U.S. patent application number 10/670165 was filed with the patent office on 2004-06-17 for weld-solder filler.
This patent application is currently assigned to Berkenhoff GmbH.. Invention is credited to Berger, Uwe, Fackert, Juergen, Rechtziegel, Bruno, Schlottner, Juergen, Schmid, Eberhard, Tauber, Klaus.
Application Number | 20040115089 10/670165 |
Document ID | / |
Family ID | 32509905 |
Filed Date | 2004-06-17 |
United States Patent
Application |
20040115089 |
Kind Code |
A1 |
Rechtziegel, Bruno ; et
al. |
June 17, 2004 |
Weld-solder filler
Abstract
Conventional weld fillers contain copper, aluminum and
manganese. These weld fillers are as a rule not suited for the
welding of thin or rust-free sheet metals. The inventive weld
filler contains 0.5 to 6.0 percent by weight Al, 0.5 to 8.0 percent
by weight Mn, the usual impurities are less than or equal to 1.0
percent by weight and as the remainder Cu. This weld filler is
better suited for the welding of thin or rust-free sheet metals
than the up to now known weld fillers.
Inventors: |
Rechtziegel, Bruno;
(Heuchelheim, DE) ; Fackert, Juergen;
(Steffenberg, DE) ; Schmid, Eberhard; (Alzenau,
DE) ; Berger, Uwe; (Leun, DE) ; Schlottner,
Juergen; (Woelfersheim, DE) ; Tauber, Klaus;
(Biebertal, DE) |
Correspondence
Address: |
FLYNN THIEL BOUTELL & TANIS, P.C.
2026 RAMBLING ROAD
KALAMAZOO
MI
49008-1699
US
|
Assignee: |
Berkenhoff GmbH.
|
Family ID: |
32509905 |
Appl. No.: |
10/670165 |
Filed: |
September 24, 2003 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
10670165 |
Sep 24, 2003 |
|
|
|
09608850 |
Jun 30, 2000 |
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Current U.S.
Class: |
420/586 |
Current CPC
Class: |
C22C 9/01 20130101; B23K
35/302 20130101 |
Class at
Publication: |
420/586 |
International
Class: |
C22C 030/00 |
Foreign Application Data
Date |
Code |
Application Number |
Jul 2, 1999 |
DE |
199 30 741.5 |
Claims
What is claimed is:
1. In a weld-solder filler composition utilized in soldering and
welding processes, the improvement comprising said weld-solder
filler composition containing, in percent by weight: 0.5 to 7.0%
Al; 0.5 to 2.0% Mn; 0.01 to 4% Fe; 0.01 to 6% Ni; no more than 1.0%
impurities; and the remainder being Cu.
2. The weld-solder filler composition of claim 1, wherein the
following impurities, if present, are contained in the indicated
ranges: 0.01 to 0.3% Si; 0.01 to 1.0% Zn; 0.01 to 0.5% Sn; 0.01 to
0.1% Cr; and 0.01 to 0.1% Co.
3. The weld-solder filler composition of claim 1, wherein 6% Al, 1%
Mn and 1% Ni are present in the filler composition.
4. The weld-solder filler composition of claim 1, wherein 5% Al, 1%
Mn and 1% Ni are present in the filler composition.
5. The weld-solder filler composition of claim 1, wherein 5% Al is
present in the filler composition.
Description
[0001] This application is a continuation-in-part application of
Ser. No. 09/608,850, filed Jun. 30, 2000.
FIELD OF THE INVENTION
[0002] The invention relates to a filler with copper, aluminum and
manganese for soldering and/or welding.
BACKGROUND OF THE INVENTION
[0003] Such fillers are known from the state of the art and are
also standardized in the DIN 1733, Part 1. Fillers must be chosen
in such a manner that strength values of the solder-weld connection
reach at least the guaranteed performance values or standard values
of the base material. Sufficient deforming ability of the welding
material is particularly of importance when the base material has a
low suitability for welding. Particular problems exist thereby in
the MIG soldering of tinned or aluminized thin sheet metals or,
however, the MIG soldering or rust-free steel plates. Also
problematic is often the build-up weld material.
[0004] When welding thin sheet metal a distortion of the sheet
metal occurred up to now because the heat penetration through the
sheet metal was too high. A further problem is often the lack of
flow and wetting behavior of the material and weld filler. A
uniform bath is then not created between the two pieces to be
welded, which bath guarantees a permanent connection.
SUMMARY OF THE INVENTION
[0005] The purpose of the invention is therefore to provide a
filler, which is suited for welding, however, in particular also
with an impulse arc through the MIG soldering to connect coated
sheet metal plates and rust-free steels, for example 1.4301 and
similar ones, and guarantees besides a low energy input and thus a
low structural part distortion, a good flow and wetting behavior, a
good gap bridging and a strong seam. Furthermore, the weld-solder
filler has a good corrosion resistance and permits fast joining
speeds.
DETAILED DESCRIPTION
[0006] This purpose is attained according to the invention in such
a manner that the filler contains in percentage by weight 0.5 to
7.0% Al, 0.5 to 8.0% Mn, the usual impurities less than or equal to
1.0% and the remainder Cu.
[0007] In contrast to the fillers known from the state of the art,
the above set forth filler has an adapted melting point, which
results in a low heat input and thus also in a low amount of
distortion of the welded pieces. Thus the filler is suited in
particular for thin sheet metal plates and also for rust-free
steels, like 1.4301 DIN 17440 of less than 4.0 mm and even less
than 1.5 mm thickness. The good flow and wetting behavior results
in a uniform flat seam, which is essentially free of pores. The
filler itself is well drawable and can therefore be prepared as a
small diameter wire of, for example, 0.8 mm.
[0008] The filler in addition contains advantageously in percentage
by weight 0.01 to 4.0% iron and/or 0.01 to 6.0% nickel. Usual
impurities are each to be no higher than 0.01 to 0.3% silicon, 0.01
to 1.0% zinc, 0.01 to 0.5% tin, 0.01 to 0.1% chromium and 0.01 to
0.1% cobalt.
[0009] A further advantageous filler contains 5 percent by weight
aluminum and 2 percent by weight manganese.
[0010] Whereas a further advantageous filler contains according to
the invention 2 percent by weight aluminum and 6 percent by weight
manganese.
[0011] A third advantageous filler has 6 percent by weight
aluminum, 1 percent by weight manganese, and 1 percent by weight
nickel.
[0012] A fourth advantageous filler has 5% Al, 1% Mn and 1% Ni.
* * * * *