U.S. patent application number 10/878607 was filed with the patent office on 2004-11-18 for semiconductor encapsulant resin having an additive with a gradient concentration.
This patent application is currently assigned to CANON KABUSHIKI KAISHA. Invention is credited to Kataoka, Ichiro, Kiso, Shigeo, Shiotsuka, Hidenori, Yamada, Satoru, Zenko, Hideaki.
Application Number | 20040229404 10/878607 |
Document ID | / |
Family ID | 26382651 |
Filed Date | 2004-11-18 |
United States Patent
Application |
20040229404 |
Kind Code |
A1 |
Kiso, Shigeo ; et
al. |
November 18, 2004 |
Semiconductor encapsulant resin having an additive with a gradient
concentration
Abstract
Provided is an encapsulant resin for a semiconductor that
effectively functions even with a relatively small amount of an
additive. The encapsulant resin for a semiconductor is
characterized in that the additive has a concentration gradient in
the direction of thickness of the encapsulant resin. Specifically,
the concentration gradient of the additive is established in the
direction of thickness of the encapsulant resin by stacking at
least two types of organic polymer resins containing different
contents of the additive to form the encapsulant resin or by
applying an electric field to the encapsulant resin to effect
electrophoresis of the polar additive in the encapsulant resin.
Inventors: |
Kiso, Shigeo; (Kyoto,
JP) ; Kataoka, Ichiro; (Kyoto, JP) ; Yamada,
Satoru; (Nara-Ken, JP) ; Shiotsuka, Hidenori;
(Kyoto, JP) ; Zenko, Hideaki; (Kyoto, JP) |
Correspondence
Address: |
FITZPATRICK CELLA HARPER & SCINTO
30 ROCKEFELLER PLAZA
NEW YORK
NY
10112
US
|
Assignee: |
CANON KABUSHIKI KAISHA
TOKYO
JP
|
Family ID: |
26382651 |
Appl. No.: |
10/878607 |
Filed: |
June 29, 2004 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
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10878607 |
Jun 29, 2004 |
|
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09256227 |
Feb 24, 1999 |
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6762508 |
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Current U.S.
Class: |
438/112 ;
257/E23.119; 257/E23.124 |
Current CPC
Class: |
B32B 17/10788 20130101;
H01L 31/048 20130101; H01L 2924/19041 20130101; H01L 23/293
20130101; H01L 2924/0002 20130101; H01L 2924/12044 20130101; H01L
23/3107 20130101; H01L 2924/0002 20130101; H01L 2924/00 20130101;
Y02E 10/50 20130101; B32B 17/10678 20130101; B32B 17/04 20130101;
H01L 31/0481 20130101 |
Class at
Publication: |
438/112 |
International
Class: |
H01L 021/44 |
Foreign Application Data
Date |
Code |
Application Number |
Feb 27, 1998 |
JP |
10-047001 |
Feb 22, 1999 |
JP |
11-042912 |
Claims
1. (Canceled)
2. A method of producing a semiconductor, comprising stacking on a
surface of a semiconductor element at least two types of organic
polymer resin members having different contents of an additive
dissolved therein and encapsulating the semiconductor with the
resin.
3. A method of producing a semiconductor, comprising applying an
electric field to an encapsulant resin member to effect
electrophoresis of a polar additive dissolved in the encapsulant
resin thereby establishing a concentration gradient of the additive
in the direction of thickness of the encapsulant resin member and
encapsulating a surface of a semiconductor with the encapsulant
resin.
4. The method according to claim 3, wherein the electric field is
applied to the encapsulant resin member by charging a surface of
the encapsulant resin member.
5. The method according to claim 3, wherein the electric field is
applied to the encapsulant resin member by stacking an organic
polymer resin member subjected to a corona discharge or plasma
discharge treatment, on a surface of the encapsulant resin
member.
6. A method of producing a solar cell module, comprising stacking
on a surface of a photovoltaic element at least two types of
organic polymer resin members having different contents of an
additive dissolved therein and encapsulating the photovoltaic
element with the resin.
7. A method of producing a solar cell module, comprising applying
an electric field to an encapsulant resin member to effect
electrophoresis of a polar additive dissolved in the encapsulant
resin thereby establishing a concentration gradient of the additive
in the direction of thickness of the encapsulant resin member and
encapsulating a surface of a photovoltaic element with the
encapsulant resin.
8. The method according to claim 7, wherein the electric field is
applied to the encapsulant resin member by charging a surface of
the encapsulant resin member.
9. The method according to claim 7, wherein the electric field is
applied to the encapsulant resin member by stacking an organic
polymer resin member by stacking an organic polymer resin member
subjected to a corona discharge or plasma discharge treatment, on
the surface of the encapsulant resin member.
10. The method according to claim 6, wherein the additive is a
silane coupling agent, and wherein the content of the silane
coupling agent is higher on a side of the organic polymer resin
members in contact with a front surface member or on a side of the
organic polymer resin in contact with the photovoltaic element.
11. The method according to claim 7, wherein the additive is a
silane coupling agent, and wherein the content of the silane
coupling agent is higher on a light-incidence side of the
encapsulant resin member.
12. The method according to claim 6, wherein the additive is an
ultraviolet absorbing agent, and wherein the content of the
ultraviolet absorbing agent is higher on a light-incidence side of
the organic polymer resin members.
13. The method according to claim 7, wherein the additive is an
ultraviolet absorbing agent, and wherein the content of the
ultraviolet absorbing agent is higher on a light-incidence side of
the encapsulant resin member.
14-19. (Canceled)
20. A method of producing a semiconductor element encapsulated with
an encapsulant resin, comprising providing an additive dissolved in
the encapsulant resin with a concentration gradient in the
direction of thickness of the encapsulant resin.
21. The method according to claim 20, wherein the semiconductor
element is a photovoltaic element.
22. The method according to claim 20, wherein the additive is at
least one selected from a silane coupling agent and an ultraviolet
absorbing agent.
23. The method according to claim 20, wherein the concentration of
the additive is higher at a location near the semiconductor element
but lower at a location remote from the semiconductor element.
24. The method according to claim 20, wherein the concentration of
the additive is lower at a location near the semiconductor element
but higher at a location remote from the semiconductor element.
25. The method according to claim 20, wherein the additive is an
adhesion.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to an encapsulant resin member
for a semiconductor, and a semiconductor element encapsulated
(sealed) by the use of the resin member and, more particularly, to
a solar cell module in which a photovoltaic element is encapsulated
by the use of the resin member.
[0003] 2. Related Background Art
[0004] It is conventional practice to encapsulate a semiconductor
element such as a photovoltaic element, a photodiode, or the like
with a transparent encapsulant resin. For example, a solar cell
module is normally constructed in such a structure that a
photovoltaic element is encapsulated with an encapsulant resin
between a front surface member and a back surface member.
[0005] The encapsulant resin is used for the purposes of filling
unevenness of the surface of the photovoltaic element and bonding
the element to the front surface member and to the back surface
member and is usually a transparent, thermoplastic, organic polymer
resin. Typical examples are polyvinyl butyral (PVB) and an
ethylene-vinyl acetate copolymer (EVA). Among others, EVA is
becoming rapidly widespread as an encapsulant resin for the
photovoltaic elements, because it is inexpensive, easy to handle,
capable of increasing heat resistance by crosslinking, high in
durability against long-term outdoor exposure, and so on.
[0006] A variety of additives, such as a crosslinking agent, an
ultraviolet absorbing agent, an oxidation inhibitor, a silane
coupling agent, an adhesive, a reinforcing agent, and so on, are
blended in the encapsulant resin in order to enhance the weather
resistance, heat resistance, adhesion, impact resistance, etc. of
the encapsulant resin. It is ordinary practice to blend these
additives in the resin at the stage of producing an encapsulant
resin member, for example, a sheet of the encapsulant resin, and
they exist uniformly in the direction of thickness of the
sheet.
[0007] The photovoltaic element is placed via this sheet of an
encapsulant resin between the front surface member and the back
surface member to form a solar cell module stack and the solar cell
module stack is thermally compressed while being deaerated, to be
laminated, thereby obtaining a solar cell module.
[0008] However, the inventors have found out that, because in the
conventional process the concentrations of the additives in the
encapsulant resin member were uniform in the direction of thickness
of the encapsulant resin member, the additives more than necessary
had to be blended in order to perform the aimed functions
effectively. These excess additives are apt to be evaporated or
decomposed readily by heat during the laminating operation of the
photovoltaic element with the encapsulant resin member, so as to
remain in the form of bubbles in the surface of the module. These
remaining bubbles will degrade the appearance and will be the cause
of decreasing the yield of the solar cell module. Further,
hitherto, when the adhesion between the photovoltaic element and
the encapsulant resin member was to be improved, it was
conventional practice to directly coat the bonding surfaces with a
silane coupling agent before the laminating operation with the
encapsulant resin. Alternatively, when the front surface member
such as glass sheet was bonded to the encapsulant resin member, it
was conventional practice to directly coat the glass surface with a
silane coupling agent before the laminating operation with the
encapsulant resin.
SUMMARY OF THE INVENTION
[0009] For solving the above issue, the present invention provides
an encapsulant resin member for a semiconductor having an additive
dissolved therein such that the concentration of the additive has a
gradient in the direction of thickness of the encapsulant resin
member.
[0010] The present invention also provides a method of producing a
semiconductor, comprising stacking on a surface of a semiconductor
element at least two types of organic polymer resin members having
different contents of an additive dissolved therein and
encapsulating the semiconductor with the resin.
[0011] The present invention also provides a method of producing a
semiconductor, comprising applying an electric field to an
encapsulant resin member to effect electrophoresis of a polar
additive dissolved in the encapsulant resin thereby establishing a
concentration gradient of the additive in the direction of
thickness of the encapsulant resin member and encapsulating a
surface of a semiconductor with the encapsulant resin.
[0012] The present invention also provides a method of producing a
solar cell module, comprising stacking on a surface of a
photovoltaic element at least two types of organic polymer resin
members having different contents of an additive dissolved therein
and encapsulating the photovoltaic element with the resin.
[0013] The present invention also provides a method of producing a
solar cell module, comprising applying an electric field to an
encapsulant resin member to effect electrophoresis of a polar
additive dissolved in the encapsulant resin thereby establishing a
concentration gradient of the additive in the direction of
thickness of the encapsulant resin member and encapsulating a
surface of a photovoltaic element with the encapsulant resin.
[0014] The present invention also provides a semiconductor element
encapsulated with an encapsulant resin, wherein an additive
dissolved in the encapsulant resin has a concentration gradient in
the direction of thickness of the encapsulant resin.
[0015] The present invention also provides a method of producing a
semiconductor element encapsulated with an encapsulant resin,
comprising providing an additive dissolved in the encapsulant resin
with a concentration gradient in the direction of thickness of the
encapsulant resin.
[0016] The following methods can be included as methods for
establishing the concentration gradient of the additive in the
direction of thickness of the encapsulant resin member. One method
is a method of stacking at least two types of organic polymer resin
members such as organic polymer resin sheets containing different
contents of the additive, on a surface of a semiconductor element
and encapsulating the semiconductor with the resin.
[0017] Another method is a method of applying an electric field to
an encapsulant resin member to effect electrophoresis of a polar
additive in the encapsulant resin member, so as to establish a
concentration gradient of the additive in the direction of
thickness of the encapsulant resin member and encapsulating a
surface of a semiconductor with the resin. The method of applying
the electric field to the surface of the encapsulant resin herein
can be either a method of applying the electric field from the
outside in forced fashion or a method of placing on the encapsulant
resin member a charged organic polymer resin member, for example,
an organic polymer resin layer having a surface subjected to the
corona discharge or plasma discharge treatment to apply the
electric field.
[0018] As the additive in the encapsulant resin, a polar substance
is used when expected to have the concentration gradient, while a
nonpolar substance is used when expected to have a uniform
concentration distribution.
[0019] The encapsulant resin member of the present invention has
the additive dissolved therein such that the additive has the
concentration gradient in the direction of thickness and is
therefore a highly functional encapsulant resin member for a
semiconductor. For example, in the case of the solar cell module,
when the additive such as an ultraviolet absorbing agent or the
like in the encapsulant resin is made to exist in a higher
concentration in the vicinity of the surface on the light-incidence
side of the encapsulant resin member, whereby deterioration of the
encapsulant resin and the photovoltaic element below the
encapsulant resin due to ultraviolet rays can be prevented
efficiently even if the amount of the additive is relatively
small.
[0020] The additive like the silane coupling agent in the
encapsulant resin member can enhance the adhesive force between the
encapsulant resin and the front surface member or between the
encapsulant resin and the photovoltaic element when existing in a
high concentration in the vicinity of the front surface member or
the photovoltaic element. Especially, in the present invention, it
is preferred that the concentration of the silane coupling agent in
the encapsulant resin member is higher at a location near the front
surface member but lower at a location remote from the front
surface member, so as to improve the adhesion between the front
surface member such as glass sheet and the encapsulant resin
member.
[0021] Thus, by establishing the concentration gradient of the
additive dissolved in the encapsulant resin in the direction of
thickness thereof as described above, the aimed function can be
achieved by a minimum amount of the additive. It can also eliminate
the negative effect that the excess additive is evaporated or
decomposed during the laminating operation to remain in the form of
bubbles in the module surface. Since the concentration gradient can
be established selectively, it also becomes possible to prevent
antagonistic action between additives, for example, between a
crosslinking agent and an oxidation inhibitor, which is such
interaction between the additives as to degrade abilities thereof,
and, conversely, to promote synergistic effect, for example,
occurring between an ultraviolet absorbing agent and a light
stabilizer, which is such interaction as to enhance abilities
thereof.
BRIEF DESCRIPTION OF THE DRAWINGS
[0022] FIG. 1 is a schematic sectional view of a solar cell module
of the present invention;
[0023] FIG. 2A is a schematic sectional view showing a photovoltaic
element and FIG. 2B is an example of a top plan view thereof on the
light receiving side; and
[0024] FIG. 3 is an example of a schematic sectional view of a
laminating apparatus of a single vacuum chamber system for
producing a semiconductor element of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0025] FIG. 1 is a schematic sectional view of a solar cell module
(semiconductor device) of the present invention. In FIG. 1,
reference numeral 100 designates the solar cell module, 101 a
photovoltaic element, 102 a transparent encapsulant resin on the
front surface side, 103 a transparent front surface member located
in the outermost surface, 104 an encapsulant resin on the back
surface side, and 105 a back surface member. Light from the outside
is incident into the front surface member 103 to reach the
photovoltaic element 101 and the generated electromotive force is
taken out via output terminals (not shown).
[0026] The photovoltaic element 101 may be selected according to
the purpose from a variety of conventionally known elements
including 1) crystalline silicon solar cells, 2) polycrystalline
silicon solar cells, 3) amorphous silicon solar cells, 4) copper
indium selenide solar cells, 5) compound semiconductor solar cells,
and so on.
[0027] The encapsulant resin 102 is necessary for covering the
unevenness of the surface of the photovoltaic element, for
protecting the element from severe external circumstances such as
temperature change, humidity, impact, and so on, and for securing
the adhesion between the front surface member 103 and the element.
Therefore, the encapsulant resin 102 needs to have sufficient
weather resistance, adhesion, filling performance, heat resistance,
low-temperature resistance, and impact resistance. Resins
satisfying these demands include polyolefin base resins such as
ethylene-vinyl acetate copolymers (EVA), ethylene-methyl acrylate
copolymers (EMA), ethylene-ethyl acrylate copolymers (EEA),
polyvinyl butyral resins, and the like, urethane resins, silicone
resins, fluororesins, and so on. Among them, the EVA copolymers are
preferably used, because they have well-balanced physical
properties for the solar cells. It is also desirable to crosslink
the encapsulant resin 102 so as to enhance the heat resistance, and
as a consequence, deformation or creep can be prevented under use
at high temperatures.
[0028] In the case of the EVA copolymers, it is ordinary practice
to crosslink them with a crosslinking agent such as organic
peroxide or the like. Crosslinking with the organic peroxide is
effected in such a manner that free radicals evolving from the
organic peroxide withdraw hydrogen or halogen atoms from the resin
to create C--C bonds. Activating methods of the organic peroxide
conventionally known are thermal decomposition, redox
decomposition, and ion decomposition. In general, the thermal
decomposition method is employed preferably. Specific examples of
chemical structure of the organic peroxide include hydroperoxide,
dialkyl (allyl) peroxide, diacyl peroxide, peroxy ketal, peroxy
ester, peroxy carbonate, ketone peroxide, and so on. The additive
amount of the organic peroxide is 0.5 to 5 parts by weight relative
to 100 parts by weight of the encapsulant resin.
[0029] In the lamination the above-stated organic peroxide is made
to be dissolved in the encapsulant resin and the crosslinking and
thermal compression are effected under application of pressure and
heat in vacuum. The crosslinking condition of the encapsulant resin
can be determined with consideration to thermal decomposition
temperature characteristics of the organic peroxide. In general,
the application of heat and pressure are stopped at temperature and
time at which thermal decomposition proceeds up to 90% and more
preferably up to 95% or more. The crosslinking of the encapsulant
resin can be checked by measuring gel percentage, which is a rate
of gelled resin in the encapsulant resin. In order to prevent
deformation of the encapsulant resin at high temperatures, it is
desirable to crosslink the resin so that the gel percentage is not
less than 70 wt %.
[0030] For efficient progress of the above crosslinking reaction,
it is also possible to add triallyl isocyanurate (TAIC) or the like
as a crosslinking assistant, in combination with the aforementioned
crosslinking agent. The additive amount of the crosslinking
assistant can be not more than the additive amount of the
crosslinking agent; for example, the additive amount of the
crosslinking assistant is not more than 5 parts by weight relative
to 100 parts by weight of the encapsulant resin.
[0031] In order to enhance the weather resistance of the
encapsulant resin and the layers below the encapsulant resin, it is
also preferable to dissolve an ultraviolet absorbing agent. Among
the ultraviolet absorbing agents, it is particularly preferable to
use a low-volatile ultraviolet absorbing agent with consideration
to operating circumstances of the solar cell module. Specific
examples include various organic compounds such as salicylic acid
base compounds, benzophenone base compounds, benzotriazole base
compounds, and cyanoacrylate base compounds.
[0032] If a light stabilizer is also added in addition to the
ultraviolet absorbing agent, the encapsulant resin can be obtained
with a stabler property against light. Typical light stabilizers
are hindered amine base light stabilizers. The hindered amine base
light stabilizers do not absorb ultraviolet rays, unlike the
ultraviolet absorbing agents. When used together with the
ultraviolet absorbing agent, however, they demonstrate the
remarkable synergistic effect that the functions of the ultraviolet
absorbing agent and the light stabilizer both can be maintained
over a long period. It is a matter of course that other light
stabilizers than the hindered amine base light stabilizers may also
be used. Since the hindered amine base light stabilizers do not
color the encapsulant resin, they are preferred light stabilizers
when the encapsulant resin is expected to have a high
light-transmittancy.
[0033] The additive amount of the ultraviolet absorbing agent and
the light stabilizer is preferably each in the range of 0.1 to 1.0
wt % and more preferably in the range of 0.05 to 1.0 wt % on the
basis of the encapsulant resin.
[0034] Further, where the solar cell module is expected to be used
under severe circumstances, it is preferable to increase the
adhesive strength between the encapsulant resin and the
photovoltaic element or the front surface member. The adhesive
strength can be improved by adding a silane coupling agent or an
organic titanate compound as an adhesion improver to the
encapsulant resin. The additive amount of the adhesion improver is
preferably 0.1 to 3 parts by weight and more preferably 0.25 to 1
part by weight relative to 100 parts by weight of the encapsulant
resin. Moreover, an oxidation inhibitor may also be added for
improving the heat resistance and thermal workability of the
encapsulant resin. The chemical structure of the oxidation
inhibitor is of the monophenol type, the bisphenol type, the
polymer phenol type, the sulfur type, or the phosphoric acid type.
The additive amount of the oxidation inhibitor is preferably 0.05
to 1.0 wt % on the basis of the encapsulant resin.
[0035] Since the front surface member 103 used in the present
invention is located in the outermost surface layer of the solar
cell module, it needs to have the performance for assuring
long-term reliability in outdoor exposure of the solar cell module,
including the transparency, weather resistance, pollution
resistance, mechanical strength, and so on. Materials suitably
applicable in the present invention include low iron tempered glass
(i.e., tempered glass with a low iron content), fluororesin films,
acrylic resin films, and so on. Particularly, in the present
invention, the low iron tempered glass is preferably used as a
front surface member of the solar cell module, because it has high
transparency and so high impact resistance as to resist
breakage.
[0036] In the present invention, when the module is expected to
have lightweight and flexible properties, it is also preferable to
use a resin film (organic polymer resin) as a front surface member.
Among such resin films, the fluororesin films are preferred members
because of their excellent weather resistance and pollution
resistance. Specifically, there can be included, for example,
polyvinylidene fluoride resins, polyvinyl fluoride resins,
tetrafluoroethylene-ethylene copolymers, and so on. It is
preferable to use the polyvinylidene fluoride resins among them for
the purpose of enhancing the weather resistance. Further, it is
also preferable to use the tetrafluoroethylene-ethylene copolymers
for the purposes of enhancing the weather resistance and mechanical
strength and achieving high transparency.
[0037] When the resin film (surface resin film) is used as the
front surface member, the thickness of the film is preferably large
to some extent to be enough to secure the mechanical strength.
Specifically, the thickness of the film is preferably 20 to 200
.mu.m and more preferably 30 to 100 .mu.m.
[0038] For increasing the adhesion to the encapsulant resin, it is
desirable to carry out a surface treatment such as a corona
discharge treatment or a plasma discharge treatment or the like for
the surface resin film. As a consequence, the concentration
gradients of the additives can be obtained in the encapsulant resin
and the adhesion of the surface resin film can also be
enhanced.
[0039] Further, when an electric field is applied to the
encapsulant resin member, the concentration gradients of the
additives dissolved in the encapsulant resin change gradually. This
method is a preferred method, particularly, when delicate
concentration gradients are expected.
[0040] When one encapsulant resin member is obtained by bonding a
first encapsulant resin member having a large amount of an additive
dissolved therein, to a second encapsulant resin member, the
additive can have a substantial concentration gradient in the
obtained encapsulant resin member. This method is a preferred
method, particularly, when the concentration gradient is expected
to be substantiated in the encapsulant within short time.
[0041] The present invention can be applied for the purpose of
encapsulating (sealing) a photoelectric conversion element with the
encapsulant resin having the additive dissolved therein with the
concentration gradient and may also be applied for the purpose of
encapsulating a semiconductor element constituting a semiconductor
device such as a thin film transistor, a diode, or the like, for
example.
[0042] In the specification and claims, the expression that an
additive is dissolved in the encapsulant resin means that the
additive is substantially not precipitated in the encapsulant
resin. In addition, in the case of the encapsulant resin for
encapsulating the photovoltaic element, the encapsulant resin is so
transparent as not to lower its transparency even if the additive
is dissolved therein.
[0043] Further, the back surface encapsulant resin 104 is provided
for the purpose of bonding the photovoltaic element 101 to the back
surface member 105. A preferred material for the back encapsulant
resin 104 is one that can secure sufficient adhesion to an
electroconductive substrate, that has excellent long-term
durability, that can resist thermal expansion and contraction, and
that has flexibility. Suitably applicable materials include hot
melt materials such as EVA, polyvinyl butyral, and the like, two
sided resin-coated tape, epoxy adhesives having flexibility, and so
on. Particularly, it is preferable to use the same material as the
front surface encapsulant resin, for example, to use the
crosslinked EVA described above for the back surface, which can
enhance the adhesion to the encapsulant resin and which can
simplify the production process remarkably.
[0044] The back surface member 105 is necessary for maintaining
electrical insulation between the electroconductive substrate of
the photovoltaic element 101 and the outside. A preferred material
is one that can secure sufficient electrical insulation to the
electroconductive substrate, that has excellent long-term
durability, that can resist thermal expansion and contraction, and
that has flexibility. Materials that can suitably be used in a film
shape include nylon and polyethylene terephthalate.
[0045] A reinforcing sheet (not shown) may be attached to the
outside of the back surface member in order to increase the
mechanical strength of the solar cell module or in order to prevent
distortion and warpage due to the temperature change. This
reinforcing sheet can also be a base material of a
roof-material-integrated or construction-material-integrate- d
solar cell module. Preferred materials are steel sheets, plastic
sheets, and FRP (fiber reinforced plastic) sheets.
[0046] Described below is a method for forming the solar cell
module using the photovoltaic element, encapsulant resins, front
surface member, and back surface member described above.
[0047] A preferred method for covering the light receiving surface
of the photovoltaic element with the front surface encapsulant
resin 102 and front surface member 103 is a method for preparing
the encapsulant resin molded in a sheet shape and thermally
compressing it onto the element. Specifically, the encapsulant
resin sheet is interposed between the photovoltaic element and the
front surface member and they are thermally compressed to form a
solar cell module. Further, in the step of producing the sheet of
the encapsulant resin or in the step of thermally compressing the
element and the front surface member with the encapsulant resin, an
electric field is applied to the encapsulant resin sheet to effect
electrophoresis of a polar additive in the encapsulant resin,
thereby establishing the concentration gradient in the direction of
thickness of the encapsulant resin. The heating temperature and
heating time during the compression are determined with reference
to the temperature and time at which the crosslinking reaction
proceeds sufficiently. The back surface is also covered by use of
the back surface member and back surface encapsulant by a method
similar to the above. In this case, particularly, it is possible to
use the same material for the front surface encapsulant resin and
the back surface encapsulant resin and thereby to effect the
crosslinking and thermal compression simultaneously.
[0048] A method of the thermal compression can be a vacuum
thermocompression method conventionally known. The vacuum
thermocompression method is of either a double vacuum chamber
system or a single vacuum chamber system, and an example of the
single vacuum chamber system will be described referring to FIGS. 1
and 3.
[0049] First, the components including the front surface member
103, front encapsulant resin 102, photovoltaic element 101, back
encapsulant resin 104, and back surface member 105 are stacked to
form a solar cell module stack 100, as illustrated in FIG. 1. On
this occasion, nonwoven fabric of glass fiber 107 may also be used
for the reason of assisting exhaust of air from spaces between the
components and for the reason of preventing EVA from melting to
flow out from the edge of the module. Specifically, this glass
fiber nonwoven fabric is laid on the surface encapsulant resin 102
and they are heated to make the fabric impregnated with EVA,
whereby the nonwoven fabric can be used as a reinforcing material
for EVA. In this case, particularly, when the front surface member
is of a film shape, the glass fiber nonwoven fabric 107 can also be
utilized as a reinforcing material for EVA, which also presents a
concomitant effect that it becomes hard for a flaw of the surface
to propagate to the element.
[0050] The step of laminating the stack 100 described above will be
described next using FIG. 3. FIG. 3 is a view which schematically
shows a laminating apparatus of the single vacuum chamber system
and the stack placed therein. The stack 306 is placed on a plate
301 and a silicone rubber sheet 302 is overlaid thereon. After this
step, the stack is laminated by the following steps.
[0051] (1) With exhaust through exhaust port 304 of the plate, the
stack is compressed throughout the entire surface and uniformly by
the silicone rubber sheet 302. At this time, air is eliminated from
the spaces between the components, described above. In the figure,
reference numeral 305 designates an O-ring.
[0052] (2) The plate 301 is heated by heater a 303 up to the
temperature at which EVA melts.
[0053] (3) An electric field is applied between an electrode 307
provided on the silicone rubber sheet, and the plate 301. At this
time the polar additive is subject to electrophoresis in the front
surface encapsulant resin to have a concentration gradient.
[0054] (4) The plate is heated up to the temperature at which EVA
undergoes the crosslinking reaction, and the temperature is
maintained until the crosslinking has completed.
[0055] (5) After cooling, the laminate 306 is taken out.
[0056] During the above steps the degree of the vacuum in the space
where the stack is present is desirably not more than 700 Pa,
because it permits quick deaeration of air between the components
and achievement of a high gelation rate.
[0057] The present invention was described above with the example
of the solar cell module, but the present invention can also be
applied preferably to encapsulation of transistors, diodes,
capacitors, or the like, which are not used as photovoltaic
elements. In such cases the encapsulant resins may also be opaque
resins.
EXAMPLES
[0058] The present invention will be described in detail based on
examples. FIG. 2A is a schematic sectional view showing the element
part of a photovoltaic element that can be produced according to
the present invention and FIG. 2B is an example of a top plan view
thereof on the light receiving side.
Example 1
[0059] (Preparation of Photovoltaic Element Part)
[0060] An amorphous silicon (a-Si) solar cell part (photovoltaic
element part) was fabricated as follows in the structure
illustrated in FIGS. 2A and 2B. Specifically, an Al layer (5000
.ANG. thick) and a ZnO layer (5000 .ANG. thick) were successively
formed as a back reflecting layer 202 on a stainless steel
substrate 201 as cleaned, by sputtering. Then, by the plasma CVD
method, n-type a-Si layers were formed from a mixture gas of
SiH.sub.4, PH.sub.3, and H.sub.2, i-type a-Si layers from a mixture
gas of SiH.sub.4 and H.sub.2, and p-type microcrystalline .mu.c-Si
layers from a mixture gas of SiH.sub.4, BF.sub.3, and H.sub.2,
thereby forming a tandem type a-Si photoelectric conversion
semiconductor layer 203 in the layer structure of n-layer 150 .ANG.
thick/1-layer 4000 .ANG. thick/p-layer 100 .ANG. thick/n-layer 100
.ANG. thick/1-layer 800 .ANG. thick/p-layer 100 .ANG. thick. Then a
thin film of In.sub.2O.sub.3 (700 .ANG. thick) was formed as a
transparent conductive layer 204 by evaporating In in an O.sub.2
atmosphere by the resistance heating method. After this, a defect
eliminating treatment of the photovoltaic element was carried out.
Specifically, the photovoltaic element and an electrode plate,
which was opposed to the transparent conductive layer of the
element, were dipped in an aqueous solution of aluminum chloride
controlled so that the electric conductivity thereof was 50 to 70
mS. While keeping the element at the earth, a positive potential of
3.5 V was applied to the electrode plate for two seconds to
selectively decompose the transparent conductive layer at shunt
portions. This treatment improved the shunt resistance from 1
k.OMEGA..multidot.cm.sup.2 to 10 k.OMEGA..multidot.cm.sup.2 before
the treatment to 50 k.OMEGA..multidot.cm.sup.2 to 200
k.OMEGA..multidot.cm.sup.2 after the treatment.
[0061] In the last step, grid electrodes 205 for collection of
electricity were provided. Copper wires having the diameter of 100
.mu.m were laid along lines of copper paste 200 .mu.m wide, formed
by screen printing. Then a cream solder was placed on the wires and
thereafter the solder was melted to fix the copper wires on the
copper paste, thereby forming the collector electrodes. A copper
tab as a negative terminal was attached to the stainless steel
substrate with stainless solder 208 and a tape of tin foil as a
positive terminal was attached to the collector electrodes with
conductive paste 207, to form output terminals 206a, 206b, thus
obtaining the photovoltaic element.
[0062] (Formation of Module)
[0063] The back surface encapsulant resin (integral laminate film
of EVA 230 .mu.m thick/PET 100 .mu.m thick/EVA 230 .mu.m thick),
the photovoltaic element (amorphous silicon semiconductor), the
front surface encapsulant resin (EVA 460 .mu.m thick), the front
surface protecting/reinforcing material (glass fiber nonwoven
fabric with a basis weight 40 g/m.sup.2 prepared by bonding glass
fibers of a diameter 10 .mu.m and a length 13 mm with an acrylic
binder), and the front surface member (an
ethylene-tetrafluoroethylene copolymer (hereinafter referred to as
ETFE) film of 50 .mu.m thick) were stacked in this order on the
back surface member (a GALVALUME steel sheet (trade name of 55%
aluminum-zinc alloy coated steel sheet) with a polyester coating
0.4 mm thick). The EVA used herein was one obtained by blending 1.5
parts by weight of 2,5-dimethyl-2,5-bis (t-butylperoxy) hexane as a
crosslinking agent, 0.5 part by weight of y-(2-aminoethyl)
aminopropyl-trimethoxysilan- e as a silane coupling agent, 0.15
part by weight of 2-hydroxy-4-n-octoxybenzophenone as an
ultraviolet absorbing agent, 0.1 part by weight of bis
(2,2,6,6-tetramethyl-4-piperidyl) sebacate as a light stabilizer,
and 0.2 part by weight of tris (mono-nonylphenyl) phosphite as an
oxidation inhibitor relative to 100 parts by weight of EVA resin
(vinyl acetate content: 33%). The ETFE was subjected to a plasma
discharge treatment on the adhesive surface side in order to
increase adhesion to the EVA.
[0064] This stack was placed with the ETFE film side up on the
plate of the laminating apparatus (FIG. 3) of the single vacuum
chamber system described above and the silicone rubber sheet 302
and plate-like electrode 307 were overlaid thereon. Then evacuation
was effected through the exhaust port of the plate by use of a
vacuum pump (not shown) to make the rubber attracted to the plate.
After the evacuation was carried on for five minutes in the vacuum
of 700 Pa, heating was started by the heater buried in the plate up
to 140.degree. C. and thereafter the temperature was maintained for
fifteen minutes, thereby bringing about the melting and
crosslinking reaction of EVA. During the heating an electric field
of 3 kV/mm was applied between the electrode 307 and the plate 301.
After that, the heater and the electric field were stopped and the
plate was cooled down to about 40.degree. C. by a cooling fan. Then
the evacuation was stopped and the solar cell module was taken
out.
[0065] The solar cell module fabricated according to the above
method was evaluated as to the items described hereinafter.
Example 2
[0066] The laminating operation was carried out by a method similar
to that in Example 1 except that the electric field of 3 kV/mm was
applied at the stage of producing the EVA sheet (460 .mu.m thick)
as the front surface encapsulant resin and the electric field was
not applied between the electrode 307 and the plate 301 during the
laminating operation, and the module thus obtained was
evaluated.
Example 3
[0067] The laminating operation was carried out by a method similar
to that in Example 1 except that a first EVA resin sheet (230 .mu.m
thick) containing 1.0 part by weight of the silane coupling agent
relative to 100 parts by weight of EVA and not containing an
ultraviolet absorbing agent was placed on the photoelectric
conversion element part, a second EVA resin sheet (230 .mu.m thick)
containing 0.3 part by weight of the ultraviolet absorbing agent
over 100 parts by weight of EVA and not containing a silane
coupling agent was overlaid on the first sheet, these two resin
sheets were bonded to form the front surface encapsulant resin, and
that the electric field was not applied between the electrode 307
and the plate 301 during the laminating operation, and the module
thus obtained was evaluated.
Example 4
[0068] The laminating operation was carried out by a method similar
to that in Example 1 except that the electric field was not applied
between the electrode 307 and the plate 301 during the laminating
operation, and the module thus obtained was evaluated.
Example 5
[0069] The laminating operation was carried out by a method similar
to that in Example 1 except that a polyvinyl fluoride film (50
.mu.m thick, hereinafter referred to as PVF) subjected to the
plasma discharge treatment was used in the place of the ETFE as the
front surface member, and the module thus obtained was
evaluated.
Example 6
[0070] The laminating operation was carried out by a method similar
to that in Example 1 except that PVF not subjected to the plasma
discharge treatment was used in the place of the ETFE as the front
surface member, and the module thus obtained was evaluated.
Comparative Example 1
[0071] The laminating operation was carried out by a method similar
to that in Example 6 except that the PVF was not subjected to the
plasma discharge treatment and that the electric field was not
applied between the electrode 307 and the plate 301 during the
laminating operation, and the module thus obtained was
evaluated.
[0072] (Evaluation Results)
[0073] The solar cell modules fabricated in the examples and
comparative example described above were evaluated for the
following items.
[0074] (1) Initial Appearance
[0075] The appearance of the solar cell modules was evaluated
immediately after the laminating operation.
[0076] .circleincircle.: a solar cell module without any problem in
appearance
[0077] .smallcircle.: a solar cell module having a small amount of
bubbles left therein but posing no problem in practical use.
[0078] (2) Adhesion
[0079] Initial adhesive force was evaluated between the encapsulant
resin (EVA) and the back surface member.
[0080] .circleincircle.: adhesive force not less than 8 kgf/25
mm
[0081] .smallcircle.: adhesive force not less than 4 kgf/25 mm but
less than 8 kgf/25 mm
[0082] x: adhesive force less than 4 kgf/25 mm.
[0083] (3) Weather Resistance
[0084] The solar cell modules were put in a sunshine weatherometer,
an accelerated weathering test was carried out to perform light
irradiation and rainfall cycles for 5000 hours, and then the change
was evaluated in the appearance of the solar cell modules.
[0085] .circleincircle.: appearance without any change
[0086] .smallcircle.: appearance with some change but without any
problem in practical use
[0087] x: appearance with peeling off or coloring.
[0088] The results are shown in Table 1.
1 TABLE 1 Treatment of front Electric Initial Weather surface
member field appearance Adhesion resistance Example 1 with plasma
applied during .circleincircle. .circleincircle. .circleincircle.
treatment lamination Example 2 with plasma applied during
.circleincircle. .circleincircle. .circleincircle. treatment
production of EVA sheet Example 3 with plasma not applied
.circleincircle. .circleincircle. .circleincircle. treatment
Example 4 with plasma not applied .circleincircle. .largecircle.
.largecircle. treatment Example 5 with plasma applied during
.circleincircle. .circleincircle. .circleincircle. treatment
lamination Example 6 without plasma applied during .circleincircle.
.largecircle. .circleincircle. treatment lamination Comparative
without plasma not applied .largecircle. X X Example 1
treatment
[0089] As apparent from Table 1, the comparative example 8 without
the concentration gradient of the additives in the thickness
direction of the encapsulant resin had low adhesive force, was also
inferior in the weather resistance, and showed yellowing of EVA
after irradiation of light, because it contained the silane
coupling agent and the ultraviolet absorbing agent in the amounts
less than those necessary for demonstrating the desired functions.
In addition, as to the initial appearance, the comparative example
had a small amount of bubbles left in the surface of the module,
though they were of a level that posed no problem in practical
use.
[0090] In contrast, the solar cell modules obtained by applying the
electric field to the encapsulant resin during the laminating
operation like those in Examples 1, 5, and 6 presented no problem
at all, even though the contents of the silane coupling agent and
ultraviolet absorbing agent were very small.
[0091] Example 2 verified that the same effect was able to be
achieved by applying the electric field during production of the
EVA resin sheet. This implies that the application of the electric
field implemented selective electrophoresis of these additives and
they functioned effectively.
[0092] As is seen from the solar cell module of Example 3, the like
effect was able to be achieved by the stack of the encapsulant
resins having the different contents of the additives, without
application of the electric field.
[0093] As is seen from the solar cell module of Example 4, the
electric field was able to be applied to the encapsulant resin only
by subjecting the ETFE to the plasma discharge treatment and the
effect thereof was of a level that posed no problem in practical
use, though weaker than in the case of the electric field being
forced to be applied.
[0094] According to the present invention, by establishing the
concentration gradient of the additive dissolved in the encapsulant
resin in the step of producing the encapsulant resin or in the step
of encapsulating the semiconductor with the encapsulant resin, the
semiconductor device with high adhesion or high weather resistance
can be obtained while the amount of the additive used is reduced.
Specifically, by stacking at least two types of organic polymer
resin sheets or the like containing different contents of additives
to form one encapsulant resin member or by applying the electric
field to the encapsulant resin member to effect electrophoresis of
a polar additive in the encapsulant resin, it is possible to
provide the highly functional encapsulant resin member for a
semiconductor with the concentration gradient of the additive in
the direction of thickness of the encapsulant resin and the
semiconductor element having it.
[0095] In the case of the solar cell module, the concentration of
an additive near the light-incident-side surface of the encapsulant
resin or near the surface of the photovoltaic element can be
changed selectively according to the function of the additive in
the encapsulant resin, whereby the additive can act more
effectively.
* * * * *