U.S. patent application number 10/456012 was filed with the patent office on 2004-12-09 for image sensor package.
Invention is credited to Chang, Eric, Chen, Bruce, Hsieh, Jackson, Wu, Jichen.
Application Number | 20040245590 10/456012 |
Document ID | / |
Family ID | 33490063 |
Filed Date | 2004-12-09 |
United States Patent
Application |
20040245590 |
Kind Code |
A1 |
Hsieh, Jackson ; et
al. |
December 9, 2004 |
Image sensor package
Abstract
An image sensor package includes a plurality of leadframes, a
molded resin, a photosensitive, a plurality of wires and a
transparent layer. Each of the leadframes have a first board and a
second board located on a height different from that of the first
board, and a chamber is defined upper a central of the plurality of
leadframes. The molded resin is for encapsulating the leadframes,
and is forming an upper surface and a lower surface, wherein the
first boards of the leadframes are exposed from the upper surface
of the molded resin. The photosensitive chip is mounted onto the
upper surface of the molded resin and arranged within the chamber.
Each of wires are electrically connected the photosensitive chip to
the each second board of the plurality of leadframes. And the
transparent resin is covered onto the each first board of the
plurality of leadframes.
Inventors: |
Hsieh, Jackson; (Hsinchu
Hsien, TW) ; Wu, Jichen; (Hsinchu Hsien, TW) ;
Chang, Eric; (Hsinchu Hsien, TW) ; Chen, Bruce;
(Hsinchu Hsien, TW) |
Correspondence
Address: |
PRO-TECHTOR INTERNATIONAL
20775 Norada Court
Saratoga
CA
95070-3018
US
|
Family ID: |
33490063 |
Appl. No.: |
10/456012 |
Filed: |
June 5, 2003 |
Current U.S.
Class: |
257/433 ;
257/E31.117 |
Current CPC
Class: |
H01L 2224/32245
20130101; H01L 2224/48247 20130101; H01L 2224/48091 20130101; H01L
2224/48091 20130101; H01L 2224/73265 20130101; H01L 2224/73265
20130101; H01L 31/0203 20130101; H01L 2224/32245 20130101; H01L
2224/48247 20130101; H01L 2924/00 20130101; H01L 2924/00014
20130101 |
Class at
Publication: |
257/433 |
International
Class: |
H01L 031/0203 |
Claims
What is claimed is:
1. An image sensor package for being electrically connected to a
printed circuit board, the printed circuit board having a through
hole, the image sensor package comprising: a plurality of
leadframes arranged in a matrix, each of the leadframes having a
first board and a second board located on a height different from
that of the first board, and a chamber being defined upper a
central of said a plurality of leadframes; a molded resin for
encapsulating the leadframes and forming a upper surface and a
lower surface, wherein the first boards of the leadframes being
exposed from the upper surface of the molded resin, the second
board of the leadframes being exposed from the upper surface of the
molded resin; a photosensitive chip mounted onto the upper surface
of the molded resin and arranged within the chamber; a plurality of
wires being electrically connected the photosensitive chip to the
each second board of the plurality of leadframes; and a transparent
resin covered onto the each first board of the plurality of
leadframes, therefore, the photosensitive chip may received optical
signals passing through the transparent resin.
2. The image sensor package according to claim 1, further
comprising a middle board is arranged within the chamber of the
leadframes, wherein the photosensitive chip is placed on the middle
board.
3. The image sensor package according to claim 1, wherein the
molded resin is formed from industrial material by way of injecting
molding, for encapsulating the plurality of the leadframes.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to an image sensor package,
and more particularly to a photosensitive chip package having a
reduced manufacturing cost and package volume.
[0003] 2. Description of the Related Art
[0004] Referring to FIG. 1, a conventional image sensor includes a
plurality of leadframes 10, a frame layer 16, a photosensitive chip
18, wires 19 and a transparent layer 22. The plurality of
leadframes 10 arranged in matrix, each of the leadframes 10 having
a first board 12 and a second board 14 located on a height
different from the second board 14. The frame layer 16 for
encapsulating the leadframes 10, and a chamber 20 being defined for
mounting the photosensitive chip, wherein the first board 12 and
second board 14 are exposed from the frame layer 16. The
photosensitive chip 18 is arranged within the chamber 20. The wire
19 are for electrically connecting the photosensitive chip 18 to
the second board 14 of the leadframes. The transparent layer 22 is
disposed on the upper surface of the frame layer 16. Furthermore,
the photosensitive chip 18 may receive optical signals passing
through the transparent layer 22.
[0005] According to the above-mentioned structure, the present
invention has following advantage.
[0006] 1. The transparent layer 22 is disposed on the upper surface
of the frame
SUMMARY OF THE INVENTION
[0007] An object of the present invention is to provide an image
sensor package, which may be advantageously reduced the volume of
the package.
[0008] Another object of the present invention is to provide an
image sensor package, which may be assembled easily and has a
reduced manufacturing cost.
[0009] To achieve the above-mentioned object, the present invent of
an image sensor package includes a plurality of leadframes, a
molded resin, a photosensitive, a plurality of wires and a
transparent layer. Each of the leadframes have a first board and a
second board located on a height different from that of the first
board, and a chamber is defined upper a central of the plurality of
leadframes. The molded resin is for encapsulating the leadframes,
and is forming an upper surface and a lower surface, wherein the
first boards of the leadframes are exposed from the upper surface
of the molded resin. The photosensitive chip is mounted onto the
upper surface of the molded resin and is arranged within the
chamber. Each of wires are electrically connected the
photosensitive chip to the each second board of the plurality of
leadframes. And the transparent resin is covered onto the each
first board of the plurality of leadframes.
[0010] Furthermore, the transparent resin of the image sensor may
be mount on the first board of the leadframes, the package may
advantageously reduced the volume of the package, and may be
assembled easily and has a reduced manufacturing cost.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] FIG. 1 is a schematic illustration showing a conventional
image sensor package.
[0012] FIG. 2 is a cross-sectional view showing an image sensor
package of the present invention.
[0013] FIG. 3 is a schematic illustration showing an image sensor
of the present invention.
DETAILED DESCRIPTION OF THE INVENTION
[0014] Referring to FIG. 2, an image sensor package of the present
invention includes a plurality of leadframes 30, a molded resin 31,
a photosensitive chip 33, a plurality of wires 35, and a
transparent layer 37
[0015] The plurality of leadframes 30 are arranged in matrix, each
of leadframes 30 have a first board 32 and a second board 34
located on a height different from that of the first board 32, a
chamber 38 is defined upper a central of the leadframe 30, and a
middle board 40 is arranged within the internal of the chamber
38.
[0016] The molded resin 31 is made of industrial plastic by way of
injection molding to encapsulate leadframes 30, and has a upper
surface 42 and a lower surface 44. Wherein the upper surface of the
first boards 32 of the leadframes 30 are exposed from the upper
surface 42 of the molded resin 31, the upper surface of the second
board 34 of the leadframes 30 are exposed from the upper surface 42
of the molded resin 31.
[0017] The photosensitive chip 33 is mounted onto the middle board
40 of the leadframe 30 and is arranged within the chamber 38.
[0018] Each of wires 35 are electrically connected the
photosensitive chip 33 to the each second board 34 of the plurality
of leadframes 30.and
[0019] The transparent resin 37 is covered onto the each first
board 32 of the plurality of leadframes 30, therefore, the
photosensitive chip 33 may be received optical signals passing
through the transparent resin 37.
[0020] Please referring to GIG.3, a schematic illustrate showing an
image sensor package of the present invention. Wherein a printed
circuit board 39 is provided, the printed circuit board 39 is
formed with a through hole 41, which is larger than the transparent
resin 37. The printed circuit board 39 is covered over the first
board 32 of the leadframes 30, and is electrically connected the
first board 32 of the leadframes 30. Then, the photosensitive chip
33 may be received optical signals passing through the transparent
layer 37 and through hole 41 of the printed circuit board 39,
therefore, the signals from the photosensitive chip 33 may be
transmitted to the printed circuit board 39 via the first board 32
of the leadframe 30.
[0021] To sum up, the present invention has the following
advantages.
[0022] 1. Since the leadframes 30 are formed with a chamber 38, and
the photosensitive chip 33 is located within the chamber 38 so as
to the volume the package can be reduced.
[0023] 2. Since the printed circuit board 39 is directly covered
over the first board 32 of the leadframes 30, on frame layer has to
be provided. Thus, the manufacturing processes may be simplified
and manufacturing cost may be reduced.
[0024] Wherein the second board 34 and middle board 40 of the
leadframes 30 are exposed from the lower surface 44 of the molded
layer 31, therefore, the lower surface of second board 34 may be
electrically connected to a printed electric board, thus, the
photosensitive chip 43 may enhance the effects of dissipation
head
[0025] While present the invention has been described by way of an
example and in terms of a preferred embodiment, it is to be
understood that the invention is not limited to the disclosed
embodiment. To the contrary, it is intended to cover various
modifications. Therefore, the scope of the appended claims should
be accorded the broadest interpretation so as to encompass all such
modifications.
* * * * *