U.S. patent application number 10/249061 was filed with the patent office on 2004-07-01 for optical interference type panel and the manufacturing method thereof.
Invention is credited to LIN, WEN-JIAN.
Application Number | 20040125455 10/249061 |
Document ID | / |
Family ID | 32322983 |
Filed Date | 2004-07-01 |
United States Patent
Application |
20040125455 |
Kind Code |
A1 |
LIN, WEN-JIAN |
July 1, 2004 |
OPTICAL INTERFERENCE TYPE PANEL AND THE MANUFACTURING METHOD
THEREOF
Abstract
A manufacturing method for optical interference type panel is
provided. A patterned supporting layer is formed on a transparent
substrate, and then a first electrode layer and an optical film are
formed sequentially on the supporting layer and the transparent
substrate. A sacrificial material layer is formed on the optical
layer, and then, a backside exposure process is performed by using
the supporting layer as a mask to pattern the sacrificial material
layer. A portion of the patterned sacrificial material layer is
removed to expose the optical film above the supporting layer to
form a sacrificial layer, and then a second electrode layer is
formed on the sacrificial layer between the adjacent supporting
layers and portion of the optical film. Afterwards, the sacrificial
layer is removed.
Inventors: |
LIN, WEN-JIAN; (HSINCHU,
TW) |
Correspondence
Address: |
JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE
7 FLOOR-1, NO. 100
ROOSEVELT ROAD, SECTION 2
TAIPEI
100
TW
|
Family ID: |
32322983 |
Appl. No.: |
10/249061 |
Filed: |
March 13, 2003 |
Current U.S.
Class: |
359/585 ;
359/577 |
Current CPC
Class: |
G02B 26/001
20130101 |
Class at
Publication: |
359/585 ;
359/577 |
International
Class: |
G02B 001/10; G02B
027/00 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 27, 2002 |
TW |
91137637 |
Claims
1. A manufacturing method for optical interference type panel,
comprising: forming a patterned supporting layer on a transparent
substrate; forming a first electrode layer on the transparent
substrate and the supporting layer; forming an optical film on the
first electrode layer; forming a sacrificial layer on the optical
film between the adjacent supporting layers; forming a second
electrode layer on the sacrificial layer between the adjacent
supporting layers and the portion of the optical layer; and
removing the sacrificial layer.
2. The manufacturing method for optical interference type panel of
claim 1, wherein the supporting layer is made of an opaque
material.
3. The manufacturing method for optical interference type panel of
claim 2, wherein the supporting layer is made of either an
insulation material or a group composed of the high-molecular
resin.
4. The manufacturing method for optical interference type panel of
claim 1, wherein the sacrificial layer is made of a photo resistant
material.
5. The manufacturing method for optical interference type panel of
claim 1, wherein a spin on coating method is used to form the
sacrificial layer.
6. The manufacturing method for optical interference type panel of
claim 1, wherein the sacrificial layer is below the optical film
above the supporting layer.
7. The manufacturing method for optical interference type panel of
claim 6, wherein after a sacrificial layer is formed on the optical
film between the adjacent supporting layers, a slightly O.sub.2
plasma etch for surface treatment is further performed onto the
sacrificial layer and the optical film, so as to remove the
sacrificial layer on the optical layer above the supporting
layer.
8. The manufacturing method for optical interference type panel of
claim 1, wherein the first electrode layer is made of a transparent
material.
9. The manufacturing method for optical interference type panel of
claim 1, wherein the optical film is formed by interleaving a
plurality of high-dielectric-constant material layers and
low-dielectric-constant material layers.
10. The manufacturing method for optical interference type panel of
claim 1, wherein the method for forming the sacrificial layer
comprises: forming a sacrificial material layer on the optical
film; and removing a portion of the sacrificial material layer to
expose the optical film above the supporting layer so as to form
the sacrificial layer, wherein the sacrificial layer is below the
optical layer above the supporting layer.
11. The manufacturing method for optical interference type panel of
claim 10, wherein an etching method is used to remove the
sacrificial material layer to expose the optical film above the
supporting layer so as to form the sacrificial layer.
12. The manufacturing method for optical interference type panel of
claim 11, wherein after a sacrificial material layer is formed on
the optical film, and before the portion of the sacrificial
material layer is removed to expose the optical film above the
supporting layer so as to form the sacrificial layer, further
comprises a backside exposure process to pattern the sacrificial
material layer.
13. The manufacturing method for optical interference type panel of
claim 1, wherein the second electrode layer is made of a metal
material.
14. The manufacturing method for optical interference type panel of
claim 1, wherein the method for removing the sacrificial layer
comprises a release process.
15. An optical interference type panel, comprising: a transparent
substrate; a supporting layer, located on the transparent
substrate; a first electrode, located on the transparent substrate
and the supporting layers; an optical film, located on the first
electrode; and a second electrode, wherein an edge of the second
electrode is located on the portion of the optical film above the
adjacent supporting layer.
16. The optical interference type panel of claim 15, wherein the
supporting layer is made of an opaque material.
17. The optical interference type panel of claim 15, wherein the
supporting layer is made of either an insulation material or a
group composed of a high-molecular resin.
18. The optical interference type panel of claim 15, wherein the
first electrode layer is made of a transparent material.
19. The optical interference type panel of claim 15, wherein the
optical film is formed by interleaving a plurality of
high-dielectric-constant material layers and
low-dielectric-constant material layers.
20. The optical interference type panel of claim 15, wherein the
second electrode layer is made of a metal material.
Description
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application claims the priority benefit of Taiwan
application serial no. 91137637, filed on Dec. 27, 2002.
BACKGROUND OF INVENTION
[0002] 1. Field of Invention
[0003] The present invention generally relates to a panel display
and a manufacturing method thereof, and more particularly, to an
optical interference type panel and a manufacturing method
thereof.
[0004] 2. Description of Related Art
[0005] Thin and light-weight panel displays, such as a liquid
crystal display (LCD), organic emitting diode (OLED) and plasma
display panels (PDP) have been widely used in daily life now.
Wherein, LCD is gradually becoming the mainstream of the display.
However, LCD still has disadvantages, such as the view angle not
being wide enough, the response time not being fast enough, the
full-color being implemented by using the color filters, and the
polarizer being mandatory which causes the problem of poor
efficiency of utlization of the light source and the problem of the
backlight module's consumption of more power.
[0006] An optical interference type panel has been currently
developed, consisting primarily in a plurality of optical
interference modulators arranged in array. The optical interference
modulator primarily consists of a transparent electrode, a
reflective electrode, and a supporting layer that supports the
reflective electrode. With the support from the supporting layer, a
specific air gap exists between the reflective electrode and the
transparent electrode. After a light emits into the optical
interference modulator via the transparent electrode, the light
passes through the air gap and emits onto the second electrode.
Then, the light is reflected from the second electrode via the
transparent electrode. Since the light experiences different levels
of interference in different air gaps, it shows light with
different colors, e.g. a red light, a green light, and a blue
light. Moreover, the reflective electrode in the optical
interference modulator has to bind with the micro electro
mechanical system (MEMS) for performing its design, so that the
optical interference modulator can be switched between the on/off
state and the objective of displaying can be achieved.
[0007] The optical interference type panel constituted by the
optical interference modulators mentioned above is able to display
appropriate color images without having to configure the color
filters and the polarizer, so that the cost of the color filters
can be saved. Moreover, the optical interference type panel
constituted by the optical interference modulators mentioned above
is also characterized by its low power consumption, fast response
time, and being bi-stable. Therefore, it is advantageous for
development of low power consumption products, such as the mobile
phone, personal digital assistant (PDA), and e-book.
[0008] FIGS. 1A to 1F schematically shows a sectional view of a
manufacturing process for a conventional optical interference type
panel. First, referring to FIG. 1A, a patterned first electrode
layer 102, an optical film 103, and a sacrificial layer 104 are
formed on a transparent layer 100. Wherein, the sacrificial layer
104 is made of a material of opaque molybdenum (Mo) or an alloy of
molybdenum (Mo). Then, referring to FIG. 1B, a supporting material
layer 106 and a negative type photoresist layer 108 are
sequentially formed on the sacrificial layer 104. Then, referring
to FIG. 1C, a backside expose process 110 and a develop process are
performed by using the opaque sacrificial layer 104 as a mask to
pattern the photoresist layer 108a. Then, referring to FIG. 1D,
portion of the supporting layer 106 that are not covered by the
photoresist layer 108a is removed by using the photoresist layer
108a as an etch mask, so as to form a supporting layer 106a. Then,
referring to FIG. 1E, the photoresist layer 108a is removed, and a
second electrode 112 is formed on the supporting layer 106a and the
sacrificial layer 104 between the adjacent supporting layers 106a.
Then, referring to FIG. 1F, a release process is performed, in
which the XeF 2 gas is used as an etch, so that the sacrificial
layer 104 is converted into a gas and is removed, so as to form a
optical interference type panel constituted by a plurality of
optical interference modulators that are arranged in array.
[0009] However, in the manufacturing method for the optical
interference type panel mentioned above, the sacrificial layer 104
must be made of an opaque material, and must be removed by the
release process. Therefore, the qualified material is limited,
requiring the choice of molybdenum (Mo) or the alloy of molybdenum
(Mo). However, using a lot of molybdenum (Mo) or an alloy of
molybdenum (Mo) to form the sacrificial layer as mentioned above
significantly increases the manufacturing costs.
SUMMARY OF INVENTION
[0010] To solve the problem mentioned above, the objective of the
present invention is to provide an optical interference type panel
and a manufacturing method thereof, so as to reduce the
manufacturing costs of the optical interference type panel.
[0011] A further objective of the present invention is to provide
an optical interference type panel and a manufacturing method
thereof, so as to simplify the manufacturing process of the optical
interference type panel.
[0012] A manufacturing method for optical interference type panel
is provided by the present invention. A patterned supporting layer
is formed on a transparent substrate, a first electrode layer is
subsequently formed on the supporting layer and the transparent
substrate, and then an optical film is formed on the first
electrode layer. Then, a sacrificial layer is formed on the optical
layer between the adjacent supporting layers. Wherein, the
sacrificial layer formed is below the optical film above the
supporting layer. Then, a second electrode layer is formed on the
sacrificial layer between the adjacent supporting layers and
portion of the optical film. Afterwards, the sacrificial layer is
removed.
[0013] Moreover, according to the present invention, a sacrificial
material layer may be formed on the optical film, and a portion of
the sacrificial material layer is removed to expose the optical
film above the supporting layer to form a sacrificial layer.
Wherein, the sacrificial layer is below the optical film above the
supporting layer.
[0014] Furthermore, according to the present invention, after the
sacrificial material layer is formed, a backside exposure process
may be processed by using the supporting layer as a mask so as to
expose the optical film above the supporting layer.
[0015] The optical interference type panel provided by the present
invention primarily comprises a transparent substrate, a patterned
supporting layer, a first electrode, an optical film, and a second
electrode. Wherein, the supporting layer is located on the
transparent substrate. The first electrode is located on the
transparent substrate and the supporting layer. The optical film is
located on the first electrode, and the edge of the second
electrode is located on portion of the optical film above the
adjacent supporting layer.
[0016] From the preferred embodiment of the present invention
mentioned above, the optical interference type panel of the present
invention first forms the opaque supporting layer, and then
sequentially forms the first electrode layer, the optical film, and
the transparent sacrificial layer that is made of the photo
resistant material. Moreover, the sacrificial layer may be made of
material that is low cost and is suitable for the release process.
Therefore, using molybdenum (Mo) or the alloy of molybdenum (Mo) to
form the sacrificial layer is not mandatory, so that the
manufacturing costs for the optical interference type panel are
reduced.
[0017] Moreover, the optical interference type panel of the present
invention directly uses the photoresist material to form the
sacrificial layer. Therefore, the present invention is able to
avoid the step of coating a photoresist layer on the supporting
layer that is required in the prior art, so that the manufacturing
process of the optical interference type panel is simplified.
[0018] Furthermore, according to the present invention, after the
sacrificial material layer is formed on the optical film, the
backside exposure process can be avoided, and the etch method can
be directly applied to form the sacrificial form. Therefore, the
manufacturing process of the optical interference type panel is
further simplified.
[0019] In addition, according to the present invention, the
sacrificial layer that is below the optical film above the
supporting layer can be directly formed on the optical film between
the adjacent supporting layers. Therefore, the manufacturing
process of the optical interference type panel is further
simplified.
BRIEF DESCRIPTION OF DRAWINGS
[0020] The accompanying drawings are included to provide a further
understanding of the invention, and are incorporated in and
constitute a part of this specification. The drawings illustrate
embodiments of the invention, and together with the description,
serve to explain the principles of the invention. In the
drawings,
[0021] FIGS. 1A to 1F schematically shows a sectional view of a
manufacturing process for a conventional optical interference type
panel;
[0022] FIGS. 2A to 2F schematically shows a sectional view of a
manufacturing process for an optical interference type panel of a
preferred embodiment according to the present invention;
[0023] FIGS. 3A to 3F schematically shows a sectional view of a
manufacturing process for an optical interference type panel of
another preferred embodiment according to the present
invention;
[0024] FIGS. 4A to 4E schematically shows a sectional view of a
manufacturing process for an optical interference type panel of
another preferred embodiment according to the present invention;
and
[0025] FIG. 5 schematically shows a structure sectional view of an
optical interference type panel of a preferred embodiment according
to the present invention.
DETAILED DESCRIPTION
[0026] FIGS. 2A to 2F schematically shows a sectional view of a
manufacturing process for an optical interference type panel of a
preferred embodiment according to the present invention.
[0027] First, referring to FIG. 2A, a patterned supporting layer
202 is formed on a transparent substrate 200. Wherein, the
transparent substrate 200 is made of glass or a transparent
material. The supporting layer 202 is made of an opaque material
such as an insulation material or a high-molecular resin. Moreover,
a micro-etch method is used to form the patterned supporting layer
202.
[0028] Then, referring to FIG. 2B, a first electrode layer 204 and
an optical film 205 are sequentially formed on the transparent
substrate 200 and the supporting layer 202. Wherein, the first
electrode layer 204 is made of a transparent conductive material
such as indium-tin oxide. Moreover, the optical film 205 is a
multi-layering of the interleaving layer composed of the
high-dielectric-constant material layers and
low-dielectric-constant material layers.
[0029] Then, referring to FIG. 2C, a sacrificial material layer 206
is formed on the optical film 205. Wherein, the sacrificial
material layer 206 is made of a transparent material such as the
negative type photoresist, and a spin on coating method is used to
form the sacrificial material layer 206.
[0030] Then, referring to FIG. 2D, a backside exposure process 208
is performed by using the supporting layer 202 as a mask, so that a
photochemistry effect occurs on the portion of the sacrificial
material layer 206 that is not masked by the supporting layer 202.
Afterwards, a developing and solidifying process is further
performed to form the sacrificial material layer 206a that has an
opening in it, and the opening of the sacrificial material layer
206a exposes the optical film 205 above the supporting layer
202.
[0031] Then, referring to FIG. 2E, part of the sacrificial material
layer 206a is removed so as to form a sacrificial layer 206b.
Wherein, an etching method is used to remove the sacrificial
material layer 206a. Preferably, a nonisotropic etching method is
used and the formed sacrificial layer 206b is below the optical
film 205 above the supporting layer 202, so that the sacrificial
layer 206b is formed on the optical film 205 between the adjacent
supporting layers 202. A second electrode layer 210 is subsequently
formed on the sacrificial layer 206b between the adjacent
supporting layers 202 and the portion of the optical film 205 above
the supporting layer 202. Preferably, the second electrode layer
210 is made of a material that is opaque and has good extendibility
and mechanical characteristic, such as metal. To be noted, since
the second electrode layer 210 is formed on the optical film 205,
and the optical film 205 is an insulator. Therefore, the second
electrode 210 is not electrically connected to the first electrode
layer 204 so as to maintain the normal operation of the
elements.
[0032] Then, referring to FIG. 2F, the optical interference type
panel is constituted by the optical interference modulators formed
by removing all sacrificial layers 206b. For example, the release
process is used to remove the sacrificial layer 206b.
[0033] In addition to the manufacturing methods mentioned above,
another manufacturing method also can be used by the present
invention. FIGS. 3A to 3F schematically shows a sectional view of a
manufacturing process for an optical interference type panel of
another preferred embodiment according to the present
invention.
[0034] First, referring to FIG. 3A, a patterned supporting layer
302 is formed on a transparent substrate 300. Wherein, the
transparent substrate 300 is made of glass or transparent resin.
The supporting layer 302 is made of an opaque material such as an
insulation material or a high-molecular resin. Moreover, a
micro-etch method is used to form the patterned supporting layer
302.
[0035] Then, referring to FIG. 3B, a first electrode layer 304 and
an optical film 305 are sequentially formed on the transparent
substrate 300 and the supporting layer 302. Wherein, the first
electrode layer 304 is made of a transparent conductive material
such as indium-tin oxide. Moreover, the optical film 305 is such as
the multi-layers of the interleaving layer composed of the
high-dielectric-constant material layers and
low-dielectric-constant material layers.
[0036] Then, referring to FIG. 3C, a sacrificial material layer 306
is formed on the optical film 305, and the sacrificial material
layer 306 is solidified via a solidifying process. Wherein, the
sacrificial material layer 306 is made of a transparent material
such as photoresistor, and a spin on coating method is used to form
the sacrificial material layer 306.
[0037] Then, referring to FIG. 3D, part of the sacrificial material
layer 306 is removed so as to form a sacrificial layer 306a. The
sacrificial layer 306a exposes the optical film 305 above the
supporting layer 302. Moreover, the sacrificial layer 306a is below
the optical film 305 above the supporting layer 302, so that the
sacrificial layer 306a is formed on the optical film 305 between
the adjacent supporting layers 302. Wherein, an etch back method is
used to remove part of the sacrificial material layer 306a. A
second electrode layer 308 is subsequently formed on the
sacrificial layer 306a between the adjacent supporting layers 302
and the portion of the optical film 305 above the supporting layer
302. Preferably, the second electrode layer 308 is made of a
material that is opaque and has good extendibility and mechanical
characteristic, such as metal. Similarly, the second electrode
layer 308 is formed on the optical film 305 of the first electrode
layer 304. Therefore, the second electrode 308 is not electrically
connected to the first electrode layer 304 so as to maintain the
normal operation of the elements.
[0038] Then, referring to FIG. 3F, the optical interference type
panel is constituted by the optical interference modulators formed
by removing all sacrificial layers 306a. For example, the release
process is used to remove the sacrificial layer 306a.
[0039] Besides the manufacturing methods mentioned above, another
manufacturing method also can be used by the present invention.
FIGS. 4A to 4E schematically shows a sectional view of a
manufacturing process for an optical interference type panel of
another preferred embodiment according to the present
invention.
[0040] First, referring to FIG. 4A, a patterned supporting layer
402 is formed on a transparent substrate 400. Wherein, the
transparent substrate 400 is made of glass or transparent resin.
The supporting layer 402 is made of an opaque material such as an
insulation material or a high-molecular resin. Moreover, a
micro-etch method is used to form the patterned supporting layer
402.
[0041] Then, referring to FIG. 4B, a first electrode layer 404 and
an optical film 405 are sequentially formed on the transparent
substrate 400 and the supporting layer 402. Wherein, the first
electrode layer 404 is made of a transparent conductive material
such as indium-tin oxide. Moreover, the optical film 405 is such as
the multi-layers of the interleaving layer composed of the
high-dielectric-constant material layers and
low-dielectric-constant material layers.
[0042] Then, referring to FIG. 4C, a sacrificial layer 406 is
formed on the optical film 405, and the sacrificial layer 406 is
solidified via a solidifying process. Wherein, the sacrificial
layer 406 exposes the optical film 405 above the supporting layer
402. Moreover, the sacrificial layer 406a is below the optical film
405 above the supporting layer 402, so that the sacrificial layer
406 is formed on the optical film 405 between the adjacent
supporting layers 402. Moreover, the sacrificial material layer 406
is made of a transparent material such as photoresist. A spin on
coating method and a flat technique are used to form the
sacrificial material layer 406, and the thickness of the
sacrificial material layer 406 is formed on the optical form 405
above the supporting layer 402. Then, a slightly O.sub.2 plasma
etch for surface treatment is performed so as to remove the tiny
sacrificial material layer that is residual on the optical film 405
above the supporting layer 402, and to obtain the structure as
shown in FIG. 4C.
[0043] Then, referring to FIG. 4D, a second electrode layer 408 is
subsequently formed on the sacrificial layer 406 between the
adjacent supporting layers 402 and the portion of the optical film
405 above the supporting layer 402. Preferably, the second
electrode layer 408 is made of a material that is opaque and has
good extendibility and mechanical characteristic, such as metal.
Similarly, the second electrode layer 408 is formed on the optical
film 405 of the first electrode layer 404. Therefore, the second
electrode 408 is not electrically connected to the first electrode
layer 404 so as to maintain the normal operation of the
elements.
[0044] Then, referring to FIG. 4E, the optical interference type
panel is constituted by the optical interference modulators formed
by removing all sacrificial layers 406. For example, the release
process is used to remove the sacrificial layer 406.
[0045] In order to apply the release process, utilization of the
photoresist material is quite suitable. In addition, various
appropriate materials such as conventional dielectric material can
be used. Therefore, the present invention is able to choose low
cost material to form the sacrificial layer.
[0046] FIG. 5 schematically shows a structural sectional view of an
optical interference type panel of a preferred embodiment according
to the present invention. Generally speaking, an optical
interference type panel is formed by deploying a plurality of
optical interference modulators on the transparent substrate with
an array style. However, for simplifying, only one optical
interference modulator is shown in FIG. 5. Referring to FIG. 5, the
optical interference modulator inside the optical interference type
panel according to the present invention primarily comprises a
transparent substrate 500, a supporting layer 502, a first
electrode 504, an optical film 505, and a second electrode 506.
[0047] The supporting layer 502 is located on the transparent
substrate 500. Wherein, the supporting layer 502 is made of an
opaque material such as an insulation material or a high-molecular
resin.
[0048] The first electrode layer 504 is located on the transparent
substrate 500 and the supporting layer 502. Wherein, the first
electrode layer 504 is made of a transparent conductive material
such as indium-tin oxide and formed on the transparent substrate
500 and the supporting layer 502.
[0049] The optical film 505 is located on the first electrode layer
504, and the optical film 505 is such as the multi layers of the
interleaving layer composed of the high-dielectric-constant
material layers and low-dielectric-constant material layers.
[0050] The edge of the second electrode 506 is individually located
on the optical film 505 above the supporting layer 502, and an air
gap 508 is formed between the second electrode 506 and the optical
film 505. Preferably, the second electrode layer 506 is made of a
material that is opaque and has good extendibility and mechanical
characteristic.
[0051] The method for driving the optical interference type panel
mentioned above is the same as the one used in the prior art. That
is, the pixel (optical interference modulator) in the same row is
driven by the first electrode in the same row, and the pixel in the
same column is driven by the second electrode in the same column.
In other words, when a specific pixel in the pixel array is driven,
the first electrode in the pixel's corresponding row and the second
electrode in the pixel's corresponding column are driven.
[0052] In summary, the present invention has at least the following
advantages:
[0053] 1. The optical interference type panel of the present
invention first forms the opaque supporting layer, and then
sequentially forms the first electrode layer, the optical film, and
the transparent sacrificial layer that is made of photoresist
material. Moreover, the sacrificial layer may be made of material
that is low cost and is suitable for the release process.
Therefore, using molybdenum (Mo) or the alloy of molybdenum (Mo) to
form the sacrificial layer is not required, so that the
manufacturing costs for the optical interference type panel are
reduced.
[0054] 2. Moreover, the optical interference type panel of the
present invention directly uses the photoresist material to form
the sacrificial layer. Therefore, the present invention is able to
avoid the step of coating a photoresist layer on the supporting
layer that is required in the prior art, so that the manufacturing
process of the optical interference type panel is simplified.
[0055] 3. Furthermore, according to the present invention, after
the sacrificial material layer is formed on the optical film, the
backside exposure process can be avoided, and the etch method can
be directly applied to form the sacrificial form. Therefore, the
manufacturing process of the optical interference type panel is
further simplified.
[0056] 4. In addition, according to the present invention, the
sacrificial layer that is below the optical film above the
supporting layer can be directly formed on the optical film between
the adjacent supporting layers. Therefore, the manufacturing
process of the optical interference type panel is further
simplified.
[0057] Although the invention has been described with reference to
a particular embodiment thereof, it will be apparent to one of the
ordinary skill in the art that modifications to the described
embodiment may be made without departing from the spirit of the
invention. Accordingly, the scope of the invention will be defined
by the attached claims not by the above detailed description.
* * * * *