U.S. patent application number 10/804730 was filed with the patent office on 2004-11-11 for electrically active textile article.
Invention is credited to Farrell, Brian, Nguyen, Patricia Wilson, Powell, Mara, Slade, Jeremiah, Teverovsky, Justyna.
Application Number | 20040224138 10/804730 |
Document ID | / |
Family ID | 26933737 |
Filed Date | 2004-11-11 |
United States Patent
Application |
20040224138 |
Kind Code |
A1 |
Farrell, Brian ; et
al. |
November 11, 2004 |
Electrically active textile article
Abstract
A method of manufacturing a fabric article to include electronic
circuitry in which a flex circuit is assembled to include
conductive traces and pads on a flexible substrate, a fabric
article is placed on a rigid surface, and the substrate of the flex
circuit is secured to the fabric article. Also disclosed is a
fabric article which includes electronic circuitry and an
electrically active textile article.
Inventors: |
Farrell, Brian; (Quincy,
MA) ; Nguyen, Patricia Wilson; (Arlington, MA)
; Teverovsky, Justyna; (Acton, MA) ; Slade,
Jeremiah; (Arlington, MA) ; Powell, Mara;
(Melrose, MA) |
Correspondence
Address: |
IANDIORIO & TESKA
INTELLECTUAL PROPERTY LAW ATTORNEYS
260 BEAR HILL ROAD
WALTHAM
MA
02451-1018
US
|
Family ID: |
26933737 |
Appl. No.: |
10/804730 |
Filed: |
March 19, 2004 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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10804730 |
Mar 19, 2004 |
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09981480 |
Oct 16, 2001 |
|
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6729025 |
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60240808 |
Oct 16, 2000 |
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60327259 |
Oct 5, 2001 |
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Current U.S.
Class: |
428/209 |
Current CPC
Class: |
H05K 2203/0285 20130101;
Y10T 29/49117 20150115; H05K 2203/065 20130101; H05K 2201/029
20130101; H05K 1/038 20130101; B32B 3/08 20130101; Y10T 29/49155
20150115; H05K 3/0058 20130101; H05K 2201/209 20130101; Y10T
29/4913 20150115; Y10T 428/24917 20150115; B32B 7/04 20130101; H05K
3/386 20130101; H05K 2201/10598 20130101; Y10T 29/49169 20150115;
H05K 1/189 20130101; B32B 5/02 20130101; A41D 1/002 20130101 |
Class at
Publication: |
428/209 |
International
Class: |
B32B 015/00; B32B
007/00; B32B 003/00 |
Claims
What is claimed is:
1. An electrically active textile article comprising: fabric; a
circuit including traces and pads on a substrate secured to the
fabric; and at least one electronic component populating the
circuit.
2. The article of claim 1 in which the substrate is flexible.
3. The article of claim 1 in which the traces and pads are
electrically conductive.
4. The article of claim 1 in which the circuit substrate is
ultrasonically welded to the fabric.
5. The article of claim 4 in which the circuit substrate is
ultrasonically welded to the fabric about the periphery of the
substrate.
6. The article of claim 1 in which the circuit substrate includes a
perimeter bond area devoid of traces and pads and the perimeter
bond area is secured to the fabric.
7. The article of claim 1 in which an adhesive secures the
substrate to the fabric.
8. The article of claim 1 in which threads secure the substrate to
the fabric.
9. The article of claim 1 further including a protective covering
over the circuit.
10. The article of claim 9 in which the protective covering is made
of a waterproof material.
11. The article of claim 9 in which the protective covering extends
onto the fabric.
12. The article of claim 3 in which the substrate is a
thermoplastic material and the conductive traces and pads are
metal.
13. The article of claim 1 in which the fabric is selected from the
group consisting of woven, knit, non-woven, and braided
fabrics.
14. The article of claim 13 in which the fabric is a portion of a
wearable article.
15. The article of claim 1 further including stress relief areas
which promote flexure of the circuit substrate.
16. The article of claim 15 in which the stress relief areas are
cut-outs in the edges of the substrate.
17. The article of claim 15 in which the stress relief areas are
cut-outs through the substrate.
18. The article of claim 15 in which the stress relief areas
include material added to the substrate.
19. The article of claim 15 in which the stress relief areas are
located between electronic components on the circuit.
20. The article of claim 1 in which there are two flex circuits
secured to the fabric and electrical interconnections between the
two flex circuits.
21. The article of claim 20 in which the two flex circuits are
secured to the fabric by at least one zipper including at least two
electrically conductive teeth for the electrical
interconnections.
22. The article of claim 20 in which the two flex circuits are
secured to the fabric by at least one pair of VELCRO.RTM. patches
with at least a portion of the patches being an electrically
conductive material for the electrical interconnections.
23. The article of claim 20 in which the two flex circuits include
conductive solder pads and the fabric includes polyester-coated
copper fabric, the conductive solder pads and the polyester coating
being melted to form the electrical interconnections.
24. An electrically active textile article comprising: an article
of clothing; a flex circuit including conductive traces and pads on
a flexible substrate secured to the article of clothing; at least
one electronic component populating the flex circuit; and a
protective covering over the flex circuit and the at least one
electronic component.
25. An electrically active textile article comprising: fabric; a
flex circuit including conductive traces and pads on a flexible
substrate secured to the fabric, the flex circuit including stress
relief areas to promote flexure of the flex circuit on the fabric;
at least one electronic component populating the flex circuit; and
a protective covering over the flex circuit and the at least one
electronic component.
26. An electrically active textile article comprising: fabric; a
flex circuit including conductive traces and pads on a flexible
substrate; at least one electronic component populating the flex
circuit; and a covering secured to the fabric over the flex circuit
and the at least one electronic component, wherein the flex circuit
is in pressed engagement with the fabric and the covering.
Description
RELATED APPLICATIONS
[0001] This application is a divisional of U.S. patent application
Ser. No. 09/981,480 filed Oct. 16, 2001, hereby incorporated by
reference, which claims priority of U.S. Provisional Patent
Application Ser. No. 60/240,808 filed Oct. 16, 2000 and U.S.
Provisional Patent Application Ser. No. 60/327,259 filed Oct. 5,
2001.
FIELD OF THE INVENTION
[0002] This invention relates to a novel method of manufacturing a
fabric article to include electronic circuitry and to an
electrically active textile article useful, for example, in the
fields of wearable circuitry and wearable computers, medical
sensors and novelty devices.
BACKGROUND OF THE INVENTION
[0003] The idea of "wearable" circuitry and "wearable" computers is
not new. U.S. Pat. No. 6,210,771, incorporated herein by this
reference, discloses fabrics with integral circuits in that select
fibers of the fabric are conductive creating electrical pathways.
Electronic components are then soldered to the conductive fibers in
the fabric some of which must be cut to avoid unwanted electrical
connections. Also, since the conductive fibers are constrained to
run only in the weft direction, the electronic components to be
electrically interconnected to the weft direction conductive fibers
are constrained in their arrangement.
[0004] Also in the prior art is the idea of a rigid circuit board
placed on a fabric article and housed thereon in a polymer shell.
The problem with this design is that the circuit board is not in
intimate contact with the fabric and, in addition, the polymer
shell protrudes from the fabric article limiting its usefulness and
also limiting the maximum size of the rigid circuit board.
SUMMARY OF THE INVENTION
[0005] It is therefore an object of this invention to provide
textile based wearable and even non-wearable circuitry which does
not require any modification to the fabric article.
[0006] It is a further object of this invention to provide a method
of manufacturing a fabric article to include electronic circuitry
which eliminates the need for conductive fibers in the fabric and
the need to cut select conductive fibers to avoid unwanted
electrical connections.
[0007] It is a further object of this invention to provide an
electrically active textile article in which the position and
arrangement of the various electronic components are not
constrained.
[0008] It is a further object of this invention to avoid the use of
rigid circuit boards.
[0009] It is a further object of this invention to provide a
comfortable, waterproof, washable, low-profile, and flexible
circuit addition to the fabric of an article of clothing.
[0010] This invention results from the realization that by
employing a circuit typically embodied in a flex circuit secured to
fabric, the need for conductive fibers in the fabric is eliminated,
the position and arrangement of the various electronic components
are not constrained, and, instead, the result is a comfortable,
waterproof, washable, low-profile, and flexible wearable
circuit.
[0011] This invention features a method of manufacturing a fabric
article to include electronic circuitry. The preferred method
comprises assembling a circuit, typically a flex circuit, to
include electrically conductive or merely decorative traces and
pads on a flexible substrate, placing a fabric article on a rigid
surface, and securing the substrate of the flex circuit to the
fabric article.
[0012] In the preferred embodiment, an ultrasonic device, such as a
handheld ultrasonic horn, is used to weld the substrate to the
fabric. The rigid surface may be made of stainless steel. In other
embodiments, an adhesive is used to fix the substrate on the
fabric. In still another embodiment, the substrate is sewn to the
fabric and a layer of additional material may be inserted between
the substrate and the fabric to reinforce the stitch area. Also, in
the preferred embodiment, a water proof protective covering is
secured over the flex circuit. In one example, this protective
covering extends onto the fabric.
[0013] The flex circuit may be populated with electronic components
before or even after the substrate is secured to the fabric. In one
embodiment, the flexible substrate is a thermoplastic material and
the conductive traces and pads are metal. The fabric maybe selected
from the group consisting of woven, knit, non-woven, and braided
fabrics. The fabric is typically a portion of a wearable article or
other useable articles.
[0014] Preferably, stress relief areas are formed in the flex
circuit to promote flexure of the flex circuit. The stress relief
areas may be cut-outs in edges of the flex circuit, cut-outs
through the flex circuit, channels formed in the flex circuit,
and/or material (e.g., a polymer) added to the substrate of the
flex circuit. Typically, the stress relief areas are located
between electronic components on the flex circuit.
[0015] In one example, two flex circuits are secured to the fabric
and electrically interconnected. The two flex circuits may be
secured and electrically interconnected by a zipper or a pair of
VELCRO.RTM. patches, portions of which are conductive to provide
the electrical interconnections. The flex circuits may include
conductive solder pads thereon, and the fabric may be a
polyester-coated copper fabric. The solder pads and the polyester
coating are melted to provide the electrical interconnections.
[0016] Preferably, the flex circuit includes a perimeter bond area
devoid of conductive traces and pads and the step of securing then
typically includes fixing the perimeter bond area of the flex
circuit to the fabric. Perimeter reinforcement may be provided by a
perimeter area including material added to the substrate.
[0017] This invention also features an electrically active textile
article. A flex circuit including conductive traces and pads on a
flexible substrate is secured to the fabric and at least one
electronic component populates the flex circuit. The flex circuit
substrate may be ultrasonically welded to the fabric about the
periphery of the substrate which, in one example, includes a
perimeter bond area devoid of conductive traces and pads. An
adhesive may also be used to secure the flexible substrate to the
fabric. Alternatively, threads secure the flexible substrate to the
fabric.
[0018] In the preferred embodiment, a waterproof protective
covering extends over the flex circuit. The protective covering may
further extend onto the fabric itself.
[0019] In one example, the flexible substrate is made of a
thermoplastic material and the conductive traces and pads are
metal. The fabric may be selected from the group consisting of
woven, knit, non-woven, and braided fabrics. In many cases, the
fabric is a portion of a wearable article.
[0020] Preferably, stress relief areas in the flex circuit promote
flexure of the flex circuit. The stress relief areas may be
cut-outs in the edges of the flex circuit, cut-outs through the
flex circuit, channels formed in the flex circuit, or material
added to the flex circuit substrate. Typically, the stress relief
areas are located between electronic components on the flex
circuit. In one example, two flex circuits are secured to the
fabric and there are electrical interconnections between the two
flex circuits. The two circuits may be secured to the fabric by a
zipper or at least one pair of VELCRO.RTM. patches. The zipper may
include conductive teeth and the VELCRO.RTM. patches may include
conductive portions to provide the electrical interconnections. The
two circuits may include conductive solder pads thereon, and the
fabric may include polyester-coated copper fabric, with the solder
pads and the coating being melted to formed the electrical
connections.
[0021] One method of manufacturing a fabric article to include
electronic circuitry in accordance with this invention includes
assembling a flex circuit to include conductive traces and pads on
a flexible substrate, placing a fabric article on a rigid surface,
securing the substrate of the flex circuit to the fabric article,
populating the flex circuit with electronic components, and
securing a protective covering over the flex circuit and the
electronic components.
[0022] The preferred method of manufacturing a clothing article to
include electronic circuitry includes assembling a flex circuit to
include conductive traces and pads on a flexible substrate, placing
an article of clothing on a rigid surface, securing the substrate
of the flex circuit to the article of clothing, populating the flex
circuit with electronic components, and securing a protective
covering over the flex circuit and the electronic components.
[0023] The preferred electrically active clothing article of this
invention includes a flex circuit including conductive traces and
pads on a flexible substrate secured to an article of clothing. The
flex circuit includes stress relief areas which promote flexure of
the flex circuit on the fabric of the article. Electronic
components populate the flex circuit and a protective covering is
placed over the flex circuit and the electronic components.
[0024] This invention also features a method of manufacturing a
clothing article with at least upper and lower layers of fabric
material to include electronic circuitry, comprising assembling a
flexible circuit with traces and pads on a substrate, placing a
rigid support surface between the upper and lower layers of fabric
material, the rigid support surface comprising a stainless steel
plate, and securing the substrate to the upper layer of the
clothing article using a hand held ultrasonic horn to bond the
substrate to the upper layer.
[0025] In another embodiment, this invention features a method for
manufacturing a fabric article to include electronic circuitry, the
method comprising assembling a flexible circuit to include traces
and pads on a substrate, placing the substrate between the fabric
article and a protective covering, and securing the protective
covering to the fabric article so that the flexible circuit is in
pressing engagement with the fabric article and the protective
covering. Alternatively, the protective covering may be secured to
the fabric article such that at least one edge of the protective
covering is unattached, thereby forming a pocket into which the
substrate is placed, and the bonding the at least one edge of the
protective covering to the fabric article.
[0026] This invention also features an electrically active textile
article including fabric, a flex circuit including conductive
traces and pads on a substrate, at least one electronic component
populating the flex circuit, and a protective covering secured to
the fabric over the flex circuit and the at least one electronic
component such that the flex circuit is in pressed engagement with
the fabric and the protective coating.
BRIEF DESCRIPTION OF THE DRAWINGS
[0027] Other objects, features and advantages will occur to those
skilled in the art from the following description of a preferred
embodiment and the accompanying drawings, in which:
[0028] FIG. 1A is a schematic top view of the prior art wearable
electronic circuitry shown in U.S. Pat. No. 6,210,771;
[0029] FIG. 1B is schematic view showing the conductive fibers of
the fabric shown in FIG. 1A;
[0030] FIG. 1C is another schematic view showing the conductive
fibers of the fabric shown in FIG. 1A;
[0031] FIG. 2 is a schematic view showing a rigid circuit board
enclosed on a piece of fabric by a polymer housing in accordance
with other prior art;
[0032] FIG. 3 is a schematic view of an electrically active textile
article in accordance with the subject invention;
[0033] FIG. 4 is an exploded schematic view showing the primary
components associated with the manufacturing method associated with
the electrically active textile article of the subject
invention;
[0034] FIG. 5 is a schematic view depicting how, in one embodiment,
an ultrasonic horn is used to weld the flex circuit shown in FIG. 4
to a fabric article in accordance with the subject invention;
[0035] FIG. 6 is a schematic cross-sectional view showing the
addition of a protective covering to the flex circuit populated
with electronic components to protect them in accordance with the
subject invention;
[0036] FIG. 7 is a schematic view showing, in one embodiment,
cut-out stress-relief areas in a flex circuit of the subject
invention to promote flexure thereof;
[0037] FIG. 8 is a schematic view showing different kinds of
cut-outs in a flex circuit to promote flexure thereof in accordance
with the subject invention;
[0038] FIG. 9 is a schematic cross-sectional view showing channels
formed in a flex circuit to provide stress relief in accordance
with the subject invention;
[0039] FIG. 9A is a schematic view showing dimples in a flex
circuit to promote flexure thereof in accordance with the subject
invention;
[0040] FIG. 10 is a schematic view of a possible large area flex
circuit addition to a wearable article in accordance with the
subject invention;
[0041] FIG. 11 is a schematic view similar to FIG. 10 except now
the large area flex circuit is divided into two smaller area flex
circuits in accordance with one preferred embodiment of the subject
invention;
[0042] FIG. 12 is a schematic view showing a flex circuit secured
to a fabric article with material added to the flex circuit
substrate and spot and weld lines to provide stress relief between
adjacent electronic components;
[0043] FIG. 13 is a schematic cross sectional view of a flex
circuit including raised peripheral reinforcement areas in
accordance with this invention;
[0044] FIG. 14 is a schematic view of a flex circuit secured to a
shirt and including a graphic design in accordance with this
invention;
[0045] FIG. 15 is a schematic cross sectional view of a flex
circuit in accordance with this invention with a compliant backing
layer disposed between the flex circuit and the textile layer;
[0046] FIG. 16 is another cross sectional view showing pockets in
the compliant backing layer which receive electronic components in
accordance with this invention;
[0047] FIGS. 17-18 are schematic cross sectional views showing how
a flex circuit with electronic components on both sides thereof can
be folded over and secured to a fabric article in accordance with
this invention;
[0048] FIGS. 19A-19E are schematic views of alternate attachment
methods in accordance with this invention; and
[0049] FIG. 20 is a schematic view of a method of attachment
including a layer of additional material in accordance with this
invention.
DISCLOSURE OF THE PREFERRED EMBODIMENT
[0050] As disclosed in the background section above, U.S. Pat. No.
6,210,771 discloses fabric 5, FIG. 1A including conducting fibers
10, FIGS. 1B and 1C running in the weft direction and
non-conductive "regular" fibers 15 running in the warp direction.
Electronic components 20, 23, and 24 are soldered to select weft
direction conductive fibers 10 which serve as the electrical
interconnects between the various electronic components.
[0051] Problems with this design include the fact that certain
conductive fibers must be cut to avoid unwanted electrical
connections or to terminate certain signal lines. Moreover, since
the direction of conductivity is constrained to the weft direction,
placement of the individual electronic components in this design is
unduly constrained.
[0052] FIG. 2 schematically depicts another prior art design
wherein rigid circuit board 30 is placed on fabric 32 and housed
thereon in polymer shell 34 shown in phantom. As delineated in the
Background section above, this design suffers from the limitation
that polymer shell 34 protrudes from fabric 32 and thus circuit
board 30 must be very small else it and polymer shell 34 would
severely reduce the comfort and usability of the resulting article
of clothing.
[0053] In this invention, wearable fabric article, for example
shirt 40, FIG. 3, includes circuit 42 including conductive traces
and pads 44 on substrate 46 secured to the fabric 48 of shirt 40.
Preferably, substrate 46 is flexible and thus circuit 42
constitutes a flex circuit. Electronic components 50 populate flex
circuit 42 resulting in a novel wearable article with various
circuit or even computing functionality. In another example, traces
and pads 44 form a design only and have no actual electrical
functionality.
[0054] Unlike the design shown in FIG. 1, no modification need be
made to fabric 48 and electronic components 50 are not constrained
in their placement on circuit 42. In addition, unlike the design
shown in FIG. 2, this invention features a low-profile (e.g.,
{fraction (1/16)}" or less inches thick) comfortable design and the
size of flex circuit 42 is not unduly constrained.
[0055] FIGS. 4-5 depict the preferred method of manufacturing a
fabric article to include the desired electronic circuitry. First,
flex circuit 42 is assembled to include conductive traces and pads
44 on flexible substrate 52 in the desired configuration. The
choices for flexible substrate 52 are many and will depend on the
specific implementation. Exemplary choices include thermoplastics
such as polyester, polyimides, and resin impregnated fabrics e.g.,
KEVLAR.RTM. fabric impregnated with a polyester or acrylic resin as
shown in U.S. Pat. No. 4,851,613 incorporated herein by this
reference. See also U.S. Pat. Nos. 5,763,058 and 4,191,800 also
incorporated herein by this reference. Substrate 52 of flex circuit
42 may also be made of different thermoplastic, thermoset, or
solution cast materials. The choice of the material for the
conductive traces and pads or electrical "pathways" 44 is also
varied and includes copper and other conductive metals, conductive
inks or polymers printed or deposited on, or in the case of
conductive foil, laminated to flexible substrate 52. The pattern of
the traces and pads will vary depending on the placement and type
of electronic components 50 to be electrically interconnected on
flex circuit 42 via the traces and pads.
[0056] Electronic components 50, FIG. 4 may include many different
types of digital or analog integrated circuits, microprocessors,
power sources such as batteries, ROMs, RAMs, logic chips,
accelerometers and other motion sensor type chips, LEDs, surface
and lead mount chips of many different possible configurations and
functionalities. The chosen electronic components may populate flex
circuit 42 either before or after flexible substrate 52 of flex
circuit 42 is secured to fabric 48 which may in the form of a
wearable item (e.g., a shirt, coat, pants, hat) or a non-wearable
article (e.g., a tent, umbrella, canopy, or backpack). Thus,
"fabric" as used herein includes woven, knit, non-woven (e.g.,
felt), and braided fabrics.
[0057] The preferred method of securing substrate 52 of flex
circuit 42 to fabric 48 is to first place fabric 48 on rigid
support surface 60, FIG. 5 and second to position flex circuit 42
in the desired position on fabric 48. In the preferred embodiment,
flex circuit 42 includes perimeter bond area 62 of substrate 52
devoid of any conductive lands and it is this perimeter bond area
62 which is secured to fabric 48.
[0058] In one example, ultrasonic horn 64 is used in the case where
substrate 52 is or includes a thermoplastic material to weld the
perimeter bond area of substrate 52 to fabric 48. Ultrasonic horn
64 may be a hand held device or it may be attached to a gantry arm
(not shown). In a preferred embodiment, the tip of ultrasonic horn
64 is rounded to reduce the possibility of cutting through the
substrate. Ultrasonic horn 64 may be part of a "sonic sewing
machine" in which a series of ultrasonic horns are attached to a
circular wheel to allow for continuous ultrasonic welding. Such
sonic welding machines also allow for specific patterns of
ultrasonic welding.
[0059] During the ultrasonic welding process, ultrasonic horn 64 is
in contact with substrate 52 at a pressure and for a time
sufficient to bond substrate 52 to fabric 48. The time and pressure
requirements are well known to those skilled in the art of
ultrasonic welding.
[0060] Rigid support surface 60 is selected of a material which
effectively acts as a barrier to the ultrasonic energy from
ultrasonic horn 64. By placing rigid support surface between layers
of fabric 48, substrate 52 is only bonded to the top layer of
fabric 48. Rigid support surface 60 should be chosen of a material
that does not convert the ultrasonic energy from ultrasonic horn 64
to heat energy or that is able to effectively dissipate any heat
energy so generated. Metals are a preferred material for rigid
support surface 60, with stainless steel being especially
useful.
[0061] In other examples, radio frequency and/or thermal lamination
processes are employed. An adhesive may also be used between
flexible substrate 52 and fabric 48 and/or sewing techniques may be
used to secure flexible substrate 52 to fabric 48. In one preferred
embodiment, an additional layer of material 282 (FIG. 20) may be
used to reinforce the stitch area 284. Also, substrate 52 may be
secured to fabric 48 using rivets 270 (FIG. 19A), plated through
holes 272 (FIG. 19B), VELCRO.RTM. patches 274 (FIG. 19C), or
zippers 278 (FIG. 19D). Patches 274 (FIG. 19C) may be of any size
and shape based on the particular application. Alternatively, the
complete area of the flex circuit is laminated or otherwise secured
to the textile article. In the typical example, electronic
components 50, FIG. 4 are then populated on flex circuit 42 after
it is secured to fabric 48. In other examples, select or even all
of the electronic components populate flex circuit 42 before it is
secured to fabric 48.
[0062] In the preferred embodiment, waterproof protective covering
70, FIG. 6 covers flex circuit 42 and even extends onto fabric 48
in some examples as shown in phantom at 72 to protect the
electronic components 50 on flex circuit 42 during washing of the
article of clothing or against the elements in the case of outdoor
and military fabric items. Protective covering 70 may be a
polymeric passivation layer laminated, dipped, sprayed, or welded
over flex circuit 42 and the electric components thereon. In one
example, the flex circuit itself includes a passivation layer. In
some embodiments, the back side of the flex circuit is protected by
the material of the flex circuit. In other examples, another
waterproof protective covering covers the back side of fabric 48
about flex circuit 42. In still another example, a protective (e.g.
PVC) layer is interposed between flex circuit 42 and fabric 48. It
is also possible to use covering 70 to press flex circuit 42 into
engagement with fabric 48 and covering 70. In this example, flex
circuit 42 is not secured to fabric 48 as previously disclosed.
Rather, flex circuit 42 is placed on fabric 48 and covering 70 is
then secured to fabric 48 such that flex circuit 42 is in pressing
engagement with fabric 48 and covering 70. Alternatively, covering
70 may first be secured to fabric 48 with at least one edge of
covering 70 left unattached to form a "pocket". Flex circuit 42 may
then be placed into the pocket and the remaining edge, or portion
thereof, of covering 70 may then be secured to fabric 48 such that
flex circuit 42 is in pressing engagement with fabric 48 and
covering 70.
[0063] Especially in the case where the flex circuit is attached to
an article of clothing and one or more of the electronic components
are fairly large chips, it is preferred that the flex circuit is
formed to include stress relief areas to promote flexibility of the
flex circuit. In the example shown in FIG. 7, stress relief areas
80 and 82 are cut-outs in the edges of flex circuit 42' between the
two electronic components 50 shown. In the example shown in FIG. 8,
stress relief areas 84, 86, and 88 are cut-outs through flex
circuit 42" between the electronic components. In the example shown
in FIG. 9, the stress relief areas are channels 90 formed in flex
circuit 42"'. Dimples 92, FIG. 9A, may be formed in flex circuit
42.sup.VII to provide stress relief areas. Dimples 92 may be formed
between components, at the periphery of the circuit, or both, as
shown. Dimples 92 may be formed by using an ultrasonic or a radio
frequency device.
[0064] In the design shown in FIG. 10, flex circuit 42.sup.IV is
rather large in area covering much of the front of shirt 100. To
further promote comfort, flex circuit 42.sup.IV may be separated
into two or more flex circuits 42.sup.V and 42.sup.VI as shown in
FIG. 11 each secured to the fabric of shirt 100 as discussed above
and electrically interconnected via conductive pathways 102. These
pathways may be in the form of a flexible conductive ribbon as
disclosed in co-pending application Ser. No. 09/715,496 filed Nov.
17, 2000 or, alternatively, integral with the fabric of shirt 100
as disclosed in U.S. Pat. No. 6,210,771, or even combinations of
these two ideas. Both of these references are hereby incorporated
herein. Alternatively, another flex circuit configured as an
electrical bus can be secured to the fabric between flex circuits
42.sup.V and 42.sup.VI. Conductive pathways 104 may extend from
flex circuit 42.sup.VI as electrical interconnects which provide
power to or signals from flex circuits 42.sup.V and 42.sup.VI.
[0065] In the design shown in FIG. 19C, conductive elements 276 of
VELCRO.RTM. patches 274 are used as electrical interconnects or
conductive pathways 102. In FIG. 19D, conductive teeth 280 of
zipper 278 are used as electrical interconnects or conductive
pathways 102. Conductive solder pads 290, FIG. 19E, may be used to
form electrical interconnects with electrical traces 292 in fabric
48'. Fabric 48' may be made from a coated metal fabric, such as a
polyester-coated copper fabric which is known in the art. When heat
is applied, conductive solder pads 290 and the polyester coating on
the copper fabric melt, thereby forming the electrical
interconnects.
[0066] Examples of uses for fabric articles including electronic
circuitry in accordance with this invention includes novelty items;
military uses; medical uses employing various sensors, for example;
as "wearable computers"; "wearable keyboards"; and the like. The
wearable circuitry of this invention does not require any
modification to the fabric article and, in the preferred
embodiment, no conductive fibers in fabric exist which would have
to be cut to avoid unwanted electrical connections or to terminate
signal pathways. In the subject invention, there are few
constraints concerning the position and arrangement of the various
electronic components. Moreover, the use of rigid circuit boards is
avoided. When embodied in a wearable article of clothing, the
result is a comfortable, easy to manufacture, waterproof, washable,
low-profile, and flexible electronic circuitry addition to the
fabric of the clothing.
[0067] In the design shown in FIG. 12, spot welds 200 and/or line
weld 202 are employed between electronic components 206, 208 and
210 to provide stress relief. Alternatively, areas 200 and 202
constitute material added (e.g., a polymer) to the substrate of the
flex circuit between select electronic components for stress
relief.
[0068] In the design shown in FIG. 13, flex circuit substrate 52
includes raised peripheral area 214 for reinforcement since it is
typically peripheral area 214 that is secured to the textile
article. Peripheral area 214 may be the same material as substrate
52 or even a conductive copper layer deposited thereon with holes
therein which receive stitching.
[0069] In FIG. 14, LEDs 220 populate flex circuit 42 on shirt 230
and graphics are added as shown at 232. The graphics can be printed
or embroidered or alternatively can be traces and pads deposited on
the substrate of flex circuit 42.
[0070] In the example shown in FIG. 15, a compliant backing layer
260 (for example a gel layer or polymeric layer) is disposed
between flex circuit 42 and textile layer 48 for comfort. In FIG.
16, flex circuit 42 includes electronic components on the back side
thereof as shown and complaint backing layer 260 includes pockets
262 which house the back side electronic components.
[0071] In FIGS. 17-18, flex circuit 42 is folded on fold line 264
and secured to fabric 48 over compliant layer 260. In this way,
battery 50' or another large area electronic component resides in
pocket 262 while smaller electronic components 50 (e.g., LEDs)
reside on the outer surface of flex circuit 42.
[0072] In the above disclosure, specific features of the invention
are shown in some drawings and not in others. This is for
convenience only as each feature may be combined with any or all of
the other features in accordance with the invention. The words
"including", "comprising", "having", and "with" as used herein are
to be interpreted broadly and comprehensively and are not limited
to any physical interconnection. Moreover, any embodiments
disclosed in the subject application are not to be taken as the
only possible embodiments.
[0073] Other embodiments will occur to those skilled in the art and
are within the following claims.
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