U.S. patent application number 10/425891 was filed with the patent office on 2004-11-04 for method of replicating a high resolution three-dimensional imprint pattern on a compliant media of arbitrary size.
Invention is credited to Jeans, Albert H..
Application Number | 20040217085 10/425891 |
Document ID | / |
Family ID | 33029751 |
Filed Date | 2004-11-04 |
United States Patent
Application |
20040217085 |
Kind Code |
A1 |
Jeans, Albert H. |
November 4, 2004 |
METHOD OF REPLICATING A HIGH RESOLUTION THREE-DIMENSIONAL IMPRINT
PATTERN ON A COMPLIANT MEDIA OF ARBITRARY SIZE
Abstract
A method for replicating a high resolution three-dimensional
imprint pattern on a compliant media is disclosed. The compliant
media carries an imprint stamp that includes three-dimensional
features that can be used as an imprint stamp in a roll-to-roll
transfer printing process. The compliant media can be made to any
size and can be connected with a belt or a cylinder. The compliant
media can be optically transparent and the belt or cylinder can
also be optically transparent so that a light source positioned
inside or outside the belt or the cylinder can irradiate another
media that is urged into contact with the compliant media.
Inventors: |
Jeans, Albert H.; (Mountain
View, CA) |
Correspondence
Address: |
HEWLETT-PACKARD DEVELOPMENT COMPANY
Intellectual Property Administration
P.O. Box 272400
Fort Collins
CO
80527-2400
US
|
Family ID: |
33029751 |
Appl. No.: |
10/425891 |
Filed: |
April 29, 2003 |
Current U.S.
Class: |
216/4 |
Current CPC
Class: |
B82Y 10/00 20130101;
B81C 99/009 20130101; G03F 7/0015 20130101; G03F 7/0002 20130101;
G03F 7/20 20130101; B82Y 40/00 20130101 |
Class at
Publication: |
216/004 |
International
Class: |
H05B 033/10 |
Claims
What is claimed is:
1. A method of replicating a high resolution three-dimensional
imprint pattern on a compliant media, comprising: forming an
imprint stamp on a master substrate by patterning and then etching
the master substrate to define an imprint pattern in the substrate;
depositing a release layer over the imprint pattern, the release
layer including a first thickness operative to conformally coat the
imprint pattern; depositing a silicone-based elastomer layer over
the release layer to a first depth operative to completely cover
the imprint pattern; curing the silicone-based elastomer layer by
heating the master substrate; releasing the silicone-based
elastomer layer from the release layer; separating the imprint
stamp from an excess portion of the silicone-based elastomer layer
that surrounds the imprint stamp; repeating the above steps, as
necessary, to form additional imprint stamps from the master
substrate; placing a flat and thin plastic film having a third
thickness on a flat and compliant silicone rubber backing having a
fourth thickness; coating a surface of the thin plastic film with a
photopolymer solution; spreading the photopolymer solution over the
surface of the plastic film to form a photopolymer layer having a
fifth thickness; placing a patterned surface of the imprint stamp
on the photopolymer layer; curing the photopolymer layer to fix a
position of the imprint stamp on the photopolymer layer and to
transfer an image of the imprint pattern on the patterned surface
of the imprint stamp to the photopolymer layer by irradiating the
photopolymer layer with an ultraviolet light of a predetermined
intensity for a first time period; separating the imprint stamp
from the photopolymer layer so that the image of the imprint
pattern defines a photopolymer shim; post-curing the photopolymer
shim by heating the photopolymer shim; depositing a coating of a
fluorocarbon material having a sixth thickness on the photopolymer
shim; separating the thin plastic film from the silicone rubber
backing; attaching the photopolymer shim to a support substrate;
attaching a shim stock having a first height to the support
substrate, the shim stock is positioned adjacent to the
photopolymer shim and is spaced apart from the photopolymer shim by
a first distance; coating the photopolymer shim and the shim stock
with a compliant material selected from the group consisting of a
silicone-based elastomer material and an amorphous fluoropolymer
material; spreading the compliant material over the photopolymer
shim and the shim stock to form a compliant media that covers the
photopolymer shim and the shim stock and to transfer the imprint
pattern in the photopolymer shim to the compliant media; heating
the support substrate; cooling the support substrate; separating
the shim stock from the compliant media; applying a first adhesive
surface of a transfer adhesive layer to a surface of the compliant
media so that the transfer adhesive layer adheres to the compliant
media, the transfer adhesive layer includes a seventh thickness and
a second adhesive surface; and separating the compliant media from
a selected one of the support substrate or the photopolymer shim by
peeling back the transfer adhesive layer.
2. The method as set fourth in claim 1, wherein the master
substrate is a material selected from the group consisting of a
silicon substrate and a silicone wafer.
3. The method as set fourth in claim 1, wherein the release layer
comprises a fluorocarbon material.
4. The method as set fourth in claim 1, wherein the first thickness
of the release layer is from about 50.0 nanometers to about 150.0
nanometers.
5. The method as set fourth in claim 1, wherein the silicone-based
elastomer layer is a material selected from the group consisting of
Polydimethyl Siloxane, SYLGARD 182, SYLGARD 183, SYLGARD 184, and
SYLGARD 186.
6. The method as set fourth in claim 1, wherein the first depth of
the silicone-based elastomer layer is from about 0.5 millimeters to
about 1.5 millimeters.
7. The method as set fourth in claim 1, wherein curing the
silicone-based elastomer layer comprises heating the master
substrate for about 4.0 hours at about 100.0 degrees
centigrade.
8. The method as set fourth in claim 1, wherein the step of
separating the silicone-based elastomer layer from the release
layer comprises lifting off the silicone-based elastomer layer from
the release layer by grabbing an edge portion of the silicone-based
elastomer layer and peeling off the silicone-based elastomer layer
from the release layer.
9. The method as set fourth in claim 1, wherein the step of
separating the imprint stamp further comprises: placing the
silicone-based elastomer layer on a substantially flat substrate;
cutting around a perimeter of the imprint stamp to release the
excess portions of the silicone-based elastomer layer from the
imprint stamp; and peeling off the excess portions of the
silicone-based elastomer layer from the substrate so that the
imprint stamp is not connected with the excess portions of the
silicone-based elastomer layer.
10. The method as set fourth in claim 9, wherein the substantially
flat substrate is a material selected from the group consisting of
a glass, a metal, a plastic, and quartz.
11. The method as set fourth in claim 1, wherein the thin plastic
film is a material selected from the group consisting of a Polymide
and a Polyester.
12. The method as set fourth in claim 1, wherein the third
thickness of the thin plastic film is from about 40.0 micrometers
to about 100.0 micrometers.
13. The method as set fourth in claim 1, wherein the fourth
thickness of the silicone rubber backing is from about 0.125 inches
to about 0.25 inches.
14. The method as set fourth in claim 1, wherein the spreading of
the photopolymer solution comprises sliding a Mayer bar including a
wire of a first diameter across the surface of the plastic
film.
15. The method as set fourth in claim 14, wherein the first
diameter of the wire on the Mayer bar is from about 50.0
micrometers to about 100.0 micrometers.
16. The method as set fourth in claim 1, wherein the photopolymer
solution comprises a mixture of about 50% of a photopolymer
material and about 50% acetone.
17. The method as set fourth in claim 16, wherein the photopolymer
material is a Norland NOA 83H photopolymer.
18. The method as set fourth in claim 1, wherein the fifth
thickness of the photopolymer layer is from about 5.0 micrometers
to about 10.0 micrometers.
19. The method as set fourth in claim 1, wherein the placing the
imprint stamp on the photopolymer layer further comprises: placing
an edge portion of the imprint stamp in contact with the
photopolymer layer and holding the edge portion down; and
progressively lowering a remainder of the patterned surface into
contact with the photopolymer layer.
20. The method as set fourth in claim 19 and further comprising:
floating the imprint stamp on a surface of the photopolymer layer
to position the imprint stamp at a predetermined location on the
photopolymer layer.
21. The method as set fourth in claim 1, wherein the placing the
imprint stamp on the photopolymer layer further comprises: floating
the imprint stamp on the photopolymer layer to position the imprint
stamp at a predetermined location on the photopolymer layer.
22. The method as set fourth in claim 1, wherein the ultraviolet
light for the curing of the photopolymer layer comprises a
wavelength from about 300.0 nanometers to about 400.0
nanometers.
23. The method as set fourth in claim 1, wherein the ultraviolet
light is generated by a UVA ultraviolet light source.
24. The method as set fourth in claim 1, wherein the predetermined
intensity of the ultraviolet light is about 150 milliwatts per
centimeter squared.
25. The method as set fourth in claim 1, wherein the first time
period for the curing of the photopolymer layer is from about 5.0
seconds to about 60.0 seconds.
26. The method as set fourth in claim 1, wherein the post-curing of
the photopolymer shim comprises heating the photopolymer shim for
about 1.0 hour at about 100.0 degrees centigrade.
27. The method as set fourth in claim 1 and further comprising
rinsing the photopolymer shim with acetone after the post-curing
step.
28. The method as set fourth in claim 1, wherein the attaching the
photopolymer shim to the support substrate comprises laying the
photopolymer shim on the support substrate and fastening an end of
the photopolymer shim to the support substrate using a high
temperature adhesive tape.
29. The method as set fourth in claim 1, wherein the support
substrate for the photopolymer shim is a material selected from the
group consisting of a glass, and quartz.
30. The method as set fourth in claim 1, wherein the shim stock is
attached to the support substrate using a high temperature adhesive
tape.
31. The method as set fourth in claim 1, wherein the first height
of the shim stock is from about 0.5 millimeters to about 1.5
millimeters.
32. The method as set fourth in claim 1, wherein the first distance
between the shim stock and the photopolymer shim is from about 1.0
millimeters to about 3.0 millimeters.
33. The method as set fourth in claim 1, wherein the silicone-based
elastomer material for coating the photopolymer shim and the shim
stock is a material selected from the group consisting of
Polydimethyl Siloxane, SYLGARD 182, SYLGARD 183, SYLGARD 184, and
SYLGARD 186.
34. The method as set fourth in claim 1, wherein the support
substrate is pre-heated to a temperature of about 100 degrees
centigrade.
35. The method as set fourth in claim 1, wherein the heating the
support substrate comprises heating the support substrate for about
1.0 hour at about 100.0 degrees centigrade.
36. The method as set fourth in claim 1, wherein the second
diameter of the wire on the Mayer bar is from about 1.0 millimeters
to about 2.0 millimeters.
37. The method as set fourth in claim 1, wherein the cooling of the
support substrate comprises allowing the support substrate to cool
down to about a room temperature.
38. The method as set fourth in claim 1, wherein the separating the
shim stock comprises cutting the compliant media along an edge of
the shim stock that is adjacent to the photopolymer shim.
39. The method as set fourth in claim 1, wherein the sixth
thickness of the fluorocarbon material is from about 50.0
nanometers to about 150.0 nanometers.
40. The method as set fourth in claim 1, wherein the seventh
thickness of the transfer adhesive layer is from about 20.0
micrometers to about 100.0 micrometers.
41. The method as set fourth in claim 1, wherein the transfer
adhesive layer is an optically transparent material.
42. The method as set fourth in claim 41, wherein the optically
transparent material is an ARclear DEV-8932 optically clear
silicone adhesive.
43. The method as set fourth in claim 1 and further comprising
laminating the compliant media to a belt material by applying the
second adhesive surface of the transfer adhesive layer to a surface
of the belt material.
44. The method as set fourth in claim 43, wherein the belt material
is an optically transparent material.
45. The method as set fourth in claim 44, wherein the optically
transparent material is a material selected from the group
consisting of a Polyester film and Mylar.
46. The method as set fourth in claim 1 and further comprising
laminating the compliant media to a cylinder by applying the second
adhesive surface of the transfer adhesive layer to an outer surface
of the cylinder.
47. The method as set fourth in claim 46, wherein the cylinder is
made from an optically transparent material selected from the group
consisting of a glass, quartz, and a plastic.
48. The method as set fourth in claim 1, wherein the an amorphous
fluoropolymer material comprises Teflon AF.
49. The method as set fourth in claim 1 and further comprising:
preheating the support substrate prior to the coating of the
photopolymer shim and the shim stock with the compliant material to
prepare the support substrate for the coating with the
silicone-based elastomer material.
Description
FIELD OF THE INVENTION
[0001] The present invention relates generally to a method for
replicating a three-dimensional imprint pattern on a compliant
media of arbitrary size. More specifically, the present invention
relates to a method for replicating one or more photopolymer shims
that include an imprint stamp on a compliant media that can be used
to transfer a high resolution three-dimensional imprint pattern
carried on the imprint stamp to another media that is brought into
contact with the compliant media in a soft lithography printing
process.
BACKGROUND OF THE INVENTION
[0002] Large scale shims are often created from smaller masters
using a process called recombination. In recombination, a small
master stamp is alternately heated and cooled while embossing a
thermoplastic substrate. As a result, a pattern in the master stamp
is transferred to the thermoplastic substrate. The thermoplastic
substrate can then be plated or otherwise coated to create other
shims. The machines used for the aforementioned process are
expensive (e.g. .gtoreq.$90,000) and are not guaranteed to work
with patterns that are submicron (i.e. less than 1.0 .mu.m) in
dimension due to a relatively high viscosity of the thermoplastic
substrate when in a molten state. Other proprietary processes are
available, such as automated holographic systems, for example.
However, those proprietary systems are also expensive and the cost
per shim can exceed several thousand dollars per shim.
[0003] Polydimethyl Siloxane (PDMS), a silicone rubber, is widely
recognized as a good material for soft lithography because of its
flexibility, non-stick properties, and transparency to ultraviolet
light. However, in thin sheets, PDMS is very difficult to handle
because it is elastic, tears easily, and tends to stick to
itself.
[0004] Consequently, there is a need for a low cost, durable, and
easy to handle compliant media for carrying an imprint stamp for
use in a soft lithography process. There is also a need for a
compliant media that can support an imprint stamp having submicron
feature sizes. There exists a need for a compliant media that is
optically transparent, particularly to ultraviolet light. Finally,
there is a need for a compliant media that is flexible, durable,
and can be connected with a belt or a cylinder.
SUMMARY OF THE INVENTION
[0005] Broadly, the present invention is embodied in a method for
replicating a high resolution three-dimensional imprint pattern on
a compliant media of arbitrary size. The compliant media can be
connected with a flexible belt material or it can be connected with
a cylinder. The compliant media carries an imprint stamp that can
include features having a submicron (i.e. less than 1.0 .mu.m)
feature size. The compliant media can be made any size and the
imprint patterns carried by the compliant media can be made from
the same master substrate or from different master substrates.
[0006] Advantages of the compliant media of the present invention
include it can be manufactured at a low cost in a bench top
laboratory environment, the compliant media is durable, flexible,
and can be made from optically transparent materials, particularly,
materials that are optically transparent to ultraviolet light. The
compliant media can be connected with an optically transparent belt
or cylinder for use in a soft lithography process wherein the
imprint stamp carried by the compliant media is used to emboss
another substrate that can be coated with a photopolymer material
and is then cured by an ultraviolet light source contemporaneously
with the embossing step.
[0007] Other aspects and advantages of the present invention will
become apparent from the following detailed description, taken in
conjunction with the accompanying drawings, illustrating by way of
example the principles of the present invention.
BRIEF DESCRIPTION OF THE DRAWINGS
[0008] FIGS. 1 through 5 depict patterning and etching a master
substrate to define an imprint pattern according to the present
invention.
[0009] FIG. 6 depicts a release layer conformally deposited on an
imprint pattern according to the present invention.
[0010] FIG. 7 depicts a silicon-based elastomer layer deposited
over a release layer according to the present invention.
[0011] FIGS. 8 through 10 depict separating a silicon-based
elastomer layer from a release layer to form an imprint stamp
according to the present invention.
[0012] FIG. 11 depicts applying a thin plastic film to a silicone
rubber backing according to the present invention.
[0013] FIG. 12 depicts a coating of a thin plastic film with a
photopolymer solution according to the present invention.
[0014] FIGS. 13 and 14 depict a spreading of a photopolymer
solution to form a photopolymer layer over a thin plastic film
according to the present invention.
[0015] FIG. 15 depicts a placing of a patterned side of an imprint
stamp on a photopolymer layer according to the present
invention.
[0016] FIG. 16 depicts curing a photopolymer layer according to the
present invention.
[0017] FIG. 17 depicts removing an imprint stamp from a
photopolymer layer according to the present invention.
[0018] FIG. 18 depicts a photopolymer shim formed in a photopolymer
layer according to the present invention.
[0019] FIG. 19 depicts a fluorocarbon coating deposited on a
photopolymer shim according to the present invention.
[0020] FIG. 20 depicts a photopolymer shim attached to a support
substrate according to the present invention.
[0021] FIG. 21 depicts a shim stock attached to a support substrate
and a pre-heating of the support substrate according to the present
invention.
[0022] FIGS. 22 and 23 depict coating and spreading a
silicone-based elastomer material over of a photopolymer shim and a
shim stock according to the present invention.
[0023] FIG. 24 depicts a heating of a support substrate according
to the present invention.
[0024] FIGS. 25 through 27 depict applying a transfer adhesive to a
compliant media according to the present invention.
[0025] FIG. 28 depicts separating a compliant media from a support
substrate according to the present invention.
[0026] FIG. 29 is a top plan view and a cross-sectional view of an
imprint pattern carried by a photopolymer shim according to the
present invention.
[0027] FIG. 30 depicts a compliant assembly according to the
present invention.
[0028] FIGS. 31a through 34b depict attaching a compliant assembly
to a cylinder according to the present invention.
[0029] FIGS. 35 through 37b depict attaching a compliant assembly
to a belt material according to the present invention.
DETAILED DESCRIPTION
[0030] In the following detailed description and in the several
figures of the drawings, like elements are identified with like
reference numerals.
[0031] As shown in the drawings for purpose of illustration, the
present invention is embodied in a method for fabricating a high
resolution three-dimensional imprint pattern on a compliant media
of arbitrary size. The compliant media can be connected with
another substrate such as a cylinder or a belt. The belt can be a
flexible belt. After connection with the substrate, the imprint
pattern can be used as part of a lithographic print process,
wherein, another coated substrate is passed under the belt or
cylinder and the imprint pattern on the compliant media is embossed
(i.e. transferred) to the coated substrate. The coated substrate
can be coated with a material such as a photopolymer and the
photopolymer can be cured contemporaneously with the embossing in
order to fix the imprinted pattern in the photopolymer.
[0032] In FIGS. 1 through 4, a master substrate 11 is patterned and
then etched to form an imprint pattern 20 therein. In FIG. 1, the
master substrate 11 is coated with a material 155 that will serve
as an etch mask. The material 155 can be a photoresist material
that is commonly used in the microelectronics art. A mask 151 that
carries a pattern 153 to be formed in the master substrate 11 is
illuminated with light 154 which exposes the material 155 with the
pattern 153.
[0033] In FIG. 2, the material 155 is developed to remove those
portions of the material 155 that were exposed to the light 154. In
FIGS. 2 and 3, the master substrate 11 is etched with an etch
material to remove those portions of the master substrate 11 that
are not covered with the material 155. As a result, in FIG. 3, a
plurality of imprint patterns 20p are formed in the master
substrate 11. In FIG. 4, the imprint patterns 20p define an imprint
stamp 20 on the master substrate 11.
[0034] The imprint stamp 20 can include imprint patterns 20p that
vary in all three dimensions of width, length, and height. In the
cross-sectional view of FIG. 4 and the top plan view of FIG. 5, the
imprint patterns 20p vary in a width dimension d.sub.0, a height
dimension h.sub.0, and a length dimension L.sub.0. The actual
dimensions of the imprint patterns 20p will be application
dependent and will depend to a large extent on the lithography
process used for the patterning the material 155. For example, if a
state-of-the-art microelectronics lithography process is used, then
the dimensions (d.sub.0, h.sub.0, L.sub.0) can be of a
sub-micrometer scale, that is, less than 1.0 .mu.m. For instance,
the imprint patterns 20p can be nano-imprint patterns that can have
dimensions (d.sub.0, h.sub.0, L.sub.0) of 100.0 nm or less.
Accordingly, the imprint stamp 20 would be a nano-imprint stamp
with imprint patterns 20p that have nanometer-size dimensions
(d.sub.0, h.sub.0, L.sub.0).
[0035] Lithography processes that are well understood in the
microelectronics art can be used to pattern and etch the master
substrate 11. For example, a photolithography process using a
photoresist for the material 155 and an etch process such as
reactive ion etching (RIE) can be used to form the imprint stamp 20
in the master substrate 11.
[0036] Suitable materials for the master substrate 11 include but
are not limited to a silicon (Si) substrate and a silicon (Si)
wafer. In FIG. 5, the master substrate 11 is a silicon wafer with a
wafer flat 11F. Four of the imprint stamps 20 are formed in the
master substrate 11. The silicon wafer can be any size. For example
a 4.0 inch silicon wafer was used as the master substrate 11 for
four of the imprint stamps 20. Larger diameter silicon wafers (e.g.
8 inch or 12 inch) can be used to provide a larger surface area for
more of the imprint stamps 20 or for larger imprint stamps 20.
Although the imprint patterns 20p appear to be identical in FIG. 5,
the imprint stamps 20 can include imprint patterns 20p that vary
(i.e are not identical) among the imprint stamps 20.
[0037] In FIG. 6, a release layer 13 is deposited over the imprint
patterns 20p. The release layer 13 includes a first thickness
t.sub.1 that is operative to conformally coat the imprint patterns
20p such that the first thickness t.sub.1 is substantially equally
thick on the vertical and the horizontal surfaces of the imprint
patterns 20p. Suitable materials for the release layer 13 include
but are not limited to a fluorocarbon material. As an example, the
fluorocarbon material for the release layer 13 can be deposited
using a plasma deposition of a trifluoromethane (CHF.sub.3) gas for
about 5.0 minutes.
[0038] The first thickness t.sub.1 will be application dependent;
however, as will be discussed below, the release layer 13 is
operative to provide a non-stick surface upon which to apply a
silicone-based elastomer material that will later be released from
the release layer 13. Therefore, the release layer 13 can be a very
thin layer having a first thickness t.sub.1 that is from about 50.0
nm to about 150.0 nm thick.
[0039] In FIG. 7, a silicone-based elastomer layer 15 is deposited
over the release layer 13 to a first depth d.sub.1 that completely
covers the imprint patterns 20p. To obtain a uniform thickness for
the silicone-based elastomer layer 15, the master substrate 11
should be substantially level. This can be accomplished by placing
the master substrate 11 on a level surface or a level vacuum chuck
prior to depositing the silicone-based elastomer layer 15, for
example.
[0040] The silicone-based elastomer layer 15 is then cured by
heating H the master substrate 11. The curing can be accomplished
by baking the master substrate 11 at a predetermined temperature
for a predetermined amount of time. The actual time and temperature
will be application dependent and will also depend on the type of
material used for the silicone-based elastomer layer 15. Suitable
materials for the silicone-based elastomer layer 15 include but are
not limited to Polydimethyl Siloxane (PDMS), DOW CORNING.RTM.
silicone-based conformal coatings including SYLGARD.RTM. 182
silicone elastomer, SYLGARD.RTM. 183 silicone elastomer,
SYLGARD.RTM. 184 silicone elastomer, and SYLGARD.RTM. 186 silicone
elastomer.
[0041] The first depth d.sub.1 of the silicone-based elastomer
layer 15 can be application dependent. However, in a preferred
embodiment, the first depth d.sub.1 of the silicone-based elastomer
layer 15 is from about 0.5 mm to about 1.5 mm. For PDMS or the DOW
CORNING.RTM. SYLGARD.RTM. silicone-based elastomers, the curing of
the silicone-based elastomer layer 15 can be accomplished by baking
the master substrate 11 in an oven or the like. The predetermined
temperature and the predetermined amount of time for the curing can
be for about 4.0 hours at a temperature of about 100.0.degree.
C.
[0042] In an alternative embodiment, also illustrated in FIG. 6,
prior to the above mentioned curing step, a cover layer 16 having a
second thickness t.sub.2 is applied over the already deposited
silicone-based elastomer layer 15. Preferably, the cover layer 16
is a Polyester film and the second thickness t.sub.2 is from about
50.0 .mu.m to about 150.0 .mu.m. The cover layer 16 may be used to
planarize any surface anomalies in the silicone-based elastomer
layer 15 that cause deviations from a substantially planar surface
15s of the silicone-based elastomer layer 15.
[0043] After the curing step, a complementary image of the imprint
patterns 20p are replicated 20r in the silicone-based elastomer
layer 15 such that an imprint stamp 20a is formed in the
silicone-based elastomer layer 15 (see FIGS. 8 through 10).
[0044] In FIG. 7, after the curing step, the silicone-based
elastomer layer 15 is released from the release layer 13. A tip of
a pair of tweezers or an edge of a knife or razor, such as an
X-Acto.RTM. Knife, can be used to separate the silicone-based
elastomer layer 15 from the release layer 13 as depicted by a knife
edge K and a dashed arrow inserted between the silicone-based
elastomer layer 15 and the release layer 13. The silicone-based
elastomer layer 15 can then be lifted off of the release layer 13
by grabbing an edge of the silicone-based elastomer layer 15 and
peeling off (see dashed arrow P) the silicone-based elastomer layer
15 from the release layer 13. If the above mentioned cover layer 16
is used, then the cover layer 16 is removed from the silicone-based
elastomer layer 15 before the silicone-based elastomer layer 15 is
released from the release layer 13.
[0045] In FIGS. 8, 9, and 10, the imprint stamp 20a is removed from
an excess portion of the silicone-based elastomer layer 15 that
surrounds the imprint stamp 20a. If the above mentioned cover layer
16 is used, then the imprint stamp 20a is removed from an excess
portion of the silicone-based elastomer layer 15 and the cover
layer 16 that surround the imprint stamp 20a.
[0046] In either case, the imprint stamp 20a can be removed from
the excess portion by placing the silicone-based elastomer layer 15
on a substantially flat substrate 21 and then cutting C around a
perimeter (see dashed lines in FIGS. 8 and 9) of the imprint stamp
20a to release the excess portions of the silicone-based elastomer
layer 15 or the silicone-based elastomer layer 15 and the cover
layer 16 from the imprint stamp 20a. A knife, razor, die, or the
like can be used to accomplish the cutting as depicted by a knife K
in FIG. 9. After the imprint stamp 20a has been released, the
excess portions (15, or 15 and 16) can be peeled off of the
substantially flat substrate 21 so that the imprint stamp 20a is no
longer connected with the excess portions (see FIG. 10). The
substantially flat substrate 21 can be a material including but not
limited to a glass, a metal, a plastic, and quartz. For example,
the substantially flat substrate 21 can be a glass plate.
[0047] Optionally, the above mentioned steps may be repeated as
necessary to produce additional imprint stamps 20a using the master
substrate 11. One advantage of the present invention is that the
master substrate 11 is not damaged by the aforementioned process
steps. Consequently, the same master substrate 11 can be repeatedly
used to produce several imprint stamps 20a. Therefore, the cost of
patterning and etching the master substrate 11 and depositing the
release layer 13 can be amortized over several imprint stamps
20a.
[0048] Another advantage of the present invention is that the
master substrate 11 need not be cleaned after each use in order to
remove contaminants, such as dust particles, because the
silicone-based elastomer layer 15 flows around the particles and
entrains them. Consequently, the master substrate 11 is
self-cleaning because the particles are removed with the
silicone-based elastomer layer 15.
[0049] In FIG. 11, a flat and thin plastic film 33 having a third
thickness t.sub.3 is placed on a flat and compliant silicone rubber
backing 31 having a fourth thickness t.sub.4. Suitable materials
for the thin plastic film 33 include but are not limited to a
Polymide and a Polyester (PET, Polyethylene Terephthalate). The
third thickness t.sub.3 and the fourth thickness t.sub.4 will be
application dependent. Preferably, the third thickness t.sub.3 of
the thin plastic film 33 is from about 40.0 .mu.m to about 100.0
.mu.m and the fourth thickness t.sub.4 of the silicone rubber
backing 31 is from about 0.125 inches to about 0.25 inches. The
fourth thickness t.sub.4 of the silicone rubber backing 31 should
be selected to ensure the silicone rubber backing 31 is complaint
(i.e. not stiff).
[0050] In FIG. 12, a surface 33s of the thin plastic film 33 is
coated with a photopolymer solution 35. The photopolymer solution
35 can include but is not limited to a mixture of about 50% of a
photopolymer material and about 50% acetone. As will be describe
below, the acetone will evaporate leaving a substantially
photopolymer layer on the surface 33s of the thin plastic film 33.
The photopolymer material can include but is not limited to a
NorIand.TM. Optical Adhesive that cures when exposed to ultraviolet
light. Preferably, the photopolymer material will cure in a time
from about 5.0 seconds to about 60.0 seconds. For example, a
Norland.RTM. NOA 83H photopolymer can be used for the photopolymer
solution 35.
[0051] In FIGS. 13 and 14, the photopolymer solution 35 is spread
over the surface 33s of the thin plastic film 33 to form a
photopolymer layer 35 having a fifth thickness t.sub.5. Preferably,
the spreading of the photopolymer solution 35 is accomplished using
a Mayer bar M.sub.1 that is wound with a wire W.sub.1 having a
first diameter. The Mayer bar M.sub.1 slides S over the surface 33s
and meters the photopolymer solution 35 so that the photopolymer
layer 35 having a fifth thickness t.sub.5 is formed. Any acetone in
the photopolymer solution 35 substantially evaporates during the
spreading process. As a result, the photopolymer layer 35 comprises
substantially a photopolymer material as described above.
Preferably, the fifth thickness t.sub.5 of the photopolymer layer
35 is from about 5.0 .mu.m to about 10.0 .mu.m. The first diameter
of the wire W.sub.1 will be application dependent. Preferably, the
first diameter of the wire W.sub.1 is from about 50.0 .mu.m
micrometers to about 100.0 .mu.m.
[0052] In FIG. 15, a patterned surface 21a of the imprint stamp 20a
is placed on the photopolymer layer 35. Placing the imprint stamp
20a on the photopolymer layer 35 can include placing an edge e1 of
the imprint stamp 20a in contact with the photopolymer layer 35 and
holding the edge e1 down while progressively lowering (see arrows
L.sub.1 and d) a remainder of the patterned surface 21a into
contact with the photopolymer layer 35. A pair of tweezers or a
suction wand can be used to grasp an edge e2 to accomplish the
lowering and to hold the edge e1 down. Alternatively, a rubber
roller or the like can be used in conjunction with the progressive
lowering to bring the patterned surface 21a into contact with the
photopolymer layer 35.
[0053] One advantage to the progressive lowering is that air
entrapped between the photopolymer layer 35 and the patterned
surface 20r is displaced so that air bubbles that can cause defects
are not trapped between the photopolymer layer 35 and the patterned
surface 20r.
[0054] Another advantage of the present invention is that once the
imprint stamp 20a has been placed on the photopolymer layer 35, the
imprint stamp 20a can be floated (see dashed arrow F) over a
surface 35s of the photopolymer layer 35 to position the imprint
stamp 20a at a predetermined location on the photopolymer layer 35.
The floating F can be done manually using a tweezer or suction
wand, or the floating F can be automated and a precision mechanical
device, such as a robotic end effector, can be used to precisely
position the imprint stamp 20a.
[0055] In FIG. 16, the photopolymer layer 35 is cured to fix a
position of the imprint stamp 20a on the photopolymer layer 35 and
to transfer an image of the imprint pattern 20r to the photopolymer
layer 35. The photopolymer layer 35 is cured by irradiating the
photopolymer layer 35 with an ultraviolet light UV of a
predetermined intensity for a first time period. The photopolymer
layer 35 hardens as it cures and an the image of the imprint
pattern 20r that is transferred into the photopolymer layer 35 also
hardens and is fixed in the photopolymer layer 35 as an imprint
pattern 20s.
[0056] The ultraviolet light UV can have a wavelength that includes
but is not limited a range from about 300 nm to about 400 nm. The
predetermined intensity of the ultraviolet light UV can include but
is not limited to an intensity of about 150 mW/cm.sup.2. The first
time period can include but is not limited to a time period from
about 5.0 seconds to about 60.0 seconds. For example, the
ultraviolet light UV can be from a UVA ultraviolet light
source.
[0057] Another advantage of the present invention is that the
imprint stamps 20a that are used to pattern the photopolymer layer
35 can have a thickness (see t.sub.A and t.sub.B in FIG. 16) that
can vary and those variations in thickness will not effect the
accuracy of the transfer of the imprint pattern 20r to imprint
pattern 20s of the photopolymer layer 35. The variations in
thickness (t.sub.A and t.sub.B) can be due to variations in the
process used to make the imprint stamps 20a, variations in the
first depth d.sub.1 of FIG. 7, or the use of different master
substrates 11 to make different imprint stamps 20 with different
imprint patterns 20p.
[0058] After the curing step, in FIGS. 17 and 18, the imprint
stamps 20a are removed P from the photopolymer layer 35 so that the
image of the imprint pattern 20r defines a photopolymer shim 36
with the imprint pattern 20s fixed therein. The imprint stamps 20a
can be removed P using a pair of tweezers or the like to grab an
edge (e1 or e2) and then lift the imprint stamps 20a from the
photopolymer layer 35 (see dashed arrow P).
[0059] In FIG. 19, the photopolymer shim 36 is post-cured by
heating the photopolymer shim 36. The post-curing of the
photopolymer shim 36 can include but is not limited to a time of
about 1.0 hour at a temperature of about 100.degree. C. Optionally,
afer the post-curing step, the photopolymer shim 36 can be rinsed
with an acetone solution to remove chemical species which might
inhibit curing of a silicone based elastomer material such as PDMS
or the above mentioned SYLGARD.RTM. silicone-based elastomers. The
post-curing of the photopolymer shim 36 drives off cure-inhibiting
species and improves an adhesion of the photopolymer shim 36 to the
thin plastic film 33.
[0060] In FIG. 19, after the post-curing of the photopolymer shim
36, a coating of a fluorocarbon material 37 having a sixth
thickness t.sub.6 is deposited on the photopolymer shim 36. The
sixth thickness t.sub.6 can include but is not limited to a
thickness from about 50.0 nm to about 150.0 nm. As an example, the
fluorocarbon material 37 can be deposited using a plasma deposition
of a trifluoromethane (CHF.sub.3) gas for about 5.0 minutes.
[0061] In FIG. 19, after the deposition of the fluorocarbon
material 37, a tweezer or a knife edge can be inserted between the
thin plastic film 33 and the silicone rubber backing 31 and the
thin plastic film 33 can be pulled off of the silicone rubber
backing 31 as shown by the dashed arrow P. Hereinafter, the
combination of the photopolymer shim 36 and the thin plastic film
33 will be referred to as the photopolymer shim 36 unless otherwise
noted.
[0062] In FIG. 20, after the thin plastic film 33 is separated, the
photopolymer shim 36 is attached to a support substrate 41. The
photopolymer shim 36 can be connected with the support substrate 41
by laying the photopolymer shim 36 on the support substrate 41 and
fastening an end of the photopolymer shim 36 to the support
substrate 41 using an adhesive. For example, a high temperature
adhesive tape T can be used. The support substrate 41 can be made
from a material including but not limited to a glass and
quartz.
[0063] In FIGS. 21 and 22, a shim stock 43 having a first height
h.sub.1 is attached to the support substrate 41. The shim stock 43
can be connected with the support substrate 41 using an adhesive
such as the above mentioned high temperature adhesive tape T, for
example. The shim stock 43 is positioned adjacent to the
photopolymer shim 36 and is spaced apart from the photopolymer shim
36 by a first distance D.sub.1 so that there is a space between the
shim stock 43 and the photopolymer shim 36 on a surface 41s of the
support substrate 41. The first height h.sub.1 of the shim stock 43
should exceed a height h.sub.S of the photopolymer shim 36 as
depicted in FIG. 22. The first height h.sub.1 and the first
distance D.sub.1 will be application dependent; however, the first
height h.sub.1 can be in a range including but not limited to from
about 0.5 mm to about 1.5 mm and the first distance D.sub.1 can be
in a range including but not limited to from about 1.0 mm to about
2.0 mm. The shim stock 43 can be a material including but not
limited to a metal, a glass, quartz, and stainless steel. For
instance, the shim stock 43 can be a stainless steel shim stock and
the first height h.sub.1 can be about 0.5 mm.
[0064] In FIG. 21, the support substrate 41 is preheated H to
increase a temperature of the support substrate 41 in preparation
for a coating of the shim stock 43 and the photopolymer shim 36
with a silicone-based elastomer material as will be discussed
below. Preferably, the silicone-based elastomer material is not
coated on a cold or on a room temperature (i.e. from about
18.0.degree. C. to about 28.0.degree. C.) support substrate 41. The
preheated temperature for the support substrate 41 will be
application dependent and the temperature should not exceed a
temperature limit of the photopolymer shim 36. For example, the
support substrate 41 can be preheated to a temperature of about
100.degree. C. A temperature of about 100.degree. C. is below the
temperature limits of most photopolymer materials.
[0065] In FIGS. 22 and 23, the photopolymer shim 36 and the shim
stock 43 are coated with a compliant material 44 that completely
covers the photopolymer shim 36 and the shim stock 43 (see FIG.
22). Suitable materials for the compliant material 44 include but
are not limited to a silicone-based elastomer material and an
amorphous fluoropolymer material.
[0066] Suitable silicone-based elastomer materials include but are
not limited to Polydimethyl Siloxane (PDMS), DOW CORNING.RTM.
silicone-based conformal coatings including SYLGARD.RTM. 182
silicone elastomer, SYLGARD.RTM. 183 silicone elastomer,
SYLGARD.RTM. 184 silicone elastomer, and SYLGARD.RTM. 186 silicone
elastomer. Preferably, the PDMS is a mixture of about 10.0 parts of
a base and about 1.5 parts of a curing agent. The base and the
curing agent can be mixed by weight or by volume as they have the
same density.
[0067] A suitable material for the amorphous fluoropolymer material
includes but is not limited to TEFLON.RTM. AF. For example, a
DuPont.TM. TEFLON.RTM. AF has been used for the compliant material
44. When the compliant material 44 comprises the amorphous
fluoropolymer material, the above mentioned preheating step of FIG.
21 is not required.
[0068] In FIGS. 23 and 24, the compliant material 44 is spread over
the photopolymer shim 36 and the shim stock 43 to form a compliant
media 45 that covers the photopolymer shim 36 and the shim stock 43
(see thicknesses t.sub.8 and t.sub.9 in FIG. 24). The imprint
pattern 20s in the photopolymer shim 36 is transferred to the
compliant media 45 so that an imprint stamp 20t is formed in the
compliant media 45.
[0069] Preferably, the spreading of the compliant material 44 is
accomplished using a Mayer bar M.sub.2 that is wound with a wire
W.sub.2 having a second diameter. The Mayer bar M.sub.2 slides S
over the shim stock 43 and meters the compliant material 44 to form
a smooth and uniformly thick compliant media 45. The compliant
material 44 will cover the shim stock 43 by a thickness t.sub.8 and
will cover the photopolymer shim 36 by a thickness t.sub.9, where
t.sub.9>>t.sub.8. The Mayer bar M.sub.2 is wound with a much
coarser diameter of wire than the Mayer bar M.sub.1 that was
discussed above. The second diameter of the wire W.sub.2 will be
application dependent. Preferably, the second diameter of the wire
W.sub.2 is from about 1.0 mm to about 3.0 mm. For example, a wire
with a diameter of about 1.5 mm can be wound on the Mayer bar
M.sub.2.
[0070] After the spreading, the support substrate 41 is heated H.
The surface 41s is operative to provide a surface for a portion 45c
of the compliant media 45 to adhere to during and after the heating
step. The time and temperature for the heating H of the substrate
41 will be application dependent, and as before, the temperature
must not exceed a temperature limit for the photopolymer shim 36 or
for the compliant media 45. As an example, the support substrate 41
can be heated H for about 4.0 hours at a temperature of about
100.0.degree. C. when the compliant media 45 is made from the
silicone-based elastomer material. The heating H cures the
silicone-based elastomer material. Alternatively, the support
substrate 41 can be heated H for about 4.0 hours at a temperature
of about 60.0.degree. C. when the compliant media is made from the
amorphous fluoropolymer material. In this case, the heating H drys
out the amorphous fluoropolymer material.
[0071] After the heating step, the support substrate 41 is cooled
down. Preferably, the support substrate 41 is allowed to cool down
to a temperature of about a room temperature (i.e. from about
18.0.degree. C. to about 28.0.degree. C.).
[0072] After the support substrate 41 has cooled down, the shim
stock 43 is removed from the support substrate 41. In FIG. 24, the
shim stock 43 can be removed by cutting K the compliant media 45
along an edge of the shim stock 43 that is adjacent to the
photopolymer shim 36. A knife, razor, or the like can be used to
cut K the compliant media 45. After the compliant media 45 is cut
K, the shim stock 43 can be pulled off of the support substrate 41.
The edge of the shim stock 43 (see dashed line for K) should be
used as a guide for making the cut K because the portion 45c of the
compliant media 45 adheres to the surface 41s of the support
substrate 41 and the adhesion prevents the compliant media 45 from
being prematurely separated from the substrate 41.
[0073] In FIGS. 25 through 27, a first adhesive surface A.sub.1 of
a transfer adhesive layer 51 is applied to a surface 45s of the
compliant media 45 so that the transfer adhesive layer 51 adheres
to the compliant media 45. The transfer adhesive layer 51 includes
a seventh thickness t.sub.7 and a second adhesive surface A.sub.2
as will be described below.
[0074] In FIG. 25, the first adhesive surface A.sub.1 can be
exposed, prior to being applied to the surface 45s, by peeling back
P.sub.1 a first backing 53 from the transfer adhesive layer 51.
Similarly, the second adhesive surface A.sub.2 can be exposed by
peeling back P.sub.2 a second backing 55 from the transfer adhesive
layer 51. The first adhesive surface A.sub.1 can be connected with
the surface 45s by using a roller 59 (see FIG. 26).
[0075] In FIG. 26, the first adhesive surface A.sub.1 is positioned
at an edge of the compliant media 45 and then the roller 59 is
rolled R across the second backing 55 to progressively apply the
first adhesive surface A.sub.1 across the surface 45s until the
entire surface 45s is connected with the first adhesive surface
A.sub.1 (see FIG. 27). The roller 59 can be a rubber roller, for
example. The roller 59 allows the first adhesive surface A.sub.1 to
be applied to the surface 45s without trapping air between the
first adhesive surface A.sub.1 and the surface 45s.
[0076] The seventh thickness t.sub.7 of the transfer adhesive layer
51 will be application dependent. However, because the transfer
adhesive layer 51 will remain attached to the compliant media 45
and because it is desirable for the compliant media 45 to be
flexible, the transfer adhesive layer 51 should be as thin as
possible. Preferably, the seventh thickness t.sub.7 of the transfer
adhesive layer 51 is from about 20.0 .mu.m thick to about 100.0
.mu.m thick.
[0077] Preferably, the transfer adhesive layer 51 is an optically
transparent material so that another photopolymer material that is
brought into contact with the compliant media 45 and the imprint
stamp 20t can be cured by a light source that is incident on both
the transfer adhesive layer 51 and the compliant media 45 as will
be described below.
[0078] A suitable optically transparent material for the transfer
adhesive layer 51 includes but is not limited to an Adhesives
Research, Inc..TM. ARclear.TM. DEV-8932 optically clear silicone
adhesive. For instance, a 25.0 .mu.m thick sheet (i.e the seventh
thickness t.sub.7=25.0 .mu.m) of ARclear.TM. DEV-8932 can be used
for the transfer adhesive layer 51.
[0079] In FIG. 28, the compliant media 45 can be separated from the
support substrate 41 by using a knife, razor, suction wand,
tweezer, or the like to initiate the separation of the compliant
media 45 from the support substrate 41 as depicted by the knife
K.
[0080] In FIG. 29, the imprint stamp 20t includes a plurality of
patterns 20q formed in the photopolymer shim 36 that complement the
patterns 20p on the master substrate 11 (see FIGS. 5 and 6). In
FIG. 30, after the peeling, the compliant media 45 is still
connected with the photopolymer shim 36 and the thin plastic film
33.
[0081] An additional advantage of the present invention is that the
photopolymer shim 36 and the thin plastic film 33 layer protect the
imprint stamp 20t from damage during subsequent processing and
handling steps that will be described below in reference to FIGS.
31 through 37b. Those processing and handling steps can be
completed and then the photopolymer shim 36 and the thin plastic
film 33 layers can be peeled off to expose the imprint stamp 20t.
Because the photopolymer shim 36 and the thin plastic film 33
layers will eventually be separated from the compliant media 45 in
order to expose the imprint stamp 20t carried by the compliant
media 45, hereinafter, unless otherwise noted, the combination of
the layers comprising the photopolymer shim 36 and the thin plastic
film 33 will be denoted as the photopolymer shim 36 (see FIG.
30).
[0082] Similarly, because the transfer adhesive layer 51 will
remain connected with the compliant media 45, the combination of
the compliant media 45 and the transfer adhesive layer 51 will be
denoted as a compliant media 70. In FIGS. 28 and 30, the
combination of the compliant media 70 and the photopolymer shim 36
will be denoted as a compliant assembly 75. As will be described
below, the compliant assembly 75 will be connected with a cylinder
and a flexible belt material.
[0083] In FIGS. 31a, 31b, and 31c an L-shaped jig 73 that includes
a horizontal section 73h and a vertical section 73v that forms a
low vertical wall. The horizontal and vertical sections (73h, 73v)
are at a right angle .beta. to each other. The sections (73h, 73v)
should be smooth and substantially flat. The L-shaped jig 73 can be
used to effectuate a laminating of the compliant assembly 75 to a
surface 69s of a cylinder 69.
[0084] In FIGS. 31a and 31b, the support substrate 41 can be placed
on the horizontal section 73h and abutted against the vertical
section 73v. Alternatively, if the compliant assembly 75 has
already been separated from the support substrate 41, then a bed
made from a smooth and flat piece of silicone rubber (not shown)
can placed on the horizontal section 73h and an end of the bed is
abutted against the vertical section 73v. The compliant assembly 75
is placed on top of the bed and is aligned with the vertical
section 73v by using the vertical section 73v as a vertical
straight edge. If the second backing 55 is still on the transfer
adhesive layer 51, then the second backing 55 can be peeled off
P.sub.2 to expose the second adhesive surface A.sub.2.
[0085] In FIGS. 31a and 31c, a cylinder 69 having an outer surface
69s is aligned with the horizontal section 73h and the vertical
section 73v so that the outer surface 69s is tangent 73t to those
sections (73h, 73v). The cylinder 69 is lowered onto the compliant
assembly 75 so that the second adhesive surface A.sub.2 is in
contact with a portion of the outer surface 69s at the tangent
point 73t. The cylinder 69 is then rolled R in a roll direction
R.sub.D to collect the compliant assembly 75 on the outer surface
69s as the cylinder 69 is rolled R. After the compliant assembly 75
is rolled onto the cylinder 69, there may be a gap 70g between
adjacent ends of the compliant assembly 75 as depicted in FIG.
31b.
[0086] Suitable materials for the cylinder 69 include but are not
limited to metal, ceramic, glass, quartz, and plastic. Preferably,
the cylinder 69 is made from an optically transparent material so
that light L can pass though the cylinder 69, the compliant media
70, and the imprint stamp 20t. Suitable optically transparent
materials for the cylinder 69 include but are not limited to glass,
quartz, and plastic. In FIG. 32, a light source 99, such as an
ultraviolet light source, can be positioned inside or outside of
the cylinder 69 to irradiate and cure a photopolymer material (not
shown) that is urged into contact with the imprint stamp 20t.
Because the compliant media 70 can be made to any size, the
cylinder 69 can include an inside diameter that is sufficient to
accommodate the light source 99. On the other hand, the light
source 99 can be small enough to fit within an inside diameter of
the cylinder 69.
[0087] In FIG. 31b, an alternative method for attaching the
compliant media 45 to the cylinder 69 is depicted. The compliant
media is denoted as 45 instead of 70 because the transfer adhesive
layer 51 is not connected with the compliant media 45 in FIG. 31b.
First, the first adhesive surface A.sub.1 of the transfer adhesive
layer 51 is exposed by peeling back the first backing 53 (not
shown). Second, the outer surface 69s of the cylinder 69 is
connected with the first adhesive surface A.sub.1 and then the
cylinder 69 is rolled to collect the transfer adhesive layer 51 on
the outer surface 69s. Third, a portion of the second backing 55 is
peeled back to expose a portion of the second adhesive surface
A.sub.2. Next, the exposed portion of the second adhesive surface
A.sub.2 is connected with the compliant media 45 at the tangent
point 73t and the cylinder 69 is rolled in the roll direction RD to
collect the compliant media 45 on the cylinder 69 while
simultaneously peeling back 55p a remainder of the second backing
55 to expose the remainder of the second adhesive surface
A.sub.2.
[0088] In FIGS. 32 and 33, after the compliant assembly 75 has been
rolled onto the cylinder 69, there may be an excess portion 75x of
the compliant assembly 75 that must be trimmed so that a majority
of the compliant assembly 75 can be smoothly rolled onto the
cylinder 69. As described above, there may be a gap 70g, if there
is, then it is desirable to trim the excess portion 75x so that the
gap 70g is as small as is practicable. A knife K or the like can be
used to trim the excess 75x so that the compliant assembly 75 lays
on the outer surface 69s without any bulges. In FIG. 33, the knife
K can cut along a direction K.sub.d to effectuate the trimming of
the excess 75x to form a completely laminated cylinder 90. In FIG.
33, the imprint stamps 20t are depicted in dashed outline because
they are still positioned below the photopolymer shim 36 which have
not been separated from the compliant media 70.
[0089] In FIG. 33, a line n-n thorough the cylinder 69 and the
compliant assembly 75 is depicted in greater detail in a
cross-sectional view in FIGS. 34a and 34b. In FIG. 34a, the
compliant assembly 75 is depicted before the excess 75x is trimmed.
In FIG. 34b, the compliant assembly 75 is depicted after the excess
75x has been trimmed.
[0090] In FIG. 34a, the excess portion 75x comprises the compliant
media 70 and the photopolymer shim 36. Because the thin plastic
film 33 (see FIG. 28) that is connected with the photopolymer shim
36 may be opaque to light and the photopolymer shim 36 can be
optically transparent, the photopolymer shim 36 can be peeled back
as denoted by the dashed arrow P so that the compliant media 70
(i.e. the optically transparent adhesive 51 and optically
transparent compliant media 45) can be used to sight along an edge
E.sub.S of the compliant assembly 75 that is already connected with
the outer surface 69s of the cylinder 69.
[0091] A knife cut K along the sight line (see dashed line) for the
edge ES can be used to trim off the excess 75x so that the
unconnected layers of the excess 75x will align with their
respective connected layers, that is: 33' to 33; 36' to 36; 45' to
45; and 51' to 51, as depicted in FIG. 34a. After the trimming,
there may be the small gap 70g between adjacent ends of the
compliant assembly 75.
[0092] In FIG. 34b, but for the gap 70g, the compliant assembly 75
forms an almost continuous layer on the outer surface 69s of the
cylinder 69. After the trimming, the photopolymer shim 36 can be
peeled back P to expose the imprint stamp 20t on the compliant
media 70.
[0093] In FIGS. 35 and 36, the compliant assembly 75 is applied to
a belt material 81. Prior to applying the compliant assembly 75 to
the belt material 81, the second backing 55 is peeled off of the
transfer adhesive layer 51 to expose the second adhesive surface
A.sub.2. Then the second adhesive surface A.sub.2 is progressively
applied to a surface 81s of the belt material 81. A roller 89, such
as a rubber roller, can be used to roll R the compliant assembly 75
in a roll direction RD.
[0094] The rolling R can begin at a first end (75a, 81a) and end at
a second end (75b, 81b) of the compliant assembly 75 and the belt
material 81. After the compliant assembly 75 and the belt material
81 are connected with each other (see FIG. 36), then the first and
second ends (81a, 81b) can be joined to form a belt 100 as depicted
in FIGS. 37a and 37b. As described above, a gap 70g may separate
the first and second ends (75a, 75b). Splicing tape or the like may
be used to cover the gap 70g. A piece of splicing tape 81t, or the
like, can also be used to connect the first and second ends (81a,
81b) of the belt material 81 to form the belt 100. After the belt
100 is formed, the photopolymer shim 36 (i.e. the layer 33 and 36
of FIG. 28) can be peeled back P to expose the imprint stamp 20t on
the compliant media 70. A suitable splicing tape includes but is
not limited to a high temperature silicone based tape.
[0095] The belt material 81 can be an optically transparent
material so that light L can pass though the belt material 81, the
compliant media 70, and the imprint stamp 20t. A suitable optically
transparent material for the belt material 81 includes but is not
limited to a DuPont.TM. Mylar.RTM.). For example, a light source
99, such as a ultraviolet light source, can be positioned inside or
outside of the belt 100 to irradiate and cure a photopolymer
material (not shown) that is urged into contact with the imprint
stamp 20t. The belt material 81 can have a thickness t.sub.B from
about 50.0 .mu.m to about 150.0 .mu.m.
[0096] Although several embodiments of the present invention have
been disclosed and illustrated, the invention is not limited to the
specific forms or arrangements of parts so described and
illustrated. The invention is only limited by the claims.
* * * * *