U.S. patent application number 10/600707 was filed with the patent office on 2004-05-06 for connector module for integrated circuit device, and integrated circuit device suitable for use with the same.
Invention is credited to Hosaka, Taiji, Miyazawa, Masaaki.
Application Number | 20040087190 10/600707 |
Document ID | / |
Family ID | 18637546 |
Filed Date | 2004-05-06 |
United States Patent
Application |
20040087190 |
Kind Code |
A1 |
Miyazawa, Masaaki ; et
al. |
May 6, 2004 |
CONNECTOR MODULE FOR INTEGRATED CIRCUIT DEVICE, AND INTEGRATED
CIRCUIT DEVICE SUITABLE FOR USE WITH THE SAME
Abstract
A connector module to be connected to an integrated circuit
device having rear electrodes provided on a back surface thereof
facing away from a wiring board. The connector module includes: a
connector having contacts to be electrically connected to the rear
electrodes; and a fixture structure for fixing the connector to the
integrated circuit device.
Inventors: |
Miyazawa, Masaaki;
(Kanagawa, JP) ; Hosaka, Taiji; (Kanagawa,
JP) |
Correspondence
Address: |
RADER FISHMAN & GRAUER PLLC
LION BUILDING
1233 20TH STREET N.W., SUITE 501
WASHINGTON
DC
20036
US
|
Family ID: |
18637546 |
Appl. No.: |
10/600707 |
Filed: |
June 23, 2003 |
Related U.S. Patent Documents
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
|
|
10600707 |
Jun 23, 2003 |
|
|
|
09836479 |
Apr 18, 2001 |
|
|
|
6592380 |
|
|
|
|
Current U.S.
Class: |
439/67 |
Current CPC
Class: |
H01R 12/594 20130101;
H01R 12/592 20130101; H01R 12/79 20130101; H01L 2924/30107
20130101; H01L 2924/3011 20130101; H01L 2224/48227 20130101; H01L
2224/48091 20130101; H01L 2224/48091 20130101; H01L 2924/00014
20130101; H01L 2924/3011 20130101; H01L 2924/00 20130101; H01L
2924/30107 20130101; H01L 2924/00 20130101 |
Class at
Publication: |
439/067 |
International
Class: |
H05K 001/00 |
Foreign Application Data
Date |
Code |
Application Number |
Apr 27, 2000 |
JP |
2000-128045 |
Claims
What is claimed is:
1. A connector module to be connected to an integrated circuit
device having rear electrodes provided on a back surface thereof
facing away from a wiring board, the connector module comprising: a
connector having contacts to be electrically connected to the rear
electrodes; and a fixture structure for fixing the connector to the
integrated circuit device.
2. A connector module as set forth in claim 1, further comprising a
wiring member connected to the connector.
3. A connector module as set forth in claim 2, wherein the wiring
member has a pseudo-coaxial structure.
4. A connector module as set forth in claim 1, wherein the fixture
structure comprises a connection block which is fixable to the back
surface of the integrated circuit device and engageable with the
connector.
5. A connector module as set forth in claim 4, wherein the fixture
structure further comprises a lock mechanism for keeping the
connector and the connection block in engagement with each
other.
6. A connector module as set forth in claim 4, wherein the
connection block incorporates a cooling mechanism for cooling the
integrated circuit device.
7. A connector module attached integrated circuit device,
comprising: an integrated circuit device body having rear
electrodes provided on a back surface thereof facing away from a
wiring board; and a connector module comprising a connector having
contacts to be electrically connected to the rear electrodes, and a
fixture structure for fixing the connector to the integrated
circuit device body.
8. An integrated circuit device as set forth in claim 7, wherein
the rear electrodes are electrodes through which signals having a
frequency of not lower than 50 MHz are inputted or outputted.
9. An integrated circuit device comprising: an integrated circuit
device body having rear electrodes provided on a back surface
thereof facing away from a wiring board; and a connection block
fixed to the back surface of the integrated circuit device body for
engagement with a connector having contacts to be electrically
connected to the rear electrodes.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a connector module for
leading out signal lines from a back surface of an integrated
circuit device, and to an integrated circuit device suitable for
use with the connector module.
[0003] 2. Description of Related Art
[0004] High speed signal input and output with respect to a
semiconductor integrated circuit device mounted on a printed wiring
board are generally achieved through micro-strip lines or strip
lines provided in the wiring board. More specifically, the printed
wiring board is constructed in a multi-level structure for the
provision of the strip lines and the micro-strip lines, which are
employed as impedance-matched transmission paths.
[0005] With the aforesaid arrangement, however, the dielectric
constant of the printed wiring board, the capacitance and
inductance of an interconnection pattern and the like should
properly be conditioned for the high speed signal transmission.
This requires advanced techniques for system development and
design. In addition, a consideration should be given to an
arrangement for overcoming drawbacks associated with noises and
crosstalk and, hence, there are technical and economic
problems.
[0006] Further, various semiconductor devices operative at
different source voltages should be employed for operation of a
high-speed system. Accordingly, a plurality of layers are
separately provided in the printed wiring board for applying the
different source voltages to the respective semiconductor devices.
However, this arrangement deteriorates the electrical properties of
the signal transmission paths and, when directed to the high-speed
system, encounters technical difficulties. In addition, this
arrangement may cause noises and crosstalk, which hinder the
speed-up of the system.
[0007] An LVDS (low-voltage differential signaling) interface, for
example, is employed for high speed data transmission in a liquid
crystal display device. The LVDS interface is a small-amplitude and
high-speed differential interface specified by EIA644/IEEE1596.3,
and applicable to communications at frequencies up to 500 MHz. An
LVDS-conformable differential driver (semiconductor device), which
incorporates circuits for four channels, for example, achieves a
data transmission rate of 400 Mbps by outputting 100-MHz
differential signals from the respective channels.
[0008] Where such an LVDS differential driver device is to be
mounted on a printed wiring board, a pseudo-coaxial circuit should
be provided for elimination of crosstalk and noises by forming
micro-strip lines on the printed board so that ground lines are
disposed between signal lines.
[0009] However, the pseudo-coaxial circuit does not provide perfect
coaxial transmission paths, so that crosstalk and noises are
inevitably introduced even if the pseudo-coaxial circuit is
provided on the multi-level printed wiring board. As a result,
signals transmitted at a high transmission rate through the
pseudo-coaxial circuit on the wiring board do not have sharp square
waveforms. Therefore, this arrangement is not necessarily adaptable
to applications for high speed digital data transmission.
[0010] Similar problems arise in the field of personal computers
which are increasingly directed to higher speed operation. That is,
a frequency employed for signal transmission between a CPU and a
chip set is currently about 133 MHz to about 200 MHz, but will
doubtlessly be increased to about 400 MHz to about 800 MHz. On the
other hand it is doubtful that the existing techniques for printed
wiring boards can cope with such high speed signal
transmission.
SUMMARY OF THE INVENTION
[0011] It is an object of the present invention to provide a
connector module which realizes a connection structure adapted for
higher speed signal transmission with respect to an integrated
circuit device.
[0012] It is another object of the invention to provide an
integrated circuit device having the aforesaid connector
module.
[0013] It is further another object of the invention to provide an
integrated circuit device having a construction suitable for
attachment with the connector module.
[0014] The present invention is directed to a connector module (30,
30A, 30B) which is to be connected to an integrated circuit device
(50, 50A, 50B) having rear electrodes (52) provided on a back
surface (51) thereof facing away from a wiring board (70). The
connector module includes a connector (1, 1A, 1B) having contacts
(15) to be electrically connected to the rear electrodes, and a
fixture structure (2, 2A, 2B, 12, 12A, 12B) for fixing the
connector to the integrated circuit device.
[0015] Parenthesized alphanumeric characters denote corresponding
components to be described later in embodiments of the invention,
but do not intend to limit the invention to the embodiments. This
definition is effectual in this section.
[0016] In the present invention, high speed signal transmission
with respect to the integrated circuit device having the rear
electrodes provided on the back surface thereof opposite from the
board-opposed surface is achieved through external circuitry
provided outside the wiring board. More specifically, the inventive
connector module leads signal lines out of the integrated circuit
device by attaching the connector thereof to the integrated circuit
device with the contacts thereof connected to the rear electrodes
of the integrated circuit device. Thus, transmission paths are
provided outside the wiring board, so that the influences of
inter-signal crosstalk and noises can be eliminated for proper high
speed signal transmission.
[0017] Particularly where signals to be transmitted at a frequency
of not lower than 50 MHz are allocated to signal lines led out of
the device with the use of the connector module, the aforesaid
effects are notable.
[0018] The integrated circuit device may have electrodes (63, 64)
provided on the board-opposed surface thereof in addition to the
rear electrodes (52) provided on the back surface thereof. In this
case, high speed signal transmission can advantageously be achieved
through the signal transmission paths outside the wiring board by
allocating signals required to be transmitted at a high speed
(e.g., higher than 50 MHz) to the rear electrodes.
[0019] The connector module may further include a wiring member (3,
90) connected to the connector.
[0020] With this arrangement, the wiring member connected to the
connector allows for signal transmission with respect to any other
electronic devices via the transmission paths outside the wiring
board.
[0021] The wiring member preferably has a pseudo-coaxial
structure.
[0022] With this arrangement, the signal transmission paths are
free from the influences of the inter-signal crosstalk and
noises.
[0023] In this case, the pseudo-coaxial structure may be
constituted by micro-strip lines and strip lines arranged such that
signal lines are provided between ground lines or, alternatively,
by twisted-pair cables.
[0024] The fixture structure preferably includes a connection block
(2, 2A, 2B) which is fixable to the back surface of the integrated
circuit device and engageable with the connector.
[0025] With this arrangement, electrical connection between the
contacts of the connector and the rear electrodes of the integrated
circuit device can be established by fixing the connection block to
the back surface of the integrated circuit device and bringing the
connection block into engagement with the connector.
[0026] The fixture structure preferably further includes a lock
mechanism (12, 22; 12A, 12B, 24) for keeping the connector and the
connection block in engagement with each other.
[0027] With this arrangement, the connector and the connection
block can be kept in engagement with each other by the lock
mechanism, so that the electrical connection between the connector
module and the integrated circuit device can assuredly be
maintained. This ensures the reliability of the signal transmission
paths outside the wiring board.
[0028] The connection block preferably incorporates a cooling
mechanism (80) for cooling the integrated circuit device.
[0029] With this arrangement, sufficient heat dissipation from the
integrated circuit device can be achieved by the cooling mechanism
incorporated in the connection block attached to the back surface
of the integrated circuit device. Thus, the inventive connector
module can be applied to an integrated circuit device generating a
greater amount of heat to provide signal transmission paths outside
the wiring board.
[0030] The cooling mechanism may be radiator fins provided on the
connection block to allow the connection block to double as a heat
sink. The cooling mechanism may be a cooling fan provided in the
connection block.
[0031] An integrated circuit device according to the present
invention includes an integrated circuit device body having rear
electrodes provided on a back surface thereof facing away from a
wiring board, and the aforesaid connector module attached to the
back surface of the integrated circuit device body.
[0032] With this arrangement, the integrated circuit device can
receive and transmit signals via the signal transmission paths
outside the wiring board. Thus, high speed signal transmission can
be achieved through the advantageous signal transmission paths
provided out,side the wiring board with little limitation, so that
the integrated circuit device can operate at a higher speed.
[0033] An integrated circuit device according to one embodiment of
the present invention includes an integrated circuit device body
having rear electrodes provided on a back surface thereof facing
away from a wiring board, and a connection block fixed to the back
surface of the integrated circuit device body for engagement with a
connector having contacts to be electrically connected to the rear
electrodes.
[0034] In accordance with the present invention, the connection
block is fixed to the back surface of the integrated circuit device
body. Therefore, the integrated circuit device can easily utilize
the signal transmission paths outside the wiring board by
connecting the connector of the connection module to the connection
block.
[0035] The connection block may be formed integrally with a mold
resin portion of the integrated circuit device. Alternatively, the
connection block may be a separate member from the mold resin
portion of the integrated circuit device, and fixed to the
integrated circuit device body with an adhesive, by ultrasonic
fusion bonding or by proper fixing means such as engagement
claws.
[0036] The foregoing and other objects, features and effects of the
present invention will become more apparent from the following
description of the preferred embodiments with reference to the
attached drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0037] FIGS. 1A and 1B are perspective views for explaining the
construction of a connector module according to a first embodiment
of the present invention;
[0038] FIG. 2 is a sectional view illustrating a state where a
connector is engaged with a connection block;
[0039] FIG. 3 is a perspective view partly in section illustrating
the internal construction of a housing of the connector;
[0040] FIG. 4 is a bottom view illustrating the connector and an
FPC cable;
[0041] FIG. 5A is a sectional view taken along a section line VA-VA
in FIG. 4, and FIG. 5B is a sectional view taken along a section
line VB-VB in FIG. 4;
[0042] FIG. 6 is a perspective view for explaining the construction
of a connector module according to a second embodiment of the
present invention;
[0043] FIG. 7A is a perspective view illustrating a state where a
connector is attached to a connection block, and FIG. 7B is a
perspective view for explaining how to detach the connector from
the connection block;
[0044] FIGS. 8A and 8B are perspective views for explaining the
construction of a connector module according to a third embodiment
of the present invention; and
[0045] FIG. 9 is a perspective view illustrating an exemplary
arrangement where pseudo-coaxial transmission paths are constituted
by twisted-pair cables.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0046] FIGS. 1A and 1B are perspective views for explaining the
construction of a connector module according to a first embodiment
of the present invention. The connector module 30 according to this
embodiment is to provide signal transmission paths outside a
printed wiring board 70 with respect to a semiconductor integrated
circuit device 50 (corresponding to the integrated circuit device
body as a whole) mounted on the printed wiring board 70. For this
purpose, the integrated circuit device 50 includes a plurality of
rear electrodes 52 provided in the vicinity of an edge of a back
surface (upper surface) 51 opposite from a surface (lower surface)
opposed to the printed wiring board 70. The connector module 30 is
electrically connected to the rear electrodes 52 for the provision
of the signal transmission paths outside the printed wiring board
70.
[0047] The connector module 30 includes a planar rectangular
connection block 2 fixed to the back surface example, with an
adhesive, and a connector 1 removably attachable to the connection
block 2. The connection block 2 has an engagement recess 21
provided above the rear electrodes 52 for engagement with the
connector 1. The connection block 2 further has a lock hole 22
provided above the engagement recess 21 for locking the connector 1
to the connection block 2 after the connector 1 is brought into
engagement with the connection block 2.
[0048] The connector 1 includes a housing 11 having a rear face
from which an FPC (flexible printed circuit) cable 3 is led out,
and an engagement piece 12 of an inverted L-shaped cross section
provided on an upper surface of the housing 11. The engagement
piece 12 has a lock claw 13 provided at a distal edge thereof for
locking the connector 1 in engagement with the lock hole 22. When
the connector 1 is moved toward the connection block 2 in a state
shown in FIG. 1A to insert the housing 11 of the connector 1 into
the engagement recess 21, the lock claw 13 is fitted in the lock
hole 22 at an insertion-complete position. Thus, the connector 1 is
locked to the connection block 2 as shown in FIG. 1B.
[0049] FIG. 2 is a sectional view illustrating the state where the
connector 1 is engaged with the connection block 2. FIG. 3 is a
perspective view partly in section illustrating the internal
construction of the housing 11 of the connector 1. The connector 1
has a plurality of contacts 15 extending through the rear wall of
the housing 11. The contacts 15 respectively have contact portions
15a provided at distal ends thereof to be brought into press
contact with the rear electrodes 52 of the integrated circuit
device 50 by spring forces of the contacts 15. The contact portions
15a of the plurality of contacts 15 are arranged in a recess 11a
formed in a lower surface of the housing 11.
[0050] Rear end portions 15b of the contacts 15 extend outwardly of
the rear face of the housing 11, and are respectively soldered to
lands 32 of micro-strip conductors 31 provided on a lower surface
3b (opposite from the engagement piece 12) of the FPC cable 3.
[0051] The integrated circuit device 50 includes a multi-level
interconnection board 55 and a semiconductor chip 56 which are
molded with a resin 57. The multi-level interconnection board 55
includes a plurality of conductive films 58 which are selectively
interconnected via conductive films 58 provided in through-holes
59. The multi-level interconnection board 55 has a recess 60
provided in a central portion of a surface 55a thereof opposed to
the board 70. The semiconductor chip 56 is accommodated in the
recess 60 and sealed in a mold resin 61.
[0052] Electrical connection between the semiconductor chip 56 and
the conductor films 58 in the multi-level interconnection board 55
is established by bonding wires 62. A plurality of lands 63 are
exposed from the resin 57 and two-dimensionally arranged on a
portion of the board-opposed surface 55a of the multi-level
interconnection board 55 not formed with the recess 60, and solder
balls 64 are provided on the respective lands 63. The conductive
films 58 and the through-holes 59 in the multi-level
interconnection board 55 serve as internal interconnections for
connection between the plurality of bonding wires 62 connected to
the semiconductor chip 56 and the plurality of lands 63.
[0053] The rear electrodes 52 are exposed on the back surface 51 of
the integrated circuit device 50. The rear electrodes 52 are
electrically connected to the semiconductor chip 56 via the
conductive films 58 in the multi-level interconnection board 55 and
the bonding wires 62.
[0054] The integrated circuit device 50 is placed, for example, on
the wiring board 70 and put in a reflow vessel in this state. Thus,
the solder balls 64 are fused, whereby the integrated circuit
device 50 is bonded to the wiring board 70.
[0055] FIG. 4 is a bottom view illustrating the connector and the
FPC cable 3. The rear end portions 15b of the contacts 15 extend
out of the housing 11, and are respectively soldered to the lands
32 of the micro-strip conductors 31 provided on the lower surface
3b of the FPC cable 3. The micro-strip conductors 31 are arranged
parallel to each other so that signal lines 31S are disposed
between ground lines 31G. The lands 32 of the respective
micro-strip conductors 31 are exposed on the FPC cable in the
vicinity of the connector 1. Lands 33 of the respective micro-strip
conductors 31 are exposed on the FPC cable at an end of the FPC
cable 3 opposite from the connector 1.
[0056] FIG. 5A is a sectional view taken along a section line VA-VA
in FIG. 4, and FIG. 5B is a sectional view taken along a section
line VB-VB in FIG. 4. In FIGS. 5A and 5B, a part of the FPC cable 3
is illustrated in section on a vertically enlarged scale when the
FPC cable 3 assumes a state shown in FIGS. 1A and 1B. An upper
surface 3a and a lower surface 3b of the FPC cable 3 are covered
with an insulative coating film 35. Only the lands 32, 33 are
exposed from the coating film 35. As described above, the signal
lines 31S are interposed between the ground lines 31G. The FPC
cable 3 has a plurality of through-holes 36 provided in midportions
of the ground lines 31G as extending therethrough. More
specifically, the through-holes 36 extend through the micro-strip
conductors 31 of the ground lines 31G from the lower surface 3b of
the FPC cable 3 and further extend through a foundation 37 of the
FPC cable 3 to reach the upper surface 3a of the FPC cable 3. A
surface of the foundation 37 is entirely covered with a conductive
film 38 on the side of the upper surface 3a of the FPC cable 3. The
conductive film 38 is connected to a ground potential, for example,
at the end of the FPC cable 3 opposite from the connector 1.
[0057] With the arrangement according to this embodiment described
above, the integrated circuit device 50 has the rear electrodes 52
on the back surface 51 thereof, and the FPC cable 3 is connected to
the rear electrodes 52 via the connector 1. Thus, signal lines of
the integrated circuit device 50 can be led out to external devices
not only via the wiring board 70 but also via the FPC cable 3.
Where the multi-level interconnection board 55 is designed so that
the rear electrodes 52 are used for high speed transmission of
signals (e.g., from an LVDS driver) at a frequency of higher than
50 MHz, the high speed signal transmission can be achieved through
the transmission paths outside the wiring board 70. Thus, the
signals transmitted at a high rate via the FPC cable 3 are not
influenced by signals transmitted via the wiring board 70, so that
the waveforms thereof are prevented from being disturbed by
crosstalk and noises. Since the FPC cable 3 includes the
micro-strip conductors 31 arranged so that the signal lines 31S are
disposed between the ground lines 31G to provide pseudo-coaxial
transmission paths, the influence of inter-signal crosstalk and
external noises can effectively be eliminated.
[0058] FIG. 6 is a perspective view for explaining the construction
of a connector module 30A according to a second embodiment of the
present invention. In FIG. 6, components equivalent to those shown
in FIGS. 1A and 1B are denoted by the same reference characters as
in FIGS. 1A and 1B.
[0059] In this embodiment, an integrated circuit device 50A having
rear electrodes 52 on a back surface 51 thereof has substantially
the same internal construction as the integrated circuit device 50
according to the first embodiment, except that a rectangular
connection block 2A is integrally provided on the back surface 51.
More specifically, the connection block 2A is molded simultaneously
with resin-molding of a multi-level interconnection board and a
semiconductor chip in the integrated circuit device 50A. In this
embodiment, the connection block 2A has a smaller size than a main
body (a portion excluding the connection block 2A) of the
integrated circuit device 50A as viewed in plan.
[0060] The connection block 2A has an engagement recess 21A
provided in a position to be opposed to a connector 1A (which,
along with the connection block 2A, constitutes the connector
module 30A) for engagement with the connector 1A. The rear
electrodes 52 are exposed in the engagement recess 21A. The
connection block 2A has lock recesses 24 respectively provided in
opposite side faces 23 extending parallel to an insertion direction
of the connector 1A.
[0061] The connector 1A includes a housing 11A to be inserted into
the engagement recess 21A of the connection block 2A, a pair of
lock claws 12A and 12B respectively provided on opposite side faces
of the housing 11A, and a pair of compression coil springs 18A, 18B
for biasing the lock claws 12A, 12B toward lock positions.
[0062] Pairs 16A and 16B of upper and lower support projections
respectively project from the opposite side faces of the housing
11A. The lock claws 12A and 12B are respectively
supported.pivotally about shafts 19A and 19B fixed to the pairs 16A
and 16B of support projections. The lock claws 12A, 12B each have
an engagement tip 12a provided at a front end thereof for
engagement with the lock recess 24 of the connection block 2A, and
an operation portion 12b provided at a rear end thereof to be
subjected to a biasing force exerted outwardly by the coil spring
18A, 18B. The shafts 19A and 19B respectively support portions of
the lock claws 12A and 12B between the engagement tips 12a and the
operation portions 12b.
[0063] An FPC cable 3 extends from a rear face of the housing 11A.
The structure of the FPC cable 3 and the structure for connection
between the FPC cable 3 and contacts within the housing 11A are the
same as those according to the first embodiment. The contacts of
the connector 1A have the same construction as the contacts 15
according to the first embodiment.
[0064] FIG. 7A is a perspective view illustrating a state where the
connector 1A is attached to the connection block 2A. When the
connector 1A is to be attached to the connection block 2A, the
operation portions 12b of the lock claws 12A, 12B are held between
fingers in a state shown in FIG. 6, and the connector 1A is moved
toward the connection block 2A with the engagement tips 12a of the
lock claws 12A, 12B being open. After the housing 11A is inserted
to an insertion-complete position into the engagement recess 21A,
the lock claws 12A, 12B are released from the fingers. The
engagement tips 12a of the lock claws 12A, 12B are respectively
brought into engagement with the lock recesses 24 by the action of
the coil springs 18A, 18B as shown in FIG. 7A. Thus, the connector
1A and the connection block 2A are kept in engagement with each
other.
[0065] When the connector 1A is to be detached from the connection
block 2A, the operation portions 12b of the pair of lock claws 12A,
12B are held between fingers from opposite sides, as shown in FIG.
7B, to disengage the lock claws 12A, 12B from the lock recesses 24.
In this state, the connector 1A is brought away from the connection
block 2B.
[0066] FIGS. 8A and 8B are perspective views for explaining the
construction of a connector module 30B according to a third
embodiment of the present invention. In FIGS. 8A and 8B, components
equivalent to those. shown in FIGS. 1A and 1B are denoted by the
same reference characters as in FIGS. 1A and 1B.
[0067] In this embodiment, a pair of engagement recesses 68, 69 for
engagement with a connection block 2B are respectively provided in
opposite side faces of an integrated circuit device 50B
(corresponding to the integrated circuit device body as a whole)
having rear electrodes 52 on aback surface, 51 thereof. The
integrated circuit device 50B has the same internal construction as
the integrated circuit device 50 according to the first
embodiment.
[0068] A connection block 2B is of a planer rectangular shape, and
has a pair of engagement claws 25 respectively provided in
association with the engagement recesses 68, 69 as projecting
toward the integrated circuit device 50B. Distal ends (lower ends)
of the engagement claws 25 are inwardly bent in an L-shape to form
claw portions 25a. The claw portions 25a are respectively brought
into engagement with steps provided below the engagement recesses
68, 69, whereby the connection block 2B is firmly fixed to the
integrated circuit device 50B. The fixed state is shown in FIG.
8B.
[0069] In this embodiment, a cooling fan 80 for cooling the
integrated circuit device 50B from the back surface 51 thereof is
incorporated in a generally central portion of the connection block
2B. As in the first and second embodiments, the connection block 2B
has an engagement recess 21B provided in a position thereof to be
opposed to the rear electrodes 52 for receiving a connector 1B
which, along with the connection block 2B, constitutes the
connection module 30B.
[0070] The connector 1B has substantially the same construction as
the connector 1 according to the first embodiment, except that the
connector 1B does not have the engagement piece 12. The connector
1B is connected to an FPC cable 3.
[0071] A state where the connector 1B is inserted in the engagement
recess 21B is shown in FIG. 8B. In this state, a plurality of
contacts of the connector 1B are electrically connected to the rear
electrodes 52 of the integrated circuit device 50B.
[0072] As described above, the cooling fan 80 is incorporated in
the connection block 2B which is to be attached to the back surface
51 of the integrated circuit device 50B in accordance with this
embodiment. Therefore, the integrated circuit device 50B can
efficiently be cooled. Even if the integrated circuit device 50B
generates a greater amount of heat, malfunction thereof can be
prevented.
[0073] While the three embodiments of the present invention have
thus been described, the invention may be embodied in any other
ways. Although the connector 1B does not have a lock mechanism in
the third embodiment, the connector 1 having the engagement piece
12 shown in FIGS. 1A and 1B may be employed instead of the
connector 1B. In this case, a lock hole 22 is provided in the
connection block 2B for engagement with the engagement piece 12 as
in the connection block 2 shown in FIGS. 1A and 1B.
[0074] In accordance with the aforesaid embodiments, the connector
is designed so that the FPC cable 3 is led out parallel to the back
surface 51 of the integrated circuit device. Where a space around
the integrated circuit device is not sufficient for routing the FPC
cable 3, however, a connector may be employed which is designed so
that an FPC cable is led out perpendicularly to the back surface 51
of the integrated circuit device 50. In this case, a connection
block to be connected to such a connector preferably has a
connector engagement recess which opens upward perpendicularly to
the back surface 51.
[0075] Although the pseudo-coaxial transmission paths are provided
by employing the micro-strip conductors provided on the FPC cable 3
in accordance with the aforesaid embodiments, twisted-pair cables
90 each including a signal lead line 90S and a ground lead line 90G
twisted with each other as shown in FIG. 9, for example, may be
employed for the provision of the pseudo-coaxial transmission
paths. Alternatively, flat cables or an FFC cable (flexible flat
cable) may be employed for signal transmission from the connector 1
or the like to any other electronic device to provide the
pseudo-coaxial transmission paths. Of course, coaxial cables may be
employed for the signal transmission from the connector 1 or the
like to any other electronic device.
[0076] In the third embodiment, the cooling fan is incorporated in
the connection block for cooling the integrated circuit device.
Alternatively, cooling fins may be provided on the connection
block, for example, to allow the connection block to double as a
heat sink for cooling the integrated circuit device.
[0077] Although the connection block is combined with the
integrated circuit device with the use of the adhesive, by the
integral molding or by the mechanical coupling with the use of the
engagement claws in the aforesaid embodiments, any other methods
such as ultrasonic fusion bonding and press insertion may be
employed for combining the connection block with the integrated
circuit device. Where the ultrasonic fusion bonding method is
employed, for example, holes are formed in the back surface of the
integrated circuit device, and resin projections are formed on the
connection block in association with the holes. Then, the
connection block is placed on the back surface of the integrated
circuit device, and ultrasonic waves are externally applied to the
connection block to fuse the resin projections, whereby the
connection block is combined with the integrated circuit device.
Where the press insertion method is employed, proper press
insertion grooves or holes are formed in the integrated circuit
device 50, and projections to be press-inserted into the press
insertion grooves or holes are provided on the connection
block.
[0078] In the aforesaid embodiments, the connector is attached to
the integrated circuit device via the connection block. However,
the connector may be attached directly to the back surface of the
integrated circuit device with the use of an adhesive, by
ultrasonic fusion bonding, or by proper fixing means such as an
engagement claw without the use of the connection block.
[0079] While the present invention has been described in detail by
way of the embodiments thereof, it should be understood that the
foregoing disclosure is merely illustrative of the technical
principles of the present invention but not limitative of the same.
The spirit and scope of the present invention are to be limited
only by the appended claims.
[0080] This application corresponds to Japanese Patent Application
No. 2000-128045 filed to the Japanese Patent Office on Apr. 27,
2000, the disclosure thereof being incorporated herein by
reference.
* * * * *