U.S. patent application number 10/778077 was filed with the patent office on 2004-08-26 for stamping tool, casting mold and methods for structuring a surface of a work piece.
This patent application is currently assigned to AlCove Surfaces GmbH. Invention is credited to Sawitowski, Thomas.
Application Number | 20040163441 10/778077 |
Document ID | / |
Family ID | 32872816 |
Filed Date | 2004-08-26 |
United States Patent
Application |
20040163441 |
Kind Code |
A1 |
Sawitowski, Thomas |
August 26, 2004 |
Stamping tool, casting mold and methods for structuring a surface
of a work piece
Abstract
A mold or stamping tool with which a simple, cost-effective
stamping or molding in the nanometer range is enabled by a molding
or stamping surface layer of the mold or tool being provided with
hollow chambers formed by anodic oxidation.
Inventors: |
Sawitowski, Thomas; (Essen,
DE) |
Correspondence
Address: |
NIXON PEABODY, LLP
401 9TH STREET, NW
SUITE 900
WASINGTON
DC
20004-2128
US
|
Assignee: |
AlCove Surfaces GmbH
Gladbeck
DE
|
Family ID: |
32872816 |
Appl. No.: |
10/778077 |
Filed: |
February 17, 2004 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
10778077 |
Feb 17, 2004 |
|
|
|
10281376 |
Oct 28, 2002 |
|
|
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Current U.S.
Class: |
72/462 |
Current CPC
Class: |
B29C 2059/023 20130101;
B29C 59/022 20130101; C25D 1/10 20130101; B22C 23/02 20130101; C25D
11/04 20130101; B22C 9/061 20130101; B22C 9/22 20130101; B30B
15/065 20130101; C25D 11/02 20130101 |
Class at
Publication: |
072/462 |
International
Class: |
B21J 013/00 |
Foreign Application Data
Date |
Code |
Application Number |
Apr 28, 2000 |
DE |
100 20 877.0 |
Jul 2, 2001 |
DE |
101 31 513.9 |
Nov 9, 2001 |
DE |
101 54 756.0 |
Claims
What is claimed is:
1. Stamping tool with a structured stamping surface, wherein the
stamping surface is formed by an anodically oxidised surface layer
or covering layer with open hollow chambers created model-free by
the anodic oxidation, wherein the stamping surface is structured at
least partially in the nanometer range by the hollow chambers.
2. Stamping tool according to claim 1, wherein the structural width
of the stamping surface is 30 to 600 nm.
3. Stamping tool according to claim 1, wherein the hollow chambers
have opening areas with an average diameter of 10 to 500 nm
4. Stamping tool according to claim 1, wherein the hollow chambers
have opening areas with an average, at least essentially uniform
diameter of 15 to 200 nm.
5. Stamping tool according to claim 1, wherein the hollow chambers
have a depth, which greater than the average diameter of the hollow
chambers.
6. Stamping tool according to claim 1, wherein the hollow chambers
are conically shaped.
7. Stamping tool according to claim 1, wherein the hollow chambers
vary at least in one of form, depth, and surface density.
8. Stamping tool according to claim 1, wherein the stamping surface
comprises both a fine and rough structure.
9. Stamping tool according to claim 1, wherein the stamping surface
is curved.
10. Stamping tool according to claim 1, wherein the surface layer
or the covering layer with the hollow chambers is formed at least
substantially of a material from the group consisting of aluminium
oxide, silicon oxide, iron oxide, oxidised steel and titanium
oxide.
11. Mold with a molding face formed of an anodally oxidized surface
or covering layer with open hollow chambers created model-free by
the anodic oxidation, wherein the molding face has a structure
formed at least partially by the hollow chambers which have
diameters in a nanometer range.
12. Mold according to claim I 1, wherein the structural width of
the molding face is essentially 30 to 600 nm.
13. Mold according to claim I 1, wherein the hollow chambers have
opening areas with an average diameter of 10 to 500 nm.
14. Mold according to claim 11, wherein the hollow chambers have
opening areas with an average, at least essentially uniform
diameter of 15 to 200 nm.
15. Mold according to claim 11, wherein the hollow chambers have a
depth, which greater than the average diameter of the hollow
chambers.
16. Mold according to claim 11, wherein the hollow chambers are
designed conically.
17. Mold according to claim 11, wherein the hollow chambers vary at
least in one of form, depth, and surface density.
18. Mold according to claim 11, wherein the molding face surface
comprises both a fine and rough structure.
19. Mold according to claim 11, wherein the surface layer or the
covering layer with the hollow chambers is formed at least
substantially of a material from the group consisting of aluminium
oxide, silicon oxide, iron oxide, oxidised steel and titanium
oxide.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a division of co-pending U.S. patent
application Ser. No. 10/281,376.
BACKGROUND OF THE INVENTION
[0002] Field of the Invention
[0003] The present invention relates to a stamping tool having a
structured stamping surface, a casting mold, a method for producing
a stamping tool or a casting mold having a structured stamping
surface, and methods for structuring a surface of a workpiece.
[0004] Stamping constitutes a non-cutting manufacturing method for
producing a relief-like or structured surface on a workpiece. A
stamping tool with a profiled or structured stamping surface is
used for this. The stamping surface is pressed with such a stamping
force onto the surface to be structured of the workpiece or rolled
on this, so that the workpiece becomes plastic and flows into
depressions in the stamping tool or the stamping surface. Due to
the considerable stamping forces employed, the stamping tool and
the stamping surface are usually made of metal.
[0005] Further, molding is known. A casting mold with a structured
molding face can be used for producing a cast workpiece with a
structured surface by casting.
[0006] In the present invention nanometer range is understood to
mean profiling or structuring with structural widths <1000 nm,
especially <500 nm. The structural width designates the
dimension by which individual structural elements, such as bumps,
are repeated, that is, for example the average distance of adjacent
bumps from one another or of depressions from one another.
[0007] 2. Description of Related Art
[0008] It is very expensive to manufacture a stamping tool with a
very finely structured or profiled stamping surface. To create a
so-called "moth eye structure"--evenly arranged, egg carton-like
bumps--or fine grooves in the nanometer range, it is known from
practice to use a lighting pattern with periodic intensity
modulation for illuminating photo-sensitive material via two
interfering laser beams. After the illuminated material develops, a
periodic surface structure results, which is molded into other
materials using various replication methods and finally into
nickel, for example, by electroforming. This type of manufacturing
is very expensive and is suited only for structuring even
surfaces.
[0009] In the nanometer range lithographic methods for structuring
a stamping surface of a stamping tool can still only be used in a
limited way. It should be noted here that the wavelength of the
visible light alone is already 400 to 750 nm. In each case
lithographic methods are very costly.
[0010] German Patent DE 197 27 132 C2 discloses the manufacturing
of a stamping tool by means of electrolytic machining. During
electrolytic machining a metallic stamping surface of the stamping
tool is treated electrolytically, wherein, being an anode in a
fast-flowing electrolyte, the metal of the stamping surface is
located at a minimal distance opposite a cathode and is dissolved
in surface terms. The metal or the stamping surface contains the
structure determined by the form of the cathode, and the cathode
thus forms a recipient vessel that is shaped electrochemically. DE
197 27 132 C2 also provides the use of a cylindrical rotation
electrode, whose covering surface presents a negative form of the
desired stamping structure. Here, too, there is considerable
expense involved and structuring in the nanometer range is at least
only partly possible.
[0011] The use of anodically oxidised surface layers made of
aluminium or magnesium in casting molds to increase resistance is
known from Swiss Patent CH 251 451. However, the forming of hollow
chambers by oxidation for structuring a molded article in the
nanometer range is not disclosed.
[0012] Forming hollow chambers with anodic oxidation of aluminium
is described in published European Patent Application EP 0 931 859
A1, for example.
[0013] However, the related art does not provide a cost-effective
solution to produce a workpiece, like a stamped piece, or casting
with a surface structered in the nanometer range.
[0014] Consequently, there is a need for a stamping tool, a casting
mold, a method for manufacturing a stamping tool or a casting mold,
a method for structuring a surface of a workpiece and a method for
using a surface layer provided with open hollow chambers, wherein
structuring in the nanometer range is enabled in a simple and
cost-effective manner.
SUMMARY OF INVENTION
[0015] Object of the present invention is to provide a stamping
tool, a casting mold, a method for manufacturing a stamping tool or
a casting mold, a method for structuring a surface of a workpiece
and a method for using a surface layer provided with open hollow
chambers, wherein structuring in the nanometer range is enabled in
a simple and cost-effective manner.
[0016] One aspect of the present invention is to use a porous oxide
layer and especially a surface layer, formed via anodic oxidation
and provided with open hollow chambers, as stamping surface of a
stamping tool. This leads to several advantages.
[0017] First, an oxide layer, especially the preferably provided
aluminium oxide, is relatively hard. With respect to the often very
high stamping forces this is an advantage for being able to stamp
workpieces of various materials and for achieving a long tool life
of the stamping tool.
[0018] Second, model-free oxidation is very easy and cost-effective
to carry out. In particular, producing hollow chambers is (quasi)
independent of the form and configuration of the cathodes employed,
so a model or negative form is not required, as in electrolytic
machining.
[0019] Third, the provided model-free forming of open hollow
chambers via anodic oxidation enables structures to be manufactured
in the nanometer range very easily and cost-effectively. In
particular, structural widths of 500 nm and less, even 100 nm and
less are possible.
[0020] Fourth, depending on choice of procedural conditions the
configuration--regular or irregular--and the surface density of the
hollow chambers can be varied as required.
[0021] Fifth, by likewise simply varying the procedural
conditions--especially by variation of the voltage during
anodising--the form of the hollow chambers and thus the structure
of the stamping surface can be adjusted and varied.
[0022] Sixth, the anodically oxidised surface layer can be used
directly, thus without further molding, as the stamping surface of
a stamping tool.
[0023] A further aspect of the present invention is to use a porous
oxide layer and especially a surface layer with open hollow
chambers, formed by anodic oxidation directly or model-free, thus
independent of a cathode form, as molding face or inner face of a
casting mold. This has a number of advantages.
[0024] First, an oxide layer, especially the preferably provided
aluminium oxide, is relatively hard. With respect to the often very
high forces utilised in casting or molding this is an advantage for
being able to produce workpieces of various materials and for
achieving a long shelf life of the casting mold.
[0025] Second, the model-free oxidation is very easy and
cost-effective to carry out. Producing hollow chambers is (quasi)
independent on the form and configuration of the cathodes used, and
a model or negative form is therefore not required.
[0026] Third, the model-free forming of open hollow chambers as
provided via anodic oxidation enables structures to be manufactured
in the nanometer range very easily and cost-effectively. In
particular, structural widths of 500 nm and less, even 100 nm and
less are possible.
[0027] Fourth, depending on choice of procedural conditions the
configuration--regular or irregular--and the surface density of the
hollow chambers can be varied as required.
[0028] Fifth, by likewise simply varying the procedural
conditions--especially by variation of the voltage during
anodising--the form of the hollow chambers and thus the structure
of the surface can be adjusted and varied.
[0029] Sixth, the anodically oxidised surface layer can be used
directly, thus without further molding, as the surface of a casting
mold.
[0030] Further advantages, properties, features and goals of the
present invention will emerge from the following description of
preferred embodiments with reference to the drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0031] FIG. 1 shows a very schematic sectional elevation of a
proposed stamping tool and a workpiece structured therewith
according to a first embodiment; and
[0032] FIG. 2 shows a very schematic sectional elevation of a
proposed casting mold and a workpiece structured therewith
according to an second embodiment.
DETAILED DESCRIPTION OF THE INVENTION
[0033] In a highly simplified sectional elevation, FIG. 1 shows a
proposed stamping tool 1 with a structured, i.e. profiled or
relief-like stamping surface 2. The stamping surface 2 is formed by
a flat side of a surface layer 3, which is provided with open
hollow chambers 4 produced by anodic oxidation.
[0034] In the illustrative example, the surface layer is applied to
a support 5 of the stamping tool 1. For example, the surface layer
3 is applied to the support 5 by plasma coating. But the surface
layer 3 can also be formed directly by the support 5, and thus be a
surface area of the support 5.
[0035] It is understood that the surface layer 3 can also be
deposited on the support 5 using other methods.
[0036] In the illustrative example the surface layer 3 preferably
consists of aluminium which is applied to the support 5 especially
via plasma coating and adheres well to the support 5 preferably
made of metal, especially iron or steel.
[0037] The surface layer 3 is oxidised anodically at least
partially in the illustrative example to the depth of a covering
layer 6, whereby the hollow chambers 4 are formed in the surface
layer 3. The hollow chambers 4 are formed immediately and/or
without any model or pattern, i.e. the arrangement, distribution,
form and the like of the hollow chambers 4--as opposed to
electrolytic machining--is, thus, at least essentially independent
of the surface shape and the proximity of the cathode (not shown)
used in oxidation. Moreover, according to the invention, the "valve
effect", namely the occurring, independent formation of hollow
chambers 4 during oxidation or anodisation of the surface layer
3,--at least in particular in the so-called valve metals--is used.
This immediate or undefined formation of the hollow chambers 4 does
not preclude an additional (before or after) formation or
structuring of the stamping surface 2 or the hollow chambers 4 by
means of a negative form.
[0038] Depending on how completely or how deeply the surface layer
3 is oxidised, or whether the surface layer 3 is formed directly by
the support 5, the surface layer 3 can correspond to the oxidised
covering layer 6. In this case, for example, the intermediate layer
7, which is comprised of aluminium in the illustrative example and
which promotes very good adhesion between the covering layer 6 and
the support 5, can be omitted.
[0039] For example, according to an alternative embodiment, the
uncoated support 5 can be oxidised anodically on its surface
forming the stamping surface 2 by formation of a porous oxide layer
or hollow chambers 4. This is possible for example for a support 5
made of iron or steel, especially stainless steel. In this case the
surface layer 3 then corresponds to the covering layer 6, i.e. the
oxidised layer.
[0040] Aluminium and iron or steel, especially stainless steel,
have already been named as particularly preferred material, used at
least substantially for forming the anodically oxidised surface
layer 3 or the covering layer 6. However, silicon and titanium as
well as other valve metals for example can also be used.
[0041] In the illustrative example the proportions in size are not
presented true to scale.
[0042] The stamping tool 1 or its stamping surface 2 preferably has
a structural width S in the nanometer range, especially from 30 to
600 nm and preferably from 50 to 200 nm.
[0043] The hollow chambers 4 or their openings have an average
diameter D of essentially 10 to 500 nm, preferably 15 to 200 nm and
especially 20 to 100 nm.
[0044] In the illustrative example the hollow chambers 4 are
designed essentially lengthwise, wherein their depth T is
preferably at least approximately 0.5 times the above-mentioned,
average diameter D and especially approximately 1.0 to 10 times the
diameter D.
[0045] The hollow chambers 4 are designed here at least
substantially similarly in shape. In particular, the hollow
chambers 4 are designed substantially cylindrically. But the hollow
chambers 4 can also present a form deviating therefrom, for example
they can be designed substantially conically.
[0046] In general, the hollow chambers 4 can also have a
cross-section varying in its depth T in form and/or diameter. In
addition to this, the hollow chambers 4 can be designed
substantially conically as a rough structure for example, and
provided along their walls with many fine depressions (small hollow
chambers) to form a fine structure in each case.
[0047] The hollow chambers 4 are preferably distributed at least
substantially uniformly over the surface of the surface layer 3 or
over the stamping surface 2. However, uneven distribution is also
feasible.
[0048] The hollow chambers or their openings are preferably
distributed over the stamping surface 2 with a surface density of
10.sup.9 to 10.sup.11/cm.sup.2. In the illustrative example the
surface density is substantially constant over the stamping surface
2. But the surface density can also vary partially on the stamping
surface 2 as required.
[0049] The area of the openings of the hollow chambers 4 is, at the
most, preferably 50% of the extension area of the stamping surface
2. A sufficiently high stability or carrying capacity of the
stamping surface 2 or the surface layer 3/covering layer 6 is
hereby achieved with respect to the high stresses arising during
the stamping.
[0050] In general, the form, configuration, surface density and the
like of the hollow chambers 4 can be controlled by corresponding
choice of the procedural conditions during anodic oxidation. For
example, with oxidation of aluminium under potentiostatic
conditions--with at least substantially constant voltage--an at
least substantially even cross-section of the hollow chambers 4 is
achieved over their depth T, i.e. an at least substantially
cylindrical form. Accordingly, the form of the hollow chambers 4
can be influenced by varying the voltage. For example,
galvanostatic oxidation--i.e. at an at least substantially constant
current--leads to a somewhat conical or hill-like form of the
hollow chambers 4, so that a type of "moth eye structure" or the
like can be formed in this way. The surface density of the hollow
chambers 4, i.e., the number of hollow chambers 4 per surface unit
the stamping surface 2, depends inter alia on the voltage and the
current during anodising.
[0051] As required, the hollow chambers 4 can vary in their form,
depth and/or surface density over the stamping surface 2,
especially partially, and/or be designed only partly on the
stamping surface 2.
[0052] And, if required, the stamping surface 2 can also be
modified before and/or after oxidation--creation of the hollow
chambers 4--for example via a lithographic process, etching and/or
other, preferably material-stripping methods, for example to create
a rough structure in the form of paths, ridges, areas with or
without hollow chambers 4, large-surface bumps or depressions and
the like on the stamping surface 2.
[0053] Chemical sizing, especially by partial etching of oxide
material, can also be carried out to modify the stamping surface 2
or the hollow chambers 4. In this way the surface ratio of the
opening surfaces of the hollow chambers 4 to the extension area of
the stamping surface 2 can be varied or increased. It is understood
that other modifications of the stamping surface 2 or of the hollow
chambers 4 can also be made, depending on reaction time and
intensity.
[0054] A particular advantage of the proposed solution is that the
stamping surface 2 can also be designed in a curved manner--for
example cylindrically--or bulged--for example lenticular or
hemispherical. In particular the stamping surface 2 can have
practically any shape at all. Compared to the prior art it is thus
not necessary that the stamping surface 2 or the surface of the
surface layer 3/covering layer 6 is at least substantially
even.
[0055] The figure also shows a workpiece 8, likewise in a highly
simplified, not true-to-scale sectional diagram, in the already
stamped state, i.e. with a surface 9 already structured by the
stamping tool 1. Stamping takes places especially by the stamping
tool 1 being pressed with a corresponding stamping force onto the
surface 9 of the workpiece 8 to be structured, so that the material
of the workpiece 8 flows at least partially into the hollow
chambers 4. Here it is not necessary that the workpiece 8, as
illustrated diagrammatically in the figure, is designed in a
monoblock manner. Instead, the workpiece 8 can also present another
type of surface layer or surface coating or the like, not
illustrated here, which forms the surface 9 and is structured or
designed in a relief-like manner by means of the stamping tool
1.
[0056] Instead of the stamp-like embossing the stamping tool 1 can
be unrolled with corresponding shaping/form of the stamping surface
2 and/or the surface 9 to be structured. By way of example the
stamping surface 2 and/or the surface 9 to be structured can be
designed in a curved manner--for example cylindrically--or in a
bulged manner to enable reciprocal unrolling for structuring the
surface 9.
[0057] Both a die stamping process and also a rolling stamp process
can be realized with the proposed solution.
[0058] Furthermore, the proposed solution can be used for embossing
as well as closed-die coining or coining. A corresponding abutment
for the workpiece 8 or a corresponding countertool is not
illustrated for clarification purposes.
[0059] The proposed stamping tool 1 allows very fine structuring of
the workpiece 8 or its surface 9. If needed the workpiece 8 or the
surface 9 can also be profiled or structured repeatedly, first with
a rough structured stamping tool--optionally manufactured also in
customary fashion--and then with the finer structured proposed
stamping tool 1. A lower stamping force is employed, especially
during the second stamping procedure using the finer stamping tool
1 and/or, in an intermediate step, the surface 9 is hardened in
order not to fully neutralise the rough structure produced at first
stamping, but to achieve superposition from the rough structure and
the fine structure of both stamping tools. Thus, it is possible,
for example, to create on the surface 9 relatively large bumps of
the order of 0.1 to 50 .mu.m each with several, relatively small
protrusions, for example of the order of 10 to 400 nm, on the
surface 9 of the workpiece 8.
[0060] The proposed solution very easily and cost-effectively
enables very fine structuring of the surface 9. Accordingly, there
is a very broad area of application. For example, such especially
very fine structuring can be utilised in anti-reflex layers, for
altering radiation emission of structured surfaces, in sensory
analysis, in catalysis, in self-cleaning surfaces, in improving
surface wetability and the like. In particular, the proposed
solution also extends to the use of workpieces 8 with structured
surfaces 9 that have been structured by use of the proposed
stamping tool 1 for the purposes mentioned hereinabove.
[0061] In particular the proposed solution is suited for stamping
synthetic materials--for example PMMA (polymethyl methacrylates),
Teflon or the like, metals--for example gold, silver, platinum,
lead, idium, cadmium, zinc or the like, polymer coatings--for
example paints, dyes or the like, and inorganic coating systems
etc.
[0062] Expressed in general terms, an essential aspect of the
present invention according to the first embodiment is using a
surface layer with hollow chambers formed by anodic oxidation as
bottom die or upper die, to enable surface structuring in the
nanometer range.
[0063] Now, the second embodiment of the present invention is
discussed with reference to FIG. 2.
[0064] In a highly simplified partial sectional elevation, FIG. 2
shows a proposed casting mold 11 with an at least partially
structured, thus profiled or relief-like inner face or molding face
12. The face 12 is formed by a top or flat side of a surface layer
13 that is provided with open hollow chambers 14 produced by anodic
oxidation.
[0065] In the illustrative example, the surface layer 13 is applied
to a support 15 of the casting mold 11. For example, the surface
layer 13 is applied to the support 15 by plasma coating. But the
surface layer 13 can also be formed directly by the support 15, and
thus be a surface area of the support 15.
[0066] It is understood that the surface layer 13 can also be
deposited on the support 15 using other methods.
[0067] In the illustrative example, the surface layer 13 preferably
comprises aluminium, which is applied to the support 15 especially
via plasma coating and adheres well to the support 15 preferably
made of metal, especially iron or steel.
[0068] The surface layer 13 is oxidised anodically at least
partially, in the illustrative example to the depth of a covering
layer 16, by means of which the hollow chambers 14 are formed in
the surface layer 13 or covering layer 16. The hollow chambers 14
are formed directly or model-free, that is, the configuration,
distribution, form and the like of the hollow chambers 14 is,
compared to electrolytic machining, therefore at least
substantially dependent on the surface shape and proximity of the
cathodes (not illustrated here) used during oxidation. Rather, the
`valve effect` is made use of here, as per the invention, namely
the automatic development of the hollow chambers 14 occurring
during oxidation or anodising of the surface layer 13, at least
especially with so-called valve metals. Such direct and model-free
production of the hollow chambers 14 does not exclude additional
(prior or subsequent) forming or structuring of the face 12 or of
the hollow chambers 14
[0069] completely or how deeply the surface layer 13 is oxidised,
or whether the surface layer 13 is formed directly by the support
15, the surface layer 13 can correspond to the oxidised covering
layer 16. In the illustrative example in this case, for example,
the intermediate layer 17, which is comprised of aluminium and
which promotes very good adhesion between the covering layer 16 and
the support 15, can be omitted.
[0070] For example, according to a design alternative the uncoated
support 15 can be oxidised anodically on its surface forming the
face 12 by formation of a porous oxide layer or hollow chambers 14.
This is possible for example for a support 15 made of iron or
steel, especially stainless steel. In this case the surface layer
13 then corresponds to the covering layer 16, i.e., the oxidised
layer.
[0071] Aluminium and iron or steel, especially stainless steel,
have already been named as particularly preferred material, used at
least substantially for forming the anodically oxidised surface
layer 13 or the covering layer 16. However, silicon and titanium as
well as other valve metals for example can also be used.
[0072] In the illustrative example the proportions in size are not
presented true to scale.
[0073] The face 12 preferably has a structural width S in the
nanometer range, especially of 130 to 600 nm and preferably of 50
to 200 nm.
[0074] The hollow chambers 14 or their openings have an average
diameter D of essentially 10 to 500 nm, preferably 15 to 200 nm and
especially 20 to 100 nm.
[0075] In the illustrative example, the hollow chambers 14 are
designed essentially lengthwise, wherein their depth T is
preferably at least approximately 0.5 times the above-mentioned,
average diameter D and especially approximately 1.0 to 10 times the
diameter D.
[0076] The hollow chambers 14 are designed here at least
substantially identically. In particular the hollow chambers 14 are
designed substantially cylindrically. But the hollow chambers 14
can also present a form deviating therefrom, for example they can
be designed substantially conically.
[0077] In general the hollow chambers 14 can also have a
cross-section varying in its depth T in form and/or diameter. In
addition to this, the hollow chambers 14 can be designed
substantially conically as a rough structure for example, and
provided along their walls with many fine depressions (small hollow
chambers) to form a fine structure in each case.
[0078] The hollow chambers 14 are preferably distributed at least
substantially uniformly over the surface of the surface layer 13 or
over the face 12. However, uneven distribution is also
feasible.
[0079] The hollow chambers or their openings are preferably
distributed with a surface density of 10.sup.9 to 10.sup.11/cm. In
the illustrative example the surface density is substantially
constant over the face 12. But the surface density can also vary
selectively on the surface 12 as required.
[0080] The area of the openings of the hollow chambers 14 is at the
most preferably 50% of the extension area of the face 12. A
sufficiently high stability or carrying capacity of the face 12 or
the surface layer 13/covering layer 16 is hereby achieved with
respect to the high stresses arising partially from molding or
casting.
[0081] In general the form, configuration, surface density and the
like of the hollow chambers 14 can be controlled by corresponding
choice of the procedural conditions during anodic oxidation. For
example, with oxidation of aluminium under potentiostatic
conditions--i.e., at at least a substantially constant voltage--an
at least substantially uniform cross-section of the hollow chambers
14 is achieved over their depth T, i.e., an at least substantially
cylindrical form. Accordingly, the form of the hollow chambers 14
can be influenced by varying the voltage. For example,
galvanostatic oxidation, i.e. at an at least substantially constant
current, leads to a somewhat conical or hill-like form of the
hollow chambers 14, so that a type of "moth eye structure" or the
like can be formed in this way. The area density of the hollow
chambers 14, i.e., the number of hollow chambers 14 per area unit
on the face 2, depends inter alia on the voltage and the current
during anodising.
[0082] As required, the hollow chambers 14 can vary in their form,
depth and/or surface density over the face 2, especially partially,
and/or be designed only partially on the face 12.
[0083] And, if required, the face 12 can also be modified before
and/or after oxidation--thus creation of the hollow chambers
14--for example, via a lithographic process, etching and/or other,
preferably material-stripping methods, for example to create a
rough structure in the form of paths, ridges, areas with or without
hollow chambers 14, large-surface bumps or depressions and the like
on the face 12.
[0084] Mechanical processing and/or chemical sizing, especially by
partial etching of oxide material, can also be carried out to
modify the face 12 or the hollow chambers 14. In this way, the area
ratio of the opening areas of the hollow chambers 14 to the
extension area of the face 12 can be varied or increased. It is
understood that other modifications of the face 12 or of the hollow
chambers 14 can also be made, depending on reaction time and
intensity.
[0085] A particular advantage of the proposed solution is that the
face 12 can also be designed in practically any shape at all.
[0086] The figure also shows a molded article or workpiece 18,
likewise in a highly simplified, not true-to-scale, sectional
diagram, in the already finished state, i.e., with a surface 19
already structured by the casting mold 11 after casting.
[0087] The proposed casting mold 11 allows very fine structuring of
the workpiece 18 or its surface 19. It is possible, for example, to
create relatively large bumps of the order of 0.1 to 50 .mu.m each
with several, relatively small projections on the surface 19, for
example of the order of 10 to 400 nm, on the surface 19 of the
workpiece 18.
[0088] The proposed solution very easily and cost-effectively
enables very fine structuring of the surface 19. Accordingly, there
is a very broad area of application. For example, such especially
very fine structuring can be utilised in anti-reflex layers, for
altering radiation emission of structured surfaces, in sensory
analysis, in catalysis, in self-cleaning surfaces, in improving
surface wettability and the like.
[0089] Expressed in general terms, an essential aspect of the
present invention is casting or molding a surface layer with hollow
chambers formed directly or model-free by anodic oxidation, to
enable surface structuring in the nanometer range.
[0090] The present invention is especially not limited to a casting
mold 11 in the narrower sense. Rather, the surface layer 13 or
covering layer 16 is to be understood as model for a general
structuring of a surface, a tool, a workpiece or the like in the
nanometer range. In particular, the model may be molded in any way
at all. And in particular, no reshaping is required when molding.
For example, with the workpiece 18 to be manufactured having a
structured surface 19, this can be a cast article, wherein the
surface 19 is structured by casting or decanting or any molding of
the mold 11.
[0091] In general, the present invention enables a simple,
cost-effective stamping or molding in the nanometer range by a
surface layer with hollow chambers formed by anodic oxidation being
used as matrix or as casting mold.
[0092] Technical Applicability
[0093] The proposed solution very easily and cost-effectively
enables very fine structuring of the surface. Accordingly, there is
a very broad area of application. For example, such especially very
fine structuring can be utilised in anti-reflex layers, for
altering radiation emission of structured surfaces, in sensory
analysis, in catalysis, in self-cleaning surfaces, in improving
surface wetability and the like. In particular, the proposed
solution also extends to the use of workpieces with structured
surfaces that have been structured by use of the proposed stamping
tool for the purposes mentioned hereinabove. Further, the proposed
solution can be used for casting with practically any material,
since aluminium oxide especially is highly resistant mechanically,
thermally and/or chemically.
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