U.S. patent application number 10/884491 was filed with the patent office on 2004-12-02 for anode member for a solid electrolytic capacitor, method of producing the same and solid electrolytic capacitor using the same.
This patent application is currently assigned to NEC TOKIN CORPORATION. Invention is credited to Yoshida, Katsuhiro.
Application Number | 20040240154 10/884491 |
Document ID | / |
Family ID | 29545186 |
Filed Date | 2004-12-02 |
United States Patent
Application |
20040240154 |
Kind Code |
A1 |
Yoshida, Katsuhiro |
December 2, 2004 |
Anode member for a solid electrolytic capacitor, method of
producing the same and solid electrolytic capacitor using the
same
Abstract
An anode member includes a tantalum foil (1) and a sintered
member (2A, 2B) formed thereon. The sintered member has a
double-layer structure including a lower sintered layer (2A.sub.1,
2B.sub.1) made of a first material powder having a high
sinterability and an upper sintered layer (2A.sub.2, 2B.sub.2) made
of a second material powder having a low sinterability. Sintering
is performed at a temperature providing good porosity of the upper
sintered layer and an over-sintered condition of the lower sintered
layer. The first and the second material powders are same in raw
material metal and different in average particle size or,
alternatively, different in raw material metal and equal in average
particle size. Alternatively, the sintered member (2C) has a
single-layer structure including a sintered body of a powder
mixture of the first and the second material powders.
Inventors: |
Yoshida, Katsuhiro;
(Sendai-shi, JP) |
Correspondence
Address: |
FRISHAUF, HOLTZ, GOODMAN & CHICK, PC
767 THIRD AVENUE
25TH FLOOR
NEW YORK
NY
10017-2023
US
|
Assignee: |
NEC TOKIN CORPORATION
Sendai-shi
JP
|
Family ID: |
29545186 |
Appl. No.: |
10/884491 |
Filed: |
July 2, 2004 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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10884491 |
Jul 2, 2004 |
|
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10441615 |
May 20, 2003 |
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6775127 |
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Current U.S.
Class: |
361/508 |
Current CPC
Class: |
H01G 9/052 20130101 |
Class at
Publication: |
361/508 |
International
Class: |
H01G 009/00; H01G
009/04 |
Foreign Application Data
Date |
Code |
Application Number |
May 22, 2002 |
JP |
147505/2002 |
Claims
What is claimed is:
1. An anode member for a solid electrolytic capacitor, said anode
member comprising: a thin plate made of a valve metal; and a
sintered member formed on the thin plate by sintering a powder
layer of a valve metal powder; wherein the sintered member
comprises a sintered product of a powder mixture including a
plurality of powders which are different in sinterability.
2. The anode member according to claim 1, wherein the plurality of
powders are produced from different raw material metals and are
equal in average particle size.
3. The anode member according to claim 2, wherein the plurality of
powders includes a first powder and a second powder; wherein the
first powder is a powder of a first valve metal having a
predetermined melting point, and the second powder is produced from
a different raw material metal than the first powder and is equal
to the first powder in average particle size.
4. The anode member according to claim 2, wherein the valve metal
of the thin plate is made from a same raw material metal as one of
the plurality of powders of the sintered member which has a
greatest sinterability.
5. The anode member according to claim 1, wherein: the thin plate
comprises a first valve metal having a predetermined melting point;
and the plurality of powders comprises: (i) a first powder which is
a powder of a second valve metal having a melting point higher than
the melting point of the first valve metal, and (ii) a second
powder which is a powder of the second valve metal and which is
greater in average particle size than the first powder.
6. The anode member as claimed in claim 3, wherein the first powder
is Nb and the second powder is Ta.
7. The anode member as claimed in claim 5, wherein the first valve
metal is Nb and the second valve metal is Ta.
8. The anode member as claimed in claim 1, wherein the sintered
member comprises a first layer of a first valve metal powder and a
second layer of a second valve metal powder.
9. A method of producing an anode member for a solid electrolytic
capacitor, said method comprising: forming a powder layer on a
valve metal thin plate, the powder layer being made of a valve
metal powder comprising a plurality of powders which are different
in sinterability; and sintering the thin plate and the powder
layer.
10. The method as claimed in claim 9, wherein forming the powder
layer comprises: forming a first layer of a first powder on the
valve metal thin plate, the first powder being a powder of a valve
metal; forming a second layer of a second powder on the first
layer, the second powder being produced from a same raw material
metal as the first powder and being greater in average particle
size than the first powder; and sintering the thin plate, the first
layer, and the second layer.
11. The method as claimed in claim 9, wherein forming the powder
layer comprises: forming a first layer of a first powder on the
valve metal thin plate, the first powder being a powder of a first
valve metal having a predetermined melting point; forming a second
layer of a second powder on the first layer, the second powder
being a powder of a second valve metal having a melting point
higher than the melting point of the first valve metal and having
an average particle size equal to an average particle size of the
first powder; and sintering the thin plate, the first layer, and
the second layer.
12. The method as claimed in claim 9, wherein forming the powder
layer comprises: forming a layer of a powder mixture, including a
first powder and a second powder, on a valve metal thin plate, the
first powder being a powder of a first valve metal having a
predetermined melting point, and the second powder being a powder
of a second valve metal having a melting point higher than the
melting point of the first valve metal and having an average
particle size equal to an average particle size of the first
powder; and sintering the thin plate and the layer of the powder
mixture.
13. The method as claimed in claim 9, wherein forming the powder
layer comprises: forming a powder mixture, including a first powder
and a second powder, on a thin plate of a first valve metal having
a predetermined melting point, the first powder being a powder of a
second valve metal having a melting point higher than the melting
point of the first valve metal, and the second powder being a
powder of the second valve metal and having an average particle
size greater than an average particle size of the first powder; and
sintering the thin plate and the layer of the powder mixture.
14. The method as claimed in claim 11, wherein Nb is the first
valve metal and Ta is the second valve metal.
15. The method as claimed in claim 9, wherein forming the powder
layer comprises: forming a first layer of a first powder on the
valve metal thin plate, the first powder being a powder of a valve
metal; forming a second layer of a second powder on the first
layer, the second powder being produced from a same raw material
metal as the first powder and having an average particle size
greater than an average particle size of the first powder, and the
second layer being thicker than the first layer; and sintering the
thin plate, the layer of the first powder, and the layer of the
second powder.
16. The method as claimed in claim 12, wherein Nb is the first
valve metal and Ta is the second valve metal.
17. The anode member as claimed in claim 13, wherein Nb is the
first valve metal and Ta is the second valve metal.
Description
CROSS REFERENCE TO RELATED APPLICATION
[0001] The present application is a Division of U.S. application
Ser. No. 10/441,615, filed May 20, 2003.
BACKGROUND OF THE INVENTION
[0002] This invention claims priority to prior Japanese patent
application JP 2002-147505, the disclosure of which is incorporated
herein by reference.
[0003] This invention relates to an anode member for a solid
electrolytic capacitor, a method of producing the same, and a solid
electrolytic capacitor using the same and, in particular, to a flat
anode member including a thin plate of a valve metal as an anode
lead and a sintered member laminated thereon, a method of producing
the same, and a solid electrolytic capacitor using the same.
[0004] There is known a solid electrolytic capacitor including an
anode including a sintered member formed by sintering a powder of a
valve metal such as tantalum (Ta); Typically, the sintered member
has a cylindrical shape such as a circular cylinder or a
rectangular cylinder. For convenience of description, the capacitor
of the type will be referred to as a cylindrical element capacitor.
On the other hand, Japanese Unexamined Patent Publication No.
S59-219923 (JP 59-219923 A) discloses a capacitor using a sintered
member of a flat structure. The capacitor includes a thin plate
(foil) of a valve metal and a layered sintered member laminated on
the thin plate. For convenience of description, the capacitor of
the type will be referred to as a foil element capacitor. This
invention relates to the sintered member of the foil element
capacitor. Hereinafter, the foil element capacitor will be
described in conjunction with a tantalum solid electrolytic
capacitor by way of example. It is well known that, in a solid
electrolytic capacitor using a sintered member formed by sintering
a powder of a valve metal, the sintered member electrically serves
as an anode of the capacitor. In this connection, the thin plate of
the valve metal and the sintered member formed thereon may
collectively be called an anode member in the following
description. Japanese Unexamined Patent Publication No. 2002-50550
(JP 2000-50550 A) discloses a method of producing an anode element
for a tantalum electrolytic capacitor, in which a paste containing
metal powder is applied or printed to form an anode element.
[0005] Referring to FIG. 1A, a related tantalum foil element solid
electrolytic capacitor will be described. The related tantalum foil
element solid electrolytic capacitor includes a tantalum foil 1,
i.e., a foil of a tantalum metal and a layered sintered member 2
obtained by sintering a tantalum powder as a material powder and
laminated on the tantalum foil 1. The layered sintered member 2 of
the tantalum powder has small pores formed by sintering and
interconnected in a complicated manner. Therefore, the layered
sintered member 2 has a very large surfaced area. As described
above, the sintered member 2 serves as an anode. On an outer
surface of the sintered member 2 and on inner walls of the small
pores, a tantalum oxide (Ta.sub.2O.sub.5) film (not shown) is
formed. The tantalum oxide film serves as a dielectric member of
the capacitor. On the tantalum oxide film, a solid electrolyte
layer (not shown) is formed. The solid electrolyte layer serves as
a cathode of the capacitor. A combination of the sintered member 2
as the anode, the tantalum oxide film as the dielectric member, and
the solid electrolyte layer as the cathode forms a fundamental
structure of the capacitor.
[0006] On the solid electrolyte layer, a conductive substance layer
(cathode conductor layer) is formed although not shown in the
figure. The cathode conductor layer includes a plurality of layers,
for example, a graphite layer and a silver paste layer,
successively laminated. To the outermost layer of the cathode
conductor layer, a cathode-side terminal (external cathode
terminal) 3 for electrical connection to an external circuit is
fixedly attached. On the other hand, the tantalum foil 1 partially
has an exposed surface on which the sintered member 2 is not
formed, as shown at a left side in the figure. To the exposed
surface, an anode-side terminal (external anode terminal) 4 for
electrical connection to the external circuit is fixedly
attached.
[0007] An outer resin member 5, for example, made of epoxy resin
covers the tantalum foil 1, the layered sintered member 2, and the
external cathode and the external anode terminals 3 and 4 except a
part of each of the external cathode and the external anode
terminals 3 and 4. The part of each of the external cathode and the
external anode terminals 3 and 4 led out of the outer resin member
5 is shaped and bent to extend at first along a side wall and then
along a bottom surface of the outer resin member 5.
[0008] In the foil element solid electrolytic capacitor having the
above-mentioned structure, the tantalum foil 1 serves to
electrically connect the sintered member 2 as the anode of the
capacitor and the external anode terminal 4. Thus, the tantalum
foil 1 corresponds to a tantalum wire well known as a so-called
"anode lead" in the cylindrical element solid electrolytic
capacitor and planted to the cylindrical sintered member.
[0009] The tantalum foil element solid electrolytic capacitor
mentioned above is generally produced in the following manner. At
first, a tantalum powder (a powder of a tantalum metal), a solvent,
and a binder are mixed to form a tantalum powder paste. The solvent
and the binder are appropriately selected with respect to each
other. For example, a water soluble binder is selected for use with
a water-based solvent.
[0010] Next, on the tantalum foil 1 separately prepared, the
tantalum powder paste is printed to form a tantalum powder layer.
As a printing mask, a screen mask or a metal mask may be used. In
order to reduce a printing thickness, the screen mask is
preferable. In order to increase the printing thickness, the metal
mask is appropriate.
[0011] Then, the tantalum foil 1 with the tantalum powder layer
formed thereon is sintered in a high vacuum of, for example, about
10.sup.-6 Torr at a temperature lower than the melting point of the
tantalum metal, for example, at a high temperature between about
1300.degree. C. and about 1600.degree. C. Thus, an anode member is
obtained.
[0012] Thereafter, in the manner similar to the production of the
cylindrical element solid electrolytic capacitor, the tantalum
oxide film as a dielectric film, the solid electrolyte layer, and
the cathode conductor layer are formed then, the external cathode
and the external anode terminals 3 and 4 are fixedly attached and
electrically connected. Furthermore, the outer resin member 5 is
formed and the external cathode and the external anode terminals 3
and 4 are shaped.
[0013] Specifically, on the inner and the outer surfaces of the
anode member obtained by the above-mentioned sintering, a tantalum
oxide (Ta.sub.2O.sub.5) film, i.e., a thin film of oxide of the
tantalum metal as a raw material of the sintered member 2 is formed
by anodic oxidation well known in the art. Furthermore, on the
tantalum oxide film, the solid electrolyte layer is formed. As a
solid electrolyte, use may be made of manganese dioxide obtained by
thermal decomposition of manganese nitrate or a conductive polymer
such as polypyrrole. In recent years, the conductive polymer is
increasingly used as the solid electrolyte because the conductive
polymer is smaller in intrinsic resistance so that the capacitor is
reduced in equivalent series resistance (ESR) and because a heat
insulating reaction is quick so that the capacitor hardly emit
smoke or catch fire.
[0014] Following the formation of the solid electrolyte layer, the
cathode conductor layer is formed. Generally, the cathode conductor
layer has a laminate structure including the graphite layer formed
on the solid electrolyte layer and the silver paste layer formed on
the graphite layer. The cathode conductor layer serves to
electrically connect the solid electrolyte layer and the external
cathode terminal 3. Furthermore, the cathode conductor layer also
serves to protect the dielectric film by relaxing the stress which
would be produced during formation of the outer resin member 5 in
the subsequent production process and upon mounting the capacitor
after it is completed. Between the step of forming the solid
electrolyte layer and the step of forming the cathode conductor
layer, the tantalum oxide film may be re-formed if necessary. Such
re-formation is intended to repair a minor defect caused in the
tantalum oxide film due to mechanical and chemical stresses
produced during formation of the solid electrolyte layer to thereby
achieve a more stable characteristic of the capacitor. The
re-formation is carried out in the manner substantially similar to
the formation of the tantalum oxide film mentioned above.
Specifically, the anode member is again applied with an electric
voltage in an electrolyte solution.
[0015] After formation of the cathode conductor layer, the external
cathode terminal 3 is fixedly attached and electrically connected
to the cathode conductor layer, for example, by adhesion using a
conductive adhesive. To the exposed surface of the tantalum foil 1
which is not covered with the sintered member 2, the external anode
terminal 4 is fixedly attached by welding or the like.
[0016] Finally, the outer resin member 5 is formed by transfer
molding using thermosetting resin such as epoxy resin. The external
cathode and the external anode terminals 3 and 4 are shaped as
mentioned above. Thus, the related tantalum foil element solid
electrolytic capacitor illustrated in FIG. 1A is completed.
[0017] As compared with the cylindrical element solid electrolytic
capacitor, the above-mentioned foil element solid electrolytic
capacitor is advantageous in the following respects. Specifically,
the thickness of the anode member can easily be reduced so that the
capacitor can advantageously be reduced in thickness and size.
Since a contact area between the tantalum foil 1 as the anode lead
and the layered sintered member 2 as the anode is increased and the
resistance therebetween is reduced, the ESR of the capacitor can be
lowered.
[0018] The related foil element solid electrolytic capacitor
illustrated in FIG. 1A has a characteristic which will presently be
described.
[0019] Referring to FIG. 1B, illustration is made of a related
tantalum foil-type anode member used in the capacitor illustrated
in FIG. 1A. The layered sintered member 2 of the anode member has a
structure shown in an enlarged view encircled by a broken line.
Specifically, the layered sintered member 2 is made of a single
kind of material powder which is prepared from a single kind of
metal (tantalum in the illustrated example) and which has a single
kind of average particle size. The thin plate of the valve metal
(tantalum foil 1 in the illustrated example) serving as the anode
lead is made of a metal (tantalum in the illustrated example) same
as a raw metal material of the material powder of the sintered
member 2.
[0020] As compared with the cylindrical element solid electrolytic
capacitor, the foil element solid electrolytic capacitor has the
above-mentioned advantages. On the other hand, the foil element
solid electrolytic capacitor is disadvantageous in that production
is difficult as compared with the cylindrical element solid
electrolytic capacitor. Hereinafter, the disadvantage will be
described.
[0021] As described above, the anode member of a foil type is
obtained by depositing (for example, by printing) the tantalum
powder paste on the tantalum foil 1 as the valve metal to form the
tantalum powder layer and then sintering the tantalum powder
layer.
[0022] In the meanwhile, sinterability upon sintering a metal
powder, i.e., the degree of coupling or adhesion between particles
forming the powder or the degree of growth of the particles is
widely different depending upon locations of the particles.
Specifically, the sinterability at a boundary between the particles
is different from the sinterability at an interface between the
particles and a macroscopic metal object such as a metal foil or a
metal plate. It is known that, even at a same temperature,
sintering is quick at the interface between the particles while the
growth or the adhesion of the particles is difficult or slow
between the particles and the metal foil. It is assumed here that,
in the related foil type anode member illustrated in FIG. 1B, the
sintering temperature is determined focusing upon the porosity of
the sintered member 2. Then, an excellent sintered condition is
obtained in a region occupied by the tantalum powder (a main body
of the sintered member 2). On the other hand, at the interface
between the tantalum foil 1 and the sintered member 2, sintering is
insufficient so that adhesion or bond between the sintered member 2
and the tantalum foil 1 is weak. During handling in a production
process, the sintered member 2 may often be separated or released
from the tantalum foil 1. In addition, the capacitor is
deteriorated in leakage current characteristic.
[0023] In order to avoid occurrence of the above-mentioned trouble
during the production process and the deterioration in
characteristic of the capacitor as a result of focusing upon the
porosity of the sintered member 2, the sintering temperature is
elevated so as to enhance the adhesion or the bond at the interface
between the tantalum foil 1 and the powder layer (sintered member
2). In this event, however, over-sintering occurs in the main body
of the sintered member 2 so that the porosity is lost and the
capacitance of the capacitor per unit weight is decreased. Such
over-sintering of the sintered member 2 results in deformation,
such as warp, of the anode member and easy occurrence of shape
error.
[0024] On the other hand, the cylindrical anode member does not use
the foil but uses a metal wire as the anode lead. In the
cylindrical anode member, the anode lead is enclosed in the
tantalum powder. In addition, the tantalum powder is pressed and
formed into a cylindrical body by compression molding under
pressure. Therefore, contact between the anode lead and the
tantalum powder is enhanced. Thus, at an initial stage prior to
sintering, the bond between the anode lead and the tantalum powder
is already strengthened. From the above-mentioned reasons, strong
bond is achieved between the anode lead and the sintered member as
compared with the foil-type electrode member even if the sintering
is carried out at the temperature determined focusing upon the
porosity, i.e., at a relatively low temperature.
SUMMARY OF THE INVENTION
[0025] Therefore, it is an object of this invention to provide a
foil-type anode member for a solid electrolytic capacitor, which
includes a thin plate of a valve metal as an anode lead and a
layered sintered member obtained by forming on the thin plate a
powder layer of a valve metal powder as a material powder to be
sintered and then sintering the powder layer and which is improved
in bonding strength between the sintered member and the thin plate
as the anode lead in case where sintering is carried out at a
temperature suitable for porosity of the sintered member.
[0026] According to this invention, there is provided an anode
member for a solid electrolytic capacitor, comprising a thin plate
of a valve metal and a layered sintered member obtained by forming
on the thin plate a powder layer of a valve metal powder as a
material powder to be sintered and then sintering the powder layer,
wherein the layered sintered member has a multi-layer structure
including a plurality of sintered layers different in material
powder and in sintered condition.
[0027] In the layered sintered member having a multi-layer
structure, the sintered layers include a heavily-sintered layer and
a lightly-sintered layer as a lower layer and an upper layer,
respectively.
BRIEF DESCRIPTION OF THE DRAWINGS
[0028] FIG. 1A is a sectional view of a related tantalum foil
element solid electrolytic capacitor;
[0029] FIG. 1B is a view showing a related tantalum foil-type anode
member used in the capacitor illustrated in FIG. 1A;
[0030] FIG. 2 is a sectional view of a tantalum foil-type anode
member according to a first embodiment of this invention;
[0031] FIG. 3A shows an image of a SEM photograph of a sintered
member in the tantalum foil-type anode member illustrated in FIG.
2;
[0032] FIG. 3B shows an image of a SEM photograph of a sintered
member in the related tantalum foil-type anode member illustrated
in FIG. 1B;
[0033] FIG. 4 is a sectional view of a tantalum foil-type anode
member according to a second embodiment of this invention;
[0034] FIG. 5 is a sectional view of a tantalum foil-type anode
member according to a third embodiment of this invention; and
[0035] FIG. 6 is a sectional view of a tantalum foil-type anode
member according to a fourth embodiment of this invention.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0036] Next, description will be made of several embodiments of
this invention with reference to the drawing.
[0037] Referring to FIG. 2, a tantalum foil-type anode member
according to a first embodiment of this invention includes a
tantalum foil 1 and a sintered member 2A formed thereon. The
foil-type anode member in this embodiment is different in structure
from the related foil-type anode member illustrated in FIG. 1B in
the following respects. The sintered member 2A has a two-layer
structure including a first or lower sintered layer 2A.sub.1 and a
second or upper sintered layer 2A.sub.2 formed thereon. The first
and the second sintered layers 2A.sub.1 and 2A.sub.2 are different
in material powder. Specifically, the first and the second sintered
layers 2A.sub.1 and 2A.sub.2 are similar to each other in that a
tantalum powder is used as the material powder but are different
from each other in average particle size of the material
powder.
[0038] The present inventor prepared a tantalum foil element solid
electrolytic capacitor using the foil-type anode member according
to the first embodiment. A production process of the capacitor is
generally similar to that of the related tantalum foil element
solid electrolytic capacitor but is different in a part related to
production of the anode member. The different part will hereinafter
be described in detail.
[0039] At first, preparation was made of two kinds of pastes each
of which contained a tantalum powder, i.e., a powder of a tantalum
metal. The two pastes were different in average particle size of
the tantalum powder contained therein. One of the paste included
the tantalum powder having an average particle size of 1.0 .mu.m
while the other paste included the tantalum powder having an
average particle size of 0.3 .mu.m. In this embodiment, each paste
was prepared by diluting an acrylic binder with toluene to obtain
an organic binder solution and adding the organic binder solution
to each of the two kinds of tantalum powders. In each of the
pastes, the amount of the binder was equal to 10% with respect to
the weight of the powder and the amount of toluene was adjusted so
that the viscosity of the paste falls within a range of
15000.+-.1000 mPa.multidot.s. Hereinafter, the paste including the
tantalum powder having an average particle size of 1.0 .mu.m will
be referred to as a paste T(1.0) while the paste including the
tantalum powder having an average particle size of 0.3 .mu.m will
be referred to as a paste T(0.3).
[0040] Next, on the tantalum foil 1 separately prepared, the paste
T(0.3) of the tantalum powder smaller in average particle size was
printed as a first layer by the use of a screen mask so that the
thickness after drying would be equal to 8 m. Then, the paste was
dried in a vacuum at a temperature of 85.degree. C. for 30 minutes.
Thereafter, on the above-mentioned paste T(0.3) printed as
mentioned above, the paste T(1.0) of the tantalum powder greater in
average particle size was printed as a second layer by the use of a
metal mask so that the thickness after drying would be equal to 200
.mu.m. Then, the paste was dried in a vacuum at a temperature of
85.degree. C. for 30 minutes, like in the first layer.
[0041] The tantalum foil 1 with the above-mentioned two tantalum
powder layers formed thereon was sintered in a vacuum of 10.sup.-6
Torr at a temperature of 1400.degree. C. for 30 minutes. Thus, the
foil-type anode member illustrated in FIG. 2 was obtained.
[0042] Thereafter, the anode member having the two-layer structure
was subjected to formation of the tantalum oxide film by anodic
oxidation, formation of the solid electrolyte layer, and
re-formation of the tantalum oxide film. These steps were carried
out in the manner similar to those in the production process of the
related foil element solid electrolytic capacitor. The producing
conditions were as follows. The anodic oxidation was carried out by
the use of a 0.6% phosphoric acid aqueous solution as an
electrolyte solution at a voltage of 16V. Polypyrrole was used as
the solid electrolyte. For the re-formation, a 0.1% phosphoric acid
aqueous solution was used and a voltage of 16V was applied.
[0043] Thereafter, in the manner similar to the production process
of the related foil element solid electrolytic capacitor, formation
of a cathode conductor layer, formation of external cathode and
external anode terminals (3 and 4 FIG. 1A), formation of an outer
resin member (5 in FIG. 1A) were carried out to complete the
tantalum foil element solid electrolytic capacitor in this
embodiment. During the production process, separation or release of
the sintered member 2A did not occur. The capacitor completed as
mentioned above had an excellent leakage current
characteristic.
[0044] For comparison, the related foil-type anode member
illustrated in FIG. 1B was prepared by the use of the
above-mentioned paste T(1.0) of the tantalum powder having an
average particle size of 1.0 .mu.m. In the related foil-type anode
member, the sintered member 2 had a single-layer structure and a
thickness of 200, m. Sintering was carried out at a temperature of
1550.degree. C. in order to prevent separation of the tantalum foil
1 and the sintered member 2.
[0045] FIG. 3A shows a scanning electron micrograph (SEM) of the
upper sintered layer 2A.sub.2 in the foil-type anode member
according to the first embodiment. FIG. 3B shows a SEM of the
sintered layer 2 of the related foil-type anode member. In both of
the sintered member 2A of the anode member according to the first
embodiment and the sintered member 2 of the related anode member,
separation or release of the sintered member from the tantalum foil
1 or deformation of the anode member was not observed. Comparing
these SEMs, however, the sintered member 2 prepared by the known
technique was over-sintered. As illustrated in FIG. 3B, the powder
was melted to grow into large massive particles so that the
porosity is decreased. On the other hand, in the anode member
according to the first embodiment, a sufficient gap is kept between
adjacent particles in the upper sintered layer 2A.sub.2 so that
excellent porosity is maintained. This is because, although the
tantalum powder having an average particle size of 1.0, m is used
in both of the upper sintered layer 2A.sub.2 in the anode member of
the first embodiment and the sintered member 2 in the related anode
member, the sintering temperature is 1400.degree. C. in the anode
member of the first embodiment and the sintering temperature is as
high as 1550.degree. C. in the related anode member.
[0046] For the tantalum powder having an average particle size of
1.0 .mu.m, the sintering temperature of 1400.degree. C. provides a
sintered condition favorable in view of the porosity. Therefore, in
the first embodiment in which the sintering was carried out at
1400.degree. C., the upper sintered layer 2A.sub.2 using the paste
T(1.0) exhibited good porosity. On the other hand, the lower
sintered layer 2A.sub.1 using the paste T(0.3) was over-sintered.
Generally, the sinterability of metal powder depends upon the size
of powder particles. Even at the same sintering temperature, the
powder smaller in particle size is highly sintered as compared with
the powder greater in particle size. As a result, bonding strength
between the lower sintered layer 2A.sub.1 and the tantalum foil 1
is greater than that which would be obtained if the upper sintered
layer 2A.sub.2 greater in average particle size is in direct
contact with to the tantalum foil 1.
[0047] The lower sintered layer 2A.sub.1 over-sintered is very thin
as compared with the upper sintered layer 2A.sub.2. Therefore,
over-sintering stays in a restricted area (i.e., the lower sintered
layer 2A.sub.1) between the tantalum foil 1 and the upper sintered
layer 2A.sub.2 and does not spread to the upper sintered layer
2A.sub.2 Thus, the upper sintered layer 2A.sub.2 as a main factor
exhibiting the capacitance is sintered into a proper sintered
condition. In addition, strong bond with the tantalum foil 1 is
assured by the lower sintered layer 2A.sub.1 in an over-sintered
condition interposed between the tantalum foil 1 and the upper
sintered layer 2A.sub.2 so that separation is prevented to
occur.
[0048] On the other hand, if the sintering temperature in the
related anode member is changed to 1400.degree. C. equal to that in
the anode member of the first embodiment, the sintered member 2
having a single-layer structure including the layer of the past
T(1.0) alone has a desired sintered condition in its main body in
view of the porosity. However, at the interface between the
tantalum foil 1 and the sintered member 2, adhesion and bond
therebetween do not make sufficient progress so that the sintered
member 2 is easily separated from the tantalum foil 1. If the
sintering temperature is elevated to 1550.degree. C. in order to
prevent such separation of the sintered layer 2, the main body of
the sintered member 2 is over-sintered as shown in the SEM
photograph in FIG. 3B so that the porosity is decreased.
[0049] In the first embodiment, the sintered member 2A has a
double-layer structure including the lower and the upper sintered
layers 2A.sub.1 and 2A.sub.2 different in sintered condition and
the lower sintered layer 2A.sub.1 in direct contact with the
tantalum foil 1 is highly sinterable. With this structure, the main
body of the sintered member 2A has good porosity while the bonding
strength between the tantalum foil 1 and the sintered member 2A is
increased.
[0050] In the first embodiment mentioned above, the two sintered
layers are same in raw material metal of the material powder but
are different in average particle size of the material powder so as
to exhibit different sintered conditions. It is noted here that the
difference in sintered condition can be exhibited if the two
sintered layers are equal in average particle size of the material
powder to each other but are different in valve metal as the raw
material metal from each other, as will be described in the
following.
[0051] Referring to FIG. 4, a foil-type anode member according to a
second embodiment of this invention includes a tantalum foil 1 and
a sintered member 2B formed thereon. The sintered member 2B has a
double-layer structure including lower and upper sintered layers
2B.sub.1 and 2B.sub.2. The lower sintered layer 2B.sub.1 includes a
sintered product of a niobium powder, i.e., a powder of a niobium
metal (Nb) while the upper sintered layer 2B.sub.2 includes a
sintered product of a tantalum powder, i.e., a powder of a tantalum
metal (Ta). The second embodiment is different from the first
embodiment in that the upper and the lower sintered layers are
different in metal species and that the average particle size of
the niobium powder is equal to that of the tantalum powder as shown
in enlarged views encircled by broken lines in FIG. 4.
[0052] The present inventor prepared a tantalum foil element solid
electrolytic capacitor using the anode member according to the
second embodiment. A production process of the capacitor is
generally similar to that in the first embodiment but is different
in a part related to production of the anode member. The different
part will hereinafter be described in detail.
[0053] At first, preparation was made of two kinds of pastes one of
which contained a tantalum powder, i.e., a powder of a tantalum
metal and the other of which contained a niobium powder, i.e., a
powder of a niobium metal. In the two pastes, the powders contained
therein were produced from different raw material metals but were
equal in average particle size to each other, i.e., equal to 1.0
.mu.m. An organic binder solution was prepared by diluting an
acrylic binder with toluene and added to each of the tantalum
powder and the niobium powder to form a paste. The paste using the
tantalum powder was same as the paste T(1.0) in the first
embodiment. In the paste using the niobium powder, the amount of
the binder was equal to 5% with respect to the weight of the powder
and the amount of toluene was adjusted so that the viscosity of the
paste was equal to that of the paste T(1.0) of the tantalum powder.
Hereinafter, the paste of the niobium powder will be referred to as
a paste N(1.0).
[0054] Next, on the tantalum foil 1 separately prepared the paste
N(1.0) of the niobium powder was printed as a first layer by the
use of a screen mask so that the thickness after drying would be
equal to 8 .mu.m. Then, the paste was dried in vacuum at a
temperature of 85.degree. C. for. 30 minutes. Thereafter, on the
above-mentioned paste N(1.0) printed as mentioned above, the paste
T(1.0) of the tantalum powder was printed as a second layer by the
use of a metal mask so that the thickness after drying would be
equal to 200 .mu.m. Then, the paste was dried in vacuum at a
temperature of 85.degree. C. for 30 minutes, like in the first
layer.
[0055] The tantalum foil 1 with the first and the second layers of
the niobium powder and the tantalum powder formed thereon was
sintered in a vacuum of 10.sup.-6 Torr at a temperature of
1400.degree. C. for 30 minutes. Thus, the foil-type anode member
illustrated in FIG. 4 was obtained.
[0056] Thereafter, in the conditions same as those in the first
embodiment, the foil-type anode member thus obtained was subjected
to formation of a tantalum oxide film by anodic oxidation,
formation of a solid electrolyte layer, formation of a cathode
conductor layer, connection of external cathode and external anode
terminals, formation of an outer resin member, and shaping of the
external terminals to complete the tantalum foil element solid
electrolytic capacitor according to the second embodiment. During
production, separation between the tantalum foil 1 and the sintered
member 2B was not observed. The capacitor had an excellent leakage
current characteristic.
[0057] The reason is as follows. The niobium metal has a melting
point of 2470.degree. C. which is lower than that (2996.degree. C.)
of the tantalum metal. Therefore, when the tantalum powder and the
niobium powder having the same average particle size are sintered
at the same sintering temperature, the niobium powder is rapidly
sintered as compared with the tantalum powder. Sintering at
1400.degree. C. which is appropriate for the tantalum powder having
an average particle size of 1.0 .mu.m (in order to provide good
porosity) brings about an over-sintered condition for the niobium
powder. In the second embodiment, over-sintering in the lower
sintered layer 2B.sub.1 of the niobium powder in direct contact
with the tantalum foil 1 serves to increase bonding strength
between the tantalum foil 1 and the sintered member 2B, like the
over-sintering in the lower sintered layer 2A.sub.1 of the tantalum
powder smaller in average size in the first embodiment.
[0058] In each of the first and the second embodiments, the
sintered member has a double-layer structure including two sintered
layers different in sintered condition. Alternatively, a mixture of
two kinds of powders different in sinterability may be used as a
raw material powder to be sintered. In this case also, good
porosity is kept and bonding strength between the sintered member
and the tantalum foil can be improved.
[0059] Referring to FIG. 5, a foil-type anode member according to a
third embodiment of this invention includes a tantalum foil 1 and a
sintered member 2C formed thereon. The foil-type anode member in
this embodiment is different from the first and the second
embodiments in the following respect. Specifically, the sintered
member 2C has a single-layer structure and is made from a material
powder which is a mixture of a tantalum powder and a niobium powder
equal in average particle size as shown in an enlarged view
encircled by a broken line in FIG. 5.
[0060] A tantalum foil element solid electrolytic capacitor using
the anode member according to the third embodiment was prepared in
the following manner. At first, preparation was made of a powder
mixture of a tantalum powder having an average particle size of 1.0
.mu.m and a niobium powder having an average particle size of 1.0
.mu.m. The ratio of the tantalum powder and the niobium powder is
9:1 in weight ratio. The powder mixture, a solvent, and a binder
were mixed into a paste. The amount of the binder was 10% with
respect to the weight of the powder mixture. The amount of toluene
was adjusted so that the viscosity of the paste falls within a
range of 15000.+-.1000 mPa.multidot.s.
[0061] Next, on the tantalum foil 1, the paste of the powder
mixture was printed by the use of a metal mask so that the
thickness after drying would be equal to 200 u m. Then, the paste
was dried at a temperature of 85.degree. C. for 30 minutes.
[0062] Thereafter, in the manner similar to the first and the
second embodiments, sintering was carried out in a vacuum of
10.sup.-6 Torr at a temperature of 1400.degree. C. for 30 minutes.
Thus, the foil-type anode member illustrated in FIG. 5 was
obtained.
[0063] Thereafter, in the conditions same as those in the first and
the second embodiments, the foil-type anode member thus obtained
was subjected to formation of a tantalum oxide film by anodic
oxidation, formation of a solid electrolyte layer, formation of a
cathode conductor layer, connection of external cathode and
external anode terminals, formation of an outer resin member, and
shaping of the external terminals to complete the tantalum foil
element solid electrolytic capacitor according to the third
embodiment. During production, separation between the tantalum foil
1 and the sintered member 2C was not observed. The capacitor had an
excellent leakage current characteristic.
[0064] The third embodiment is different from the second embodiment
in that sintered particles of the niobium powder greater in
sinterability are uniformly distributed among sintered particles of
the tantalum powder smaller in sinterability. Niobium particles in
contact with the tantalum foil 1 exhibit over-sinterability to
promote adhesion and bond with the tantalum foil 1 so that the
effect similar to that in the first or the second embodiment is
achieved. However, as compared with the fist and the second
embodiments, the number of particles of the over-sinterable powder
(i.e., the niobium powder) present at and around an interface with
the tantalum foil 1 is reduced. Correspondingly, the effect of
improving the bonding strength between the sintered member 2C and
the tantalum foil 1 is decreased to some extent. In addition, the
niobium particles are distributed throughout a main body of the
sintered member 2C so that over-sintering occurs also in the main
body of the sintered member 2C to sacrifice the capacitance of the
capacitor to some extent. Thus, the foil-type anode member
according to the third embodiment is not equivalent in effect to
that according to the first or the second embodiment. However, the
third embodiment requires only one kind of paste and only one
printing step to print the paste. Therefore, the production process
is simplified. Thus, the third embodiment is superior to the first
or the second embodiment in view of the production.
[0065] Referring to FIG. 6, a foil-type anode member according to a
fourth embodiment of this invention is a modification of the third
embodiment. The foil-type anode member according to the fourth
embodiment includes a niobium foil 10 and a sintered member 2D
formed thereon. The sintered member 2D has a single-layer structure
including a mixture of two kinds of sintered particles of material
powders different in sinterability, like in the third embodiment.
However, this embodiment is different from the third embodiment in
that the two kinds of material powders different in sinterability
are made of a same valve metal (tantalum) but are different in
average particle size. Unlike any of the first through the third
embodiments, the foil 10 as an anode lead is not made of tantalum
used in the foregoing embodiments but is made of a niobium
metal.
[0066] A tantalum foil element solid electrolytic capacitor using
the anode member according to the fourth embodiment was prepared in
the following manner. At first, preparation was made of a powder
mixture of a tantalum powder having an average particle size of
1.0, m and another tantalum powder having an average particle-size
of 0.3 .mu.m. The ratio of the tantalum powder having an average
particle size of 1.0, m and the tantalum powder having an average
particle size of 0.3, m is 9:1 in weight ratio. The powder mixture,
a solvent, and a binder were mixed into a paste. The amount of the
binder was 10% with respect to the weight of the powder mixture.
The amount of toluene was adjusted so that the viscosity of the
paste falls within a range of 15000.+-.1000 mPa.multidot.s.
[0067] Thereafter, like in the third embodiment, the paste of the
powder mixture was printed on the niobium foil 1 by the use of a
metal mask so that the thickness after drying would be equal to 200
.mu.m. Then, the paste was dried at a temperature of 85.degree. C.
for 30 minutes.
[0068] Furthermore, in the manner similar to the third embodiment,
sintering was carried out in a vacuum of 10.sup.-6 Torr at a
temperature of 1400.degree. C. for 30 minutes. Thus, the foil-type
anode member illustrated in FIG. 6 was obtained.
[0069] Thereafter, in the conditions same as those in the first
through the third embodiments, the foil-type anode member thus
obtained was subjected to formation of a tantalum oxide film by
anodic oxidation, formation of a solid electrolyte layer, formation
of a cathode conductor layer, connection of external cathode and
external anode terminals, formation of an outer resin member, and
shaping of the external terminals to complete the tantalum foil
element solid electrolytic capacitor according to the fourth
embodiment. During production, separation between the tantalum foil
1 and the sintered member 2D was not observed. The capacitor had an
excellent leakage current characteristic.
[0070] In the fourth embodiment, particles of the tantalum powder
having an average particle size of 0.3 .mu.m and distributed in the
sintered member 2D at and around an interface with the niobium foil
10 serve to strengthen the bond between the sintered member 2D and
the niobium foil 10. Since the foil 10 is made of the niobium metal
having a melting point lower than that of the tantalum metal, the
adhesion and the bond between the foil 10 and the sintered member
2D are strengthened in this respect also.
[0071] As described above, in the anode member for a solid
electrolytic capacitor including a thin plate of a valve metal as
an anode lead and a layered sintered member formed thereon and
obtained by forming a layer of a valve metal powder as a material
powder to be sintered and then sintering the powder layer, it is
possible according to this invention to increase the bonding
strength between the sintered member and the thin plate of the
valve metal in case where sintering is carried out at an
appropriate temperature in view of the porosity of the sintered
member.
* * * * *