U.S. patent application number 10/618468 was filed with the patent office on 2004-11-18 for digital image capturing module assembly and method of fabricating the same.
This patent application is currently assigned to Siliconware Precision Industries Co., Ltd.. Invention is credited to Tan, Kah-Ong, Tao, Peter, Wang, Hui, Zhang, Dong-Jin.
Application Number | 20040227848 10/618468 |
Document ID | / |
Family ID | 33415012 |
Filed Date | 2004-11-18 |
United States Patent
Application |
20040227848 |
Kind Code |
A1 |
Tan, Kah-Ong ; et
al. |
November 18, 2004 |
Digital image capturing module assembly and method of fabricating
the same
Abstract
A digital image capturing module assembly and method of
fabricating the same is proposed, which is designed for the
assembly of a digital image capturing module from a photosensitive
printed circuit board and a lens holder. The proposed module
assembly is characterized by the provision of a shouldered portion
and a grooved portion in the lens holder's inner wall around the
focusing plane of the lens holder wherein an adhesive layer is
coated in the grooved portion to adhere the photosensitive printed
circuit board to the lens holder. This feature allows the junction
between the photosensitive printed circuit board and the lens
holder to have a sealed light-impenetrable quality, so that the
captured image by the digital image capturing module would be
substantially free of sidelight effect. Moreover, it allows the
finished product of digital image capturing module to be more
compact in size than prior art.
Inventors: |
Tan, Kah-Ong; (Shanghai,
CN) ; Tao, Peter; (Shanghai, CN) ; Wang,
Hui; (Shanghai, CN) ; Zhang, Dong-Jin;
(Shanghai, CN) |
Correspondence
Address: |
Mr. Peter F. Corless
EDWARDS & ANGELL, LLP
101 Federal Street,
Boston
MA
02110-1800
US
|
Assignee: |
Siliconware Precision Industries
Co., Ltd.
|
Family ID: |
33415012 |
Appl. No.: |
10/618468 |
Filed: |
July 10, 2003 |
Current U.S.
Class: |
348/374 ;
257/E21.504; 257/E23.055; 257/E31.117 |
Current CPC
Class: |
H01L 21/565 20130101;
H01L 2224/48091 20130101; H01L 2224/4824 20130101; H04N 5/2257
20130101; H01L 24/48 20130101; H01L 31/0203 20130101; H01L 23/49816
20130101; H01L 24/49 20130101; H01L 2224/48091 20130101; H01L 23/13
20130101; H01L 23/3114 20130101; H01L 23/49572 20130101; H01L
2224/4824 20130101; H01L 23/3128 20130101; H01L 2224/49175
20130101; H01L 2924/15311 20130101; H01L 2924/00 20130101; H01L
2224/49175 20130101; H01L 2924/00014 20130101 |
Class at
Publication: |
348/374 |
International
Class: |
H04N 005/225 |
Foreign Application Data
Date |
Code |
Application Number |
May 13, 2003 |
TW |
092112881 |
Claims
What is claimed is:
1. A digital image capturing module assembly, which comprises: a
lens holder, which has one side defined as a focusing plane, and
which is formed with a shouldered portion on the lens holder's
inner wall on the periphery of the focusing plane and is further
formed with a grooved portion in the shouldered portion; an
adhesive layer, which is coated in the grooved portion in the
shouldered portion of the lens holder; and a photosensitive printed
circuit board, which is embedded in the space confined within the
lens holder's inner wall over the shouldered portion, and which is
adhered by means of the adhesive layer to the lens holder so as to
be fixedly mounted on the lens holder with a sealed
light-impenetrable quality at the junction between the
photosensitive printed circuit board and the lens holder.
2. The digital image capturing module assembly of claim 1, wherein
the photosensitive printed circuit board is a CCD-based
photosensitive printed circuit board.
3. The digital image capturing module assembly of claim 1, wherein
the photosensitive printed circuit board is a CMOS-based
photosensitive printed circuit board.
4. The digital image capturing module assembly of claim 1, wherein
the shouldered portion is dimensioned to a depth substantially
equal to the thickness of the photosensitive printed circuit
board.
5. The digital image capturing module assembly of claim 1, wherein
the space confined within the lens holder's inner wall on the
shouldered portion is dimensioned to be substantially equal to the
area of the photosensitive printed circuit board.
6. A method for fabricating a digital image capturing module,
comprising: preparing a lens holder having one side defined as a
focusing plane, and which is formed with a shouldered portion on
the lens holder's inner wall on the periphery of the focusing plane
and is further formed with a grooved portion in the shouldered
portion; preparing a photosensitive printed circuit board; coating
an adhesive layer in the grooved portion in the shouldered portion
of the lens holder; and embedding the photosensitive printed
circuit board in the space confined within the lens holder's inner
wall over the shouldered portion, and which is adhered by means of
the adhesive layer to the lens holder so as to be fixedly mounted
on the lens holder with a sealed light-impenetrable quality at the
junction between the photosensitive printed circuit board and the
lens holder.
7. The method of claim 6, wherein the photosensitive printed
circuit board is a CCD-based photosensitive printed circuit
board.
8. The method of claim 6, wherein the photosensitive printed
circuit board is a CMOS-based photosensitive printed circuit
board.
9. The method of claim 6, wherein the shouldered portion is
dimensioned to a depth substantially equal to the thickness of the
photosensitive printed circuit board.
10. The method of claim 6, wherein the space confined within the
lens holder's inner wall on the shouldered portion is dimensioned
to be substantially equal to the area of the photosensitive printed
circuit board.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] This invention relates to electronics assembly technology,
and more particularly, to a digital image capturing module assembly
and method of fabricating the same, which is designed for use to
assemble a digital image capturing module by mounting an optical
sensing PCB (printed circuit board), such as CCD (Charge Coupled
Device) or CMOS (Complementary Metal Oxide Semiconductor) based
PCB, to a lens holder.
[0003] 2. Description of Related Art
[0004] Digital image capturing module is a key component in the
assembly of a digital still camera (DSC) or a camera-equipped
electronic device such as mobile phone, which is composed of a lens
holder and a sheet-shaped photosensitive printed circuit board
(PCB); wherein the lens holder is used to hold a lens unit that is
used to capture an optical image and focus the captured image on a
focusing plane on the rear of the lens holder, while the
photosensitive printed circuit board is, for example, CCD (Charge
Coupled Device) or CMOS (Complementary Metal Oxide Semiconductor)
based, and which is arranged on the focusing plane of the lens
holder for the purpose of converting the optical image focused
thereon into digital form.
[0005] A conventional method for the assembly of a digital image
capturing module is to provide an array of aligning posts on the
periphery of the focusing plane on the lens holder and a
corresponding array of aligning holes in the photosensitive printed
circuit board to help align the photosensitive printed circuit
board in position on the lens holder. Further, the photosensitive
printed circuit board is securely fixed in position by melting the
tips of the aligning posts in addition to the use of an adhesive
layer to adhere the photosensitive printed circuit board to the
lens holder.
[0006] One drawback to the foregoing assembly method, however, is
that the provision of the aligning posts would undesirably make the
finished product quite large in volume, i.e., the overall length of
the finished digital image capturing module would be equal to the
length of the lens holder plus the thickness of the photosensitive
printed circuit board, and therefore there is still room for
improvement in compactness. In addition, it would often be
difficult to coat the adhesive agent evenly over the lens holder,
particularly at the corners where the aligning posts are located,
undesirably resulting in the formation of leakage holes in the
coated adhesive layer. These leakage holes would adversely cause
the captured image by the digital image capturing module to be
subjected to sidelight effect and thus degrade the optical quality
of the captured image.
SUMMARY OF THE INVENTION
[0007] It is therefore an objective of this invention to provide a
new digital image capturing module assembly and method of
fabricating the same which can help allow the finished digital
image capturing module to be more compact in size than prior
art.
[0008] It is another objective of this invention to provide a
digital image capturing module assembly and method of fabricating
the same which allows the junction between the photosensitive
printed circuit board and the lens holder to have a sealed
light-impenetrable quality, so that the captured image by the
digital image capturing module would be free of sidelight effect
and thus ensured in its optical quality.
[0009] The digital image capturing module assembly and method of
fabricating the same according to the invention is designed for use
to assemble a digital image capturing module by mounting an optical
sensing PCB (printed circuit board), such as CCD (Charge Coupled
Device) or CMOS (Complementary Metal Oxide Semiconductor) based
PCB, to a lens holder.
[0010] The digital image capturing module assembly and method of
fabricating the same according to the invention is characterized by
the provision of a shouldered portion and a grooved portion in the
lens holder's inner wall around the focusing plane of the lens
holder wherein an adhesive layer is coated in the grooved portion
to adhere the photosensitive printed circuit board to the lens
holder.
[0011] The digital camera lens module assembly and method of
fabricating the same according to the invention is advantageous to
use in that it allows the junction between the photosensitive
printed circuit board and the lens holder to have a sealed
light-impenetrable quality, so that the captured image by the
digital image capturing module of the invention would be
substantially free of sidelight effect that would otherwise degrade
the optical quality of the captured image. Moreover, it allows the
overall length of the finished digital image capturing module to be
the same as the length of the lens holder, allowing the finished
digital image capturing module to be more compact in size than
prior art.
BRIEF DESCRIPTION OF DRAWINGS
[0012] The invention can be more fully understood by reading the
following detailed description of the preferred embodiments, with
reference made to the accompanying drawings, wherein:
[0013] FIG. 1 is a schematic diagram showing an exploded
perspective view of the various constituent parts used to assemble
a digital image capturing module according to the invention;
[0014] FIG. 2 is a schematic diagram showing a sectional view of
that shown in FIG. 1;
[0015] FIG. 3 is a schematic sectional diagram used to depict an
adhesive agent dispensing procedure used in the assembly of the
digital image capturing module according to the invention;
[0016] FIG. 4 is a schematic diagram showing a sectional view of
the finished product of the digital image capturing module
according to the invention; and
[0017] FIG. 5 is a schematic diagram showing a perspective view of
the finished product of the digital image capturing module
according to the invention.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
[0018] The digital image capturing module assembly and method of
fabricating the same according to the invention is disclosed in
full details by way of preferred embodiments in the following with
reference to the accompanying drawings.
[0019] Referring first to FIG. 1 together with FIG. 2, the first
step in the assembly of a digital image capturing module according
to the invention is to prepare a lens holder 10 and a sheet-shaped
photosensitive printed circuit board 20.
[0020] The lens holder 10 has an inside hollowed portion 11 for the
accommodation of a lens unit (not shown) therein, and the lens unit
is to be used to capture an optimal image and focus the captured
image on a focusing plane 12 on the rear side of the lens holder
10. The invention is characterized in that the lens holder 10 is
formed with a shouldered portion 14 on the lens holder's inner wall
13 on the periphery of the focusing plane 12 and is further formed
with a grooved portion 15 in shouldered portion 14. Preferably, the
space confined within the lens holder's inner wall 13 over the
shouldered portion 14 is dimensioned to be substantially equal to
the area of the photosensitive printed circuit board 20, and the
shouldered portion 14 is dimensioned to a depth substantially equal
to the thickness of the photosensitive printed circuit board
20.
[0021] The photosensitive printed circuit board 20 can be, for
example, a CCD (Charge Coupled Device) based or a CMOS
(Complementary Metal Oxide Semiconductor) based circuit board, and
which is to be used to convert the optical image captured by the
lens unit (not shown) in the lens holder 10 into digital form.
Preferably, the photosensitive printed circuit board 20 is
dimensioned in such a manner that its area is equal to the space
confined within the lens holder's inner wall 13 over the shouldered
portion 14, and its thickness is equal to the depth of the
shouldered portion 14 of the lens holder 10.
[0022] Referring next to FIG. 3, during the assembly process, the
first step is to perform an adhesive agent dispensing process to
dispense an adhesive agent into the grooved portion 15 in the
shouldered portion 14 of the lens holder 10 to form an adhesive
layer 30.
[0023] Referring further to FIG. 4, in the subsequent step, the
photosensitive printed circuit board 20 is fitted into the space
confined within the lens holder's inner wall 13 over the shouldered
portion 14 so as to be embedded therein, and meanwhile the
photosensitive printed circuit board 20 is adhered by means of the
adhesive layer 30 to the lens holder 10 so as to be fixedly mounted
on the lens holder 10. During this procedure, since the
photosensitive printed circuit board 20 is dimensioned to be equal
to the space confined within the lens holder's inner wall 13 over
the shouldered portion 14, the photosensitive printed circuit board
20 can be aligned in position with the help of the lens holder's
inner wall 13. In addition, since the photosensitive printed
circuit board 20 is embedded to a depth within the lens holder's
inner wall 13 and adhered by the adhesive layer 30 coated in the
grooved portion 15 which is also positioned at a depth within the
lens holder's inner wall 13, it can help provide a sealed
light-impenetrable effect at the junction between the
photosensitive printed circuit board 20 and the lens holder 10.
Furthermore, since the thickness of the photosensitive printed
circuit board 20 is substantially equal to the depth of the
shouldered portion 14 of the lens holder 10, the entirety of the
photosensitive printed circuit board 20 can be fully embedded
within the lens holder's inner wall 13, allowing the overall length
of the finished digital image capturing module to be exactly the
same as the length of the lens holder 10, which makes the finished
digital image capturing module more compact in size than prior
art.
[0024] FIG. 5 shows a perspective view of the finished product of
the digital image capturing module according to the invention. In
application, since the junction between the photosensitive printed
circuit board 20 and the lens holder 10 has a sealed
light-impenetrable quality, the captured image by the digital image
capturing module of the invention would be substantially free of
sidelight effect that would otherwise degrade the optical quality
of the captured image.
[0025] In conclusion, the invention provides a digital image
capturing module assembly and method of fabricating the same for
use to assemble a digital image capturing module by mounting a
photosensitive printed circuit board to a lens holder, which is
characterized by the provision of a shouldered portion and a
grooved portion in the lens holder's inner wall around the focusing
plane of the lens holder wherein an adhesive layer is coated in the
grooved portion to adhere the photosensitive printed circuit board
to the lens holder. This feature allows the junction between the
photosensitive printed circuit board and the lens holder to have a
sealed light-impenetrable quality, so that the captured image by
the digital image capturing module of the invention would be
substantially free of sidelight effect that would otherwise degrade
the optical quality of the captured image. Moreover, it allows the
overall length of the finished digital image capturing module to be
the same as the length of the lens holder, allowing the finished
digital image capturing module to be more compact in size than
prior art. The invention is therefore more advantageous to use than
the prior art.
[0026] The invention has been described using exemplary preferred
embodiments. However, it is to be understood that the scope of the
invention is not limited to the disclosed embodiments. On the
contrary, it is intended to cover various modifications and similar
arrangements. The scope of the claims, therefore, should be
accorded the broadest interpretation so as to encompass all such
modifications and similar arrangements.
* * * * *