenser 2, only the liquid
refrigerant is supplied to the centrifugal refrigerant pump 3 with
the vapor refrigerant remained within the receiver tank 7.
Accordingly, the liquid refrigerant can be positively supplied to
the cold plate 1, making it possible to suppress an increase in
temperature of the semiconductor element.
[0024] Although the present invention has been fully described by
way of examples with reference to the accompanying drawings, it is
to be noted here that various changes and modifications will be
apparent to those skilled in the art. Therefore, unless such
changes and modifications otherwise depart from the spirit and
scope of the present invention, they should be construed as being
included therein.
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