U.S. patent application number 10/752414 was filed with the patent office on 2004-07-22 for hearing-aid assembly using folded flex circuits.
This patent application is currently assigned to HEI, Inc.. Invention is credited to Paczkowski, Theodore T..
Application Number | 20040141627 10/752414 |
Document ID | / |
Family ID | 26879945 |
Filed Date | 2004-07-22 |
United States Patent
Application |
20040141627 |
Kind Code |
A1 |
Paczkowski, Theodore T. |
July 22, 2004 |
Hearing-aid assembly using folded flex circuits
Abstract
Hearing aids improve not only the hearing, but the lives of
millions. Unfortunately, far too many sufferers of hearing loss
forego the benefits of hearing aids because of size and cost of the
devices. To address this need, the present inventor devised
hearing-aid circuit modules that use folded flexible circuits. The
modules save space and reduce the cost of manufacturing hearing
aids.
Inventors: |
Paczkowski, Theodore T.;
(Chaska, MN) |
Correspondence
Address: |
SCHWEGMAN, LUNDBERG, WOESSNER & KLUTH, P.A.
P.O. BOX 2938
MINNEAPOLIS
MN
55402
US
|
Assignee: |
HEI, Inc.
|
Family ID: |
26879945 |
Appl. No.: |
10/752414 |
Filed: |
January 6, 2004 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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10752414 |
Jan 6, 2004 |
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09792700 |
Feb 23, 2001 |
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6674869 |
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60184237 |
Feb 23, 2000 |
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Current U.S.
Class: |
381/324 ;
381/312 |
Current CPC
Class: |
H04R 2225/57 20190501;
H04R 25/609 20190501; H05K 1/189 20130101 |
Class at
Publication: |
381/324 ;
381/312 |
International
Class: |
H04R 025/00 |
Claims
1. A hearing aid comprising: a flexible circuit module including at
least first, second, and third unfolded regions and a first folded
region between the first and second unfolded regions and a second
folded region between the second and third unfolded regions; one or
more input-output connections mounted to one or more of the
unfolded regions; first and second signal processing chips mounted
to the first and second unfolded regions and electrically coupled
to the one or more of the input-output connections; a microphone
coupled to at least one of the input-output connections; and a
receiver coupled to at least another one of the input-output
connections.
2. The hearing aid of claim 1, wherein at least the first and
second unfolded regions and the first folded region are formed from
a continuous flexible circuit and wherein the first folded region
includes a fold of about 90 degrees and the second folded region
includes a fold of about 180 degrees.
3. The hearing aid of claim 1, wherein at least the first and
second unfolded regions and the first folded region are formed from
two or more mechanically discontinuous sections of flexible
circuit.
4. The circuit module of claim 1, wherein the one or more
electrical components include first and second integrated circuits,
with the first integrated circuit mounted on a top surface of the
second region and the second integrated circuit mounted on a top
surface of the third region such that the first and second
integrated circuits are back to back.
6. A hearing-aid assembly comprising: a deformable disk having a
major surface; a container attached or mounted to the deformable
disk; a flexible circuit module at least partially within the
container and including: at least first, second, and third unfolded
regions and a first folded region between the first and second
unfolded regions and a second folded region between the second and
third unfolded regions; one or more input-output connections
mounted to one or more of the unfolded regions; first and second
signal processing chips mounted to the first and second unfolded
regions and electrically coupled to the one or more of the
input-output connections; a microphone coupled to at least one of
the input-output connections; and a receiver coupled to at least
another one of the input-output connections.
7. The hearing-aid assembly of claim 6, wherein the microphone and
the receiver are mounted to the disk.
8. The hearing-aid assembly of claim 6, wherein the disk consist
essentially of plastic.
9. The hearing-aid assembly of claim 6, wherein the container is
integral to the disk.
10. The hearing-aid assembly of claim 6, wherein at least the first
and second unfolded regions and the first folded region are formed
from two or more mechanically discontinuous sections of flexible
circuit.
11. The hearing-aid assembly of claim 6, wherein the one or more
electrical components include first and second integrated circuits,
with the first integrated circuit mounted on a top surface of the
second region and the second integrated circuit mounted on a top
surface of the third region such that the first and second
integrated circuits are back to back.
Description
RELATED APPLICATION
[0001] This application is a continuation of U.S. patent
application Ser. No. 09/792,700, filed Feb. 23, 2001 which is a
continuation of U.S. Provisional application No. 60/184,237 which
was filed Feb. 23, 2000 and which is incorporated herein by
reference.
TECHNICAL FIELD
[0002] The present invention concerns hearing aids, particularly
hearing-aid assemblies and components.
BACKGROUND
[0003] For many, it is surprising to learn that one out of every
ten Americans suffers from some form of hearing loss, ranking it
the third most common disability in the United States, behind
arthritis and high-blood pressure. Perhaps even more surprising is
that half of those suffering hearing loss are under age 65.
[0004] Many hearing-loss sufferers enjoy considerable relief
through use of electronic hearing aids. A multitude of advancements
ranging from basic miniaturization and microphone and amplifier
improvements to digital sound filtering and custom programmability
have made it possible for hearing aids to improve the hearing of
over 90% of hearing-loss sufferers. Unfortunately, even with these
advances, many miss out on the benefits of these miraculous devices
because of concerns regarding visibility or cost of the device.
[0005] A key factor in both the visibility and cost of hearing aids
is still their size. Smaller hearing aids are generally less
visible than larger devices, but more difficult and costly to
manufacture. Moreover, even where cost is of less concern,
manufacturers often have to increase hearing-aid size to provide
all the circuitry needed to address some severe forms of hearing
loss, ultimately forcing some sufferers to choose between better
hearing or less visible hearing aids.
[0006] Accordingly, there continues to be a need for smaller
hearing aids, particularly hearing-aid circuit assemblies that
allow for more cost- and space-effective manufacture.
SUMMARY OF THE INVENTION
[0007] To address this and other needs, the present inventor
devised a unique hearing-aid assembly concept that saves space and
facilitates manufacture of hearing aids. One exemplary hearing-aid
embodiment includes at least a portion of a hearing-aid housing or
earshell containing a unique flex circuit coupled to a microphone
and a receiver. The flexible circuit includes at least first,
second, and third unfolded regions and a first folded region
between the first and second unfolded regions and a second folded
region between the second and third unfolded regions. One or more
of the unfolded regions include input-output connections to
electrical conductors within and/or on the flex circuit, and to a
signal processor and supporting resistive and/or reactive
components, such as capacitors.
[0008] Other aspects of the invention include methods of
manufacturing hearing aids and intermediate hearing-aid assemblies.
One exemplary intermediate assembly includes a formable plastic
disk comprising an integral plastic container containing the
exemplary flex circuit (described above.) Mounted to the surface of
the disk are a microphone and a receiver which are electrically
coupled to the flex circuit. The plastic disk portion of the
assembly can be heated and shaped using conventional methods to
form housing, or earshell, portion of a hearing aid.
BRIEF DESCRIPTION OF DRAWINGS
[0009] FIG. 1 is a top perspective view of an exemplary flex
circuit module 100 incorporating teachings of the present
invention;
[0010] FIG. 2 is a bottom perspective view of flex circuit module
100 in FIG. 1;
[0011] FIG. 3 is a perspective view of flex circuit module 100 in a
partially disassembled state;
[0012] FIG. 4 is a diagrammatic view of an exemplary hearing-aid
assembly 400 incorporating flex circuit module 100; and
[0013] FIG. 5 is a simplified cross-sectional view of an exemplary
hearing aid 500 incorporating flex circuit module 100.
DESCRIPTION OF EXEMPLARY EMBODIMENTS OF THE INVENTION
[0014] The following detailed description, which incorporates FIGS.
1-5, describes and illustrates one or more exemplary embodiments of
the invention. These embodiments, offered not to limit but only to
exemplify and teach the invention, are shown and described in
sufficient detail to enable those skilled in the art to practice
the invention. Thus, where appropriate to avoid obscuring the
invention, the description may omit certain information known to
those of skill in the art.
[0015] U.S. Pat. No. 6,014,320, entitled High Density Stacked
Circuit Module, is incorporated herein by reference.
[0016] FIGS. 1 and 2 show respective top and bottom perspective
views of an exemplary circuit module 100, and FIG. 3 shows a
partially disassembled perspective view of module 100. Module 100
includes a flex circuit 110, components 120, input-output pads 130,
and component groups 140 and 150.
[0017] More particularly, flex circuit 110 includes folded (or more
generally foldable or flexible) regions 111, 112, and 113, and
three non-folded or generally straight regions 114, 115, and 116.
(In some embodiments, the entire length of flex circuit 110 is
flexible, meaning that regions 114, 115, and 116 are also
flexible.) Flex circuit 110 has respective top and bottom sides
110a and 110b, and each region of circuit 100 also has a top and
bottom side. Thus, for example, folded region 111 includes a top
side 111a and a bottom side 111b.
[0018] In some embodiments, one or more portions of the flex
circuit includes a flexible base material and a conductive coating
or cladding. Exemplary materials for the flexible base material
include thermoplastic, thermoset, polyimide (PI), polyester (PIT),
polyethylene naphthalate (PEN), flourinated ethylene-proplene
coplymet (FEP), polyetherimide (PEI), aramiad, and epoxy. Exemplary
material forms used in some embodiments of the invention. include
copper-clad flexible laminates, coverlayers, photoimageable
coverlayers, covercoats, and bondplies. Exemplary conductive
coating or cladding materials includes copper foil,
electrodeposited copper (standard and heat treated), rolled and
anneal copper, specialty copper alloys, electroplated copper,
sputtered or vapor deposited copper, beryllium copper, aluminum
foil, iron alloy, or polymer thick film (PTF). Some embodiments use
built-in resistor-material flexible circuits, platable toner
flexible circuits, and/or indium-tin oxide (ITO) flexible circuits.
The invention, however, is not limited to any type or composition
of flexible circuit.
[0019] In the exemplary embodiment, folded regions 111, 112, and
113 have respective fold axes or lines 111c, 112c, and 113c which
are generally parallel to each other and perpendicular to the
length dimension of the flex circuit. However, in other
embodiments, two or more of the fold lines are substantially
perpendicular to each other. In some embodiments, two or more of
the fold lines are more generally not parallel. In still other
embodiments, one or more of the fold lines are parallel to or
skewed relative the length dimension of the flex circuit.
[0020] Some embodiments with two or more non-parallel folds have
I-, L-, T-, or V-shaped pre-folded configuration. For example, with
the L-shaped configuration, an upper portion of the top leg of the
L is folded over a lower portion of the top leg, and the bottom leg
of the L is folded over or under or up or down relative the folded
portions of the top leg of the L. Depending on the length of the L
and desired uses of the resulting module, multiple fold-overs,
fold-unders, and/or 90-degree folds are used. The legs of the L can
be physically discontinuous flex circuits.
[0021] Components 120 include one or more resistors, capacitors,
inductors, transistors, jumpers, switches, circuit boards, or
integrated circuits. Components 120 are electrically coupled in
conventional ways to one or more conductors in flex circuit 110,
specifically regions 114 and 115. Although the exemplary embodiment
places components 120 on the bottom of flex circuit 110, other
embodiments place all or a portion of the components on the top of
the flex circuit. Still other embodiments distribute the components
along a greater length of the flex circuit than does the exemplary
embodiment. For example, some embodiments even place components on
folded regions 111, 112, or 113.
[0022] Input-output pads 130 are mounted on the bottom side of
region 115. In the exemplary embodiment, pads 130 form a C-shaped
arrangement around the components mounted to region 115. However,
the invention is not limited to any particular arrangement of pads.
For example, other embodiments fully encircle the components with
pads, mount pads along the full length of the flex circuit,
including on one or more of regions 111, 112, or 113, and/or mount
pads on one or both sides of any region of the flex circuit. The
exemplary embodiment uses solder pads or solder balls, or
ball-grid-array technology. However, the invention is amenable to
virtually any form of input-output connection.
[0023] Components 140 and 150 are mounted using conventional
techniques to respective regions 115 and 116. Components 140 and
150, which include one or more resistors, capacitors, inductors,
transistors, jumpers, switches, circuit boards, or integrated
circuits, are electrically coupled in conventional ways to one or
more conductors in regions 115 and 116. The exemplary embodiments
mounts components 140 and 150 such that the top sides of the
components 140 confront the top sides of components 150 as shown in
FIGS. 2 and 3.
[0024] In the exemplary embodiment, all of components 140 and all
of components 150 are integrated into respective integrated
circuits packages, for example, flip-chip packages, or circuit
boards or other circuit-bearing substrates designed to form
specific functions. In one embodiment, the flip-chip includes
hearing-aid circuitry, such as a digital and/or analog signal
processor. which facilitate a hearing aid function. In some
embodiments, one of components 140 and 150 is a heat sink, and in
others a heat sink or more generally some form of heat-distribution
member or agent sandwiched between components 150 and 160 upon
final assembly.
[0025] FIG. 4 shows an exemplary hearing-aid assembly 400
incorporating circuit module 100. Assembly 400 additionally
includes a deformable disk 410, a deformable container 420, a
microphone 430, and wires 440 and 452. Deformable disk 410, which
for example comprises plastic or foam, constitutes the material for
forming a housing or earshell of a hearing aid. Container 420,
which is integral to disk 410 in the exemplary embodiment, has a
similar composition to disk 410 and provides a protective enclosure
for flex circuit module 100, which is coupled respectively via
wires 422 and 424 to microphone 430 and receiver 440. Though not
visible in this view, container 420 includes an opening on its
bottom side for receiving a battery which is coupled to battery
terminals that are in turn coupled to flex module 100. Microphone
430 and receiver 440 are fastened to disk 410 using glue, tape, or
other readily available means, to hold them in place during
shipment and/or during subsequent deformation that transforms the
disk into an earshell or hearing-aid housing.
[0026] FIG. 5 shows an exemplary hearing aid 500 incorporating flex
circuit module 100. In addition, hearing aid 500 includes an
earshell or housing 510, a battery 520, a microphone 530, and a
receiver 530. The battery, microphone, and receiver are coupled to
flex circuit module 100 (although for convenience the internal
wiring is not shown.) Notably, module 100 includes two integrated
circuit chips directly mounted to a flexible circuit.
Conclusion
[0027] In furtherance of the art, the inventor has presented a
unique hearing-aid assemblies comprising folded flex circuits. One
exemplary assembly includes a flex circuit having at least two
folds. The folds not only facilitate ease of manufacture, but also
save space.
[0028] The embodiments described above are intended only to
illustrate and teach one or more ways of making and using the
present invention, not to restrict its breadth or scope. The actual
scope of the invention, which embraces all ways of practicing or
implementing the teachings of the invention, is defined only by the
following claims and their equivalents.
* * * * *