U.S. patent application number 10/452248 was filed with the patent office on 2004-06-24 for user interface for wafer data analysis and visualization.
This patent application is currently assigned to Lam Research Corporation. Invention is credited to Luque, Jorge.
Application Number | 20040119749 10/452248 |
Document ID | / |
Family ID | 46299334 |
Filed Date | 2004-06-24 |
United States Patent
Application |
20040119749 |
Kind Code |
A1 |
Luque, Jorge |
June 24, 2004 |
User interface for wafer data analysis and visualization
Abstract
A wafer viewer system is provided for graphical presentation and
analysis of a wafer and a wafer series. More specifically, the
wafer viewer system includes a graphical user interface for
displaying a wafer, graphically selecting regions of the wafer for
analysis, performing analysis on the selected regions of the wafer,
and displaying results of the analysis.
Inventors: |
Luque, Jorge; (Redwood City,
CA) |
Correspondence
Address: |
MARTINE & PENILLA, LLP
710 LAKEWAY DRIVE
SUITE 170
SUNNYVALE
CA
94085
US
|
Assignee: |
Lam Research Corporation
4650 Cushing Parkway
Fremont
CA
|
Family ID: |
46299334 |
Appl. No.: |
10/452248 |
Filed: |
May 30, 2003 |
Related U.S. Patent Documents
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
|
|
10452248 |
May 30, 2003 |
|
|
|
10331194 |
Dec 24, 2002 |
|
|
|
Current U.S.
Class: |
715/771 ;
257/E21.525 |
Current CPC
Class: |
H01L 22/20 20130101 |
Class at
Publication: |
345/771 |
International
Class: |
G09G 005/00 |
Claims
What is claimed is:
1. A graphical user interface for analyzing wafer measurement data,
comprising: providing a control for selecting a first set of wafer
measurement data; providing a control for selecting a second set of
wafer measurement data; providing a control for performing a
mathematical operation between the first set of wafer measurement
data and the second set of wafer measurement data, the mathematical
operation creating a result set of wafer data; and displaying the
result set of wafer data.
2. A graphical user interface for analyzing wafer measurement data
as recited in claim 1, wherein the first set of wafer measurement
data and the second set of wafer measurement data are associated
with a common wafer.
3. A graphical user interface for analyzing wafer measurement data
as recited in claim 1, wherein the first set of wafer measurement
data and the second set of wafer measurement data are associated
with different wafers.
4. A graphical user interface for analyzing wafer measurement data
as recited in claim 1, wherein the first set of wafer measurement
data and the second set of wafer measurement data represent wafer
thickness measurement data.
5. A graphical user interface for analyzing wafer measurement data
as recited in claim 1, wherein the first set of wafer measurement
data and the second set of wafer measurement data represent a
common subset of wafer measurement data, the common subset of wafer
measurement data being associated with a portion of a wafer.
6. A graphical user interface for analyzing wafer measurement data
as recited in claim 5, further comprising: providing a subset
selection control for selecting the common subset of wafer
measurement data.
7. A graphical user interface for analyzing wafer measurement data
as recited in claim 6, wherein the subset selection control
provides for removal of specific wafer measurement data from one of
the first set of wafer measurement data, the second set of wafer
measurement data, and both the first and second sets of wafer
measurement data.
8. A graphical user interface for analyzing wafer measurement data
as recited in claim 1, wherein displaying the result set of wafer
data includes displaying a wafer map, the wafer map illustrating
the result set of wafer data as a function of location on a wafer
surface, differing magnitudes within the result set of wafer data
being illustrated using one of a color scale and a monochrome
scale.
9. A graphical user interface for analyzing wafer measurement data
as recited in claim 1, further comprising: providing a control for
saving the result set of wafer data.
10. A graphical user interface for analyzing wafer measurement data
as recited in claim 1, further comprising: providing a control for
printing a report of the result set of wafer data.
11. A graphical user interface for analyzing wafer measurement data
as recited in claim 1, further comprising: providing a control for
electronically transferring the result set of wafer data.
12. A graphical user interface for analyzing wafer measurement data
as recited in claim 1, further comprising: providing a control for
changing a unit of measure for displaying the result set of wafer
data.
13. A graphical user interface for managing and evaluating a
collection of wafer measurement data, comprising: providing a
control for selecting the collection of wafer measurement data;
providing a control for performing an evaluation of the collection
of wafer measurement data, the evaluation creating a set of
evaluation results; and displaying the set of evaluation
results.
14. A graphical user interface for managing and evaluating a
collection of wafer measurement data as recited in claim 13,
further comprising: providing a control for adding a set of wafer
measurement data to the collection of wafer measurement data.
15. A graphical user interface for managing and evaluating a
collection of wafer measurement data as recited in claim 13,
further comprising: providing a control for removing a set of wafer
measurement data from the collection of wafer measurement data.
16. A graphical user interface for managing and evaluating a
collection of wafer measurement data as recited in claim 13,
further comprising: providing a control for generating the
collection of wafer measurement data from a group of wafer
measurement data, the group of wafer measurement data including a
common type of data measurement for multiple wafers.
17. A graphical user interface for managing and evaluating a
collection of wafer measurement data as recited in claim 13,
further comprising: providing a control for generating multiple
collections of wafer measurement data from a group of wafer
measurement data, the group of wafer measurement data including
different types of data measurements for multiple wafers, a
separate collection of wafer measurement data being generated for
each of the different types of data measurements, each separate
collection of wafer measurement data including wafer measurement
data for each of the multiple wafers.
18. A graphical user interface for managing and evaluating a
collection of wafer measurement data as recited in claim 13,
further comprising: providing a control for saving changes to the
collection of wafer measurement data.
19. A graphical user interface for managing and evaluating a
collection of wafer measurement data as recited in claim 13,
wherein the control for performing evaluation of the collection of
wafer measurement data includes a control for selecting a quantity
to be evaluated, the quantity being selected from a set of options
including a mean, a standard deviation about the mean, a range
between a maximum value and a minimum value, the maximum value, and
the minimum value.
20. A graphical user interface for managing and evaluating a
collection of wafer measurement data as recited in claim 13,
wherein the control for performing the evaluation of the collection
of wafer measurement data includes a control for selecting a subset
of wafer measurement data to be evaluated, the subset of wafer
measurement data being associated with a portion of a wafer.
21. A graphical user interface for managing and evaluating a
collection of wafer measurement data as recited in claim 20, the
control for selecting a subset of wafer measurement data including
options for selecting wafer measurement data within one of an
arbitrary half of the wafer, an arbitrary region outwardly
extendable from a center of the wafer, and an annular region
selectable at an arbitrary distance from the center of the
wafer.
22. A graphical user interface for managing and evaluating a
collection of wafer measurement data as recited in claim 13,
wherein displaying the set of evaluation results includes providing
a graphical display of the set of evaluation results for each set
of wafer measurement data in the collection of wafer measurement
data.
23. A graphical user interface for managing and evaluating a
collection of wafer measurement data as recited in claim 22,
wherein the graphical display includes a display of control limits,
the control limits representing a selected number of standard
deviations about a mean of a quantity being displayed in the set of
evaluation results.
24. A graphical user interface for managing and evaluating a
collection of wafer measurement data as recited in claim 13,
wherein displaying the set of evaluation results includes
displaying statistical values associated with the set of evaluation
results, the statistical values including a mean, a standard
deviation about the mean, a range between a maximum value and a
minimum value, the maximum value, and the minimum value.
25. A computer implemented process for controlling and performing
analysis of wafer measurement data, comprising: providing a
graphical user interface, the graphical user interface providing a
control for selecting a subset of the wafer measurement data for
analysis; performing analysis of the subset of the wafer
measurement data to create a set of analysis results; and providing
a display of the set of analysis results, the display being
presented in the graphical user interface.
26. A computer implemented process for controlling and performing
analysis of wafer measurement data as recited in claim 25, wherein
the control for selecting the subset of the wafer measurement data
for analysis is a cross-section selection control, the
cross-section selection control allowing the wafer measurement data
across a diameter of a wafer to be selected as the subset of the
wafer measurement data for analysis.
27. A computer implemented process for controlling and performing
analysis of wafer measurement data as recited in claim 26, wherein
the set of analysis results includes a mean, a standard deviation
about the mean, an range between a maximum value and a minimum
value, the maximum value, and the minimum value.
28. A computer implemented process for controlling and performing
analysis of wafer measurement data as recited in claim 26, wherein
the display of the set of analysis results includes a graphical
display of the subset of the wafer measurement data across the
diameter of the wafer.
29. A computer implemented process for controlling and performing
analysis of wafer measurement data as recited in claim 28, wherein
differing magnitudes within the subset of the wafer measurement
data are illustrated using one of a color scale and a monochrome
scale.
30. A computer implemented process for controlling and performing
analysis of wafer measurement data as recited in claim 25, wherein
the control for selecting the subset of the wafer measurement data
for analysis is a radial selection control, the radial selection
control allowing the wafer measurement data across a radius of a
wafer to be selected as the subset of the wafer measurement data
for analysis.
31. A computer implemented process for controlling and performing
analysis of wafer measurement data as recited in claim 30, wherein
the set of analysis results includes a mean, a standard deviation
about the mean, an range between a maximum value and a minimum
value, the maximum value, and the minimum value.
32. A computer implemented process for controlling and performing
analysis of wafer measurement data as recited in claim 30, wherein
the display of the set of analysis results includes a graphical
display of the subset of the wafer measurement data across the
radius of the wafer.
33. A computer implemented process for controlling and performing
analysis of wafer measurement data as recited in claim 32, wherein
differing magnitudes within the subset of the wafer measurement
data are illustrated using one of a color scale and a monochrome
scale.
34. A computer implemented process for controlling and performing
analysis of wafer measurement data as recited in claim 25, wherein
the control for selecting the subset of the wafer measurement data
for analysis is an angular selection control, the angular selection
control allowing the wafer measurement data at a constant distance
about a center of a wafer to be selected as the subset of the wafer
measurement data for analysis.
35. A computer implemented process for controlling and performing
analysis of wafer measurement data as recited in claim 34, wherein
the set of analysis results includes a mean, a standard deviation
about the mean, an range between a maximum value and a minimum
value, the maximum value, and the minimum value.
36. A computer implemented process for controlling and performing
analysis of wafer measurement data as recited in claim 34, wherein
the display of the set of analysis results includes a graphical
display of the subset of the wafer measurement data at the constant
distance about the center of the wafer.
37. A computer implemented process for controlling and performing
analysis of wafer measurement data as recited in claim 36, wherein
differing magnitudes within the subset of the wafer measurement
data are illustrated using one of a color scale and a monochrome
scale.
38. A computer implemented process for controlling and performing
analysis of wafer measurement data as recited in claim 25, wherein
the set of analysis results includes a set of Gaussian analysis
results based on the subset of the wafer measurement data.
39. A computer implemented process for controlling and performing
analysis of wafer measurement data as recited in claim 38, wherein
the display of the set of analysis results includes a graphical
display of the Gaussian analysis results, the graphical display
being a histogram represented by a number of bars, each of the
number of bars representing a number of wafer measurement data
values within a varying number of standard deviations about a mean
value, the graphical display further including an ideal Gaussian
distribution plot based on the subset of the wafer measurement
data.
40. A graphical user interface for performing a profile analysis,
comprising: displaying an electronic microscope image; providing
controls for adjusting the electronic microscope image; and
providing a graphical measurement control.
41. A graphical user interface for performing a profile analysis as
recited in claim 40, further comprising: providing controls for
calibrating the graphical measurement control.
42. A graphical user interface for performing a profile analysis as
recited in claim 40, further comprising: displaying a profile over
the electronic microscope image.
43. A graphical user interface for performing a profile analysis as
recited in claim 40, wherein the controls for adjusting the
electronic microscope image includes an image zoom control and an
image position control.
44. A computer readable media containing program instructions for
controlling and performing analysis of wafer measurement data,
comprising: program instructions for providing a graphical user
interface, the graphical user interface providing a control for
selecting a subset of the wafer measurement data for analysis;
program instructions for performing analysis of the subset of the
wafer measurement data to create a set of analysis results; and
program instructions for providing a display of the set of analysis
results, the display being presented in the graphical user
interface.
45. A computer readable media containing program instructions for
controlling and performing analysis of wafer measurement data as
recited in claim 44, wherein the control for selecting the subset
of the wafer measurement data for analysis is a cross-section
selection control, the cross-section selection control allowing the
wafer measurement data across a diameter of a wafer to be selected
as the subset of the wafer measurement data for analysis.
46. A computer readable media containing program instructions for
controlling and performing analysis of wafer measurement data as
recited in claim 45, wherein the display of the set of analysis
results includes a graphical display of the subset of the wafer
measurement data across the diameter of the wafer.
47. A computer readable media containing program instructions for
controlling and performing analysis of wafer measurement data as
recited in claim 44, wherein the control for selecting the subset
of the wafer measurement data for analysis is a radial selection
control, the radial selection control allowing the wafer
measurement data across a radius of a wafer to be selected as the
subset of the wafer measurement data for analysis.
48. A computer readable media containing program instructions for
controlling and performing analysis of wafer measurement data as
recited in claim 47, wherein the display of the set of analysis
results includes a graphical display of the subset of the wafer
measurement data across the radius of the wafer.
49. A computer readable media containing program instructions for
controlling and performing analysis of wafer measurement data as
recited in claim 44, wherein the control for selecting the subset
of the wafer measurement data for analysis is an angular selection
control, the angular selection control allowing the wafer
measurement data at a constant distance about a center of a wafer
to be selected as the subset of the wafer measurement data for
analysis.
50. A computer readable media containing program instructions for
controlling and performing analysis of wafer measurement data as
recited in claim 49, wherein the display of the set of analysis
results includes a graphical display of the subset of the wafer
measurement data at the constant distance about the center of the
wafer.
Description
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation-in-part of U.S.
application Ser. No. 10/331,194, filed Dec. 24, 2002, and entitled
"User Interface for Quantifying Wafer Non-Uniformities and
Graphically Explore Significance," benefit to which is claimed
under 35 U.S.C. .sctn.120 and the disclosure of which is
incorporated herein by reference. This application is also related
to U.S. patent application Ser. No. 10/327,233, filed Dec. 20,
2002, and entitled "System and Method for Quantifying Uniformity
Patterns for tool Development and Monitoring," the disclosure of
which is incorporated herein by reference.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates generally to post-process
wafer evaluation. More specifically, the present invention relates
to a system for enabling graphical presentation and control of a
post-process wafer evaluation.
[0004] 2. Description of the Related Art
[0005] Semiconductor wafers undergo numerous processes during the
semiconductor manufacturing process. Layers may be added,
patterned, etched, removed, and polished, among others. After each
process the wafer is typically examined to confirm the previous
process was completed with an acceptable level of post-process
error or nonuniformity. The various operating variables (e.g.,
event timing, gas pressure, concentrations, temperatures, etc.) of
each process performed on the wafer are recorded so that any
changes in any variable may be quickly identified and potentially
correlated to any post-process error or nonuniformity discovered
when the wafer is examined.
[0006] Prior art approaches to describing post-process
nonuniformities include subjective, verbal descriptions such as
"center-fast" for annular nonuniformity or "left-side-slow" for
azimuthal nonuniformity. Center-fast is generally descriptive of a
post-process wafer condition where more material has been removed
from a center region on the wafer than from a surrounding region on
the wafer. However, center-fast does not provide a specific,
objective, and quantitative description of the nonuniformity.
Similarly, left-side-slow is generally descriptive of a
post-process wafer condition where less material has been removed
from a left side region on the wafer than from a remaining region
on the wafer. As with the center-fast description, the
left-side-slow description fails to provide a specific, objective,
and quantitative description of the nonuniformity.
[0007] Descriptions of post-process nonuniformities are used to
provide feedback to correct errors and inconsistencies in the
preceding wafer processes. Descriptions of post-process
nonuniformities can also be used to track the impact of the
nonuniformities on subsequent semiconductor manufacturing processes
and on metrics from completed semiconductor devices (e.g., device
yields, performance parameters, etc.).
[0008] As post-process nonuniformities become smaller and smaller,
the post-process nonuniformities become less symmetrical and more
difficult to accurately describe with the subjective, verbal
descriptions. In following, the subjective, verbal descriptions are
insufficient to accurately describe the post-process
nonuniformities so that further improvements in the preceding wafer
processing operations can be successfully implemented.
[0009] In view of the foregoing, there is a need for a system that
enables a detailed graphical display and analysis of a post-process
wafer condition.
SUMMARY OF THE INVENTION
[0010] Broadly speaking, the present invention fills these needs by
providing a wafer viewer system for graphical presentation and
analysis of a wafer. More specifically, the wafer viewer system
includes a graphical user interface for displaying a wafer,
graphically selecting regions of the wafer for analysis, performing
analysis on the selected regions of the wafer, and displaying
results of the analysis.
[0011] In one embodiment, a graphical user interface for analyzing
wafer measurement data is disclosed. The graphical user interface
provides controls for selecting a first set of wafer measurement
data and a second set of wafer measurement data. The graphical user
interface also provides a control for performing a mathematical
operation between the first set of wafer measurement data and the
second set of wafer measurement data. The mathematical operation
creates a result set of wafer data. The graphical user interface
further includes displaying the result set of wafer data.
[0012] In another embodiment, a graphical user interface for
managing and evaluating a collection of wafer measurement data is
disclosed. The graphical user interface provides a control for
selecting the collection of wafer measurement data. The graphical
user interface also provides a control for performing an evaluation
of the collection of wafer measurement data to create a set of
evaluation results. The graphical user interface further includes
displaying the set of evaluation results.
[0013] In another embodiment, a computer implemented process for
controlling and performing analysis of wafer measurement data is
disclosed. The computer implemented process includes providing a
graphical user interface. The graphical user interface provides a
control for selecting a subset of the wafer measurement data for
analysis. The computer implemented process further includes
performing analysis of the subset of the wafer measurement data to
create a set of analysis results. A display of the analysis results
is provided by the computer implemented process in the graphical
user interface.
[0014] In another embodiment, a graphical user interface for
performing a profile analysis is disclosed. The graphical user
interface includes displaying a wafer image. Controls for adjusting
the wafer image are provided. Also, the graphical user interface
provides a graphical measurement control.
[0015] In another embodiment, a computer readable media containing
program instructions for controlling and performing analysis of
wafer measurement data is disclosed. The computer readable media
includes program instructions for providing a graphical user
interface. The graphical user interface provides a control for
selecting a subset of the wafer measurement data for analysis. The
computer readable media further includes program instructions for
performing analysis of the subset of the wafer measurement data to
create a set of analysis results. The computer readable media also
includes program instructions for providing a display of the
analysis results in the graphical user interface.
[0016] Other aspects and advantages of the invention will become
more apparent from the following detailed description, taken in
conjunction with the accompanying drawings, illustrating by way of
example the present invention.
BRIEF DESCRIPTION OF THE DRAWINGS
[0017] The invention, together with further advantages thereof, may
best be understood by reference to the following description taken
in conjunction with the accompanying drawings in which:
[0018] FIG. 1 is an illustration showing a graphical user interface
(GUI) of a wafer viewer system, in accordance with one embodiment
of the present invention;
[0019] FIG. 2 is an illustration showing an isolated view of the
wafer display area, in accordance with one embodiment of the
present invention;
[0020] FIG. 3 is an illustration showing an isolated view of the
wafer data area, in accordance with one embodiment of the present
invention;
[0021] FIG. 4 is an illustration showing the GUI when the
cross-section analysis option is selected, in accordance with one
embodiment of the present invention;
[0022] FIG. 5 is an illustration showing an isolated view of the
cross-section area, in accordance with one embodiment of the
present invention;
[0023] FIG. 6 is an illustration showing an isolated view of the
histogram area, in accordance with one embodiment of the present
invention;
[0024] FIG. 7 is an illustration showing the GUI when the
distribution analysis option is selected, in accordance with one
embodiment of the present invention;
[0025] FIG. 8 is an illustration showing an isolated view of the
radial/angular distribution area, in accordance with one embodiment
of the present invention;
[0026] FIG. 9 is an illustration showing the GUI when the
XSEM/profile analysis option is selected, in accordance with one
embodiment of the present invention;
[0027] FIG. 10 is an illustration showing an isolated view of the
XSEM/profile area, in accordance with one embodiment of the present
invention;
[0028] FIG. 11 is an illustration showing the GUI when a series
analysis option is selected, in accordance with one embodiment of
the present invention;
[0029] FIG. 12 is an illustration showing an isolated view of the
series plot area, in accordance with one embodiment of the present
invention;
[0030] FIG. 13 is an illustration showing an isolated view of the
spatial statistics area, in accordance with one embodiment of the
present invention;
[0031] FIG. 14 is an illustration showing an isolated view of the
spatial statistics area with a side-to-side spatial distribution
selection, in accordance with one embodiment of the present
invention; and
[0032] FIG. 15 is an illustration showing an isolated view of the
spatial statistics area with an annular spatial distribution
selection, in accordance with one embodiment of the present
invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0033] Broadly speaking, an invention is disclosed for a wafer
viewer system for graphical presentation and analysis of a wafer.
More specifically, the wafer viewer system includes a graphical
user interface for displaying a wafer, graphically selecting
regions of the wafer for analysis, performing analysis on the
selected regions of the wafer, and displaying results of the
analysis.
[0034] In the following description, numerous specific details are
set forth in order to provide a thorough understanding of the
present invention. It will be apparent, however, to one skilled in
the art that the present invention may be practiced without some or
all of these specific details. In other instances, well known
process operations have not been described in detail in order not
to unnecessarily obscure the present invention.
[0035] FIG. 1 is an illustration showing a graphical user interface
(GUI) 10 of a wafer viewer system, in accordance with one
embodiment of the present invention. The GUI 10 includes a menu bar
101 having a number of user-activatable icons which can be
activated to perform a number of tasks.
[0036] A clear wafers/XSEM icon 103 is provided to allow a user to
either clear a wafer or an XSEM/TEM image that is currently loaded
in the wafer viewer. The clear wafers/XSEM icon 103 offers a
drop-down menu for presenting the clear wafer and clear XSEM/TEM
options.
[0037] A load data/XSEM icon 105 is provided to allow a user to
load data for either a Wafer A, a Wafer B, or an XSEM/TEM image.
The load data/XSEM icon 105 offers a drop-down menu for presenting
the Wafer A, the Wafer B, or the XSEM/TEM image options for loading
data. In one embodiment, the wafer viewer is capable of reading
output files from metrology tools without intermediate processing.
In this embodiment, the wafer viewer recognizes file formats by an
associated file extension. For example, output files from metrology
tools such as Hitachi CD SEM, KLA-Tencor CD SEM, Optiprobe
ellipsometer, Rudolph ellipsometer, F5.times. KLA-Tencor
(ellipsometry and scatterometry formats), and NOVA scatterometer
are recognizable by the wafer viewer. Also, the wafer viewer is
capable of loading a user defined file. In addition to loading data
for individual wafers and XSEM/TEM images, the wafer viewer also
supports loading files containing data for either individual or
multiple wafers having multiple layers or measurements for a given
wafer.
[0038] A save data icon 107 is provided to allow a user to save
numerical data corresponding to a currently displayed wafer. In one
embodiment, the save data icon 107 offers a drop-down menu for
presenting options for saving either wafer data, diameter data, or
optical profile data.
[0039] A print icon 109 is provided to allow a user to print a
wafer report. In one embodiment, the wafer report includes a header
(containing wafer names, date, number of sites, etc . . . ), a set
of wafer statistics (mean, 3-sigma, range, maximum, minimum), a
wafer map currently displayed by the wafer viewer, a set of
cross-section statistics (mean, 3-sigma, range, maximum, minimum),
and a cross-section graph currently displayed by the wafer
viewer.
[0040] A copy to clipboard icon 111 is provided to allow a user to
copy information to a virtual clipboard for transfer to other
applications. In one embodiment, the copy to clipboard icon 111
offers a drop-down menu for presenting various information options
that can be copied to the virtual clipboard. For example, in one
embodiment, the drop-down menu can include a Map, Scale, and
Statistics option, a Wafer Map option, a Color Scale option, a
Diameter option, a Radial Graph option, an Azimuthal Graph option,
and a XSEM/Optical Profile Picture option.
[0041] An undelete wafer site icon 113 is provided to allow a user
to undelete a previously deleted wafer site. In one embodiment, the
undelete wafer site icon 113 offers a drop-down menu for presenting
a last point option and an all points option. Selection of the last
point option will undelete the last wafer site that was deleted.
Selection of the all points option will undelete all of the
previously deleted wafer sites.
[0042] A wafer collection management icon 115 is provided to allow
a user to create and manage a wafer collection. The wafer
collection represents a collection of multiple data sets for a
number of wafers that have a common pattern of data measurement
sites ("sites"). In addition to data sets, the wafer collection
also includes associated wafer identifiers, dates, and comments. In
one embodiment, the number of wafers in the wafer collection can
have differing patterns of sites. However, in this embodiment, a
first wafer in the wafer collection will determine a master site
pattern for the entire wafer collection. In following, the
remaining wafers in the wafer collection will have their data
interpolated to match the master site pattern. For example, if a
wafer with a deleted site is added to a wafer collection, a data
value is interpolated for the deleted site. Additionally, this
embodiment avoids problems associated with an analysis of a wafer
collection that includes wafers having different edge exclusion
areas and/or measurement data from different metrology tools (i.e.,
have a different measurement site pattern).
[0043] In one embodiment, the wafer collection management icon 115
offers a drop-down menu for presenting a number of wafer collection
management options. Options are included for adding a wafer to a
collection, deleting a wafer from a collection, making a collection
from a wafer lot, making a collection from all wafer lot
properties, inserting a wafer in a collection, and saving changes
to a wafer collection. The option for making a collection from a
wafer lot allows a user to create a wafer collection from a file
containing a common type of data for multiple wafers. The option
for making a collection from all wafer lot properties allows a user
to simultaneously create multiple wafer collections from a file
containing a number of types of data for multiple wafers. A
separate wafer collection will be created for each of the number of
types of data. Each of the separate wafer collections will contain
the corresponding data for each of the multiple wafers.
[0044] A help icon 129 is provided to allow a user to obtain
assistance with operation of the GUI 10. In one embodiment, the
help icon 129 offers a drop-down menu for presenting options to
either obtain general help or obtain help with file input
formats.
[0045] An email technical support icon 131 is provided to allow a
user to send an email to a designated GUI 10 technical support
email address. Activation of the email technical support icon 131
automatically instantiates an new email preparation feature of an
email program resident on a host computer system.
[0046] An about icon 133 is provided to allow a user to obtain
information about the wafer viewer system. In one embodiment, the
about icon 133 offers a drop-down menu for presenting options to
either obtain information regarding the wafer viewer system or
visit a wafer viewer system website. Selection of the option to
visit the wafer viewer system website automatically instantiates a
web browser resident on the host computer system and navigates to a
predesignated wafer viewer system web page.
[0047] A registration icon 135 is provided to allow a user to
register a wafer viewer system. In one embodiment, registration of
the wafer viewer system is used as a security feature to control
distribution and installation of the wafer viewer system on the
host computer system.
[0048] In addition to the aforementioned user-activatable icons,
menu bar 101 also includes a series analysis icon 117, a
diameter/histogram icon 119, an azimuthal/radial distribution icon
121, an XSEM/profile icon 123, a histogram icon 125, and a wafer
spreadsheet icon 127. These additional user-activatable icons will
be discussed below in connection with their corresponding wafer
viewer system feature.
[0049] The GUI 10 further includes a first wafer identification and
selection field 137 and a second wafer identification and selection
field 139. Each of the first and second wafer identification and
selection fields, 137 and 139, displays a name corresponding to a
wafer data set currently loaded for a Wafer A and a Wafer B,
respectively. Additionally, each of the first and second wafer
identification and selection fields, 137 and 139, offers a
drop-down menu for selecting an available wafer data set to be
loaded for the Wafer A and the Wafer B, respectively.
[0050] The GUI 10 further includes a display control field 141 to
allow the user to select a wafer data set to be displayed and
analyzed by the wafer viewer system. In one embodiment, the display
control field 141 offers a drop-down menu for presenting options of
different wafer data sets to be selected for display and analysis.
For example, the drop-down menu can include options for Wafer A,
Wafer B, (Wafer A-Wafer B), (Wafer A+Wafer B), (Wafer A.times.Wafer
B), (Wafer A/Wafer B), and [(1/Wafer A)-(1/Wafer B)], among others.
The option selected will determine the wafer data that is currently
displayed and analyzed by the wafer viewer system.
[0051] In addition, through the use of an operator field 143 and an
operand field 145, further mathematical operations can also be
performed on the wafer data selected in the display control field
141. The operator field 143 offers a drop-down menu for presenting
a multiplication (.times.), an addition (+), a subtraction (-), a
division (/), a power ({circumflex over ( )}), and a rotate
operation to be performed on the wafer data that is selected in the
display control field 141. The operand field 145 offers a drop-down
menu for allowing the user to select either a number, a mean, or a
minimum operand option. Selection of the number operand option
allows the user to enter a number in the operand field 145 to be
used as an operand. Selection of the mean operand option will cause
the mean value of the wafer data selected in the display control
field 141 to be used as the operand. Selection of the minimum
operand option will cause the minimum value of the wafer data
selected in the display control field 141 to be used as the
operand. The mathematical operation indicated in the operator field
143 (i.e., .times., +, -, /, or {circumflex over ( )}) will be
performed on the wafer data selected in the display control field
141 using the operand entered in the operand field 145. Data
resulting from the mathematical operation will be used by the wafer
viewer system for display and analysis. In the case where the
rotate option is selected in the operator field 143, the operand
entered in the operand field 145 will be used as a number of
degrees of rotation for display of the wafer data currently
selected.
[0052] The GUI 10 further includes a units field 147 to allow the
user to select a unit of measure to be associated with the wafer
data currently displayed and analyzed by the wafer viewer system.
In one embodiment, available units of measure include Angstrom,
nanometer, kiloAngstrom, micrometer, Celsius, Angstrom/minute,
nanometer/minute, kiloAngstrom/minute, micrometer/minute, and none.
The units field 147 offers a drop-down menu for presenting the
various unit of measure options available for selection.
[0053] As previously mentioned, data can be loaded for multiple
layers or measurements for a given wafer. For these cases, the GUI
10 includes an internal wafer math selection 149. When selected,
the internal wafer math selection 149 causes a mathematical
operation to be performed between selected layer or measurement
data sets for the given wafer. A first internal math operand field
151 offers a drop-down menu for allowing the user to select a data
set to be used as a first operand in the internal wafer math
calculation. A second internal math operand field 155 offers a
drop-down menu for allowing the user to select a data set to be
used as a second operand in the internal wafer math calculation. An
internal math operator field 153 offers a drop-down menu for
allowing the user to select the internal math operation to be
performed (i.e., subtraction (-), addition (+), multiplication
(.times.), or division (/). The selected internal math operation is
performed between corresponding data values of the selected first
and second internal math operands. Data resulting from the selected
internal math operation will be used by the wafer viewer system for
display and analysis.
[0054] The GUI 10 further includes a wafer description area 157. In
one embodiment, the wafer description area 157 includes a sites
field 159, an edge field 161, and a size field 163. The sites field
159 provides information about the number of data measurement sites
in the currently displayed and analyzed wafer or wafers. The edge
field 161 provides a size of an edge exclusion zone of the
currently displayed and analyzed wafer or wafers. The size field
163 provides a diameter size of the currently displayed and
analyzed wafer or wafers.
[0055] The GUI 10 further includes a wafer information area 165. In
one embodiment, the wafer information area 165 includes a wafer
identifier field 167, a date field 169, a recipe field 171, and a
comment field 173. The wafer identifier field 167 displays an
identifier associated with the currently displayed and analyzed
wafer. The date field 169 displays a date on which the currently
loaded wafer data was created or obtained. The date field 169 also
offers a drop-down control that when activated causes a navigatable
calendar to be displayed. The recipe field 171 displays information
regarding a wafer processing recipe associated with the currently
loaded wafer data. The comment field 173 displays comments provided
with the currently loaded wafer data. The comment field 173 is
equipped with vertical scroll controls. An expand icon 175 is also
associated with the comment field 173. When activated, the expand
icon 175 causes the comment field 173 to be displayed in a larger
pop-up window. The larger pop-up window offers a close icon that
can be activated to close the pop-up window.
[0056] The GUI 10 further includes a wafer display area 201 and a
spatial statistics area 301. A remaining portion of the GUI is used
to display features associated with a currently selected analysis
mode. For example, in FIG. 1, the currently selected analysis mode
is spreadsheet. Therefore, the remaining portion of the GUI is used
to display a wafer data area 401 associated with the spreadsheet
analysis mode. The wafer data area 401 and other available analysis
mode selections and associated features will be described in more
detail below.
[0057] FIG. 2 is an illustration showing an isolated view of the
wafer display area 201, in accordance with one embodiment of the
present invention. The wafer display area 201 includes a wafer
display window 215. A Cartesian coordinates system is defined
within the wafer display window 215. An origin of the Cartesian
coordinates system is positioned at the center of the wafer display
window 215.
[0058] A wafer image 217 is displayed within the wafer display
window 215. The wafer image 217 is centered at the origin of the
cartesian coordinate system defined within the wafer display window
215. The wafer image 217 includes a display of actual data
measurement site locations 219 and an associated measurement data
value. The wafer image 217 also includes a color or monochrome map
rendered by numerical interpolation between the data measurements.
As the user moves a mouse over the wafer image 217, a vertical
guide 223, a horizontal guide 221, and a information box 225 are
displayed at the mouse location. The information box 225 displays a
set of Cartesian coordinates and a data value corresponding to the
mouse location. The vertical guide 223 and horizontal guide 221 can
be used in combination with a scale 227 provided at the lower edge
of the wafer display window 215 to accurately position the mouse at
a desired location.
[0059] The wafer display area 201 also includes a color scale 229
corresponding to the various hues or shades utilized in the color
or monochrome map displayed across the wafer image 217. According
to the color scale 229 a change in color or shade corresponds to a
change in data value magnitude.
[0060] A wafer view select field 231 is provided within the wafer
display area 201. The wafer view select field 231 offers a
drop-down menu for presenting wafer display options. In one
embodiment, the wafer display options include color contour, color
gradient, monochrome, 1-sigma, and sites value. The color contour
option divides the color scale 229 into a discrete number of steps.
In one embodiment, the color contour option divides the color scale
into 9 discrete steps. The color contour option is useful for
showing wafer regions with similar values. The color gradient
option defines the color scale 229 using a continuous gradient. The
color gradient option is useful for providing more detail than the
color contour option. The monochrome option defines the color scale
229 as a gray scale. The monochrome option is useful for providing
the wafer image 217 in a format that is more compatible with black
and white printers. The 1-sigma option displays data values below
1-sigma in a first color, data values within plus or minus 1-sigma
in a second color, and data values above 1-sigma in a third color.
The 1-sigma option is useful for displaying data values that are
far from average. The sites value option only displays the actual
data measurement site locations 219 and associated measurement data
values.
[0061] A point density select field 233 is provided within the
wafer display area 201. The point density select field 233 offers a
drop-down menu for presenting point density options for use in
defining an interpolation grid. In one embodiment, the point
density options include low (50 point by 50 point interpolation
grid), normal (100 point by 100 point interpolation grid, and high
(200 point by 200 point interpolation grid). For example, selection
of the low option will cause the interpolation grid to be defined
within the wafer display window 215 with 50 uniform width columns
and 50 uniform height rows. Selection of the normal option will
cause the interpolation grid to be defined within the wafer display
window 215 with 100 uniform width columns and 100 uniform height
rows. Selection of the high option will cause the interpolation
grid to be defined within the wafer display window 215 with 200
uniform width columns and 200 uniform height rows. A data value is
interpolated for each point in the defined interpolation grid.
Thus, selection of the high option provides the highest
interpolation resolution, and selection of the low option provides
the lowest interpolation resolution.
[0062] An interpolation select field 235 is provided within the
wafer display area 201. The interpolation select field 233 offers a
drop-down menu for presenting interpolation options for use in
calculating the interpolated data values for display in accordance
with the selected interpolation grid. In one embodiment, the
interpolation options include soft, normal, and harsh. The
interpolation is based on an inverse distance algorithm which
generates a weight function that is proportional to (1/r.sup.n),
where r is the distance between a data measurement site location
219 and a location to be interpolated and n is an adjustable
parameter with an optimum value between 2 and 4. A higher n value
is better for fewer data measurement site locations. Conversely, a
lower n value is better for more data measurement locations. The
soft option sets the n value equal to 2. The harsh option sets the
n value equal to 4. The normal option calculates an n value
according to a number of displayed data measurement locations.
[0063] A show sites selection 239 is provided within the wafer
display area 201. The show sites selection 239 can be toggled to
display and remove the data measurement site locations 219 from the
wafer image 217.
[0064] A show values selection 241 is provided within the wafer
display area 201. The show values selection 241 can be toggled to
display and remove the data values associated with the data
measurement site locations 219 from the wafer image 217.
[0065] A show ruler selection 263 is provided within the wafer
display area 201. The show ruler selection 263 can be toggled to
display and remove ruler tick marks from the sides of the wafer
display window 215.
[0066] A warning limits area 243 is provided within the wafer
display area 201. The warning limits area 243 includes a warning
limits activation selection 245, an upper warning limit field 247,
and a lower warning limit field 249. When the warning limits
activation selection 245 is activated, each data measurement site
location 219 having an associated data value that is either above
the upper warning limit field 247 value or below the lower warning
limit field value 249 is highlighted in the wafer image 217.
[0067] A scale limits area 251 is provided within the wafer display
area 201. The scale limits area 251 includes a scale limits
activation selection 253 and a drop-down menu 259 offering options
for establishing an upper and a lower scale limit. The drop-down
menu 259 includes a user supplied option, a percentage of mean
option, and a 3-sigma option. Selection of the user supplied option
enables an upper scale limit to be entered in an upper scale limit
field 255 and a lower scale limit to be entered in a lower scale
limit field 257. Selection of the percentage of mean option enables
a percentage value to be entered in a value field 261. The upper
and lower scale limits are calculated to be a corresponding
percentage of the mean. Selection of the 3-sigma option establishes
the upper and lower scale limits at three times the standard
deviation about the mean.
[0068] A die layout area 265 is provided within the wafer display
area 201. The die layout area 265 includes a show die layout
selection 267, a horizontal die size field 269a, a vertical die
size field 269b, a horizontal die offset field 271a, and a vertical
die offset field 271b. The horizontal die size field 269a and the
vertical die size field 269b allow the user to provide dimensions
of a single die. The horizontal die offset field 271a and the
vertical die offset field 271b allow the user to provide a die grid
offset relative to a center of the wafer.
[0069] The wafer display area 201 also includes a wafer statistics
area 203. The wafer statistics area 203 displays a mean value 205,
a 3-sigma value 207 (i.e., three times the standard deviation about
the mean), a range value 209 (i.e., difference between the maximum
value and the minimum value), a maximum value 211, and a minimum
value 213, corresponding to a set of currently displayed wafer
data.
[0070] The wafer display area 201 further includes an analysis
select field 237. The analysis select field 237 offers a drop-down
menu for presenting analysis mode options. In one embodiment, the
analysis mode options include a cross-section analysis option, a
distribution analysis option, an XSEM/Profile analysis option, and
a spreadsheet analysis option. Selection of an analysis option
causes a set of corresponding features and controls to be displayed
within the GUI 10. Features and controls associated with each of
the analysis mode options are described below with respect to FIGS.
3 through 13.
[0071] In FIG. 2, the analysis select field 237 indicates that the
spreadsheet analysis option is selected. Referring back to FIG. 1,
the wafer data area 401 is displayed upon selection of the
spreadsheet analysis option. In addition to using the analysis
select field 237, the spreadsheet analysis option can also be
selected by activating the wafer spreadsheet icon 127 in the menu
bar 101.
[0072] FIG. 3 is an illustration showing an isolated view of the
wafer data area 401, in accordance with one embodiment of the
present invention. The wafer data area 401 includes a spreadsheet
display. The spreadsheet display includes a site column 407 for
entering and/or displaying a number of a data measurement site. An
x-column 409 and a y-column 411 are included for entering and/or
displaying x and y cartesian coordinates, respectively, of the
corresponding data measurement site. A z-column 413 is included for
entering and/or displaying a wafer thickness corresponding to the
data measurement site. Data is entered and/or displayed for each
data measurement site on a separate row. The user can select a
header of either the site column 407, the x-column 409, the
y-column 411, or the z-column 413 to sort the data in the
spreadsheet display by the data in the respective column.
Successive selections of a particular header will toggle the sort
between ascending and descending order. A vertical scroll control
is provided to allow navigation through the spreadsheet display.
Also, an allow adding new sites selection 405 is provided.
Activation of the allow adding new sites selection 405 allows the
user to manually enter data for a new data measurement site in the
spreadsheet display. If the allow adding new sites selection 405 is
not activated, the user is not able to enter or change data in the
spreadsheet display. Thus, the spreadsheet analysis option allows
the user to edit data of an existing wafer or enter data for a new
wafer.
[0073] The wafer data area 401 also includes a wafer size select
field 403 offering a drop-down menu for presenting wafer size
options. In one embodiment, the wafer size options include 75 mm,
100 mm, 125 mm, 150 mm, 200 mm, 300 mm, and 450 mm diameter wafers.
Selection of a particular wafer size option adjusts the scale 227
provided at the lower edge of the wafer display window 215.
[0074] FIG. 4 is an illustration showing the GUI 10 when the
cross-section analysis option is selected, in accordance with one
embodiment of the present invention. The cross-section analysis
option can be selected with either the analysis select field 237,
the diameter/histogram icon 119, or the histogram icon 125. Upon
selection of the cross-section analysis option, the GUI 10 displays
a cross-section area 501 and a histogram area 601.
[0075] FIG. 5 is an illustration showing an isolated view of the
cross-section area 501, in accordance with one embodiment of the
present invention. The cross-section area 501 includes a
cross-section display 523. The cross-section display 523 displays a
cross-section traversing through a center of the wafer in
accordance with a set of cross-section controls. The cross-section
display 523 includes a horizontal scale representing the radial
distance from the center of the wafer. The cross-section display
523 also includes a vertical scale representing a wafer thickness.
Therefore, the cross-section display 523 presents an image of the
wafer thickness variation as a function of distance from the wafer
center.
[0076] The set of cross-section controls are provided to allow the
user to select the exact cross-section to be displayed in the
cross-section display 523. The set of cross-section controls
include an angle select graphical control 515, an angle value field
517, a color selection 519, and a scale limits synchronization
selection 521. The angle select graphical control 515 and the angle
value field 517 can be used by the user to select the exact
cross-section to be analyzed. The user can select and drag a
cross-section control line 525 to obtain a desired cross-section
for analysis. The cross-section control line 525 is defined to
pivot about a center of the graphical control 515. Alternatively,
the user can directly enter an angle in the angle value field 517
to obtain a desired cross-section for analysis. If the angle select
graphical control 515 is used, the corresponding angle is displayed
in the angle value field 517. If an angle value is entered directly
in the angle value field 517, the angle select graphical control
515 adjusts to reflect the entered angle value. The color selection
519 is used to toggle between a color cross-section display 523 and
line-graph type cross-section display 523. When the color selection
519 is activated, the color scale displayed in the wafer display
area 201 is also used for the color cross-section display 523. The
scale limits synchronization selection 521 is used to synchronize
the vertical scale of the cross-section display 523 with the scale
limits as entered in the scale limits area 251.
[0077] The cross-section area 501 also includes a cross-section
statistics area 503. The cross-section statistics area 503 displays
a mean value 505, a 3-sigma value 507 (i.e., three times the
standard deviation about the mean), a range value 509 (i.e.,
difference between the maximum value and the minimum value), a
maximum value 511, and a minimum value 513, corresponding to a
currently selected and displayed cross-section as established by
the set of cross-section controls.
[0078] FIG. 6 is an illustration showing an isolated view of the
histogram area 601, in accordance with one embodiment of the
present invention. The histogram area 601 includes a histogram
display 605 and a histogram data source selection 603. The
histogram display 605 can be used to evaluate a Gaussian nature of
the currently selected and displayed wafer data values. The
histogram display 605 includes a bar plot of the data values
according to the current histogram data source selection 603. Each
bar of the bar plot represents one quarter of the standard
deviation about the mean. The histogram display 605 also shows an
ideal Gaussian distribution 607 based on the mean and standard
deviation of the current histogram data source selection 603. The
histogram data source selection 603 offers a drop-down menu that
allows the user to select a data source for generating the
histogram display 605. In one embodiment, the histogram data source
options include either the data values corresponding to the data
measurement sites or the data values corresponding to the
interpolation, where the interpolation is defined by the point
density select field 233 and the interpolation select field
235.
[0079] FIG. 7 is an illustration showing the GUI 10 when the
distribution analysis option is selected, in accordance with one
embodiment of the present invention. The distribution analysis
option can be selected with either the analysis select field 237 or
the azimuthal/radial distribution icon 121. Upon selection of the
distribution analysis option, the GUI 10 displays a radial/angular
distribution area 701.
[0080] FIG. 8 is an illustration showing an isolated view of the
radial/angular distribution area 701, in accordance with one
embodiment of the present invention. The radial/angular
distribution area 701 includes a radial distribution display 739,
an angular distribution display 741, a set of radial and angular
distribution display controls, a radial distribution statistics
area 703, and an angular distribution statistics area 715.
[0081] The radial distribution display 739 presents a plot of wafer
thickness from a distribution center to the edge of the wafer. A
vertical scale of the radial distribution display 739 corresponds
to the wafer thickness value. A horizontal scale of the radial
distribution display 739 corresponds to the distance from the
distribution center to the edge of the wafer. Through a
distribution select field 727 in the set of radial and angular
distribution display controls, the user can choose to set the
distribution center at either a geometric center of the wafer or a
center of mass of the wafer. Through a graphical distribution
control 733 in the set of radial and angular distribution display
controls, the user can select and drag a radial distribution
control line 745 to obtain a desired radial distribution for
analysis. The radial distribution control line 745 is defined to
pivot about the distribution center selected in the distribution
select field 727. Alternatively, the user can directly enter an
angle in the angle value field 731 to obtain a desired radial
distribution for analysis. If the radial distribution control line
745 is used, the corresponding angle is displayed in the angle
value field 731. If the angle value is entered directly in the
angle value field 731, the radial distribution control line 745
adjusts to reflect the entered angle value.
[0082] The angular distribution display 741 presents a plot of
wafer thickness around an annular region of the wafer. A vertical
scale of the angular distribution display 741 corresponds to the
wafer thickness value. A horizontal scale of the angular
distribution display 741 corresponds to an angular distance (i.e.,
0 degrees to 360 degrees) from a starting point about a
distribution center. Through the distribution select field 727, the
user can choose to set the distribution center at either the
geometric center of the wafer or the center of mass of the wafer.
Through the graphical distribution control 733, the user can select
and drag an annular distribution control line 743 to obtain a
desired annular distribution radius for analysis. The annular
distribution control line 743 is defined to be radially adjusted
about the distribution center selected in the distribution select
field 727. Alternatively, the user can directly enter a radius in
the radius value field 729 to obtain a desired annular distribution
for analysis. If the annular distribution control line 743 is used,
the corresponding radius is displayed in the radius value field
729. If the radius value is entered directly in the radius value
field 729, the annular distribution control line 743 adjusts to
reflect the entered radius value.
[0083] A color selection 735 is used to toggle between a color
version and a line-graph version of the radial distribution display
739 and the angular distribution display 741. When the color
selection 735 is activated, the color scale displayed in the wafer
display area 201 is also used for the color version of the radial
distribution display 739 and the angular distribution display 741.
Also, a scale limits synchronization selection 737 is used to
synchronize the vertical scales of both the radial distribution
display 739 and the angular distribution display 741 with the scale
limits as entered in the scale limits area 251.
[0084] The radial distribution statistics area 703 displays a mean
value 705, a 3-sigma value 707 (i.e., three times the standard
deviation about the mean), a range value 709 (i.e., difference
between the maximum value and the minimum value), a maximum value
711, and a minimum value 713, corresponding to a currently selected
and displayed radial distribution as established by the set of
radial and angular distribution display controls. Similarly, the
angular distribution statistics area 715 displays a mean value 717,
a 3-sigma value 719 (i.e., three times the standard deviation about
the mean), a range value 721 (i.e., difference between the maximum
value and the minimum value), a maximum value 723, and a minimum
value 725, corresponding to a currently selected and displayed
angular distribution as established by the set of radial and
angular distribution display controls. The radial distribution
display 739 and the radial distribution statistics area 703 are
useful for evaluating non-uniformities at a constant angle across
the wafer from either the wafer geometric center or the wafer
center of mass. The angular distribution display 741 and the
angular distribution statistics area 715 are useful for evaluating
non-uniformities at a constant distance from either the wafer
geometric center or the wafer center of mass.
[0085] FIG. 9 is an illustration showing the GUI 10 when the
XSEM/profile analysis option is selected (XSEM is a cross-section
scan electronic microscope image), in accordance with one
embodiment of the present invention. The XSEM/profile analysis
option can be selected with either the analysis select field 237 or
the XSEM/profile icon 123. Upon selection of the XSEM/profile
analysis option, the GUI 10 displays an XSEM/profile area 801.
[0086] FIG. 10 is an illustration showing an isolated view of the
XSEM/profile area 801, in accordance with one embodiment of the
present invention. An XSEM/profile display area 803 is provided
within the XSEM/profile area 801. The user can open an XSEM or
profile picture by using either the load data/XSEM icon 105 in the
menu bar 101 or an open file icon 823 in the XSEM/profile area 801.
A filename field 825 is provided to show a filename of the picture
currently displayed in the XSEM/profile display area 803. The
filename field 825 also offers a drop-down menu to allow the user
to quickly select another picture currently stored in memory to be
displayed in the XSEM/profile display area 803.
[0087] A zoom select field 817 is provided to allow the user to
select a size amplification of the picture currently displayed in
the XSEM/profile display area 803. In one embodiment, the zoom
select field 817 can be used to amplify the displayed picture up to
4 times its original size. A rotation select field 819 is provided
to allow the user to rotate the picture currently displayed in the
XSEM/profile display area 803. The rotation select field 819 is
useful for correcting angle errors that may have occurred during a
capture of the currently displayed picture. A drift select field
821 is provided to allow the user to correct distortions that may
have occurred during a capture of the currently displayed picture.
For example, the drift select field 821 is useful for correcting
distortion caused by stage movement during electron beam scanning
when capturing the currently displayed picture. A horizontal slider
805 and a vertical slider 807 are provided to allow a user to shift
the currently displayed picture left, right, up, and down. The
horizontal slider 805 and the vertical slider 807 are useful for
centering a target feature when the zoom is amplifying the size of
the currently displayed picture. A reset XSEM settings button 827
is provided to allow the user to reset the horizontal slider 805,
the vertical slider 807, the zoom select field 817, the rotation
select field 819, and the drift select field 821 to default values.
A remove XSEM button 829 is provided to allow the user to remove
the currently displayed picture from memory. A remove all button
831 is provided to allow the user to remove all pictures currently
stored in memory to be displayed in the XSEM/profile display area
803. A show profile selection 833 is provided to allow the user to
quickly show and remove a currently selected profile picture. A
show XSEM selection 835 is provided to allow the user to quickly
show and remove a currently selected XSEM picture. A show main axes
selection 837 is provided to allow the user to display and remove a
horizontal axis 802 and a vertical axis 804 from the XSEM/profile
display area 803.
[0088] A first calibration slider 809 and a second calibration
slider 811 are used to calibrate a scale for measuring distances
within the XSEM/profile display area 803. A calibration distance
select field 813 is provided to allow the user to assign a value to
a distance between the first calibration slider 809 and the second
calibration slider 811. After calibration, the user can position
the mouse pointer within the XSEM/profile display area 803 to
obtain a set of cartesian coordinates corresponding to the mouse
pointer position relative to the horizontal axis and vertical axis
as presented by the show main axes selection 837. The set of
cartesian coordinates are displayed in a label area 806 next to the
mouse pointer position. The user can click the mouse pointer to
select a starting location of a distance measurement. Keeping the
mouse pointer pressed, the user can move the mouse pointer to an
ending location of the distance measurement. The label area 806
displayed next to the mouse pointer position will display a
horizontal distance value, a vertical distance value, a
straight-line distance value, and an angle value between the
straight-line distance direction and the horizontal and vertical
axes. The calculated distances displayed in the label area 806
correspond to the calibration established using the first
calibration slider 809, the second calibration slider 811, and the
calibration distance select field 813. Additionally, the user can
drop a marker set of lines at a desired location in the
XSEM/profile display area 803 by double-clicking the mouse pointer
at the desired location. In one embodiment, the XSEM/profile
analysis option allow the user to overlay a profile 808 created
using profile parameter results over a XSEM picture displayed in
the XSEM/profile display area 803. As previously mentioned, the
profile 808 display can be toggled on and off using the show
profile selection 833.
[0089] FIG. 11 is an illustration showing the GUI 10 when a series
analysis option is selected, in accordance with one embodiment of
the present invention. The series analysis option can be selected
with the series analysis icon 117. Upon selection of the series
analysis option, the GUI 10 displays a series plot area 901.
[0090] FIG. 12 is an illustration showing an isolated view of the
series plot area 901, in accordance with one embodiment of the
present invention. As previously discussed with respect to the
wafer collection management icon 115, a wafer collection represents
a collection of multiple data sets for a number of wafers that have
a common pattern of data measurement sites. Depending on the wafer
processes run, the wafer collection could represent a process
library, a statistical process control (SPC) series, or a tool
matching series, among others. In the process library, the
collection of multiple data sets represents results in different
process conditions. In the SPC series, the collection of multiple
data sets represents results obtained for the same process in the
same tool at different times. In the tool matching series, the
collection of multiple data sets represents results of the same
process in different tools.
[0091] The data set for each wafer in the wafer collection can be
separately displayed and analyzed. Also, spatially resolved
statistics can be calculated for the collection of multiple data
sets. In one embodiment, an average wafer data set is calculated
based on the collection of multiple data sets. The average wafer
data set can be displayed and analyzed. Also, a 3-sigma value wafer
data set, a range value wafer data set, a maximum value data set,
and a minimum value data set is calculated based on the collection
of multiple data sets and can be displayed and analyzed.
[0092] The series plot area 901 displays information related to the
currently loaded wafer collection. The series plot area 901
includes a series plot display 903 of a number of data values 905
for each wafer in the wafer collection. The series plot display 903
is rendered according to a graph style selection 907, a quantity
selection 909, a data source selection 911, and a series order
selection 913. The series plot display 903 presents a plot of the
quantity selection 909 for each wafer in the wafer collection. The
quantity selection 909 offers a drop-down menu to allow the user to
select either a mean value, a 3-sigma value (i.e., three times the
standard deviation about the mean), a range value (i.e., difference
between the maximum value and the minimum value), a maximum value,
or a minimum value. The series order selection 913 offers a
drop-down menu to allow the user to select either a wafer number or
a wafer date for ordering of the wafers in the series plot display
903. The graph style selection 907 offers a drop-down menu to allow
the user to select either a lines+circles format, a lines format, a
circles format, or a bars format for the series plot display 903.
Furthermore, the data source selection 911 offers a drop-down menu
to allow the user to select a group of data points for use in
calculating the value selected in the quantity selection 909. In
one embodiment, the group of data points can be either all wafer
data points, a spatial black region in the spatial statistics area
301, or a spatial white region in the spatial statistics area 301.
The spatial black and white regions in the spatial statistics area
301 are described below with respect to the spatial statistics area
301.
[0093] A show control limits selection 931 is provided to allow the
user to display a control limit on the series plot display 903. A
control limit selection 915 offers the user a drop-down menu for
selecting the control limit. In one embodiment, control limit
options include 1.5, 2, 2.5, 3, 3.5, and 4 sigma (i.e., standard
deviations about the mean). A show moving average selection 929 is
also provided to allow the user to display moving averages of the
mean and the selected control limit about the mean, on the series
plot display 903.
[0094] In one embodiment, the user can select a wafer from the
series plot display 903 and have the corresponding wafer data set
be displayed in the wafer display window 215. In another
embodiment, the user can activate a movie button 933 in the series
plot area 901 to cause each wafer data set in the wafer collection
to be automatically and sequentially displayed in the wafer display
window 215.
[0095] The series plot area 901 also includes a series statistics
area 917. The series statistics area 917 displays a mean value 919,
a 3-sigma value 921 (i.e., three times the standard deviation about
the mean), a range value 923 (i.e., difference between the maximum
value and the minimum value), a maximum value 925, and a minimum
value 927, corresponding to the currently loaded wafer collection
and data source selection 911.
[0096] FIG. 13 is an illustration showing an isolated view of the
spatial statistics area 301, in accordance with one embodiment of
the present invention. The spatial statistics area 301 includes a
spatial control 303 for graphically selecting an area of the wafer
to be statistically analyzed. A spatial distribution selection 305
offers the user a drop-down menu for selecting a type of spatial
distribution to be used in the spatial control 303. In one
embodiment, a center-to-edge spatial distribution is offered to the
user. Selection of the center-to-edge spatial distribution allows
the user to select and drag a control line 335 to obtain a desired
center-to-edge area for analysis. The center-to-edge area is
defined to extend outward from the center of the wafer to the
control line 335 position. The center-to-edge area is called a
black region for statistical analysis purposes. A balance of the
wafer area beyond the center-to-edge area is called a white region
for statistical analysis purposes. The center-to-edge embodiment
further includes a radius display field 307 for displaying a radial
distance from the wafer center at which the control line 335 is
positioned.
[0097] In general, a set of data measurement points z.sub.i are
provided at locations (x.sub.i, y.sub.i) across a wafer defined by
x.sup.2+y.sup.2<=R.sup.2, where R is the radius of the wafer.
Whole wafer statistics are based on inclusion of all points
z.sub.i. As an alternative, the spatial control 303 allows the user
to obtain statistics for sub-regions (i.e., the black region and
the white region) of the wafer. Statistics for each of the
sub-regions are calculated based on inclusion of only the data
points z.sub.i within the respective sub-region. Description of the
spatial control 303 and its use to obtain statistics for
sub-regions of the wafer is provided in co-pending patent
application entitled "User Interface for Quantifying Wafer
Non-Uniformities and Graphically Explore Significance", having U.S.
patent application Ser. No. 10/331,194 [Docket LAM2P388], which is
incorporated herein by reference.
[0098] The spatial statistics area 301 further includes a black
region statistics area 309. The black region statistics area 309
displays a mean value 311, a 3-sigma value 313 (i.e., three times
the standard deviation about the mean), a range value 315 (i.e.,
difference between the maximum value and the minimum value), a
maximum value 317, and a minimum value 319, corresponding to the
black region associated with a currently selected center-to-edge
area. Additionally, the black region statistics area 309 includes a
sites display 321 for presenting a number of data measurement sites
included in the selected black region. The statistics presented in
the black region statistics area 309 are automatically recalculated
as the user adjusts the control line 335 defining the selected
center-to-edge area.
[0099] The spatial statistics area 301 further includes a white
region statistics area 323. The white region statistics area 323
displays a mean value 325, a 3-sigma value 327 (i.e., three times
the standard deviation about the mean), a range value 329 (i.e.,
difference between the maximum value and the minimum value), a
maximum value 331, and a minimum value 333, corresponding to the
white region associated with a currently selected center-to-edge
area. Additionally, the white region statistics area 323 includes a
sites display 335 for presenting a number of data measurement sites
included in the selected white region. The statistics presented in
the white region statistics area 323 are automatically recalculated
as the user adjusts the control line 335 defining the selected
center-to-edge area.
[0100] The spatial statistics area 301 further includes a center of
mass area 343. The center of mass area 343 displays a set of polar
coordinates corresponding to the center of mass of the wafer. The
set of polar coordinates includes a radius display 345 and an angle
display 347 for identifying the center of mass location of the
wafer. A center of mass indicator 341 is also displayed in the
spatial control 303. Calculation of the center of mass and
description of its usefulness for analysis is provided in
co-pending patent application entitled "System and Method for
Quantifying Uniformity Patterns for tool Development and
Monitoring", having U.S. patent application Ser. No. 10/327,233
[Docket LAM2P385], which is incorporated herein by reference.
[0101] FIG. 14 is an illustration showing an isolated view of the
spatial statistics area 301 with a side-to-side spatial
distribution selection, in accordance with one embodiment of the
present invention. In the embodiment of FIG. 14, the side-to-side
spatial distribution is selected in the spatial distribution
selection 305. Selection of the side-to-side spatial distribution
changes the spatial control 303 to a side-to-side control. The
side-to-side control allows the user to select and drag a control
line 337 to obtain a desired area for analysis. The side-to-side
area is defined to cover one-half of the wafer with a boundary
extending through the center of the wafer. By adjusting the control
line 337, the user can rotate the side-to-side area about the
center of the wafer. Values presented in the black region
statistics area 309 correspond to the selected side-to-side area.
Values presented in the white region statistics area 323 correspond
to the complement of the selected side-to-side area. The
side-to-side embodiment further includes an angle display field 331
for displaying an angle about the wafer center at which the control
line 337 is positioned. Also in the side-to-side embodiment, the
center of mass area 343 displays the set of polar coordinates
corresponding to the center of mass of the wafer.
[0102] FIG. 15 is an illustration showing an isolated view of the
spatial statistics area 301 with an annular spatial distribution
selection, in accordance with one embodiment of the present
invention. In the embodiment of FIG. 15, the annular spatial
distribution is selected in the spatial distribution selection 305.
Selection of the annular spatial distribution changes the spatial
control 303 to an annular control. The annular control allows the
user to select and drag a control line 339 to obtain a desired
annular area for analysis. The annular area is defined as a ring
about the center of the wafer. By adjusting the control line 339,
the user can move the annular area toward or away from the center
of the wafer. Values presented in the black region statistics area
309 correspond to the selected annular area. Values presented in
the white region statistics area 323 correspond to the complement
of the selected annular area. The annular embodiment further
includes an radius display field 333 for displaying a radial
distance from the wafer center at which the control line 339 is
positioned. Also in the annular embodiment, the center of mass area
343 displays the set of polar coordinates corresponding to the
center of mass of the wafer.
[0103] With the above embodiments in mind, it should be understood
that the invention may employ various computer-implemented
operations involving data stored in computer systems. These
operations are those requiring physical manipulation of physical
quantities. Usually, though not necessarily, these quantities take
the form of electrical or magnetic signals capable of being stored,
transferred, combined, compared, and otherwise manipulated.
Further, the manipulations performed are often referred to in
terms, such as producing, identifying, determining, or
comparing.
[0104] Any of the operations described herein that form part of the
invention are useful machine operations. The invention also relates
to a device or an apparatus for performing these operations. The
apparatus may be specially constructed for the required purposes,
or it may be a general-purpose computer selectively activated or
configured by a computer program stored in the computer. In
particular, various general-purpose machines may be used with
computer programs written in accordance with the teachings herein,
or it may be more convenient to construct a more specialized
apparatus to perform the required operations.
[0105] The invention can also be embodied as computer readable code
on a computer readable medium. The computer readable medium is any
data storage device that can store data which can be thereafter be
read by a computer system. Examples of the computer readable medium
include hard drives, network attached storage (NAS), read-only
memory, random-access memory, CD-ROMs, CD-Rs, CD-RWs, magnetic
tapes, and other optical and non-optical data storage devices. The
computer readable medium can also be distributed over a network
coupled computer systems so that the computer readable code is
stored and executed in a distributed fashion.
[0106] While this invention has been described in terms of several
embodiments, it will be appreciated that those skilled in the art
upon reading the preceding specifications and studying the drawings
will realize various alterations, additions, permutations and
equivalents thereof. It is therefore intended that the present
invention includes all such alterations, additions, permutations,
and equivalents as fall within the true spirit and scope of the
invention.
* * * * *