U.S. patent application number 10/761168 was filed with the patent office on 2004-08-05 for electronic units and method for packaging and assembly of said electronic units.
This patent application is currently assigned to International Business Machines Corporation. Invention is credited to Staiger, Dieter E..
Application Number | 20040150946 10/761168 |
Document ID | / |
Family ID | 8178828 |
Filed Date | 2004-08-05 |
United States Patent
Application |
20040150946 |
Kind Code |
A1 |
Staiger, Dieter E. |
August 5, 2004 |
Electronic units and method for packaging and assembly of said
electronic units
Abstract
The present invention discloses method for packaging and
assembly of electronic units comprising a multi-planar board system
in which each single planar board provides electrical contacts
and/or signal drive to its successive planar board via a flexible
cable forming the only connection between successive planar boards.
In its packaged position the planar boards are laid upon one
another without affixing them with each other or affixing them with
the housing of the electronic unit, wherein the packaging of the
planar boards preferably forming a daisy chain. Positioning and
adjusting of the planar boards to each other is mainly achieved by
the cover element being wrapped around all surfaces of the planar
boards during the packaging process, positioning and clamping of
the packaging of the planar boards within the housing is mainly
achieved by the self-adapting suspension during the assembly
process of the electronic unit into the housing. The cover element
separating and concurrently adjusting each planar boards to each
other has isolating, stabilizing, heat draining, and flexible
attributes. The electronic unit is preferably arranged in a
screw-less, and scalable housing.
Inventors: |
Staiger, Dieter E.; (Weil im
Schoenbuch, DE) |
Correspondence
Address: |
IBM CORPORATION
PO BOX 12195
DEPT 9CCA, BLDG 002
RESEARCH TRIANGLE PARK
NC
27709
US
|
Assignee: |
International Business Machines
Corporation
Armonk
NY
|
Family ID: |
8178828 |
Appl. No.: |
10/761168 |
Filed: |
January 20, 2004 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
10761168 |
Jan 20, 2004 |
|
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|
10255840 |
Sep 26, 2002 |
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Current U.S.
Class: |
361/679.01 |
Current CPC
Class: |
H05K 1/189 20130101;
Y10T 29/49187 20150115; Y10T 29/4973 20150115 |
Class at
Publication: |
361/683 |
International
Class: |
H05K 005/00 |
Foreign Application Data
Date |
Code |
Application Number |
Oct 2, 2001 |
EP |
01123614.8 |
Claims
1. A method to package electrical units comprising the acts of:
providing a plurality of planar electronic circuit boards;
providing a cover element with defined folding points therein;
connecting the plurality of planar electronic circuit boards with
an electrical conductive member; placing a first planar electronic
circuit board with its bottom side at a first part of said cover
element; folding said cover element at a defined folding point and
placing a remaining part of said cover element upon the surface of
the top side of said first planar board thereby covering the side
surface of the first planar board; placing a second planar board
with its bottom side at said surface of the remaining part of said
cover element; folding said remaining cover element at a further
defined point and placing the newly remaining cover element upon
the surface of the top side of said second planar board thereby
covering the side surface of said second planar board; and
repeating the placing and folding steps until all surfaces of said
planar electronic circuit boards are covered by said cover
element.
2. The method according to claim 1, wherein each of said planar
electronic circuit boards includes a system specific entry
connector at one side and a pass-on connector at the other
side.
3. Packaging according to claim 1, wherein each of said planar
electronic circuit boards includes a system specific entry
connector and a pass-on connector at one side.
4. Packaging according to claim 2, wherein final packaging of said
planar electronic circuit boards form a "daisy chain"
configuration.
5. Packaging according to claim 1, wherein said cover element (20)
is a plastic bag having stabilizing elements and folding points,
wherein said plastic bag is filled with a heat conducting
liquid.
6. Packaging according to claim 1, wherein said cover element (20)
is a plastic bag having stabilizing elements and folding points,
wherein said plastic bag is filled with a liquid providing
electromagnetic shielding attributes.
7. Packaging according to claim 1, wherein said cover element (20)
is filled with a silicon gel.
8. Packaging according to claim 1, wherein said cover element (20)
forms a continuous element.
9. Packaging according to claim 1, wherein the longitudinal axis of
said cover element (20) in its non-folded position and the
longitudinal axis of multi-planar board in its non-packaged
position are 90.degree. rotated against each other when starting
packaging of said planar boards.
10. Packaging according to claim 1, wherein said packaging process
is automatically accomplished by a machine.
11. A method to package electrical units comprising the acts of:
providing a loosely connected multi-planar electronic circuit board
system including a plurality of single planar electronic circuit
boards connected to one another by flexible cables and separated
from one another by a continuous cover element; providing a housing
having a lower shell section and an upper shell section; fitting
said system of said planar boards into said bottom shell (80) of
said housing; positioning and clamping of said system in said
bottom shell(80) by a self-adapting suspension (100) being part of
the bottom shell(80); closing said housing with said top shell
(90); positioning and clamping of said packaging against said top
shell (90) by a self-adapting suspension (100) being part of the
top shell when said top shell is self-interlocking with said bottom
shell (80).
12. Method according to claim 11, wherein said self-interlocking
between top (90) and bottom (80) shell is accomplished by a
zigzag-teeth structure (110) being part of contacting surfaces of
said bottom and top shell.
13. Method according to claim 11, wherein said assembly process is
automatically accomplished by a machine.
14. Electronic unit comprising: a multi-planar board system,
wherein said multi-planar board system is characterized by single
planar boards (1-4) connected with each other by a flexible cable
(12,23,34) providing electrical contacts and signal drive, wherein
the contacting surfaces of said planar boards are separated from
and adjusted to each other by a continuous cover element (20).
15. Electronic unit according to claim 14, wherein said
multi-planar board comprising single planar boards having a system
specific entry connector at one side and a pass-on connector at the
other side.
16. Electronic unit according to claim 14, wherein said
multi-planar board comprising single planar boards having a system
specific entry connector and a pass-on connector at one side.
17. Electronic unit according to claim 14, wherein a final
packaging of said planar boards builds up a "daisy chain"
configuration.
18. Electronic unit according to claim 14, wherein said cover
element (20) includes a plastic bag having stabilizing elements and
folding points, wherein said plastic bag is filled with a heat
conducting liquid.
19. Electronic unit according to claim 14, wherein said cover
element (20) is filled with a silicon gel.
20. Housing (70) for an electronic unit comprising: a bottom shell
(80) having at least one self-adapting suspension (100) for
adjusting and clamping a package in said bottom shell (80) when
said package is fully located in said bottom shell (80); and a top
shell (90) having at least one self-adapting suspension (100) for
adjusting and clamping said package against said top shell (90)
when said top shell (90) is interlocked with said bottom shell
(80).
21. Housing (70) according to claim 20, wherein contacting faces of
said bottom shell (80) and top shell (90) comprises a zigzag-teeth
structure (110) allowing automatic interlocking and adjusting the
size of said housing.
22. An electronic assembly comprising: a housing including a bottom
shell; at least a first self-adapting suspension operatively
mounted to an inner wall of said bottom shell; a top shell having
surfaces that coact with surfaces on the bottom shell to interlock
the top shell to the bottom shell; and at least a second
self-adapting suspension operatively mounted to an inner wall of
said top shell.
23. Packaging according to claim 1 wherein said cover element is
filled with shielding foil.
24. The method of claim 1 wherein the electrical conductive member
includes flexible cables.
25. The electronic unit of claim 14 wherein said cover element is
filled with a material having isolating, stabilizing, heat
draining, foldable and flexible attributes.
26. The electronic assembly of claim 22 wherein the self-adapting
suspension includes springs.
27. The electronic assembly of claim 22 or claim 26 wherein the
coacting surfaces include a structure that adjusts and interlocks
the top shell and bottom shell relative to each other.
28. The electronic assembly of claim 27 wherein the structure
includes zigzag-teeth.
29. The electronic assembly of claim 22 further including a package
of loosely connected planar electronic circuit boards placed in
said housing and coacting with the self-adapting suspensions to
adjust the position of. said package within said housing.
30. A method to package electrical units comprising the acts of:
providing a plurality of planar electronic circuit boards;
providing a cover element; connecting the plurality of planar
electronic circuit boards with an electrical conductive member;
placing a first planar electronic circuit board with its bottom
side at a first part of said cover element; folding said cover
element and placing a remaining part of said cover element upon the
surface of the top side of said first planar board thereby covering
the side surface of the first planar board; placing a second planar
board with its bottom side at said surface of the remaining part of
said cover element; folding said remaining cover element and
placing the newly remaining cover element upon the surface of the
top side of said second planar board thereby covering the side
surface of said second planar board; and repeating the placing and
folding steps until all surfaces of said planar electronic circuit
boards are covered by said cover element.
Description
BACKGROUND OF THE INVENTION
[0001] 1) Field of the Invention
[0002] The present invention relates to a method for packaging and
assembly of electronic units and more particularly to packaging and
assembly of electronic units requiring mechanical robustness and
being used in rugged environmental conditions such as e.g. demanded
by electronic devices used in industrial machinery and automotive
control units.
[0003] 2) Prior Art
[0004] Electronic units as addressed by the present invention are
preferably small scalable electronic devices or embedded electronic
devices, e.g. handheld devices, set-top systems, internet
appliances, mainly used in rugged environmental conditions such as
e.g. demanded by electronic devices used in industrial machinery
tools and automotive electronic units. They normally comprising at
least a processor, a storage media (ROM, RAM), and interfaces, e.g.
interfaces to user and/or components to be controlled. The
electronic unit itself is mostly arranged in a housing. The
electronic components being part of the electronic units may be
arranged in the housing either in a card-on-board system or a card
stack system.
[0005] Typically card-on-board systems utilize a base planar-board
(mother board) featuring extension slots and connectors allowing to
customize/scale the system by adding on various system feature
cards. The minimum base system is providing the overhead on
power-source signal drive capability and electrical connectors
supporting to assemble system configuration. As a result, it is
necessary that the electronic components positioning within the
housing of the electronic units be maintained. In addition, many
card-on-board systems are developed to satisfy the requirements of
a particular electronic assembly. Therefore, as the system size and
configuration changes, an additional package is required which
would also require changes on the mother-board. As a result,
packaging for electronic units is relatively expensive.
[0006] Card stack systems provide a multi-planar-board system. The
basic system functions as well as the potential system expansions
are sub-divided and implemented into individual single planar
boards. The single boards are rigidly stacked in a housing and
separated by spacers. Electrical contacts and the signal drive
between the single planar boards are achieved via specifically
designed connectors. Finally, the multi-planar board system is
separated from the housing of the electronic unit by a shock
absorbing arrangement. The prior art card stack system does provide
scalable electronic units. But by requiring precisely arranging the
single boards in a rigid stacked arrangement in the housing, by
providing the exact interconnections between the boards, and by
providing shock-absorbing components the prior art stack system
requires an expensive and time-consuming manufacturing and assembly
process. As a consequence, overall cost of such prior art systems
tends to be high.
[0007] U.S. Pat. Nos. 3,904,934 and 3,529,213 disclose examples of
those prior art card stack systems.
[0008] In view of the above there is a need for a card stack system
that corrects the problems of the prior art card stack systems.
SUMMARY OF THE INVENTION
[0009] It is, therefore, object of the present invention to provide
a method to package and assemble electronic units having a
multi-planar-board system without the disadvantages of prior art
systems.
[0010] It is another object of the present invention to provide a
scalable housing for those electronic units.
[0011] These objects have been solved by the features of the
independent claims. Further advantageous embodiments of the present
invention are laid down in the dependent claims.
[0012] The present invention discloses method for packaging and
assembly of electronic units comprising a multi-planar board system
in which each single planar board provides electrical contacts
and/or signal drive to its successive planar board via a flexible
cable forming the only connection between successive planar boards.
In its packaged position the planar boards are laid upon one
another without affixing them with each other or affixing them with
the housing of the electronic unit, wherein the packaging of the
planar boards preferably forming a daisy chain. Positioning and
adjusting of the planar boards to each other is mainly achieved by
the cover element being wrapped around all surfaces of the planar
boards during the packaging process, positioning and clamping of
the packaging of the planar boards within the housing is mainly
achieved by the self- adapting suspension during the assembly
process of the electronic unit into the housing. The cover element
separating and concurrently adjusting each planar boards to each
other has isolating, stabilizing, heat draining, electromagnetic
shielding and flexible attributes. The electronic unit is
preferably arranged in a screw-less, and scalable housing...
BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Other objects, features and advantages will occur from the
following description of the preferred embodiments and the
accompanying drawings wherein:
[0014] FIG. 1 shows the inventive flexible interconnections between
the single planar boards of the multi-planar boards system of the
electronic unit according to the present invention.
[0015] FIG. 2 shows a preferred embodiment of the arrangement of
planar boards in a packaged position according to the present
invention.
[0016] FIG. 3 shows a preferred embodiment of the cover element
used by the present invention.
[0017] FIG. 4 shows the preferred method for packaging of
electronic units according to the present invention.
[0018] FIG. 5 shows the final package of the electronic unit.
[0019] FIG. 6 shows the package of FIG. 5 arranged in a preferred
embodiment of a housing.
[0020] FIG. 7 shows the housing of FIG. 6 with its inter-locking
structure.
DESCRIPTION OF THE ILLUSTRATED EMBODIMENT
[0021] FIG. 1 shows a multi-planar board system with four boards
1-4 in a non-packaged position. The basic system functions as well
as the potential system expansions are subdivided into four single
planar boards 1-4. Each single extendible planar board 1 to 3 is at
least providing the electrical contacts and signal drive supporting
to extend the multi-planar system with a successive planar board.
That means the drive capability as well as the signal distribution
connectors are built up consequently when adding on a consecutive
planar board. Each single extendible planar board 1-3 comprises a
system specific entry connector on one side and a pass-on connector
on another side. Another likely configuration is to have entry and
pass-on connectors on one side of each planar board.
Interconnections 12, 23, 34 between the single planar boards 1-4
are flexible cables. Advantageous the flexible cable can be built
by a planar inner plane stub allowing to be connected to the next
extender card at the end. Depending on the specific system to be
implemented the connectivity can be provided utilizing small
connector clamps or flexible cable may be simply soldered at the
planars. The use of flexible cables (12, 23, 34) allows the entire
arrangement of the single boards to be folded in a zigzag
configuration, somewhat analogous to a concertina.
[0022] FIG. 2 shows a preferred embodiment of the arrangement of
planar boards in a packaged position (cover element is not shown).
The single planar boards 1-4 are arranged to each other in a so
called "daisy chain". That means the single planar boards 1-4 are
laid upon another without affixing them with each other or affixing
them with the housing being used by the present invention.
Positioning of the planar boards to each other is mainly achieved
by the cover element being wrapped around all surfaces of the
planar boards during the packaging process, positioning and
clamping of the package of the planar boards within the housing is
mainly achieved by the self-adapting suspension being part of the
housing (not shown) during the assembly process. The only
connections between the planar boards are the flexible cables (12,
23, 34). The use of flexible cables (12, 23, 34) allows the entire
packaging of the planar boards to be folded in a zigzag manor
concertina. In another embodiment of the present invention the
flexible cables may be arranged at the same sides of the planar
boards connecting one planar board with another one. Preferably the
electronic components of the opposite planar boards should be
selected and arranged to each other to minimize to over-all height
of the arrangement.
[0023] FIG. 3 shows a specific embodiment of the inventive cover
element 20 separating the planar boards from each other. In this
embodiment the cover element is a heat pillow 20. The heat pillow
20 may be implemented as flexible plastic bag featuring stabilizing
elements 32 and folding points 27. The plastic bag may be filled
with heat conducting liquid 25. Depending on the electronics system
requirements, if necessary, the plastic bag may in addition
incorporate a electromagnetic shielding foil or may be filled with
liquid featuring shielding attributes. The thickness may be defined
taking the size and shape of the planar boards and utilized
electronic components into account. The heat conducting liquid
could be simply water and if required complemented by antifreeze
add-ons. However, if advanced heat conducting characteristics and
mechanical stabilization qualities are required, the bag may be
filled applying specific liquids featuring lower flowing
attributes. An alternative to heat conducting liquids 25 is a gel
especially a silicon gel. The silicon gel is assembled mixing two
base substances allowing the gel to be adjusted to the desired
attributes. Furthermore, any other material with or without heat
conducting liquids may be used when that type of material fulfills
following requirements:
[0024] 1) the material must support mounting and positioning of the
planar boards to each other
[0025] 2) isolating the electrical parts and planar boards from
each other
[0026] 3) minimizing acceleration forces effecting bigger/higher
mass electrical components
[0027] 4) stabilizing the entire assembly keeping shock and
vibration stress at a minimum
[0028] 5) draining the dissipated heat energy from the electronic
components
[0029] 6) electromagnetic shielding of planar boards
[0030] FIG. 4 shows the preferred method for packaging of
electronic units by using the heat pillow of FIG. 3.
[0031] A first planar board 1 is placed onto a first part 30 of a
cover element 20. In the first step the second part 40 of the cover
element 20 is folded at its folding point 35 and placed at the
surface of first planar board 1. In the second step the second
planar board 2 is placed upon the first planar board 1 separated by
the second part 40 of the cover element 20. In the third step the
third part 50 of cover element 20 is folded at its next folding
point 45 and placed at the second planar board 2. In the fourth
step the third planar board 3 is placed at the second planar board
2 separated by the third part 50 of the cover element 20. In fifth
step the fourth part 60 of the cover element 20 is folded at its
folding point 55 and placed at the surface of the third planar
board 3. In a sixth step the fourth planar board 4 is placed at the
third planar board 3 separated by the fourth part 60 of the cover
element 20. In a preferred embodiment of the present invention the
longitudinal axis of said cover element (20) in its non-folded
position and the longitudinal axis of multi-planar board in its
non-packaged position are 90 rotated against each other when
starting packaging of said planar boards.
[0032] All these steps may be easily accomplished by an automatic
assembly processes since no screws or other fixing elements are
required in order to assemble the planar boards with each other.
Therefore, the manufacturing process as well as the assembly
process can be simplified as much as possible by applying the
present invention.
[0033] FIG. 5 shows the final packaging of the electronic unit. The
cover element 20 is folded around all contacts and surfaces of the
planar boards 1-4 including their electronic components as
described to FIG. 4. An essential advantage of that packaging is
that the planar boards do not need to lined up in a
rectangular/straight orientation--rather given by the size and
height of the electronic components. The planar boards will be
self-aligning to the best positioning angle thus utilizing the
minimum amount of assembly space.
[0034] FIG. 6 shows the housing 70 for the final packaging of FIG.
5. In its basic implementation the housing comprises a bottom shell
80 and a top shell 90. Furthermore, a self-adapting suspension 100
is preferably arranged at the inner side wall of the bottom shell
80 as well as at the inner side of the top shell 90. Other
suspensions or springs achieving the same effect may be used also.
When placing the packaging 1-4 of the electronic unit into the
housing 70 the self-adapting suspensions 100 will automatically
force the packaging in the right clamping position within the
housing 70 and concurrently adjust the planar boards 1-4 with the
right pressure against each other without using screws, spacers or
other fixing elements. If required connectors to allow electrical
signals to enter and exit the package can be fabricated in the
housing.
[0035] FIG. 7 shows a preferred embodiment of the housing 70 as
shown in FIG. 6. The scalable housing 70 comprising a bottom shell
80 and a top shell 90. The outer part of the bottom shell as well
as the inner part of the top shell comprise a zigzag-teeth
structure 110 allowing self-interlocking of top shell 90 with the
bottom shell 80. When the top shell 90 is locked in the self-
adapting suspension has reached a clamping force allowing adjusting
the electronic unit in the housing. The zigzag teeth-structure 110
allowing to adjust the size housing dimension to fit the customized
multi-boards system without replacing the bottom shell 80 or top
shell 90. The zigzag-teeth structure 110 is one preferred
embodiment of the present invention. Other embodiments having the
same technical effects may be used also.
[0036] Summarizing, the present invention includes, among other
things, the following components:
[0037] a scalable housing allowing to adjust the size of the
housing to different sizes of electronic units,
[0038] a mounting, adjusting, and cooling cover element used to
physically align and stabilize the planar boards and concurrently
used to transport the dissipated energy to the system housing
components,
[0039] a suspension arranged in the bottom and top shell of the
housing to position and stabilize the package of the planar boards
in the housing.
[0040] The main advantages of the present inventions are:
[0041] robust system attributes allowing shock resistant and
vibration resistant system implementations,
[0042] high system reliability due to robust packaging method.
Heavier components placed on planar boards do not require specific
mounting reinforcement,
[0043] advantageous thermal behavior and minimized cooling
effort,
[0044] significant cost advantage due to:
[0045] reduced system assembly components ("screw-less" system
mount) basic system cooling provided by packaging method fast
system assembly (manufacturing) time,
[0046] scalable system provided at a minimum base system
scale-infrastructure hardware overhead and a minimum overhead on
physical size and mass--easy system upgradability ("screw-less"
system mount and flexible housing),
[0047] reduced physical measures (size and weight),
[0048] ease of maintenance and repair efforts.
[0049] The invention may be preferably used for handheld devices
(e.g. mobile phones), set-top systems, internet appliances, PCs as
well as to embedded electronic devices requiring mechanical
robustness and being used in rugged environmental conditions such
as e.g. demanded by electronic devices used in industrial machinery
tools and automotive electronic units.
* * * * *