U.S. patent application number 10/781456 was filed with the patent office on 2004-08-19 for techniques for connecting a lead to a conductor.
This patent application is currently assigned to Antaya Technologies Corporation. Invention is credited to Antaya, Stephen C., MacHado, Manuel H..
Application Number | 20040158981 10/781456 |
Document ID | / |
Family ID | 32179387 |
Filed Date | 2004-08-19 |
United States Patent
Application |
20040158981 |
Kind Code |
A1 |
Antaya, Stephen C. ; et
al. |
August 19, 2004 |
Techniques for connecting a lead to a conductor
Abstract
A connector device is shaped or formed to include bendable flaps
for securing one or more conductors when the flaps are crimped.
Typically, the connector device includes a base having an external
surface that is eventually affixed to a complementary shaped
surface. Accordingly, a conductor can be attached to the
complementary shaped surface. For example, one or more conductors
can be crimped via the connector device, which is thereafter
attached to a complementary surface.
Inventors: |
Antaya, Stephen C.; (West
Kingston, RI) ; MacHado, Manuel H.; (Hope,
RI) |
Correspondence
Address: |
HAMILTON, BROOK, SMITH & REYNOLDS, P.C.
530 VIRGINIA ROAD
P.O. BOX 9133
CONCORD
MA
01742-9133
US
|
Assignee: |
Antaya Technologies
Corporation
Cranston
RI
|
Family ID: |
32179387 |
Appl. No.: |
10/781456 |
Filed: |
February 18, 2004 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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10781456 |
Feb 18, 2004 |
|
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|
10176946 |
Jun 20, 2002 |
|
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6730848 |
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60302087 |
Jun 29, 2001 |
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Current U.S.
Class: |
29/861 ; 29/854;
29/857; 29/860 |
Current CPC
Class: |
H01R 4/182 20130101;
H01R 4/184 20130101; Y10T 29/49169 20150115; Y10T 29/49179
20150115; Y10T 29/49174 20150115; B23K 1/0008 20130101; B23K
2101/32 20180801; Y10T 29/49181 20150115 |
Class at
Publication: |
029/861 ;
029/860; 029/854; 029/857 |
International
Class: |
H01R 043/02; H01R
004/66 |
Claims
What is claimed:
1. A method of producing a device for securing conductors, the
method comprising the steps of: shaping a connector device to
include bendable flaps for securing a conductor; and forming the
connector device to include an external surface that is eventually
affixed to a substantially complementary shaped surface, at least a
portion of the conductor secured in the connector device also being
affixed to the substantially complementary shaped surface, the
conductor being bent near the connector device in a manner so that
at least a portion of the conductor and the external surface of the
connector device lie in a common contour.
2. A method as in claim 1, wherein the external surface is
substantially flat and at least a portion of the conductor and
external surface lie in a common plane.
3. A method as in claim 1 further comprising the steps of:
providing a strip of flat metal; and bending the strip of flat
metal to form the bendable flaps of a connector device, a portion
of the strip of flat metal forming the external surface that is
eventually attached to the complementary surface.
4. A method as in claim 1, wherein the connector device includes
two or more sets of bendable flaps.
5. A method as in claim 1, wherein the connector device is
electrically conductive.
6. A method as in claim 1, wherein the external surface of the
connector device is soldered to a complementary shaped surface.
7. A method as in claim 1, wherein a lead is crimped to the
conductor via the connector device.
8. A method as in claim 1 further comprising the step of: shaping
the connector device to include a tongue for attaching a lead
wire.
9. A method as in claim 8, wherein a lead wire can be removably
attached to the tongue.
10. A method as in claim 9, wherein the tongue is disposed above a
corresponding surface to which the connector device is
attached.
11. A method of attaching conductors comprising the steps of:
providing a connector device having bendable flaps for securing a
conductor strip when the flaps are crimped, the connector device
including an external surface for attachment to a substantially
complementary shaped surface; crimping at least a portion of the
conductor strip to the connector device by bending the flaps; and
attaching the connector device and at least a portion of the
conductor strip to the substantially complementary surface, the
conductor being bent near the connector device in a manner so that
at least a portion of the conductor and the external surface of the
connector device lie in a common contour.
12. A method as in claim 11, wherein the step of crimping further
comprises: bending the set of flaps of the connector device inwards
towards each other to secure a lead wire to the conductor
strip.
13. A method as in claim 11, wherein the connector device is
crimped around a lengthwise portion of the conductor strip to
attach a distal end of a lead wire to the conductor strip.
14. A method as in claim 11, wherein the connector device is
electrically conductive.
15. A method as in claim 11 further comprising the steps of:
disposing a lead wire above the conductor strip and thereafter
crimping the flaps of the connector device to attach the lead wire
to the conductor strip; and bending a portion of the conductor
strip extending through the connector device such that at least a
portion of the conductor strip lies in a common plane with the
external surface of the connector device.
16. A method as in claim 15, wherein the step of bending a portion
of the conductor strip includes applying a force on a portion of
the conductor strip extending beyond an edge of the connector
device.
17. A method as in claim 11, wherein the conductor strip includes a
braided wire.
18. A method as in claim 11, wherein the conductor strip comprises
a braided wire with a solder core.
19. A method as in claim 11 further comprising the steps of:
contacting the external surface of the connector device to the
complementary shaped surface; and applying heat to the connector
device for soldering the connector device to the complementary
shaped surface.
20. A method as in claim 19, wherein the complementary shaped
surface is a layer of glass.
21. A method as in claim 11 further comprising the step of:
applying heat to the conductor strip and connector device for
attachment to glass.
22. A method as in claim 11 further comprising the step of: bending
the flaps of the connector device to crimp a lead wire to a braid
of wire.
23. A method as in claim 22 further comprising the steps of:
heating the braid of wire; and applying solder to the braid of
wire.
24. A method as in claim 11 further comprising the step of:
attaching individual solder masses along the conductor strip.
25. A method of forming an assembly comprising: providing a
conductor; securing a connector device to the conductor by crimping
bendable flaps extending from the connector device, the connector
device having an external surface; and bending the conductor near
the connector device in a manner so that at least a portion of the
conductor and the external surface of the connector device lie in a
common contour for attaching to a surface.
Description
RELATED APPLICATIONS
[0001] This application is a divisional of U.S. application Ser.
No. 10/176,946, filed Jun. 20, 2002, which claims the benefit of
U.S. Provisional Application No. 60/302,087 filed Jun. 29, 2001.
The entire teachings of the above applications are incorporated
herein by reference.
BACKGROUND OF THE INVENTION
[0002] Creating a solder connection between a conductor such as a
braided wire and a conductive node can be tedious, especially when
the conductive node or underlying material is sensitive to extreme
temperature. To create such a connection, a hot soldering iron is
generally applied to the surface of the conductor and the
conductive node, forcing the two conductors in contact with each
together. Heat from the hot solder iron tip flows through the
material, increasing the temperature of both conductors. After both
conductors reach a desired temperature, a solder wire is typically
provided in contact with the two conductors and hot soldering iron.
Upon contact, the solder melts and flows to fill the void between
the conductors. After the area cools, a solid conductive solder
contact bond remains, holding the two conductive terminals
together.
[0003] Unfortunately, the process of soldering a braided wire to a
conductive node involves incidentally heating the underlying
conductive substrate as well as the braided wire to extreme
temperatures. Overheating the material underlying the conductive
substrate can stress the material creating a structural weak spot.
This is particularly true when the material is sensitive to thermal
exposure such as when the substrate is glass. Needless to say,
structural weakening of this material, or any material for that
matter, is undesirable because it increases the likelihood of a
premature product failure.
[0004] The method of soldering a braid of wire to a conductive
contact can also be a cumbersome process. Soldering braided wire
can require three hands: a first to direct the solder iron, a
second to direct the solder wire and a third to hold the braided
wire in place. When only two hands are used, as is often the case,
it is difficult to simultaneously control the direction of solder
wire and hold the braided wire in place using only one hand. Hence,
it is difficult to maneuver the solder wire to the desired area
during the. soldering process. In addition, a technician can
miscalculate how long it takes to heat an area to be soldered.
Overheating an area with a solder iron can stress the underlying
material.
SUMMARY OF THE INVENTION
[0005] One aspect of the present invention is directed towards a
system and method of securing conductors. In an illustrative
embodiment, a connector device is shaped to include bendable flaps
for securing one or more conductors such as a conductive strip and
a lead wire. The connector device can include a base having an
external surface that is eventually affixed to a complementary
shaped surface. A portion of the conductor can also be attached to
the complementary shaped surface. Accordingly, a conductor strip
and connector device can be securely fastened to the complementary
shaped surface.
[0006] In one application, one or more conductors are crimped into
the connector device, which is attached to a complementary
surface.
[0007] The connector device can be made from a strip of flat metal
and can be formed to include bendable flaps. A portion of the metal
strip can form the external surface that is eventually attached to
a complementary surface.
[0008] In another application, the external surface of the
connector device is flat such that the external surface of the
connector device and at least a portion of the conductor strip lie
in a common plane for attachment to a complementary shaped surface
such as a flat surface.
[0009] In yet another application, the connector device for
crimping conductors includes two or more sets of bendable flaps so
that multiple conductors can be crimped together. For example, a
first set of bendable flaps can be used to crimp a conductor such
as a lead wire to the connector device while a second set of
bendable flaps can be used to crimp yet another conductor to the
connector device. Accordingly, two or more conductors can be
crimped to a common electrode such as the connector device
itself.
[0010] Although the connector device can be made of any suitable
material such as an insulating material, it is optionally
electrically conductive. Thus, when the connector device is formed
out of metal such as copper, the external surface of the connector
device can be soldered to a complementary shaped surface. The
conductor strip is also optionally soldered to the complementary
surface.
[0011] Another aspect of the present invention involves shaping the
connector device to include a tongue for attaching a lead wire. For
example, the connector device can include a protruding extension to
which a lead wire can be removably or permanently attached. The
tongue can be formed or bent so that it rests above a complementary
surface to which the connector device is attached.
[0012] Another aspect of the present invention involves providing a
connector device having bendable flaps for securing one or more
conductors such as a conductor strip when the flaps are crimped.
The conductor strip can be a flat strip of metallic or conductive
material. As previously discussed, the connector device can include
an external surface for attachment to a complementary shaped
surface. Thus, the connector device can be used to attach one or
more crimped conductors to the complementary surface. Also, a
portion of the conductor strip itself can be attached to a
complementary shaped surface.
[0013] Generally, the bendable flaps can be bent inwards or towards
each other to crimp the conductor such as a flat conductive strip
to the connector device. More specifically, a connector device can
be crimped around a lengthwise portion of a conductive strip to
attach another conductor such as a distal end of a lead wire to the
conductor strip.
[0014] The connector device can be made of electrically conductive
metal, although even a non-conductive material can be used to form
the connector device.
[0015] In one application, a conductor strip is positioned in a
channel formed by bendable flaps and a lead wire is then crimped to
the elongated conductor strip by bending the flaps inward. A
portion of the flat conductor strip extending through the connector
device can be formed or bent so that the flat conductive strip lies
in a common plane with the external surface of the connector
device.
[0016] One method of bending a portion of the flat conductive strip
includes applying a force on a portion of the conductive strip
extending beyond an edge of the connector device so that at least a
portion of the conductive strip generally lies flat lengthwise
along a surface such as a planar or curved surface. Consequently, a
flat conductive strip and base of the connector device can lie in a
common plane on a corresponding surface to which the entire
assembly can be attached.
[0017] The conductive strip can be a braided wire with a solder
core. Thus, an assembly including a connector device and braided
wire lying flat on a surface can be heated to melt the solder and
attach the braided wire and connector device to a corresponding
complementary shaped surface.
[0018] The complementary surface to which the braid wire is
attached can be a conductive layer disposed on glass or glass
itself such as a surface of an automobile window. The conductor and
connector assembly can also be attached directly to glass or other
surface using a solder process. Accordingly, a voltage can be
applied to the conductive layer through a lead wire attached to the
connector device.
[0019] An elongated conductor strip crimped in the connector device
is optionally a braided wire that is pre-soaked in previously
heated solder. In such a case, the conductive strip and connector
device can be affixed to a complementary surface by melting the
solder in the braid.
[0020] Generally, the conductor strip can be flexible so that it
can conform to the shape of a complementary surface to which it is
eventually attached. Accordingly, it is an easier task to secure an
assembly including the conductor strip to a complementary surface.
Preferably, the conductor strip is substantially similar to the
complementary surface to which it is secured, but an exact matching
of contoured surfaces is not necessary when the conductor is more
flexible. That is, the conductor can be somewhat malleable so that
it can be formed for attachment to a particular surface.
[0021] Spaced masses of solder can be attached along a length of an
elongated conductor strip to which the connector device is crimped.
Thereafter, heat can be applied to the elongated conductor and
connector device to melt the solder masses for attaching the
elongated conductor to a corresponding surface.
[0022] One application of the inventive combination of materials
such as a lead wire attached to a conductor is a rear window of an
automobile or even glass itself. In such an application, a lead
wire can be crimped to a conductor such as a braided wire via the
connector device. This combination of conductive strip and
connector device can then be soldered to a heater or defroster
strip disposed on glass. For example, a base of the connector
device and conductive strip such as braided wire can be soldered to
a conductive layer disposed on a rear window of an automobile. A
lead wire can be crimped by the connector device to contact the
braid. The assembly can also be soldered directly to a glass
window. Consequently, a voltage then can be applied to the heater
strip via a connection between the lead wire crimped to the
connector device, which in turn is attached to the heater
strip.
BRIEF DESCRIPTION OF THE DRAWINGS
[0023] The foregoing and other objects, features and advantages of
the invention will be apparent from the following more particular
description of preferred embodiments of the invention, as
illustrated in the accompanying drawings in which like reference
characters refer to the same parts throughout the different views.
The drawings are not necessarily to scale, emphasis instead being
placed upon illustrating the principles of the invention.
[0024] FIG. 1 is a diagram of a connector device for attaching a
lead wire to a conductor according to certain principles of the
present invention.
[0025] FIG. 2 is a diagram of a crimped connector device attaching
a lead wire to a conductor according to certain principles of the
present invention.
[0026] FIG. 3 is a side view diagram of flattening a conductor
according to certain principles of the present invention.
[0027] FIG. 4 is a diagram illustrating a connector device
including multiple sets of bendable flaps according to certain
principles of the present invention.
[0028] FIG. 5 is a diagram of a connector assembly for attaching a
lead wire to a conductive strip according to certain principles of
the present invention.
[0029] FIG. 6 is a diagram of a connector device including a tongue
for attaching a wire lead according to certain principles of the
present invention.
[0030] FIG. 7 is a cross-sectional diagram of a braided wire with
flux solder core according to certain principles of the present
invention.
[0031] FIG. 8 is a cross-sectional diagram of a flattened braided
wire with flux solder core according to certain principles of the
present invention.
[0032] FIG. 9 is a diagram illustrating a method of attaching a
conductor and wire lead to a complementary surface according to
certain principles of the present invention.
[0033] FIG. 10 is a diagram of attaching a conductor and lead wire
to glass according to certain principles of the present
invention.
DETAILED DESCRIPTION OF THE INVENTION
[0034] A description of preferred embodiment follows.
[0035] FIG. 1 is a diagram illustrating an assembly for connecting
a lead wire to a conductor strip according to certain principles of
the present invention.
[0036] As shown, connector device 110 includes channel 120 formed
by bendable flaps 115. Generally, bendable flaps 115 can be crimped
or bent inward to secure any number of conductors. For example,
lead wire 130 including exposed wire strands 112 can be secured to
conductor 140 by positioning distal end of lead wire 130 and
conductor 140 in channel 120 and, thereafter, bending flaps 115
inward with a corresponding crimping tool. Accordingly, a connector
150 of lead wire 130 can be electrically connected to conductor 140
through lead wire 130.
[0037] Although FIG. 1 illustrates a connection between a conductor
140 such as a flat conductor strip such and lead wire 130,
generally any type of conductor strips can be secured to a
complementary surface.
[0038] One aspect of the present invention concerns the shape of
connector device 110. Generally, a surface of connector device 110
can be shaped for attachment to a substantially complementary
surface. That is, the shape of a surface of connector device 110
can have a surface contour that substantially matches that of a
complementary surface to which it is attached. For example, a base
or bottom surface of connector device 110 can be flat so that it
can be attached to a corresponding approximately flat surface.
According to this aspect of the invention, connector device 110 can
be more easily attached to a complementary surface via a strong
solder bond.
[0039] In one application, connector device 110 is fabricated from
malleable metal such as copper or tinned copper so that connector
device 110 can be soldered to a complementary shaped surface such
as metal or glass. As shown, conductor 140 can be a flat strip of
metallic material such as a braided wire so that assembly 100
generally has a planar shape along bottom of conductor 140 and
connector device 110. Consequently, a planar surface of assembly
100 including base of connector device 110 and surface of conductor
140 can be soldered to a complementary shaped surface.
[0040] FIG. 2 is a diagram of a conductor attached to a lead wire
according to certain principles of the present invention.
[0041] As previously discussed, wire strands 112 at distal end of
lead wire 130 can be crimped to conductor 140. Solder masses 210
such as strips of solder with a flux core can be attached or
crimped along a length of conductor 140. Typically, solder masses
210 are spaced at a specified distance such as length, L, apart
from each other. Solder masses 210 need not include a flux
core.
[0042] When used, the addition of the spaced solder masses 210
renders it easier to solder assembly 200 to a corresponding
surface. For example, conductor 140 can be soldered to a
complementary surface by heating conductor 140 and solder masses
210 accordingly. Thus, a predetermined mass of solder can be melted
to provide a solder connection between conductor 140 and underlying
surface. Also, crimping solder masses 210 along a length of the
conductor simplifies the soldering process since an extra hand is
no longer necessary to hold the solder in close proximity to the
conductor 140. Rather, the solder masses can be attached to
conductor 140. Based on this aspect of the invention, assembly 200
can be more easily soldered to a complementary surface such as a
planar surface area of glass.
[0043] Solder masses 210 can include a flux core or an external dab
of flux (between solder mass 210 and conductor 140) can be provided
so that the melted solder flows more easily during the attachment
process. In one embodiment, the solder masses themselves do not
include flux in their core. However, when solder masses 210 do
include flux in their core, the end of solder masses 210 are
preferably tapered so that a substantial amount of the flux remains
within the core of a solder mass 210 when it is crimped to
conductor 140.
[0044] Another aspect of the present invention involves shaping
conductor 140 so that it can be attached to a complementary
surface. For example, a portion of conductor 140 extending through
crimped portion of connector device 110 is bent near sections 220
so that bottom portion of connector device 110 and conductor 140
are generally flat along their length. This is shown in more detail
in FIG. 3.
[0045] FIG. 3 is a side view diagram illustrating a process of
bending a conductor according to certain principles of the present
invention.
[0046] To shape conductor 140, a force is applied via stamp 310 so
that conductor 140 and connector device 110 generally lie flat or
form a contoured surface. Consequently, assembly 200 can be more
easily attached to a complementary surface. Of course, conductor
and/or bottom surface of connector device 110 can be shaped for
attachment to any shaped surface contour.
[0047] As shown, a conductor 140 and connector device 110 can be
formed for attachment to a particular surface contour. For
instance, a portion of conductor 140 such as a conductor strip can
be bent or formed so that an external surface of connector device
110 and a portion of conductor 140 conform to a selected contour.
One such selected contour is a flat surface of glass. Notably,
conductor 140 can be flexible so that conductor 140 conforms to a
complementary surface with minimal effort.
[0048] FIG. 4 is a diagram of a connector device including multiple
sets of bendable flaps according to certain principles of the
present invention.
[0049] As shown, connector device 405 includes sets of bendable
flaps 410 spaced apart from each other. Thus, flaps 410 can form
corresponding channels 430, 431. Each set of bendable flaps 410 can
secure individual conductors to a common electrical node when
crimped. It is, therefore, a simpler task to attach multiple
conductors such as lead wires to connector device 405. For example,
the conductors can be attached at different times.
[0050] One method of fabricating connective device 405 is to cut an
`H` shaped pattern out of a flat strip of metal. Thereafter, flaps
410 can be bent so that they are substantially perpendicular to
base 420, potentially forming a surface of connector device 405
that can be attached to a complementary shaped surface. For
example, a flat base 405 can be formed for attaching connector
device 430 to a complementary surface.
[0051] FIG. 5 is a diagram illustrating a device for attaching
multiple conductors according to certain principles of the present
invention. As discussed, flaps 410 can be crimped to connect
multiple lead wires 130 to connector device 405 and, more
specifically, conductor 140.
[0052] Assembly 500 optionally includes serially disposed
electrical component 510 such as a resettable fuse and connector
550.
[0053] FIG. 6 is a diagram of a connector device including an
extension for attaching a conductor such as a lead wire according
to certain principles of the present invention.
[0054] Many features of connector device 610 have been discussed in
previous embodiments as discussed. However, device 610 also
includes a base extension 620 and tongue 630 such as a protruding
portion of metal. In the embodiment shown, tongue 630 is formed so
that a conductor such as connector 635 can be attached to a portion
of tongue 630 disposed at a height, H, above extension 620.
Extension 620 is optional and tongue 630 generally can be connected
to any portion of connector device 610. For example, extension 620
itself can be shaped to form a male connector for attaching a lead
such as connector 635.
[0055] FIG. 7 is a pictorial view of a conductor according to
certain principles of the present invention. As shown, a
combination of materials can be used to form a conductor including
a wire braid 740 with flux solder core.
[0056] Solder wire 720 with a flux core 730 is first provided.
Strands of wire are knitted about the outside of the solder wire
720 to produce a braid of wire 710 hugging the outer surface of
solder wire 720. Alternatively, a solder wire 720 may be passed
through the center of a pre-assembled hollow wire braid 710. The
resulting solder-filled braid 740, regardless of the assembly
method, resembles a metallic sleeve that runs the length of the
overall solder wire 720.
[0057] The term "solder" has been used and will be used throughout
this specification. It should be noted that this term includes
suitable substantially pure metals such as lead or tin as well as
solder, commonly so-called, and other fusible alloys or
compositions that serve the same purpose. Additionally, "flux"
refers to material that aids in the fusion process.
[0058] According to another embodiment of the present invention, a
solder strip 720 is flattened on a braid or within a braid to
produce at least a two layer structure including an unmelted flat
bead of solder on a single or double layer of braided wire. A cross
section of the picture in FIG. 8 shows a combination of solder 720
and flux 730 on a single or double layer braid of wire 730.
[0059] A composition of material by weight, i.e., solder versus
braided wire, can be tailored depending on the particular
application. For example, some applications require more solder by
weight than braided wire, in which case a larger mass, or diameter,
of solder is provided at the solder core. Additionally, the
thickness of the wire strands or thickness of the overall knitted
braid of wire can be tailored depending on the application.
[0060] It should be noted that the aforementioned method of
combining materials to create a braided wire 740 with a solder core
advantageously enables one to achieve very high levels of solder
content. For example, it is possible to achieve a mixture of
greater than 90% solder and less than 10% braid by weight.
Alternative methods, such as pre-soldering the braid, generally
cannot produce a braid of wire impregnated with more than 41%
solder by total weight. Hence, during the solder process, the
inventive combination of material does not require the laborious
task of adding solder to the braided strip to achieve a higher
percentage of solder by weight as is required for a pre-soldered
version. Rather, the present invention advantageously provides the
correct solder content at its core prior to the solder process.
Overheating of an underlying substrate is avoided because there is
no need to add more solder to the surface during the soldering
process.
[0061] In the preferred embodiment, the combination of flux 730,
solder 720 and braid of wire 710 is flattened with a rolling device
to produce a flat wire braid 850 with flux solder core as shown in
FIG. 8. Because the solder 720 core is generally malleable, the
strands of wire in the braid of wire 710 become embedded in the
softer solder 720 material during the flattening process. This
flattened braided wire with flux solder core 850 can be used as
conductor 140 that is crimped into connector device 110, 405 via
bendable flaps 115, 410 as shown in FIGS. 1 and 4.
[0062] Referring again to FIG. 8, the combination of solder 720 and
braid of wire 710 is flattened for a number of reasons. First,
embedding the strands of wire in the solder 720 serves to increase
the surface contact between the solder 720 and braid of wire 710,
thereby enhancing the thermal conductivity between the two
materials, i.e., heat flows more easily from the braided wire in
contact with the solder core. When the braid of wire is heated by
pressing a hot soldering iron to its outer surface, the heat easily
transfers to the core solder wire 720 because of the increased
surface area contact between the strands of wire and solder core
720. When the solder core melts, the solder is easily absorbed by
the braided wire facilitating the fusion of the braided wire to a
conductive node.
[0063] Additionally, the combination of material is flattened to
produce a flat wire braid 850 because this shape conforms to most
conductive electrical node surfaces, which are usually flat or
slightly curved surfaces. For example, to create a good solder
connection between two conductive materials, both materials
generally conform to each other so that both materials become
sufficiently heated during the solder process. In fact, it can be
necessary to sufficiently heat the conductive strips to avoid
creating cold solder joints. Preferably, the two conductive
materials touch during the heating process because melted solder
adheres and flows based on capillary action. Therefore, better
solder joints can be created when the surface area of the materials
to be bonded are in close proximity to each other.
[0064] FIG. 9 shows a method of soldering a conductor 140 such as a
strip of flat wire braid 850 with flux solder core to a conductive
strip 920 adhered to a glass substrate 930. Any of the connective
assemblies as previously discussed also can be attached directly to
glass or other complementary surface.
[0065] Heat can be applied directly to the surface of the conductor
140 at one or multiple points to bring the temperature of the
solder core up to its melting point. More specifically, one or
multiple heat sources 900 can be used at different positions along
the conductor so that a conductor strip is more easily soldered to
strip 920. Notably, conductor 140 can include spaced masses of
solder 210 as previously discussed.
[0066] A substantial portion of the heat can travel down the length
of the solder core, rather than through opposing side of the
braided wire to the conductive strip 920 adhered to the glass
substrate 930. Effectively, conductive strip 920 and glass 930 can
be buffered from the hot solder core by the layer of braided wire,
until the solder melts and forms a connection between conductor 140
and strip 920. Accordingly, underlying glass 930 is not severely
heated during the initial phases of the solder process. As
mentioned, conductor 140 and connector device 110 also can be
attached directly to glass 930.
[0067] Around the time when the solder core reaches its melting
temperature at the tip of heat source 900, so does the entire
length of the solder core in the braided wire strip 850 because of
the high thermal conductivity of the solder core, i.e., the solder
core is one solid strip. In some respects, the underlying
conductive strip 920 is shielded from severe heat because the
solder core has a higher thermal conductivity. Hence, a substantial
amount of heat generally passes down the solid core prior to
melting.
[0068] When braided wire with solder core is used, the solder core
melts and changes to a liquid. It is then typically absorbed into
the outer walls of the braided wire 850 where heat is then
transferred vertically to the underlying conductive strip 920.
Because conductive strip 920 is now in direct contact with the
braided wire strip 850 filled with molten solder, it experiences an
instant rise in temperature. As a result, the solder flows freely
onto the surface of the conductive strip 920 or window pane 930 to
form a reliable solder joint when the heat source is removed and
the area is cooled.
[0069] This method of attaching a braided wire strip 850 or
conductor 140 including connector device 115 to conductive strip
920 reduces and evenly distributes heat that is transferred to
glass substrate 930 during the soldering process. Effectively, a
substantial portion of heat imparted by heat source 900 is
initially transferred horizontally, or lengthwise, along the
braided wire 850 until the solder core melts at which point the
heat is then transferred vertically to the conductive strip 920.
Although glass 930 is exposed to heat, the aforementioned method is
superior to other methods which transfer heat in a substantially
vertical direction throughout the soldering process. As a result,
the present invention can be used to avoid creating severe "hot
spots" in glass 930 that can cause structural damage.
[0070] Another advantage of the present invention is the visual
clue that indicates when to stop heating the braided wire 850. A
technician can note that heat source 900 such as a solder iron
should be removed by observing when the solder core changes to a
liquid and is absorbed by the braided wire. Because the conductive
strip is in contact with braided wire 850, the solder can flow to
conductive strip 920 fusing the two conductors when the region is
cooled. In general, these visual clues indicate that a good solder
contact has been formed between braided wire 850 and underlying
conductive strip 920 on glass 930. At this point, or soon
thereafter, the technician knows to remove heat source 900 to avoid
unnecessarily overheating underlying glass 930.
[0071] The inventive method of soldering braided wire 850 or a
conductor 140 to a conductive strip 920 over a glass substrate 930
has a more favorable failure mode than other suggested methods. It
requires more force to separate the braid from the glass using the
adhesion process of the present invention. In particular, it
generally requires 15 pounds of pull on the braid 850 to tear it
from the conductive strip 920 or glass 930.
[0072] Based on other suggested methods such as soldering a
pre-soldered braid to a conductive strip adhered to a glass,
applying a 5 pound pull on the braid of wire causes the conductive
strip to separate from the main piece of glass. Essentially, the
effect of heating the glass is so severe using other methods that
the structurally damaged glass severs from the main piece of glass
before the adhesive solder between the braid and conductive strip
separates. Typically, shards of broken glass cling to the
conductive strip during the separation process destroying the
underlying window. The failure mode of the present invention,
therefore, is preferred because there is no damage to the glass and
the soldered braid can withstand a greater pulling force.
[0073] One application involves soldering a conductor 140 such as a
braided wire 850 to opposing ends of the defroster heating elements
on a rear window 1000 of an automobile. For example, see the
illustration in FIG. 10. Manufacturers of rear windows 1000
generally provide parallel, horizontal resistive strips 1010 that
produce heat when a voltage potential is applied across each end at
location 1050 and 1060. In short, the voltage difference 1040 along
lengthwise portion of resistive strips 1010 causes current to flow
through the resistive strips 1010, thus creating a mild heat source
when switch 1030 is turned on.
[0074] At some point in the manufacturing process, one or multiple
wires 1070 and 1080 must be routed to the vertically positioned
buses located at 1050 and 1060 on the left and right side of the
rear window 1000. Initially, a braid of wire with a flux solder
core 1020 can be cut to length and soldered to the resistive strip
on the glass at opposing ends 1050 and 1060. This solder process is
described above and illustrated in FIG. 9. The length of the braid
1020 now serves as a highly conductive path where little, if any,
heat is dissipated near braid of wire 1020 or conductor 140. Heat
can be generated in the middle of the window melting snow or ice
along the resistive strips 1010 where a driver is most interested,
rather than at the opposing edges located at 1050 and 1060. In
other words, the overlaying soldered braid wire 1020 on the wide
vertical resistive strips located at 1050 and 1060 tremendously
increases current carrying capacity in that region and thereby
reduces undesirable heat loss.
[0075] A connector device can be soldered along with conductor 140
to the wide vertical resistive strips at either ends located at
1050 and 1060. This is a means by which voltage 1040 can be applied
across the horizontal resistive heater strips 1010. Effectively,
the braided wire 1020 or conductor 140 can serve as a strong
structural support for the wire connector where forces on the
electrical connector 1070 or 1080 are distributed along the length
of conductor 140. As a result, the connector and supporting strip
of braid wire are less likely to be damaged by a mechanic pulling
on the wire to disconnect it from the window assembly. A close up
view of the electrical connector 1070 and 1080 can be found in FIG.
9 that alternatively shows a side view of the electrical connector
960 and current carrying wire 950.
[0076] While this invention has been particularly shown and
described with references to preferred embodiments thereof, it will
be understood by those skilled in the art that various changes in
form and details may be made therein without departing from the
spirit and scope of the invention as defined by the appended
claims.
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