Methods of manufacturing semiconductor devices

Abstract

Methods of manufacturing semiconductors are disclosed. One example method includes forming a trench through a dual damascene process, depositing a barrier metal layer on the overall surface, and depositing copper in the trench to form a copper line. The example method may also include performing a wet etching process to remove the top portion of the copper line, depositing a barrier layer on the etched copper line, and performing a planarization process to flatten the barrier layer.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to semiconductor devices and, more particularly, to a methods of manufacturing semiconductor devices.

BACKGROUND

[0002] Generally, in a copper damascene process, a trench is formed in a substrate and a barrier metal layer is deposited on the overall surface of the substrate and the trench. Then, a copper layer is deposited over the barrier metal layer so that the trench is completely filled. A chemical mechanical polishing process is performed to flatten the copper layer. As a result, a copper interconnect is formed. Next, a barrier layer is formed over the copper interconnect.

[0003] However, most barrier layers used as an etch-stop layer in a damascene process have high capacitance, thereby increasing the delay time of electrons. Such increase in the delay time of electrons makes it difficult to enhance processing speed of the device.

BRIEF DESCRIPTION OF THE DRAWINGS

[0004] FIGS. 1a through 1f illustrate, in cross-sectional views, the results of process steps for fabricating a semiconductor device.

DETAILED DESCRIPTION

[0005] Disclosed herein is an example semiconductor device manufacturing process that reduces capacitance of an interlayer dielectric (ILD), thereby reducing delay time of electron by forming a barrier layer only on a copper line, and, therefore, can enhance processing speed of a device produced by a copper damascene process.

[0006] Referring to FIG. 1a, a trench 10 of a dual damascene structure is formed in an interlayer dielectric (ILD) through a predetermined patterning process so that a portion of a lower metal interconnect is exposed. Then, a barrier metal layer 12 to prevent diffusion of copper is deposited on the surface of the ILD including the trench 10.

[0007] Referring to FIG. 1b, a copper layer 14 is deposited so that the trench 10 is completely filled with copper. The copper is deposited by means of at least one of electroplating and chemical vapor deposition (CVD). Referring to FIG. 1c, a planarization process is performed to flatten the copper layer. The planarization process may be, for example, a chemical mechanical polishing (CMP) process or an etch back process. As a result, a copper line 11 is formed.

[0008] Referring to FIG. 1d, an etching process such as wet etching is performed to remove some part of the copper line 11 in the trench 10. In one example, the etching may be wet etching performed using an etching solution such as hydrochloric acid, dilute sulfuric acid, or aqueous ammonia, which have relatively low etching speeds.

[0009] Referring to FIG. 1e, a barrier layer 16 is deposited on the etched copper line 11. The barrier layer may be formed of SiN or SiC. Referring to FIG. 1f, a planarization process is performed to flatten the barrier layer. The planarization process may employ CMP or an etch back process.

[0010] The foregoing describes how a barrier layer is formed only on the copper line using SiN or SiC to reduce capacitance of the ILD, thereby reducing delay time of electrons, which is proportional to resistance-capacitance (RC). Therefore, the disclosed techniques can increase processing speed of device.

[0011] Although certain example methods are disclosed herein, the scope of coverage of this patent is not limited thereto. On the contrary, this patent covers every apparatus, method and article of manufacture fairly falling within the scope of the appended claims either literally or under the doctrine of equivalents.

Claims

What is claimed is:

1. A method for manufacturing a semiconductor device comprising: forming a trench through a dual damascene process; depositing a barrier metal layer on an overall surface, the barrier metal layer preventing diffusion of copper; depositing copper in the trench to form a copper line; performing a wet etching process to remove a top portion of the copper line; depositing a barrier layer on the etched copper line; and performing a planarization process such as chemical mechanical polishing (CMP) or an etch back process to flatten the barrier layer.

2. A method as defined by claim 1, wherein the barrier layer is formed of SiN or SiC.

3. A method as defined by claim 1, wherein the copper is deposited by at least one of electroplating and chemical vapor deposition (CVD).

4. A method as defined by claim 1, wherein the wet etching is performed using hydrochloric acid, dilute sulfuric acid, or aqueous ammonia.