U.S. patent application number 10/277195 was filed with the patent office on 2004-04-22 for solder ball holding terminal in a bga arrangement.
Invention is credited to Hsu, Feng-Chien.
Application Number | 20040074946 10/277195 |
Document ID | / |
Family ID | 32093224 |
Filed Date | 2004-04-22 |
United States Patent
Application |
20040074946 |
Kind Code |
A1 |
Hsu, Feng-Chien |
April 22, 2004 |
SOLDER BALL HOLDING TERMINAL IN A BGA ARRANGEMENT
Abstract
A solder ball holding terminal has a first plate, a second plate
and a third plate integrally formed with and sandwiched between the
first plate and the second plate. The first plate has a first
distal end, the second plate has a second distal end and the third
plate has a third distal end and a fourth distal end. A distance
between the third distal end and the fourth distal end is much
smaller than that between the first distal end and the second
distal end such that when a solder ball is inserted into a space
defined among the first distal end, the second distal end, the
third distal end and the fourth distal end, a substantially
three-point support is provided to the solder ball so that the
solder ball is securely clamped.
Inventors: |
Hsu, Feng-Chien; (Taipei
Hsien, TW) |
Correspondence
Address: |
Alan D. Kamrath
Rider, Bennett, Egan & Arundel, LLP
Suite 2000
333 South Seventh Street
Minneapolis
MN
55402
US
|
Family ID: |
32093224 |
Appl. No.: |
10/277195 |
Filed: |
October 21, 2002 |
Current U.S.
Class: |
228/49.4 |
Current CPC
Class: |
B23K 2101/38 20180801;
H05K 2203/041 20130101; Y02P 70/613 20151101; Y02P 70/50 20151101;
B23K 3/0607 20130101; B23K 2101/40 20180801; H05K 3/3426 20130101;
H05K 2201/10984 20130101; H01R 13/11 20130101 |
Class at
Publication: |
228/049.4 |
International
Class: |
B23K 001/14 |
Claims
What is claimed is:
1. A solder ball holding terminal in a ball grid array arrangement,
the solder ball holding terminal having a first plate, a second
plate and a third plate integrally formed with and sandwiched
between the first plate and the second plate, wherein the
improvements comprise: the first plate has a first distal end, the
second plate has a second distal end, the third plate has a third
distal end and a fourth distal end, a distance between the third
distal end and the fourth distal end is much smaller than that
between the first distal end and the second distal end such that
when a solder ball is inserted into a space defined among the first
distal end, the second distal end, the third distal end and the
fourth distal end, a substantially three-point support is provided
to the solder ball so that the solder ball is securely clamped.
2. The solder ball holding terminal as claimed in claim 1, wherein
the distance between the third distal end and the fourth distal end
is so small that a deformation is formed on the solder ball after
the solder ball is inserted into the space.
3. The solder ball holding terminal as claimed in claim 2, wherein
two stops are respectively formed between the first distal end and
the third distal end and the second distal end and the fourth
distal end so that after the solder ball is inserted into the
space, further advancement of the solder ball into the space is
limited.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a solder ball holding
terminal, and more particularly to a solder ball holding terminal
in a ball grid array (BGA) arrangement to securely hold the solder
ball inside the holding terminal.
[0003] 2. Description of Related Art
[0004] With reference to FIGS. 4 and 5, a conventional solder ball
holding terminal (80) is integrally made and has a first leg (81),
a second leg (82) and a stop (83) sandwiched between the first leg
(81) and the second leg (82).
[0005] When a solder ball (90) is inserted into a space between the
first leg (81) and the second leg (82), the first leg (81) and the
second leg (82) are able to clamp an outer periphery of the solder
ball (90) and the stop (83) limits further advancement of the
solder ball (90) between the first leg (81) and the second leg
(82).
[0006] It is well known in the art that when an object is clamped
by two individual ends of the terminal, the object is not stably
positioned. Therefore, the solder ball (90) very easily falls out
from the terminal (80).
[0007] To overcome the shortcomings, the present invention tends to
provide an improved solder ball holding terminal to mitigate and
obviate the aforementioned problems.
SUMMARY OF THE INVENTION
[0008] The primary objective of the present invention is to provide
an improved solder ball holding terminal having a first distal end,
a second distal end, a third distal end and a fourth distal end,
wherein a distance between the third and the fourth distal ends is
much smaller than that between the first distal end and the second
distal end. When a solder ball is inserted into a space defined
among the first, the second, the third and the fourth distal ends,
a three-point support is provided to the solder ball so that the
solder ball is securely clamped by the solder ball holding
terminal.
[0009] Another objective of the present invention is that the
distance between the third distal end and the fourth distal end is
able to allow the solder ball to deform so that the solder ball is
firmly clamped inside the solder ball holding terminal.
[0010] Still another objective of the present invention is that a
stop is respectively formed between the first distal end and the
third distal end and the second distal end and the fourth distal
end so that after the solder ball is inserted into a space among
the first distal end, the second distal end, the third distal end
and the fourth distal end, further advancement of the solder ball
into the space is limited.
[0011] Other objects, advantages and novel features of the
invention will become more apparent from the following detailed
description when taken in conjunction with the accompanying
drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] FIG. 1 is a perspective view of the solder ball holding
terminal of the present invention;
[0013] FIG. 2 is a front plan view of the solder ball holding
terminal in FIG. 1;
[0014] FIG. 3 is a top plan view of the solder ball holding
terminal of the present invention;
[0015] FIG. 4 is a perspective view of a conventional solder ball
holding terminal; and
[0016] FIG. 5 is a schematic view showing that the conventional
solder ball holding terminal is clamping the solder ball.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0017] With reference to FIGS. 1 and 2, the solder ball holding
terminal (10) in accordance with the present invention has a first
plate, a second plate and a third plate integrally formed with and
sandwiched between the first plate and the second plate. The first
plate has a first distal end (11). The second plate has a second
distal end (12). The third plate has a third distal end (13) and a
fourth distal end (14). A distance `A` between the third distal end
(13) and the fourth distal end (14) is much smaller than that
between the first distal end (11) and the second distal end (12).
When a solder ball (90) is inserted into a space (15) defined among
the first distal end (11), the second distal end (12), the third
distal end (13) and the fourth distal end (14), a substantially
three-point support is provided to the solder ball (90) so that the
solder ball (90) is securely clamped by the solder ball holding
terminal (10).
[0018] Furthermore, the distance `A` between the third distal end
(13) and the fourth distal end (14) is able to allow the solder
ball (90) to have a deformation (91) when the solder ball (90) is
inserted into the space (15). Thus, the solder ball (90) is
securely clamped by the solder ball holding terminal (10) of the
present invention.
[0019] Still further, two stops (16,17) are respectively formed
between the first distal end (11) and the third distal end (13) and
the second distal end (12) and the fourth distal end (14) so that
after the solder ball (90) is inserted into the space (15), further
advancement of the solder ball (90) into the space (15) is
limited.
[0020] From the foregoing description, it is noted that the solder
ball holding terminal of the present invention not only provides a
three-point support to securely clamp the solder ball (90), but
also limits undesirable advancement of the solder ball (90) beyond
the space (15).
[0021] It is to be understood, however, that even though numerous
characteristics and advantages of the present invention have been
set forth in the foregoing description, together with details of
the structure and function of the invention, the disclosure is
illustrative only, and changes may be made in detail, especially in
matters of shape, size, and arrangement of parts within the
principles of the invention to the full extent indicated by the
broad general meaning of the terms in which the appended claims are
expressed.
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