U.S. patent application number 10/411233 was filed with the patent office on 2004-10-14 for cpu radiator holding mechanism.
This patent application is currently assigned to ASIA VITAL COMPONENTS CO., LTD.. Invention is credited to Chen, Chih-Peng, Lin, Hsin-Cheng.
Application Number | 20040200600 10/411233 |
Document ID | / |
Family ID | 33130934 |
Filed Date | 2004-10-14 |
United States Patent
Application |
20040200600 |
Kind Code |
A1 |
Chen, Chih-Peng ; et
al. |
October 14, 2004 |
CPU RADIATOR HOLDING MECHANISM
Abstract
A CPU radiator holding mechanism. The mechanism includes a
pressure-bearing unit, a pair of holding-down clamps, and a seat
for holding a radiator to a main board above a CPU. The radiator is
formed from radiating fins and is provided at a top thereof with a
receiving recess for receiving the pressure-bearing unit therein.
The holding-down clamps are provided with hooks for engaging with
receiving holes provided on the seat. The radiator is connected to
the seat by pressing the holding-down clamps against the
pressure-bearing unit and engaging the hooks of the holding-down
clamps with the receiving holes of the seat, such that any pressure
applied by the holding-down clamps onto the pressure-bearing unit
does not cause any deformation of the radiating fins of the
radiator.
Inventors: |
Chen, Chih-Peng; (Taipei,
TW) ; Lin, Hsin-Cheng; (Lujou City, TW) |
Correspondence
Address: |
BACON & THOMAS, PLLC
625 SLATERS LANE
FOURTH FLOOR
ALEXANDRIA
VA
22314
|
Assignee: |
ASIA VITAL COMPONENTS CO.,
LTD.
Kaohsiung
TW
|
Family ID: |
33130934 |
Appl. No.: |
10/411233 |
Filed: |
April 11, 2003 |
Current U.S.
Class: |
165/80.3 ;
165/104.33; 165/185; 257/E23.086; 257/E23.088; 361/700;
361/704 |
Current CPC
Class: |
H01L 23/4093 20130101;
H01L 2924/0002 20130101; H01L 23/427 20130101; H01L 2924/00
20130101; H01L 2924/0002 20130101 |
Class at
Publication: |
165/080.3 ;
165/185; 165/104.33; 361/704; 361/700 |
International
Class: |
F28F 007/00; F28D
015/00; H05K 007/20 |
Claims
1 (Cancelled)
2 (Cancelled)
3. A CPU radiator holding mechanism, comprising: a pressure-bearing
unit, said pressure-bearing unit is made of a thermally conductive
material: a radiator formed from a plurality of radiating fins and
provided at a top thereof with a receiving recess for receiving
said pressure-bearing unit therein; a pair of holding-down clamps,
each of which being provided at predetermined positions with hooks;
a seat provided at predetermined positions with receiving holes for
engaging with said hooks on said holding-down clamps: said radiator
being fixedly connected to said seat by pressing said holding-down
clamps against said pressure-bearing unit positioned in said
receiving recess of said radiator, and engaging said hooks of said
holding-down clamps with said receiving holes of said seat, such
that any pressure applied by said holding-down clamps onto said
pressure-bearing unit does not cause any deformation of said
radiating fins of said radiator: and said thermally conductive
material is selected from the group consisting of copper, aluminum,
copper alloys, aluminum alloys, titanium alloys, and stainless
steel.
4 (Cancelled)
5 (Cancelled)
6. A CPU radiator holding mechanism, comprising: a pressure-bearing
unit having two arms sideward extended from two upper outer ends of
a central portion thereof, said pressure-bearing unit is made of a
thermally conductive material; a radiator formed from a plurality
of radiating fins and provided at a top thereof with a receiving
recess for receiving said central portion of said pressure-bearing
unit therein; a pair of holding-down clamps, each of which being
provided at predetermined positions with hooks; a seat provided at
predetermined positions with receiving holes for engaging with said
hooks on said holding-down clamps; said radiator being fixedly
connected to said seat by pressing said holding-down clamps against
said pressure-bearing unit positioned in said receiving recess of
said radiator, and engaging said hooks of said holding-down clamps
with said receiving holes of said seat, such that any pressure
applied by said holding-down clamps onto said pressure-bearing unit
does not cause any deformation of said radiating fins of said
radiator; and said thermally conductive material is selected from
the group consisting of copper, aluminum, copper alloys, aluminum
alloys, titanium alloys, and stainless steel.
7. A CPU radiator holding mechanism, comprising a pressure-bearing
unit having two arms sideward extended from two upper outer ends of
a central portion thereof: a radiator formed from a plurality of
radiating fins and provided at a top thereof with a receiving
recess for receiving said central portion of said pressure-bearing
unit therein: a pair of holding-down clamps, each of which being
provided at predetermined positions with hooks: a seat provided at
predetermined positions with receiving holes for engaging with said
hooks on said holding-down clamps: said radiator being fixedly
connected to said seat by pressing said holding-down clamps against
said pressure-bearing unit positioned in said receiving recess of
said radiator, and engaging said hooks of said holding-down clamps
with said receiving holes of said seat, such that any pressure
applied by said holding-down clamps onto said pressure-bearing unit
does not cause any deformation of said radiating fins of said
radiator; and said arms of said pressure-bearing unit have a
reduced depth, such that said pressure-bearing unit is positioned
in said receiving recess of said radiator to flush with the top of
said radiator.
8. A CPU radiator holding mechanism, comprising: a pressure-bearing
unit having a plurality of radiating fins downward extended from a
lower side thereof; a radiator formed from a plurality of radiating
fins, and adapted to engage at a top with said pressure-bearing
unit with said radiating fins of said radiator and said radiating
fins of said pressure-bearing unit alternating with one another,
and said radiator including a receiving recess; a pair of
holding-down clamps, each of which being provided at predetermined
positions with hooks; a seat provided at predetermined positions
with receiving holes for engaging with said hooks on said
holding-down clamps; and said radiator being fixedly connected to
said seat by pressing said holding-down clamps against said
pressure-bearing unit positioned in said receiving recess of said
radiator, and engaging said hooks of said holding-down clamps with
said receiving holes of said seat, such that any pressure applied
by said holding-down clamps onto said pressure-bearing unit does
not cause any deformation of said radiating fins of said
radiator.
9. The CPU radiator holding mechanism as claimed in claim 8,
wherein said pressure-bearing unit is made of a thermally
conductive material.
10. The CPU radiator holding mechanism as claimed in claim 9,
wherein said thermally conductive material is selected from the
group consisting of copper, aluminum, copper alloys, aluminum
alloys, titanium alloys, and stainless steel.
11. The CPU radiator holding mechanism as claimed in claim 8,
wherein said radiator is provided at the top with a receiving
recess, such that said pressure-bearing unit is positioned in said
receiving recess of said radiator to flush with the top of said
radiator.
Description
FIELD OF THE INVENTION
[0001] The present invention relates to a CPU radiator holding
mechanism that mainly includes a pressure-bearing unit, a pair of
holding-down clamps, and a seat for holding a radiator above a CPU
on a main board, such that any pressure applied by the holding-down
clamps onto the pressure-bearing unit when holding the radiator to
the main board does not cause any deformation of the radiator.
BACKGROUND OF THE INVENTION
[0002] The currently available central processing unit (CPU) for
computers has a surprisingly high operating speed to execute many
highly useful programs and hardware functions. However, the
extremely high-speed CPU also produces very high amount of heat
during its operation to adversely affect the performance of the CPU
or even result in damage or loss of data stored in the computer, if
the produced heat is not properly radiated. A common practice for
general users to solve the problem of large quantity of heat
produced by the CPU is to mount a radiator or a cooling fan to the
CPU to dissipate the heat. The radiator may also be added with
heat-transfer tubes to dissipate the heat more quickly.
[0003] In the case of a radiator added with the heat-transfer
tubes, a holding-down clamping means is usually needed to closely
connect the radiator to the CPU. However, a pressure applied by
such holding-down clamping means onto the radiator would frequently
deform radiating fins forming the radiator, resulting in poor
contact of the radiating fins with the heat-transfer tubes and even
bent heat-transfer tubes to largely reduce an overall thermal
conductivity of the radiator.
[0004] It is therefore tried by the inventor to develop an improved
CPU radiator holding mechanism to eliminate drawbacks existed in
the conventional holding-down clamping means.
SUMMARY OF THE INVENTION
[0005] A primary object of the present invention is to provide a
CPU radiator holding mechanism that includes a pressure-bearing
unit mounted on a top of the CPU radiator to bear a pressure
applied by holding-down clamps and thereby protects the radiator
against deformation due to such pressure.
BRIEF DESCRIPTION OF THE DRAWINGS
[0006] The structure and the technical means adopted by the present
invention to achieve the above and other objects can be best
understood by referring to the following detailed description of
the preferred embodiments and the accompanying drawings,
wherein
[0007] FIG. 1 is an exploded perspective view of a CPU radiator
holding mechanism according to a first embodiment of the present
invention;
[0008] FIG. 2 is an assembled perspective view of FIG. 1;
[0009] FIG. 3 is an exploded perspective view of a CPU radiator
holding mechanism according to a second embodiment of the present
invention;
[0010] FIG. 4 is an assembled perspective view of FIG. 3;
[0011] FIG. 5 is an assembled perspective view of a variant of the
second embodiment of the present invention;
[0012] FIG. 6 is an exploded perspective view of a CPU radiator
holding mechanism according to a third embodiment of the present
invention;
[0013] FIG. 7 is an assembled perspective view of FIG. 6;
[0014] FIG. 8 is an exploded perspective view of a variant of the
third embodiment of the present invention; and
[0015] FIG. 9 is an assembled perspective view of FIG. 8.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0016] Please refer to FIGS. 1 and 2 that are exploded and
assembled perspective views, respectively, of a mechanism for
holding a radiator to a central processing unit (CPU) according to
a first embodiment of the present invention. For the purpose of
simplicity, the present invention is referred to as the "CPU
radiator holding mechanism" throughout the specification. As shown,
the CPU radiator holding mechanism according to the first
embodiment of the present invention mainly includes a
pressure-bearing unit 11, a pair of holding-down clamps 14, and a
seat 15 for holding a pair of first radiators 12 and a second
radiator 13 onto a main board 16 on which a CPU 161 is mounted.
[0017] The pressure-bearing unit 11 includes a generally
strip-shaped member made of a thermally conductive metal material,
which may be selected from the group consisting of copper,
aluminum, copper alloys, aluminum alloys, titanium alloys, and
stainless steel, so that it also serves as an auxiliary radiating
means of the first and second radiators 12, 13. Each of the first
radiators 12 is formed from a plurality of vertically parallelly
arranged radiating fins 121, and includes two horizontally spaced
holes 121a longitudinally extended through the radiating fins 121,
and a receiving recess 121b longitudinally extended through an
upper side of the first radiator 12 to locate above and between the
two holes 121a. The second radiator 13 is formed from a plurality
of vertically parallelly arranged radiating fins 131, and includes
an upper receiving recess 131a and two spaced lower receiving
recesses 131b corresponding to the receiving recesses 121b and the
two through holes 121a, respectively, on the first radiators 12.
Each of the two holding-down clamps 14 includes a press head 141
downward protruded from a lower center thereof and two downward
extended legs, each of which has a hook 142 formed at a free end
thereof. The seat 15 is provided at four corners with four
receiving holes 151 for engaging with the hooks 142 of the pair of
holding-down clamps 14.
[0018] Two heat-transfer tubes 122 are separately extended through
the two spaced holes 121a on the radiating fins 121 of the pair of
first radiators 12, so that the radiating fins 131 of the second
radiator 13 are located on the two heat-transfer tubes 122 with the
two lower receiving recesses 131b separately bearing against the
heat-transfer tubes 122. Meanwhile, a heat-transfer block 132 is
fixedly connected to a lower side of the two heat-transfer tubes
122 to correspondingly locate below the second radiator 13. The
seat 15 is firmly fixed to a top of the main board 16, and the
first radiators 12 and the second radiator 13 are seated on the
seat 15 with a lower side of the heat-transfer block 132 bearing
against the CPU 161 on the main board 16. The pressure-bearing unit
11 is positioned in the receiving recesses 121b of the first
radiators 12 and the upper receiving recess 131a of the second
radiator 13. The holding-down clamps 14 is connected to the seat 15
by engaging the hooks 142 with the receiving holes 151, so that the
press heads 141 are compressed against a top of the
pressure-bearing unit 11. That is, a pressure applied by the
holding-down clamps 14 is born by the pressure-bearing unit 11 to
protect the radiating fins 121, 131 against deformation and avoid
poor contact of the heat-transfer tubes 122 with the holes 121a
that would happen when the pressure is otherwise directly applied
to the radiating fins 121, 131 by the holding-down clamps 14. The
pressure-bearing unit 11 also protects the heat-transfer tubes 122
from bending and accordingly reduced working efficiency due to the
pressure applied by the holding-down clamps 14 on the radiators 12,
13, so that the radiators 12, 13 always provide an overall
effective radiating effect.
[0019] FIGS. 3 and 4 are exploded and assembled perspective views,
respectively, of a second embodiment of the present invention. As
shown, the second embodiment includes a pressure-bearing unit 21, a
pair of holding-down clamps 24, and a seat 25 for holding a pair of
first radiators 22 and a second radiator 23 onto a main board 26 on
which a CPU 261 is mounted.
[0020] The pressure-bearing unit 21 includes a generally
strip-shaped member having two arms 211 sideward extended from two
upper outer ends of a central portion thereof. The pressure-bearing
unit 21 is made of a thermally conductive metal material, which may
be selected from the group consisting of copper, aluminum, copper
alloys, aluminum alloys, titanium alloys, and stainless steel, so
that it also serves as an auxiliary radiating means of the first
and second radiators 22, 23. Each of the first radiators 22 is
formed from a plurality of vertically parallelly arranged radiating
fins 221, and includes two horizontally spaced holes 221a
longitudinally extended through the radiating fins 121, and a
receiving recess 221b longitudinally extended through an upper side
of the first radiator 22 to locate above and between the two holes
221a. The second radiator 23 is formed from a plurality of
vertically parallelly arranged radiating fins 231, and includes an
upper receiving recess 231a and two spaced lower receiving recesses
231b corresponding to the receiving recesses 221b and the two
through holes 221a, respectively, on the first radiators 22. Each
of the two holding-down clamps 24 includes a press head 241
downward protruded from a lower center thereof and two downward
extended legs, each of which has a hook 242 formed at a free end
thereof. The seat 25 is provided at four corners with four
receiving holes 251 for engaging with the hooks 242 of the pair of
holding-down clamps 24.
[0021] Two heat-transfer tubes 222 are separately extended through
the two spaced holes 221a on the radiating fins 221 of the pair of
first radiators 22, so that the radiating fins 231 of the second
radiator 23 are located on the two heat-transfer tubes 222 with the
two lower receiving recesses 231b separately bearing against the
heat-transfer tubes 222. Meanwhile, a heat-transfer block 232 is
fixedly connected to a lower side of the two heat-transfer tubes
222 to correspondingly locate below the second radiator 23. The
seat 25 is firmly fixed to a top of the main board 26, and the
first radiators 22 and the second radiator 23 are seated on the
seat 25 with a lower side of the heat-transfer block 232 bearing
against the CPU 261 on the main board 26.
[0022] The pressure-bearing unit 21 is so positioned that the
central portion thereof is located in the upper receiving recess
231a of the second radiator 23 and the two arms 211 are located
overhead the receiving recesses 221b of the first radiators 22.
This design allows even better flowing of air among the radiating
fins 221 and 231. The holding-down clamps 24 is connected to the
seat 25 by engaging the hooks 242 with the receiving holes 251, so
that the press heads 241 are compressed against a top of the
pressure-bearing unit 21. That is, a pressure applied by the
holding-down clamps 24 is born by the pressure-bearing unit 21 to
protect the radiating fins 221, 231 against deformation and avoid
poor contact of the heat-transfer tubes 222 with the holes 221a
that would happen when the pressure is otherwise directly applied
to the radiating fins 221, 231 by the holding-down clamps 24. The
pressure-bearing unit 21 also protects the heat-transfer tubes 222
from bending and accordingly reduced working efficiency due to the
pressure applied by the holding-down clamps 24 on the radiators 22,
23, so that the radiators 22, 23 always provide an overall
effective radiating effect.
[0023] Please refer to FIG. 5 that shows a variant of the second
embodiment of the present invention. In this variant, the two arms
211 of the pressure-bearing unit 21 have a reduced depth, such that
the pressure-bearing unit 21 is positioned in the receiving
recesses 221b and the upper receiving recess 231a with an upper
surface flushing with the top of the first radiators 22 and the
second radiator 23. This design allows a space above the first
radiators 22 and the second radiator 23 to be otherwise effectively
utilized.
[0024] FIGS. 6 and 7 are exploded and assembled perspective views,
respectively, of a third embodiment of the present invention. As
shown, the third embodiment includes a pressure-bearing unit 31, a
pair of holding-down clamps 34, and a seat 35 for holding a pair of
first radiators 32 and a second radiator 33 onto a main board 36 on
which a CPU 361 is mounted.
[0025] The pressure-bearing unit 31 includes a generally
strip-shaped member having a plurality of vertically parallelly
arranged radiating fins 311 downward extended from a lower side
thereof. The pressure-bearing unit 31 is made of a thermally
conductive metal material, which may be selected from the group
consisting of copper, aluminum, copper alloys, aluminum alloys,
titanium alloys, and stainless steel, so that it also serves as an
auxiliary radiating means of the first and second radiators 32, 33.
Each of the first radiators 32 is formed from a plurality of
vertically parallelly arranged radiating fins 321, and includes two
horizontally spaced holes 321a longitudinally extended through the
radiating fins 321. The second radiator 33 is formed from a
plurality of vertically parallelly arranged radiating fins 331, and
includes two spaced lower receiving recesses 331a corresponding to
the two through holes 321a on the first radiators 32. Each of the
two holding-down clamps 34 includes a press head 341 downward
protruded from a lower center thereof and two downward extended
legs, each of which has a hook 342 formed at a free end thereof.
The seat 35 is provided at four corners with four receiving holes
351 for engaging with the hooks 342 of the pair of holding-down
clamps 34.
[0026] Two heat-transfer tubes 322 are separately extended through
the two spaced holes 321a on the radiating fins 321 of the pair of
first radiators 32, so that the radiating fins 331 of the second
radiator 33 are located on the two heat-transfer tubes 322 with the
two lower receiving recesses 331a separately bearing against the
heat-transfer tubes 322. Meanwhile, a heat-transfer block 332 is
fixedly connected to a lower side of the two heat-transfer tubes
322 to correspondingly locate below the second radiator 33. The
seat 35 is firmly fixed to a top of the main board 36, and the
first radiators 32 and the second radiator 33 are seated on the
seat 3 with a lower side of the heat-transfer block 332 bearing
against the CPU 361 on the main board 36. The pressure-bearing unit
31 is so positioned that it is protruded from the top of the
radiators 32, 33 with the radiating fins 311 downward extended into
the radiators 32, 33 to alternate with the radiating fins 321 and
331. The holding-down clamps 34 is connected to the seat 35 by
engaging the hooks 342 with the receiving holes 351, so that the
press heads 341 are compressed against a top of the
pressure-bearing unit 31. That is, a pressure applied by the
holding-down clamps 34 is born by the pressure-bearing unit 31 to
protect the radiating fins 321, 331 against deformation and avoid
poor contact of the heat-transfer tubes 322 with the holes 321a
that would happen when the pressure is otherwise directly applied
to the radiating fins 321, 331 by the holding-down clamps 34. The
pressure-bearing unit 31 also protects the heat-transfer tubes 322
from bending and accordingly reduced working efficiency due to the
pressure applied by the holding-down clamps 3 on the radiators 32,
33, so that the radiators 32, 33 always provide an overall
effective radiating effect.
[0027] Please refer to FIGS. 8 and 9 that shows a variant of the
third embodiment of the present invention. In this variant, each of
the pair of first radiators 32 is provided at a top with a
receiving recess 321b, and the second radiator 33 is provided at a
top with an upper receiving recess 331b, and the pressure-bearing
unit 31 is positioned in the receiving recesses 321b and the upper
receiving recess 331b to flush with the top of the radiators 32,
33. This design allows a space above the first radiators 32 and the
second radiator 33 to be otherwise effectively utilized.
[0028] The present invention has been described with some preferred
embodiments thereof and it is understood that many changes and
modifications in the described embodiments can be carried out
without departing from the scope and the spirit of the invention as
defined by the appended claims.
* * * * *