U.S. patent application number 10/675798 was filed with the patent office on 2004-06-24 for gallium nitride materials and methods.
This patent application is currently assigned to Nitronex Corporation. Invention is credited to Gehrke, Thomas, Linthicum, Kevin J., Piner, Edwin L., Weeks, T. Warren JR..
Application Number | 20040119067 10/675798 |
Document ID | / |
Family ID | 24962082 |
Filed Date | 2004-06-24 |
United States Patent
Application |
20040119067 |
Kind Code |
A1 |
Weeks, T. Warren JR. ; et
al. |
June 24, 2004 |
Gallium nitride materials and methods
Abstract
The invention provides semiconductor materials including a
gallium nitride material layer formed on a silicon substrate and
methods to form the semiconductor materials. The semiconductor
materials include a transition layer formed between the silicon
substrate and the gallium nitride material layer. The transition
layer is compositionally-graded to lower stresses in the gallium
nitride material layer which can result from differences in thermal
expansion rates between the gallium nitride material and the
substrate. The lowering of stresses in the gallium nitride material
layer reduces the tendency of cracks to form. Thus, the invention
enables the production of semiconductor materials including gallium
nitride material layers having few or no cracks. The semiconductor
materials may be used in a number of microelectronic and optical
applications.
Inventors: |
Weeks, T. Warren JR.;
(Raleigh, NC) ; Piner, Edwin L.; (Cary, NC)
; Gehrke, Thomas; (Apex, NC) ; Linthicum, Kevin
J.; (Cary, NC) |
Correspondence
Address: |
Robert H. Walat
Wolf, Greenfield & Sacks, P.C.
600 Atlantic Avenue
Boston
MA
02210
US
|
Assignee: |
Nitronex Corporation
616 Hutton Street
Raleigh
NC
27606
|
Family ID: |
24962082 |
Appl. No.: |
10/675798 |
Filed: |
September 30, 2003 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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|
10675798 |
Sep 30, 2003 |
|
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09736972 |
Dec 14, 2000 |
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6649287 |
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Current U.S.
Class: |
257/40 ;
257/E21.125; 257/E21.127 |
Current CPC
Class: |
H01L 21/0254 20130101;
H01L 29/201 20130101; H01L 33/04 20130101; H01L 21/02598 20130101;
H01L 29/04 20130101; Y10T 428/265 20150115; C30B 25/18 20130101;
C30B 29/06 20130101; H01L 21/0243 20130101; H01L 29/7787 20130101;
H01L 33/32 20130101; H01L 33/06 20130101; H01L 29/0649 20130101;
C30B 25/02 20130101; C30B 23/025 20130101; C30B 25/183 20130101;
H01L 29/2003 20130101; Y10T 428/24942 20150115; H01L 29/205
20130101; H01L 29/78 20130101; H01L 29/045 20130101; H01L 29/155
20130101; H01L 21/0251 20130101; H01L 33/0075 20130101; C30B 23/02
20130101; H01L 21/02458 20130101; H01L 21/0262 20130101; H01L
33/007 20130101; H01L 33/12 20130101; H01L 33/0066 20130101; H01L
21/02422 20130101; H01L 29/225 20130101; H01L 29/66462 20130101;
Y10T 428/26 20150115; H01L 21/02433 20130101; H01L 21/02507
20130101; C30B 29/406 20130101; C30B 29/403 20130101; C30B 29/68
20130101; H01L 21/0245 20130101; H01L 21/02381 20130101 |
Class at
Publication: |
257/040 |
International
Class: |
H01L 035/24 |
Claims
What is claimed is:
1. A semiconductor material comprising: a silicon substrate; a
compositionally-graded transition layer formed over the silicon
substrate; and a gallium nitride material layer formed over the
transition layer.
2. The semiconductor material of claim 1, wherein the composition
of the transition layer is graded continuously across the thickness
of the layer.
3. The semiconductor material of claim 1, wherein the composition
of the transition layer is graded discontinuously across the
thickness of the layer.
4. The semiconductor material of claim 1, wherein the transition
layer comprises an alloy of gallium nitride selected from the group
consisting of Al.sub.xIn.sub.yGa.sub.(1-x-y)N,
In.sub.yGa.sub.(1-y)N, and Al.sub.xGa.sub.(1-x)N.
5. The semiconductor material of claim 4, wherein the concentration
of gallium in the transition layer is graded.
6. The semiconductor material of claim 4, wherein x and/or y is
varied from a first value at a back surface of the transition layer
to a second value at a front surface of the transition layer,
wherein the back surface is closer to the substrate than the front
surface.
7. The semiconductor material of claim 6, wherein the sum of the
value of x and the value of y at the back surface is greater than
0.4.
8. The semiconductor material of claim 6, wherein the sum of the
value of x and the value of y at the back surface is greater than
0.8.
9. The semiconductor material of claim 6, wherein the transition
layer comprises Al.sub.xIn.sub.(1-x)N at the back surface of the
transition layer in contact with the silicon substrate.
10. The semiconductor material of claim 6, wherein the sum of the
value of x and the value of y at the front surface is less than
0.3.
11. The semiconductor material of claim 6, wherein the transition
layer comprises GaN at a front surface of the transition layer in
contact with the gallium nitride material layer and is free of
gallium at a back surface of the transition layer in contact with
the substrate.
12. The semiconductor material of claim 4, wherein the transition
layer comprises Al.sub.xGa.sub.(1-x)N.
13. The semiconductor material of claim 4, wherein the value of x
decreases in a direction away from the silicon substrate.
14. The semiconductor material of claim 4, wherein the value of y
remains constant across the transition layer.
15. The semiconductor material of claim 1, wherein the transition
layer comprises a superlattice.
16. The semiconductor material of claim 15, wherein the
superlattice includes a series of alternating
Al.sub.xIn.sub.yGa.sub.(1-x-y)N and Al.sub.aIn.sub.bGa.sub.(1-a-b)N
layers.
17. The semiconductor material of claim 16, wherein the of value of
x, y, a, and b are constant across respective layers and the
thickness of the respective layers is varied across the transition
layer.
18. The semiconductor material of claim 1, wherein the transition
layer has a thickness between about 0.03 micron and about 20
microns.
19. The semiconductor material of claim 1, wherein the gallium
nitride material layer comprises GaN.
20. The semiconductor material of claim 1, wherein the gallium
nitride material layer comprises
Al.sub.xIn.sub.yGa.sub.(1-x-y)N.
21. The semiconductor material of claim 1, wherein the gallium
nitride material layer has a thickness of greater than 0.75
micron.
22. The semiconductor material of claim 1, wherein the
semiconductor material forms a semiconductor device.
23. The semiconductor material of claim 22, wherein the
semiconductor material forms an LED.
24. The semiconductor material of claim 22, wherein the
semiconductor material forms a laser diode.
25. The semiconductor material of claim 22, wherein the
semiconductor material forms a FET.
26. The semiconductor material of claim 1, wherein the gallium
nitride material layer has a crack level of less than 0.005
.mu.m/.mu.m.sup.2.
27. The semiconductor material of claim 1, wherein the gallium
nitride material layer has a crack level of less than 0.001
.mu.m/.mu.m.sup.2
28. The semiconductor material of claim 1, wherein the gallium
nitride material layer is substantially free of cracks.
29. The semiconductor material of claim 1, wherein the gallium
nitride material layer is monocrystalline.
30. The semiconductor material of claim 1, wherein the silicon
substrate has a thickness of greater than 250 micron.
31. The semiconductor material of claim 1, wherein the silicon
substrate is textured.
32. The semiconductor material of claim 1, further comprising an
intermediate layer formed over the silicon substrate and under the
transition layer.
33. The semiconductor material of claim 1, wherein the intermediate
layer has a constant composition.
34. The semiconductor material of claim 1, wherein the intermediate
layer comprises an alloy of gallium nitride selected from the group
consisting of Al.sub.xIn.sub.yGa.sub.(1-x-y)N,
In.sub.yGa.sub.(1-y)N, and Al.sub.xGa.sub.(1-x)N.
35. The semiconductor material of claim 1, wherein the silicon
substrate comprises a silicon wafer.
36. A semiconductor material comprising: a silicon substrate; a
gallium nitride material layer formed over the silicon substrate,
the gallium nitride material layer having a crack level of less
than 0.005 .mu.m/.mu.m.sup.2.
37. The semiconductor material of claim 36, wherein the gallium
nitride material layer comprises GaN.
38. The semiconductor material of claim 36, wherein the gallium
nitride material layer comprises an alloy of gallium nitride
selected from the group consisting of
Al.sub.xIn.sub.yGa.sub.(1-x-y)N, In.sub.yGa.sub.(1-y)N, and
Al.sub.xGa.sub.(1-x)N.
39. The semiconductor material of claim 36, wherein the gallium
nitride material layer has a thickness of greater than 0.5
micron.
40. The semiconductor material of claim 36, wherein the gallium
nitride material layer has a thickness of greater than 1.0
micron.
41. The semiconductor material of claim 36, wherein the gallium
nitride material layer has a crack level of less than 0.001
.mu.m/.mu.m.sup.2.
42. The semiconductor material of claim 36, wherein the gallium
nitride material layer is substantially free of cracks.
43. The semiconductor material of claim 36, wherein the gallium
nitride material layer is monocrystalline.
44. The semiconductor material of claim 36, wherein the silicon
substrate comprises a silicon wafer.
45. A semiconductor structure comprising: a silicon substrate; and
a gallium nitride material layer formed over the silicon substrate
and having a thickness of greater than 0.5 micron, wherein the
semiconductor structure forms a semiconductor device.
46. The semiconductor structure of claim 45, wherein the gallium
nitride material layer has a thickness of greater than 1.0
micron.
47. The semiconductor material of claim 45, wherein the silicon
substrate comprises a silicon wafer.
48. The semiconductor structure of claim 45, wherein the
semiconductor structure forms an LED.
49. The semiconductor structure of claim 45, wherein the
semiconductor structure forms a laser diode.
50. The semiconductor structure of claim 45, wherein the
semiconductor structure forms a FET.
51. The semiconductor structure of claim 45, wherein the gallium
nitride material layer has a crack level of less than 0.005
.mu.m/.mu.m.sup.2.
52. The semiconductor structure of claim 45, wherein the gallium
nitride material layer has a crack level of less than 0.001
.mu.m/.mu.m.sup.2.
53. The semiconductor structure of claim 45, wherein the gallium
nitride material layer is substantially free of cracks.
54. A method of producing a semiconductor material comprising:
forming a compositionally-graded transition layer over a silicon
substrate; and forming a gallium nitride material layer over the
transition layer.
55. The method of claim 54, wherein the composition of the
transition layer is graded continuously across the thickness of the
layer.
56. The method of claim 54, wherein the transition layer comprises
an alloy of gallium nitride selected from the group consisting of
Al.sub.xIn.sub.yGa.sub.(1-x-y)N, In.sub.yGa.sub.(1-y)N, and
Al.sub.xGa.sub.(1-x)N.
57. The method of claim 54, wherein the concentration of gallium in
the transition layer is graded.
58. The method of claim 56, wherein the value of x decreases in a
direction away from the silicon substrate.
59. The method of claim 56, wherein the transition layer comprises
Al.sub.xGa.sub.(1-x)N.
60. The method of claim 54, wherein the transition layer comprises
a superlattice including a series of alternating
Al.sub.xIn.sub.yGa.sub.(1-- x-y)N/Al.sub.aIn.sub.bGa.sub.(1-a-b)N
layers.
61. The method of claim 54, wherein the gallium nitride material
layer comprises GaN.
62. The method of claim 54, wherein the gallium nitride material
layer comprises Al.sub.xIn.sub.yGa.sub.(1-x-y)N.
63. The method of claim 54, further comprising processing the
semiconductor material to form at least one semiconductor
device.
64. The method of claim 54, wherein the gallium nitride material
layer has a crack level of less than 0.005 .mu.m/.mu.m.sup.2.
65. The method of claim 54, wherein the gallium nitride material
layer has a crack level of less than 0.001 .mu.m/.mu.m.sup.2.
66. The method of claim 54, wherein the gallium nitride material
layer is substantially free of cracks.
67. The method of claim 54, wherein the gallium nitride material
layer is monocrystalline.
68. The method of claim 54, further comprising forming an
intermediate layer over the silicon substrate and under the
transition layer.
69. A method of producing a semiconductor material comprising:
forming a gallium nitride material layer formed over a silicon
substrate, the gallium nitride material layer having a crack level
of less than 0.005 .mu.m/.mu.m.sup.2
70. The method of claim 69, wherein the gallium nitride material
layer comprises GaN.
71. The method of claim 69, wherein the gallium nitride material
layer has a thickness of greater than 1.0 micron.
72. The method of claim 69, wherein the gallium nitride material
layer has a crack level of less than 0.001 .mu.m/.mu.m.sup.2.
73. The method of claim 69, wherein the gallium nitride material
layer is substantially free of cracks.
74. The method of claim 69, wherein the gallium nitride material
layer is monocrystalline.
75. A method of forming a semiconductor structure comprising:
forming a semiconductor structure comprising a silicon substrate,
and a gallium nitride material layer formed over the silicon
substrate and having a thickness of greater than 0.5 micron.
76. The method of claim 75, wherein the gallium nitride material
layer has a thickness of greater than 1.0 micron.
77. The method of claim 75, wherein the gallium nitride material
layer has a thickness of greater than 2.0 microns.
78. The method of claim 75, wherein the semiconductor structure
forms an LED.
79. The method of claim 75, wherein the semiconductor structure
forms a laser diode.
80. The method of claim 75, wherein the semiconductor structure
forms a FET.
81. The method of claim 75, wherein the gallium nitride material
layer has a crack level of less than 0.005 .mu.m/.mu.m.sup.2.
82. The method of claim 75, wherein the gallium nitride material
layer has a crack level of less than 0.001 .mu.m/.mu.m.sup.2.
83. The method of claim 75, wherein the gallium nitride material
layer is substantially free of cracks.
84. A semiconductor material comprising: a silicon (100) substrate;
and a gallium nitride material layer having a Wurtzite structure
formed over the silicon substrate.
85. The semiconductor material of claim 84, further comprising a
compositionally-graded transition layer formed between the silicon
(100) substrate and the gallium nitride material layer.
Description
RELATED APPLICATIONS
[0001] This application is a continuation of U.S. patent
application Ser. No. 09/736,972, filed Dec. 14, 2000, and entitled
"Gallium Nitride Materials and Methods," the disclosure of which is
incorporated herein by reference.
FIELD OF INVENTION
[0002] The invention relates generally to semiconductor materials
and, more particularly, to gallium nitride materials and methods of
producing gallium nitride materials.
BACKGROUND OF INVENTION
[0003] Gallium nitride materials include gallium nitride (GaN) and
its alloys such as aluminum gallium nitride (AlGaN), indium gallium
nitride (InGaN), and aluminum indium gallium nitride (AlInGaN).
These materials are semiconductor compounds that have a relatively
wide, direct bandgap which permits highly energetic electronic
transitions to occur. Such electronic transitions can result in
gallium nitride materials having a number of attractive properties
including the ability to efficiently emit blue light, the ability
to transmit signals at high frequency, and others. Accordingly,
gallium nitride materials are being widely investigated in many
microelectronic applications such as transistors, field emitters,
and optoelectronic devices.
[0004] In many applications, gallium nitride materials are grown on
a substrate. However, differences in the properties between gallium
nitride materials and substrates can lead to difficulties in
growing layers suitable for many applications. For example, gallium
nitride (GaN) has a different thermal expansion coefficient (i.e.,
thermal expansion rate) than many substrate materials including
sapphire, silicon carbide, and silicon. This difference in thermal
expansion can lead to cracking of a gallium nitride layer deposited
on such substrates when the structure is cooled, for example,
during processing. The cracking phenomena can prevent gallium
nitride materials from being suitable for use in many applications.
Cracking can be particularly problematic for relatively thick
(e.g., >0.5 micron) gallium nitride layers.
[0005] Gallium nitride (GaN) also has a different lattice constant
than most substrate materials. The difference in lattice constant
may lead to the formation of defects in gallium nitride material
layers deposited on substrates. Such defects can impair the
performance of devices formed using the gallium nitride material
layers.
[0006] Prior art techniques have been developed to address crack
formation and defect formation in gallium nitride materials
deposited on sapphire substrates and silicon carbide substrates.
Such techniques, for example, may involve depositing one or more
buffer layers on the substrate and, then, depositing the gallium
nitride material on the buffer layer(s).
SUMMARY OF INVENTION
[0007] The invention provides semiconductor materials including a
gallium nitride material layer formed on a silicon substrate and
methods to form the semiconductor materials. The semiconductor
materials include a transition layer formed between the silicon
substrate and the gallium nitride material layer. The transition
layer is compositionally-graded to lower stresses in the gallium
nitride material layer which can result from differences in thermal
expansion rates between the gallium nitride material and the
substrate. The lowering of stresses in the gallium nitride material
layer reduces the tendency of cracks to form which enables the
production of semiconductor materials including gallium nitride
material layers having few or no cracks. The semiconductor
materials may be used in a number of microelectronic and optical
applications.
[0008] The invention has overcome the problem of growing gallium
nitride materials having few or no cracks on silicon substrates
which, due to the large differences in both thermal expansion rate
and lattice constant between gallium nitride materials (e.g., GaN)
and silicon, is considerably more challenging than on other types
of substrates (e.g., SiC and sapphire).
[0009] In one aspect, the invention provides a semiconductor
material. The material includes a silicon substrate and a
compositionally-graded transition layer formed over the silicon
substrate. The material further includes a gallium nitride material
layer formed over the transition layer.
[0010] In another aspect, the invention provides a semiconductor
material. The semiconductor material includes a silicon substrate
and a gallium nitride material layer formed over the silicon
substrate. The gallium nitride material layer has a crack level of
less than 0.005 m/.mu.m.sup.2.
[0011] In another aspect, the invention provides a semiconductor
structure. The semiconductor structure includes a silicon
substrate, and a gallium nitride material layer formed over the
silicon substrate. The gallium nitride material layer has a
thickness of greater than 0.5 micron. The semiconductor structure
forms a semiconductor device.
[0012] In another aspect, the invention provides a method of
producing a semiconductor material. The method includes the steps
of forming a compositionally-graded transition layer over a silicon
substrate, and forming a gallium nitride material layer over the
transition layer.
[0013] In another aspect, the invention provides a method of
producing a semiconductor material. The method includes forming a
gallium nitride material layer formed over a silicon substrate. The
gallium nitride material layer has a crack level of less than 0.005
.mu.m/.mu.m.sup.2
[0014] In another aspect, the invention provides a method of
forming a semiconductor structure. The method includes forming a
semiconductor structure comprising a silicon substrate, and a
gallium nitride material layer formed over the silicon substrate.
The gallium nitride material layer has a thickness of greater than
0.5 micron.
[0015] In another aspect, the invention provides a semiconductor
material. The semiconductor material comprises a silicon (100)
substrate and a gallium nitride material layer having a Wurtzite
structure formed over the silicon substrate.
[0016] Other advantages, aspects, and features of the invention
will become apparent from the following detailed description of the
invention when considered in conjunction with the accompanying
drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0017] FIG. 1 illustrates a semiconductor material including a
compositionally-graded transition layer according to one embodiment
of the present invention.
[0018] FIGS. 2A to 21 are exemplary profiles of the concentration
of an element as a function of the thickness across the
compositionally-graded transition layer.
[0019] FIGS. 3A and 3B illustrate a semiconductor material that
includes a superlattice transition layer according to another
embodiment of the present invention.
[0020] FIGS. 4A and 4B are exemplary profiles of the concentration
of an element as a function of the thickness of the transition
layers in the semiconductor materials of FIGS. 3A and 3B,
respectively.
[0021] FIG. 5 illustrates a textured substrate used to form the
semiconductor material according to one embodiment of the present
invention.
[0022] FIG. 6 illustrates a semiconductor material including an
intermediate layer between the substrate and the transition layer
according to another embodiment of the present invention.
[0023] FIG. 7 illustrates an LED formed from the semiconductor
material according to another embodiment of the present
invention.
[0024] FIG. 8 illustrates a laser diode formed from the
semiconductor material according to another embodiment of the
present invention.
[0025] FIG. 9 illustrates a FET formed from the semiconductor
material according to another embodiment of the present
invention.
[0026] FIG. 10 is a micrograph of the surface of a gallium nitride
layer formed on a silicon substrate with a transition layer as
described in Example 1.
[0027] FIG. 11 is a micrograph of the surface of a gallium nitride
layer formed on a silicon substrate without a transition layer as
described in comparative Example 2.
DETAILED DESCRIPTION OF THE INVENTION
[0028] The invention provides semiconductor materials including a
gallium nitride material layer and a process to produce the
semiconductor materials. As used herein, the phrase "gallium
nitride material" refers to gallium nitride and any of its alloys,
such as aluminum gallium nitride (Al.sub.xGa.sub.(1-x)N), indium
gallium nitride (In.sub.yGa.sub.(1-y)N), aluminum indium gallium
nitride (Al.sub.xIn.sub.yGa.sub.(1-x-y)N), gallium arsenide
phosporide nitride (GaAs.sub.aP.sub.bN.sub.(1-a-b)), aluminum
indium gallium arsenide phosporide nitride
(Al.sub.xIn.sub.yGa.sub.(1-x-y)As.sub.aP.sub.bN.sub.(1- -a-b)),
amongst others. Typically, when present, arsenic and/or phosphorous
are at low concentrations (i.e., less than 5 weight percent).
[0029] Referring to FIG. 1, a semiconductor material 10 according
to one embodiment of the invention is shown. Semiconductor material
10 includes a transition layer 12 formed over a silicon substrate
14 and a gallium nitride material layer 16 formed over the
transition layer. As described further below, transition layer 12
is compositionally-graded to reduce internal stresses within
gallium nitride material layer 16 that can result from differences
between the thermal expansion rates of substrate 14 and the gallium
nitride material layer. The internal stresses may arise, for
example, when semiconductor material 10 is cooled after the
deposition of gallium nitride material layer 16 and substrate 14
contracts more rapidly than the gallium nitride material layer. As
a result of the reduced internal stresses, gallium nitride material
layer 16 can be formed with a low crack level making semiconductor
material 10 suitable for use in a number of applications including
FETs, LEDs, laser diodes, and the like.
[0030] It should be understood that when a layer is referred to as
being "on" or "over" another layer or substrate, it can be directly
on the layer or substrate, or an intervening layer may also be
present. It should also be understood that when a layer is referred
to as being "on" or "over" another layer or substrate, it may cover
the entire layer or substrate, or a portion of the layer or
substrate.
[0031] As used herein, the term "compositionally-graded layer"
refers to a layer having a composition that varies across at least
a portion of the thickness of the layer. Thus, transition layer 12
includes at least two different compositions at different depths
within the layer. As described further below, the composition of
transition layer 12 can be varied in a number of ways. It is
generally advantageous to vary the composition of transition layer
12 in a manner that provides sufficient strain relief to limit or
prevent the formation of cracks in gallium nitride material layer
16.
[0032] According to one set of embodiments, transition layer 12 is
composed of an alloy of gallium nitride such as
Al.sub.xIn.sub.yGa.sub.(1- -x-y)N, Al.sub.xGa.sub.(1-x)N, and
In.sub.yGa .sub.(1-y)N. It should be understood, however, that
transition layers having other compositions may also be used. In
embodiments which utilize alloys of gallium nitride, the
concentration of at least one of the elements (e.g., Ga, Al, In) of
the alloy is typically varied across at least a portion of the
thickness of the transition layer. When transition layer 12 has an
Al.sub.xIn.sub.yGa.sub.(1-x-y)N composition, x and/or y is varied.
When transition layer 12 has a Al.sub.xGa.sub.(1-x)N composition, x
is varied. When transition layer 12 has a In.sub.yGa.sub.(1-y)N
composition, y is varied.
[0033] In certain preferred embodiments, it is desirable for
transition layer 12 to have a low gallium concentration at back
surface 18 and a high gallium concentration at front surface 20. It
has been found that such transition layers are particularly
effective in relieving internal stresses within gallium nitride
material layer 16. Decreasing the gallium concentration of a
gallium nitride alloy transition layer can make the thermal
expansion rate of the alloy more similar to the thermal expansion
rate of silicon. As described further below, gallium nitride
material layer 16 typically includes a high gallium concentration.
Thus, in these embodiments, increasing the concentration of gallium
in transition layer 12 can make the thermal expansion rate of the
alloy more similar to the thermal expansion rate of gallium nitride
material layer 16. It is believed that in these preferred
embodiments effective strain relief is achievable because back
surface 18 has a relatively similar thermal expansion rate as
substrate 14, while front surface 20 has a relatively similar
thermal expansion rate as gallium nitride material layer 16.
[0034] In some cases, the sum of (x+y) at back surface 18 is
greater than 0.4, greater than 0.6, greater than 0.8 or ever
higher. In some preferred embodiments, (x+y)=1 at back surface 18,
so that transition layer 12 is free of gallium at the back surface.
In some cases, the sum of (x+y) is less than 0.3, less than 0.2, or
even less at front surface 20. In some preferred embodiments, the
sum of (x+y)=0 at front surface 20, so that transition layer 12 has
a composition of GaN at the front surface. It may be particularly
preferred for transition layer 12 to have a composition of GaN at
front surface 20, when gallium nitride material layer 16 has a
composition of GaN. In other cases when gallium nitride material
layer is composed of an alloy of GaN, it may be preferable for the
composition of transition layer 12 at front surface 20 to be the
same as the composition of gallium nitride material layer 16. In
some cases, transition layer 12 is free of gallium at back surface
18 and has a composition of GaN at front surface 20.
[0035] In certain embodiments, it may be preferable for transition
layer 12 to comprise Al.sub.xGa.sub.(1-x)N. In these cases, the
transition layer is free of indium. In other cases, transition
layer 12 may include a small amount of indium, for example, less
than 10 percent by weight. When indium is present in transition
layer 12 (i.e., Al.sub.xIn.sub.yGa.sub.(1-x-y)N), the concentration
of indium (i.e., y) may remain constant throughout the transition
layer, while the concentration of gallium and aluminum are
graded.
[0036] The composition in transition layer 12 may be graded across
its thickness in a number of different manners. For example, the
composition may be graded continuously, discontinuously, across the
entire thickness, or across only a portion of the thickness. As
described above, the composition may be graded by varying the
concentration of one or more of the elements (i.e., Ga, Al, In).
FIGS. 2A to 21 illustrate exemplary manners in which the
composition may be graded by varying the concentration of one of
the elements as a function of thickness across transition layer 12.
In certain preferred embodiments, the profiles represent the
concentration of gallium across the thickness of transition layer
12, though it should be understood that in other embodiments the
profiles may represent the concentration of other elements (i.e.,
Al or In). The convention in FIGS. 2A to 21 is that the thickness
of transition layer 12 increases in the direction away from
substrate 14 (i.e., t=0 at back surface 18 and t=1 at front surface
20).
[0037] FIG. 2A shows a step-wise variation of concentration as a
function of thickness which includes multiple steps. FIG. 2B shows
a step-wise variation of concentration as a function of thickness
which includes two steps. FIG. 2C shows a saw tooth variation of
concentration as a function of thickness. FIG. 2D shows continuous
variations of concentration at a constant rate as a function of
thickness. FIG. 2E shows a continuous variation of concentration at
a constant rate starting from a non-zero concentration. FIGS. 2F
and 2G show continuous variations of concentration as a function of
thickness at exponential rates. FIG. 2H shows a discontinuous
variation of concentration as a function of thickness. FIG. 21
shows a variation of the concentration across a portion of the
thickness of the transition layer.
[0038] It should be understood that the profiles illustrated in
FIGS. 2A to 21 are intended to be exemplary and that the
composition of transition layer 12 may be graded in other manners
that are within the scope of the present invention.
[0039] Referring to FIGS. 3A and 3B, transition layer 12 may be a
compositionally-graded strained layer superlattice 22 according to
another embodiment of the present invention.
[0040] Superlattice 22 includes alternating layers 24a, 24b of
semiconductor compounds having different compositions. In some
cases, the composition across each individual layer 24a, 24b is
varied according to any of the manners described above. In other
cases, the composition of individual layers 24a, 24b is constant
across the thickness of the individual layer as shown in the
concentration profile of FIGS. 4A and 4B. As shown in FIGS. 3B (and
4B), the thicknesses of individual layers 24a, 24b is varied across
transition layer 12 to provide compositional grading.
[0041] In one preferred set of embodiments, superlattice 22
comprises alternating layers of gallium nitride alloys having
different compositions. For example, layer 24a has a composition of
Al.sub.xIn.sub.yGa.sub.(1-x-y)N and layer 24b has a composition of
Al.sub.aIn.sub.bGa.sub.(1-a-b)N, wherein x:a and y:b. In cases when
the composition is graded across each individual layer, the
concentration of at least one of the elements (i.e., Al, In, Ga) of
the alloy can be varied according to any of the manners described
above. In cases when the composition of individual layers 24a, 24b
is constant (FIG. 3B), the gallium concentration is typically
different in individual layers 24a, 24b.
[0042] As described above, it may be desirable to have a low
gallium concentration at back surface 18 and a high gallium
concentration at front surface 20. In embodiments that utilize
superlattice 22 as transition layer 12, increasing the gallium
concentration in a direction away from back surface 18 can be
accomplished by varying the thickness of individual layers. As
shown in FIGS. 3B and 4B, layer 24a has a low gallium concentration
and layer 24b has a high gallium concentration. As shown, layers
24a are relatively thick and layers 24b are relatively thin
proximate back surface 18. The thickness of layers 24a is decreased
and the thickness of layers 24b is increased in a direction away
from back surface 18. Thus, layers 24a are relatively thin and
layers 24b are relatively thick proximate front surface 20. This
structure provides a low gallium concentration at back surface 18
and a high gallium concentration at front surface 20.
[0043] It should be understood that transition layer 12 may be
formed of a combination of a single layer having a graded
composition and a superlattice. In some cases, the superlattice is
formed over the single compositionally-graded layer. In other
cases, the single compositionally-graded layer is formed over the
superlattice.
[0044] Transition layer 12 can have a variety of thicknesses
depending on the application. Generally, though not always,
transition layer 12 has a thickness of less than about 500 microns.
In some cases, relatively thick transition layers are preferable,
for example between about 2.0 microns and about 20 microns. Thick
transition layers may be preferred when thick gallium nitride
material layers (i.e., greater than 5 microns) are produced. In
some cases, relatively thin transition layers are preferable, for
example between about 0.03 micron and about 2.0 microns. When
superlattice structures are used as transition layers, the
thickness of individual layers 24a, 24b depends upon the particular
application. Typically the thickness of individual layers 24a, 24b
may be between about 0.001 microns and about 0.020 microns. As
described above, the thicknesses of individual layers may vary
across transition layer 12 (FIG. 3B).
[0045] Gallium nitride material layer 16 is formed of gallium
nitride (GaN) or any of its alloys including aluminum gallium
nitride (Al.sub.xGa.sub.(1-x)N), indium gallium nitride
(In.sub.yGa.sub.(1-y)N), and aluminum indium gallium nitride
(Al.sub.xIn.sub.yGa.sub.(19-x-y)N). The composition of gallium
nitride material layer 16 is generally constant across its
thickness as distinguished with transition layer 12. Thus, x and/or
y are generally fixed when gallium nitride material is formed of
any of the aforementioned compound alloys. It should be understood
that small variations in the composition of gallium nitride
material layer 16 may occur, for example, as a result of slight
non-uniformities and inhomogeneities during growth.
[0046] In certain preferred embodiments, gallium nitride material
layer 16 has a high concentration of gallium and includes little or
no amounts of aluminum and/or indium. In high gallium concentration
embodiments, the sum of (x+y) may be less than 0.4, less than 0.2,
less than 0.1, or even less. In some cases, it is preferable for
gallium nitride material layer 16 to have a composition of GaN
(i.e., x+y=0).
[0047] As described above, gallium nitride material layer 16 has a
low crack level as a result of the ability of transition layer 12
to relieve stress arising from differences in thermal expansion
rates between the silicon substrate and the gallium nitride
material. A "crack," as used herein, is a linear fracture or a
cleavage having a length to width ratio of greater than 5:1 that
extends to the surface of the gallium nitride material. It should
be understood that a crack may or may not extend through the entire
thickness of the gallium nitride material. "Crack level" is defined
as a total measure of all crack lengths in a gallium nitride
material per unit surface area. Crack level can be expressed in
units of .mu.m/.mu.m.sup.2. The crack level of a gallium nitride
material can be measured, for example, using optical microscopy
techniques. To determine the crack level, the length of all of the
cracks in a given area (i.e., 1 mm.times.1 mm) are added together
and divided by the total surface area. If necessary, this process
may be repeated at a number of locations across the surface to
provide a measurement representative of the entire gallium nitride
material. The crack level at each location may be averaged to
provide a crack level for the material. The number of locations
depends upon the amount of surface area of the gallium nitride
material. When measuring the crack level of a gallium nitride
material, measurements are not made within a region proximate to
edges of the material known as an edge exclusion. The nominal edge
exclusion is 5 mm from the edge. Edge effects in such regions may
lead to increased crack levels and are typically not used to in
device formation.
[0048] Gallium nitride material layer 16 advantageously has a low
crack level. In some cases, gallium nitride material layer 16 has a
crack level of less than 0.005 .mu.m/.mu.m.sup.2. In some cases,
gallium nitride material has a very low crack level of less than
0.001 .mu.m/.mu.m.sup.2. In certain cases, it may be preferable for
gallium nitride material layer 16 to be substantially crack-free as
defined by a crack level of less than 0.0001 .mu.m/.mu.m.sup.2.
[0049] Gallium nitride material layer 16 preferably has a
monocrystalline structure. In preferred cases, gallium nitride
material layer 16 has a Wurtzite (hexagonal) structure. Preferably,
the entire gallium nitride material layer has a Wurtzite structure.
The gallium nitride material layer 16 is generally of high enough
quality so as to permit the formation of devices therein. In some
embodiments, gallium nitride material layer 16 has a relatively low
amount of defects (e.g., less than 10.sup.9 cm.sup.-2) which, for
example, result from the lattice mismatch between gallium nitride
and silicon.
[0050] The thickness of gallium nitride material layer 16 is
dictated, in part, by the requirements of the specific application.
In applications when gallium nitride material is used as a device
layer, the thickness is sufficient to permit formation of the
device. Gallium nitride material layer 16 generally has a thickness
of greater than 0.1 micron, though not always. In other cases,
thicker gallium nitride material layers are desired such as
thicknesses greater than 0.5 micron, greater than 0.75 micron,
greater than 1.0 microns, greater than 2.0 microns, or even greater
than 5.0 microns. Even thick gallium nitride material layers 16 are
achievable at low crack densities because of the presence of
transition layer 12. In relatively thick gallium nitride layers,
upper regions of the layer may include low amounts of defects due
to the tendency of defects to annihilate one another as they
propagate vertically through the layer. Thus, in these cases, the
use of thick gallium nitride layers may improve device
performance.
[0051] Silicon substrate 14 typically is formed of high-quality
single-crystal silicon as readily available in the art. Silicon
substrates 14 having different crystallographic orientations may be
used. In some cases, silicon (111) substrates are preferred. In
other cases, silicon (100) substrates are preferred. Gallium
nitride material layer 16 having a Wurtzite structure may be grown
on silicon (111) substrates and silicon (100) substrates using
transition layer 12. It is particularly surprising that gallium
nitride material layer 16 having a Wurtzite structure may grown on
silicon (100) substrates because conventional techniques generally
result in gallium nitride materials having a mixture of zinc blend
(cubic) and Wurtzite structures when grown on silicon (100)
substrates.
[0052] Silicon substrate may have any dimensions as used in the
art. Suitable diameters include, but are not limited to, 2 inches,
4 inches, 6 inches, and 8 inches. In some embodiments, silicon
substrate 14 is relatively thick, for example, greater than 250
microns. Thicker substrates are generally able to resist bending
which can occur, in some cases, in thinner substrates.
[0053] As used herein, silicon substrate 14 refers to any substrate
that includes a silicon layer at its top surface. Examples of
suitable silicon substrates include substrates that are composed
entirely of silicon (e.g., silicon wafers), silicon-on-insulator
(SOI) substrates, silicon-on-sapphire substrate (SOS), SIMOX
substrates, amongst others.
[0054] Referring to FIG. 5, silicon substrate 14 is textured
according to some embodiments of the present invention. As
illustrated, textured substrate 14 includes a plurality of posts 24
which define trenches 26 therebetween. Such texturing can be
provided using selective etching and/or selective epitaxial growth.
Etching may be performed using standard dry or wet etching
techniques, such as with a mask which later may be removed. In some
cases, textured substrates are used in conjunction with the
transition layers described herein to grow gallium nitride material
layers with very low defect densities (e.g., less than 10.sup.7
cm.sup.2). Silicon substrate 14 may also be pre-patterned to
include mask areas which selectively expose regions of the
substrate, while covering other regions. Such pre-patterned
substrates enable selective area epitaxial growth which may be
advantageous in minimizing defect densities.
[0055] Referring to FIG. 6, semiconductor material 10 includes an
intermediate layer 28 between silicon substrate 14 and transition
layer 12 according to another embodiment of the present invention.
It should be understood that intermediate layer 28 may also be
positioned between transition layer 12 and gallium nitride material
layer 16. Intermediate layer 28, when provided, may further relieve
stress in gallium nitride material layer 16. Intermediate layer
generally has a thickness of less than about 500 microns and, in
some cases, between about 0.01 micron and about 2.0 microns. The
presence of intermediate layer 28 may permit reduction of the
thickness of transition layer 12. The composition of the
intermediate layer is generally constant throughout its
thickness.
[0056] Intermediate layer 28, for example, can be composed of a GaN
alloy such as aluminum gallium nitride (Al.sub.xGa.sub.(1-x)N),
indium gallium nitride (In.sub.yGa.sub.(1-y)N), and aluminum indium
gallium nitride (Al.sub.xIn.sub.yGa.sub.(1-x-y)N). In these cases,
the sum of (x+y) in the intermediate layer may be greater than 0.4,
greater than 0.6, greater than 0.8, greater than 0.9, or even more.
In some preferred cases, the intermediate layer is free of gallium
and is composed of Al.sub.xIn.sub.yN or AlN. GaN alloy intermediate
layers with low Ga concentrations may be effective at relieving
stresses because they have a thermal expansion rate relatively
close to the thermal expansion rate of silicon substrate 14.
[0057] It should be understood that intermediate layer 28 may be
utilized in accordance with any of the embodiments described herein
including embodiments that use a superlattice as a transition
layer. In embodiments in which transition layer 12 includes a
single compositionally-graded layer and a superlattice, the
intermediate layer may be positioned between the
compositionally-graded layer and the superlattice. In some
embodiments of the invention, more than one intermediate layer 28
having different compositions may be provided.
[0058] According to one preferred method, transition layer 12 and
gallium nitride material layer 16 are grown using a metalorganic
chemical vapor deposition (MOCVD) process. It should be understood
that other suitable techniques known in the art may also be
utilized to deposit transition layer 12 and gallium nitride
material layer 16 including molecular beam epitaxy (MBE), hydride
vapor phase epitaxy (HVPE), and the like.
[0059] Generally, the MOCVD process involves introducing different
source gases into an environment (e.g., a process system) around a
substrate and providing conditions which promote a reaction between
the gases to form a layer on the substrate surface. The reaction
proceeds until a layer of desired thickness is achieved. The
composition of the layer may be controlled, as described further
below, by several factors including gas composition, gas
concentration, and the reaction conditions (e.g. temperature and
pressure).
[0060] Examples of suitable source gases for MOCVD growth of the
transition layer include trimethylaluminum (TMA) or
triethylaluminum (TEA) as sources of aluminum; trimethylindium
(TMI) or triethylindium (TEI) as sources of indium;
trimethylgallium (TMG) or trimethylgallium (TEG) as sources of
gallium; and ammonia (NH.sub.3) as a source of nitrogen. The
particular source gas used depends upon the desired composition of
the transition layer. For example, an aluminum source (e.g., TMA or
TEA), a gallium source (TMG or TEG), and a nitrogen source are used
to deposit films having an Al.sub.xGa.sub.1-xN composition.
[0061] The flow rates of the source gases, the ratios of the source
gases, and the absolute concentrations of the source gases may be
controlled to provide transition layers having the desired
composition. For the growth of Al.sub.xGa.sub.1-xN layers, typical
TMA flow rates are between about 5 .mu.mol/min and about 50
.mu.mol/min with a flow rate of about 20 .mu.mol/min being
preferred in some cases; typical TMG flow rates are between about 5
.mu.mol/min and 250 .mu.mol/min, with a flow rate of 115 mol/min
being preferred in some cases; and the flow rate of ammonia is
typically between about 3 slpm to about 10 slpm. The reaction
temperatures are generally between about 900.degree. C. and about
1200.degree. C. and the process pressures are between about 1 Torr
and about 760 Torr. It is to be understood that the process
conditions, and in particular the flow rate, are highly dependent
on the process system configuration. Typically, smaller throughput
systems require less flow than larger throughput systems.
[0062] Process parameters are suitably adjusted to control the
compositional grading of the transition layer. The composition may
be graded by changing the process conditions to favor the growth of
particular compositions. For example, to increase incorporation of
gallium in the transition layer thereby increasing the gallium
concentration, the flow rate and/or the concentration of the
gallium source (e.g., TMG or TEG) may be increased. Similarly, to
increase incorporation of aluminum into the transition layer
thereby increasing the aluminum concentration, the flow rate and/or
the concentration of the aluminum source (e.g., TMA or TEA) may be
increased. The manner in which the flow rate and/or the
concentration of the source is increased (or decreased) controls
the manner in which the composition is graded. In other
embodiments, the temperature and/or pressure is adjusted to favor
the growth of a particular compound. Growth temperatures and
pressures favoring the incorporation of gallium into the transition
layer differ from the growth temperatures and pressures favoring
the incorporation of aluminum into the transition layer. Thus, the
composition may be graded by suitably adjusting temperature and
pressure.
[0063] Typical growth rates of the transition layer are between
about 0.01 m/hr and about 3.0 .mu.m/hr. The growth rate depends
upon the process parameters as well as the composition of the
layer.
[0064] The gallium nitride material layer (and intermediate layers,
if present) may also be grown using an MOCVD process. The process
may utilize source gases and process parameters similar to those
described above for the deposition of the transition layer. The
particular source gases and process parameters are selected based
upon the desired composition. When depositing the gallium nitride
material layer (or the intermediate layer), however, the process
parameters are maintained constant so as to provide a film having a
constant composition.
[0065] The semiconductor materials of the invention may be used in
a variety of applications. In some cases, semiconductor material 10
is processed using known techniques to form a semiconductor device.
Doped regions may be formed within gallium nitride material layer
16 and additional layers may be deposited upon the gallium nitride
material layer to produce the desired semiconductor structure. In
some embodiments, gallium nitride material layer 16 is doped using
known techniques to achieve a desired conductivity.
[0066] Any suitable semiconductor device known in the art including
electronic and optical devices can be produced using semiconductor
material 10. Exemplary devices include LEDs, laser diodes, FETs
(e.g., HFETs) amongst others.
[0067] FIG. 7 schematically illustrates an exemplary LED 30 formed
from semiconductor material 10. LED 30 includes silicon-doped
gallium nitride material layer 16 formed on transition layer 12 on
silicon substrate 14. In the illustrative embodiment, the following
layers are formed on gallium nitride material layer 16 in
succession: a silicon-doped Al.sub.xGa.sub.(1-x)N layer 31
(containing 0-20% by weight Al), a GaN/InGaN single or multiple
quantum well 32, a magnesium-doped Al.sub.xGa.sub.(1-x)N layer 34
(containing 10-20% by weight Al), and a magnesium-doped GaN layer
36. LED 30 includes a p-type metal contact 38 on magnesium-doped
GaN layer 36 and an n-type metal contact pad 39 on silicon-doped
gallium nitride material layer 16. LED 30 may be provided as a
variety of different structure including: a double heterostructure
(e.g., Al>0% in layer 31), a single heterostructure (e.g., Al=0%
in layer 31), a symmetric structure, or an asymmetric structure. It
should be understood that LED may have a variety of different
structures as known to those of ordinary skill in the art.
[0068] FIG. 8 schematically illustrates an exemplary laser diode 40
formed from semiconductor material 10. Laser diode 40 includes
silicon-doped gallium nitride material layer 16 formed on
transition layer 12 on silicon substrate 14. In the illustrative
embodiment, the following layers are formed on gallium nitride
material layer 16 in succession: a silicon-doped
Al.sub.xGa.sub.(1-x)N layer 42 (containing 5-30% by weight Al), a
silicon-doped Al.sub.xGa.sub.(1-x)N layer 44 (containing 0-20% by
weight Al), a GaN/InGaN single or multiple quantum well 46, a
magnesium-doped Al.sub.xGa.sub.(1-x)N layer 48 (containing 5-20% by
weight Al), a magnesium-doped Al.sub.xGa.sub.(1-x)N layer 50
(containing 5-30% by weight Al), and a magnesium-doped GaN layer
52. Laser diode 40 includes a p-type metal contact 38 on
magnesium-doped GaN layer 52 and an n-type metal contact pad 39 on
silicon-doped gallium nitride material layer 16. It should be
understood that laser diode 40 may have a variety of different
structures as known to those of ordinary skill in the art.
[0069] FIG. 9 schematically illustrates a FET 54 (e.g., HFET)
formed from semiconductor material 10. FET 54 includes intrinsic
gallium nitride material layer 16 formed on transition layer 12 on
silicon substrate 14. FET 54 includes an Al.sub.xGa.sub.(1-x)N
layer 56 (containing 10-40% by weight Al). It should be understood
that FET 54 may have a variety of different structures as known to
those of ordinary skill in the art.
[0070] The function and advantage of these and other embodiments of
the present invention will be more fully understood from the
examples below. The following examples are intended to illustrate
the benefits of the present invention, but do not exemplify the
full scope of the invention.
EXAMPLE 1
Production of Gallium Nitride Layer Using a Compositionally Graded
Transition Layer
[0071] This example illustrates the effectiveness of a
compositionally-graded transition layer in limiting the number of
cracks in a gallium nitride material grown on a silicon
substrate.
[0072] An MOCVD process was used to grow an AlN intermediate layer,
an Al.sub.xGa.sub.1-xN compositionally-graded transition layer, and
a GaN layer in succession on a silicon substrate.
[0073] A silicon substrate having a 2-inch diameter and a thickness
of 250 microns was positioned in an MOCVD system. To grow the AlN
intermediate layer, trimethylaluminum gas (TMA) was introduced into
the MOCVD system at a flow rate of about 50 .mu.mol/min and ammonia
gas (NH.sub.3) was introduced into the system at a flow rate of
between about 3 and about 10 slpm. A growth temperature of between
about 1000-100.degree. C. and a growth pressure 30-200 Torr were
maintained in the system. After about 60 minutes, an AlN
intermediate layer was formed having a thickness of about 0.3
micron on the silicon substrate.
[0074] After the growth of the intermediate layer, trimethylgallium
(TMG) was introduced into the system at a flow rate of about 5
.mu.mol/min to provide a ratio of TMA:TMG of about 10:1. To form
the compositionally-graded transition layer, the flow rate of the
TMA was decreased to about 5 .mu.mol/min, while the flow rate of
TMG was increased to about 115 .mu.mol/min. Over this time, the
ratio of TMA:TMG was decreased from about 10:1 to about 1:23. After
about 30 minutes, a compositionally-graded transition layer having
a thickness of about 0.4 micron was grown on the intermediate
layer.
[0075] To grow the gallium nitride layer on the transition layer,
the introduction of TMA into the system was stopped and the TMG
flow rate was adjusted to about 115 .mu.mol/min. The flow rate of
ammonia was maintained between about 3 and about 10 slpm. The
growth temperature was maintained between about 1000 and about
1050.degree. C. and the growth pressure between about 30 and about
200 Torr. After about 45 minutes, a GaN layer having a thickness of
about 1.5 micron was grown on the compositionally-graded transition
layer. The semiconductor material was furnace-cooled to room
temperature and removed from the MOCVD system for analysis.
[0076] The resulting semiconductor material included a 0.3 micron
AlN intermediate layer formed on the silicon substrate; a 0.4
micron thick continuously graded Al.sub.xGa.sub.1-xN transition
layer formed on the intermediate layer; and a 1.5 micron GaN layer
grown on the transition layer. The composition of the
Al.sub.1Ga.sub.1-xN transition layer was graded from x=0.8 at the
juncture with the intermediate layer to x=0 at the juncture with
the GaN layer. The GaN layer had a monocrystalline structure.
[0077] The crack level of the semiconductor material was measured
using an optical microscopic technique. The microscope was equipped
with the camera capable of taking micrographs of the surface of the
GaN layer. FIG. 10 is a micrograph showing a representative area of
slightly greater than 1 mm.sup.2 on the surface of the GaN layer.
No cracks are visible in the representative area. Measurements were
repeated at several other locations on the surface of the GaN layer
and similar results were achieved. The gallium nitride material was
found to be substantially crack-free as defined by a crack level of
less than 0.0001 .mu.m/.mu.m.sup.2.
[0078] This example illustrates the ability to grow gallium nitride
layers having a low crack level on a silicon substrate using a
compositionally-graded transition layer.
COMPARATIVE EXAMPLE 2
Production of Gallium Nitride Layer Without Using a Compositionally
Graded Transition Layer
[0079] This example illustrates the generation of cracks in a
gallium nitride material grown on a silicon substrate without using
a compositionally-graded transition layer.
[0080] An MOCVD process was used to grow an AlN intermediate layer
and a GaN layer in succession on a silicon substrate.
[0081] A silicon (111) substrate having a 2-inch diameter and a
thickness of 250 microns was positioned in the same MOCVD system as
used in Example 1. An AlN intermediate layer was formed using
essentially the same processing conditions as the growth of the
intermediate layer in Example 1. A GaN layer was grown on the
intermediate layer using essentially the same processing conditions
as the growth of the GaN layer in Example 1. A
compositionally-graded transition layer was not grown. The
semiconductor material was furnace-cooled to room temperature and
removed from the MOCVD system for analysis.
[0082] The resulting semiconductor material included a 0.3 micron
AlN intermediate layer formed on the silicon substrate, and a 1.5
micron GaN layer grown on the intermediate layer. The GaN layer had
a monocrystalline structure.
[0083] The crack level of the GaN layer was measured using the same
technique as described in Example 1. FIG. 11 is a micrograph
showing a representative area of slightly greater than 1 mm.sup.2
on the surface of the GaN layer. The length of each crack in the
area was measured and added together to determine the total crack
length. The total crack length was divided by the surface area to
determine the crack level. Measurements were repeated at several
other locations on the surface which were averaged to provide a
crack level of the GaN layer of about 0.007 .mu.m/.mu.m.sup.2.
[0084] This comparative example illustrates the presence of cracks
in gallium nitride layers grown on a silicon substrate without
using a compositionally-graded transition layer.
[0085] Those skilled in the art would readily appreciate that all
parameters listed herein are meant to be exemplary and that the
actual parameters would depend upon the specific application for
which the semiconductor materials and methods of the invention are
used. It is, therefore, to be understood that the foregoing
embodiments are presented by way of example only and that, within
the scope of the appended claims and equivalents thereto the
invention may be practiced otherwise than as specifically
described.
* * * * *